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JPH0760844B2 - How to recycle used probe cards - Google Patents

How to recycle used probe cards

Info

Publication number
JPH0760844B2
JPH0760844B2 JP3138581A JP13858191A JPH0760844B2 JP H0760844 B2 JPH0760844 B2 JP H0760844B2 JP 3138581 A JP3138581 A JP 3138581A JP 13858191 A JP13858191 A JP 13858191A JP H0760844 B2 JPH0760844 B2 JP H0760844B2
Authority
JP
Japan
Prior art keywords
probe
probe card
tip
aqueous solution
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP3138581A
Other languages
Japanese (ja)
Other versions
JPH04338662A (en
Inventor
善広 山下
章二 細田
Original Assignee
株式会社駒ヶ根電化
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社駒ヶ根電化 filed Critical 株式会社駒ヶ根電化
Priority to JP3138581A priority Critical patent/JPH0760844B2/en
Publication of JPH04338662A publication Critical patent/JPH04338662A/en
Publication of JPH0760844B2 publication Critical patent/JPH0760844B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

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  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電子デバイス試験器の
使用済みプローブカードを使用可能な状態に再生させる
方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of reusing a used probe card of an electronic device tester to a usable state.

【0002】[0002]

【従来の技術】各種IC、LSI等の電子デバイスは、
その製造工程の最後の段階で所定の機能や特性値を具備
するか否かの検査を受ける。そのとき使用される試験器
は、検査すべき電子デバイスの端子ピンとの電気的接触
をプローブカードと呼ばれる部品を用いて行う。プロー
ブカードには、細い鉤針状に成形された導体・プローブ
を電子デバイスの端子ピンの数だけ、且つそれらの先端
をピン配置に対応させて固定してあって、すべてのピン
とプローブを1:1の関係で同時に接触させることがで
きるようになっている。各プローブは、プローブカード
上のプリント配線、端子ピン、接続ケーブル等を介して
試験器本体に接続することができるので、プローブカー
ドを用いることにより短時間に多くの試験を行うことが
可能である。
2. Description of the Related Art Electronic devices such as various ICs and LSIs are
At the final stage of the manufacturing process, it is inspected whether it has a predetermined function or characteristic value. The tester used at that time makes electrical contact with the terminal pins of the electronic device to be inspected using a component called a probe card. On the probe card, conductors and probes formed in the shape of thin hooks are fixed by the number of terminal pins of the electronic device and their tips are fixed according to the pin arrangement, and all pins and probes are 1: 1. Because of this, they can be contacted at the same time. Since each probe can be connected to the tester main body via the printed wiring on the probe card, terminal pins, connection cables, etc., it is possible to perform many tests in a short time by using the probe card. .

【0003】プローブカードのプローブが接触針として
の所定の機能を果たすためには、言うまでもなく、その
先端のピン接触点が常に清浄に保たれていなければなら
ない。しかしながら、プローブ先端はきわめて汚れやす
く、それによる導通不良を起こし易い。すなわち、きわ
めて狭い間隔で多数のプローブを基盤に配設する必要
上、プローブはできるだけ細くする必要があり、しかも
電子デバイスのピンに確実に圧接させなければならない
から、プローブはタングステン等、かなり硬い金属で作
られている。そのため、プローブ先端は、概してプロー
ブよりも柔らかい金属で作られている電子デバイス側ピ
ンとの接触を繰り返す間にピン表面から削り取った金属
質物質で汚染される。この汚れが蓄積すると、ピンとプ
ローブとの良好な接触は妨げられて両者の間の電気抵抗
が増加し、検査結果に誤りを生じるに至る。プローブが
極めて細く且つ高い精度で密に配列されているものであ
ることにより、先端が汚れたプローブの清浄化は至難と
され、したがって、従来、汚れによりプローブがたとえ
一本でも接触不良を起こすようになったプローブカード
は廃棄するしかなかった。
In order for the probe of the probe card to perform a predetermined function as a contact needle, it goes without saying that the pin contact point at the tip of the probe must always be kept clean. However, the tip of the probe is extremely liable to be contaminated, resulting in poor conduction. In other words, because it is necessary to arrange a large number of probes on the substrate at extremely narrow intervals, it is necessary to make the probes as thin as possible, and moreover, the pins must be pressed firmly against the electronic device. Is made of. Therefore, the probe tip is contaminated with the metallic substance scraped off from the pin surface during repeated contact with the electronic device side pin which is generally made of a metal softer than the probe. This buildup of dirt prevents good contact between the pins and the probe and increases the electrical resistance between them, resulting in erroneous test results. Since the probes are extremely thin and densely arranged with high precision, it is extremely difficult to clean the probe with a dirty tip, and therefore, even if even one probe has a contact failure due to the conventional dirt. I had no choice but to discard the probe card.

【0004】[0004]

【発明が解決しようとする課題】プローブカードは製作
に高度の技術と手間を必要とし、したがって極めて高価
なものである。本発明の目的は、上述のようにプローブ
が汚れたときは廃棄するしかなかったプローブカードの
再生法を提供し、プローブカードの寿命延長を可能にす
ることにある。
The probe card requires a high degree of skill and labor to manufacture, and is therefore extremely expensive. It is an object of the present invention to provide a method of regenerating a probe card that had to be discarded when the probe became dirty as described above, and to extend the life of the probe card.

【0005】[0005]

【課題を解決するための手段】本発明が提供することに
成功したプローブカードの再生方法は、プローブカード
にプローブ以外の部分を遮蔽する遮蔽材を密着させ、プ
ローブ先端に付着した金属質汚染を溶解可能な酸または
アルカリの水溶液をプローブ先端に噴射して上記金属質
汚染を除去し、水洗後乾燥することを特徴とするもので
ある。
The method of reproducing a probe card succeeded in the present invention provides a probe card with a shielding material which shields a portion other than the probe in close contact with the probe card to prevent metallic contamination attached to the tip of the probe. It is characterized in that a soluble aqueous solution of acid or alkali is sprayed onto the tip of the probe to remove the metallic contamination, washed with water and dried.

【0006】プローブ先端に付着する金属質汚染は、ア
ルミニウム、銀、パラジウム等であり、かつ検査対象に
よってほぼ決まっているから、汚染の内容に応じて硝
酸、リン酸等の無機酸、またはこれらの混合物、さらに
はアルカリ等を適当な濃度で水溶液にしてプローブ先端
に噴射すれば、付着していた汚染物質は溶けて除かれ
る。薬液噴射によりプローブが受ける衝撃は、プローブ
がほとんど湾曲しない程度の弱いものであるから、それ
によりプローブ配置が狂う恐れはない。汚染物質の溶解
除去は、それに先立って界面活性剤の水溶液を噴射して
おくことにより薬液の浸透が良くなり、処理時間を短縮
することができる。処理後は必要に応じて中和処理を施
した後、十分に水洗し、熱風を吹き付けて乾燥する。薬
液等の噴射は、プローブが配置されたプローブカード中
央の開口部を貫通するように行う。噴射と同時に、反対
側から吸引を行うことにより、薬液等の飛散を防ぐこと
ができる。
[0006] The metallic contamination attached to the tip of the probe is aluminum, silver, palladium, etc., and is almost determined by the object to be inspected. Therefore, depending on the content of contamination, nitric acid, phosphoric acid, or other inorganic acids, or these When the mixture, and further, an alkali or the like is made into an aqueous solution at an appropriate concentration and sprayed onto the probe tip, the attached contaminants are dissolved and removed. Since the impact of the chemical liquid injection on the probe is so weak that the probe hardly bends, there is no risk of the probe arrangement being misaligned. In dissolving and removing contaminants, spraying an aqueous solution of a surfactant prior to that improves the permeation of the chemical solution and shortens the processing time. After the treatment, a neutralization treatment is performed if necessary, followed by thorough washing with water and blowing with hot air to dry. The chemical solution or the like is ejected so as to penetrate through the opening in the center of the probe card in which the probe is arranged. By performing suction from the opposite side at the same time as jetting, it is possible to prevent the chemical solution from scattering.

【0007】以上の処理は、遮蔽材を用いてプローブ以
外の部分に薬液や水が付着しないようにして行う。適当
な遮蔽材の例としては、プローブの基部にあてがってプ
ローブ部分だけを包囲することができるように内径を選
定された筒状体がある。その下端をゴムなど弾性変形可
能な材料で構成しておくと、プローブカードとの密着性
がよく、遮蔽作用が確実になる。剥離可能な対薬品性皮
膜を形成する不定形マスキング剤をプローブカードのプ
ローブ以外の部分に塗布し、薬液処理終了後に剥離する
ようにしてもよい。遮蔽材は、プローブカードの薬液噴
射面側だけに用いてもよく、また両面に用いてもよい。
The above treatment is carried out by using a shielding material so that the chemical liquid and water do not adhere to the portion other than the probe. An example of a suitable shield is a tubular body whose inner diameter is selected so that it can be applied to the base of the probe to enclose only the probe portion. If the lower end is made of an elastically deformable material such as rubber, the close contact with the probe card is good and the shielding action is ensured. An amorphous masking agent that forms a releasable chemical resistant film may be applied to a portion of the probe card other than the probe and peeled off after the completion of the chemical treatment. The shielding material may be used only on the chemical liquid ejection surface side of the probe card, or may be used on both surfaces.

【0008】[0008]

【実施例】LSIの検査に長時間使用した結果、アルミ
ニウム質の汚染物質によりプローブ先端が接触不良を起
こすに至った図1のプローブカード1を本発明の方法に
より再生した。なお、処理するプローブカード1は、中
央に貫通孔2を有する基板3の貫通孔2部分に先端が配
列するように樹脂層4により固定された多数のプローブ
5を有するもので、プローブ5はその先端約0.5mmの
部分が図1において紙面と垂直に、手前方向に折れ曲が
ってLSIのピンとの接触点になっている。再生処理を
行うときは、図2に示したとおり、また図1に鎖線で示
したように、プローブ5の露出部分すなわち貫通孔2を
包囲するように円筒状の遮蔽材6を樹脂層4に密着させ
ることによりプローブ5以外の部分を遮蔽しておき、遮
蔽材6の中心からプローブ5の先端に向けて薬液等を噴
射した。
EXAMPLE The probe card 1 of FIG. 1 was reproduced by the method of the present invention in which the probe tip caused contact failure due to aluminum contaminants after being used for a long time for LSI inspection. The probe card 1 to be processed has a large number of probes 5 fixed by a resin layer 4 so that the tips are arranged in the through holes 2 of a substrate 3 having a through hole 2 in the center. The tip portion of about 0.5 mm is bent in the front direction perpendicular to the paper surface in FIG. 1 and serves as a contact point with the LSI pin. When performing the regeneration treatment, as shown in FIG. 2 and as shown by the chain line in FIG. 1, the cylindrical shielding material 6 is formed on the resin layer 4 so as to surround the exposed portion of the probe 5, that is, the through hole 2. The parts other than the probe 5 were shielded by being brought into close contact with each other, and a chemical solution or the like was sprayed from the center of the shield 6 toward the tip of the probe 5.

【0009】再生処理は、下記の8工程により行なっ
た。 脱脂工程:中性の界面活性剤水溶液を90秒間噴射 水洗工程 薬液噴射工程:硝酸とリン酸を主成分とする混酸水溶液を100秒間噴射 水洗工程 中和工程:弱アルカリ水溶液を90秒間噴射 水洗工程 純水洗浄工程 乾燥工程:約80℃の熱風を約180秒間吹き付ける。 処理後のプローブカードはその機能を完全に回復してお
り、新品と同様に使用可能であった。
The regeneration process was performed by the following 8 steps. Degreasing process: Neutral surfactant aqueous solution is jetted for 90 seconds Water washing process Chemical solution jetting process: Mixed acid aqueous solution containing nitric acid and phosphoric acid as main components is jetted for 100 seconds Water washing process Neutralization process: Weak alkaline aqueous solution is jetted for 90 seconds Water washing process Pure water washing step Drying step: Hot air of about 80 ° C. is blown for about 180 seconds. The processed probe card had completely restored its function and could be used like a new one.

【0010】[0010]

【発明の効果】上述のように、本発明によればプローブ
配置の精度を悪くしたりプローブ以外の部分に損傷を与
えたりすることなしにプローブ先端だけを清浄化し、そ
の機能を回復させることができるので、高価なプローブ
カードの寿命を延ばし、電子デバイス検査費用を顕著に
低減させることが可能になる。
As described above, according to the present invention, it is possible to clean only the probe tip and restore its function without deteriorating the accuracy of probe placement or damaging the parts other than the probe. Therefore, it becomes possible to prolong the life of the expensive probe card and to significantly reduce the electronic device inspection cost.

【図面の簡単な説明】[Brief description of drawings]

【図1】 実施例において再生処理したプローブカード
の平面図。
FIG. 1 is a plan view of a probe card that is regenerated in an example.

【図2】 図1のプローブカードに遮蔽材を装着して再
生処理する状態を示す側面図。
FIG. 2 is a side view showing a state in which a shielding material is attached to the probe card of FIG. 1 and a reproducing process is performed.

【符号の説明】[Explanation of symbols]

1:プローブカード 4:樹脂層 5:プローブ 6:遮蔽材 1: probe card 4: resin layer 5: probe 6: shielding material

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 電子デバイス試験器のプローブカードに
プローブ以外の部分を遮蔽する遮蔽材を密着させ、プロ
ーブ先端に付着した金属質汚染を溶解可能な酸またはア
ルカリの水溶液をプローブ先端に噴射して上記金属質汚
染を除去し、水洗後乾燥することを特徴とする使用済み
プローブカードの再生方法。
1. A probe card of an electronic device tester is brought into close contact with a shielding material for shielding a portion other than the probe, and an acid or alkali aqueous solution capable of dissolving metallic contamination adhering to the probe tip is jetted onto the probe tip. A method for recycling a used probe card, which comprises removing the metallic contamination, washing with water, and then drying.
【請求項2】 硝酸または(および)リン酸を主成分と
する酸の水溶液をプローブ先端に噴射する請求項1記載
の再生方法。
2. The regeneration method according to claim 1, wherein an aqueous solution of an acid containing nitric acid or / and phosphoric acid as a main component is sprayed onto the tip of the probe.
JP3138581A 1991-05-15 1991-05-15 How to recycle used probe cards Expired - Lifetime JPH0760844B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3138581A JPH0760844B2 (en) 1991-05-15 1991-05-15 How to recycle used probe cards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3138581A JPH0760844B2 (en) 1991-05-15 1991-05-15 How to recycle used probe cards

Publications (2)

Publication Number Publication Date
JPH04338662A JPH04338662A (en) 1992-11-25
JPH0760844B2 true JPH0760844B2 (en) 1995-06-28

Family

ID=15225466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3138581A Expired - Lifetime JPH0760844B2 (en) 1991-05-15 1991-05-15 How to recycle used probe cards

Country Status (1)

Country Link
JP (1) JPH0760844B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8928967B2 (en) 1998-04-08 2015-01-06 Qualcomm Mems Technologies, Inc. Method and device for modulating light
US8971675B2 (en) 2006-01-13 2015-03-03 Qualcomm Mems Technologies, Inc. Interconnect structure for MEMS device
US9110289B2 (en) 1998-04-08 2015-08-18 Qualcomm Mems Technologies, Inc. Device for modulating light with multiple electrodes
US9570789B2 (en) 2007-03-20 2017-02-14 Nuvotronics, Inc Transition structure between a rectangular coaxial microstructure and a cylindrical coaxial cable using step changes in center conductors thereof
US9583856B2 (en) 2011-06-06 2017-02-28 Nuvotronics, Inc. Batch fabricated microconnectors

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10501928A (en) * 1995-04-19 1998-02-17 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ Method for cleaning probe tip of probe card and apparatus for implementing the method
JPH11230989A (en) 1997-12-10 1999-08-27 Mitsubishi Electric Corp Method and apparatus for cleaning probe pin for probe card and cleaning liquid therefor
US9952255B2 (en) 2015-10-30 2018-04-24 Texas Instruments Incorporated Magnetically shielded probe card

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8928967B2 (en) 1998-04-08 2015-01-06 Qualcomm Mems Technologies, Inc. Method and device for modulating light
US9110289B2 (en) 1998-04-08 2015-08-18 Qualcomm Mems Technologies, Inc. Device for modulating light with multiple electrodes
US8971675B2 (en) 2006-01-13 2015-03-03 Qualcomm Mems Technologies, Inc. Interconnect structure for MEMS device
US9570789B2 (en) 2007-03-20 2017-02-14 Nuvotronics, Inc Transition structure between a rectangular coaxial microstructure and a cylindrical coaxial cable using step changes in center conductors thereof
US9583856B2 (en) 2011-06-06 2017-02-28 Nuvotronics, Inc. Batch fabricated microconnectors

Also Published As

Publication number Publication date
JPH04338662A (en) 1992-11-25

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