JPH05259680A - High frequency electronic apparatus - Google Patents

Abstract

PURPOSE:To hold a printed board by sealing it in a high frequency electronic apparatus without providing a hole in a housing for constituting the apparatus. CONSTITUTION:A plurality of protrusions 11a-11c to be formed by projection pressing are provided at a shielding case side plate 11. A printed board 1 is placed from above, and resists 1a, 1b, etc., are connected to the protrusions 11a-11c by soldering. A frame is formed together with a shielding case side plate 12. The frame is sealed from above and below by an upper cover 4 and a lower cover 5 of the case to constitute a high frequency electronic apparatus.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency electronic device such as a tuner used in a television receiver or a video tape recorder.

[0002]

2. Description of the Related Art In recent years, a high frequency electronic device incorporating a printed circuit board on which a high frequency electronic circuit component is mounted is housed in a metal shield case or the like and hermetically sealed so that interference from an external electronic circuit or electrical connection to the outside is prevented. It is configured to prevent unintended interference.

FIG. 3 is a diagram showing an example of an assembly structure of a conventional high frequency electronic device. In this figure, a printed circuit board 1 on which a high frequency electronic circuit is mounted has a U-shaped shield case side plate 2
Further, it is surrounded by a flat shield case side plate 3, and its upper surface is covered with a shield case upper lid 4 and its lower surface is covered with a shield case lower lid 5, and is fixed in the housing. Here, around the printed circuit board 1, as shown in the drawing, there is provided a region in which the resists 1a to 1c of the copper foil on the back surface can be soldered. The shield case side plate 2 has bent portions 2a to 2c each having a U-shaped groove at the center of the three side surfaces as shown in the drawing.
Are formed. The bent portions 2a to 2c are previously bent toward the inside of the shield case side plate 2, the printed circuit board 1 is placed on the bent portions 2a to 2c to position the printed circuit board, and the printed circuit board 1 is provided in advance on the back surface of the printed circuit board 1. It contacts the resists 1a to 1c and is fixed by soldering. This soldering plays an extremely important role in improving the performance of the high frequency electronic device. In this way, the printed circuit board 1 is shielded by the shield case side plates 2 and 3, the upper lid 4 and the lower lid 5 to form a high frequency electronic device.

[0004]

However, in such a conventional high frequency electronic device, when the bent portions 2a to 2c provided on the shield case side plate 2 are bent into the shield case, a U-shaped hole is formed in the bent portion. As a result, the shield effect of the shield case side plate 2 is reduced. Therefore, there is a drawback in that the high-frequency electronic device causes electrical interference to the outside, or is susceptible to external interference.

The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to make it possible to form a high-frequency electronic device without forming holes in the side plates of the shield case.

[0006]

SUMMARY OF THE INVENTION The present invention has a printed circuit board on which a high frequency electronic circuit component is mounted, and a plurality of inward projections formed by a projection press process which are formed in a frame shape while holding the printed circuit board inside. A shield case side plate formed by soldering to the ground plane of the printed circuit board on the protrusion, a shield case upper lid covering the upper surface of the frame body of the shield case side plate, and a shield covering the lower surface of the frame body of the shield case side plate. And a case lower lid, and a printed circuit board is hermetically sealed.

[0007]

According to the present invention having such characteristics, a plurality of projections are formed on the side plate of the shield case by projection press processing, and the printed circuit board is placed and connected to the grounded portion by soldering to achieve high frequency. It is grounded. Then, an upper lid and a lower lid are attached to the upper and lower sides of the shield case side plate to form a housing and to seal the internal printed circuit board.

[0008]

EXAMPLE An example of the present invention will be described. FIG. 1 is an assembly configuration diagram of a high frequency electronic device according to an embodiment of the present invention. In this figure, the same parts as those in the conventional example described above are designated by the same reference numerals, and detailed description thereof will be omitted. Also in this embodiment, the printed circuit board 1 on which the high frequency electronic circuit component is mounted is
It is constituted by being surrounded by the second shield case side plates 11 and 12. Here, the shield case side plate 11 is a member having a U-shaped cross-section, and as shown in the drawing, a projection 11a is formed by inward projection projection at substantially the center of each side surface.
~ 11c. As shown in the sectional structure of FIG. 2, these protrusions 11a to 11c have a right triangle shape for mounting the printed circuit board 1. Here, the projection press working is a press working for forming a specific shape, here, a right-angled triangular shape as shown in FIG. 2, by sandwiching a metal plate with a punch and a die for press working. Since the shield case side plate is not punched by this process, the protrusions 11a to 11c are not punched.
No holes are formed in the vicinity of. Further, thin slits are formed on the sides of the protrusions 11a and 11c of the shield case side plate 11. Then, projecting portions provided at both longitudinal ends of the flat plate-shaped second shield case side plate 12 are inserted to form a frame body holding the printed circuit board 1 therein.

The printed circuit board 1 is mounted on the protrusions 11a to 11c, and the printed circuit board 1 is positioned downward. At this time, the resists 1a to 1c formed on the lower surface of the printed board 1 are soldered to the protrusions 11a to 11c, respectively, so that the printed board 1 is fixed and grounded at a high frequency. Like the conventional high-frequency electronic device, the shield case upper lid 4 and the shield case lower lid 5 are covered and sealed from above and below the frame body thus configured,
It is a high-frequency electronic device.

In the present embodiment, the projections 11a to 11c provided on the shield case side plate 11 have a right triangle shape in cross section, but any shape may be used as long as the printed board can be mounted and the resist can be soldered. , It does not have to be a right triangle.

Further, in this embodiment, the protrusions 11a to 11c are provided only on the first shield case side plate 11, but the second shield
A similar projection may be provided on the shield case side plate 12 by projection press processing.

[0012]

As described in detail above, in the high frequency electronic device according to the present invention, the shield case side plate is provided with the projection by projection press processing, and the printed circuit board is placed on the projection to form the projection. Since it is fixed by soldering, there is no hole in the side plate of the shield case. Therefore, there is an effect that the shield effect can be greatly improved without causing electrical interference to the outside of the electronic device or receiving external interference.

[Brief description of drawings]

FIG. 1 is an assembly configuration diagram of a high frequency electronic device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a shield case side plate of the high-frequency electronic device according to the present embodiment.

FIG. 3 is an assembly configuration diagram of a conventional high-frequency electronic device.

[Explanation of symbols]

 1 Printed Circuit Boards 1a to 1c Resist 4 Shield Case Upper Lid 5 Shield Case Lower Lid 11 First Shield Case Side Plate 11a to 11c Projection 12 Second Shield Case Side Plate

Claims (1)

[Claims] 1. A printed circuit board on which a high-frequency electronic circuit component is mounted, and a printed wiring board formed in a frame shape while holding the printed circuit board inside.
A shield case side plate having a plurality of inward projections formed by projection press processing and solder-connected to the ground plane of the printed circuit board on the projections, and a shield case upper cover covering the upper surface of the frame body of the shield case side plate And a shield case lower lid that covers the lower surface of the frame of the shield case side plate, and is configured by sealing a printed circuit board.