JPH0474605A - Punching method - Google Patents

Abstract

PURPOSE:To enable a machining to be performed mechanically and safely positively by the use of a pair of molds that have a desired configuration through a marking-off and are comprised of a protruded mold slightly smaller than the desired configuration and a recessed mold slightly larger than the desired configuration, and thereby punching out a plane material. CONSTITUTION:A semiconductor wafer 1 of GaAs or the like that is made with an approximately circular laying out line 3 of about 50mm in diameter and about 0.1mm in depth and has a diameter of 100mm or below (for example 70mm) and a thickness of the order of 0.5 - 1mm is mounted on a support table 2, and secured thereto through vacuum attraction. The outer configuration of a lower mold is made inside about 1 - 2mm of the marking-off line nearly along the laying out line. The lower mold is a doughnut shape in the case of punching out a generally circular piece, and the distances from the outer diameter 2a of the support table 2 of the lower mold and the inner diameter 5a of the upper mold 5 from the marking-off line 3 are determined 1 - 2mm respectively. A driving recessed upper mold 5 is slowly moved downward and brought into contact with the semiconductor wafer 1. In this manner, the wafer is severed into the desired configuration of the marking-off line 3 and thus a generally circular wafer is obtained. In this instance, the severing process of a semiconductor wafer or the like can be done by machines, resulting in shortening the work time and reducing cracks in the wafer.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a punching method, and particularly to a processing method for punching a brittle, low-toughness flat plate such as a semiconductor wafer into a predetermined shape, for example, a circle. .

[Conventional technology]

Cutting of semiconductor wafers and the like is performed as a pre-process for processing irregularly shaped wafers other than circular ones into circular wafers.

Conventionally, as a method for cutting irregularly shaped wafers, a scriber (scriber) is used to create a predetermined scribe line on the wafer, and then the semiconductor wafer is manually grasped on both sides of the scribe line and carefully split.

[Problem to be solved by the invention]

As mentioned above, the cutting of irregularly shaped semiconductor wafers has traditionally been done manually, but such manual work requires skill and varies from person to person.
Since the process is done manually, it takes time, and there are problems such as cracks occurring near the cutting process of the semiconductor wafer and the risk of injury to the hands.

The present invention solves the above problems, and aims to provide a processing method that is free from individual differences and has improved efficiency.

[Means to solve the problem]

According to the present invention, when punching a brittle and low-toughness flat material into a desired shape, the above-mentioned problem is solved by performing marking line processing on the flat material in the desired shape,
Punching the flat material using a pair of dies: a convex die having the desired shape and slightly smaller than the desired shape, and a concave die having the desired shape and slightly larger than the desired shape. This problem is solved by a punching method characterized by:

In the present invention, a semiconductor wafer such as GaAs is preferably used as a brittle and flat plate-like material having low toughness.

Further, it is effective that the above-mentioned slight distance is 1 to 2 mm because processing errors of the marking lines can be absorbed and no undue force is applied to the semiconductor wafer.

[For production]

According to the present invention, rough circular punching of semiconductor wafers, etc. can be performed mechanically, safely and reliably, and it can also contribute to improved productivity. In the present invention, only a rough circular shape is shown in the embodiment, but it is possible to punch out a variety of shapes such as a rectangular shape and a trapezoid shape.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

1 and 2 are schematic diagrams for carrying out the method of the present invention and a partially enlarged cross-sectional view (plane BB) of FIG. 1. Further, FIG. 3 is a perspective view for explaining the present invention in detail.

As shown in Figures 2 and 3, a roughly circular marking line 3 with a diameter of approximately 50 cm is placed at a depth of approximately 0.1 degrees, with a diameter of 100 mm.
A semiconductor wafer 1 of GaAs or the like having a thickness of about 0.5 to 1 m (about 70 mm) is placed on a support base 2 and fixed by vacuum suction.

As can be clearly seen in FIGS. 1 and 3, the support base 2 serves as a lower mold for a circular upper mold 5.

The outer shape of the lower die 2 is shaped to follow the intended marking line for punching, and is approximately 1 to 2 m inside the marking line.

Semiconductor wafer 1 and support stand 2 are arranged in this manner and processed using the punching apparatus shown in FIG. The upper die 5 of the punching device shown in FIG. 1'' has a donut shape as shown in FIG. and the upper mold 5
The respective positional relationships are clearly shown in FIG.

In this example, from the marking line 3 to the outer diameter 2 of the lower die support stand 2
The distances between a and the inner diameter 5a of the upper die 5 are each 1 to 2 m. From this arrangement, the drive concave upper die 5 is slowly lowered by the motor 4 or the like, and when it comes into contact with the semiconductor wafer, the wafer 1 is cut along the desired scribe line 3 shape to obtain a roughly circular wafer.

〔Effect of the invention〕

As explained above, according to the present invention, cutting of semiconductor wafers, etc. can be performed by a machine, and it is expected that working time can be shortened and cracking of wafers can be reduced.

In addition, by mechanizing the work of marking lines,
This process can now be completely automated, resulting in significant labor savings.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram for carrying out the method of the present invention, FIG. 2 is a partially enlarged sectional view (B-B plane) of FIG. 1, and FIG. 3 is a detailed explanation of the present invention. FIG. DESCRIPTION OF SYMBOLS 1... Semiconductor GaAs wafer, 2... Support stand (lower mold: convex shape), 3... Marking line, 4... Motor, 5...
Upper mold (concave)

Claims (1)

[Claims] 1. When punching a brittle, low-toughness flat material into a desired shape, marking the desired shape on the flat material;
Punching the flat material using a pair of dies: a convex die having the desired shape and slightly smaller than the desired shape, and a concave die having the desired shape and slightly larger than the desired shape. A punching method characterized by: 2. The method according to claim 1, characterized in that the flat material is fixed in a convex shape. 3. The method of claim 1, wherein the brittle, low-toughness planar material is a semiconductor wafer. 4. A method according to claim 1, characterized in that said slight distance is 1-2 mm.