JPH0495859A - Optically inspecting apparatus for printed board - Google Patents
Optically inspecting apparatus for printed boardInfo
- Publication number
- JPH0495859A JPH0495859A JP21390790A JP21390790A JPH0495859A JP H0495859 A JPH0495859 A JP H0495859A JP 21390790 A JP21390790 A JP 21390790A JP 21390790 A JP21390790 A JP 21390790A JP H0495859 A JPH0495859 A JP H0495859A
- Authority
- JP
- Japan
- Prior art keywords
- light
- printed board
- laser beam
- intensity
- scattered light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 claims abstract description 10
- 238000011156 evaluation Methods 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 7
- 239000011889 copper foil Substances 0.000 abstract description 7
- 238000002845 discoloration Methods 0.000 abstract description 3
- 238000005259 measurement Methods 0.000 description 10
- 238000003384 imaging method Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント板光学検査装置に関し、特にプリント
板に配設した微小パターンの良否をレーザ光の走査によ
って検査するプリント板光学検査装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed board optical inspection device, and more particularly to a printed board optical inspection device that inspects the quality of minute patterns arranged on a printed board by scanning a laser beam.
従来、この種のプリント板光学検査装置は、プリント板
に照射したレーザ光の反射光と散乱光を合せて受光し、
その光強度を測定することにより、微小パターンとプリ
ント基板の反射の相違にもとづいて微細パターンの検査
を行っていた。Conventionally, this type of printed board optical inspection equipment receives a combination of reflected light and scattered light from a laser beam irradiated onto a printed board.
By measuring the light intensity, fine patterns were inspected based on the difference in reflection between the fine patterns and the printed circuit board.
又、走査レーザ光と逆光路で戻る正反射光のみを用いる
方法もある。なお、これらに関しては、例えば[光計測
のニーズとシーズJ、P301〜305、コロナ社等に
詳述されている。There is also a method that uses only the scanning laser beam and specularly reflected light that returns in the reverse optical path. Note that these are detailed in, for example, [Needs and Seeds of Optical Measurement J, P301-305, Corona Publishing, etc.
上述した従来のプリント板光学検査装置は、プリント板
に照射したレーザの反射光と散乱光を共に捕捉し、その
光強度より検査を行っている。The conventional printed board optical inspection apparatus described above captures both the reflected light and scattered light of the laser irradiated onto the printed board, and performs inspection based on the light intensity.
しかしながら、レーザスポットが微細パターンを形成す
る銅箔に照射された時、反射光強度は強いが散乱光強度
は弱く、逆にレーザスポットがプリント基板に照射され
た時には、反射光強度は弱いが散乱光強度は強い。この
ため、反射光と散乱光とを区別しないで単純に計測した
場合に、照射レーザスポットが銅箔に照射された時と基
板に照射された時の差が小さ(S/N比の良い測定が困
難であるという欠点がある。However, when a laser spot is irradiated onto a copper foil that forms a fine pattern, the reflected light intensity is strong but the scattered light intensity is weak; conversely, when the laser spot is irradiated onto a printed circuit board, the reflected light intensity is weak but scattered. The light intensity is strong. For this reason, when simply measuring without distinguishing between reflected light and scattered light, the difference between when the irradiated laser spot is irradiated on the copper foil and when it is irradiated on the substrate is small (measurement with a good S/N ratio). The disadvantage is that it is difficult to
また、正反射光のみを受光する方法では、表面の黒化し
た場合には反射光が十分に帰ってこす、誤って検出する
ことが避けられないという欠点がある。Furthermore, the method of receiving only specularly reflected light has the drawback that when the surface becomes black, a sufficient amount of the reflected light returns and erroneous detection is unavoidable.
本発明の装置は、プリント板に配設された微小パターン
の良否を検査するプリント板光学検査装置であって、検
査すべきプリント板を照射するレーザ光を出光しプリン
ト板上を走査させるレーザ光走査手段と、前記レーザ光
走査手段で得られるプリント板の反射光を結像しこの結
像の半径方向の強度分布を表現する評価値もしくはこの
評価値の空間微分値にもとづいて前記微小パターンの良
否を判定する良否判定手段とを備えて構成される。The device of the present invention is a printed board optical inspection device that inspects the quality of minute patterns arranged on a printed board, and the device emits a laser beam that irradiates the printed board to be inspected and scans the printed board. a scanning means, and an image of the reflected light from the printed board obtained by the laser beam scanning means, and an evaluation value expressing the intensity distribution in the radial direction of this image, or a spatial differential value of this evaluation value, to form an image of the minute pattern. and a quality determination means for determining quality.
〔実施例〕 次に、本発明について図面を参照して説明する。〔Example〕 Next, the present invention will be explained with reference to the drawings.
第1図は本発明の一実施例の構成図である。第1図に示
す実施例は、レーザ光走査手段を構成するレーザ光源1
、コリメータレンズ2、ポリゴンミラー3およびコリメ
ータレンズ4、良否判定手段を構成するハーフミラ−6
、結像用レンズ7、小型マスク8、回折光計測用7オト
マル9および演算処理部10を備え、なお第1図には、
プリント基板5と、プリント基板5に配設した微小パタ
ーン51を併記して示す。FIG. 1 is a block diagram of an embodiment of the present invention. The embodiment shown in FIG.
, a collimator lens 2, a polygon mirror 3, a collimator lens 4, and a half mirror 6 constituting a quality determining means.
, an imaging lens 7, a small mask 8, a diffracted light measurement 7 otomaru 9, and an arithmetic processing unit 10, and FIG.
A printed circuit board 5 and a micro pattern 51 disposed on the printed circuit board 5 are also shown.
レーザ光源1から放射されたレーザ光は、コリメータレ
ンズ2により細く絞り込まれ、回転多面鏡のポリゴンミ
ラー3とコリメータレンズ4により垂直走査され、プリ
ント基板5を照射する。Laser light emitted from a laser light source 1 is narrowed down by a collimator lens 2, vertically scanned by a polygon mirror 3, which is a rotating polygon mirror, and a collimator lens 4, and illuminates a printed circuit board 5.
プリント基板5に当ったレーザビームは、反射または散
乱され、その一部はコリメータレンズ4とポリゴンミラ
ー3を通り往光路を逆行する。照射光と、照射光と逆行
する反射・散乱光をハーフミラ−6を使って分離し、反
射・散乱光はプリント基板5と結像レンズ7を介して回
折光計測用フォトマル9上に、プリント基板3上に射照
されたレーザ光による強度分布の像を結ばせる。また、
正反射光強度が強い場合、回折光計測用フォトマル9を
保護する為に、正反射光のみを遮光し散乱光のみを通過
させるように構成した小型マスク8を使用する。The laser beam hitting the printed circuit board 5 is reflected or scattered, and part of it passes through the collimator lens 4 and the polygon mirror 3 and travels backward on the outgoing optical path. The irradiated light and the reflected/scattered light that travels in the opposite direction to the irradiated light are separated using a half mirror 6, and the reflected/scattered light is printed on the photomultiplier 9 for diffracted light measurement via the printed circuit board 5 and the imaging lens 7. An image of the intensity distribution of the laser beam irradiated onto the substrate 3 is formed. Also,
When the specularly reflected light intensity is strong, in order to protect the diffracted light measurement photomultiple 9, a small mask 8 configured to block only the specularly reflected light and allow only the scattered light to pass is used.
回折光計測用フォトマル9は、同心円状に配設した受光
素子を有し、入射した反射・散乱光、第1図の場合は小
型マスク8を通過する散乱光の光強度を同心円状に分布
している受光素子ごとに測定し、その結合を演算処理部
10に送る。The photomultiplier 9 for diffracted light measurement has light receiving elements arranged concentrically, and the light intensity of the incident reflected and scattered light, or in the case of FIG. 1, the scattered light passing through the small mask 8, is distributed concentrically. The measurement is performed for each light-receiving element, and the combination is sent to the arithmetic processing section 10.
演算処理部10は、回折光計測用フォトマル9で得られ
た散乱光の半径方向の強度分布データを評価値として発
生する。The arithmetic processing unit 10 generates the radial intensity distribution data of the scattered light obtained by the photomultiplier 9 for diffracted light measurement as an evaluation value.
回折光計測用フォトマル9に照射される反射・散乱光強
度を正反射光位置を中心に第2図および第3図に示す。The intensity of reflected and scattered light irradiated onto the photomultiplex 9 for diffracted light measurement is shown in FIGS. 2 and 3, centering on the position of specularly reflected light.
レーザ光がプリント板上の銅箔51に照射された場合、
第2図(a)に示されたように、中心部の正反射光位置
に光強度が集中する形になる。また小型マスク10によ
って正反射光を遮光した場合は第2図(b)のように強
度が弱く、分布も狭い信号となる。When the laser beam is irradiated onto the copper foil 51 on the printed board,
As shown in FIG. 2(a), the light intensity is concentrated at the specularly reflected light position in the center. In addition, when the specularly reflected light is blocked by the small mask 10, the intensity becomes weak and the distribution becomes a narrow signal as shown in FIG. 2(b).
またレーザ光がプリント基板5に照射された場合、第3
図(a)のように正反射光は弱く、光は散乱光として広
く分布する。この傾向はマスクをした場合の第3図(b
)でも同様である。Furthermore, when the printed circuit board 5 is irradiated with laser light, the third
As shown in Figure (a), the specularly reflected light is weak and the light is widely distributed as scattered light. This tendency is seen in Figure 3 (b) when wearing a mask.
) but the same is true.
演算処理部10は回折光計測用フォトマル9から出力さ
れる半径方向強度分布に対応した評価値を求め、これら
評価値の特長からレーザ光照射部分の状態を知り、微小
パターンの良否を判定する。The arithmetic processing unit 10 obtains evaluation values corresponding to the radial intensity distribution output from the photomultiplier 9 for diffracted light measurement, learns the state of the laser beam irradiated area from the features of these evaluation values, and determines the quality of the minute pattern. .
なお、上述した実施例では、結像用レンズ7による結像
の半径方向の強度分布を表現する評価値を求め、この評
価値にもとづいて微細パターンの良否を判定したが、こ
の評価値をそのまま利用する代りに、評価値の空間微分
値をとり、銅箔とプリント基板の強度分布を表現する評
価値の空間的変化程度の相異を評価尺度として利用する
ことも容易に実施しうろことは明らかである。In the above embodiment, an evaluation value expressing the radial intensity distribution of the image formed by the imaging lens 7 was obtained, and the quality of the fine pattern was determined based on this evaluation value. However, this evaluation value may be used as is. Instead, it would be easy to take the spatial differential value of the evaluation value and use the difference in the degree of spatial change in the evaluation value, which expresses the strength distribution of the copper foil and the printed circuit board, as an evaluation measure. it is obvious.
以上説明したように本発明は、プリント板に照射したレ
ーザ光の散乱光を測定し、半径方向強度分布を求めるこ
とにより、プリント板の微小パターンを検査する際に正
反射光の強度の低下を伴なう銀箔の変色の影響を受けず
、銅箔表面が黒色化した場合でも検査ができるという効
果がある。As explained above, the present invention measures the scattered light of the laser beam irradiated onto the printed board and determines the radial intensity distribution, thereby detecting a decrease in the intensity of specularly reflected light when inspecting minute patterns on the printed board. This method has the advantage that it is not affected by the accompanying discoloration of the silver foil and can be inspected even if the surface of the copper foil turns black.
−ン。-n.
Claims (1)
るプリント板光学検査装置であって、検査すべきプリン
ト板を照射するレーザ光を出光しプリント板上を走査さ
せるレーザ光走査手段と、前記レーザ光走査手段で得ら
れるプリント板の反射光を結像しこの結像の半径方向の
強度分布を表現する評価値もしくはこの評価値の空間微
分値にもとづいて前記微小パターンの良否を判定する良
否判定手段とを備えて成ることを特徴とするプリント板
光学検査装置。A printed board optical inspection device for inspecting the quality of minute patterns arranged on a printed board, the device comprising: a laser beam scanning means for emitting a laser beam to irradiate the printed board to be inspected and scanning the printed board; and the laser beam A pass/fail judgment for forming an image of the reflected light from the printed board obtained by the optical scanning means and judging whether the minute pattern is good or bad based on an evaluation value expressing the intensity distribution in the radial direction of this image or a spatial differential value of this evaluation value. A printed board optical inspection device comprising: means.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21390790A JPH0495859A (en) | 1990-08-13 | 1990-08-13 | Optically inspecting apparatus for printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21390790A JPH0495859A (en) | 1990-08-13 | 1990-08-13 | Optically inspecting apparatus for printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0495859A true JPH0495859A (en) | 1992-03-27 |
Family
ID=16647004
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21390790A Pending JPH0495859A (en) | 1990-08-13 | 1990-08-13 | Optically inspecting apparatus for printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0495859A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5633121A (en) * | 1993-04-21 | 1997-05-27 | Fujitsu Limited | Method for examining surface of copper layer in circuit board and process for producing circuit board |
JP2007529878A (en) * | 2004-03-18 | 2007-10-25 | アクセリス テクノロジーズ インコーポレーテッド | In situ monitoring of rotating disk ion implanter |
US7753287B2 (en) | 2002-05-08 | 2010-07-13 | Fico Cables, S.A. | Cleaning system for headlamps of motor vehicles |
-
1990
- 1990-08-13 JP JP21390790A patent/JPH0495859A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5633121A (en) * | 1993-04-21 | 1997-05-27 | Fujitsu Limited | Method for examining surface of copper layer in circuit board and process for producing circuit board |
US7753287B2 (en) | 2002-05-08 | 2010-07-13 | Fico Cables, S.A. | Cleaning system for headlamps of motor vehicles |
JP2007529878A (en) * | 2004-03-18 | 2007-10-25 | アクセリス テクノロジーズ インコーポレーテッド | In situ monitoring of rotating disk ion implanter |
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