JPH0680804A - Resin-impregnated base material and electrical laminate - Google Patents

Abstract

PURPOSE:To provide a base material excellent in heat resistance after absorption of moisture and useful for electronic and electrical equipments, etc., by impregnating a base material with a specified epoxy resin varnish and drying it. CONSTITUTION:An epoxysilicone-modified novolak type phenol resin, a vinylsilicone and a hydrogensilicone are added to an epoxy resin containing an epoxy resin having a naphthalene skeleton and, as necessary, e.g. a curing agent such as a phenol resin, a curing promotor such as a phosphorous-based promotor and a solvent such as a ketone-based solvent are further added thereto to prepare an epoxy resin varnish. A base material made of glass fiber, etc., is impregnated with the resultant epoxy resin varnish and dried, thus producing the objective base material. In addition, an electrical laminate is obtained by monolithically laminating required leaves of the base materials whole placing a metal foil of copper, etc., on the upside and/or underside of each base material leaf.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-impregnated base material used for electronic equipment, electric equipment, calculators, communication equipment and the like, and an electric laminate.

[0002]

2. Description of the Related Art In recent years, attempts have been made to improve the heat resistance after moisture absorption as a measure for increasing the reliability of electric and electronic devices, but there are advantages and disadvantages, and there is no noticeable effect.

[0003]

As described in the prior art, it is not easy to improve the heat resistance after absorbing moisture. The present invention has been made in view of the above problems in the prior art, and an object thereof is to provide a resin-impregnated base material having improved heat resistance after moisture absorption, a laminated board for electrical use, and high electrical and electronic equipment. It is to improve reliability.

[0004]

Means for Solving the Problems The present invention comprises an epoxy resin containing a naphthalene skeleton epoxy resin, an epoxy silicon-modified novolac type phenol resin, vinyl silicon, and hydrogen silicone, and a curing agent if necessary.
A base material is formed by impregnating a base material with an epoxy resin varnish added with a curing accelerator, a solvent, etc., and drying the base material. The above-mentioned object can be achieved because of the electrical laminated board characterized by the above, and the present invention will be described in detail below.

The epoxy resin used in the present invention includes bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, glycidyl ether type epoxy resin, glycidyl ester type epoxy resin. Epoxy resin, glycidylamine type epoxy resin, linear aliphatic epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin, halogenated epoxy resin, etc. may be used alone, modified, or as a mixture. As the naphthalene skeleton epoxy resin, it is possible to use all naphthalene skeleton epoxy resins having two or more epoxy groups in one molecule. The epoxysilicon-modified novolac-type phenol resin is not particularly limited as long as it is a silicon-modified novolac-type phenol resin having an epoxy group in one molecule, but an epoxy equivalent of 500 to 10,000 is preferable. Vinyl silicon has two or more vinyl groups directly bonded to a silicon atom in one molecule. As hydrogen silicon, two hydrogen atoms directly bonded to a silicon atom are included in one molecule.
Have more than one. Epoxy silicone modified novolac type phenol resin, vinyl silicone, and hydrogen silicone are preferably used as the reaction products which have been previously reacted. The reaction can be made into a reaction product by heating at 50 to 160 ° C. for 20 to 120 minutes. As the curing agent used as necessary, a phenol resin, an isocyanate, an amine type curing agent, an acid anhydride, a Lewis acid complex compound, an imidazole type compound, etc. are used and are not particularly limited. If necessary, a phosphorus-based or tertiary amine-based curing accelerator is used as the curing accelerator. If necessary, the solvent is not particularly limited as long as it is compatible with the resin, such as a ketone solvent or an alcohol solvent. Further, if necessary, inorganic powder fillers such as talc, clay, silica, calcium carbonate, aluminum hydroxide, antimony trioxide and antimony pentoxide, glass fibers, asbestos fibers, pulp fibers, synthetic fibers, fibrous materials such as ceramic fibers. Fillers, colorants and the like can be added. As the base material, glass, inorganic fibers such as asbestos, polyester, polyamide,
Organic fibers such as polyacryl, polyvinyl alcohol, polyimide and fluororesin, and natural fibers such as cotton can be used. The base material may be impregnated only with the same resin, but a plurality of impregnations such as primary impregnation with the same resin or different type resin and secondary impregnation may be performed to make the impregnation more uniform. Thus, the resin is impregnated into the base material and dried to obtain a resin-impregnated base material. As the metal foil, a single, alloy, or composite foil of copper, aluminum, brass, nickel, iron or the like can be used. In this manner, a metal foil is provided on the upper surface and / or the lower surface of the required number of the resin-impregnated base materials and integrated to obtain an electrical laminate.

The present invention will be described below based on examples.

[0007]

Example: To 70 parts by weight of a naphthalene skeleton epoxy resin (hereinafter simply referred to as "part"), 10 parts of epoxy silicone-modified novolac type phenol resin and 10 parts of vinyl silicone are used.
Part, hydrogen silicon 10 parts 3 parts at 80 ℃
Reaction product obtained by heating for 0 minutes, dicyandiamide 4
Part, benzyl dimethylamine 0.2 part, and methyl oxytol 100 parts were added to an epoxy resin varnish, and a plain woven glass cloth having a thickness of 0.018 mm was impregnated so that the resin adhesion amount was 45%, and the resin impregnation group was dried. I got the material. Next, a thickness of 0.035 mm was formed on the upper and lower surfaces of the eight resin-impregnated base materials.
Molding pressure of 40Kg / cm
^2. Heat and pressure molding at 160 ℃ for 90 minutes, thickness 1.6m
A double-sided copper-clad laminated board having a thickness of m was obtained.

[0008]

[Comparative Example] Dicyandiamide 4 to 100 parts of epoxy resin (Epicoat 1001 manufactured by Ciel Chemical Co., Ltd.)
Part, benzyl dimethylamine 0.2 part, and methyloxytol 100 parts were used to obtain a resin-impregnated base material and double-sided copper-clad wiring having a thickness of 1.6 mm by the same treatment as in Example except that an epoxy resin varnish was used. A substrate was obtained.

Table 1 shows the performance of the electrical laminates of Examples and Comparative Examples. Heat resistance after moisture absorption is 85% humidity, 85 ℃
After absorbing moisture for 48 hours, it was immersed in molten solder at 250 ° C. for 10 seconds, and the cross-section was cut to check for internal cracks.

[0010]

[Table 1]

[0011]

The present invention is constructed as described above.
It has been confirmed that the electrical laminate using the resin-impregnated base material having the structure described in the claims has good heat resistance after moisture absorption and is excellent in the present invention.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Internal reference number FI Technical display location C08G 59/62 NJS 8416-4J H05K 1/03 D 7011-4E

Claims (2)

[Claims] 1. An epoxy resin comprising an epoxy resin containing a naphthalene skeleton epoxy resin, an epoxy silicon-modified novolac-type phenol resin, vinyl silicon and hydrogen silicon, and if necessary, a curing agent, a curing accelerator, a solvent and the like. A resin-impregnated base material, characterized in that the base material is impregnated with varnish and dried. 2. An epoxy resin containing an epoxy resin containing a naphthalene skeleton epoxy resin, an epoxy silicon-modified novolac type phenol resin, vinyl silicon, and hydrogen silicon, and a curing agent, a curing accelerator, a solvent, etc., if necessary. A laminated board for electrical use, characterized in that a metal foil is arranged and formed on a required number of upper and / or lower surfaces of a resin-impregnated base material in which a base material is impregnated with a varnish and dried.