JPH07256575A - Fine work machining method and device - Google Patents

Abstract

PURPOSE:To easily position a working device for a fine work by carrying out the necessary machining for the fine work by the working device through the remote operation, observing the fine work and the working device by a magnifying observing device. CONSTITUTION:The environment in a shaping chamber B is made same to that of a working chamber C, and a fine work W which is shaped by opening a gate valve V is carried into the working chamber C. In the working chamber C, the necessary work is carried out, observing the fine work W on a supporting board 7 and the working top ends of the working devices 25 and 31 by a scan type electron microscope 15 or an optical microscope 31a. Accordingly, when the cutting work is carried out for the fine work W, the micro end mill 35 of the working device 25b is approached to the fine work W, and working is carried out. In this case, the reaction force applied onto the working device from the fine work W is transmitted as the force feeling information or the sound information which is amplified by an operator through a force sensor 13.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a minute work processing method and apparatus for performing a required processing while observing a minute work with a magnifying observation device.

[0002]

2. Description of the Related Art Conventionally, in the production of microscopic workpieces used in micromachines, medical instruments, information equipment, etc., the conventional methods for machining microscopic workpieces are grinding, lapping,
The same lithography as semiconductors, X-ray irradiation from cyclotons, and electric discharge machining by wire cutting are used, but these methods are all limited to the machining of planar parts that can be easily manufactured. It is necessary to transport, position, adjust, fix, bond, etc. minute parts to make an assembly, and to further inspect, test, etc. to finish the parts of In the prior art, they are manually operated, that is, an operator searches for a minute work part or product that has been processed under a microscope and grips it with tweezers or the like to perform the work.

[0003]

However, some of these minute works have micron order or sub-micron order size, and these minute works are grasped with tweezers, conveyed to the working position, and given a predetermined size. It was difficult to position it, fix it, and perform the required work, and once it was out of the field of view of the microscope, it was time-consuming to find out and work efficiency was poor.

In addition, positioning a minute work for each work not only takes time, but also causes a positional deviation between the minute work and the working apparatus for each work, which causes a decrease in accuracy.

[0005]

SUMMARY OF THE INVENTION The present invention has been made to eliminate the above-mentioned drawbacks of the prior art. Therefore, according to the present invention, the minute work is provided in a working chamber in order to perform a required treatment on the minute work. It is supported on a fixed support table, and the support table can be moved in three orthogonal directions within the work chamber, and the working device can be moved spherically in the work chamber around a minute work on the support table. The above object is achieved by observing the microscopic work and the working device by the device and performing the required processing on the microscopic work by the working device by remote control.

The present invention also provides the above processing method,
The processing is assembling of minute work, machining of minute work,
The above object is achieved by a method comprising one or more of surface analysis, inspection and measurement.

Further, according to the present invention, in the above-mentioned processing method, the work table for movably supporting the support table for the minute work in three orthogonal directions is movable along a linear guide.
The above-described object is achieved by pre-forming the minute work in a forming chamber adjacent to the work chamber, and then transporting the minute work together with the work table to the work chamber and performing the required processing.

The present invention also provides the above processing method,
The shaping is beam sputtering, mask etching,
The above object is achieved by a method of either laser lathe or ultrasonic cutting.

Further, according to the present invention, in order to perform a required processing on a minute work, a working chamber, a table for supporting the minute work in the working chamber, and the supporting table can be moved in three orthogonal directions in the working chamber. A work table supported on the work table, and a work device arranged so that a spherical work can be moved around the micro work on the support table in the work chamber.
It consists of a magnifying observation device capable of observing the minute work and the working device on the support table, and a means for remotely operating the working table and the working device. The above object is achieved by a processing apparatus for a minute work piece that performs a required processing.

Further, according to the present invention, in the above processing apparatus, a horizontal circular guide centering on a minute work on the support is provided in a working chamber, and a vertical arc guide is attached to a slider sliding on the circular guide. The above-mentioned object is achieved by a minute work processing device in which the working device is slidably mounted on the arc guide.

Further, the present invention provides the above processing apparatus,
One or more of a tool for machining the micro work by the working device, an assembly tool for assembling the micro work, an analyzer for analyzing the surface of the micro work, an inspection device for inspecting the micro work, and a measuring device for measuring the micro work. The above-mentioned object is achieved by the following apparatus for processing minute works.

Further, in the present invention, in the above processing apparatus, a forming chamber for forming a minute work in advance is provided adjacent to the working chamber, and the working table is provided along the linear guide between the forming chamber and the working chamber. The above object is achieved by a processing device for a minute work that can be moved by a transfer device.

Furthermore, the present invention provides the above processing apparatus,
The above-mentioned object is achieved by a processing device for a minute work, in which the molding chamber is equipped with any one of a beam sputtering device, a mask etching device, a laser lathe, and an ultrasonic cutting device.

Further, in the above processing apparatus according to the present invention, a buffer chamber is provided adjacent to the working chamber, and the working table can be moved along the linear guide between the buffer chamber and the working chamber by the carrying device. The above-mentioned object is achieved by the above-mentioned processing apparatus for minute works.

[0015]

In the method and apparatus for processing a minute work of the present invention, the work tip of the work device, regardless of the work,
Since the microscopic work is easily placed in the field of view of the magnifying observation device, the operator can perform the work by operating the working device remotely while always observing the microscopic work and the working device with the magnifying observation device. For this reason, it is not necessary to position each minute work for each work, and the work efficiency can be improved.

Further, since it is not necessary to position the minute work for each work, the minute work is not lost, or the positional deviation between the minute work and the working device does not occur, and an efficient and highly accurate product is obtained. be able to.

Further, since various works can be performed in one work room, not only the work space can be reduced, but also the entire apparatus can be simplified, which is economical.

Further, when a minute work is preformed in a forming chamber adjacent to the working chamber and thereafter the work is performed in the working chamber, the minute work is moved to the working chamber together with the work table.
Not only is it easy to position the working device and the minute work, but there is no risk of losing the minute work.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 shows an embodiment of the present invention.
The embodiment is configured as a consistent production system for processing, assembling, inspecting, adjusting and analyzing a minute work having an accuracy of the order of 1 to 100 nm. This is because from the input of raw materials to the completion of the product, a small work piece is placed on a single workbench, and in each process the work piece is placed under the microscope and the workbench is moved to enable consistent work. ing.

The system includes three vacuum chambers, a buffer chamber A, a molding chamber B, and a working chamber C, and a gate valve V is provided between these three chambers to open and close the gate valve. By doing so, the minute work W can be moved along with the work table T along the linear guide 1 between the three chambers.

The buffer chamber A enables loading and unloading of the minute work W into and out of the working chamber C without impairing the atmosphere of the working chamber C.

The forming chamber B is for performing beam processing such as etching and film forming on the minute work W, and requires a special gas environment. Therefore, when performing work that adversely affects other operating equipment, This is done in a room separate from the working room C. Examples of the beam processing tool 3 include means for irradiating a substrate coated with a resist with a high-speed atomic beam for etching by reaction and evaporation, and for irradiating the substrate with an excimer laser through the mask 5 for decomposition and scattering. And so on.

The working chamber C is a vacuum or an atmosphere different from the atmosphere of the molding chamber, and the minute work W molded in the molding chamber.
For further processing, assembly, inspection, adjustment, analysis, etc.

For this reason, a working table T is provided in the working chamber C, and the working table supports the table 7 for supporting the minute work W and the supporting table so as to be movable in three orthogonal directions in the working chamber. The stage 9 and the linear slider 11 that supports the stage and is movable along the linear guide 1 are provided. The minute work W is fixed on the support base 7 by electrostatic attraction, an adhesive, an adhesive tape having high flatness, or the like. The processing force acting on the minute work W from the work device is detected by the force sensor 13, and the detection signal is amplified and transmitted to the operator as image information, acoustic information, or force sensation information. The stage 9 that moves the support base 7 in the three orthogonal directions includes a coarse movement stage and a fine movement stage.

In the working chamber C, when the workbench T is in a fixed position on the linear slider 1, the workbench T is positioned almost directly above the minute work support base 7 at the reference position on the workbench. A 3-DSEM (stereoscopic scanning electron microscope) 15 is provided so that the microscopic work W on the support 7 and the tip of the working device can be magnified and observed at high magnification (for example, 100,000 times).

Further, when the workbench T is in a fixed position on the linear slider 1, a horizontal circular guide 17 is provided substantially concentrically with the minute work support base 7 at the reference position on the workbench, and the circular guide is provided. A plurality of sliders 19 are slidably provided along the guides 21. An arc-shaped guide 21 is attached to each slider 19, and various working devices 25 are fixed to a slider 23 slidable along the arc guides. Has been done. As a result, each working device 25 can move spherically around the minute work W on the support base.

A plurality of vertical circular arc guides 27 are provided above the circular arc guides 21 concentrically with the circular arc guides, and sliders 29 are slidably mounted on the circular arc guides 27 and other sliders are mounted on the sliders. The work device 31 is fixed. The upper arc guide 27 is fixedly arranged in a vertical plane in the illustrated example, but if necessary, it can be slid along a horizontal circular guide like the lower arc guide 21.
Thereby, the working device 31 can be moved spherically around the minute work W. Alternatively, the work device 31
May be directly attached to the wall surface of the work chamber via a manipulator so that the spherical work can be moved around the minute work W.

By arranging the working devices 25 and 31 so that the spherical work can be moved around the minute work W as described above, a series of work can be performed quickly and accurately without moving the minute work W. it can.

As the working device 25 attached to the lower slider 23, for example, as shown in the drawing, a surface cutting probe 25a or a micro cutting tool 25b having a micro end mill 33 at its tip, or micro tweezers shown in FIGS. 35, an electrostatic desorption tool 37, a micro suction / desorption tool 39, a micro joining heater 41, and the like. The working device 31 attached to the upper slider 29 is an optical microscope 31a, an AFM (atomic force microscope), an STM (scanning tunnel microscope) 31b, or the like.

In the illustrated example, the surface analysis probe 25a irradiates the surface of the minute work W with a laser beam, and the reflected light is taken into the sample analyzer by a taking-in probe (not shown) on an arc guide opposite to the probe. The sample analysis of the surface of the micro work is performed by using the probe, but if the surface potential of the micro work needs to be measured, the potential should be measured by directly contacting the surface of the micro work with a probe capable of measuring the potential. You can also

The micro-tweezers 35 hold and release a minute work by opening and closing the opposing tip, and the micro electrostatic desorption tool 37 applies an electrostatic field to the tip and utilizes the applied voltage change (plus or minus) or vibration. For sucking and releasing minute workpieces, micro suction / desorption tool 39
Is a device that sucks air from the tip hole with a pump and adsorbs and releases the micro workpiece to the tip hole by the pressure difference or dynamic pressure applied to the micro workpiece. The micro-joining heater 41 locally heats the micro workpiece by heating the tip. The adhesive is applied evenly by heating.

The 3-DSEM (scanning electron microscope) 15 is capable of observing the processing state and the assembly state of the minute work W on the support base 7 and the working tips of the working devices 25 and 31 at a high magnification. The optical microscope 31a is used when the scanning electron microscope 15 cannot be used due to the influence of an electric field or a magnetic field, or when high magnification is not required, and the AFM (atomic force microscope) is electrically conductive and non-conductive. The atomic arrangement state of the surface of the electrically conductive minute work can be observed at the atomic level, and the STM (scanning tunneling microscope) can observe the atomic arrangement state of the surface of the electrically conductive minute work. These observation devices 15, 3
The input information from 1a and 31b is transmitted to the operator as image information in real time.

These working devices 25 and 31 are previously attached to the sliders 23 and 29 on the circular arc guide, and are selected and used as required, or used by exchanging with other working devices as required. can do.

The opening and closing of the gate valve V, the movement and stop of the work table T along the linear guide 1, and the movement of the minute work support table 7 in the three orthogonal directions are monitored by the operator. It can be operated by remote control while looking at the image display device.

Similarly, the movements of the sliders 19, 23 and 29 and the operation of the work devices 25 and 31 can be remotely controlled while monitoring the movements of the sliders by using an image display device or an acoustic display device.

Next, an example of a method for processing a minute work using the above processing system will be described.

First, the raw materials or parts of the minute work W to be processed are fixed on the support base 7, and the work base T is loaded into the buffer chamber A. Next, the buffer chamber A is brought into a vacuum state or the same state as the atmosphere in the working chamber, and when a predetermined state is reached, the gate valve V is opened to place the minute work W on the worktable T.
The whole is carried into the molding chamber B through the working chamber C. At this time, the support base 7 is lowered or the horizontal guide 17 is lowered so that the minute work W and the horizontal guide 17 do not come into contact with each other. Next, the gate valve of the forming chamber B is closed, the forming chamber is made to have a predetermined atmosphere, and then the minute work W is irradiated with a high-speed atomic beam or laser through the mask from the beam gun 3 to perform etching. After that, the atmosphere in the forming chamber B is made the same as that in the working chamber C, and the minute work W formed by opening the gate valve V is carried into the working chamber C. In the work room, 3-DSEM
The required work is performed while observing the minute work w on the support base 7 and the work tips of the work devices 25 and 31 with the (scanning electron microscope) 15 or the optical microscope 31a. That is, if the micro workpiece W is to be cut, the micro end mill 33 is brought close to the micro workpiece to perform the machining. At this time, the reaction force from the minute work W to the working device is transmitted to the operator via the force sensor 13 as amplified force sense information or acoustic information. Also,
When assembling one minute work with another minute work,
Each micro work is grasped or adsorbed by the micro tweezers 35 or the micro electrostatic attachment / detachment tool 37 to be positioned with respect to each other, and the holes and the projections of the micro works are combined, and / or the micro joining heater 41 is used for bonding. Assemble a minute work by fixing with a chemical. Therefore, as shown in FIG. 7, it is desirable that the support base 7a be further rotatable around a vertical axis so that the assembling work on the support base can be facilitated. While observing the state during assembling or after assembling in detail with the 3-DSEM (scanning electron microscope) 15 or the optical microscope 31a, if insufficient pushing or a situation requiring reassembly is found, push again or disassemble. Then reassemble and make other adjustments. The surface analysis probe 25a is used to measure the conductivity and resistance value of a small work after assembly.
Using. Further, when it is desired to check the surface of the minute work at the atomic level, the inspection is performed with an AFM (atomic force microscope) or STM (scanning tunnel microscope) 31b.

After completing a series of operations in this way,
The small work is moved again together with the workbench into the buffer chamber, and then taken out to the outside.

The processing in the molding chamber is not limited to the above-described processing, and for example, as shown in FIG. 8, film formation 45 (FIG. 8a) on a minute work using the convergent beam 43 and rotation of the minute work. However, mask etching using the mask 47 (FIG. 8b), ultrasonic cutting (FIG. 8c), and removal processing by a laser lathe (8d) can be performed.

Further, the working device arranged in the working chamber is not limited to the above-mentioned one, and an appropriate working device such as laser brazing shown in FIG. 8e can be used according to the work content.

[0042]

As described above, according to the present invention, in order to easily place the working device and the minute work in the visual field of the magnifying observation device, the operator always uses the magnifying observation device to make the minute work. It is possible to remotely operate the work device while observing the work device and the work device. Therefore, it is not necessary to position the minute work individually for each work, and the work efficiency can be improved.

Further, since it is not necessary to position the minute work for each work, the minute work is not lost, and the positional deviation between the minute work and the working device does not occur, and an efficient and highly accurate product is obtained. be able to.

Further, since various works can be performed in one work room, not only the work space can be reduced, but also the entire apparatus can be simplified, which is economical.

Further, when a minute work is preformed in a forming chamber adjacent to the working chamber and thereafter the work is performed in the working chamber, the minute work is moved to the working chamber together with the work table.
Not only is it easy to position the working device and the minute work, but there is no risk of losing the minute work.

[Brief description of drawings]

FIG. 1 is a schematic view showing a minute work processing apparatus according to an embodiment of the present invention.

FIG. 2 is an enlarged perspective view showing a main part of FIG.

FIG. 3 is a side view showing an example of a working device used in the minute work processing device of FIG.

FIG. 4 is a side view showing an example of a working device used in the minute work processing device of FIG.

5 is a side view showing an example of a working device used in the micro workpiece processing device of FIG. 1. FIG.

6 is a side view showing an example of a working device used in the micro workpiece processing device of FIG. 1. FIG.

FIG. 7 is a side view showing a modified example of the minute work support base.

FIG. 8 is a diagram showing an example of forming a minute work in the minute work processing apparatus of the present invention.

[Explanation of symbols]

A: buffer room, B: work room, C: molding room,
T: workbench, W: minute work, 1: straight line guide,
3: Beam gun, 7: Support 15: Scanning electron microscope 17: Circular guide, 19, 2
3: Slider, 25a, 25b, 31a, 31b, 3
5,37,39,41: Working device,

Claims (10)

[Claims] 1. To perform a required process on a minute work,
The minute work is supported on the support table in the work chamber, and the support table can be moved in three orthogonal directions in the work chamber. The working device is moved spherically in the work chamber around the minute work on the support table. A method for processing a microscopic work, characterized in that the microscopic work is performed by a remote control while observing the microscopic work and the working device with a magnifying observation device. 2. The processing method according to claim 1, wherein the processing comprises one or more of processing, assembling, surface analysis, inspection, and measurement of the minute work. 3. The processing method according to claim 1 or 2, wherein
A work table for movably supporting a support for the minute work in three orthogonal directions is made movable along a linear guide, and the minute work is preformed in a forming chamber adjacent to the work chamber, and then the minute work is performed. Is carried to the working chamber together with the workbench to perform the required processing. 4. The processing method according to claim 3, wherein the forming is any one of beam sputtering, mask etching, laser lathe, and ultrasonic cutting. 5. A processing apparatus for a minute work that performs a required processing on a minute work, a working chamber, a table for supporting the minute work in the working chamber, and the support table moved in three orthogonal directions in the working chamber. A work table that supports the work table, a work device that is arranged so as to be able to move spherically around the micro work on the support table in the work chamber, and a magnifying observation device that can observe the micro work and the work device on the support table. , A workbench and a means for remotely controlling the work device, and performing a required process on the microworkpiece while observing the work and the work device with a magnifying observation device. 6. The processing apparatus according to claim 5, wherein a horizontal circular guide centering on a minute work on the support table is provided in the working chamber, and an arc guide perpendicular to the slider sliding on the circular guide. And a working device which is slidably mounted on the arc guide. 7. The processing apparatus according to claim 5, wherein:
The working device is one or more of a tool for machining a minute work, an assembly tool for assembling a minute work, an analyzer for analyzing a surface of a minute work, an inspection device for inspecting a minute work, and a measuring device for measuring a minute work. A processing device for a minute work, characterized in that 8. The processing apparatus according to claim 5, further comprising a forming chamber adjacent to the working chamber for forming a minute work in advance, the working table being provided with the forming chamber and the working chamber. An apparatus for processing a minute work, characterized in that it can be moved along a straight line guide by a transfer device. 9. The processing apparatus according to claim 8, wherein the forming chamber includes any one of a beam sputtering apparatus, a mask etching apparatus, a laser lathe, and an ultrasonic cutting apparatus. apparatus. 10. The processing apparatus according to claim 5, wherein a buffer chamber is provided adjacent to the working chamber, and the workbench is provided between the buffer chamber and the working chamber along a linear guide. 2. A processing apparatus for minute work, wherein the apparatus is movable by the transfer device.