JPH05319846A - Method for breaking off glass substrate and device therefor - Google Patents

Abstract

PURPOSE:To break off a glass substrate into minute strips with no need for skill or into narrow strips in the subscanning direction in the production of an image sensor, etc. CONSTITUTION:This breaking jig consists of a fixed part having a recess 22 into which a glass substrate 20 is inserted and a V-shaped clearance groove 24, a movable part 16 provided with a presser blade 14 and an elastic part for connecting both opposed parts. The substrate 20 is uniformly supported by the jig on both sides of a scribed line 26, and the blade 14 is vertically pressed on the principal plate of the substrate 20 along the scribed line 26 at an angle of beta of the tip of the blade 14 to the principal plane.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for breaking a glass substrate and an apparatus therefor, and more specifically, a method for breaking a glass substrate in a strip shape when manufacturing a semiconductor device such as an image sensor, and an implementation of the method. It relates to devices such as jigs, machines, and instruments that are used directly in.

[0002]

2. Description of the Related Art Among semiconductor devices, an image sensor used in, for example, a facsimile, an image scanner, a digital copying machine, an electronic blackboard, etc., has a plurality of semiconductor elements consisting of a lower electrode, a semiconductor layer and an upper electrode on a glass substrate. The semiconductor device includes an interlayer insulating film which is arranged in a shape and covers and insulates the plurality of semiconductor elements, and a wiring which is arranged via the interlayer insulating film. The size of the semiconductor elements and wiring that make up this image sensor is μm.
The photolithography method is usually used for fine processing. For this reason, in order to manufacture an image sensor, it is necessary to repeat the steps such as film formation, photoresist coating, photomask positioning, exposure, and etching. It is preferable to manufacture the sensor. Therefore, after forming a plurality of image sensors simultaneously using a large-area glass substrate, the large-area glass substrate is divided to manufacture individual image sensors.

As one of the methods for dividing the glass substrate,
There is a method of cutting a glass substrate having a large area with a dicer used for cutting a silicon wafer or the like. This cutting method is, for example, as shown in FIG. 10, in which the resin film 3 is attached to the back surface side of the glass substrate 2 on which the semiconductor element 1 and the like are formed by the adhesive layer 4, and the rotary blade 5 of the dicer is used.
Thus, the glass substrate 2 is sequentially cut while leaving the resin film 3. The image sensor 6 is manufactured by the resin film 3 so that the glass substrate 2 of the image sensor 6 cut by the dicer does not get caught in the rotary blade 5 of the dicer and is damaged.

By the way, a cutting margin is required for cutting the glass substrate 2 by the dicer, and the cutting margin is usually set to 0.
2mm or more is required. This cutting margin corresponds to 10% or more when the width of the image sensor 6 in the sub-scanning direction is 2 mm, for example, and limits the number of image sensors 6 that can be manufactured from the glass substrate 2 having a certain size. Further, there is a problem that chipping is caused by the rotary blades 5 on both sides of the cutting line by the dicer, the end portions of the corners are not sharply formed, and the electrode portion of the sensor is damaged, so that wire bonding cannot be performed. Therefore, a margin is required for the width of the glass substrate 2 in the sub-scanning direction in consideration of this chipping with respect to the effective area where the semiconductor element 1 and the like are formed, and the glass substrate 2 is manufactured from a certain size. The number of possible image sensors 6 is reduced.

Further, the cutting of the glass substrate 2 by the dicer takes a long time, and the productivity cannot be improved. Further, although the cut length of the glass substrate 2 varies depending on the reading size of the image sensor 6, it is usually 2
The length is about 00 to 340 mm, and a long dicer is required to cut such a long distance. However, it is difficult to obtain this long dicer because of its special use, and it is expensive. In addition, the blade 5 of the dicer needs to be replaced and the resin film or pure water needs to be used, which causes a problem of high running cost.

Further, when the glass substrate 2 is cut by a dicer, a resin film 3 is attached to the back surface of the glass substrate 2 so that the cut glass substrate 2 is not caught by a rotary blade. It is necessary to peel off the resin film 3. Therefore, various treatments such as immersion in a solvent are required, and this treatment damages the semiconductor element 1 and the like formed on the glass substrate 2.

Therefore, folding is used as a method of dividing the glass substrate 2. The glass substrate 2 is broken as shown in FIG.
As shown in FIG. 1, first, after inserting the scribe line 7 into the glass substrate 2 with a scriber such as a hard foil cutter (not shown), an operator inserts an ear portion 8 which is an unnecessary portion provided in the outer peripheral portion of the glass substrate 2. It is bent along the scribe line 7 so that it is bent while being supported by a fingertip. That is, in such a breaking method, a crack is formed along the scribe line 7 from the ear portion 8 of the glass substrate 2 which is supported and bent by the fingertip, and the crack gradually progresses in the tip direction thereof and the glass substrate 2 is bent. Are separated and separated into individual image sensors 6. For example, in the case of an image sensor having a width of 3 mm, the image sensor 6 is divided into two image sensors 6 having a width of 6 mm and then divided into individual image sensors 6.

[0008]

However, according to this breaking method, bending or twisting stress acts on the image sensor 6 separated from the glass substrate 2, and the thin film adhered and formed on the glass substrate 2. The semiconductor element 1 may be cracked or the semiconductor element 1 may be peeled off from the glass substrate 2 to reduce the yield and further reduce the reliability.

Further, even if the width of the image sensor 6 in the sub-scanning direction is narrowed to improve the productivity, the scribe line 7 is folded by applying uniform force to both sides as the width in the sub-scanning direction becomes narrower. However, the glass substrate 2 having a thickness of 0.7 mm has a limit of about 3 mm width. However, even if the width is 3 mm, when an immature worker performs it, the progress of cracks may stop halfway and the middle part may become jagged, or it may break in the middle. Further, if the width is narrower than 3 mm, there is a problem that the yield is remarkably reduced.

Therefore, the inventors of the present invention can improve the productivity of a semiconductor device such as an image sensor, further reduce the width in the sub-scanning direction, and at the same time, increase the length in the main-scanning direction to fold it. In addition, as a result of intensive studies, the present invention has been achieved in order to satisfy the contradictory conditions of obtaining a semiconductor device having no defects.

[0011]

The gist of the method of breaking a glass substrate according to the present invention is a method of breaking the glass substrate along a scribe line pre-attached to the glass substrate. The glass substrate is evenly supported on both sides of the scribe line, and is applied perpendicularly to the main surface of the supported glass substrate and along the scribe line from the side opposite to the face on which the scribe line is attached. It is to press the pressure blade.

In the breaking method, the pressure blade is pressed against the glass substrate so that the blade edge of the pressure blade and the main surface of the glass substrate form a constant angle. The point is to make contact with the edge of.

On the other hand, the gist of the glass substrate breaking device according to the present invention is a device for breaking the glass substrate along a scribe line previously attached to the glass substrate. Supporting means for uniformly supporting the scribe line on both sides of the scribe line, and perpendicularly to the main surface of the supported glass substrate, and along the scribe line from the side opposite to the surface to which the scribe line is attached. It is provided with a pressure blade to be pressed against.

In the folding device, the pressure blade is pressed against the glass so that the blade edge of the pressure blade and the main surface of the glass substrate form a constant angle. It is configured so that it can be brought into point contact with the edge of the substrate.

Further, the folding device is provided with a pushing means for pushing the pressure blade.

[0016]

According to the method of breaking a glass substrate according to the present invention, the glass substrate provided with the scribe line is evenly supported on both sides of the scribe line. Then, a pressure blade is pressed against the main surface of the supported glass substrate perpendicularly and along the scribe line from the side opposite to the surface on which the scribe line is attached. More preferably, the pressure blade is brought into point contact with the edge of the glass substrate by pressing the pressure blade so that the blade edge of the pressure blade and the main surface of the glass substrate form a constant angle. As a result, a concentrated stress is generated at the end of the scribe line attached to the glass substrate, a crack progresses from the end, and the glass substrate is broken along the scribe line. At this time, the glass substrate is evenly supported on both sides of the scribe line, so that the crack does not deviate from the scribe line and is not broken in the middle, or bending or twisting stress is generated.

On the other hand, the glass substrate breaking apparatus according to the present invention is an apparatus directly used for carrying out the invention of the aforementioned breaking method. This device is equipped with supporting means,
The glass substrate provided with the scribe line is evenly supported on both sides of the scribe line by the supporting means.
Further, when the pressing means is provided, the pressing blade is pushed by the pressing means, and the pressing blade is surely pressed perpendicularly to the main surface of the supported glass substrate and along the scribe line. Will be done. Note that the “device” here is a broad concept including jigs, tools, instruments, tools, machines, and the like.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of a glass substrate folding method and apparatus according to the present invention will be described in detail with reference to the drawings.

In FIG. 2, reference numeral 10 is an embodiment of the glass substrate breaking apparatus according to the present invention, which is a jig used directly for carrying out the glass substrate breaking method according to the present invention. The breaking jig 10 includes a fixed portion 12 for fixing a glass substrate and a movable portion 16 having a pressure blade 14 at its tip.
And an elastic portion 18 for connecting the fixed portion 12 and the movable portion 16 in a state of being opposed to each other, and are integrally manufactured using bamboo or the like. As shown in FIG. 1, a recess 22 for inserting the glass substrate 20 to be broken is formed at the tip of the fixing portion 12, and the pressing blade 14 is attached to the fixing portion 12 when the breaking is performed. A V-shaped escape groove 24 is formed in the center of the recess 22 so as not to contact. In this example, the glass substrate 20 is scribed with the scribe line 2 by forming the recess 22 and the escape groove 24.
Supporting means for supporting uniformly on both sides of 6 is configured.

As a material for the breaking jig 10,
Other than bamboo or wood, resin such as plastic, non-ferrous metal material such as aluminum, brass, steel or steel material, or alloy or casting of these materials may be used. Furthermore, the surface of these may be coated with a hard inorganic material such as Si ₃ N ₄ .

By the way, generally, in an image sensor, a plurality of photodiodes are formed one-dimensionally on a glass substrate, and blocking diodes are connected in series to each of these photodiodes with opposite polarities, and these photodiodes are fixed. Wirings for driving in units of blocks for each number and matrix wirings for reading out signals output from the driven photodiodes are formed. Since this image sensor is manufactured through many complicated steps, it is possible to reduce the manufacturing cost by manufacturing a large number of image sensors at once. Therefore, as shown in FIG. 3, a large-area glass substrate 28 is used, and a plurality of image sensors 30 are formed in parallel on the glass substrate 28.

As the large area glass substrate 28, one having a thickness of about 0.3 to 1.1 mm is used.
8 is longer than the length of the image sensor 30 in the main scanning direction (for example, 200 to 340 mm), and the width of the image sensor 30 in the sub scanning direction (for example, 1.0 to
It is set larger than a value obtained by multiplying the number of manufactured sensors 30 by 4.0 mm. That is, the size of the glass substrate 28 is such that the manufactured image sensor 30 is for A4 size, B4 size.
It differs depending on whether it is for a standard size or A3 size, and is selected according to the size to be manufactured.

After using the large-area glass substrate 28 to form the above-described photodiode or the like on it, the scribe line 26 is previously attached to a predetermined position of the glass substrate 28 by a foil cutter, a diamond cutter or the like. Next, the glass substrate 28 is bent while supporting the center portion in the width direction with a fingertip, and first, the glass substrate 28 is halved along the center scribe line 26. Next, each of the glass substrates 28 folded in half is further folded in half along the scribe line 26 in the center thereof. This is repeated thereafter, and the glass substrate 28 is broken with a fingertip until the width is equal to the width of two image sensors. That is, if a 3 mm wide image sensor is to be manufactured,
You can fold it up to a width of 6 mm with your fingertips.

Then, the recess 2 of the above-mentioned splitting jig 10
The glass substrates 20 for two image sensors are inserted into the substrate 2 with the scribe line 26 facing downward (on the side of the fixed portion 12). The width of the recess 22 is the width of the glass substrate 20 to be inserted.
The width of the glass substrate 20 is equal to the width of the recess 2
The second side surface portion 22a and the abutting portion 22b are completely positioned and fixed. In addition, the glass substrate 20
Will be evenly supported on both sides of the scribe line 26 by the bottom 22c of the recess 22.

Next, while lightly supporting the end portion of the glass substrate 20 which is not inserted into the recess 22 with a hand, the fixed portion 12 and the movable portion 16 of the splitting jig 10 are lightly grasped.
As shown in, the pressure blade 14 provided in the movable portion 16 is perpendicular to the main surface of the glass substrate 20, and
The blade edge and the main surface of the glass substrate 20 are pressed against each other along the scribe line 26 so as to form a constant angle β. As a result, the pressing blade 14 is brought into contact with the edge of the glass substrate 20 at a point, the glass substrate 20 bends, and stress concentrated at the end of the scribe line 26 attached to the glass substrate 20 is generated. Then, the crack progresses from the end portion, and the glass substrate 20 is broken along the scribe line 26. At this time, since the glass substrate 20 is evenly supported on both sides of the scribe line 26, cracks deviate from the scribe line 26, the glass substrate 20 is broken in the middle, and bending or twisting stress occurs, so that the glass substrate 20 is broken. A semiconductor element such as a photodiode formed above or a matrix wiring or the like is not cracked or peeled off from the glass substrate 20. Then, finally, the image sensor 30 is completed by breaking the ears 32 at both ends of the glass substrate 28 by breaking them with fingertips.

Here, the angle α of the tip of the pressure blade 14 is made smaller as the total length of the glass substrate 20 to be broken is longer. Further, the blade edge of the pressure blade 14 and the glass substrate 20.
It is arranged to form a constant angle β with the main surface of. Further, the depth L of the recess 22 is a length into which the glass substrate 20 to be broken is pushed. The angles α, β and the length L are the glass substrate 20 to be broken.
It is appropriately selected according to the size of, for example, 300
In the case of manufacturing an image sensor of mm × 2 mm × 0.7 mmt, it is optimal that the angle α is about 30 °, the angle β is 10 ° or more, and the length L is within 2 mm. Also,
When manufacturing an image sensor of 300 mm × 2.5 mm × 0.7 mmt, the angle α should be within 45 ° and the angle β should be within 45 °.
Was optimally 10 ° or more and the length L was 3 mm or less.

Although the glass substrate breaking jig 10 has a simple structure, the glass substrate 20 breaking process, which has been the most difficult in the conventional image sensor manufacturing process, is surprisingly simple and the yield is high. It has improved dramatically. Moreover, even an unskilled person can easily break the sheet, so that stable production can always be ensured. Further, bending or twisting stress acts on the image sensor 30 separated from the glass substrate 20, and the photodiode formed on the glass substrate 20 is cracked or the photodiode is separated from the glass substrate 20. It's gone. Therefore, not only the yield is improved, but also the reliability is improved.

Although one embodiment of the method for splitting a glass substrate and the apparatus therefor according to the present invention has been described in detail above, the present invention is not limited to the above-mentioned embodiment and can be implemented in other modes. Is.

For example, as shown in FIG. 5, a compression coil spring 38 is provided around a slide shaft 36 to which a pressure blade 34 is attached, and a push button 40 attached to the tip of the slide shaft 36 is lightly pressed. It is also possible to use a splitting jig 42 in which the pressing blade 34 is moved in parallel by pushing. In this example as well, a recess 22 for inserting the glass substrate 20 to be broken is formed, and a V-shaped escape groove 24 is formed so that the pressure blade 34 does not come into contact when the glass substrate 20 is broken. ing.

Further, as shown in FIG. 6, the sliding body 46 to which the pressure blade 44 is attached is suspended from the frame 50 by the tension coil spring 48, and the handle 52 pivotally supported by the frame 50 is pushed down. Accordingly, the stationary splitting device 54 may be configured so that the pressure blade 44 is translated downward. In this example, the pressure blade 44
Supporting means 56 for supporting the glass substrate is formed below the table, and further the handle 52 and the tension coil spring 4 are provided.
8, the sliding body 46 and the like constitute a pushing means for pushing the pressing blade 44. When the pushing means is provided in this way, perpendicularly to the main surface of the supported glass substrate,
Moreover, the glass substrate can be surely pressed along the scribe line, so that the glass substrate can be broken more reliably.

Further, as shown in FIG. 7, a plurality of pressure blades 58 may be provided side by side, and the pressure blades 58 may be pressed against each other along a plurality of scribe lines 60 at a time. The width of the recess 62 in this case is an integral multiple of the width of the image sensor to be manufactured, and is equal to the width of the glass substrate 64 to be inserted. In this example, the concave portion 62 is formed, and a plurality of V-shaped groove portions 66 are formed in the concave portion 62 at positions where the pressure blades 58 face each other.
Supporting means for supporting evenly on both sides of 0 is configured.

Further, instead of forming the recess for inserting the glass substrate as in the above-described embodiments, as shown in FIG. 8, the fixing pieces 68, 7 movable in the vertical or horizontal direction are provided.
Even if the width of the glass substrate 20 to be split and attached is slightly different, the fixing pieces 6
The glass substrate 20 may be supported evenly on both sides of the scribe line 26 by adjusting 8, 70. According to this example, the length L of pushing the glass substrate 20 can be freely adjusted, so that the glass substrate 2 to be broken and folded
The optimum length L can be selected according to the size of 0. In addition, although not shown, a cylindrical screw or the like is used.
The screw may be attached to the fixing portion to support the glass substrate evenly on both sides of the scribe line with these screws. That is, the supporting means may have any form as long as it can uniformly support the glass substrate on both sides of the scribe line.

Furthermore, it is possible to automatically make a glass substrate breaking process, which has conventionally been done manually by an expert. For example, as shown in FIG. 9, supporting bases 72 for supporting the glass substrate 20 to be broken at both ends thereof are provided, and pressure is applied perpendicularly to the main surface of the glass substrate 20 supported by these supporting bases 72. The blade 74 may be moved so that the pressure blade 74 can be brought into point contact with the edge of the glass substrate 20. Here, the broken glass substrate 76 is conveyed to the next step by the belt conveyor 78. Moreover, it is preferable to provide a separator 80 below the scribe line 26 so that the folded glass substrates do not interfere with each other when they fall.

In addition, the pressing means may be a means for rotating the pressing blade, not the means for moving the pressing blade in parallel. That is, the pushing means may be of any form as long as it pushes the pressure blade, and the present invention is not limited to various improvements, corrections, and modifications within the scope not departing from the gist of the present invention. It can be implemented in an added mode.

[0035]

Industrial Applicability The glass substrate breaking method and the glass breaking device according to the present invention uniformly support the glass substrate on both sides of the scribe line, and perpendicularly to the main surface of the supported glass substrate, and , The glass substrate is folded by pressing the pressure blade along the scribe line from the side opposite to the surface on which the scribe line is attached, so even an unskilled person can easily fold the glass substrate along the scribe line. You can break. For this reason, the defective rate at the time of breaking is greatly reduced, and the productivity is improved. Moreover, since abnormal stress does not occur when the glass substrate is broken, the semiconductor element deposited on the glass substrate is not cracked or the semiconductor element is not peeled off from the glass substrate. The property is also improved. Further, since the pressing means for pressing the pressure blade is provided, the glass substrate can be broken more reliably.

Further, since it is possible to manufacture a semiconductor device having a narrower width and a semiconductor device having a longer overall length, it is possible to increase the number of semiconductor devices obtained from one large glass substrate, which leads to cost reduction. Also becomes. For example, 0.
If the image sensor has a thickness of 7 mm, the glass substrate can be surely broken even if the width is narrower than 3 mm.

[Brief description of drawings]

FIG. 1 is a perspective view of a main part showing an embodiment of a glass substrate breaking jig according to the present invention.

FIG. 2 is a side view showing the entire folding jig shown in FIG.

FIG. 3 is a diagram for explaining a glass substrate that is folded and broken by the folding jig shown in FIGS. 1 and 2;
(a) is a plan view showing a glass substrate of a semiconductor device, (b) of the same figure
FIG. 3 is a plan view showing a large-area glass substrate for manufacturing a semiconductor device.

FIG. 4 is a front view showing a state in which a glass substrate is split and broken by the split jig shown in FIGS. 1 and 2.

FIG. 5 is a side view showing another embodiment of the glass substrate splitting jig according to the present invention.

FIG. 6 is a side view showing still another embodiment of the glass substrate breaker according to the present invention.

FIG. 7 is a perspective view of an essential part showing still another embodiment of the glass substrate breaker according to the present invention.

FIG. 8 is a perspective view of an essential part showing still another embodiment of the glass substrate breaker according to the present invention.

FIG. 9 is a perspective view showing still another embodiment of the glass substrate breaker according to the present invention.

FIG. 10 is an enlarged fragmentary front elevational view for explaining a problem in a conventional method for cutting a glass substrate of a semiconductor device.

11A and 11B are views for explaining a conventional method for manufacturing a semiconductor device, in which FIG. 11A is a front view of a main part and FIG. 11B is a plan view of the main part.

[Explanation of symbols]

10, 42; Glass substrate splitting jig (glass substrate splitting device) 14, 34, 44, 58, 74; Pressure blade 20, 64; Glass substrate 22, 62; Recess 24, 66; Relief groove 26, 60; scribe line 56; support means 54; glass substrate breaker 72; support base (support means)

Claims (5)

[Claims] 1. A method of folding the glass substrate along a scribe line pre-attached to the glass substrate, the glass substrate being evenly supported on both sides of the scribe line, and the glass substrate being supported by the scribe line. A method of splitting a glass substrate, which comprises press-contacting a pressure blade along the scribe line perpendicularly to the main surface and from the side opposite to the surface on which the scribe line is attached. 2. The pressure blade is brought into point contact with the edge of the glass substrate by pressing the pressure blade so that the edge of the pressure blade and the main surface of the glass substrate form a constant angle. The method for breaking a glass substrate according to claim 1, wherein the glass substrate is broken. 3. A device for breaking a glass substrate along a scribe line preliminarily attached to the glass substrate, comprising: a supporting means for uniformly supporting the glass substrate on both sides of the scribe line; And a pressing blade that is pressed against the main surface of the scribed line perpendicularly to the main surface of the scribed line and from the side opposite to the face on which the scribed line is attached. Splitting device. 4. The pressure blade is pressed into contact with the edge of the glass substrate by pressing the pressure blade so that the blade edge of the pressure blade and the main surface of the glass substrate form a constant angle. The glass substrate splitting device according to claim 3, wherein the glass substrate splitting device is configured to be brought into contact with each other. 5. The glass substrate breaking device according to claim 3, further comprising a pushing means for pushing the pressure blade.