JPH04369231A - Fabrication of semiconductor device - Google Patents

Abstract

PURPOSE:To provide an encapsulation technique by which regions to be encapsulated and the thickness of an encapsulation are readily controlled without producing a resin dam. CONSTITUTION:By the use of two types of fluid resins, possessing the same curing characteristics, but being different from each other in thixotropic properties, a resin 5 with high thixotropic properties is used to control regions to be encapsulated, and another resin 4, with low thixotropic properties, is used to control the thickness of an encapsulation.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device, and more particularly to a method of sealing a semiconductor element.

0002

[Prior Art] Generally speaking, potting methods and printing methods are mainstream as methods for sealing semiconductor elements with liquid resin. It is applied to the entire sealing area of the carrier and molded by heat curing.

0003

[Problems to be Solved by the Invention] In this case, if a liquid resin with low thixotropy and easy to spread is used, the spreading after potting will be large, and although the sealing thickness can be reduced, the sealing This makes it difficult to control the stopping area (see Figure 3).

On the other hand, if a resin with high thixotropy and difficult to spread is used, it is possible to reduce the sealing area because the spread after potting is small, but it is difficult to apply a thin layer, and the sealing area is small. The thickness increases (see Figure 4).

[0005]Also, there is a method (Fig. 5) in which the sealing area is controlled by providing a resin dam on the pattern and using a resin with low thixotropy, but this method requires a step of providing the resin dam, and There are drawbacks such as reliability problems due to differences in the characteristics of the dam and the sealing resin.

SUMMARY OF THE INVENTION The present invention aims to solve the above-mentioned drawbacks of the prior art, and particularly to provide a sealing method in which the sealing area and sealing thickness can be easily controlled without creating a resin dam.

[0007]

[Means for Solving the Problems] The present invention uses two types of liquid resins with the same cured product properties but different thixotropy, controls the sealing area with the resin with high thixotropy, and uses a resin with low thixotropy. The feature is that the sealing thickness is controlled by resin.

[0008]

[Example] Hereinafter, an example will be explained using a tape carrier package.

FIG. 1 shows a process diagram of the sealing method according to the present invention.

A resin 5 having high thixotropy (resin does not easily spread) is applied around the sealing area using a drawing method using a potting device 3 (FIGS. 1(a) and 2).

Next, a resin 4 with low thixotropy (easily spreadable) is applied to the area surrounded by the resin 5 with high thixotropy (FIG. 1(b)).

[0012] The resin 4 and the resin 5 are placed in a curing furnace and cured at the same time (FIG. 1(c)).

The thixotropic properties of a resin can be changed by slightly changing the particle size distribution of the filler (eg, silica) in the resin (eg, epoxy resin) without affecting the properties after curing. It is possible.

Although the above embodiments were carried out using a potting device, the coating of the resin with low thixotropy may also be performed using a printing device.

Furthermore, the present invention can be implemented in a COB as well.

[0016]

[Effects of the Invention] According to the present invention, it is possible to provide a sealing method in which the sealing area and sealing thickness can be easily controlled without creating a resin dam.
The accuracy of control of the resin region can be improved.

- Since the properties are the same after curing, reliability is improved compared to when a resin dam is used.

[0018] By installing another potting device in front of the conventional sealing device, the manufacturing process can be easily created and the step of creating a resin dam can be omitted.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of the sealing process according to the invention.

FIG. 2 is a plan view of FIG. 1(a).

FIG. 3 is a cross-sectional view of a conventional technique (when a resin with low thixotropy is used).

FIG. 4 is a cross-sectional view of a conventional technique (when a highly thixotropic resin is used).

FIG. 5 is a cross-sectional view of a conventional technique (when using a resin dam).

[Explanation of symbols]

1 Semiconductor element 2 Inner lead 3 Potting device 4 Resin (low thixotropic resin) 5 Resin (high thixotropic resin) 6 Resin dam

Claims (1)

[Claims] 1. A method for manufacturing a semiconductor device, comprising sealing a semiconductor element using two types of resins having the same cured product properties but different liquid properties.