JP2003133681A - Fixture of semiconductor device and fixing structure thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device fixture and semiconductor device fixing structure capable of erecting a semiconductor device through spacers, insulation between electrodes, measures against noise and cooling using a radiating fin. SOLUTION: The semiconductor device fixture has a semiconductor device fixing part for putting the body of the semiconductor device on it, a seat to be mounted on a board and leg inserting parts provided with leg inserting holes penetrated from the fixing part up to the seat to insert respective legs of the semiconductor device into them, and an extended diameter for inserting a cylindrical bead core is formed on at least one of the leg inserting holes.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device attachment and a semiconductor device attachment structure using the same.

[0002]

As is well known, for example, TO-3, TO-
A semiconductor device commonly referred to as 220 or the like has a relatively large structure in which leads (legs) are led out from one end of a flat mold case. For example, a diode,
When used as a switching power supply for transistors, etc., the switching frequency causes current and voltage waveforms to ring at several MHz, causing noise to the outside.
In the worst case, the breakdown voltage may be exceeded and damage may occur.

Therefore, in the case of a lead of a semiconductor device, for example, in the case of a transistor, a cylindrical bead core of ferrite or amorphous is inserted in the lead of a drain to suppress noise and protect it. FIG. 28 shows a mounting structure of a semiconductor device to which a general bead core is mounted. When the semiconductor device 1 is mounted on the printed circuit board 5, if it is mounted as it is, it will not be mounted vertically but will be tilted. Therefore,
The inclination is prevented by inserting the spacer 3 into the lead 2 of the semiconductor device 1.

Further, by inserting the spacer 3, the spacing between the leads 2 is secured, and the printed circuit board 5
By eliminating the gap between the spacer 3 and the spacer 3, it is possible to prevent dust from adhering and prevent short-circuit failure. Bead core 4
Are directly mounted on the printed circuit board 5. Also, T
Since the semiconductor devices commonly referred to as O-3, TO-220, etc. generate a large amount of heat from power transistors for high power, switching FETs for large current, etc., as shown in FIG. 6 is attached via a screw 7.

[0005]

When the bead core 4 is inserted into the semiconductor device 1, the spacer 3 cannot be mounted. Therefore, the bead core 4 is directly mounted on the printed circuit board 5, as shown in FIG. . Therefore, it is necessary to separately perform the self-standing of the semiconductor device 1 by the spacer 3 and the insulation between the electrodes and the noise countermeasure by the bead core 4. In addition, as shown in FIG. 29, the radiation fin 6 has a screw 7
Since the semiconductor device 1 is attached via the, the work different from the assembling of the semiconductor device 1 is required.

It is known that a spring-shaped clip is used in place of the screw 7, but in this case as well as the screw 7, a work different from the assembling of the semiconductor device 1 is required. The present invention has been made to solve such conventional problems, and an object thereof is a semiconductor device mounting tool capable of performing self-standing of a semiconductor device and insulation between electrodes by a spacer and noise countermeasures by a bead core. To provide.

Another object of the present invention is to provide a semiconductor device mounting tool which can perform self-supporting of a semiconductor device and insulation between electrodes by a spacer, measures against noise by a bead core, and cooling by a radiation fin. is there. Another object of the present invention is to provide a semiconductor device mounting structure capable of performing self-standing of a semiconductor device and insulation between electrodes by a spacer, and measures against noise by a bead core.

Another object of the present invention is to provide a semiconductor device mounting structure capable of performing self-standing of a semiconductor device and insulation between electrodes by a spacer, measures against noise by a bead core, and cooling by a radiation fin. is there.

[0009]

The invention according to claim 1 is
A semiconductor device mounting portion on which a main body portion of the semiconductor device is mounted, a seat portion mounted on a substrate, and a penetrating portion from the semiconductor device mounting portion to the seat portion, and the leg portions of the semiconductor device are respectively inserted. And a leg insertion portion provided with a leg insertion hole, and at least one of the leg insertion holes is formed with an enlarged diameter portion into which a cylindrical bead core is inserted. Claim 2
The invention according to claim 1 is the semiconductor device mounting tool according to claim 1, wherein the semiconductor device mounting portion has wall surface portions surrounding three outer sides of the main body portion of the semiconductor device.

According to a third aspect of the present invention, in the semiconductor device attachment according to the second aspect, the bead core is provided on a wall surface portion of the semiconductor device attachment portion facing the leg insertion hole in which the enlarged diameter portion is formed. Is characterized in that a notch for inserting is formed. According to a fourth aspect of the present invention, in the semiconductor device attachment according to the first aspect, a locking claw that is fitted into a hole provided in the substrate is formed in the seat.

According to a fifth aspect of the present invention, the semiconductor device mounting portion on which the main body of the semiconductor device is mounted, the wall surface portion surrounding the semiconductor device mounting portion on three sides, and the end portions of the wall surface portion facing each other are provided. A radiation fin mounting portion, a seat portion mounted on the board,
Provided are leg insertion portions penetrating from the semiconductor device attachment portion to the seat portion and provided with leg insertion holes for inserting the leg portions of the semiconductor device, respectively, and a notch portion fitted into the heat radiation fin attachment portion. And a plate-shaped radiating fin, and a diametrically expanded portion into which a cylindrical bead core is inserted is formed in at least one of the leg insertion holes. It is characterized in that a spring member having a shape of a circle is provided.

According to a sixth aspect of the present invention, in the semiconductor device attachment according to the fifth aspect, the bead core is provided on a wall surface portion of the semiconductor device attachment portion facing the leg insertion hole in which the enlarged diameter portion is formed. Is characterized in that a notch for inserting is formed. According to a seventh aspect of the present invention, in the semiconductor device mounting tool according to the fifth aspect, a locking claw that is fitted into a hole provided in the substrate is formed in the seat.

According to an eighth aspect of the present invention, in the semiconductor device mounting fixture according to the fifth aspect, the plate-shaped heat radiation fin is formed with a hole for inserting the spring member, and the spring member is
A fixing portion fixed to one side surface of the plate-shaped heat radiation fin,
It is characterized in that it is integrally provided with a connecting portion which passes through the hole and a curved portion which is arranged on the other side surface of the plate-shaped heat radiation fin.

According to a ninth aspect of the present invention, the semiconductor device mounting portion on which the main body portion of the semiconductor device is mounted, the wall surface portion surrounding the semiconductor device mounting portion on three sides, and the end portions of the wall surface portion facing each other are provided. A radiation fin mounting portion, a seat portion mounted on the board,
Provided are leg insertion portions penetrating from the semiconductor device attachment portion to the seat portion and provided with leg insertion holes for inserting the leg portions of the semiconductor device, respectively, and a notch portion fitted into the heat radiation fin attachment portion. And a curved spring member provided with a cutout portion to be fitted into the radiation fin mounting portion, and at least one of the leg insertion holes has a cylindrical bead core. It is characterized in that an enlarged diameter portion for inserting is formed.

According to a tenth aspect of the present invention, in the semiconductor device attachment according to the ninth aspect, the bead core is provided on a wall surface portion of the semiconductor device attachment portion facing the leg insertion hole in which the enlarged diameter portion is formed. Is characterized in that a notch for inserting is formed. The invention according to claim 11 is the semiconductor device mounting tool according to claim 9, wherein the seat portion is
It is characterized in that a locking claw fitted in a hole provided in the substrate is formed.

According to a twelfth aspect of the present invention, a semiconductor device mounting portion on which a main body portion of the semiconductor device is mounted, a seat portion mounted on a substrate, and a penetrating portion from the semiconductor device mounting portion to the seat portion are provided. A leg insertion portion having leg insertion holes for respectively inserting the leg portions of the semiconductor device, a radiation fin attachment portion provided to face one end of the semiconductor device attachment portion, and the other end of the semiconductor device attachment portion. A wall portion that is erected on the wall portion, a concave portion that is provided on the boundary portion between the semiconductor device mounting portion and the wall portion, a hole portion that extends from the top of the wall portion to the concave portion, and project from the wall portion. And a pair of arm portions provided with a radiation fin mounting portion of the same shape at a position facing the radiation fin mounting portion, a pair of cylindrical spring members having a through hole disposed in the recess, and A screw hole that can be moved up and down and is arranged on the lower surface side of the spring member. A punching plate member, a screw member that is inserted into the hole and that is screwed into the screw hole of the plate member through the through hole of the spring member, and the semiconductor device mounting portion side and the pair of arm portions, respectively. A plate-shaped heat radiation fin fitted into the heat radiation fin mounting portion, and a diameter expansion portion into which a cylindrical bead core is inserted is formed in at least one of the leg insertion holes provided in the semiconductor device mounting portion. It is characterized by being.

According to a thirteenth aspect of the present invention, in the semiconductor device mounting tool according to the twelfth aspect, a locking claw that is fitted into a hole provided in the substrate is formed in the seat. And According to a fourteenth aspect of the present invention, in the semiconductor device mounting tool according to the twelfth aspect, there are two hole portions provided in the wall surface portion.

According to a fifteenth aspect of the present invention, in the semiconductor device mounting fixture according to the twelfth aspect, the plate-shaped heat radiation fins are T-shaped. Claim 16
The invention according to claim 12 is the semiconductor device mounting tool according to claim 12, wherein the plate-shaped heat radiation fin is bent at a portion protruding from the heat radiation fin mounting portion provided on the pair of arm portions. To do.

According to a seventeenth aspect of the present invention, a pair of semiconductor device mounting portions for mounting the main body portion of the semiconductor device, a seat portion mounted on the substrate, and the pair of semiconductor device mounting portions to the seat portion are provided. A leg insertion portion having a leg insertion hole penetrating therethrough and each of which penetrates a leg portion of the semiconductor device; a heat radiation fin attachment portion provided opposite to both ends of the pair of semiconductor device attachment portions; Of the semiconductor device mounting portions, an opening provided at the boundary between the pair of semiconductor device mounting portions on the wall surface portion, and a penetrating portion from the top of the wall surface portion to the opening portion. A hole portion, a pair of arm portions projecting from both ends of the wall surface portion and provided with a radiation fin mounting portion of the same shape at a position facing the radiation fin mounting portion, and a through hole provided in the opening portion. A pair of tubular spring members, and the spring portion A plate member provided on the lower surface of the plate with a vertically movable screw hole; a screw member inserted into the hole and inserted through a through hole of the spring member and screwed into the screw hole of the plate member; A semiconductor device mounting portion side and plate-shaped heat radiation fins fitted into the heat radiation fin mounting portions respectively provided on the pair of arm portions, and at least one of the leg insertion holes has a cylindrical shape. It is characterized in that an enlarged diameter portion for inserting the bead core is formed.

According to an eighteenth aspect of the present invention, in the semiconductor device mounting tool according to the seventeenth aspect, the seat portion is formed with a locking claw that is fitted into a hole provided in the substrate. And According to a nineteenth aspect of the present invention, in the semiconductor device mounting tool according to the seventeenth aspect, the leg insertion holes provided in the wall surface portion are two.

According to a twentieth aspect of the present invention, in the semiconductor device mounting tool according to the seventeenth aspect, the plate-shaped heat radiation fins are T-shaped. Claim 21
The invention according to claim 17 is the semiconductor device mounting tool according to claim 17, wherein the plate-shaped radiating fins are bent at portions projecting from the radiating fin mounting portions respectively provided on the pair of arm portions. And

According to a twenty-second aspect of the present invention, there is provided a semiconductor device attachment according to any one of the first to third aspects, and at least one leg provided on the semiconductor device attachment portion of the semiconductor device attachment. A cylindrical bead core inserted into the insertion hole, a semiconductor device in which a leg portion is inserted into the leg insertion hole of the semiconductor device mounting tool and a main body portion is mounted on the semiconductor device mounting portion, and a leg of the semiconductor device. A substrate provided with a leg insertion hole for inserting a portion, the semiconductor device attachment is mounted on the substrate, and the semiconductor device has a leg portion with the leg insertion hole of the semiconductor device attachment and the semiconductor device attachment. It is characterized in that it penetrates the substrate through the leg insertion holes of the substrate and is fixed to the substrate with solder.

According to a twenty-third aspect of the present invention, there is provided a semiconductor device attachment according to the fourth aspect, and a cylindrical shape inserted into at least one of the leg insertion holes provided in the semiconductor device attachment portion of the semiconductor device attachment. A bead core, a semiconductor device in which a leg portion is inserted into the leg insertion hole of the semiconductor device mounting tool and a main body portion is placed on the semiconductor device mounting portion, and a leg insertion hole into which the leg portion of the semiconductor device is inserted are provided. And a substrate provided with a locking hole portion for inserting the locking claw of the semiconductor device mounting tool, the semiconductor device mounting tool being mounted on the substrate and locking the locking claw. The semiconductor device is fixed to the board by being locked in the use hole portion, and in the semiconductor device, the leg portion penetrates the substrate through the leg insertion hole of the semiconductor device fixture and the leg insertion hole of the substrate, and solder Fixed to the substrate with Characterized by comprising Te.

According to a twenty-fourth aspect of the present invention, there is provided at least the semiconductor device attachment according to any one of the fifth, sixth and eighth aspects, and at least the semiconductor device attachment portion of the semiconductor device attachment. A cylindrical bead core inserted into one of the leg insertion holes; a semiconductor device in which a leg portion is inserted into the leg insertion hole of the semiconductor device attachment and a main body portion is placed on the semiconductor device attachment portion; A substrate provided with a leg insertion hole into which a leg portion of the semiconductor device is inserted, the semiconductor device attachment is mounted on the substrate, and the semiconductor device is
The leg portion penetrates the substrate through the leg insertion hole of the semiconductor device mounting fixture and the leg insertion hole of the substrate and is fixed to the substrate with solder, and the side wall surface portion of the plate-shaped heat radiation fin is provided. It is characterized in that it is pressed toward the wall surface portion side by the provided curved spring member and is sandwiched between the spring member and the wall surface portion.

According to a twenty-fifth aspect of the present invention, there is provided a semiconductor device attachment according to the seventh aspect, and a cylindrical shape inserted into at least one of the leg insertion holes provided in the semiconductor device attachment portion of the semiconductor device attachment. A bead core, a semiconductor device in which a leg portion is inserted into the leg insertion hole of the semiconductor device mounting tool and a main body portion is placed on the semiconductor device mounting portion, and a leg insertion hole into which the leg portion of the semiconductor device is inserted are provided. And a substrate provided with a locking hole portion for inserting the locking claw of the semiconductor device mounting tool, the semiconductor device mounting tool being mounted on the substrate and locking the locking claw. The semiconductor device is fixed to the board by being locked in the use hole portion, and in the semiconductor device, the leg portion penetrates the substrate through the leg insertion hole of the semiconductor device fixture and the leg insertion hole of the substrate, and solder Fixed to the substrate with And wherein the being pressed into the wall portion by said curved spring member sidewall portions are provided on the heat radiating fins formed by sandwiched between the spring member and the wall surface.

According to a twenty-sixth aspect of the present invention, the semiconductor device attachment according to the ninth or tenth aspect is inserted into at least one of the leg insertion holes provided in the semiconductor device attachment portion of the semiconductor device attachment. A cylindrical bead core, a semiconductor device in which a leg portion is inserted into the leg insertion hole of the semiconductor device mounting tool and a main body portion is mounted on the semiconductor device mounting portion, and a leg into which the leg portion of the semiconductor device is inserted A substrate provided with an insertion hole, the semiconductor device attachment is placed on the substrate, and the semiconductor device has a leg portion having the leg insertion hole of the semiconductor device attachment and the leg insertion of the substrate. The substrate is penetrated through the hole and is fixed to the substrate by solder, and the side wall surface portion is pressed toward the wall surface portion side by the heat dissipation fin and the curved spring member, and the spring member and the wall surface portion. Characterized in that it comprises is sandwiched.

According to a twenty-seventh aspect of the present invention, there is provided a semiconductor device attachment according to the eleventh aspect, and a cylindrical shape inserted into at least one of the leg insertion holes provided in the semiconductor device attachment portion of the semiconductor device attachment. A bead core, a semiconductor device in which a leg portion is inserted into the leg insertion hole of the semiconductor device mounting tool and a main body portion is placed on the semiconductor device mounting portion, and a leg insertion hole into which the leg portion of the semiconductor device is inserted are provided. And a substrate provided with a locking hole portion for inserting the locking claw of the semiconductor device mounting tool, the semiconductor device mounting tool being mounted on the substrate and locking the locking claw. The semiconductor device is fixed to the board by being locked in the use hole portion, and in the semiconductor device, the leg portion penetrates the substrate through the leg insertion hole of the semiconductor device fixture and the leg insertion hole of the substrate, and solder Fixed to the substrate with It is, and is pressed by the heat radiating fins and said curved spring member sidewall portions to said wall portion, characterized in that formed by sandwiched between the spring member and the wall surface.

The invention according to claim 28 is the semiconductor device mounting tool according to any one of claims 12, 14, 15, or 16, and the semiconductor device mounting portion of the semiconductor device mounting tool. A cylindrical bead core inserted into at least one of the leg insertion holes provided in the semiconductor device, and a semiconductor in which a leg portion is inserted into the leg insertion hole of the semiconductor device attachment and a main body portion is placed on the semiconductor device attachment portion. A device and a substrate provided with a leg insertion hole into which a leg portion of the semiconductor device is inserted, the semiconductor device attachment is placed on the substrate,
In the semiconductor device, a leg portion penetrates the substrate through the leg insertion hole of the semiconductor device mounting fixture and the leg insertion hole of the substrate and is fixed to the substrate by solder, and side wall surface portions are the pair. The cylindrical spring member is pressed toward the radiating fin side and sandwiched between the spring member and the radiating fin.

According to a twenty-ninth aspect of the present invention, there is provided a semiconductor device attachment according to the thirteenth aspect, and a cylindrical shape inserted into at least one of the leg insertion holes provided in the semiconductor device attachment portion of the semiconductor device attachment. A bead core, a semiconductor device in which a leg portion is inserted into the leg insertion hole of the semiconductor device mounting tool and a main body portion is placed on the semiconductor device mounting portion, and a leg insertion hole into which the leg portion of the semiconductor device is inserted are provided. And a substrate provided with a locking hole portion for inserting the locking claw of the semiconductor device mounting tool, the semiconductor device mounting tool being mounted on the substrate and locking the locking claw. The semiconductor device is fixed to the board by being locked in the use hole portion, and in the semiconductor device, the leg portion penetrates the substrate through the leg insertion hole of the semiconductor device fixture and the leg insertion hole of the substrate, and solder Fixed to the substrate with It is, and sidewall portions is pressed to the radiating fin side by the pair of cylindrical spring member, characterized in that formed by sandwiched between the spring member and the heat radiation fins.

The invention according to claim 30 is the semiconductor device mounting tool according to any one of claim 17, claim 19, claim 20 or claim 21, and the pair of semiconductor devices of the semiconductor device mounting tool. A cylindrical bead core inserted into at least one leg insertion hole for each leg insertion portion provided in each attachment portion, and a leg portion inserted into the leg insertion hole of the semiconductor device attachment and the semiconductor device attachment Two semiconductor devices each having a main body portion mounted thereon and a substrate having a leg insertion hole into which a leg portion of each of the two semiconductor devices is inserted are provided, and the semiconductor device attachment is mounted on the substrate. In the two semiconductor devices, a leg portion penetrates the substrate through the leg insertion hole of the semiconductor device attachment and the leg insertion hole of the substrate and is fixed to the substrate with solder, and a side wall surface portion Is the one Is pressing to the cylindrical the radiating fin side by the spring member of which characterized by comprising been held between the spring member and the heat radiation fins.

According to a thirty-first aspect of the invention, there is provided at least one leg for each of the semiconductor device attachment according to the eighteenth aspect and each leg insertion portion provided on each of the pair of semiconductor device attachment portions of the semiconductor device attachment. A cylindrical bead core inserted into the insertion hole, two semiconductor devices each having a leg portion inserted into the leg insertion hole of the semiconductor device attachment and a main body portion placed on the semiconductor device attachment portion, and the semiconductor device. And a substrate provided with a locking hole for inserting the locking claw of the semiconductor device mounting tool, and the semiconductor device mounting tool is mounted on the substrate. And the locking claws are locked in the locking holes to be fixed to the substrate, and the two semiconductor devices have legs that are the leg insertion holes of the semiconductor device mounting tool and the substrate. Through the leg insertion hole And is fixed to the substrate by solder, and the side wall surface portion is pressed toward the heat radiation fin side by the pair of cylindrical spring members and is sandwiched between the spring member and the heat radiation fin. And

[0032]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 show a semiconductor device mounting tool 10 (corresponding to claims 1, 2 and 3) according to a first embodiment of the present invention, and a semiconductor device mounting structure 30 using the semiconductor device mounting tool 10 (claims). (Corresponding to Item 22).
The semiconductor device mounting tool 10 according to the present embodiment includes a semiconductor device mounting part 11 on which a main body part (mold case) 21 of a rectangular parallelepiped semiconductor device (for example, a power transistor for high power) 20 is mounted, and a substrate (for example, a semiconductor device mounting part). , A printed circuit board, etc.) 25, and a leg portion (for example, leads) 22a, 22b, 22c of the semiconductor device 20 penetrating from the semiconductor device mounting portion 11 to the seat portion 12 And a leg insertion portion 13 provided with leg insertion holes 13a, 13b, 13c which are respectively inserted therethrough.

In the center leg insertion hole 13b, an enlarged diameter portion 14 into which the cylindrical bead core 28 is inserted and placed is formed from the semiconductor device mounting portion 11 toward the seat portion 12. Therefore, the enlarged diameter portion 14 is a concave portion and does not penetrate the seat portion 12. The semiconductor device 2 is attached to the semiconductor device mounting portion 11.
Wall surface portion 15 surrounding three outer side portions of the main body portion 21 of 0
a, 15b, 15c are formed.

The lateral width W1 of the semiconductor device mounting portion 11 is equal to or slightly larger than the lateral width of the main body portion 21 of the semiconductor device 20, and the vertical width (depth) W2 of the semiconductor device mounting portion 11 is set.
Is slightly larger than the width of the bottom surface of the main body 21 of the semiconductor device 20. Here, the vertical width (depth) W2 of the semiconductor device mounting portion 11 is made slightly larger than the vertical width of the bottom surface of the main body portion 21 of the semiconductor device 20 because the outer diameter of the cylindrical bead core 28 is the semiconductor device 20. Because it is larger than the vertical width of.

An arcuate cutout 16 for inserting a cylindrical bead core 28 is formed in a vertical direction in a wall surface portion 15b facing the leg insertion hole 13b in which the expanded diameter portion 14 is formed. Next, the operation of the semiconductor device mounting structure 30 using the semiconductor device mounting tool 10 according to the present embodiment thus configured will be described.

First, the cylindrical bead core 28 is inserted into the expanded diameter portion 14 provided in the center leg insertion hole 13b of the semiconductor device mounting tool 10 according to the present embodiment and placed in the expanded diameter portion 14. At this time, the cylindrical bead core 28 has an arcuate notch 1 for inserting the bead core 28 formed in the wall surface portion 15b.
6 and is guided into the enlarged diameter portion 14 of the leg insertion hole 13b.

Next, the leg portions 22a, 22 of the semiconductor device 20.
Insert b and 22c into the leg insertion holes 13a, 13b and 13c. Next, the semiconductor device mounting tool 10 according to the present embodiment to which the semiconductor device 20 is mounted is placed on the substrate 25 via a jig (not shown), and the leg portions 22a and 22b of the semiconductor device 20 are placed in the through holes 26 of the substrate 25. , 22c.

Next, the leg portions 22a, 22b, 22c protruding from the through hole 26 of the board 25 are fixed to the board 25 by soldering according to a conventional method. As described above, according to the present embodiment, the semiconductor device mounting tool 10 makes the semiconductor device 20 self-supporting and the leg portion (electrode) 2 as in the conventional spacer.
Insulation between the 2a, 22b and 22c can be performed, and noise can be prevented by the cylindrical bead core 28 housed in the leg insertion hole 13b of the semiconductor device mounting tool 10.

Therefore, according to the present embodiment, it is possible to obtain the semiconductor device mounting structure 30 which simultaneously achieves the self-standing of the semiconductor device and the insulation between the electrodes by the spacer and the noise countermeasure by the bead core, which have been individually performed simultaneously. it can.
The semiconductor device mounting structure 30 according to this embodiment can also be formed as follows.

First, the central leg portion 22b of the semiconductor device 20.
The cylindrical bead core 28 is inserted through. Next, the semiconductor device 20 is held with the legs 22a, 22b, 22c facing upward, and the semiconductor device mounting tool 10 according to the present embodiment is opposed. Next, the semiconductor device fixture 10 or the semiconductor device 20 according to the present embodiment is moved to bring them closer to each other, and the leg portions 22a, 22b, 22 are placed in the leg insertion holes 13a, 13b, 13c.
Insert c.

At this time, the cylindrical bead core 28 moves along the arcuate notch 16 for insertion of the bead core 28 formed in the wall surface portion 15b, and enters the enlarged diameter portion 14 of the leg insertion hole 13b. Be guided. Next, the semiconductor device mounting fixture 10 according to the present embodiment to which the semiconductor device 20 is mounted is arranged on the substrate 25 by a jig (not shown), and the leg portions 22a, 22b, 22c of the semiconductor device 20 are placed in the through holes 26 of the substrate 25.
Through.

Next, the leg portions 22a, 22b, 22c projecting from the through hole 26 of the board 25 are fixed to the board 25 by soldering in accordance with a conventional method. 5 to 8 show a semiconductor device mounting tool 40 (corresponding to claim 4) and a semiconductor device mounting structure 45 (corresponding to claim 23) using the same according to a second embodiment of the present invention.

The semiconductor device mounting tool 40 according to the present embodiment.
Is a seat portion 1 of the semiconductor device fixture 10 according to the first embodiment.
2 is provided with two locking claws 41, 41, which is different from the semiconductor device mounting tool 10 according to the first embodiment. Further, the semiconductor device mounting structure 45 according to the present embodiment is different from the semiconductor device mounting structure 30 according to the first embodiment in that the board 25 of the semiconductor device mounting structure 30 according to the first embodiment is provided with the two holes 27, 27 for the locking claws. It is different from the semiconductor device mounting structure 30 according to the embodiment.

The semiconductor device mounting tool 40 according to this embodiment.
As shown in FIG. 7, the two locking claws 41,
Since it can be locked via 41, there is an advantage that supporting and fixing at the time of soldering becomes more reliable than the semiconductor device mounting tool 10 according to the first embodiment. Also in the present embodiment, it is possible to achieve the same effects as those of the semiconductor device mounting tool 10 and the semiconductor device mounting structure 30 according to the first embodiment.

9 to 13 show a semiconductor device attachment 50 (corresponding to claims 5, 6 and 8) according to a third embodiment of the present invention and a semiconductor device attachment structure 70 (claim 24) using the same. (Corresponding to). The semiconductor device mount 50 according to the present embodiment is a main body portion of the semiconductor device mount 50 (corresponding to the semiconductor device mount 10 according to the first embodiment) 50.
The semiconductor device mounting tool 10 according to the first embodiment differs from the semiconductor device mounting tool 10 according to the first embodiment in that a locking mechanism for mounting the plate-shaped heat radiation fin 60 is provided on a and the plate-shaped heat radiation fin 60 is mounted via the locking mechanism. .

The main body 50a of the semiconductor device mount 50 according to this embodiment is a semiconductor device mount for mounting the main body (mold case) 21 of a rectangular parallelepiped semiconductor device (for example, a power transistor for high power) 20. 51 and the substrate 2
5, and the leg portion 22 of the semiconductor device 20 penetrates through the seat portion 52 mounted on the sheet 5 and the seat portion 52 from the semiconductor device mounting portion 51.
leg insertion holes 53 for inserting a, 22b, and 22c, respectively.
and a leg insertion portion 53 provided with a, 53b, and 53c, and an enlarged diameter portion 54 into which the cylindrical bead core 28 is inserted is formed in the center leg insertion hole 53b.

The semiconductor device 2 is attached to the semiconductor device mounting portion 51.
A wall surface portion 55 surrounding three outer sides of the main body portion 21 of 0
a, 55b, 55c are formed. The lateral width W1 of the semiconductor device mounting portion 51 is equal to or slightly larger than the lateral width of the main body portion 21 of the semiconductor device 20.
The vertical width (depth) W2 of 1 is the main body 2 of the semiconductor device 20.
It is slightly larger than the width of the bottom surface of 1. Here, the vertical width (depth) W2 of the semiconductor device mounting portion 51 is equal to the semiconductor device 2
The reason why it is made slightly larger than the vertical width of the bottom surface of the main body portion 21 of 0 is that the outer diameter of the cylindrical bead core 28 is larger than the vertical width of the semiconductor device 20.

An arcuate notch 56 for inserting the bead core 28 is vertically formed in the wall surface portion 55b facing the leg insertion hole 53b in which the enlarged diameter portion 54 is formed.
A pair of radiating fin mounting portions 5 for locking the plate-shaped radiating fins 60 are provided at the ends of the wall surface portions 55a and 55c of the main body portion 50a.
7, 57 are provided. Radiating fin mounting part 57, 57
Is formed by projecting the end portions of the wall surface portions 55a and 55c and providing recessed grooves or cutouts from both sides of the end portions of the wall surface portions 55a and 55c toward the center. The pair of radiating fin mounting portions 57, 57 constitutes a locking mechanism for the plate-shaped radiating fins 60.

The height of the pair of radiation fin mounting portions 57, 57 is the same as the height of the wall surface portions 55a, 55c. As shown in FIGS. 11 and 12, the plate-shaped radiating fins 60 are
For example, a plate member made of aluminum is provided with cutout portions 61, 61 to be fitted into the pair of radiation fin attachment portions 57, 57, and a rectangular hole 62 is provided between the cutout portions 61, 61.
The curved spring member 65 is attached through the hole 62 and the screw 69.

When the plate-shaped radiating fins 60 are assembled to the pair of radiating fin mounting portions 57, 57, the notch portions 61, 61 have a depth set so as to be flush with the seat portion 52, It is desirable that the upper end portion 63 has a height protruding from the wall surface portions 55a, 55b, 55c. The curved spring member 65 includes a fixing portion 66 fixed to the one side surface 60 a of the plate-shaped heat radiation fin 60, and a connecting portion 67 inserted through the hole 62.
And a curved portion 68 disposed on the other side surface 60b of the plate-shaped heat radiation fin 60 are integrally provided.

Next, a semiconductor device mounting structure 7 using the semiconductor device mounting tool 50 according to the present embodiment having the above structure.
The action of 0 will be described. First, the expanded diameter portion 5 provided in the center leg insertion hole 53b of the semiconductor device mounting fixture 50 according to the present embodiment.
The cylindrical bead core 28 is inserted into 4. At this time, the cylindrical bead core 28 moves along the arcuate notch 56 for inserting the bead core 28 formed in the wall surface portion 55b, and is guided into the enlarged diameter portion 54 of the leg insertion hole 53b.

Next, as in the first embodiment, the leg portions 22a, 22b, 22c of the semiconductor device 20 are connected to the leg insertion holes 53a,
It inserts in 53b and 53c (however, in FIG. 13, only the leg part 22b and the leg insertion hole 53b are shown, and the rest are abbreviate | omitted). Next, a plate-shaped heat radiation fin 60 is arranged below the pair of heat radiation fin mounting portions 57, 57, the plate heat radiation fin 60 is moved toward the pair of heat radiation fin mounting portions 57, 57, and the notch portion is formed. 61 and 61 are a pair of heat radiation fin mounting portions 5
Insert it into 7,57.

At this time, as the plate-shaped heat radiation fin 60 moves, the curved spring member 65 abuts against the wall surface portion of the semiconductor device 20 and presses the semiconductor device 20 toward the wall surface portion 25b.
Then, when the cutout portions 61, 61 are fitted into the pair of heat radiation fin mounting portions 57, 57, as shown in FIG. 13, the semiconductor device 20 is sandwiched between the curved spring member 65 and the wall surface portion 55b.

Next, the semiconductor device mounting fixture 50 according to the present embodiment to which the semiconductor device 20 is mounted is placed on the substrate 25,
The leg portion 2 of the semiconductor device 20 is provided in the through hole 26 of the substrate 25.
2a, 22b, 22c are inserted. Next, the leg portions 22a, 22b, 22 protruding from the through holes 26 of the substrate 25
C is fixed to the substrate 25 by soldering according to a conventional method.

As described above, the semiconductor device mounting structure 70 can be obtained. Also in the present embodiment, it is possible to achieve the same effects as those of the semiconductor device mounting tool 10 and the semiconductor device mounting structure 30 according to the first embodiment. In addition, also in this embodiment, the locking claw 41 can be provided similarly to the second embodiment shown in FIGS. 4 to 8 (corresponding to claims 7 and 25).

14 to 17 show a semiconductor device mounting tool 80 (corresponding to claims 9 and 10) according to a fourth embodiment of the present invention and a semiconductor device mounting structure 90 using the same (corresponding to claim 26). Yes). The semiconductor device attachment 80 according to the present embodiment relates to the third embodiment in that the plate-shaped heat radiation fin 81 and the curved spring member 83 are individually attached from above the pair of heat radiation fin attachment portions 57, 57. It is different from the semiconductor device fixture 50.

In the present embodiment, the semiconductor device mounting tool 8
The main body 80a of No. 0 has the same shape as the main body 50a of the third embodiment. The plate-shaped heat radiation fin 81 is provided with cutouts 82, 82 to be fitted into the pair of heat radiation fin mounting portions 57, 57. The curved spring member 83 is provided with a cutout portion 84 and a curved portion 85 which are fitted into the pair of heat radiation fin mounting portions 57, 57.

Next, a semiconductor device mounting structure 9 using the semiconductor device mounting tool 80 according to the present embodiment thus configured
The action of 0 will be described. In the semiconductor device mounting structure 90 according to the present embodiment, the semiconductor device 20 is mounted on the semiconductor device mounting tool 80.
The steps up to the attachment to the main body 80a are the same as in the third embodiment.

Next, the pair of radiation fin mounting portions 57, 57
A curved spring member 83 is arranged on the upper side of, and the curved spring member 83 is moved toward the pair of radiating fin mounting portions 57, 57, and the cutout portions 61, 61 are arranged in the pair of radiating fin mounting portions 57, 57. Insert it into 57. Next, a plate-shaped heat radiation fin 81 is arranged above the pair of heat radiation fin mounting portions 57, 57,
The plate-shaped radiating fin 81 is pushed to the outside of the curved spring member 83 previously attached to the pair of radiating fin mounting portions 57, 57, and the cutouts 82, 82 are formed in the pair of radiating fin mounting portions 57, 57. Fit in.

At this time, with the pressing of the plate-shaped heat radiation fin 81, the curved spring member 83 contacts the wall surface portion of the semiconductor device 20, and presses the semiconductor device 20 toward the wall surface portion 55b.
Then, when the cutouts 82, 82 are fitted into the pair of heat radiation fin mounting portions 57, 57, the semiconductor device 20 is sandwiched between the curved spring member 83 and the wall surface 55b, as shown in FIG.

As described above, the semiconductor device mounting structure 90 can be obtained. Also in the present embodiment, it is possible to achieve the same effects as those of the semiconductor device mounting tool 10 and the semiconductor device mounting structure 30 according to the first embodiment. In addition, also in this embodiment, the locking claw 41 can be provided similarly to the second embodiment shown in FIGS. 4 to 8 (claim 11,
(Corresponding to claim 27).

18 to 23 show a semiconductor device attachment 100 (corresponding to claims 12 and 15) according to the fifth embodiment of the present invention and a semiconductor device attachment structure 120 using the same.
(Corresponding to claim 28) is shown. The semiconductor device mount 100 according to the present embodiment is provided with two locking mechanisms for the plate-shaped heat radiation fins 117 and also has the plate-shaped heat radiation fins 117.
A pair of cylindrical spring members 11 that press the semiconductor device 20 against
The semiconductor device mounting fixture 50 according to the third embodiment differs from the semiconductor device mounting fixture 50 according to the third embodiment in that 0 and 110 are provided so as to face the plate-shaped heat radiation fins 117.

The semiconductor device mount 100 according to this embodiment.
The main body portion 100 a of the semiconductor device 20 penetrates the semiconductor device mounting portion 101 on which the main body portion of the semiconductor device 20 is mounted, the seat portion 102 mounted on the substrate 25, and the semiconductor device mounting portion 101 to the seat portion 102. Legs 22a, 22b of the semiconductor device 20,
22c through the leg insertion holes 103a and 103, respectively.
b and 103c, the leg insertion portion 103, the pair of heat radiation fin mounting portions 105 and 105 provided to face the one end portion 101a of the semiconductor device mounting portion 101, and the semiconductor device mounting portion 1
01, the wall surface portion 106 erected on the other end portion 101 b, the recess portion 107 provided on the wall surface portion 106 at the boundary portion with the semiconductor device mounting portion 101, and the recess portion 1 from the top portion 106 a of the wall surface portion
07 and a pair of radiating fin mounting portions 105, 10 protruding from the wall surface portion 106 and the hole portion 108 penetrating therethrough.
5, a radiation fin mounting portion 110 of the same shape,
A pair of arm portions 109, 109 provided with 110, a pair of tubular spring members 111, 111 having a through hole 112 arranged in the hole portion 108, and a pair of tubular spring members 11
The plate member 113 provided with a screw hole 114 disposed on the lower surface side of the plate 1, 1111 and the through hole 112 of the pair of cylindrical spring members 111, 111 inserted into the hole 108 are inserted through the plate member 1
It has 13 screw holes 114 and screw members 115 to be screwed.

The leg insertion holes 103a, 103b, 103c provided in the semiconductor device mounting portion 101 have a long hole shape, and the enlarged diameter portion into which the cylindrical bead core 28 is inserted and placed in the center leg insertion hole 103b. 104 is formed. The plate-shaped heat radiation fin 117 has a T-shape, and the fin body 11
7a denotes a semiconductor device mounting portion 101 side and a pair of arm portions 1
09, 109 are fitted in a pair of heat radiation fin mounting portions 105, 105, 110, 110, respectively, and projecting portions 117b, 117c on both sides are provided in a pair of arm portions 109, 1
It is mounted on 09.

Next, the operation of the semiconductor device mounting structure 120 using the semiconductor device mounting fixture 100 according to the present embodiment thus constructed will be described. First, as shown in FIG.
The main body portion 10 of the semiconductor device mounting fixture 100 according to the present embodiment.
0a, the plate-shaped heat radiation fin 117, the semiconductor device 20, and the cylindrical bead core 28 are prepared.

Next, the leg portions 22a, 22 of the semiconductor device 20.
b, 22c are inserted into leg insertion holes 103a, 103b, 103c provided in the semiconductor device mounting portion 101. Next, the plate-shaped heat radiation fins 117 are fitted into the pair of heat radiation fin mounting portions 105, 105, 110, 110 provided on the semiconductor device mounting portion 101 side and the pair of arm portions 109, 109, respectively, and projecting portions on both sides are fitted. 117b and 117c are placed on the pair of arm portions 109 and 109.

Next, the screw member 115 is inserted through the hole 108, and the through hole 1 of the pair of cylindrical spring members 111, 111 is inserted.
12 is inserted, and is disposed on the lower surface side of the pair of cylindrical spring members 111, 111 and screwed with the screw hole 114 of the plate member 113. The assembled state up to this point is shown in FIG. Next, the screw member 115 is rotated to move the plate member 113 to the wall surface portion 1.
06 to the side of the top portion 106a. As a result, FIG.
As shown in FIG. 3, a pair of tubular spring members 111, 111
Is compressed and flattened, and the semiconductor device 20 is pressed toward the plate-shaped heat radiation fin 117 side. Therefore, the semiconductor device 20 is sandwiched between the pair of cylindrical spring members 111, 111 and the plate-shaped heat radiation fin 117.

As described above, the semiconductor device mounting structure 120 can be obtained. Also in the present embodiment, it is possible to achieve the same effects as those of the semiconductor device mounting tool 10 and the semiconductor device mounting structure 30 according to the first embodiment. In addition,
Also in the present embodiment, the locking claw 41 can be provided as in the second embodiment shown in FIGS.
3, corresponding to claim 29).

Further, in the present embodiment, the case where one hole 108 for inserting the screw member 115 is provided has been described, but it may be two as shown in FIG. 24 (claim 1).
4, corresponding to claim 28). In this case, the pair of cylindrical spring members 111, 111 also have two through holes 112. Further, in this embodiment, the T-shaped heat radiation fin 117 is used.
Although the case where the above is used has been described, as shown in FIGS. 25 and 26, the heat radiation fin 118 may be formed by bending the portions projecting from the pair of arm portions 109, substantially at right angles.

Further, although the case where one semiconductor device 20 is attached has been described in the present embodiment, for example, as shown in FIG. 27, the semiconductor attaching portion is separated from the wall surface portion 131 by one semiconductor device attaching tool 130. 132, 132 may be provided symmetrically. In this case, a pair of cylindrical spring members 133 and 133 and the plate member 1 are provided below the wall surface portion 131.
34 is arranged.

Also in this embodiment, the pair of spring members 133 and 133 can be deformed by the screw member to press the two semiconductor devices 20 toward the heat radiation fin 117 or 118 (claims 17, 20). (Corresponding to claim 21 and claim 30). Note that, also in this embodiment,
The locking claw 41 can be provided similarly to the second embodiment shown in FIGS. 4 to 8 (corresponding to claims 19 and 31).

Further, in the present embodiment, the case where one hole 135 through which the screw member 115 is inserted is provided, but it may be two as in the semiconductor device mounting tool shown in FIG. (Corresponding to item 19). In this case, the pair of cylindrical spring members 133 and 133 also has two through holes.

[0073]

According to the present invention, it is possible to simultaneously perform self-standing of a semiconductor device, insulation between electrodes, and measures against noise by a bead core. Further, according to the present invention, it is possible to simultaneously perform self-standing of a semiconductor device and insulation between electrodes, measures against noise by a bead core, and cooling by a radiation fin.

[Brief description of drawings]

FIG. 1 is a front view showing a semiconductor device mounting tool 10 according to a first embodiment of the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is a perspective view of FIG. 1.

4 is a front view of a semiconductor device mounting structure 30 using the semiconductor device mounting tool 10 of FIG.

FIG. 5 is a front view showing a semiconductor device mounting tool 40 according to a second embodiment of the present invention.

FIG. 6 is a side view of FIG.

7 is a front view showing a state in which the semiconductor device attachment 40 of FIG. 5 is attached to a substrate.

8 is a front view of a semiconductor device mounting structure 45 using the semiconductor device mounting fixture 40 of FIG.

FIG. 9 is a plan view showing a semiconductor device mounting fixture 50 according to a third embodiment of the present invention.

FIG. 10 is a perspective view of FIG. 9.

11 is a front view showing a plate-shaped radiating fin 60 used in the semiconductor device mounting fixture 50 of FIG. 9. FIG.

12 is a side view showing the plate-shaped heat dissipation fin 60 of FIG. 11. FIG.

13 is a sectional view of a semiconductor device mounting structure 70 using the semiconductor device mounting fixture 50 of FIG.

FIG. 14 is a front view showing a plate-shaped heat dissipation fin 81 used in a semiconductor device attachment 80 according to a fourth embodiment of the present invention.

FIG. 15 is a front view showing a spring member 83 used in a semiconductor device attachment 80 according to a fourth embodiment of the present invention.

16 is a side view of the spring member 83 of FIG.

FIG. 17 is a sectional view of a semiconductor device mounting structure 90 using a semiconductor device mounting fixture 80 according to a fourth embodiment of the present invention.

FIG. 18 is a plan view showing a semiconductor device mounting fixture 100 according to a fifth embodiment of the present invention.

19 is a perspective view showing the semiconductor device attachment 100 of FIG.

20 is a front view showing a plate-shaped heat radiation fin used in the semiconductor device attachment 100 of FIG. 18. FIG.

21 is a perspective view showing a state before assembling a semiconductor device mounting structure 120 using the semiconductor device mounting fixture 100 of FIG. 18. FIG.

22 is a side view showing a state before the semiconductor device mounting structure 120 shown in FIG. 21 is assembled.

23 is a side view showing a state after assembling of the semiconductor device mounting structure 120 shown in FIG. 21. FIG.

24 is a plan view showing an example in which the semiconductor device attachment 100 of FIG. 18 is provided with two holes 108 through which the screw members 115 are inserted.

25 is a perspective view showing an example in which the plate-shaped heat radiation fin shown in FIG. 20 is bent.

26 is a side view showing a semiconductor device mounting structure using the plate-shaped heat radiation fin shown in FIG. 25. FIG.

FIG. 27 is a plan view showing a semiconductor device mounting tool having a pair of semiconductor device mounting portions.

FIG. 28 is a front view showing an example of mounting a conventional semiconductor device using a spacer.

FIG. 29 is a front view showing a mounting example of a conventional semiconductor device using a radiation fin.

[Explanation of symbols]

10, 40, 50, 80, 100, 130 Semiconductor device mounting tool 30, 45, 70, 90, 120 Semiconductor device mounting structure 11 Semiconductor device mounting part 12 Seat part 13 Leg insertion part 13a, 13b, 13c Leg insertion hole 14 Expansion Diameter portions 15a, 15b, 15c Wall surface portion 16 Cutout portions 22a, 22b, 22c12 Leg portion 20 Semiconductor device 21 Main body portion 25 Substrate 26 Through hole 27 of substrate 25 Hole portion 28 Cylindrical bead core 41 Locking claw 50a Semiconductor device mounting Main body 51 of tool 50 Semiconductor device mounting portion 52 Seat portion 53 Leg insertion portions 53a, 53b, 53c Leg insertion hole 54 Expanded diameter portions 55a, 55b, 55c Wall surface portion 56 Cutout portion 57 Radiating fin mounting portion 60 Plate-shaped heat radiation Fin 60a One side 60b of the plate-shaped heat dissipation fin 60 Other side 61 of the plate-shaped heat dissipation fin 60 Notch 62 Hole 65 Curved Spring member 67 Connection portion 68 Curvature portion 69 Screw 80a Main body portion 81 of the semiconductor device mounting tool 80 Plate-shaped heat radiation fin 82 Cutout portion 83 Curvature spring member 84 Cutout portion 85 Curving portion 100a Main body of the semiconductor device mounting fixture 100 Part 101 Semiconductor device mounting part 102 Seat part 103 Leg insertion part 103a, 103b, 103c Leg insertion hole 101a One end part 105 of the semiconductor device mounting part 101 Radiating fin mounting part 101b The other end part 106 of the semiconductor device mounting part 101 Wall surface part 107 Recessed part 106a Top part 108 of wall surface part 106 Hole part 109 Arm part 110 Cylindrical spring member 110 Radiating fin mounting part 111 Cylindrical spring member 112 Through hole 113 Plate member 114 Screw hole 115 Screw member 117 Plate-shaped radiating fin 117a Fin body 117b protrusion 131 wall surface 132 semiconductor mounting portion 133 cylinder The spring member 134 plate member

Claims (31)

[Claims] 1. A leg of the semiconductor device, including a semiconductor device mounting portion on which a main body portion of the semiconductor device is mounted, a seat portion mounted on a substrate, and a penetrating from the semiconductor device mounting portion to the seat portion. And a leg insertion portion provided with a leg insertion hole through which each of the portions is inserted, and at least one of the leg insertion holes is formed with an expanded diameter portion into which a cylindrical bead core is inserted. Semiconductor device mounting tool. 2. The semiconductor device mounting tool according to claim 1, wherein the semiconductor device mounting part has wall surfaces surrounding three outer sides of the main body of the semiconductor device. . 3. The semiconductor device mounting tool according to claim 2, wherein a notch for inserting the bead core is formed in a wall surface portion of the semiconductor device mounting portion facing the leg insertion hole in which the enlarged diameter portion is formed. A semiconductor device mounting fixture, wherein a portion is formed. 4. The semiconductor device mount according to claim 1, wherein the seat has a locking claw that is fitted into a hole formed in the substrate. . 5. A semiconductor device mounting portion on which a main body portion of a semiconductor device is mounted, a wall surface portion surrounding three sides of the semiconductor device mounting portion, and a radiation fin mounting portion provided at an end portion of the wall surface portion facing each other. A seat portion mounted on a substrate, a leg insertion portion having leg insertion holes penetrating from the semiconductor device mounting portion to the seat portion and respectively inserting leg portions of the semiconductor device, and the radiation fin mounting A plate-shaped heat radiation fin provided with a notch portion to be fitted into the portion, and at least one of the leg insertion portions provided with the leg insertion holes,
A semiconductor device mounting fixture, wherein an enlarged diameter portion for inserting a cylindrical bead core is formed, and a curved spring member is provided on one side surface of the plate-shaped heat radiation fin. 6. The semiconductor device mounting tool according to claim 5, wherein a notch for inserting the bead core is formed in a wall surface portion of the semiconductor device mounting portion facing the leg insertion hole in which the enlarged diameter portion is formed. A semiconductor device mounting fixture, wherein a portion is formed. 7. The semiconductor device mounting tool according to claim 5, wherein the seat has a locking claw that is fitted into a hole provided in the substrate. . 8. The semiconductor device attachment according to claim 5, wherein the plate-shaped heat radiation fin has a hole through which the spring member is inserted, and the spring member is formed on one side surface of the plate-shaped heat radiation fin. 2. A semiconductor device mounting tool, comprising: a fixing portion to be fixed, a connecting portion that passes through the hole, and a curved portion that is arranged on the other side surface of the plate-shaped heat radiation fin. 9. A semiconductor device mounting portion on which a main body portion of a semiconductor device is mounted, wall surfaces surrounding the semiconductor device mounting portion on three sides, and heat radiation fin mounting portions provided at end portions of the wall surface portion facing each other. A seat portion mounted on a substrate, a leg insertion portion having leg insertion holes penetrating from the semiconductor device mounting portion to the seat portion and respectively inserting leg portions of the semiconductor device, and the radiation fin mounting A plate-shaped radiating fin provided with a cutout portion fitted into the radiating portion, and a curved spring member provided with a cutout portion fitted into the radiating fin mounting portion, wherein the leg insertion hole is provided. At least one of the leg insertion parts provided,
A semiconductor device mounting fixture, wherein an enlarged diameter portion for inserting a cylindrical bead core is formed. 10. The semiconductor device attachment according to claim 9, wherein a notch for inserting the bead core is formed in a wall surface portion of the semiconductor device attachment portion facing the leg insertion hole in which the enlarged diameter portion is formed. A semiconductor device mounting fixture, wherein a portion is formed. 11. The semiconductor device mount according to claim 9, wherein the seat has a locking claw that is fitted into a hole provided in the substrate. . 12. A semiconductor device mounting portion on which a main body portion of a semiconductor device is mounted, a seat portion mounted on a substrate, and a leg of the semiconductor device, which penetrates from the semiconductor device mounting portion to the seat portion. Leg insertion holes through which the respective parts are inserted, a heat radiation fin attachment portion provided facing one end of the semiconductor device attachment portion, and a wall surface erected at the other end of the semiconductor device attachment portion. Section, a recessed portion provided on the wall surface portion at a boundary portion with the semiconductor device mounting portion, a hole portion penetrating from the top of the wall surface portion to the recessed portion, the heat radiation fin mounting portion protruding from the wall surface portion A pair of arm portions provided with the same shape of the radiation fin attachment portion at a position facing the portions, a pair of cylindrical spring members provided with through holes disposed in the recess, and a lower surface side of the spring member. A plate member provided with a screw hole that can be moved up and down, A screw member that is inserted into the hole and that inserts the through hole of the spring member into a screw hole of the plate member, and the heat dissipation fin attachment portion provided on the semiconductor device attachment portion side and the pair of arm portions, respectively. A radiating fin in the form of a plate that is fitted to the semiconductor device mounting portion, and at least one of the leg insertion holes provided in the semiconductor device mounting portion is formed with an enlarged diameter portion into which a cylindrical bead core is inserted. Characteristic semiconductor device mounting tool. 13. The semiconductor device mount according to claim 12, wherein the seat has a locking claw that is fitted into a hole provided in the substrate. . 14. The semiconductor device mounting tool according to claim 12, wherein the wall surface portion has two holes. 15. The semiconductor device mounting tool according to claim 12, wherein the plate-shaped heat dissipation fin is T-shaped. 16. The semiconductor device mounting tool according to claim 12, wherein the plate-shaped radiating fins are bent at portions projecting from the radiating fin mounting portions provided on the pair of arm portions. Semiconductor device mounting tool. 17. A pair of semiconductor device mounting parts for mounting a main body part of a semiconductor device, a seat part mounted on a substrate, and a penetrating from the pair of semiconductor device mounting parts to the seat part, Between the leg insertion portions provided with leg insertion holes for inserting the leg portions of the semiconductor device, the heat radiation fin attachment portions provided opposite to both ends of the pair of semiconductor device attachment portions, and between the pair of semiconductor device attachment portions. A wall portion that is erected on the wall surface, an opening portion that is provided at the boundary portion between the pair of semiconductor device mounting portions on the wall surface portion, a hole portion that extends from the top portion of the wall surface portion to the opening portion, and the wall surface. Of the pair of arms, each of which has a radiating fin mounting portion of the same shape provided at a position facing the radiating fin mounting portion and protruding from both ends of the portion, and a pair of through holes provided in the opening. -Shaped spring member and disposed on the lower surface side of the spring member A plate member with a vertically movable screw hole, a screw member that is inserted into the hole and that is inserted into the through hole of the spring member and screwed into the screw hole of the plate member, and the pair of semiconductor device mounting portions And a plate-shaped radiating fin fitted into the radiating fin mounting portion provided in each of the pair of arm portions, and at least one of the leg insertion holes provided in each of the leg insertion portions has a tubular shape. 2. A semiconductor device mounting fixture, wherein an enlarged diameter portion for inserting the bead core is formed. 18. The semiconductor device mounting tool according to claim 17, wherein the seat has a locking claw that is fitted into a hole provided in the substrate. . 19. The semiconductor device attachment according to claim 17, wherein the leg insertion hole provided in the wall surface portion is two. 20. The semiconductor device mounting tool according to claim 17, wherein the plate-shaped heat radiation fin is T-shaped. 21. The semiconductor device mounting tool according to claim 17, wherein the plate-shaped heat radiation fins are bent at portions projecting from the heat radiation fin mounting portions provided on the pair of arm portions, respectively. And a semiconductor device mounting tool. 22. The semiconductor device mounting tool according to claim 1, wherein the semiconductor device mounting tool is inserted into at least one leg insertion hole provided in the semiconductor device mounting portion of the semiconductor device mounting tool. A cylindrical bead core, a semiconductor device in which a leg portion is inserted into the leg insertion hole of the semiconductor device mounting tool and a main body portion is placed on the semiconductor device mounting portion, and a leg insertion for inserting the leg portion of the semiconductor device A substrate provided with a hole, the semiconductor device attachment is mounted on the substrate, and the semiconductor device has a leg portion having the leg insertion hole of the semiconductor device attachment and the leg insertion hole of the substrate. A semiconductor device mounting structure, characterized in that the semiconductor device mounting structure penetrates through the substrate via and is fixed to the substrate with solder. 23. The semiconductor device attachment according to claim 4, a cylindrical bead core inserted into at least one of the leg insertion holes provided in the semiconductor device attachment portion of the semiconductor device attachment, and the semiconductor device. A semiconductor device in which a leg portion is inserted into the leg insertion hole of the attachment and a main body portion is placed on the semiconductor device attachment portion, and a leg insertion hole into which the leg portion of the semiconductor device is inserted are provided, and the semiconductor device attachment is also provided. And a substrate provided with a locking hole for inserting the locking claw of the semiconductor device mounting tool, the semiconductor device mounting tool being mounted on the substrate and locking the locking claw in the locking hole. And the semiconductor device is fixed to the substrate by soldering while the legs penetrate the substrate through the leg insertion holes of the semiconductor device attachment and the leg insertion holes of the substrate. Characterized by The semiconductor device mounting structure. 24. The semiconductor device mounting tool according to claim 5, 6, or 8, and at least one leg insertion hole provided in the semiconductor device mounting portion of the semiconductor device mounting tool. A cylindrical bead core inserted into the semiconductor device mounting device, a semiconductor device in which a leg portion is inserted into the leg insertion hole of the semiconductor device mounting tool, and a main body portion is mounted on the semiconductor device mounting portion; A substrate provided with a leg insertion hole for insertion, the semiconductor device attachment is mounted on the substrate, the semiconductor device, the leg portion of the leg insertion hole of the semiconductor device attachment and the substrate The board is pierced through the leg insertion hole and fixed to the board with solder, and the side wall surface portion is pressed toward the wall surface side by the curved spring member provided on the plate-shaped heat radiation fin. With the spring member The semiconductor device mounting structure, characterized by comprising sandwiched between the wall portion. 25. The semiconductor device attachment according to claim 7, a cylindrical bead core inserted into at least one of the leg insertion holes provided in the semiconductor device attachment portion of the semiconductor device attachment, and the semiconductor device. A semiconductor device in which a leg portion is inserted into the leg insertion hole of the attachment and a main body portion is placed on the semiconductor device attachment portion, and a leg insertion hole into which the leg portion of the semiconductor device is inserted are provided, and the semiconductor device attachment is also provided. And a substrate provided with a locking hole for inserting the locking claw of the semiconductor device mounting tool, the semiconductor device mounting tool being mounted on the substrate and locking the locking claw in the locking hole. And the semiconductor device is fixed to the substrate by soldering while the legs penetrate the substrate through the leg insertion holes of the semiconductor device attachment and the leg insertion holes of the substrate. And the side wall surface The semiconductor device mounting structure in which the is pressed to the wall surface portion side by the curved spring member provided on the serial radiating fins, characterized in that formed by sandwiched between the spring member and the wall surface. 26. The semiconductor device attachment according to claim 9 or 10, and a cylindrical bead core inserted into at least one of the leg insertion holes provided in the semiconductor device attachment portion of the semiconductor device attachment. A semiconductor device in which a leg portion is inserted into the leg insertion hole of the semiconductor device attachment and a main body portion is placed on the semiconductor device attachment portion, and a substrate provided with leg insertion holes into which the leg portion of the semiconductor device is inserted And the semiconductor device mounting fixture is mounted on the substrate, the semiconductor device, the leg portion is the substrate through the leg insertion hole of the semiconductor device mounting fixture and the leg insertion hole of the substrate. And is fixed to the substrate with solder, and the side wall surface portion is pressed toward the wall surface side by the heat radiation fin and the curved spring member and is sandwiched between the spring member and the wall surface portion. The semiconductor device mounting structure according to claim. 27. The semiconductor device attachment according to claim 11, a cylindrical bead core inserted into at least one of the leg insertion holes provided in the semiconductor device attachment portion of the semiconductor device attachment, and the semiconductor device. A semiconductor device in which a leg portion is inserted into the leg insertion hole of the attachment and a main body portion is placed on the semiconductor device attachment portion, and a leg insertion hole into which the leg portion of the semiconductor device is inserted are provided, and the semiconductor device attachment is also provided. And a substrate provided with a locking hole for inserting the locking claw of the semiconductor device mounting tool, the semiconductor device mounting tool being mounted on the substrate and locking the locking claw in the locking hole. And the semiconductor device is fixed to the substrate by soldering while the legs penetrate the substrate through the leg insertion holes of the semiconductor device attachment and the leg insertion holes of the substrate. And side wall surface The semiconductor device mounting structure, characterized in that the said is pressed to the wall surface portion side by the radiation fins and said curved spring member formed by sandwiched between the spring member and the wall surface. 28. Claim 12, Claim 14, and Claim 15.
17. The semiconductor device attachment according to claim 16, a cylindrical bead core inserted into at least one of the leg insertion holes provided in the semiconductor device attachment portion of the semiconductor device attachment, and the semiconductor. A semiconductor device in which a leg portion is inserted into the leg insertion hole of the device attachment and a main body portion is placed on the semiconductor device attachment portion; and a substrate having a leg insertion hole into which the leg portion of the semiconductor device is inserted The semiconductor device attachment is mounted on the substrate, and the semiconductor device has a leg portion that penetrates the substrate through the leg insertion hole of the semiconductor device attachment and the leg insertion hole of the substrate. And the side wall surface portion is pressed to the heat radiation fin side by the pair of cylindrical spring members and sandwiched between the spring member and the heat radiation fin together. Guide Device mounting structure. 29. The semiconductor device mounting tool according to claim 13, a cylindrical bead core inserted into at least one of the leg insertion holes provided in the semiconductor device mounting portion of the semiconductor device mounting tool, and the semiconductor device. A semiconductor device in which a leg portion is inserted into the leg insertion hole of the attachment and a main body portion is placed on the semiconductor device attachment portion, and a leg insertion hole into which the leg portion of the semiconductor device is inserted are provided, and the semiconductor device attachment is also provided. And a substrate provided with a locking hole for inserting the locking claw of the semiconductor device mounting tool, the semiconductor device mounting tool being mounted on the substrate and locking the locking claw in the locking hole. And the semiconductor device is fixed to the substrate by soldering while the legs penetrate the substrate through the leg insertion holes of the semiconductor device attachment and the leg insertion holes of the substrate. And side wall surface The semiconductor device mounting structure, characterized in that said pressed to the radiating fin side by the pair of curved spring member formed by sandwiched between the spring member and the heat radiation fins. 30. Claims 19, 19 and 20.
22. The semiconductor device attachment according to claim 21, and at least one leg insertion hole for each leg insertion portion provided in each of the pair of semiconductor device attachment portions of the semiconductor device attachment. A cylindrical bead core, two semiconductor devices each having a leg portion inserted into the leg insertion hole of the semiconductor device mounting tool and a main body portion placed on the semiconductor device mounting portion, and leg portions of the two semiconductor devices. And a substrate provided with a leg insertion hole for inserting the semiconductor device mounting tool, the semiconductor device mounting tool is mounted on the substrate, and the two semiconductor devices have a leg portion that is the leg insertion hole of the semiconductor device mounting tool. It penetrates the substrate through the leg insertion holes of the substrate and is fixed to the substrate by soldering, and the side wall surface portion is pressed toward the heat radiation fin side by the pair of cylindrical spring members and the spring member. The The semiconductor device mounting structure, characterized by comprising sandwiched between heat fins. 31. The semiconductor device attachment according to claim 18, and at least one leg insertion hole for each leg insertion portion provided in each of the pair of semiconductor device attachment portions of the semiconductor device attachment. A cylindrical bead core, two semiconductor devices in which a leg portion is inserted into the leg insertion hole of the semiconductor device mounting tool and a main body portion is placed on the semiconductor device mounting portion, and a leg portion of the semiconductor device is inserted. A substrate having a leg insertion hole and a locking hole for inserting the locking claw of the semiconductor device mounting tool, wherein the semiconductor device mounting tool is placed on the substrate and the locking The claw is locked in the locking hole and fixed to the substrate, and the two semiconductor devices have a leg portion through the leg insertion hole of the semiconductor device attachment and the leg insertion hole of the substrate. When it penetrates the substrate The semiconductor device is fixed to the substrate with solder, and the side wall surface portion is pressed toward the heat radiation fin side by the pair of curved spring members and sandwiched between the spring member and the heat radiation fin. Mounting structure.