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JPH06116419A - Resin-impregnated base and electrical laminate - Google Patents

Resin-impregnated base and electrical laminate

Info

Publication number
JPH06116419A
JPH06116419A JP26498792A JP26498792A JPH06116419A JP H06116419 A JPH06116419 A JP H06116419A JP 26498792 A JP26498792 A JP 26498792A JP 26498792 A JP26498792 A JP 26498792A JP H06116419 A JPH06116419 A JP H06116419A
Authority
JP
Japan
Prior art keywords
resin
epoxy resin
impregnated
curing accelerator
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26498792A
Other languages
Japanese (ja)
Inventor
Kazuhiko Nemoto
一彦 根本
Sunao Ikoma
直 生駒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP26498792A priority Critical patent/JPH06116419A/en
Publication of JPH06116419A publication Critical patent/JPH06116419A/en
Pending legal-status Critical Current

Links

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE:To provide an electrical laminate good in electrical performance and heat resistance without postcuring and to provide a resin-impregnated base therefor. CONSTITUTION:The resin-impregnated one obtained by impregnating a base with an epoxy resin varnish comprising an epoxy resin, a hardener, and a curing accelerator with a basicity of 11 or higher and optionally containing other curing accelerator, a solvent, etc., and drying the resulting base. The electrical laminate is one obtained by superposing a necessary number of sheets of the resin-impregnated base, disposing a metal foil on at least one side of the pile, and uniting the laminae.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は電子機器、電気機器、計
算器、通信機器等に用いられる樹脂含浸基材、電気用積
層板に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-impregnated base material used for electronic equipment, electric equipment, calculators, communication equipment and the like, and an electric laminate.

【0002】[0002]

【従来の技術】近年、電気、電子機器の高信頼化対策と
してエポキシ樹脂積層板を用いることが多くなっている
が、エポキシ樹脂積層板は優れた熱変形温度、耐湿信頼
性、電気絶縁性を得るためにはアフターキュアーが必要
である。
2. Description of the Related Art In recent years, epoxy resin laminates have been increasingly used as a measure for increasing the reliability of electrical and electronic equipment. Epoxy resin laminates have excellent heat distortion temperature, moisture resistance reliability and electrical insulation. After cure is needed to get it.

【0003】[0003]

【発明が解決しようとする課題】従来の技術で述べたよ
うに、現在広く使用されているエポキシ樹脂積層板の性
能を発揮させるにはアフターキュアーが必要である。本
発明は従来の技術における上述の問題点に鑑みてなされ
たもので、その目的とするところはアフターキュアーな
しで優れた性能が得られるエポキシ樹脂含浸基材、エポ
キシ樹脂電気用積層板を提供することにある。
As described in the prior art, after-curing is necessary to bring out the performance of the epoxy resin laminates which are widely used at present. The present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide an epoxy resin-impregnated base material and an epoxy resin electrical laminate that can provide excellent performance without after-cure. Especially.

【0004】[0004]

【課題を解決するための手段】本発明はエポキシ樹脂
に、硬化剤と塩基度11以上の硬化促進剤を加え、更に
必要に応じて硬化促進剤、溶剤等を添加したエポキシ樹
脂ワニスに基材を含浸、乾燥した樹脂含浸基材、及び該
樹脂含浸基材の所要枚数の上面及び又は下面に金属箔を
配設ー体化してなることを特徴とする電気用積層板のた
め、上記目的を達成することができたもので、以下本発
明を詳細に説明する。
The present invention provides a base material for an epoxy resin varnish obtained by adding a curing agent and a curing accelerator having a basicity of 11 or more to an epoxy resin, and further optionally adding a curing accelerator, a solvent and the like. A resin-impregnated base material which has been impregnated with and dried on, and a laminate for electrical use, characterized in that a required number of the resin-impregnated base material is provided with a metal foil on the upper surface and / or the lower surface thereof. The present invention has been accomplished, and the present invention will be described in detail below.

【0005】本発明に用いるエポキシ樹脂は、ビスフェ
ノ−ルA型エポキシ樹脂、フェノ−ルノボラック型エポ
キシ樹脂、クレゾールノボラック型エポキシ樹脂、グリ
シジルエステル型エポキシ樹脂、グリシジルアミン型エ
ポキシ樹脂、線状脂肪族エポキシ樹脂、脂環式エポキシ
樹脂、複素環型エポキシ樹脂、ハロゲン化エポキシ樹脂
等のようにエポキシ樹脂全般を用いることができる。硬
化剤としてはフェノ−ル樹脂、イソシアネート、アミン
系硬化剤、酸無水物硬化剤、ルイス酸錯化合物、ジシア
ンジアミド等が用いられる。硬化促進剤としては1・5
ジアザビシクロ(4・3・0)ノネン等のジアザビシク
ロ環含有化合物のような塩基度11以上の硬化促進剤を
用いることが必要であるが、燐系化合物、3級アミン系
化合物等の硬化促進剤全般を併用することもできる。必
要に応じて用いられる溶剤としてはケトン系、アルコー
ル系等のように樹脂と相溶するものであればよく特に限
定しない。更に必要に応じてタルク、クレー、シリカ、
炭酸カルシュウム、水酸化アルミニゥム、三酸化アンチ
モン、五酸化アンチモン等の無機質粉末充填剤、ガラス
繊維、アスベスト繊維、パルプ繊維、合成繊維、セラミ
ック繊維等の繊維質充填剤、着色剤等を添加することが
できる。基材としてはガラス、アスベスト等の無機質繊
維、ポリエステル、ポリアミド、ポリアクリル、ポリビ
ニルアルコール、ポリイミド、フッ素樹脂等の有機質繊
維、木綿等の天然繊維の織布、不織布、紙、マット等を
用いることができる。基材に対する含浸は同一の樹脂の
みによる含浸でもよいが、同系樹脂又は異系樹脂による
1次含浸、2次含浸というように含浸を複数にし、より
含浸が均一になるようにすることもできる。かくして基
材に樹脂を含浸、乾燥して樹脂含浸基材を得るものであ
る。金属箔としては銅、アルミニュウム、真鍮、ニッケ
ル、鉄等の単独、合金、複合箔を用いることができる。
このようにして上記樹脂含浸基材の所要枚数の上面及び
又は下面に金属箔を配設ー体化して電気用積層板を得る
ものである。以下本発明を実施例に基づいて説明する。
The epoxy resin used in the present invention is a bisphenol A type epoxy resin, a phenol novolac type epoxy resin, a cresol novolac type epoxy resin, a glycidyl ester type epoxy resin, a glycidyl amine type epoxy resin, a linear aliphatic epoxy resin. It is possible to use general epoxy resins such as alicyclic epoxy resin, heterocyclic epoxy resin, halogenated epoxy resin, and the like. As the curing agent, phenol resin, isocyanate, amine curing agent, acid anhydride curing agent, Lewis acid complex compound, dicyandiamide, etc. are used. 1.5 as a curing accelerator
Although it is necessary to use a curing accelerator having a basicity of 11 or more, such as a diazabicyclo ring-containing compound such as diazabicyclo (4,3,0) nonene, a curing accelerator for phosphorus compounds, tertiary amine compounds, etc. in general Can also be used together. The solvent used as needed is not particularly limited as long as it is compatible with the resin, such as a ketone solvent or an alcohol solvent. If necessary, talc, clay, silica,
It is possible to add inorganic powder fillers such as calcium carbonate, aluminum hydroxide, antimony trioxide and antimony pentoxide, fibrous fillers such as glass fibers, asbestos fibers, pulp fibers, synthetic fibers and ceramic fibers, and coloring agents. it can. As the base material, it is possible to use glass, inorganic fibers such as asbestos, organic fibers such as polyester, polyamide, polyacrylic, polyvinyl alcohol, polyimide and fluororesin, woven cloth of natural fibers such as cotton, non-woven fabric, paper and mat. it can. The base material may be impregnated only with the same resin, but a plurality of impregnations such as primary impregnation with the same resin or different type resin and secondary impregnation may be performed to make the impregnation more uniform. Thus, the resin is impregnated into the base material and dried to obtain a resin-impregnated base material. As the metal foil, a single, alloy, or composite foil of copper, aluminum, brass, nickel, iron or the like can be used.
In this manner, a metal foil is provided on the upper surface and / or the lower surface of the required number of the resin-impregnated base materials and integrated to obtain an electrical laminate. The present invention will be described below based on examples.

【0006】[0006]

【実施例】エポキシ樹脂(シエル化学株式会社製、エピ
コート1001)100重量部(以下単に部と記す)に
対し、ジシアンジアミド4部、1・5ジアザビシクロ
(4・3・0)ノネン0.5部、メチルオキシトール1
00 部を添加したエポキシ樹脂ワニスに、厚み0.01
8mmの平織ガラス布を樹脂付着量が45%になるよう
に含浸、乾燥して樹脂含浸基材を得た。次に該樹脂含浸
基材8枚を重ねた上下面に厚み0.035mmの銅箔を
各々配設した積層体を成形圧力40Kg/cm 2 、16
0℃で90分間加熱加圧成形して厚み1.6mmの両面
銅張り積層板を得た。
[Embodiment] Epoxy resin (Shell Chemical Co., Epi
Coat 1001) 100 parts by weight (hereinafter simply referred to as "part")
In contrast, dicyandiamide 4 parts, 1.5 diazabicyclo
0.5 parts of (4.3.0) nonene, 1 of methyl oxitol
Epoxy resin varnish added with 0 parts, thickness 0.01
8mm plain woven glass cloth so that the amount of resin adhered becomes 45%
Was impregnated and dried to obtain a resin-impregnated base material. Next, the resin impregnation
A copper foil with a thickness of 0.035 mm is placed on the upper and lower surfaces of the eight base materials.
Forming pressure of 40Kg / cm 2, 16
Both sides with a thickness of 1.6 mm after heat and pressure molding at 0 ° C for 90 minutes
A copper-clad laminate was obtained.

【0007】[0007]

【比施例】エポキシ樹脂(シエル化学株式会社製、エピ
コート1001)100部に対してジシアンジアミド4
部、ベンジルジメチルアミン0.2部、メチルオキシト
ール100部を添加したエポキシ樹脂ワニスを用いた以
外は実施例と同様に処理して樹脂含浸基材を得ると共に
厚み1.6mmの両面銅張り積層板を得、150℃で3
0分間アフターキュアーして電気用積層板を得た。
[Comparative Example] Dicyandiamide 4 to 100 parts of epoxy resin (Epicoat 1001 manufactured by Ciel Chemical Co., Ltd.)
Parts, benzyl dimethylamine 0.2 parts, and methyl oxytol 100 parts were used to obtain a resin-impregnated base material and double-sided copper-clad laminate having a thickness of 1.6 mm by the same procedure as in Example except that an epoxy resin varnish was used. Get a plate, 3 at 150 ℃
After-curing for 0 minutes, an electrical laminate was obtained.

【0008】実施例及び比較例の電気用積層板の性能は
表1のようである。熱時体積抵抗は150℃でのもので
ある。
Table 1 shows the performance of the electrical laminates of Examples and Comparative Examples. Volume resistance under heat is at 150 ° C.

【0009】[0009]

【表1】 [Table 1]

【0010】[0010]

【発明の効果】本発明は上述した如く構成されている。
特許請求の範囲に記載した構成を有する樹脂含浸基材を
用いた電気用積層板はアフターキュアーなしでも電気絶
縁抵抗、耐熱性がよく本発明の優れていることを確認し
た。
The present invention is constructed as described above.
It has been confirmed that the electrical laminate using the resin-impregnated base material having the structure described in the claims has good electrical insulation resistance and heat resistance even without after-curing and is excellent in the present invention.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】エポキシ樹脂に、硬化剤と塩基度11以上
の硬化促進剤を加え、更に必要に応じて硬化促進剤、溶
剤等を添加したエポキシ樹脂ワニスに基材を含浸、乾燥
したことを特徴とする樹脂含浸基材。
1. A base material is impregnated into an epoxy resin varnish obtained by adding a curing agent and a curing accelerator having a basicity of 11 or more to an epoxy resin, and further a curing accelerator, a solvent, etc., if necessary, and drying. Characteristic resin-impregnated base material.
【請求項2】エポキシ樹脂に、硬化剤と塩基度11以上
の硬化促進剤を加え、更に必要に応じて硬化促進剤、溶
剤等を添加したエポキシ樹脂ワニスに基材を含浸、乾燥
した樹脂含浸基材の所要枚数の上面及び又は下面に金属
箔を配設ー体化してなることを特徴とする電気用積層
板。
2. An epoxy resin varnish obtained by adding a curing agent and a curing accelerator having a basicity of 11 or more to an epoxy resin, and further adding a curing accelerator, a solvent, etc., if necessary, and impregnating a base material with the resin and impregnating the resin. A laminated board for electrical use, characterized in that a required number of base materials are provided with a metal foil on the upper surface and / or the lower surface to form a body.
JP26498792A 1992-10-02 1992-10-02 Resin-impregnated base and electrical laminate Pending JPH06116419A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26498792A JPH06116419A (en) 1992-10-02 1992-10-02 Resin-impregnated base and electrical laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26498792A JPH06116419A (en) 1992-10-02 1992-10-02 Resin-impregnated base and electrical laminate

Publications (1)

Publication Number Publication Date
JPH06116419A true JPH06116419A (en) 1994-04-26

Family

ID=17410995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26498792A Pending JPH06116419A (en) 1992-10-02 1992-10-02 Resin-impregnated base and electrical laminate

Country Status (1)

Country Link
JP (1) JPH06116419A (en)

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