JP2023007543A - Dressing plate and dressing method - Google Patents

Abstract

To provide a dressing plate capable of suppressing the change of a shape of a polishing cloth due to dressing.SOLUTION: A dressing plate for dressing an upper platen side polishing cloth and/or a lower platen side a polishing cloth is sandwiched between the upper platen side polishing cloth and the lower platen side polishing cloth which are each stuck to an upper platen and a lower platen of a double-sided polishing device. The dressing plate comprises: a disk-like diamond fixing plate in which diamond particles are arranged on an upper surface or a lower surface; an annular connection member fixed to an outer periphery of the diamond fixing plate and comprising flexible rubber; and an annular support plate fixed to the connection member and connected to the diamond fixing plate via the connection member.SELECTED DRAWING: Figure 1

Description

The present invention provides a dressing plate for dressing the polishing cloth by being sandwiched between the upper and lower polishing cloths attached to the upper and lower polishing plates of a double-sided polishing apparatus. It relates to a dressing method using a dressing plate.

A double-side polishing machine is usually equipped with an upper and lower surface plate to which polishing cloth made of non-woven fabric or foamed urethane is attached, and has a planetary gear structure with a sun gear in the center and an internal gear in the outer periphery. A so-called 4-way system is used. When polishing a silicon wafer, the wafer is inserted and held in a wafer holding hole formed in the carrier. Polishing slurry is supplied to the wafer from the upper surface plate side, the upper and lower surface plates are rotated, and while pressing the polishing cloths facing the upper and lower surface plates against both the front and back sides of the wafer, the carrier is moved between the sun gear and the internal gear. Both sides of each wafer can be polished simultaneously by rotating and revolving between them.

The double-side polishing apparatus can polish both sides of the wafer at the same time, but there is a problem that the shape of the wafer gradually changes if the polishing is continued using the same polishing cloth. This is mainly due to the life of the polishing cloth, and is affected by changes in compressibility of the polishing cloth, clogging, and the like. Therefore, in order to prevent the wafer shape from changing, dressing of the surface of the polishing cloth is performed (regularly) after replacing the polishing cloth or at predetermined intervals.

Dressing has conventionally been performed using a diamond dresser in which a grindstone such as diamond is fixed to a plate by electrodeposition or an adhesive. By placing such a diamond dresser between the upper surface plate and the lower surface plate alternately between the upper surface plate side and the lower surface plate side, and operating the device in the same way as normal polishing. , both the upper and lower polishing cloths are dressed simultaneously. As a result, the surface of the polishing cloth can be scraped off or roughened, and the slurry retention property of the polishing cloth can be improved to maintain the polishing ability. Such dressing suppresses aging such as clogging of the polishing cloth and maintains the surface condition of the polishing cloth in good condition, thereby maintaining the machining allowance and flatness accuracy, and stably obtaining highly flat wafers. be able to.

In Patent Document 1, a dressing device is provided in which the angle of the dressing surface is adjusted according to the shape of the surface plate and contacts the polishing cloth so that the diamond dresser can uniformly dress the polishing cloth. Proposed.

Japanese Patent Application Laid-Open No. 2004-090142

FIG. 9 shows a top view and cross-sectional view of a conventional dressing plate 20, and FIG. 10 shows a cross-sectional view of the dressing plate 20 and polishing pad when dressing is performed using the conventional dressing plate 20. As shown in FIG. The conventional dressing plate 20 includes a plate 21 with diamond grains 4 fixed directly on one side thereof by electrodeposition or an adhesive, and a pellet-type dressing plate fixed to the plate. The number of diamond particles 4 is #60 to #500, and there are a non-arranged type and an arranged type.

The dressing plate 20 has a gear shape on its outer periphery that is in contact with the internal gear pin 30 and the sun gear pin 31, and is brought into contact with the lower surface plate (or the polishing cloth on the side of the lower surface plate) by its own weight. Such a dressing plate 20 is used by being inverted so as to correspond to the upper polishing cloth 3A and the lower polishing cloth 3B (FIGS. 10(a) and 10(b)). Then, as shown in FIG. 11, using a double-side polishing apparatus 200 having such a dressing plate 20, the surfaces of the upper surface plate side polishing cloth 3A and the lower surface plate side polishing cloth 3B such as hard urethane foam pads are polished. For the purpose of erecting, the polishing cloth 3A and the polishing cloth 3B attached to the upper surface plate 1 and the lower surface plate 2, respectively, are simultaneously dressed with a dressing plate 20 having diamond particles 4 on one side thereof. are doing. The dressing of the polishing cloth is performed when the polishing cloth is set up and at regular intervals between processing operations.

The shape of the surface plate itself is usually convex on the upper surface plate side and concave on the lower surface plate side. The side is weakly concave and becomes flat. Since the shape of the polishing cloth changes due to dressing in this way, the load distribution during wafer polishing differs between the initial life of the polishing cloth and the end of the life of the polishing cloth. There is a problem that the shape of is different.

The present inventor believes that the reason why the shape of the polishing cloth changes due to dressing is that the dressing plate does not follow the shape of the surface plate, and the shape of the polishing cloth changes when the polishing cloth is cut by diamond. Focusing on this point, the present invention was completed through intensive studies.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems. It is an object of the present invention to provide a dressing plate capable of suppressing a change in the shape of a polishing cloth caused by dressing, and a dressing method capable of suppressing a change in the shape of the polishing cloth due to dressing.

The present invention has been made to achieve the above object, and is sandwiched between the upper and lower polishing cloths attached to the upper and lower polishing plates of a double-side polishing apparatus, A dressing plate for dressing the upper surface plate-side polishing cloth and/or the lower surface plate-side polishing cloth, comprising a disk-shaped diamond fixing plate having diamond particles arranged on the upper surface or the lower surface thereof; and the diamond fixing plate. An annular connecting member made of flexible rubber fixed to the outer periphery, and an annular supporting plate fixed to the connecting member and connected to the diamond fixing plate via the connecting member. provides a dressing plate that is

According to such a dressing plate, since the dressing plate can grind the polishing cloth with a pressure distribution that follows the shape of the surface plate, it is possible to suppress the change in the shape of the polishing cloth due to dressing. Become. Even if the number of times of dressing increases, the shape of the polishing cloth attached to the upper and lower surface plates does not change much, so that a flat wafer shape can be obtained without adjusting the polishing conditions of the wafer to be processed.

At this time, when the dressing plate is placed on the lower surface plate-side polishing cloth, a space is formed between the lower surface of the diamond fixing plate and the lower surface plate-side polishing cloth in a state in which no load is applied. It can be a dressing plate.

This makes it possible to follow the shape of the surface plate more effectively.

At this time, the dressing plate for the upper surface plate side abrasive cloth has the diamond particles arranged on the upper surface of the diamond fixing plate, and the dressing plate for the lower surface plate side abrasive cloth has the diamond fixing plate. A dressing plate may be provided in which the diamond particles are arranged on the lower surface of the plate.

By using dressing plates with different structures for the polishing cloth on the upper surface plate side and the polishing cloth on the lower surface plate side, the shape of the surface plate can be followed more effectively, and dressing can be performed more reliably. becomes possible.

At this time, the dressing plate for the upper surface plate side polishing cloth has the diamond particles arranged in an annular protrusion provided on the upper surface of the diamond fixing plate, and the lower surface plate side polishing cloth. The dressing plate for the diamond fixing plate may be a dressing plate in which the diamond particles are arranged in an annular protrusion provided on the lower surface of the diamond fixing plate.

As a result, dressing can be performed more stably and effectively.

At this time, a dressing plate is sandwiched between the upper polishing cloth and the lower polishing cloth attached to the upper polishing cloth and the lower polishing cloth respectively of the double-sided polishing apparatus, and the upper polishing cloth and/or the polishing cloth is A dressing method for dressing the polishing cloth on the side of the lower surface plate, wherein the above-described dressing plate is used, and the dressing plate is not rotated and the dressing is performed while the upper surface plate and the lower surface plate are rotated. I will provide a.

As a result, the dressing plate can grind the polishing cloth with a pressure distribution that follows the shape of the surface plate, making it possible to suppress changes in the shape of the polishing cloth due to dressing. Since the change in the shape of the attached polishing cloth can be reduced, it is possible to obtain a flat wafer shape without adjusting the polishing conditions of the wafer to be processed.

At this time, a dressing method can be adopted in which dressing plates for the upper polishing cloth and dressing plates for the lower polishing cloth are alternately arranged for dressing.

Thereby, more stable and more uniform dressing can be performed.

As described above, according to the dressing plate of the present invention, it is possible to suppress the change in the shape of the polishing pad due to dressing. Even if the number of times of dressing increases, the shape of the polishing cloth attached to the upper and lower surface plates does not change much, so that a flat wafer shape can be obtained without adjusting the polishing conditions of the wafer to be processed. Further, according to the dressing method of the present invention, it is possible to suppress the change in the shape of the polishing cloth due to dressing. A flat wafer shape can be obtained without adjusting the polishing conditions of the wafer to be processed.

FIG. 2 shows a top view and a cross-sectional view of a dressing plate for polishing cloth on the upper platen side according to the present invention. FIG. 2 shows a locally enlarged cross-sectional view of a dressing plate for polishing cloth on the upper platen side according to the present invention. FIG. 2 shows a bottom view and a cross-sectional view of a dressing plate for polishing cloth on the lower platen side according to the present invention; FIG. 4 shows a locally enlarged view of a dressing plate for polishing cloth on the lower platen side according to the present invention; 1 shows a double-sided polishing apparatus with a dressing plate according to the present invention; The results of Example 1 (polishing cloth shape and polishing wafer shape) are shown. The results of Comparative Example 1 (polishing cloth shape and polishing wafer shape) are shown. 4 shows evaluation results of flatness of the polished wafer of Example 2. FIG. 4 shows evaluation results of flatness of the polished wafer of Comparative Example 2. FIG. 1 shows a conventional dressing plate. 2 shows the state of use of a conventional dressing plate. 1 shows a double-sided polishing apparatus in which a conventional dressing plate is arranged; It is a figure for demonstrating the part which arrange|positions a dressing plate.

The present invention will be described in detail below, but the present invention is not limited to these.

As described above, it is possible to suppress the change in the shape of the polishing cloth due to dressing in order to obtain a flat wafer shape without adjusting the polishing conditions of the wafer to be processed by suppressing the change in the shape of the polishing cloth due to dressing. A dressing plate was required.

The inventors of the present invention have made intensive studies on the above problems, and as a result, sandwiched between the upper polishing cloth and the lower polishing cloth respectively attached to the upper and lower polishing plates of the double-sided polishing apparatus, A dressing plate for dressing the upper surface plate side polishing cloth and/or the lower surface plate side polishing cloth, comprising a disk-shaped diamond fixing plate on which diamond particles are arranged on the upper surface or the lower surface, and the outer periphery of the diamond fixing plate A dressing plate comprising: an annular connecting member made of flexible rubber fixed to a portion; and an annular supporting plate fixed to the connecting member and connected to the diamond fixing plate via the connecting member. Therefore, it is possible to suppress the change in the shape of the polishing cloth due to dressing. The inventors have found that a flat wafer shape can be obtained without adjusting the polishing conditions, and completed the present invention.

Description will be made below with reference to the drawings.

(double-sided polishing machine)
First, a double-side polishing apparatus according to the present invention will be described. FIG. 5 shows a double-sided polishing apparatus 100 having a dressing plate according to the present invention. As shown in FIG. 5, the double-sided polishing apparatus 100 according to the present invention includes an upper surface plate 1 and a lower surface plate 2, and an upper surface plate-side polishing cloth 3A attached to each of the upper surface plate 1 and the lower surface plate 2; A lower polishing cloth 3B and a dressing plate 10 according to the present invention are arranged so as to be sandwiched between the upper polishing cloth 3A and the lower polishing cloth 3B. FIG. 5 shows an example in which a dressing plate 10A for the polishing cloth on the upper surface plate and a dressing plate 10B for the polishing cloth on the lower surface plate are arranged as the dressing plate 10. As shown in FIG. Although FIG. 5 shows the double-sided polishing apparatus for dressing, when polishing a wafer, the wafer to be processed is placed instead of the dressing plate 10 (10A, 10B).

[Dressing plate]
Next, a dressing plate according to the present invention will be described. The dressing plate 10 according to the present invention includes a disk-shaped diamond fixing plate having diamond particles arranged on the upper surface or the lower surface so that the dressing plate can be ground with a pressure distribution that follows the shape of the surface plate. , an annular support plate fixed to a connection member and connected to the diamond fixing plate through the connection member, and an annular connection member made of flexible rubber. In the present invention, the dressing plate for dressing the upper surface plate side polishing cloth 3A and the dressing plate for dressing the upper surface plate side polishing cloth 3B are not prepared by turning over the same shape as in the conventional art. It is preferable to use a structure suitable for each case.

(Dressing plate for abrasive cloth on upper platen side)
FIG. 1 shows a top view and a sectional view of a dressing plate 10A for the polishing cloth on the upper platen side. FIG. 2 shows a locally enlarged sectional view of the dressing plate 10A for the polishing cloth on the upper platen side.

As shown in FIG. 1, the dressing plate 10A for the polishing cloth on the upper platen side includes a disk-shaped diamond fixing plate 11A, an annular connecting member 12A, and an annular support plate 13A. Diamond particles 4 are arranged on the upper surface of the diamond fixing plate 11A. Although the connection member 12A is made of flexible rubber, the material of the diamond fixing plate 11A and the support plate 13A is not particularly limited, and the same materials as those of conventional dressing plates can be used. The connection member 12A is not particularly limited as long as it is flexible rubber, but for example, one having a Shore A hardness of 85 degrees or more can be used, and a core material such as cloth may be used inside. The diamond particles 4 may have a number of #60 to #500.

As shown in FIGS. 1 and 2, the diamond particles 4 are preferably arranged on an annular protrusion 14A provided on the upper surface of the diamond fixing plate 11A. As a result, dressing can be performed more stably and effectively.

As shown in FIG. 2, when the dressing plate 10A for the upper surface plate side polishing cloth is placed on the lower surface plate side polishing cloth 3B, in a state where no load is applied, the lower surface of the diamond fixing plate 11A and the lower surface plate side are arranged. A space 15A is preferably formed between the abrasive cloth 3B. Thereby, followability to the shape of the upper surface plate becomes more effective. In this case, when the dressing plate 10A for the upper surface plate side polishing cloth is arranged in the double side polishing apparatus 100 and no load is applied to the dressing plate 10A for the upper surface plate side polishing cloth, the diamond particles 4 is in contact with the upper surface plate side abrasive cloth 3A, but is not pushed in strongly. It is in a state of floating without contact. Therefore, it is possible to secure a space when the annular connecting member 12A bends and deforms to follow the shape of the upper surface plate 1 .

(Dressing plate for abrasive cloth on the lower surface plate side)
FIG. 3 shows a bottom view and a cross-sectional view of the dressing plate 10B for the abrasive cloth on the lower platen side. FIG. 4 shows a locally enlarged cross-sectional view of the dressing plate 10B for the polishing cloth on the lower platen side. Note that the description of the same matters as those of the dressing plate 10A for the polishing cloth on the upper platen side may be omitted as appropriate.

As shown in FIG. 3, the dressing plate 10B for the polishing cloth on the lower platen side includes a disk-shaped diamond fixing plate 11B, an annular connecting member 12B, and an annular support plate 13B. Diamond particles 4 are arranged on the lower surface of the diamond fixing plate 11B.

At this time, as shown in FIGS. 3 and 4, the diamond particles 4 are preferably arranged on the annular projecting portion 14B provided on the lower surface of the diamond fixing plate 11B. As a result, dressing can be performed more stably and effectively.

As shown in FIG. 4, when the dressing plate 10B for the lower surface plate side polishing cloth is placed on the lower surface plate side polishing cloth 3B, in a state where no load is applied, the lower surface of the diamond fixing plate 11B and the lower surface plate side polishing cloth are in contact with each other. A space 15B is preferably formed between the cloth 3B. Thereby, followability to the shape of the lower surface plate becomes more effective. In this case, when the dressing plate 10B for the lower surface plate-side polishing cloth is arranged in the double-side polishing apparatus 100, the dressing plate 10B for the lower surface plate-side polishing cloth is in a state where no load is applied to the dressing plate 10B for the lower surface plate-side polishing cloth. The upper surface of the dressing plate 10B is in contact with the upper surface plate-side polishing cloth 3A, but the diamond particles 4 on the lower surface are in a floating state at a position not in contact with the lower surface plate-side polishing cloth 3B, and are not pushed in strongly. state. Therefore, it is possible to secure a space when the annular connecting member 12B bends and deforms following the shape of the lower platen 2 .

As a structure for connecting the diamond fixing plates 11A, 11B, the connection members 12A, 12B, and the support plates 13A, 13B, the support plates 13A, 13B hang the diamond fixing plates 11A, 11B from the connection members 12A, 12B. It is preferable that

The method of fixing the disk-shaped diamond fixing plates 11A and 11B, the ring-shaped connection members 12A and 12B, and the ring-shaped support plates 13A and 13B is not particularly limited. For example, they can be fixed and connected by screwing or the like.

(Dressing method)
Next, a dressing method according to the present invention will be described. A dressing plate is sandwiched between the upper surface plate side polishing cloth and the lower surface plate side polishing cloth attached respectively to the upper surface plate and the lower surface plate of the double-sided polishing apparatus, and the upper surface plate side polishing cloth and/or the lower surface plate side polishing cloth is provided. In the dressing method of the present invention, the dressing plate according to the present invention is used, but the dressing plate does not rotate and the upper surface plate and the lower surface plate are rotated while dressing. . By stopping the rotation of the internal gear and the sun gear and not rotating or revolving the dressing plate, the effect of averaging the surface plate shape is reduced, and the dressing plate 10 (10A, 10B) according to the present invention reduces the surface plate shape. It is possible to realize the contact between the diamond and the polishing cloth that follows the pattern.

Only one of the upper surface plate side polishing cloth and the lower surface plate side polishing cloth may be dressed. 10B are preferably used to simultaneously dress the upper surface plate side polishing cloth 3A and the lower surface plate side polishing cloth 3B. In this case, the dressing plate 10A for the upper polishing cloth and the dressing plate 10B for the lower polishing cloth are preferably arranged alternately for dressing. Specifically, the dressing plate 10A for the polishing cloth on the upper surface plate is arranged at the installation locations P1 and P3 shown in FIG. 12, and the dressing plate 10B for the polishing cloth on the lower surface plate is arranged at the installation locations P2 and P4. can be done. The number of dressing plates to be arranged is not particularly limited.

Although the dressing conditions are not particularly limited, as an example, when two dressing plates 10A for upper surface plate side polishing cloth and two dressing plates 10B for lower surface plate side polishing cloth are alternately charged between the surface plates, By stopping the rotation of the internal gear and the sun gear, dressing can be performed with a load of 60 to 100 g/cm ² and a rotation of the upper and lower surface plates of 5 to 20 rpm while supplying pure water.

EXAMPLES The present invention will be specifically described below with reference to Examples, but these are not intended to limit the present invention.

[Example 1, Comparative Example 1]
First, in Example 1, the dressing was performed using the dressing plate according to the present invention, and in Comparative Example 1, the conventional dressing plate was used for dressing. Differences in shape and shape evaluation (cross-sectional shape, GBIR) of polished wafers were evaluated and compared.

(Example 1)
As the dressing plate used in Example 1, a diamond fixing plate and a support plate were screwed via a diaphragm (connecting member) with a rubber hardness (Shore A hardness) of 85° or higher and containing a fabric core material. A donut-shaped diamond was directly fixed to an annular protrusion as the diamond fixing plate. As the dressing plate for the upper surface plate side, a diamond fixing plate was held in a hollow state so that the surface of the diamond fixing plate on which diamonds were not attached did not come into contact with the lower surface plate pad. As the dressing plate for the lower surface plate side, a diamond fixing plate was held in a hollow state so that the diamond-attached surface of the diamond fixing plate did not come into contact with the lower surface plate pad. 2 dressing plates for the upper surface plate side and 2 dressing plates for the lower surface plate side are alternately placed between the upper and lower surface plates. The surface plate was rotated at a rotation speed of 5.2 rpm and the lower surface plate at a rotation speed of 16.0 rpm, and the dressing was performed with a load of 100 g/cm ² while supplying pure water.

(Comparative example 1)
As a conventional dressing plate, four integrated dressing plates of the same shape as shown in FIG. , and dressing was performed while rotating the dressing plate and rotating the upper surface plate and the lower surface plate.

(Measurement of polishing pad shape)
The polishing pad shape measurement conditions after dressing are as follows.
Measuring machine: Straightness shape measuring machine (HSS) manufactured by Hitachi Zosen Corporation
Measurement method: Touch the polishing pad on the upper surface plate with a palpable needle, move it inward from the outer circumference of the surface plate, and measure the outer circumference of the surface plate on the opposite side to measure the shape of the upper surface plate. Next, the palpation needle is reversed and brought into contact with the lower surface plate, and measurement is performed in the same manner.

After measuring the shape of the polishing pad after dressing, processing was performed under the same wafer polishing conditions as before dressing, and flatness was measured.

(polishing)
Equipment: Double-sided polishing machine manufactured by Nachi-Fujikoshi Machinery Processed wafer: Diameter 300 mm, Si, P-, plane orientation (100)
Processing material: Urethane foam type polishing pad Polishing slurry: KOH-based colloidal silica

(flatness measurement)
Evaluation device: Flatness measuring machine manufactured by Kuroda Seiko Co., Ltd., Nanometero300TT-A

(result)
FIG. 6A shows the results of Example 1, and FIG. 6B shows the results of Comparative Example 1 (the shape of the polishing cloth and the shape of the polishing wafer). In FIGS. 6A and 6B, the shape profile in the radial direction of the surface plate, which is the evaluation result of the shape of the polishing pad, shows the upper profile on the lower surface plate side and the lower profile on the upper surface plate side. In the case of Example 1, as shown in FIG. 6A, the change in the shape of the polishing pad is suppressed between the initial stage and the final stage of dressing. That is, it can be seen that if the dressing is performed using the dressing plate according to the present invention, the change in the shape of the polishing pad can be suppressed. On the other hand, as shown in FIG. 6B, when the conventional dressing plate is used for dressing as in Comparative Example 1, the shape of the polishing pad is significantly different between the initial stage and the final stage of dressing.

Further, as shown in FIGS. 6A and 6B , as a result of actually polishing the wafer in each of the initial stage and the final stage of dressing, the cross-sectional shape of the wafer in the final stage of dressing in Comparative Example 1 showed a large concave distribution. On the other hand, in the case of Example 1, no significant difference was observed between the initial stage of dressing and the final stage of dressing. This could also be confirmed from the numerical value of GBIR.

In Comparative Example 1, as the number of times of dressing increases, the shape of the polishing pad attached to the upper and lower surface plates changes from a convex shape to a flat direction on the upper surface plate side, and changes from a concave shape to a flat direction on the lower surface plate side. shape change to Due to this change in shape, even if the processing conditions are set so that the flatness of the wafer to be processed is good at the initial stage, the progress of dressing tends to deteriorate the flatness of the wafer after processing. On the other hand, in Example 1, even if the number of times of dressing increased, the change in the shape of the polishing pad attached to the upper and lower surface plates was small, and a flat wafer shape could be obtained without adjusting the polishing conditions for the wafer to be processed.

[Example 2, Comparative Example 2]
Next, the flatness (GBIR) of the processed wafer due to the difference in dressing was evaluated. Double-side polishing was performed using an actual wafer to be processed, and the wafer shape (cross-sectional shape) after polishing was measured and compared. In Example 2 and Comparative Example 2, dressing was performed in the same manner as in Example 1 and Comparative Example 1, respectively. Conditions common to Example 2 and Comparative Example 2 are shown below.

(dressing)
As an accelerated test for evaluating the effect of increasing the number of times of dressing, the dressing time was set to 1 min and 250 min (2 levels).

After performing dressing for a predetermined time as described above, processing was performed under the same wafer polishing conditions as before dressing, and the flatness of the wafer was measured.

(polishing)
Equipment: Double-sided polishing machine manufactured by Nachi-Fujikoshi Machinery Processed wafer: Diameter 300 mm, Si, P-, plane orientation (100)
Processing material: Urethane foam type polishing pad Polishing slurry: KOH-based colloidal silica

(flatness measurement)
Evaluation device: Flatness measuring machine manufactured by KLA, WaferSight2
Evaluation conditions Edge Ex. = 2mm

The flatness evaluation result of Example 2 is shown in FIG. 7, and the flatness evaluation result of Comparative Example 2 is shown in FIG. As shown in FIGS. 7 and 8, in Comparative Example 2 using the conventional dressing method, the variation in GBIR was greater than in Example 2 even when the dressing was performed for 1 minute. It can be seen that both the GBIR value and the dispersion deteriorate when the dressing is accelerated to 250 minutes. On the other hand, in Example 2 using the dressing method of the present invention, the GBIR was stable without being affected by the dressing time, and variation was small.

It should be noted that the present invention is not limited to the above embodiments. The above-described embodiment is an example, and any device having substantially the same configuration as the technical idea described in the claims of the present invention and exhibiting the same effect is the present invention. is included in the technical scope of

1... Upper surface plate, 2... Lower surface plate,
3A: Upper surface plate side polishing cloth 3B: Lower surface plate side polishing cloth 4: Diamond particles
10 ... dressing plate (example of the present invention),
10A: Dressing plate for polishing cloth on upper platen side,
10B: Dressing plate for abrasive cloth on lower platen side,
11A, 11B ... diamond fixing plate,
12A, 12B ... connecting members,
13A, 13B... support plate,
14A, 14B... Protrusions, 15A, 15B... Spaces,
20... Dressing plate (conventional example) 21... Plate 30... Internal gear pin 31... Sun gear pin
100 Double-side polishing machine during dressing (example of the present invention),
200: Double-side polishing machine during dressing (conventional example).
P1, P2, P3, P4 . . . Arrangement positions of dressing plates.

Claims (6)

Sandwiched between the upper surface plate-side polishing cloth and the lower surface plate-side polishing cloth respectively attached to the upper surface plate and the lower surface plate of the double-side polishing apparatus, the upper surface plate-side polishing cloth and/or the lower surface plate-side polishing cloth A dressing plate for dressing,
a disk-shaped diamond fixing plate having diamond particles arranged on its upper or lower surface;
an annular connecting member made of flexible rubber fixed to the outer periphery of the diamond fixing plate;
and an annular support plate fixed to the connecting member and connected to the diamond fixing plate through the connecting member. When the dressing plate is placed on the lower polishing cloth, a space is formed between the lower surface of the diamond fixing plate and the lower polishing cloth in a state where no load is applied. A dressing plate according to claim 1, characterized in that: The dressing plate for the polishing cloth on the upper surface plate has the diamond particles arranged on the upper surface of the diamond fixing plate,
3. The dressing plate according to claim 1, wherein the diamond particles are arranged on the lower surface of the diamond fixing plate. The dressing plate for the polishing cloth on the upper platen side has the diamond particles arranged in an annular protrusion provided on the upper surface of the diamond fixing plate,
4. The diamond particles according to claim 3, wherein the dressing plate for the polishing cloth on the lower platen side has the diamond particles arranged in an annular protrusion provided on the lower surface of the diamond fixing plate. dressing plate. A dressing plate is sandwiched between the upper surface plate side polishing cloth and the lower surface plate side polishing cloth respectively attached to the upper surface plate and the lower surface plate of the double-sided polishing apparatus, and the upper surface plate side polishing cloth and/or the lower surface plate side polishing plate is provided. A dressing method for dressing a polishing cloth,
Using the dressing plate according to any one of claims 1 to 4,
A dressing method, wherein the dressing is performed while rotating the upper surface plate and the lower surface plate without rotating or revolving the dressing plate. 6. The dressing method according to claim 5, wherein the dressing plate for the upper polishing cloth and the dressing plate for the lower polishing cloth are alternately arranged for dressing.

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