JPH05251866A - Manufacture of laminate for multi-layered printed-circuit board - Google Patents
Manufacture of laminate for multi-layered printed-circuit boardInfo
- Publication number
- JPH05251866A JPH05251866A JP5018692A JP5018692A JPH05251866A JP H05251866 A JPH05251866 A JP H05251866A JP 5018692 A JP5018692 A JP 5018692A JP 5018692 A JP5018692 A JP 5018692A JP H05251866 A JPH05251866 A JP H05251866A
- Authority
- JP
- Japan
- Prior art keywords
- inner layer
- circuit board
- layer material
- laminate
- paper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000463 material Substances 0.000 claims abstract description 25
- 239000005011 phenolic resin Substances 0.000 claims abstract description 12
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 7
- 229920001568 phenolic resin Polymers 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000007791 dehumidification Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 22
- 239000011889 copper foil Substances 0.000 abstract description 10
- 239000002184 metal Substances 0.000 abstract description 7
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 238000013508 migration Methods 0.000 abstract description 7
- 230000005012 migration Effects 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 37
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 239000000123 paper Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 238000004080 punching Methods 0.000 description 8
- 238000001035 drying Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000005553 drilling Methods 0.000 description 6
- 239000004744 fabric Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000004640 Melamine resin Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- -1 chlorine ions Chemical class 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- JYIZNFVTKLARKT-UHFFFAOYSA-N phenol;1,3,5-triazine-2,4,6-triamine Chemical compound OC1=CC=CC=C1.NC1=NC(N)=NC(N)=N1 JYIZNFVTKLARKT-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、打抜き加工性及び耐金
属マイグレーション性に優れた多層プリント配線板用積
層板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a laminate for a multilayer printed wiring board which is excellent in punching workability and metal migration resistance.
【０００２】[0002]
【従来の技術】多層プリント配線板用積層板の内層材
は、ガラス基材の積層板である。すなわち、まず基材と
してガラスクロス又はガラスペーパー（不織布）、樹脂
としてエポキシ樹脂を用いて銅張積層板を作り、その銅
面をエッチング加工し回路を形成して得た回路板をいく
つか組み合わせて内層回路板とし、これと外層用プリプ
レグ及び銅箔とを一体成形する。このようにして得られ
た銅張積層板を穴あけ加工し、めっき及びエッチング加
工を経て４層、６層などの多層プリント配線板とする。2. Description of the Related Art The inner layer material of a laminated board for a multilayer printed wiring board is a glass-based laminated board. That is, first, a glass cloth or glass paper (nonwoven fabric) is used as a base material, an epoxy resin is used as a resin to form a copper clad laminate, and the copper surface is subjected to etching processing to form a circuit. The inner layer circuit board is formed, and this, the outer layer prepreg, and the copper foil are integrally molded. The copper clad laminate thus obtained is perforated, plated and etched to obtain a multilayer printed wiring board having four layers, six layers or the like.
【０００３】[0003]
【発明が解決しようとする課題】内層回路板の基材にガ
ラス繊維を用いると、部品穴を形成するドリル加工でス
ミアが発生し、かつドリル刃の摩耗が著しい。打ち抜き
加工は、部品穴の形成が困難であるために実施されてい
ない。When glass fiber is used as the base material of the inner layer circuit board, smear occurs in the drilling process for forming the component holes and the wear of the drill blade is remarkable. The punching process has not been performed because it is difficult to form the component holes.
【０００４】また、ガラス繊維を使用すると、ＣＡＦ
（コンダクティブ・アノーディック・フィラメント）す
なわち金属マイグレーションもガラス繊維に沿って発生
しやすい。加うるに、ガラス繊維の使用比率が高くなる
と、多層板の重量が重くなり、ＶＴＲ用カメラ等電子機
器の軽量化が難しくなる。本発明は、上記の課題を解決
して、ドリル加工性、打抜き加工性及び耐金属マイグレ
ーション性に優れ、かつ軽量電子機器用として利用でき
る紙フェノール内層回路板入り多層プリント配線板用銅
張積層板の製造方法を提供することを目的とする。Further, when glass fiber is used, CAF
(Conductive anodic filament), that is, metal migration is also likely to occur along the glass fiber. In addition, when the use ratio of glass fiber becomes high, the weight of the multilayer board becomes heavy, and it becomes difficult to reduce the weight of electronic equipment such as a VTR camera. The present invention solves the above-mentioned problems and is excellent in drilling workability, punching workability and metal migration resistance, and can be used as a lightweight electronic device. A copper-clad laminate for a multilayer printed wiring board containing a paper phenol inner layer circuit board. It aims at providing the manufacturing method of.
【０００５】[0005]
【課題を解決するための手段】本発明は、紙基材フェノ
ール樹脂積層板に内層回路を形成してなる内層材を脱湿
し、この内層材所定枚と外層材とを接着用プリプレグを
介して重ね、加熱加圧することを特徴とする多層プリン
ト配線板用積層板の製造方法である。内層材は、脱湿後
の内層材の絶縁抵抗が１０9 Ω以上、含水率が１．２％
以下となるように脱湿する。According to the present invention, an inner layer material formed by forming an inner layer circuit on a paper base phenolic resin laminate is dehumidified, and a predetermined number of the inner layer material and an outer layer material are passed through an adhesive prepreg. It is a method for manufacturing a laminated board for a multilayer printed wiring board, which is characterized by stacking and heating and pressing. The inner layer material has an insulation resistance of 10 9 Ω or more and a water content of 1.2% after dehumidification.
Dehumidify as follows.
【０００６】紙基材フェノール樹脂プリプレグの絶縁抵
抗をよくするには、紙基材、フェノール樹脂共に高純度
のものを使用する。特に金属イオン及び塩素イオンの含
有量が少ないものを選ぶ。また、紙基材を予めフェノー
ル樹脂またはメラミン樹脂で前処理し、更に樹脂の含浸
をすることも有効である。In order to improve the insulation resistance of the paper base phenolic resin prepreg, both a paper base material and a phenolic resin having high purity are used. In particular, select one with a low content of metal ions and chlorine ions. It is also effective to pretreat the paper base material with a phenol resin or a melamine resin in advance and further impregnate it with the resin.
【０００７】内層材と外層材とを多層化接着するに先立
って、内層材を、その含水率が１．２％以下であるよう
に乾燥する。乾燥条件は、例えば１０５℃、１時間ある
いは１６０℃、３０分で目的を達し得る。乾燥は、加熱
乾燥炉、遠赤外線乾燥炉、ＵＶ乾燥炉などを使用すれば
よい。なお、乾燥が不十分であると、多層化接着後の外
層にかすれ現象あるいはボイドの発生があり、耐熱性が
著しく低下する。Prior to the multi-layer adhesion of the inner layer material and the outer layer material, the inner layer material is dried so that the water content thereof is 1.2% or less. The drying conditions can reach the purpose, for example, at 105 ° C. for 1 hour or 160 ° C. for 30 minutes. For drying, a heating drying oven, a far infrared ray drying oven, a UV drying oven or the like may be used. If the drying is insufficient, the outer layer after the multi-layered adhesion may have a fading phenomenon or a void, and the heat resistance will be significantly reduced.
【０００８】内層材の銅はくは、厚みは１２〜１０５μ
ｍのものが使用できる。厚み３５μｍを越えると銅めっ
き及び銀ペイントとの密着性が良くなり、スルーホール
の信頼性（ホットオイルテスト）が向上する。The inner layer copper foil has a thickness of 12 to 105 μm.
m can be used. When the thickness exceeds 35 μm, the adhesion to copper plating and silver paint is improved, and the reliability of through holes (hot oil test) is improved.
【０００９】外層材として銅はくを使用する場合、接着
剤付を用いるのがこのましい。紙フェノール・プリプレ
グに良く接着する。また、内層材の回路面と接着プリプ
レグとの接着を良くするために、回路面を酸化または還
元して粗化し、あるいは予め粗化した銅はくを用いて回
路加工する。When copper foil is used as the outer layer material, it is preferable to use an adhesive layer. Adheres well to paper phenol prepreg. Further, in order to improve the adhesion between the circuit surface of the inner layer material and the adhesive prepreg, the circuit surface is oxidized or reduced to be roughened, or the circuit is processed by using a copper foil which is roughened in advance.
【００１０】[0010]
【作用】内層材として紙基材フェノール樹脂積層板積層
板を用いているので、軽く、かつ、打ち抜き加工性に優
れている。すなわち、ガラス基材エポキシ樹脂積層板の
ように打ち抜き壁面にバリを生ずることがない。また、
ドリル加工においても切削性が良好である。[Function] Since the paper-based phenolic resin laminate is used as the inner layer material, it is light and has excellent punching workability. That is, burrs do not occur on the punched wall surface unlike the glass-based epoxy resin laminated plate. Also,
Good machinability even in drilling.
【００１１】[0011]
【実施例】実施例１ 桐油変性率３４％のフェノール樹脂１００部（重量部、
以下同じ）にブロム化エポキシ樹脂（臭素量４８％）３
０部、トリフェニルリン酸エステル２０部を添加した配
合物を、予めフェノール−メラミン樹脂で前処理（付着
量２０％）したクラフト紙基材（イオン含有量８５０ｐ
ｐｍ）に塗布含浸して樹脂付着量５８％の紙基材フェノ
ール樹脂プリプレグを得た。次に、これを２枚重ね、そ
の両面に接着剤付銅はくを張り合せて厚み０．４ｍｍの
両面銅張積層板を得た。この積層板の絶縁抵抗（Ｄ−２
／１００）は、ＪＩＳ Ｃ６４８１の測定法によって１
×１０10Ωであった。Examples Example 1 100 parts by weight of a phenol resin having a tung oil modification rate of 34% (parts by weight,
The same shall apply hereinafter) to brominated epoxy resin (bromine content 48%) 3
A kraft paper substrate (ion content: 850 p) in which 0 parts and 20 parts of triphenyl phosphate ester were pretreated with a phenol-melamine resin in advance (adhesion amount: 20%)
pm) was coated and impregnated to obtain a paper-based phenol resin prepreg having a resin adhesion amount of 58%. Next, two sheets of this were laminated, and copper foil with an adhesive was attached to both surfaces thereof to obtain a double-sided copper-clad laminate having a thickness of 0.4 mm. Insulation resistance (D-2
/ 100) is 1 according to the measurement method of JIS C6481.
It was × 10 10 Ω.
【００１２】この両面銅張積層板をエッチング加工して
両面に回路を形成し、内層回路板を得た。これを１６０
℃、３０分加熱して乾燥した。次に、図１に示すように
内層回路板１の両回路面２に内層材と同じ紙基材フェノ
ール樹脂プリプレグ３を１枚ずつ配し、更にその外側に
接着剤付銅はく４を重ね合わせ、１７０℃、１０ＭＰａ
で８０分加熱加圧して、厚み０．８ｍｍの４層回路板用
銅張積層板を得た。This double-sided copper-clad laminate was etched to form circuits on both sides to obtain an inner layer circuit board. 160 this
It was dried by heating at ℃ for 30 minutes. Next, as shown in FIG. 1, a paper base phenolic resin prepreg 3 which is the same as the inner layer material is arranged on both circuit surfaces 2 of the inner layer circuit board 1 one by one, and an adhesive-attached copper foil 4 is further laid on the outside thereof. Combined, 170 ℃, 10MPa
After heating and pressing for 80 minutes, a copper-clad laminate for a 4-layer circuit board having a thickness of 0.8 mm was obtained.
【００１３】この内層回路板入り銅張積層板をドリル加
工してスルーホールを形成し、銀ペイントを充填し１８
０℃、３０分乾燥して銀スルーホールを形成した。ま
た、部品穴を、打ち抜き加工で形成し、エッチング加工
して４層銅スルーホールプリント配線板を得た。た。This copper clad laminate containing the inner layer circuit board is drilled to form through holes and filled with silver paint.
It was dried at 0 ° C. for 30 minutes to form a silver through hole. Further, component holes were formed by punching and etching was performed to obtain a 4-layer copper through-hole printed wiring board. It was
【００１４】実施例２ 実施例１と同様にして得た内層回路板を１６０℃で３０
分乾燥し、その両面にガラス布基材エポキシ樹脂プリプ
レグを１枚ずつ配し、さらに、その外側に上下に銅はく
を重ね合わせて１７０℃、７ＭＰａで加熱加圧し、厚み
０．８ｍｍの４層回路板用銅張積層板を得た。以下実施
例１と同様に加工した。Example 2 An inner layer circuit board obtained in the same manner as in Example 1 was heated at 160 ° C. for 30 days.
After minute drying, glass cloth base epoxy resin prepregs are placed on both sides one by one, copper foil is overlaid on the outside and heated and pressed at 170 ° C. and 7 MPa, and a thickness of 0.8 mm is applied. A copper clad laminate for a layer circuit board was obtained. The following processing was performed in the same manner as in Example 1.
【００１５】実施例３ 実施例２と同様にして得た４層回路板用銅張積層板をド
リル加工によってスルーホールを設け、スルーホールに
銅めっきした後エッチング加工して回路を形成し、かつ
部品穴は打ち抜き加工によって設けた。Example 3 A copper clad laminate for a four-layer circuit board obtained in the same manner as in Example 2 was provided with through holes by drilling, copper was plated in the through holes and then etching was performed to form a circuit, and The component holes were punched.
【００１６】比較例 厚み０．４ｍｍガラス布基材エポキシ樹脂両面銅張積層
板をエッチング加工して内層回路板とし、その両面にガ
ラス布基材エポキシ樹脂プリプレグを１枚ずつ配し、更
にその両外側に銅はくを重ね合わせて、厚み０．８ｍｍ
のガラス基材エポキシ樹脂４層回路板用銅張積層板を得
た。これに、ドリル加工によってスルーホール及び部品
穴を設け、スルーホールに銅めっきした後エッチング加
工して４層銅スルーホールプリント配線板を得た。Comparative Example 0.4 mm thick glass cloth base material epoxy resin double-sided copper clad laminate was etched to form an inner layer circuit board, and one glass cloth base material epoxy resin prepreg was placed on each of both sides, and both of them were arranged. 0.8mm thick with copper foil on the outside
To obtain a copper-clad laminate for a four-layer glass substrate epoxy resin circuit board. A through hole and a component hole were provided by drilling, copper was plated on the through hole, and then etching was performed to obtain a four-layer copper through hole printed wiring board.
【００１７】試験 各実施例及び比較例で得た４層プリント配線板につい
て、曲げ強さ、重量、耐金属マイグレーション性を調べ
た。試験の方法とその結果及び打抜き加工性は以下の通
りである。Test The bending strength, weight, and metal migration resistance of the four-layer printed wiring boards obtained in each of the examples and comparative examples were examined. The test method, its result, and punching workability are as follows.
【００１８】打抜き加工性（５０℃） １．７８ｍｍピッチ、直径０．９ｍｍの６連続穴を作っ
てクラック発生を評価した。その結果本発明のものには
クラックが発生しなかったが、ガラス布基材エポキシ樹
脂両面銅張積層板を内層材とした、比較例のものにはク
ラックが発生した。Punching workability (50 ° C.) Six continuous holes having a pitch of 1.78 mm and a diameter of 0.9 mm were made to evaluate the occurrence of cracks. As a result, cracks did not occur in the present invention, but cracks occurred in the comparative example in which the glass cloth base material epoxy resin double-sided copper clad laminate was used as the inner layer material.
【００１９】曲げ強さ（kgf/ｍｍ2 ） ＪＩＳ Ｃ６４８１により５０×２５ｍｍの試験片を用
い、強度試験機で測定した。その結果、実施例１の試料
は１７０ＭＰａ、実施例２の試料は３００ＭＰａ、実施
例３の試料は３００ＭＰａ、比較例の試料は４００ＭＰ
ａであった。Bending strength (kgf / mm 2 ) Measured by a strength tester using a test piece of 50 × 25 mm according to JIS C6481. As a result, the sample of Example 1 was 170 MPa, the sample of Example 2 was 300 MPa, the sample of Example 3 was 300 MPa, and the sample of Comparative Example was 400 MP.
It was a.
【００２０】重量 実施例１の試料は１．２０ｋｇ／ｍ2、実施例２の試料
は１．５０ｋｇ／ｍ2、実施例３の試料は１．５０ｋｇ
／ｍ2、比較例の試料は１．７５ｋｇ／ｍ2であった。[0020] Samples 1.20 kg / m 2 of weight Example 1, Example 2 samples 1.50 kg / m 2, the samples of Example 3 1.50 kg
/ M 2 , and the sample of the comparative example was 1.75 kg / m 2 .
【００２１】耐金属マイグレーション性 ６０℃、９０％ＲＨ、印加電圧直流５０Ｖの条件で２０
００時間処理後の絶縁抵抗値を測定し、得た値が１０8
以上を良好とした。結果は、実施例１、２、３及び比較
例の何れも良好であった。Metal migration resistance 20 under the conditions of 60 ° C., 90% RH, and applied voltage of DC 50V.
The insulation resistance value after processing for 00 hours was measured, and the obtained value was 10 8
The above was considered good. The results were good in all of Examples 1, 2, 3 and Comparative Example.
【００２２】[0022]
【発明の効果】本発明による多層プリント配線板用積層
板をプリント配線板は、ドリル加工または打ち抜き加工
によってスルーホール穴や部品穴をあけることができ
る。また耐金属マイグレーション性にも優れ、軽量であ
る。The printed wiring board of the laminated board for a multilayer printed wiring board according to the present invention can be provided with through holes or component holes by drilling or punching. It is also excellent in metal migration resistance and lightweight.
【図１】本発明の一実施例に関し、多層プリント配線板
用積層板の層構成を示す断面図である。FIG. 1 is a cross-sectional view showing a layer structure of a laminated board for a multilayer printed wiring board according to an embodiment of the present invention.
１ 内層回路板 ２ 回路面 ３ 紙基材フェノール樹脂プリプレグ ４ 接着剤付銅はく 1 inner layer circuit board 2 circuit surface 3 paper base phenolic resin prepreg 4 copper foil with adhesive
Claims (2)
を形成してなる内層材を脱湿し、この内層材所定枚と外
層材とを接着用プリプレグを介して重ね、加熱加圧する
ことを特徴とする多層プリント配線板用積層板の製造方
法。1. A method of dehumidifying an inner layer material formed by forming an inner layer circuit on a paper-based phenolic resin laminate, stacking a predetermined number of the inner layer material and an outer layer material via an adhesive prepreg, and applying heat and pressure. A method of manufacturing a laminated board for a multilayer printed wiring board, which is characterized.
上、含水率が１．２％以下であることを特徴とする請求
項１記載の多層プリント配線板用積層板の製造方法。2. The method for producing a laminated board for a multilayer printed wiring board according to claim 1, wherein the inner layer material after dehumidification has an insulation resistance of 10 9 Ω or more and a water content of 1.2% or less. ..
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5018692A JPH05251866A (en) | 1992-03-09 | 1992-03-09 | Manufacture of laminate for multi-layered printed-circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5018692A JPH05251866A (en) | 1992-03-09 | 1992-03-09 | Manufacture of laminate for multi-layered printed-circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05251866A true JPH05251866A (en) | 1993-09-28 |
Family
ID=12852152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5018692A Pending JPH05251866A (en) | 1992-03-09 | 1992-03-09 | Manufacture of laminate for multi-layered printed-circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05251866A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013171939A (en) * | 2012-02-20 | 2013-09-02 | Fujitsu Ltd | Wiring structure and manufacturing method thereof, and electronic device and manufacturing method thereof |
-
1992
- 1992-03-09 JP JP5018692A patent/JPH05251866A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013171939A (en) * | 2012-02-20 | 2013-09-02 | Fujitsu Ltd | Wiring structure and manufacturing method thereof, and electronic device and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB2224464A (en) | Printed wiring board | |
| US20030045164A1 (en) | Non-woven fabric material and prepreg, and circuit board using the same | |
| JPH07106728A (en) | Rigid-flexible printed wiring board and manufacture thereof | |
| JPH05251866A (en) | Manufacture of laminate for multi-layered printed-circuit board | |
| JPH0697670A (en) | Board for multilayer printed wiring | |
| JPH07176837A (en) | Rigid-flexible printed wiring board and its manufacture | |
| JPH0750455A (en) | Rigid/flexible printed wiring board and its manufacture | |
| JPH05327227A (en) | Blind hole and its production | |
| JPH08148825A (en) | Manufacture of wiring board | |
| JP3154350B2 (en) | Printed wiring board and its manufacturing method | |
| JPH0240234B2 (en) | ||
| JP3092117B2 (en) | Printed wiring board and its manufacturing method | |
| JPH0977886A (en) | Glass nonwoven fabric for laminated plate and laminated plate | |
| JPH08148836A (en) | Multilayered flexrigid wiring board | |
| JPH06338663A (en) | Rigid-flex printed wiring board and its manufacture | |
| JPS61135738A (en) | Multilayer board | |
| JPH0570953B2 (en) | ||
| JPH05259643A (en) | Manufacture of multilayer wiring board | |
| JPH05251867A (en) | Manufacture of multi-layered circuit board | |
| JPH0573360B2 (en) | ||
| JPH05220892A (en) | Copper clad laminated sheet and production thereof | |
| JPH0239486A (en) | Manufacture of metal core printer substrate for bending | |
| JPH04185429A (en) | Laminate and printed wiring board | |
| JPH0878854A (en) | Multilayered printed wiring board | |
| JPH09326565A (en) | Multilayer printed wiring board and manufacture thereof |