JPH0493042A - Recognition method of chip of semiconductor wafer - Google Patents

Abstract

PURPOSE:To recognize a chip without any wasteful movement and to prevent the chip from being recognized erroneously by a method wherein, on the basis of a chip arrangement data in a previously stored front-row data table, the chip is recognized only in a position where the chip on a semiconductor wafer is situated. CONSTITUTION:Chips 2 formed on a semiconductor wafer 1 are recognized while the semiconductor wafer 1 is being moved in the X-axis direction by an intercentral distance xc of the chips 2 in the X-axis direction and it is being removed in the Y-axis direction by an intercentral distance yc of the chips 2 in the Y-axis direction. At this time, on the basis of a chip arrangement data of the chips 2, the semiconductor wafer is moved only to positions where the chips of the semiconductor wafer 1 exist and the chips are recognized only in the positions. In this case, individual data such as a distance df from the central point 0 of the semiconductor wafer 1 to the center of the chip 2 which is recognized first, the movement data xc and yc as the intercentral distances of the chips 2, 2 in the X-axis direction and the Y-axis direction are stored in a control device used to recognize the chips 2 of the semiconductor chip 1.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] This invention provides a semiconductor wafer with a first axial direction and a second axis.
A semiconductor wafer that recognizes whether the chips of the semiconductor wafer are good or bad by recognizing the presence or absence of defective ink on the surface of the chips formed in a 7-trix array with respect to a second axis direction perpendicular to the axial direction. The present invention relates to a chip recognition method.

[Conventional technology]

Conventionally, when recognizing a chip, which is a semiconductor element, in the state of a semiconductor wafer, first movement data X in the X-axis direction (first axis direction) and Y-axis direction (second axis direction perpendicular to the first axis direction) is obtained. +yc and the radius R to the outermost circumferential chip area of the semiconductor wafer are input as parameters to a control device for chip recognition. Note that the above movement data X.

is set to a value corresponding to the distance between chip centers in the X-axis direction of the semiconductor wafer, and the movement data y. is set to a value corresponding to the distance between chip centers in the Y-axis direction of the semiconductor wafer.

In the conventional semiconductor wafer chip recognition method, as shown in FIG.
Let the center point 0 be the X-Y coordinates (0, O), and let the position of an arbitrary stopping point (for example, corresponding to the position directly below the image sensor for chip recognition) be the coordinates (x, y). Then, if the position after moving the semiconductor wafer 1 in the X-axis direction by the movement data XC is the coordinate (x', y), then the (1st ) Check with the formula.

x'''+y2<R2... (1) If the above equation holds true, move to the next point.For example, if the current position is 0 point, the equation (1) holds, so move to the next 0 point. Move to a point.

If the above equation (1) does not hold (for example, when the current position is at point A and the semiconductor wafer 11 is moved as shown by arrow A), from the current position of coordinates (Xy) to the arrow Movement data y as shown in A. The position after being moved by the distance is the coordinate (X.

y'), it is checked by equation (2) whether the position after movement exceeds the movement range.

x2 +y' 2 <R2... (2) If the above formula holds true, the coordinates (x
, y') in the X-axis direction by xc l, check whether each point exceeds the movement range, move it to the limit position within the movement range, and move in the X-axis direction. Reverse direction.

If the above equation (2) does not hold (for example, if the current position is the point B), as shown by the arrow B1 extending from the point B, X When moving in the opposite direction to the axial direction, the moving direction in the X-axis direction is reversed by checking whether it is within the moving range or not, and then moving to a position within the moving range.

Note that the X mark on the arrow in FIG. 3 means that if you move in that direction, you will be out of the movement range.

In this way, the semiconductor wafer 1 is moved within the radius R.
1 was not moved, so the chips in that area were recognized.

[Problem to be solved by the invention]

However, according to the semiconductor wafer chip recognition method described above, when considering the variation in the position of the center point O of the semiconductor wafer 11, it is necessary to set the value of the radius R that determines the movement range to a large value. In addition, the chip 12 of the semiconductor wafer 11
Depending on the arrangement state, chip recognition is performed even in the area within the radius R that is not used as a chip.

Therefore, there is a problem in that a wasteful chip recognition operation is performed and it takes time to recognize the chips on the entire semiconductor wafer 11.

In addition, chipped or chipped parts around the periphery of the semiconductor wafer 11 have not been processed into chips and may have a surface or mirror surface, making it difficult to recognize whether it is defective ink or being mistakenly treated as a good product. there were.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a semiconductor wafer chip recognition method that can perform chip recognition without unnecessary operations and can prevent erroneous chip recognition.

[Means to solve the problem]

In the semiconductor wafer chip recognition method of the present invention, the semiconductor wafer has a first axial direction and a second axial direction orthogonal to the first axial direction.
The semiconductor wafer is moved in the first axis direction by the distance between the chip centers in the first axis direction, and the chips formed in a matrix alignment state in the axial direction are moved in the first axis direction. At the time of recognition while moving each chip in the second axis direction, chip array data indicating the existing position of the chip on the semiconductor wafer is stored in advance in an array data table, and the chip array data is used based on the chip array data in the array data table. The semiconductor wafer is characterized in that chips are recognized only at positions where chips exist on the semiconductor wafer.

[For production]

According to the configuration of the present invention, chips are recognized only at the positions where chips exist on the semiconductor wafer based on the chip array data stored in advance in the array data table, so that there is no waste and no erroneous recognition. This makes it possible to perform fewer recognition operations.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. In this embodiment of the semiconductor wafer chip recognition method, as shown in FIG.
The semiconductor wafer 1 is aligned in the X-axis direction (first axis direction) and the Y-axis direction (second axis direction) perpendicular to the X-axis direction. Distance between centers of chips 2 (See Figure 1 (b))
While moving in the X-axis direction, the distance y between the centers of the chips 2 in the Y-axis direction. When recognizing the chips 2 on the semiconductor wafer 1 as shown in FIG. 1(C) while moving them in the Y-axis direction (see FIG. 1(b)),
The chip array data indicating the existing position of the chip is stored in the array data table in advance, and the chip is moved only to the position where the chip exists on the semiconductor wafer l based on the chip array data in the array data table, and the chip is placed only at that position. It is characterized by recognition.

In this case, the control device for recognizing the chips 2 on the semiconductor wafer 1 includes, in addition to the array data table, the distance df from the center point 0 of the semiconductor wafer 1 to the center of the chip 2 that is first recognized; Axial and Y-axis tip 2.2
Movement data X, which is the center-to-center distance. and 3'c are stored.

This semiconductor wafer chip recognition method will be described in detail below.

The shaded portion in FIG. 1(a) is a portion of the semiconductor wafer 1 that is not used as a chip, and the other portions are portions that are used as a chip 2. Figure 1(b) is Figure 1(a)
is an enlarged view of a portion of movement data XC and y. It shows.

FIG. 1(C) shows an array data table storing chip array data in which the chip 2 portion is 'l'' and the non-chip portion is 0'' in the semiconductor wafer 1. This corresponds to the position of the chip 2 on the semiconductor wafer 1 shown in FIG. 1(a). The data array of the array data table has a size of n pieces in the column direction and a size of m pieces in the row direction, where n and m are the numbers of chips 2 in the Y-axis direction and the X-axis direction in the semiconductor wafer 1. It is larger.

The control device for chip recognition recognizes the chip 2 by moving only to the position where the chip 2 is present based on the array data table shown in FIG. 1(C).

In addition to this array data, the control device also contains the movement data df of the chip 2 that is first recognized, as described above.
, the distance X between the centers of the chips 2 of the semiconductor wafer 1 in the X and Y directions. and y.

is input.

First, the semiconductor wafer 1 is moved by the movement data df,
In the 0th row of the array data, the first point where the data is viewed starting from the 0th column, the 3rd column (column 9th row) in Figure 1 (C)
Proceed to position (3,0) of coordinates. Hereinafter, the position of the array data will be expressed by the coordinates of (column, 1 row).

The movement order is as indicated by the arrows in FIG. 1(a).

When the current position is the coordinates (x, y) of the array data,
When advancing to the runner-up, formula (3) and (4) must be
) Check the formula.

Direction of movement of X Child direction (x + a, y) - "V° ・ ・ (3) However, a is decreased by l until formula (3) holds within the range of X - a ≧ 0. Fig. 2 (a), (C))
Direction of movement of X/One direction (x+a, y) −'“Bi’ ・・・・・・(
4) Then, a is increased by 1 until the formula (4) is satisfied in the range of x+a≦n. Figure 2 (b), (d)
) If the above equations (3) and (4) are satisfied, move data X from the current position. 8 times in the direction opposite to the sign of the value a. In other words, in the non-chip position,
It does not stop and moves steadily to the next chip 2 position.

If the equations (3) and (4) do not hold, then the equation (5)
) Check the formula.

All data in the rows y-z are ``0''''... (5) If the above equation (5) is satisfied, the recognition process of the semiconductor wafer being processed is terminated.

If the above formula (5) does not hold, y is increased over y, the direction of movement of X is reversed, and formulas (3) and (4)
) Check the formula. The pig y is moved to the position where the equation (3) or the equation (4) is satisfied by 8 times the movement data XC in the direction opposite to the sign of the value a, and the pig y is moved in one direction. Move the height.

As described above, the chip 2 is moved from one location to the next location all at once, and the chip 2 is recognized each time it is moved. In other words, the chip 2 is recognized only at the position used as the chip 2.

〔Effect of the invention〕

According to the semiconductor wafer chip recognition method of the present invention, chips are recognized only at positions to be used as chips by referring to the array data table, so that efficient operation is possible, and parts that are not used for chips are used as chips. It is possible to eliminate misrecognition caused by

[Brief explanation of drawings]

FIG. 1(a) is a plan view of a semiconductor wafer for explaining a semiconductor wafer chip recognition method according to an embodiment of the present invention;
FIG. 1(b) is an enlarged view of a part of FIG. 1(a), FIG. 1(C) is an explanatory diagram showing the array data of the location corresponding to the semiconductor wafer, and FIGS. 2(a) and (b). ) is a plan view of a semiconductor wafer showing the steps of the semiconductor wafer chip recognition method, and FIGS. 2(C) and (d) are respectively FIG. 2(a).
), FIG. 3 is a plan view of a semiconductor wafer showing a conventional semiconductor wafer chip recognition method.

Claims (1)

[Scope of Claims] Chips formed on a semiconductor wafer in a matrix-like alignment with respect to a first axis direction and a second axis direction orthogonal to the first axis direction; While moving in the first axis direction by the distance between the centers,
When recognizing the chip while moving it in the second axis direction by the distance between the chip centers in the axial direction, chip array data indicating the existing position of the chip on the semiconductor wafer is stored in advance in an array data table, and the chip array data is stored in the array data table in advance. A method for recognizing chips on a semiconductor wafer, characterized in that chips are recognized only at positions of the semiconductor wafer where chips exist based on chip array data therein.