JP7509092B2 - DRESSING PLATE AND DRESSING METHOD - Google Patents

Description

The present invention relates to a dressing plate that is sandwiched between an upper platen side polishing cloth and a lower platen side polishing cloth that are attached to the upper platen and the lower platen side polishing cloth, respectively, of a double-sided polishing machine, for dressing the polishing cloth, and a dressing method using such a dressing plate.

Double-sided polishing machines usually use the so-called 4-way system, which has an upper and lower platen with polishing cloth made of nonwoven fabric or urethane foam attached, and a planetary gear structure with a sun gear in the center and an internal gear on the periphery. When polishing silicon wafers, the wafer is inserted and held inside a wafer holding hole formed in the carrier. Polishing slurry is supplied to the wafer from the upper platen, and the upper and lower plates are rotated to press the opposing polishing cloths of the upper and lower plates against both the front and back sides of the wafer, while the carrier is rotated around the sun gear and internal gear, allowing both sides of each wafer to be polished simultaneously.

Double-sided polishing machines can polish both sides of a wafer simultaneously, but there is a problem in that the wafer shape gradually changes if polishing is continued using the same polishing cloth. This is mainly due to the life of the polishing cloth, and is influenced by changes in the compression rate of the polishing cloth and clogging. Therefore, to prevent changes in the wafer shape, the surface of the polishing cloth is dressed after changing the polishing cloth and at specified intervals (regularly).

Traditionally, dressing has been performed using a diamond dresser in which a grinding wheel such as diamond is fixed to a plate by electroplating or adhesive. Such diamond dressers are placed between an upper platen and a lower platen, with the surface to which the diamond is fixed alternately on the upper platen side and the lower platen side, and the device is operated in the same way as for normal polishing, so that both the upper and lower polishing cloths are dressed simultaneously. This scrapes off or roughens the surface of the polishing cloth, improving the retention of the slurry on the polishing cloth and maintaining the polishing ability. This type of dressing suppresses changes over time such as clogging of the polishing cloth and maintains the surface condition of the polishing cloth in good condition, thereby maintaining the precision of the removal amount and flatness, and making it possible to stably obtain wafers with high flatness.

Patent Document 1 proposes a dressing device in which the dressing surface contacts the polishing cloth at an angle adjusted according to the shape of the platen when dressing, so that the diamond dresser can uniformly dress the polishing cloth.

JP 2004-090142 A

Figure 9 shows a top view and a cross-sectional view of a conventional dressing plate 20, and Figure 10 shows a cross-sectional view of the dressing plate 20 and polishing pad when dressing is performed using the conventional dressing plate 20. Conventional dressing plates 20 include those in which particulate diamond particles 4 are directly fixed to only one side of the plate 21 by electroplating or adhesive, as well as those in which pellet-type particles are fixed to the plate. The grit size of the diamond particles 4 ranges from #60 to #500, and there are non-aligned and aligned types.

The dressing plate 20 has a gear shape that contacts the internal gear pin 30 and the sun gear pin 31 on its outer periphery, and contacts the lower platen (or the lower platen side polishing cloth) by its own weight. Such a dressing plate 20 is used by inverting it so as to correspond to the upper platen side polishing cloth 3A and the lower platen side polishing cloth 3B (FIGS. 10(a) and (b)). As shown in FIG. 11, a double-sided polishing machine 200 in which such a dressing plate 20 is arranged is used to simultaneously dress the upper platen side polishing cloth 3A and the lower platen side polishing cloth 3B attached to the upper platen 1 and the lower platen 2, respectively, with the dressing plate 20 equipped with diamond particles 4 on one side, in order to sharpen the surfaces of the upper platen side polishing cloth 3A and the lower platen side polishing cloth 3B, such as hard foamed urethane pads. The polishing cloth is dressed when the polishing cloth is raised and at a certain interval between processing.

The shape of the platen itself is usually convex on the upper platen side and concave on the lower platen, so as dressing progresses, the shape of the polishing cloth becomes flatter with a weaker convex shape on the upper platen side and flatter with a weaker concave shape on the lower platen side. Because the shape of the polishing cloth changes due to dressing in this way, the load distribution during wafer polishing differs between the beginning and end of the polishing cloth's life, resulting in the problem that the shape of the wafer after polishing will differ even if polishing is performed under the same conditions.

The inventors focused on the fact that the shape of the polishing cloth changes due to dressing because the dressing plate does not follow the shape of the table, and so the shape of the polishing cloth changes when it is ground away with diamond, and after extensive research, they completed the present invention.

The present invention has been made to solve the above problems, and aims to provide a dressing plate that can suppress changes in the shape of the polishing cloth caused by dressing, and a dressing method that can suppress changes in the shape of the polishing cloth caused by dressing, in order to obtain a flat wafer shape without adjusting the polishing conditions of the wafer being processed.

The present invention has been made to achieve the above object, and provides a dressing plate that is sandwiched between an upper platen side polishing cloth and a lower platen side polishing cloth affixed to the upper platen and lower platen, respectively, of a double-sided polishing machine, for dressing the upper platen side polishing cloth and/or the lower platen side polishing cloth, the dressing plate comprising a disk-shaped diamond fixing plate having diamond particles arranged on its upper or lower surface, an annular connecting member made of flexible rubber fixed to the outer periphery of the diamond fixing plate, and an annular support plate fixed to the connecting member and connected to the diamond fixing plate via the connecting member.

With this type of dressing plate, the dressing plate can grind the polishing cloth with a pressure distribution that follows the shape of the platen, making it possible to suppress changes in the shape of the polishing cloth caused by dressing. Furthermore, even if the number of dressing cycles increases, the change in the shape of the polishing cloth attached to the upper and lower platens is small, making it possible to obtain a flat wafer shape without adjusting the polishing conditions for the wafer being processed.

In this case, the dressing plate can be one in which, when the dressing plate is placed on the lower platen side polishing cloth, a space is formed between the lower surface of the diamond fixing plate and the lower platen side polishing cloth in a state where no load is applied.

This allows it to more effectively follow the shape of the base.

In this case, the dressing plate for the upper platen side polishing cloth can be a dressing plate in which the diamond particles are arranged on the upper surface of the diamond fixing plate, and the dressing plate for the lower platen side polishing cloth can be a dressing plate in which the diamond particles are arranged on the lower surface of the diamond fixing plate.

By using different dressing plates for the upper and lower polishing cloths, it is possible to more effectively conform to the shape of the polishing plate and perform dressing more reliably.

In this case, the dressing plate for the upper platen side polishing cloth can be a dressing plate in which the diamond particles are arranged on an annular protrusion provided on the upper surface of the diamond fixing plate, and the dressing plate for the lower platen side polishing cloth can be a dressing plate in which the diamond particles are arranged on an annular protrusion provided on the lower surface of the diamond fixing plate.

This allows for more stable and effective dressing.

At this time, a dressing plate is sandwiched between the upper platen side polishing cloth and the lower platen side polishing cloth attached to the upper platen and the lower platen side polishing cloth, respectively, of the double-sided polishing machine, and the upper platen side polishing cloth and/or the lower platen side polishing cloth are dressed in a dressing method in which the dressing plate described above is used, the dressing plate is not rotated around its axis, and the upper platen and the lower platen are rotated while the dressing is performed.

This allows the dressing plate to grind the polishing cloth with a pressure distribution that follows the shape of the platen, making it possible to suppress changes in the shape of the polishing cloth caused by dressing. Even if the number of dressing cycles is increased, changes in the shape of the polishing cloth attached to the upper and lower plates can be minimized, making it possible to obtain a flat wafer shape without adjusting the polishing conditions for the wafer being processed.

In this case, a dressing method can be used in which dressing plates for the upper platen side polishing cloth and dressing plates for the lower platen side polishing cloth are arranged alternately.

This allows for more stable and uniform dressing.

As described above, the dressing plate of the present invention makes it possible to suppress changes in the shape of the polishing cloth caused by dressing. And since the change in the shape of the polishing cloth attached to the upper and lower plates is small even if the number of dressings is increased, it is possible to obtain a flat wafer shape without adjusting the polishing conditions for the wafer to be processed. Also, the dressing method of the present invention makes it possible to suppress changes in the shape of the polishing cloth caused by dressing. And since the change in the shape of the polishing cloth attached to the upper and lower plates is small even if the number of dressings is increased, it is possible to obtain a flat wafer shape without adjusting the polishing conditions for the wafer to be processed.

2A and 2B are a top view and a cross-sectional view of a dressing plate for an upper platen side polishing cloth according to the present invention. 2 is a locally enlarged cross-sectional view of a dressing plate for an upper platen side polishing cloth according to the present invention; FIG. 2A and 2B are a bottom view and a cross-sectional view of a dressing plate for a lower platen side polishing cloth according to the present invention. 3 is a locally enlarged view of a lower platen side polishing cloth dressing plate according to the present invention; FIG. 1 shows a double-sided polishing apparatus equipped with a dressing plate according to the present invention. The results of Example 1 (polishing cloth shape and polished wafer shape) are shown. The results of Comparative Example 1 (polishing cloth shape and polished wafer shape) are shown. 4 shows the evaluation results of flatness of the polished wafer of Example 2. 1 shows the evaluation results of flatness of the polished wafer of Comparative Example 2. 1 shows a conventional dressing plate. 1 shows a conventional dressing plate in use. 1 shows a double-sided polishing apparatus equipped with a conventional dressing plate. FIG. 13 is a diagram for explaining a portion where a dressing plate is arranged.

The present invention is described in detail below, but is not limited to these.

As mentioned above, there was a need for a dressing plate that could suppress changes in the shape of the polishing cloth caused by dressing, in order to obtain a flat wafer shape without adjusting the polishing conditions for the wafer being processed.

After extensive research into the above-mentioned problem, the inventors discovered that a dressing plate for dressing the upper and/or lower polishing cloths, which is sandwiched between the upper and lower polishing cloths attached to the upper and lower polishing plates of a double-sided polishing machine, can suppress changes in the shape of the polishing cloth caused by dressing, and that the dressing plate includes a disk-shaped diamond fixing plate having diamond particles arranged on the upper or lower surface, an annular connecting member made of flexible rubber fixed to the outer periphery of the diamond fixing plate, and an annular support plate fixed to the connecting member and connected to the diamond fixing plate via the connecting member, and that because the change in the shape of the polishing cloths attached to the upper and lower plates is small even with an increase in the number of dressings, a flat wafer shape can be obtained without adjusting the polishing conditions for the wafer to be processed, and thus completed the present invention.

The following explanation will be given with reference to the drawings.

(Double-sided polishing machine)
First, the double-sided polishing apparatus according to the present invention will be described. FIG. 5 shows a double-sided polishing apparatus 100 in which a dressing plate according to the present invention is arranged. As shown in FIG. 5, the double-sided polishing apparatus 100 according to the present invention includes an upper platen 1 and a lower platen 2, an upper platen side polishing cloth 3A and a lower platen side polishing cloth 3B attached to the upper platen 1 and the lower platen 2, respectively, and a dressing plate 10 according to the present invention arranged so as to be sandwiched between the upper platen side polishing cloth 3A and the lower platen side polishing cloth 3B. FIG. 5 shows an example in which a dressing plate 10A for the upper platen side polishing cloth and a dressing plate 10B for the lower platen side polishing cloth are arranged as the dressing plate 10. Note that FIG. 5 shows the double-sided polishing apparatus when performing dressing, but when polishing a wafer, a wafer to be processed is arranged instead of the dressing plate 10 (10A, 10B).

[Dressing plate]
Next, the dressing plate according to the present invention will be described. The dressing plate 10 according to the present invention is a disk-shaped diamond fixing plate with diamond particles arranged on the upper or lower surface, and a circular support plate fixed to a connecting member and connected to the diamond fixing plate via the connecting member, which are connected by a circular connecting member made of flexible rubber. In the present invention, the dressing plate for dressing the upper surface plate side polishing cloth 3A and the dressing plate for dressing the upper surface plate side polishing cloth 3B are preferably made to have a structure suitable for each, rather than being made by flipping the same shape of the dressing plate upside down as in the past.

(Dressing plate for upper platen side polishing cloth)
Fig. 1 shows a top view and a cross-sectional view of a dressing plate 10A for an upper platen side polishing cloth, and Fig. 2 shows a locally enlarged cross-sectional view of the dressing plate 10A for an upper platen side polishing cloth.

As shown in FIG. 1, the dressing plate 10A for the upper surface plate side polishing cloth includes a disk-shaped diamond fixing plate 11A, an annular connecting member 12A, and an annular support plate 13A. Diamond particles 4 are arranged on the upper surface of the diamond fixing plate 11A. The connecting member 12A is made of flexible rubber, but the materials constituting the diamond fixing plate 11A and the support plate 13A are not particularly limited, and the same materials as those of conventional dressing plates can be used. The connecting member 12A is not particularly limited as long as it is flexible rubber, but for example, one with a Shore A hardness of 85 degrees or more can be used, and it may have a core material such as cloth inside. The grit of the diamond particles 4 can be #60 to #500.

As shown in Figures 1 and 2, it is preferable to place the diamond particles 4 on the annular protrusion 14A provided on the upper surface of the diamond fixing plate 11A. This allows for more stable and effective dressing.

As shown in FIG. 2, when the dressing plate 10A for the upper platen side polishing cloth is placed on the lower platen side polishing cloth 3B, it is preferable that a space 15A is formed between the lower surface of the diamond fixing plate 11A and the lower platen side polishing cloth 3B in a state where no load is applied. This makes it more effective to follow the shape of the upper plate. In this case, when the dressing plate 10A for the upper platen side polishing cloth is placed on the double-sided polishing apparatus 100, in a state where no load is applied to the dressing plate 10A for the upper platen side polishing cloth, the diamond particles 4 on the upper surface are in contact with the upper platen side polishing cloth 3A but are not strongly pressed, and the lower surface of the diamond fixing plate 11A of the dressing plate 10A for the upper platen side polishing cloth does not contact the lower platen side polishing cloth 3B and is in a floating state. Therefore, a space margin can be secured when the annular connecting member 12A bends and deforms to follow the shape of the upper platen 1.

(Dressing plate for lower platen side polishing cloth)
Fig. 3 shows a bottom view and a cross-sectional view of the dressing plate 10B for the lower polishing cloth on the lower surface plate side. Fig. 4 shows a local enlarged cross-sectional view of the dressing plate 10B for the lower polishing cloth on the lower surface plate side. Note that the description of the same matters as those of the dressing plate 10A for the upper polishing cloth on the upper surface plate side may be omitted as appropriate.

As shown in FIG. 3, the dressing plate 10B for the lower platen side polishing cloth includes a disk-shaped diamond fixing plate 11B, an annular connecting member 12B, and an annular support plate 13B. Diamond particles 4 are arranged on the underside of the diamond fixing plate 11B.

At this time, as shown in Figures 3 and 4, it is preferable to place the diamond particles 4 on the annular protrusion 14B provided on the underside of the diamond fixing plate 11B. This allows for more stable and effective dressing.

As shown in FIG. 4, when the dressing plate 10B for the lower platen side polishing cloth is placed on the lower platen side polishing cloth 3B, it is preferable that a space 15B is formed between the lower surface of the diamond fixing plate 11B and the lower platen side polishing cloth 3B in a state where no load is applied. This makes it more effective to follow the shape of the lower plate. In this case, when the dressing plate 10B for the lower platen side polishing cloth is placed on the double-sided polishing apparatus 100, in a state where no load is applied to the dressing plate 10B for the lower platen side polishing cloth, the upper surface of the dressing plate 10B for the lower platen side polishing cloth is in contact with the upper platen side polishing cloth 3A, but the diamond particles 4 on the lower surface are in a floating state at a position where they do not contact the lower platen side polishing cloth 3B, and are not strongly pressed. Therefore, a space margin can be secured when the annular connecting member 12B bends and deforms to follow the shape of the lower platen 2.

The structure connecting the diamond fixing plates 11A, 11B, the connecting members 12A, 12B, and the support plates 13A, 13B is preferably such that the support plates 13A, 13B suspend the diamond fixing plates 11A, 11B with the connecting members 12A, 12B.

The method of fixing the disk-shaped diamond fixing plates 11A, 11B, the annular connecting members 12A, 12B, and the annular support plates 13A, 13B is not particularly limited. For example, they can be fixed and connected by screws, etc.

(Dressing method)
Next, the dressing method according to the present invention will be described. When a dressing plate is sandwiched between the upper platen side polishing cloth and the lower platen side polishing cloth attached to the upper platen and the lower platen of a double-sided polishing machine, and the upper platen side polishing cloth and/or the lower platen side polishing cloth are dressed, the dressing method according to the present invention uses the dressing plate according to the present invention described above, but the dressing plate does not rotate orbitally, and the upper platen and the lower platen are rotated while dressing. By stopping the rotation of the internal gear and the sun gear and not rotating orbitally of the dressing plate, the effect of averaging the platen shape is reduced, and the dressing plate 10 (10A, 10B) according to the present invention can achieve the contact between the diamond and the polishing cloth following the platen shape.

Although dressing may be performed on only one of the upper and lower polishing cloths, it is preferable to simultaneously dress the upper and lower polishing cloths 3A and 3B using both the dressing plate 10A for the upper polishing cloth and the dressing plate 10B for the lower polishing cloth. In this case, it is preferable to alternately arrange the dressing plate 10A for the upper polishing cloth and the dressing plate 10B for the lower polishing cloth for dressing. Specifically, the dressing plate 10A for the upper polishing cloth can be arranged at the installation positions P1 and P3 shown in FIG. 12, and the dressing plate 10B for the lower polishing cloth can be arranged at the installation positions P2 and P4. The number of dressing plates to be arranged is not particularly limited.

The dressing conditions are not particularly limited. As an example, when two dressing plates 10A for the upper platen side polishing cloth and two dressing plates 10B for the lower platen side polishing cloth are alternately placed between the plates, the rotation of the internal gear and the sun gear can be stopped, and dressing can be performed with a load of 60 to 100 g/ ^cm2 , with the upper and lower platen rotating at 5 to 20 rpm, and pure water being supplied.

The present invention will be described in detail below with reference to examples, but the present invention is not limited thereto.

[Example 1, Comparative Example 1]
First, in Example 1, dressing was performed using a dressing plate according to the present invention, and in Comparative Example 1, dressing was performed using a conventional dressing plate. The difference in the shape of the polishing cloth at the beginning and end of dressing, and the shape evaluation of the polished wafer (cross-sectional shape, GBIR) were evaluated and compared.

Example 1
The dressing plate used in Example 1 was a diamond fixing plate and a support plate fixed with screws via a diaphragm (connecting member) with a rubber hardness (Shore A hardness) of 85° or more and containing a cloth core material. The diamond fixing plate was a plate with a ring-shaped protrusion to which diamonds were directly fixed in a donut shape. The dressing plate for the upper surface plate side was a plate that holds the diamond fixing plate in a hollow state so that the surface of the diamond fixing plate that does not have diamonds does not come into contact with the lower surface plate pad. The dressing plate for the lower surface plate side was a plate that holds the diamond fixing plate in a hollow state so that the surface of the diamond fixing plate that has diamonds does not come into contact with the lower surface plate pad. Two dressing plates for the upper platen and two dressing plates for the lower platen were alternately placed between the upper and lower platens, the rotation of the internal gear and sun gear was stopped, and the dressing plates were not rotated.The upper platen was rotated at 5.2 rpm and the lower platen at 16.0 rpm, and dressing was performed while supplying pure water at a load of 100 g/ ^cm2 .

(Comparative Example 1)
As conventional dressing plates, four integrated dressing plates of the same shape as shown in Figure 9 were used, and the dressing plates were arranged in an alternately inverted manner so that they were used for the polishing cloth on the upper platen and the polishing cloth on the lower platen, and dressing was performed while the dressing plates revolved around themselves and the upper and lower plates rotated.

(Polishing pad shape measurement)
The conditions for measuring the shape of the polishing pad after dressing are as follows.
Measuring instrument: Straightness and shape measuring instrument (HSS) manufactured by Hitachi Zosen Corporation
Measurement method: Touch the palpation needle to the polishing pad on the upper surface plate, move it from the outer periphery of the surface plate inwards, and measure the shape of the upper surface plate by measuring the outer periphery of the surface plate on the opposite side. Next, turn the palpation needle over and touch it to the lower surface plate and measure in the same way.

After measuring the polishing pad shape after dressing, processing was performed under the same conditions as the wafer polishing conditions before dressing, and the flatness was measured.

(Polishing)
Equipment: Fujikoshi double-sided polishing machine Processed wafer: Diameter 300 mm, Si, P-, surface orientation (100)
Processing material: Foamed urethane type polishing pad Polishing slurry: KOH-based colloidal silica

(Flatness measurement)
Evaluation equipment: Kuroda Precision Industries Co., Ltd. flatness measuring instrument, Nanometro 300TT-A

(result)
FIG. 6A shows the results of Example 1, and FIG. 6B shows the results of Comparative Example 1 (shape of polishing cloth and shape of polished wafer). In FIG. 6A and FIG. 6B, the shape profile in the platen radial direction, which is the evaluation result of the polishing pad shape, shows the shape of the lower platen side in the upper profile and the shape of the upper platen side in the lower profile. In the case of Example 1, as shown in FIG. 6A, the change in the shape of the polishing pad is suppressed at the beginning and end of dressing. That is, it can be seen that if dressing is performed using the dressing plate according to the present invention, the change in the shape of the polishing pad can be suppressed. On the other hand, as shown in FIG. 6B, when dressing is performed using a conventional dressing plate as in Comparative Example 1, it can be seen that the shape of the polishing pad is significantly different at the beginning and end of dressing.

As shown in Figures 6A and 6B, when wafers were actually polished in the early and final stages of dressing, the cross-sectional shape of the wafer showed a large concave distribution in the final stage of dressing in Comparative Example 1, whereas no significant difference was observed between the early and final stages of dressing in Example 1. This was also confirmed by the GBIR values.

In Comparative Example 1, as the number of dressings increased, the shape of the polishing pads attached to the upper and lower platens changed from a convex shape to a flat shape on the upper platen side, and the shape of the lower platen changed from a concave shape to a flat shape. Due to this change in shape, even if the processing conditions were set to provide good flatness for the processed wafer initially, the flatness of the processed wafer tended to deteriorate as dressing progressed. On the other hand, in Example 1, even if the number of dressings increased, the change in the shape of the polishing pads attached to the upper and lower platens was small, and a flat wafer shape could be obtained without adjusting the polishing conditions for the processed wafer.

[Example 2, Comparative Example 2]
Next, the flatness (GBIR) of the processed wafer due to the difference in dressing was evaluated. Double-sided polishing was performed using an actual wafer to be processed, and the wafer shape (cross-sectional shape) after polishing was measured and compared. In Example 2 and Comparative Example 2, dressing was performed in the same manner as in Example 1 and Comparative Example 1, respectively. The common conditions in Example 2 and Comparative Example 2 are shown below.

(dressing)
As an accelerated test for evaluating the effect of increasing the number of dressing times, the dressing times were set to 1 min and 250 min (two levels).

After dressing for the specified time as described above, the wafer was processed under the same conditions as the wafer polishing conditions before dressing, and the wafer flatness was measured.

(Polishing)
Equipment: Fujikoshi double-sided polishing machine Processed wafer: Diameter 300 mm, Si, P-, surface orientation (100)
Processing material: Foamed urethane type polishing pad Polishing slurry: KOH-based colloidal silica

(Flatness measurement)
Evaluation equipment: KLA flatness measuring instrument, WaferSight2
Evaluation conditions Edge Ex. = 2 mm

The flatness evaluation results for Example 2 are shown in Figure 7, and the flatness evaluation results for Comparative Example 2 are shown in Figure 8. As shown in Figures 7 and 8, in Comparative Example 2, which used a conventional dressing method, the GBIR variation was larger than in Example 2, even when the dressing time was 1 minute. It can also be seen that by accelerating the dressing to 250 minutes, both the GBIR value and the variation worsen. On the other hand, in Example 2, which used the dressing method of the present invention, the GBIR was stable and not affected by the dressing time, and the variation was also small.

The present invention is not limited to the above-described embodiment. The above-described embodiment is merely an example, and anything that has substantially the same configuration as the technical idea described in the claims of the present invention and exhibits similar effects is included within the technical scope of the present invention.

1...Upper surface plate, 2...Lower surface plate,
3A: upper surface platen side polishing cloth; 3B: lower surface platen side polishing cloth; 4: diamond particles;
10...Dressing plate (example of the present invention),
10A: Dressing plate for upper surface plate side polishing cloth,
10B: Dressing plate for lower surface plate side polishing cloth,
11A, 11B...diamond fixing plate,
12A, 12B...connecting member,
13A, 13B...Support plate,
14A, 14B...protrusions, 15A, 15B...spaces,
20: Dressing plate (conventional example), 21: Plate, 30: Internal gear pin, 31: Sun gear pin,
100...Double-sided polisher during dressing (example of the present invention),
200...Double-sided polisher during dressing (conventional example).
P1, P2, P3, P4...positions of the dressing plates.

Claims (6)

A dressing plate is sandwiched between an upper platen-side polishing cloth and a lower platen-side polishing cloth attached to an upper platen and a lower platen, respectively, of a double-sided polishing apparatus, for dressing the upper platen-side polishing cloth and/or the lower platen-side polishing cloth,
A disk-shaped diamond fixing plate having diamond particles arranged on an upper surface or a lower surface thereof;
a ring-shaped connecting member made of flexible rubber fixed to the outer periphery of the diamond fixing plate;
A dressing plate comprising: a circular support plate fixed to the connecting member and connected to the diamond fixing plate via the connecting member. The dressing plate according to claim 1, characterized in that when the dressing plate is placed on the lower platen side polishing cloth, a space is formed between the lower surface of the diamond fixing plate and the lower platen side polishing cloth in a state where no load is applied. the dressing plate for the upper platen side polishing cloth has diamond particles disposed on the upper surface of the diamond fixing plate,
3. The dressing plate according to claim 1, wherein the dressing plate for the lower platen side polishing cloth has diamond particles disposed on the lower surface of the diamond fixing plate. the dressing plate for the upper platen side polishing cloth has diamond particles disposed on an annular protrusion provided on the upper surface of the diamond fixing plate,
The dressing plate for the lower platen side polishing cloth is characterized in that the diamond particles are arranged on an annular protrusion provided on the lower surface of the diamond fixing plate. A dressing method for dressing an upper polishing cloth and/or a lower polishing cloth attached to an upper polishing plate and a lower polishing plate of a double-sided polishing apparatus, the method comprising:
Using the dressing plate according to any one of claims 1 to 4,
The dressing method is characterized in that dressing is performed without rotating or revolving the dressing plate, and while rotating the upper and lower surface plates. The dressing method according to claim 5, characterized in that the dressing plates for the upper platen side polishing cloth and the dressing plates for the lower platen side polishing cloth are arranged alternately for dressing.

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