JPH04338662A - Regeneration method for used probe card - Google Patents
Regeneration method for used probe cardInfo
- Publication number
- JPH04338662A JPH04338662A JP3138581A JP13858191A JPH04338662A JP H04338662 A JPH04338662 A JP H04338662A JP 3138581 A JP3138581 A JP 3138581A JP 13858191 A JP13858191 A JP 13858191A JP H04338662 A JPH04338662 A JP H04338662A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- tip
- probe card
- probes
- shielding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims abstract description 74
- 238000011069 regeneration method Methods 0.000 title claims abstract description 5
- 239000000463 material Substances 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000007864 aqueous solution Substances 0.000 claims abstract description 7
- 238000005406 washing Methods 0.000 claims abstract description 7
- 238000011109 contamination Methods 0.000 claims abstract description 6
- 239000000243 solution Substances 0.000 claims abstract description 6
- 239000002253 acid Substances 0.000 claims abstract description 4
- 238000001035 drying Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 11
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 4
- 239000003513 alkali Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000004064 recycling Methods 0.000 claims description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 2
- 229910017604 nitric acid Inorganic materials 0.000 claims description 2
- 239000011260 aqueous acid Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 11
- 239000011347 resin Substances 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 abstract description 4
- 230000008929 regeneration Effects 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 2
- 238000005507 spraying Methods 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000000356 contaminant Substances 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、電子デバイス試験器の
使用済みプローブカードを使用可能な状態に再生させる
方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for regenerating a used probe card of an electronic device tester into a usable state.
【0002】0002
【従来の技術】各種IC、LSI等の電子デバイスは、
その製造工程の最後の段階で所定の機能や特性値を具備
するか否かの検査を受ける。そのとき使用される試験器
は、検査すべき電子デバイスの端子ピンとの電気的接触
をプローブカードと呼ばれる部品を用いて行う。プロー
ブカードには、細い鉤針状に成形された導体・プローブ
を電子デバイスの端子ピンの数だけ、且つそれらの先端
をピン配置に対応させて固定してあって、すべてのピン
とプローブを1:1の関係で同時に接触させることがで
きるようになっている。各プローブは、プローブカード
上のプリント配線、端子ピン、接続ケーブル等を介して
試験器本体に接続することができるので、プローブカー
ドを用いることにより短時間に多くの試験を行うことが
可能である。[Prior Art] Electronic devices such as various ICs and LSIs are
At the final stage of the manufacturing process, it is inspected to see if it has predetermined functions and characteristic values. The tester used at this time uses a component called a probe card to make electrical contact with the terminal pins of the electronic device to be tested. The probe card has as many conductors and probes shaped like thin hooks as the number of terminal pins of the electronic device fixed thereon, with their tips corresponding to the pin arrangement, and all the pins and probes are fixed at a ratio of 1:1. This allows them to be brought into contact at the same time. Each probe can be connected to the tester main body via printed wiring, terminal pins, connection cables, etc. on the probe card, so it is possible to perform many tests in a short time by using the probe card. .
【0003】プローブカードのプローブが接触針として
の所定の機能を果たすためには、言うまでもなく、その
先端のピン接触点が常に清浄に保たれていなければなら
ない。しかしながら、プローブ先端はきわめて汚れやす
く、それによる導通不良を起こし易い。すなわち、きわ
めて狭い間隔で多数のプローブを基盤に配設する必要上
、プローブはできるだけ細くする必要があり、しかも電
子デバイスのピンに確実に圧接させなければならないか
ら、プローブはタングステン等、かなり硬い金属で作ら
れている。そのため、プローブ先端は、概してプローブ
よりも柔らかい金属で作られている電子デバイス側ピン
との接触を繰り返す間にピン表面から削り取った金属質
物質で汚染される。この汚れが蓄積すると、ピンとプロ
ーブとの良好な接触は妨げられて両者の間の電気抵抗が
増加し、検査結果に誤りを生じるに至る。プローブが極
めて細く且つ高い精度で密に配列されているものである
ことにより、先端が汚れたプローブの清浄化は至難とさ
れ、したがって、従来、汚れによりプローブがたとえ一
本でも接触不良を起こすようになったプローブカードは
廃棄するしかなかった。Needless to say, in order for the probe of the probe card to perform its prescribed function as a contact needle, the pin contact point at its tip must be kept clean at all times. However, the tip of the probe is extremely prone to dirt, which tends to cause poor continuity. In other words, since it is necessary to arrange a large number of probes on the board at extremely narrow intervals, the probes need to be as thin as possible, and they also need to be firmly pressed against the pins of the electronic device, so the probes must be made of a fairly hard metal such as tungsten. It is made of. Therefore, the tip of the probe becomes contaminated with metallic material scraped from the surface of the pin during repeated contact with the electronic device pin, which is generally made of a softer metal than the probe. This buildup of dirt prevents good contact between the pins and the probe and increases the electrical resistance between them, leading to erroneous test results. Because the probes are extremely thin and closely arranged with high precision, it is extremely difficult to clean probes with dirty tips. The damaged probe card had no choice but to be discarded.
【0004】0004
【発明が解決しようとする課題】プローブカードは製作
に高度の技術と手間を必要とし、したがって極めて高価
なものである。本発明の目的は、上述のようにプローブ
が汚れたときは廃棄するしかなかったプローブカードの
再生法を提供し、プローブカードの寿命延長を可能にす
ることにある。PROBLEM TO BE SOLVED BY THE INVENTION Probe cards require advanced technology and labor to manufacture, and are therefore extremely expensive. An object of the present invention is to provide a method for recycling a probe card, which had to be discarded when the probe became dirty, as described above, and to make it possible to extend the life of the probe card.
【0005】[0005]
【課題を解決するための手段】本発明が提供することに
成功したプローブカードの再生方法は、プローブカード
にプローブ以外の部分を遮蔽する遮蔽材を密着させ、プ
ローブ先端に付着した金属質汚染を溶解可能な酸または
アルカリの水溶液をプローブ先端に噴射して上記金属質
汚染を除去し、水洗後乾燥することを特徴とするもので
ある。[Means for Solving the Problems] A probe card recycling method successfully provided by the present invention is to attach a shielding material that shields parts other than the probe to the probe card, and remove metallic contamination attached to the tip of the probe. This method is characterized by spraying a soluble acid or alkali aqueous solution onto the tip of the probe to remove the metallic contamination, washing with water, and then drying.
【0006】プローブ先端に付着する金属質汚染は、ア
ルミニウム、銀、パラジウム等であり、かつ検査対象に
よってほぼ決まっているから、汚染の内容に応じて硝酸
、リン酸等の無機酸、またはこれらの混合物、さらには
アルカリ等を適当な濃度で水溶液にしてプローブ先端に
噴射すれば、付着していた汚染物質は溶けて除かれる。
薬液噴射によりプローブが受ける衝撃は、プローブがほ
とんど湾曲しない程度の弱いものであるから、それによ
りプローブ配置が狂う恐れはない。汚染物質の溶解除去
は、それに先立って界面活性剤の水溶液を噴射しておく
ことにより薬液の浸透が良くなり、処理時間を短縮する
ことができる。処理後は必要に応じて中和処理を施した
後、十分に水洗し、熱風を吹き付けて乾燥する。薬液等
の噴射は、プローブが配置されたプローブカード中央の
開口部を貫通するように行う。噴射と同時に、反対側か
ら吸引を行うことにより、薬液等の飛散を防ぐことがで
きる。Metallic contamination that adheres to the tip of the probe is aluminum, silver, palladium, etc., and is almost determined depending on the object to be inspected. If a mixture, or even an alkali, is made into an aqueous solution at an appropriate concentration and sprayed onto the tip of the probe, the attached contaminants will be dissolved and removed. The impact that the probe receives from the chemical liquid injection is so weak that it hardly bends the probe, so there is no risk that the probe arrangement will be disturbed. By spraying an aqueous surfactant solution prior to dissolving and removing contaminants, the chemical solution can penetrate better and the treatment time can be shortened. After treatment, neutralize as necessary, wash thoroughly with water, and dry by blowing hot air. The chemical liquid or the like is sprayed so as to pass through the opening in the center of the probe card where the probes are placed. By suctioning from the opposite side at the same time as injection, it is possible to prevent the chemical liquid and the like from scattering.
【0007】以上の処理は、遮蔽材を用いてプローブ以
外の部分に薬液や水が付着しないようにして行う。適当
な遮蔽材の例としては、プローブの基部にあてがってプ
ローブ部分だけを包囲することができるように内径を選
定された筒状体がある。その下端をゴムなど弾性変形可
能な材料で構成しておくと、プローブカードとの密着性
がよく、遮蔽作用が確実になる。剥離可能な対薬品性皮
膜を形成する不定形マスキング剤をプローブカードのプ
ローブ以外の部分に塗布し、薬液処理終了後に剥離する
ようにしてもよい。遮蔽材は、プローブカードの薬液噴
射面側だけに用いてもよく、また両面に用いてもよい。The above processing is performed using a shielding material to prevent chemical solution or water from adhering to parts other than the probe. An example of a suitable shielding material is a cylindrical body whose inner diameter is selected so that it can be applied to the base of the probe and surround only the probe portion. If the lower end is made of an elastically deformable material such as rubber, it will have good adhesion to the probe card, and the shielding effect will be ensured. An amorphous masking agent that forms a removable chemical-resistant film may be applied to parts of the probe card other than the probes, and the masking agent may be peeled off after the chemical treatment is completed. The shielding material may be used only on the chemical liquid injection surface side of the probe card, or may be used on both sides.
【0008】[0008]
【実施例】LSIの検査に長時間使用した結果、アルミ
ニウム質の汚染物質によりプローブ先端が接触不良を起
こすに至った図1のプローブカード1を本発明の方法に
より再生した。なお、処理するプローブカード1は、中
央に貫通孔2を有する基板3の貫通孔2部分に先端が配
列するように樹脂層4により固定された多数のプローブ
5を有するもので、プローブ5はその先端約0.5mm
の部分が図1において紙面と垂直に、手前方向に折れ曲
がってLSIのピンとの接触点になっている。再生処理
を行うときは、図2に示したとおり、また図1に鎖線で
示したように、プローブ5の露出部分すなわち貫通孔2
を包囲するように円筒状の遮蔽材6を樹脂層4に密着さ
せることによりプローブ5以外の部分を遮蔽しておき、
遮蔽材6の中心からプローブ5の先端に向けて薬液等を
噴射した。EXAMPLE The probe card 1 shown in FIG. 1, which had been used for an LSI test for a long period of time and had developed contact failure at the probe tip due to aluminum contaminants, was regenerated by the method of the present invention. The probe card 1 to be processed has a large number of probes 5 fixed by a resin layer 4 such that their tips are arranged in the through hole 2 portion of a substrate 3 having a through hole 2 in the center. Tip approximately 0.5mm
In FIG. 1, the portion is bent toward the front perpendicular to the plane of the paper and becomes the point of contact with the pin of the LSI. When performing the regeneration process, as shown in FIG. 2 and as indicated by the chain line in FIG.
By bringing a cylindrical shielding material 6 into close contact with the resin layer 4 so as to surround it, parts other than the probe 5 are shielded,
A chemical solution or the like was sprayed from the center of the shielding material 6 toward the tip of the probe 5.
【0009】再生処理は、下記の8工程により行なった
。
■ 脱脂工程:中性の界面活性剤水溶液を90秒間噴
射■ 水洗工程
■ 薬液噴射工程:硝酸とリン酸を主成分とする混酸
水溶液を100秒間噴射■ 水洗工程
■ 中和工程:弱アルカリ水溶液を90秒間噴射■
水洗工程
■ 純水洗浄工程
■ 乾燥工程:約80℃の熱風を約180秒間吹き付
ける。
処理後のプローブカードはその機能を完全に回復してお
り、新品と同様に使用可能であった。[0009] The regeneration process was carried out through the following eight steps. ■ Degreasing process: Spraying a neutral surfactant aqueous solution for 90 seconds ■ Water washing process ■ Chemical injection process: Spraying a mixed acid aqueous solution containing nitric acid and phosphoric acid as main components for 100 seconds ■ Water washing process ■ Neutralization process: Spraying a weak alkaline aqueous solution Spray for 90 seconds■
Water washing process ■ Pure water washing process ■ Drying process: Blow hot air at about 80°C for about 180 seconds. After processing, the probe card had fully recovered its functionality and could be used like a new one.
【0010】0010
【発明の効果】上述のように、本発明によればプローブ
配置の精度を悪くしたりプローブ以外の部分に損傷を与
えたりすることなしにプローブ先端だけを清浄化し、そ
の機能を回復させることができるので、高価なプローブ
カードの寿命を延ばし、電子デバイス検査費用を顕著に
低減させることが可能になる。[Effects of the Invention] As described above, according to the present invention, it is possible to clean only the tip of the probe and restore its function without impairing the accuracy of probe placement or damaging parts other than the probe. This makes it possible to extend the life of expensive probe cards and significantly reduce the cost of testing electronic devices.
【図1】 実施例において再生処理したプローブカー
ドの平面図。FIG. 1 is a plan view of a probe card that has been recycled in an example.
【図2】 図1のプローブカードに遮蔽材を装着して
再生処理する状態を示す側面図。FIG. 2 is a side view showing a state where a shielding material is attached to the probe card of FIG. 1 and the probe card is recycled.
Claims (2)
にプローブ以外の部分を遮蔽する遮蔽材を密着させ、プ
ローブ先端に付着した金属質汚染を溶解可能な酸または
アルカリの水溶液をプローブ先端に噴射して上記金属質
汚染を除去し、水洗後乾燥することを特徴とする使用済
みプローブカードの再生方法。Claim 1: A shielding material that shields parts other than the probe is tightly attached to the probe card of an electronic device tester, and an aqueous acid or alkali solution capable of dissolving metallic contamination attached to the probe tip is sprayed onto the probe tip. A method for recycling used probe cards, which comprises removing the metal contamination, washing with water, and then drying.
とする酸の水溶液をプローブ先端に噴射する請求項1記
載の再生方法。2. The regeneration method according to claim 1, wherein an aqueous solution of an acid containing nitric acid or/and phosphoric acid as main components is injected onto the tip of the probe.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3138581A JPH0760844B2 (en) | 1991-05-15 | 1991-05-15 | How to recycle used probe cards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3138581A JPH0760844B2 (en) | 1991-05-15 | 1991-05-15 | How to recycle used probe cards |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04338662A true JPH04338662A (en) | 1992-11-25 |
JPH0760844B2 JPH0760844B2 (en) | 1995-06-28 |
Family
ID=15225466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3138581A Expired - Lifetime JPH0760844B2 (en) | 1991-05-15 | 1991-05-15 | How to recycle used probe cards |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0760844B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5814158A (en) * | 1995-04-19 | 1998-09-29 | U.S. Philips Corporation | Method of cleaning probe tips of cards and apparatus for implementing the method |
US6474350B1 (en) | 1997-12-10 | 2002-11-05 | Mitsubishi Denki Kabushiki Kaisha | Cleaning device for probe needle of probe card and washing liquid used therefor |
WO2017075599A1 (en) * | 2015-10-30 | 2017-05-04 | Texas Instruments Incorporated | Magnetically shielded probe card |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100703140B1 (en) | 1998-04-08 | 2007-04-05 | 이리다임 디스플레이 코포레이션 | Interferometric modulation and its manufacturing method |
US8928967B2 (en) | 1998-04-08 | 2015-01-06 | Qualcomm Mems Technologies, Inc. | Method and device for modulating light |
US7916980B2 (en) | 2006-01-13 | 2011-03-29 | Qualcomm Mems Technologies, Inc. | Interconnect structure for MEMS device |
KR101472134B1 (en) | 2007-03-20 | 2014-12-15 | 누보트로닉스, 엘.엘.씨 | Coaxial transmission line microstructures and methods of formation thereof |
US8814601B1 (en) | 2011-06-06 | 2014-08-26 | Nuvotronics, Llc | Batch fabricated microconnectors |
-
1991
- 1991-05-15 JP JP3138581A patent/JPH0760844B2/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5814158A (en) * | 1995-04-19 | 1998-09-29 | U.S. Philips Corporation | Method of cleaning probe tips of cards and apparatus for implementing the method |
US6474350B1 (en) | 1997-12-10 | 2002-11-05 | Mitsubishi Denki Kabushiki Kaisha | Cleaning device for probe needle of probe card and washing liquid used therefor |
WO2017075599A1 (en) * | 2015-10-30 | 2017-05-04 | Texas Instruments Incorporated | Magnetically shielded probe card |
US9952255B2 (en) | 2015-10-30 | 2018-04-24 | Texas Instruments Incorporated | Magnetically shielded probe card |
US10191083B2 (en) | 2015-10-30 | 2019-01-29 | Texas Instruments Incorporated | Magnetic shielded probe card |
Also Published As
Publication number | Publication date |
---|---|
JPH0760844B2 (en) | 1995-06-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7025600B2 (en) | Semiconductor device having external contact terminals and method for using the same | |
US6056627A (en) | Probe cleaning tool, probe cleaning method and semiconductor wafer testing method | |
EP0766829B1 (en) | Method of cleaning probe tips of probe cards | |
TWI479158B (en) | Wafer testing probe card | |
US5304252A (en) | Method of removing a permanent photoimagable film from a printed circuit board | |
JPH04338662A (en) | Regeneration method for used probe card | |
EP0248029A1 (en) | Method for selectively removing adhesives from polyimide substrates. | |
US3384556A (en) | Method of electrolytically detecting imperfections in oxide passivation layers | |
KR101398180B1 (en) | The repairing method of test board for semiconductor device | |
JPH01130590A (en) | Cleaning of circuit board mounted with component | |
JP2000353865A (en) | Inspection method for conductor layer forming process on wiring board | |
US6480015B2 (en) | Circuit probing methods | |
JPH06148237A (en) | Contact pin for inspection of printed circuit board | |
JPH03241742A (en) | Cleaning device for semiconductor substrate | |
JP2007240240A (en) | Cleaning method of contact component | |
RU2003133172A (en) | METHOD OF TESTS AND CONTROL OF ELECTRONIC COMPONENTS | |
KR20020091665A (en) | Method for cleaning the needle tip of probe card | |
Schlough et al. | Cleaning processes for HIC's with solder paste | |
JPH116864A (en) | Method and equipment for electrical inspection of base | |
JPH0888498A (en) | Method for cleaning electronic component | |
Grunwald et al. | Aqueous Cleaning of Reflowed Surface Mount Assemblies' | |
Clay | The Cleaning of Printed Circuit Boards Using Organic Solvents | |
CN113068307A (en) | Circuit board anti-seepage plating method | |
JPH02194636A (en) | Analyzing method for integrated circuit | |
KR19990021286A (en) | Inspection device of semiconductor device |