JPH0638431Y2 - heatsink - Google Patents

Description

TECHNICAL FIELD The present invention relates to a heat sink, and more particularly to a heat sink provided in close contact with a semiconductor element in order to dissipate heat from the semiconductor element that internally generates heat.

[Prior Art] Conventionally, in a semiconductor element that generates heat of this type, such as a power transistor, a rectifying element, or a diode, a radiator (heat sink) formed of an aluminum plate, a copper plate, or the like in order to dissipate heat generated inside. ) Is provided in close contact with the case of the semiconductor element, and the heat radiation efficiency is improved by keeping it in the form of standing on the printed circuit board.

2 and 3 show an example of the structure of such a conventional heat sink. In these figures, 10 is a printed circuit board, 11
Is a semiconductor element, for example, a transistor, 11A is a lead pin of the transistor 11, and 11B is its case. In addition, FIG. 2 shows that the flange portion 12A of the heat sink 12 is attached to the printed circuit board 10 with screws 13 for the plurality of transistors 11 which are vertically mounted via the lead pins 11A.
It was fixed to 0, thus heat sink 1
The flat plate portion 12B for radiating heat 2 is closely attached to the heat radiating surface 11C of the transistor 11 (hereinafter simply referred to as the case surface). In this state, the flat plate portion 12B of the heat sink is provided with a mounting hole (not shown) corresponding to the through hole 11D of each transistor 11, and in the state shown in the drawing, the transistor 11 is closely attached to the heat sink flat plate portion 12B by the screw 14. It is fixed in the state.

In FIG. 3, the transistor 11 is sandwiched between the flange portion 12A of the heat sink 12 and the printed circuit board 10. In the case of this example, the case 11 of the ton radiator 11
With B lying on the printed circuit board 10, the bent lead pin 11A causes the transistor 11 to move to the printed circuit board 10.
Mounted on top and electrically connected. Thus screw 15
The mounting holes (not shown) of the printed circuit board 10
11 through holes (not shown) and heat sink flange 12
By penetrating the fixing hole 12C of A, the transistor case surface 11C is kept in close contact with the flange portion 12A.

[Problems to be Solved by the Invention] However, in the above-described conventional heat sinks, the relative positioning between the heat sink and the semiconductor element is a problem, and in the case of the first conventional example shown in FIG. If the heat sink 12 is fixed to both sides after the transistor 11 is attached to, for example, the mounting through hole 11D of the transistor 11 and the fixing hole of the heat sink 12 do not match well, and it is impossible to perform the alignment. Lead pin
There is a risk of stressing 11A and damaging pin 11A. In addition, if the heat sink 12 is fixed to the heat sink 12 and then the heat sink 12 is attached to the printed circuit board 10, the step of connecting the lead pins 11A to the printed circuit board 10 by solder dip or the like is a post process, and the handling operation is difficult, It is an obstacle to the automation of production. .

In the case of the second conventional example shown in FIG. 3, the fixing hole 12C and the transistor 11 provided in the heat sink flange portion 12A are provided.
Match the through hole (not shown) of
It was necessary to match the through holes of 11 and the mounting holes of the printed circuit board 10 with each other. To make the transistor 11 a printed circuit board
Use a jig to attach the lead pin 11A
Forming related to bending is performed as a pretreatment,
First, the mounting hole of the printed circuit board 10 and the through hole of the transistor 11 should be aligned with each other, and then the fixing hole 12C of the heat sink flange portion 12A should be aligned with these, which is troublesome and inefficient. there were.

An object of the present invention is to focus on the above-mentioned conventional problems, and in order to solve the problems, a semiconductor element is attached to a printed circuit board, and the semiconductor elements are easily positioned with respect to the semiconductor elements, so that the two can be easily fixed to each other. An object of the present invention is to provide a heat sink which can be improved in workability and can be labor-saving and rationalized in its mounting.

[Means for Solving the Problems] In order to achieve such an object, the present invention provides a common heat sink that is provided in close contact with each case for a plurality of semiconductor elements electrically connected to a printed circuit board. An element holding portion capable of holding the case of the plurality of semiconductor elements in close contact with the printed circuit board, and a heat dissipation portion for dissipating heat transferred from the plurality of semiconductor elements via the element holding portion. A plurality of legs that can be mounted on a positioning portion provided on the printed board and a fastening unit that fastens the element holding portion to the printed board are provided.

[Operation] According to the present invention, the legs are mounted on the printed circuit board so that the surfaces of the case are in contact with each other, and the plurality of connected semiconductor elements are closely attached to the element holding portion on the other surface of the case. The case of the semiconductor element can be held between the element holding portion and the printed board by fastening the element holding portion and the printed board by the fastening means after mounting and positioning on the positioning portion of the printed board. In this state, the heat radiating portion can radiate the heat generated in relation to the semiconductor element. The heat sink is positioned and attached to the semiconductor element and the printed board separately from the attachment of the semiconductor element to the printed board. be able to. In addition, since the positioning is performed only by mounting the legs on the positioning portion of the printed circuit board, it is possible to improve workability and save labor for mounting, without the need for complicated procedures and operations as in the past.

Embodiments Embodiments of the present invention will be specifically described below with reference to the drawings.

FIG. 1 shows an embodiment of the present invention. Here, 1 is a semiconductor element, such as a transistor, mounted on the printed circuit board 10 via the lead pin 1A. 2 is a heat sink according to the present invention, 2A is a flange-shaped element holding portion capable of holding the case 1B of the transistor 1 between the printed board 10 and 2B, and 2B.
Is a heat radiating portion for radiating heat, 2C is a fixing hole formed in the element holding portion 2A, and 2D is a positioning leg portion extending from both ends of the heat radiating portion 2B toward the printed circuit board 10. On the other hand, the printed circuit board 10 has a mounting hole 10A for fixing the heat sink 2 to the printed circuit board 10 with the screw 3 at a position facing the fixing hole 2C.
Positioning holes 10B are provided on both sides corresponding to the legs 2D.

When mounting the heat sink 2 configured as described above, the leg portion 1A of the transistor 1 is connected to a predetermined connection portion on the printed circuit board 10, and the case surface 1C is turned upside down with the case 1B being inverted. None, the element holding portion 2A of the heat sink 2 is brought into contact with the case surface 1C from above, and the positioning leg portion 2D is inserted into the positioning hole 10B of the printed circuit board 10. It should be noted that in this state of positioning, the fixing hole 2C of the element holding portion 2A and the printed circuit board 10
Since the mounting hole 10A and the mounting hole 10A are preliminarily drilled so that their relative positions coincide with each other, it is only necessary to insert the screw 3 into the fixing hole 2C through the mounting hole 10A and screw it. Here, if silicone grease is applied between the heat radiation surface 1C of the transistor 1 and the opposing surface on the element holding portion 2A side that is in contact with the heat radiation surface 1C, the effect of enhancing the heat transfer function can be obtained.

In the embodiment described above, the heat dissipation part of the heat sink
2B is formed of a metal into a flat plate shape, but the shape of the heat dissipation part is not limited to a single flat plate shape. For example, one having fins, one that is divided into a plurality of flat plates, or a large number of plates. Needless to say, it may be in a form suitable for heat dissipation, such as a hole provided with the above.

[Advantages of Device] As described above, according to the present invention, a plurality of semiconductor device cases can be held in close contact with a printed circuit board, and a plurality of semiconductor device cases can be held via the device holding units. Since the heat dissipation portion for radiating the heat transmitted from the semiconductor element, the plurality of legs attachable to the positioning portion provided on the printed board, and the fastening means for fastening the element holding portion to the printed board are provided, A plurality of semiconductor elements can be simply mounted on the board by a labor-saving method such as dipping, and then the heat sink can be positioned on the printed board. As a fastening means, the heat sink can be mounted on the printed board with a single screw. The element can be held between the element holding part of the heat sink and the printed circuit board, and the workability in mounting the heat sink can be rationalized and improved. You can

[Brief description of drawings]

FIG. 1 is a perspective view showing an example of the structure of a heat sink of the present invention, and FIGS. 2 and 3 are perspective views showing two examples of the structure of a heat sink as a conventional example. 1 ... Transistor, 1A ... Lead pin, 1B ... Case, 1C ... Case surface, 2 ... Heat sink, 2A ... Element holding part, 2B ... Heat dissipation part, 2C ... Fixing hole, 2D ... Leg part , 10 ... Printed circuit board, 10A ... Mounting hole, 10B ... Positioning hole.

Claims (1)

[Scope of utility model registration request] 1. A common heat sink provided in close contact with each case of a plurality of semiconductor elements electrically connected to a printed circuit board, wherein cases of the plurality of semiconductor elements are provided between the printed circuit board and the case. An element holding part that can be held in close contact, a heat radiation part that dissipates heat transferred from the plurality of semiconductor elements via the element holding part, and a plurality of legs that can be mounted on a positioning part provided on the printed circuit board. And a fastening means for fastening the element holding portion to the printed circuit board.