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JP7560345B2 - ダイシングテープ - Google Patents

ダイシングテープ Download PDF

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Publication number
JP7560345B2
JP7560345B2 JP2020208544A JP2020208544A JP7560345B2 JP 7560345 B2 JP7560345 B2 JP 7560345B2 JP 2020208544 A JP2020208544 A JP 2020208544A JP 2020208544 A JP2020208544 A JP 2020208544A JP 7560345 B2 JP7560345 B2 JP 7560345B2
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JP
Japan
Prior art keywords
resin
die bond
film
adhesive layer
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020208544A
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English (en)
Japanese (ja)
Other versions
JP2022095302A (ja
JP2022095302A5 (ko
Inventor
俊之 角田
慧 古川
浩和 佐藤
理恵 田中
晃良 増田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Ltd
Original Assignee
Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Maxell Ltd filed Critical Maxell Ltd
Priority to JP2020208544A priority Critical patent/JP7560345B2/ja
Priority to CN202111526569.8A priority patent/CN114634768A/zh
Priority to TW110146695A priority patent/TW202239850A/zh
Priority to KR1020210179328A priority patent/KR20220086506A/ko
Publication of JP2022095302A publication Critical patent/JP2022095302A/ja
Publication of JP2022095302A5 publication Critical patent/JP2022095302A5/ja
Application granted granted Critical
Publication of JP7560345B2 publication Critical patent/JP7560345B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C08L23/0869—Acids or derivatives thereof
    • C08L23/0876—Neutralised polymers, i.e. ionomers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • C09J2477/006—Presence of polyamide in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
JP2020208544A 2020-12-16 2020-12-16 ダイシングテープ Active JP7560345B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020208544A JP7560345B2 (ja) 2020-12-16 2020-12-16 ダイシングテープ
CN202111526569.8A CN114634768A (zh) 2020-12-16 2021-12-13 切割胶带和切割芯片接合膜
TW110146695A TW202239850A (zh) 2020-12-16 2021-12-14 晶圓切割膠帶及晶圓切割黏晶膜
KR1020210179328A KR20220086506A (ko) 2020-12-16 2021-12-15 다이싱 테이프 및 다이싱 다이 본드 필름

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020208544A JP7560345B2 (ja) 2020-12-16 2020-12-16 ダイシングテープ

Publications (3)

Publication Number Publication Date
JP2022095302A JP2022095302A (ja) 2022-06-28
JP2022095302A5 JP2022095302A5 (ko) 2023-03-07
JP7560345B2 true JP7560345B2 (ja) 2024-10-02

Family

ID=81945987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020208544A Active JP7560345B2 (ja) 2020-12-16 2020-12-16 ダイシングテープ

Country Status (4)

Country Link
JP (1) JP7560345B2 (ko)
KR (1) KR20220086506A (ko)
CN (1) CN114634768A (ko)
TW (1) TW202239850A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023188714A1 (ko) * 2022-03-31 2023-10-05

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160040043A1 (en) 2013-12-19 2016-02-11 Lg Chem, Ltd. Composition for forming adhesive layer of dicing film, and dicing film
JP2017098369A (ja) 2015-11-20 2017-06-01 三井・デュポンポリケミカル株式会社 ダイシングフィルム基材用樹脂組成物、ダイシングフィルム基材およびダイシングフィルム
JP2018056282A (ja) 2016-09-28 2018-04-05 リンテック株式会社 保護膜付き半導体チップの製造方法及び半導体装置の製造方法
WO2018123804A1 (ja) 2016-12-27 2018-07-05 三井・デュポンポリケミカル株式会社 ダイシングフィルム基材およびダイシングフィルム
JP2019009203A (ja) 2017-06-22 2019-01-17 日東電工株式会社 ダイシングダイボンドフィルム
JP2019016816A (ja) 2016-11-18 2019-01-31 古河電気工業株式会社 貼合体
JP2020053453A (ja) 2018-09-25 2020-04-02 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP7440633B2 (ja) 2020-06-10 2024-02-28 三井化学東セロ株式会社 電子装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7105120B2 (ja) 2017-07-04 2022-07-22 日東電工株式会社 ダイシングテープ、ダイシングダイボンドフィルム、および半導体装置製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160040043A1 (en) 2013-12-19 2016-02-11 Lg Chem, Ltd. Composition for forming adhesive layer of dicing film, and dicing film
JP2017098369A (ja) 2015-11-20 2017-06-01 三井・デュポンポリケミカル株式会社 ダイシングフィルム基材用樹脂組成物、ダイシングフィルム基材およびダイシングフィルム
JP2018056282A (ja) 2016-09-28 2018-04-05 リンテック株式会社 保護膜付き半導体チップの製造方法及び半導体装置の製造方法
JP2019016816A (ja) 2016-11-18 2019-01-31 古河電気工業株式会社 貼合体
WO2018123804A1 (ja) 2016-12-27 2018-07-05 三井・デュポンポリケミカル株式会社 ダイシングフィルム基材およびダイシングフィルム
JP2019009203A (ja) 2017-06-22 2019-01-17 日東電工株式会社 ダイシングダイボンドフィルム
JP2020053453A (ja) 2018-09-25 2020-04-02 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP7440633B2 (ja) 2020-06-10 2024-02-28 三井化学東セロ株式会社 電子装置の製造方法

Also Published As

Publication number Publication date
TW202239850A (zh) 2022-10-16
KR20220086506A (ko) 2022-06-23
CN114634768A (zh) 2022-06-17
JP2022095302A (ja) 2022-06-28

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