JPH06143268A - Resin-impregnated base and electrical laminate - Google Patents

Abstract

PURPOSE:To provide an electrical laminate of superior resistance to smear and a resin-impregnated base used for the laminate. CONSTITUTION:A curing agent and a reaction product of vinyl-terminated organopolysiloxane and a side-chain hydrogen organopolysiloxane are added to epoxy resin, and if required, a base is impregnated with epoxy resin varnish to which a curing accelerator, a solvent and the like are added to form a resin impregnated base. Metallic foils are disposed integrally with the upper faces and/or lower faces of required number of the resin-impregnated bases to form an electrical laminate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-impregnated base material used for electronic equipment, electric equipment, calculators, communication equipment and the like, and an electric laminate.

[0002]

2. Description of the Related Art In recent years, smear resistance has been required as a measure for increasing the reliability of electrical and electronic equipment. For this reason, it is necessary to pay close attention to the opening process of the substrate, and it is inevitable that the work efficiency is lowered.

[0003]

As described in the prior art, in order to improve the smear resistance, the work efficiency of the opening process is lowered. The present invention has been made in view of the above problems in the prior art, the object is to obtain a resin-impregnated base material that can obtain a substrate with good smear resistance without lowering the work efficiency of the opening step, The purpose of the present invention is to provide a laminated board for electric use and improve the reliability of electric and electronic devices.

[0004]

Means for Solving the Problems The present invention adds a curing agent, a reaction product of a vinyl organopolysiloxane having both terminals and a side chain hydrogen organopolysiloxane to an epoxy resin, and further, if necessary, a curing accelerator, a solvent, etc. A resin-impregnated base material obtained by impregnating a base material into an epoxy resin varnish containing a resin, and a metal foil disposed on and integrated with a required number of upper and / or lower surfaces of the resin-impregnated base material. Since the laminate has achieved the above object, the present invention will be described in detail below.

The epoxy resin used in the present invention includes bisphenol A type epoxy resin, halogenated epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, glycidyl ether type epoxy resin, glycidyl ester type epoxy resin, Glycidylamine type epoxy resin, linear aliphatic epoxy resin,
Alicyclic epoxy resin, heterocyclic epoxy resin, etc.
Modified products and mixtures can be used. As the curing agent, a phenol resin, an isocyanate, an amine type curing agent, an acid anhydride, a Lewis acid complex compound, an imidazole type compound or the like can be used without any particular limitation. The both-end vinylorganopolysiloxane is not particularly limited as long as it has an alkyl group and a phenyl group. The side chain hydrogenoorganopolysiloxane is not particularly limited as long as it has an alkyl group and a phenyl group. Regarding the reaction between the vinyl organopolysiloxane having both terminals and the side chain hydrogenoorganopolysiloxane, the ratio thereof is arbitrary, and the reaction temperature and the reaction time are not particularly limited. The amount of the reaction product obtained is preferably 0.05 to 5% by weight of the resin (hereinafter simply referred to as "%"). That is, if it is less than 0.05%, it is difficult to improve the smear resistance, and if it exceeds 5%, bleeding tends to occur. A phosphorus-based or tertiary amine-based curing accelerator is used as the curing accelerator added as necessary. If necessary, a solvent that is compatible with the resin, such as a ketone-based solvent or an alcohol-based solvent, can be used and is not particularly limited. If necessary, talc, clay, silica, calcium carbonate, aluminum hydroxide, antimony trioxide,
Inorganic powder filler such as antimony pentoxide, glass fiber,
Fibrous fillers such as asbestos fibers, pulp fibers, synthetic fibers and ceramic fibers, coloring agents and the like can be added. As the base material, glass, inorganic fibers such as asbestos,
Organic fibers such as polyester, polyamide, polyacryl, polyvinyl alcohol, polyimide, and fluororesin,
Woven cloth, non-woven cloth, paper, mat and the like of natural fibers such as cotton can be used. The base material may be impregnated only with the same resin, but a plurality of impregnations such as primary impregnation with the same resin or different type resin and secondary impregnation may be performed to make the impregnation more uniform. Thus, the resin is impregnated into the base material and dried to obtain a resin-impregnated base material.
As metal foil, copper, aluminum, brass, nickel,
A single material such as iron, an alloy, or a composite foil can be used. In this manner, a metal foil is provided on the upper surface and / or the lower surface of the required number of the resin-impregnated base materials and integrated to obtain an electrical laminate. The present invention will be described below based on examples.

[0006]

EXAMPLE To 100 parts by weight of a bisphenol A type epoxy resin having an epoxy equivalent of 475 (hereinafter simply referred to as "part"), 95 parts of an equal mixture of vinyl organopolysiloxane having both ends and a side chain hydrogenoorganopolysiloxane was used.
0.5 part of a reaction product obtained by heating and reacting at 60 ° C., 4 parts of dicyandiamide, 0.2 part of benzyldimethylamine,
An epoxy resin varnish containing 100 parts of methyl oxytol was impregnated with a 0.018 mm-thick plain woven glass cloth so that the resin adhesion amount was 45%, and dried to obtain a resin-impregnated base material. Next, a laminated body in which copper foil having a thickness of 0.035 mm is arranged on the upper and lower surfaces of the eight resin-impregnated base materials stacked on each other is heated and pressure-molded at 160 ° C. for 90 minutes at a molding pressure of 40 Kg / cm ² , and a thickness of 1 is obtained. A 0.6 mm double-sided copper-clad laminate was obtained.

[0007]

[Comparative Example] A resin-impregnated base material was obtained in the same manner as in Example 1 except that a reaction product of a vinyl organopolysiloxane having both ends with a side chain hydrogenoorganopolysiloxane was not used and a double-sided copper having a thickness of 1.6 mm was used. A tension laminate was obtained.

Table 1 shows the performance of the electrical laminates of Examples and Comparative Examples.

[0009]

[Table 1]

[0010]

The present invention is constructed as described above.
It has been confirmed that the electrical laminate using the resin-impregnated base material having the structure described in the claims has excellent smear resistance and is excellent in the present invention.

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Claims (2)

[Claims] 1. An epoxy resin varnish obtained by adding a curing agent, a reaction product of vinyl organopolysiloxane at both ends and a side chain hydrogen organopolysiloxane to an epoxy resin, and further adding a curing accelerator, a solvent and the like as required. A resin-impregnated base material, which is obtained by impregnating and drying a base material. 2. An epoxy resin varnish obtained by adding a curing agent, a reaction product of a vinyl organopolysiloxane having both terminals and a side chain hydrogen organopolysiloxane to an epoxy resin, and further adding a curing accelerator, a solvent and the like as required. An electrical laminate, comprising a resin foil impregnated with a base material, and a metal foil provided on the upper surface and / or the lower surface of the required number of resin-impregnated base materials.