JP3108535B2 - Relay shield structure - Google Patents
Relay shield structureInfo
- Publication number
- JP3108535B2 JP3108535B2 JP04200949A JP20094992A JP3108535B2 JP 3108535 B2 JP3108535 B2 JP 3108535B2 JP 04200949 A JP04200949 A JP 04200949A JP 20094992 A JP20094992 A JP 20094992A JP 3108535 B2 JP3108535 B2 JP 3108535B2
- Authority
- JP
- Japan
- Prior art keywords
- relay
- metal
- circuit board
- printed circuit
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プログラマブルアッテ
ネータなどのようにリレーを複数個連結して使用する場
合、リレー相互間の高周波をシールドするのに用いる構
造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure used for shielding high frequencies between relays when a plurality of relays are connected and used, such as a programmable attenuator.
【０００２】[0002]
【従来の技術】プラスチックケースで覆ったプラスチッ
クリレーを連結して使用した場合、リレー相互間の高周
波の漏れが発生し、満足した高周波特性が得られなかっ
た。従来、アッテネータではリレー１が搭載されたプリ
ント基板２は図７に示すようにアルミニウム等の金属筺
体３内に内装されるようになっている。プリント基板２
は図８のように両面に導体２ａを有する両面プリント基
板であって、このプリント基板２の上に複数個のリレー
１を並べて搭載してある。金属筺体３は切削加工で形成
されるものであって、金属筺体３内に設けたリブ４にて
隣り合うリレー１を仕切ってある。５はコネクターの貫
通孔である。2. Description of the Related Art When plastic relays covered with a plastic case are connected and used, high-frequency leakage occurs between the relays, and satisfactory high-frequency characteristics cannot be obtained. Conventionally, in an attenuator, a printed circuit board 2 on which a relay 1 is mounted is housed in a metal housing 3 made of aluminum or the like as shown in FIG. Printed circuit board 2
8 shows a double-sided printed circuit board having conductors 2a on both sides as shown in FIG. 8, on which a plurality of relays 1 are mounted side by side. The metal housing 3 is formed by cutting, and adjacent relays 1 are separated by ribs 4 provided in the metal housing 3. 5 is a through hole of the connector.
【０００３】[0003]
【発明が解決しようとする課題】ところで、金属筺体３
を切削加工で形成するときリブ４を設ける加工は非常に
複雑で、非常に高価なのものになるという問題がある。
本発明は上記問題に鑑みてなされたものであって、本発
明の目的とするところはリレーを並べて使用してもリレ
ー相互間の信号の漏れを防止できるのは勿論、そのシー
ルド構造を簡単且つ安価にできるリレーのシールド構造
を提供するにある。The metal housing 3
There is a problem that the process of providing the ribs 4 when forming is extremely complicated and very expensive.
The present invention has been made in view of the above problems, and an object of the present invention is to not only prevent signal leakage between relays even when relays are used side by side, but also to make the shield structure simple and easy. An object of the present invention is to provide an inexpensive relay shield structure.
【０００４】[0004]
【課題を解決するための手段】上記目的を達成するため
本発明リレーのシールド構造は、プリント基板２に複数
個のリレー１を並べて搭載すると共にリレー１とプリン
ト基板２との間に金属シート６を介在し、各リレー１に
金属ケース７を被せて金属ケース７と金属シート６とを
結合し、金属ケース７の上面に設けた切り起こし片８に
てリレー１をプリント基板２側に押圧し、金属ケース７
及び金属シート６で被覆した複数個のリレー１とプリン
ト基板２を金属筺体３に内装して成ることを特徴とす
る。In order to achieve the above object, a relay shield structure of the present invention comprises a plurality of relays arranged side by side on a printed circuit board and a metal sheet interposed between the relay and the printed circuit board. The metal case 7 is put on each relay 1, the metal case 7 and the metal sheet 6 are joined, and the relay 1 is pressed toward the printed circuit board 2 by the cut-and-raised piece 8 provided on the upper surface of the metal case 7. , Metal case 7
A plurality of relays 1 and a printed circuit board 2 covered with a metal sheet 6 are provided inside a metal housing 3.
【０００５】また金属ケース７乃至金属シート６の一部
にアース端子９を設けて成ることを特徴とすることも好
ましい。It is also preferable that a ground terminal 9 is provided on a part of the metal case 7 to the metal sheet 6.
【０００６】[0006]
【作用】上記構成によれば、金属ケース７と金属シート
６とで各リレー１の回りを覆ってシールドできてリレー
相互間の信号の漏れを防止できる。また金属ケース７と
金属シート６とで各リレーを覆うことにより、金属筺体
３には従来のように金属筺体３にリブを設ける必要がな
く、金属筺体３の加工を簡単にでき、シールド構造を簡
単且つ安価にできる。According to the above construction, the metal case 7 and the metal sheet 6 can cover and surround the relays 1 to prevent signal leakage between the relays. Further, by covering each relay with the metal case 7 and the metal sheet 6, it is not necessary to provide a rib on the metal housing 3 as in the conventional case, so that the processing of the metal housing 3 can be simplified and the shield structure can be improved. It can be simple and cheap.
【０００７】[0007]
【実施例】リレー１は図３に示すようにプリント基板２
の上に複数個並べて搭載されるようになっている。金属
シート６は図２に示すようにリレー１の底面よりやや大
きさの大きいものであり、リレー１のリレー足１ａを挿
通したりする透孔６ａを有している。この金属シート６
は打ち抜き加工等で形成してある。金属ケース７は図２
に示すように下面を開口せる角箱状に形成されており、
上面に下方に切り起こした切り起こし片８を設けてあ
る。この金属ケース７も金型による抜き曲げ加工で形成
してある。しかして金属シート６を介してリレー１を図
３のように複数個搭載してあり、各リレー１に図１に示
すように金属ケース７を被嵌して金属シート６の周縁と
金属ケース７を結合してある。このとき金属ケース７及
び金属シート６をアースするためプリント基板２への実
装時、金属ケースの一部をプリント基板２に半田付けで
接合する。また金属ケース７の切り起こし片８をリレー
１に当接してリレー１を金属シート６やプリント基板２
に押し付けてある。つまり、プリント基板２とリレー１
底面の距離が少ない程、良好な高周波特性が得られる。
このため金属ケース７と金属シート６を結合したときリ
レー１底面を金属シート６と密着させておく必要があ
る。しかしながらリレー１の高さは部品及び組み立てに
よるばらつきが出るため、金属ケース７の高さをリレー
１の高さより高くし、切り起こし片８にてリレー１を押
さえている。また金属筺体３は図４に示すように切削加
工で形成されるが、従来のようにリブを設けたものな
く、簡単に加工されるものである。そして金属ケース７
や金属シート６で被覆した複数のリレー１を搭載したプ
リント基板２は金属筺体３内に内装される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in FIG.
It is designed to be mounted side by side on a plurality. As shown in FIG. 2, the metal sheet 6 is slightly larger than the bottom surface of the relay 1, and has a through hole 6 a through which the relay foot 1 a of the relay 1 is inserted. This metal sheet 6
Are formed by punching or the like. The metal case 7 is shown in FIG.
As shown in the figure, it is formed in a square box shape that opens the lower surface,
A cut-and-raised piece 8 cut and raised downward is provided on the upper surface. The metal case 7 is also formed by punching and bending using a die. A plurality of relays 1 are mounted via the metal sheet 6 as shown in FIG. 3, and a metal case 7 is fitted to each relay 1 as shown in FIG. Are combined. At this time, in order to ground the metal case 7 and the metal sheet 6, a part of the metal case is joined to the printed circuit board 2 by soldering when mounting on the printed circuit board 2. Further, the cut-and-raised piece 8 of the metal case 7 is brought into contact with the relay 1 and the relay 1 is placed on the metal sheet 6 or the printed circuit board 2.
Pressed to. That is, the printed circuit board 2 and the relay 1
As the distance between the bottom surfaces is shorter, better high-frequency characteristics are obtained.
For this reason, when the metal case 7 and the metal sheet 6 are combined, the bottom surface of the relay 1 needs to be in close contact with the metal sheet 6. However, since the height of the relay 1 varies depending on parts and assembly, the height of the metal case 7 is made higher than the height of the relay 1, and the cut-and-raised piece 8 holds the relay 1. Although the metal housing 3 is formed by cutting as shown in FIG. 4, it is easily processed without a rib provided as in the conventional case. And metal case 7
A printed circuit board 2 on which a plurality of relays 1 covered with a metal sheet 6 are mounted is housed in a metal housing 3.
【０００８】図５は他の実施例を示すものである。図５
（ａ）の場合、金属ケース７にアース端子９を設けてあ
り、図５（ｂ）の場合、金属シート６にアース端子９を
設けてある。このように金属ケース７または金属シート
６にアース端子９を設けることにより、プリント基板２
として図６のような片面に導体２ａを有する片面プリン
ト基板を用いても、両面プリント基板を用いた場合と同
等の高周波特性が得られる。つまり片面プリント基板の
場合、リレー１とプリント基板２のアース面との距離が
あるため、アースが不十分であったが、金属ケース７や
金属シート６を使用することにより片面プリント基板の
場合でも十分なアースを取ることができる。FIG. 5 shows another embodiment. FIG.
In the case of (a), the ground terminal 9 is provided on the metal case 7, and in the case of FIG. 5B, the ground terminal 9 is provided on the metal sheet 6. By providing the ground terminal 9 on the metal case 7 or the metal sheet 6 in this manner, the printed circuit board 2
Even when a single-sided printed circuit board having a conductor 2a on one side as shown in FIG. 6 is used, high-frequency characteristics equivalent to those obtained when a double-sided printed circuit board is used can be obtained. In other words, in the case of a single-sided printed circuit board, the grounding is insufficient because of the distance between the relay 1 and the ground surface of the printed circuit board 2. You can take enough ground.
【０００９】[0009]
【発明の効果】本発明は叙述のようにプリント基板に複
数個のリレーを並べて搭載すると共にリレーとプリント
基板との間に金属シートを介在し、各リレーに金属ケー
スを被せて金属ケースと金属シートとを結合し、金属ケ
ースの上面に設けた切り起こし片にてリレーをプリント
基板側に押圧し、金属ケース及び金属シートで被覆した
複数個のリレーとプリント基板を金属筺体に内装してい
るので、金属ケースと金属シートとで各リレーの回りを
覆ってシールドできてリレー相互間の信号の漏れを防止
できるものであり、また金属ケースと金属シートとで各
リレーを覆うことにより、金属筺体には従来のようにリ
ブを設ける必要がなく、金属筺体の加工を簡単にでき、
シールド構造を簡単且つ安価にできる（金属シートや金
属ケースは打ち抜きや曲げ加工で簡単でき、部品点数が
増えてもトータル的にコストが安くなる）ものである。As described above, according to the present invention, a plurality of relays are arranged and mounted on a printed circuit board, a metal sheet is interposed between the relay and the printed circuit board, and each relay is covered with a metal case. The relay is pressed to the printed circuit board side by the cut-and-raised piece provided on the upper surface of the metal case, and a plurality of relays and the printed circuit board covered with the metal case and the metal sheet are housed in the metal housing. Therefore, a metal case and a metal sheet can cover and shield around each relay to prevent signal leakage between the relays. Also, by covering each relay with the metal case and the metal sheet, a metal housing can be provided. Does not require ribs as in the past, making it easier to process metal housings.
The shield structure can be made simple and inexpensive (the metal sheet or metal case can be easily formed by punching or bending, and the total cost is reduced even if the number of parts is increased).
【００１０】また本発明の請求項２記載の発明にあって
は、金属ケース乃至金属シートの一部にアース端子を設
けてあるので、十分なアースがとれて高周波特性を向上
できるものである。Further, in the invention according to claim 2 of the present invention, since the ground terminal is provided on a part of the metal case or the metal sheet, sufficient ground can be taken and the high frequency characteristics can be improved.
【図１】本発明の一実施例の要部の断面図である。FIG. 1 is a sectional view of a main part of an embodiment of the present invention.
【図２】同上の分解斜視図である。FIG. 2 is an exploded perspective view of the same.
【図３】同上のプリント基板に複数のリレーを搭載した
状態の斜視図である。FIG. 3 is a perspective view showing a state where a plurality of relays are mounted on the printed circuit board according to the first embodiment.
【図４】同上の金属筺体に内装する状態を示す分解斜視
図である。FIG. 4 is an exploded perspective view showing a state of being housed in the metal housing.
【図５】同上の他の実施例を示し、（ａ）は金属ケース
の斜視図、（ｂ）は金属シートの斜視図である。5A and 5B show another embodiment of the above, wherein FIG. 5A is a perspective view of a metal case, and FIG. 5B is a perspective view of a metal sheet.
【図６】同上のプリント基板にリレーを搭載した断面図
である。FIG. 6 is a cross-sectional view in which a relay is mounted on the printed circuit board according to the first embodiment.
【図７】従来例の分解斜視図である。FIG. 7 is an exploded perspective view of a conventional example.
【図８】従来のプリント基板にリレーを搭載した断面図
である。FIG. 8 is a cross-sectional view in which a relay is mounted on a conventional printed circuit board.
１ リレー ２ プリント基板 ３ 金属筺体 ６ 金属シート ７ 金属ケース DESCRIPTION OF SYMBOLS 1 Relay 2 Printed circuit board 3 Metal housing 6 Metal sheet 7 Metal case
フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01H 45/00 - 59/00 H05K 9/00 Continuation of the front page (58) Field surveyed (Int. Cl. 7 , DB name) H01H 45/00-59/00 H05K 9/00
Claims (2)
搭載すると共にリレーとプリント基板との間に金属シー
トを介在し、各リレーに金属ケースを被せて金属ケース
と金属シートとを結合し、金属ケースの上面に設けた切
り起こし片にてリレーをプリント基板側に押圧し、金属
ケース及び金属シートで被覆した複数個のリレーとプリ
ント基板を金属筺体に内装して成ることを特徴とするリ
レーのシールド構造。A plurality of relays are arranged and mounted on a printed circuit board, a metal sheet is interposed between the relay and the printed circuit board, a metal case is put on each relay, and the metal case and the metal sheet are joined. The relay is characterized in that the relay is pressed toward the printed circuit board side by a cut-and-raised piece provided on the upper surface of the case, and a plurality of relays covered with a metal case and a metal sheet and the printed circuit board are housed in a metal housing. Shield structure.
ス端子を設けて成ることを特徴とする請求項１記載のリ
レーのシールド構造。2. The relay shield structure according to claim 1, wherein a ground terminal is provided on a part of the metal case or the metal sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04200949A JP3108535B2 (en) | 1992-07-28 | 1992-07-28 | Relay shield structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04200949A JP3108535B2 (en) | 1992-07-28 | 1992-07-28 | Relay shield structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0652767A JPH0652767A (en) | 1994-02-25 |
| JP3108535B2 true JP3108535B2 (en) | 2000-11-13 |
Family
ID=16432992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04200949A Expired - Lifetime JP3108535B2 (en) | 1992-07-28 | 1992-07-28 | Relay shield structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3108535B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000236189A (en) | 1999-02-16 | 2000-08-29 | Minebea Co Ltd | Shielding device for electronic circuit for aircraft |
| DE60032471T2 (en) * | 2000-07-14 | 2007-05-03 | Minebea Co., Ltd. | DEVICE FOR SHIELDING ELECTRONIC CIRCUITS IN AIRCRAFT |
| JP2002368360A (en) * | 2001-06-12 | 2002-12-20 | Nec Corp | Circuit board provided with protection cover |
| JP5542986B2 (en) * | 2013-03-06 | 2014-07-09 | 三菱電機株式会社 | Switchgear |
-
1992
- 1992-07-28 JP JP04200949A patent/JP3108535B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0652767A (en) | 1994-02-25 |
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