JP7490351B2 - Shunt resistor module and mounting structure of the shunt resistor module - Google Patents

Description

This invention relates to a shunt resistor module equipped with a shunt resistor and a mounting structure for the shunt resistor module.

For example, shunt resistors are used to detect current in power semiconductor devices, etc.

Patent Document 1 discloses the structure of a shunt resistor that includes a resistor and electrodes (wiring members) on both sides of the resistor, and a bus bar is connected to the electrodes. The shunt resistor also includes a voltage detection terminal that measures the voltage value between the electrodes.

JP 2016-217829 A

When a current flows through a shunt resistor, a magnetic flux is generated. If the voltage detection terminal is affected by this magnetic flux, the voltage value fluctuates, causing a problem in which the current value cannot be measured accurately.

Therefore, the present invention has been made in consideration of the above problems, and aims to provide a shunt resistor module that can perform current detection with high accuracy, and a mounting structure for the shunt resistor module.

A shunt resistor module according to one embodiment of the present invention comprises a flat shunt resistor having a resistor, a first electrode provided at one end of the resistor, and a second electrode provided at the other end of the resistor, and a plate-shaped conductive member electrically connected to the first electrode and arranged at a distance between the second electrode and the resistor, forming a current path in the opposite direction to the current path flowing through the shunt resistor, wherein in the current path formed by the conductive member and in parallel with the first electrode, the second electrode, and the resistor, the distance in parallel with the resistor is shorter than the distance in parallel with the first electrode and the second electrode, voltage detection terminals are formed on both sides of the resistor, and a substrate connected to a current measurement circuit is arranged on the surface on which the voltage detection terminals are formed.

A mounting structure of a shunt resistor module according to one aspect of the present invention includes a shunt resistor module , a current measurement circuit, and a power semiconductor module, and is a mounting structure of a shunt resistor module in which the shunt resistor module, the current measurement circuit , and the power semiconductor module are connected, the shunt resistor module including a resistor, a flat shunt resistor including a first electrode provided at one end of the resistor, and a second electrode provided at the other end of the resistor, and a current path flowing through the shunt resistor, the current path being electrically connected to the first electrode and disposed at a distance between the second electrode and the resistor, and a plate-shaped conductive member that forms a reverse current path, wherein in the current path through the conductive member that is parallel to the first electrode, the second electrode, and the resistor, a distance in parallel with the resistor is shorter than a distance in parallel with the first electrode and the second electrode, a through hole is formed at an end of the second electrode, an external connection terminal of the power semiconductor module is arranged at a position facing the second electrode of the shunt resistor module, and a fixing member that fixes the shunt resistor module to the external connection terminal is inserted into the through hole, so that the second electrode is electrically connected and fixed to the external connection terminal.

According to the shunt resistor module of the present invention, a conductive member is placed opposite the shunt resistor with a gap between them, and the first electrode of the shunt resistor is electrically connected to the conductive member. This allows current paths in the shunt resistor and the conductive member to be formed in opposite directions, and magnetic flux can be canceled, making it possible to perform current detection with high accuracy.

The mounting structure of the shunt resistor module of the present invention allows the shunt resistor module to be properly connected to a current measurement circuit without damaging the reverse current path between the shunt resistor and the conductive member.

1 is a perspective view of a power semiconductor module including a shunt resistor module according to an embodiment of the present invention; FIG. 2 is an exploded perspective view of the shunt resistor module of the present embodiment. 1 is an exploded perspective view showing an enlarged view of a connection structure of a shunt resistor module to a power semiconductor module according to an embodiment of the present invention. FIG. 1 is a cross-sectional view of a shunt resistor module according to an embodiment of the present invention. FIG. 11 is a cross-sectional view of a shunt resistor module showing another embodiment.

The shunt resistor module according to this embodiment will be described below with reference to the attached drawings.

<Shunt resistor module 1 according to the present embodiment>
For example, when a current flows through a shunt resistor for current detection attached to a power semiconductor module, a magnetic flux is generated according to the right-handed rule. At this time, a large current flows through the shunt resistor, generating a large magnetic flux, which fluctuates the voltage value between the electrodes of the shunt resistor. As a result, a problem occurs in which the current value cannot be detected accurately. As a result of extensive research, the present inventor has developed a structure that can cancel the magnetic flux generated when a current flows through a shunt resistor.

That is, the shunt resistor module 1 of this embodiment has the following features.
(1) The shunt resistor 2 includes a resistor 5, a first electrode 6 provided at one end of the resistor 5, and a second electrode 7 provided at the other end of the resistor 5.
(2) Providing a conductive plate 4 that is electrically connected to the first electrode 6, is spaced apart from the second electrode 7 and the resistor 5, and forms a current path C2 that flows in the opposite direction to the current path C1 that flows through the shunt resistor 2.
The structure of the shunt resistor module 1 of this embodiment will be specifically described below.

Figure 1 is a perspective view of a power semiconductor module 10 including a shunt resistor module 1 according to the present embodiment. Figure 2 is an exploded perspective view of the shunt resistor module 1 according to the present embodiment. Figure 3 is an exploded perspective view showing an enlarged view of the connection structure of the shunt resistor module 1 according to the present embodiment to the power semiconductor module 10. Figure 4 is a cross-sectional view of the shunt resistor module 1 according to the present embodiment.

The power semiconductor module 10 shown in FIG. 1 has semiconductor elements and the like arranged inside a housing 15, and a drive board 16 arranged on the surface of the housing 15. A plurality of external connection terminals 10a to 10d are provided on both ends of the housing 15 in the Y direction, and the shunt resistor module 1 is attached to the external connection terminal 10a, for example. Fixing holes 17 are provided on both sides of the external connection terminals 10a to 10d in the X direction, through which bolts or the like can be inserted to fix the power semiconductor module 10 to external heat dissipation fins or the like.

As shown in FIG. 1, the shunt resistor module 1 and bus bar 11 of this embodiment can be stacked on the external connection terminal 10a of the power semiconductor module 10 and fixed with a fixing member 18.

As shown in FIG. 2, the shunt resistor module 1 of this embodiment includes a shunt resistor 2, an insulating sheet 3 as an insulating member, and a conductive plate 4 as a conductive member. Note that the X1-X2 direction and the Y1-Y2 direction shown in FIG. 2 are two directions that are perpendicular to each other on a plane.

(Shunt resistor 2)
2 and 4, the shunt resistor 2 is in the shape of a flat plate that is longer in the Y1-Y2 direction than its width in the X1-X2 direction, and is configured with a resistor 5, a first electrode 6 provided at one end (Y1 end) of the resistor 5, and a second electrode 7 provided at the other end (Y2 end) of the resistor 5. The first electrode 6 and the second electrode 7 have lower electrical resistance values than the resistor 5. Although there is no limitation on the material, for example, the resistor 5 is a metal such as a Cu-Ni type, a Cu-Mn type, or a Ni-Cr type, and the electrodes 6 and 7 are a metal such as Cu.

2 and 4, the length dimension L1 of the first electrode 6 in the Y1-Y2 direction is shorter than the length dimension L2 of the second electrode 7 in the Y1-Y2 direction. Here, the "length dimension" refers to the length in the direction parallel to the current path C1 formed in the first electrode 6 and the second electrode 7. The second electrode 7 has a length dimension extending from the position of the external connection terminal 10a to the surface of the drive board 16. This allows the second electrode 7 to be connected to the external connection terminal 10a, and allows the pin-shaped voltage detection terminal 8b provided on the second electrode 7, which will be described later, to be properly inserted into the connection hole 16b formed on the surface of the drive board 16 of the power semiconductor module 10. On the other hand, the first electrode 6 only needs to be electrically connected to the conductive plate 4 and have an area in which the voltage detection terminal 8a can be placed, and the length dimension L1 of the first electrode 6 can be shorter than the second length dimension L2. This makes it possible to properly and reliably connect and fix the shunt resistor 2 to the power semiconductor module 10 while suppressing the increase in size.

As shown in Figures 2 and 4, a through hole 2a is formed in the second electrode 7. This through hole 2a is a fixing hole for inserting the fixing member 18, as described below.

As shown in Figs. 2 and 4, voltage detection terminals 8a, 8b are formed on the undersides (opposing sides of the power semiconductor module 10) of the first electrode 6 and the second electrode 7. These voltage detection terminals 8a, 8b are, for example, pin-shaped and protrude toward the power semiconductor module 10. The voltage detection terminals 8a, 8b can be attached to the undersides of the first electrode 6 and the second electrode 7 by welding or the like.

(Insulating sheet 3)
As shown in Figures 2 and 4, the insulating sheet 3 is disposed on top of the flat shunt resistor 2. The term "sheet" means that the insulating sheet 3 is in the form of a thin plate, and the material and structure of the insulating sheet 3 are not particularly limited, provided that the second electrode 7 and resistor 5 are electrically insulated from the conductive plate 4. As an example, the insulating sheet 3 is a sheet made of an insulating polymer such as a polyethylene-based material. The insulating sheet 3 does not have to be a single sheet, and may be separated into multiple sheets. The insulating sheet 3 may be flexible or not.

As shown in FIG. 4, the length dimension L3 of the insulating sheet 3 is shorter than the length dimension L4 of the shunt resistor 2. As shown in FIG. 4, the insulating sheet 3 covers the surfaces of the second electrode 7 and the resistor 5, while the Y1 side end 6a of the surface of the first electrode 6 is not covered by the insulating sheet 3 and is exposed.

As shown in FIG. 2, for example, the width dimension of the insulating sheet 3 (length dimension in the X1-X2 direction) is formed to be approximately the same as the width dimension of the shunt resistor 2, but the width dimension is not limited.

As shown in Figures 2 and 4, the insulating sheet 3 has a through hole 3a of approximately the same size as the through hole 2a formed in the second electrode 7 at a position that overlaps the through hole 2a.

In addition, in this embodiment, the insulating sheet 3 has been described as an example of an insulating member, but an insulating layer can also be formed by coating the surfaces of the second electrode 7 and resistor 5 to provide insulation between the second electrode 7 and resistor 5 and the conductive plate 4. However, using the insulating sheet 3 is preferable because it can more reliably provide electrical insulation between the second electrode 7 and resistor 5 and the conductive plate 4, and also makes the assembly of the shunt resistor module 1 less complicated.

(Conductive plate 4)
2 and 4, the conductive plate 4 is disposed on the insulating sheet 3. In this embodiment, the conductive plate 4 has a length dimension L5 that is approximately the same as that of the shunt resistor 2. The conductive plate 4 may be formed to be longer in the Y1-Y2 direction than the shunt resistor 2. In this case, the conductive plate 4 extends in the Y2 direction from the Y2 side end of the second electrode 7 of the shunt resistor 2. The material of the conductive plate 4 is not limited, but is preferably a material with excellent conductivity. For example, the conductive plate 4 may be made of the same material as the electrodes 6 and 7, or a material having the same main component. Specifically, the conductive plate 4 may be made of a Cu plate.

As shown in FIG. 4, the Y1 side end 4b of the conductive plate 4 abuts and is electrically connected to the Y1 side end 6a of the first electrode 6 that is exposed and not covered by the insulating sheet 3. At this time, it is preferable that the Y1 side end 4b of the conductive plate 4 is formed in a convex shape that protrudes toward the first electrode 6 (the downward direction shown in FIG. 4) so that it can be easily electrically connected to the first electrode 6.

As shown in Figures 2 and 4, the conductive plate 4 has a through hole 4a of approximately the same size as the through holes 2a and 3a at a position that overlaps with them in the thickness direction.

The conductive plate 4 is flat and is formed long in the Y1-Y2 direction, similar to the shunt resistor 2. The conductive plate 4 may be in a shape other than flat, but by making it flat, it can be electrically connected to the first electrode 6 with high precision and the shunt resistor module 1 can be made thinner.

(Assembly of the shunt resistor module 1)
The shunt resistor 2, the insulating sheet 3, and the conductive plate 4 are stacked in the thickness direction, and the Y1 side end 4b of the conductive plate 4 and the first electrode 6 are joined by welding or the like while aligning the positions so that the through holes 2a, 3a, and 4a are continuous in the thickness direction. As a result, the conductive plate 4 and the first electrode 6 are electrically connected, and the insulating sheet 3 is interposed between the second electrode 7 and the resistor 5 and the conductive plate 4, so that they are electrically insulated. The joining method is not limited to welding, and may be a conductive adhesive or solder joining. In addition, as shown in other embodiments described later, it is also possible to screw the first electrode 6 and the conductive plate 4 together. The above-mentioned joining ensures that the Y1 side end 4b of the conductive plate 4 and the first electrode 6 are electrically connected to each other. The through hole 1a (hereinafter, each successive through hole 2a, 3a, 4a will be regarded as one through hole) that penetrates from the second electrode 7 of the shunt resistor module 1 to the conductive plate 4 can also be formed all at once after stacking the shunt resistor 2, the insulating sheet 3 and the conductive plate 4 and joining the Y1 side end 4b of the conductive plate 4 to the first electrode 6.

Except for the joint area between the Y1 end 4b of the conductive plate 4 and the first electrode 6, as shown in FIG. 4, a fixing member 18 such as a screw is inserted into the through hole 1a to fix the second electrode 7, so that the position of the second electrode 7 can also be fixed together with the insulating sheet 3 and the conductive plate 4. Note that the shunt resistor 2 and the insulating sheet 3, and the insulating sheet 3 and the conductive plate 4 may be joined together using an adhesive or the like.

<Mounting structure of shunt resistor module 1>
3 is an exploded perspective view showing an enlarged connection structure of the shunt resistor module 1 of the present embodiment to the power semiconductor module 10. As shown in FIG. 3, the shunt resistor module 1 of the present embodiment is attached to, for example, an external connection terminal 10a of the power semiconductor module 10.

At this time, as shown in Figures 3 and 4, a step is generated between the external connection terminal 10a and the drive substrate 16 located on the surface of the power semiconductor module 10. For this reason, it is preferable to interpose a height-adjusting conductive ring (pedestal) 22 between the shunt resistor module 1 and the external connection terminal 10a to adjust the height of the shunt resistor module 1 to be approximately the same height as the surface of the drive substrate 16. In addition, the shunt resistor module 1 and the external connection terminal 10a are electrically connected via the conductive ring 22.

As shown in FIG. 3, the busbar 11 is placed on top of the shunt resistor module 1. At this time, the through hole 11a formed in the busbar 11 is aligned with the through hole 1a of the shunt resistor module 1, and the fixing member 18 is inserted into the through holes 1a, 11a, for example, via an insulating washer 23, a washer 24, and a spring washer 25. The tip of the fixing member 18 is a threaded portion 18a, and similarly, the external connection terminal 10a is also threaded. Therefore, as the fixing member 18 is inserted into the through holes 1a, 11a, it can be screwed to the external connection terminal 10a, and thus the shunt resistor module 1 and the busbar 11 can be fixed and supported to the external connection terminal 10a.

As shown in FIG. 3, an insulating tube 26 is attached to the peripheral surface of the fixing member 18, except for the screw portion 18a at the tip. The insulating tube 26 can be fixed to the periphery of the fixing member 18 by inserting it into the fixing member 18 and shrinking it. As shown in FIG. 4, when the fixing member 18 is inserted into the through hole 1a, the insulating tube 26 reaches the shunt resistor 2, the insulating sheet 3, the conductive plate 4, and the bus bar 11. Therefore, when a current flows between the external connection terminal 10a and the bus bar 11 through the shunt resistor module 1, a problem that the current flows through the fixing member 18 can be prevented. In addition to the configuration using the insulating tube 26, for example, an insulating layer may be formed by painting, spraying, or vapor-depositing an insulating material on the surface of the fixing member 18.

As shown in FIG. 3, connection holes 16a, 16b into which pin-shaped voltage detection terminals 8a, 8b can be inserted are formed on the surface of the drive substrate 16 of the power semiconductor module 10 at positions facing the voltage detection terminals 8a, 8b of the shunt resistor module 1. By inserting the voltage detection terminals 8a, 8b into the connection holes 16a, 16b, the voltage detection terminals 8a, 8b can be electrically connected to the connection parts 27a, 27b of the current measurement circuit arranged in the connection holes 16a, 16b.

As a result, the shunt resistor module 1 of this embodiment can be attached to the external connection terminal 10a of the power semiconductor module 10, and the voltage detection terminals 8a, 8b can be electrically connected to the connections 27a, 27b of the current measurement circuit.

When measuring current, when a current flows between the power semiconductor module 10 and the busbar 11 via the shunt resistor module 1, the voltage value between the voltage detection terminals 8a, 8b, i.e., the voltage value between the electrodes 6, 7 of the shunt resistor 2, is measured. At this time, since the resistance value of the resistor 5 of the shunt resistor 2 is known, the current value can be detected according to Ohm's law. In this way, the shunt resistor module 1 can be used as a current detection device.

<Effects of this embodiment>
According to the shunt resistor module 1 of the present embodiment, the conductive plates 4 are arranged at intervals in the thickness direction of the shunt resistor 2, and the first electrode 6 of the shunt resistor 2 and the conductive plate 4 are electrically connected. As a result, when the shunt resistor module 1 is attached to the power semiconductor module 10 and current measurement is performed as shown in FIG. 1, the current path flowing through the shunt resistor module 1 is folded back at the shunt resistor 2 and the conductive plate 4. Therefore, as shown in FIG. 4, the current path C1 formed in the shunt resistor 2 and the current path C2 formed in the conductive plate 4 are opposite in direction. At this time, magnetic flux (magnetic field) is generated in the shunt resistor 2 and the conductive plate 4 according to the right-handed screw rule, but since the current paths C1 and C2 are opposite in direction to each other, the magnetic flux generated in the shunt resistor 2 and the conductive plate 4 is in the opposite direction, and the magnetic fluxes can be canceled out (cancelled) by each other. As a result, the influence of the magnetic flux on the voltage detection terminals 8a and 8b provided on the first electrode 6 and the second electrode 7 can be suppressed, and the current detection can be performed with high accuracy.

In this embodiment, as shown in Figures 2 and 4, an insulating sheet 3 is interposed between the second electrode 7 and resistor 5 and the conductive plate 4. This ensures reliable electrical insulation between the second electrode 7 and resistor 5 and the conductive plate 4, and allows the reverse current paths C1 and C2 to be formed precisely in the shunt resistor 2 and the conductive plate 4, enhancing the magnetic flux cancellation effect.

In addition, in this embodiment, a through hole 1a is formed in the shunt resistor module 1 from the second electrode 7 to the conductive plate 4 that faces the second electrode 7 in the thickness direction, and an insulated fixing member 18 is inserted into the through hole 1a. This allows the shunt resistor module 1 to be properly fixed and supported, and prevents the problem of current flowing between the shunt resistor 2 and the conductive plate 4 via the fixing member 18. In addition, the bus bar 11 can be connected to the shunt resistor module 1 by the fixing member 18.

In addition, in this embodiment, the first electrode 6 and the second electrode 7 are provided with the voltage detection terminals 8a, 8b on the side opposite to the conductive plate 4 (the lower side in FIG. 4). This allows the voltage detection terminals 8a, 8b to be formed appropriately. In particular, in the mounting structure of the shunt resistor module 1, it becomes possible to simply and reliably connect the voltage detection terminals 8a, 8b to the current measurement circuit.

In addition, in the mounting structure of the shunt resistor module 1 of this embodiment, an external connection terminal 10a is provided at a position facing the second electrode 7 of the shunt resistor module 1, and the fixing member 18 is inserted, so that the shunt resistor module 1 is fixed to the external connection terminal 10a and the second electrode 7 is electrically connected to the external connection terminal 10a. In this way, in this embodiment, the shunt resistor module 1 can be fixed and supported and electrically connected to the external connection terminal 10a at the same time.

In addition, in the mounting structure of the shunt resistor module 1 of this embodiment, the voltage detection terminals 8a and 8b are connected to the current measurement circuit when the shunt resistor module 1 is fixed to the external connection terminal 10a. In this embodiment, the drive substrate 16 of the power semiconductor module 10 is provided with connection holes 16a and 16b into which the voltage detection terminals 8a and 8b can be inserted, and the connection parts 27a and 27b located in the connection holes 16a and 16b are connected to the current measurement circuit. Therefore, in this embodiment, when the shunt resistor module 1 is attached to the external connection terminal 10a, the voltage detection terminals 8a and 8b can be inserted into the connection holes 16a and 16b, and the voltage detection terminals 8a and 8b can be connected to the current measurement circuit. In this way, in this embodiment, the voltage detection terminals 8a and 8b can be easily and reliably connected to the current measurement circuit at the same time as the shunt resistor module 1 is attached to the power semiconductor module 10.

As described above, in this embodiment, the shunt resistor module 1 and bus bar 11 can be easily and reliably attached to the power semiconductor module 10.

<Configuration of shunt resistor module according to another embodiment>
Fig. 5 is a cross-sectional view of a shunt resistor module 30 showing another embodiment. The shunt resistor module 30 shown in Fig. 5 includes a shunt resistor 31 and a conductive plate 32, but does not include the insulating sheet 3 shown in Fig. 2 and Fig. 4. Note that parts with the same reference numerals as in Fig. 2 and Fig. 4 have substantially the same configuration. As shown in Fig. 5, the Y1 side end 32b of the conductive plate 32 is a convex part that protrudes toward the shunt resistor 31 (the direction shown in the figure), and a predetermined gap is provided between the second electrode 7 and the conductive plate 32.

As shown in FIG. 5, the first fixing member 33 is inserted through the through holes 7a and 32a provided in the second electrode 7 and the conductive plate 32. This allows the distance between the second electrode 7 and the conductive plate 32 to be maintained at a predetermined dimension. However, by not leaving an air layer between the second electrode 7 and the conductive plate 32 and by interposing the insulating sheet 3 shown in FIG. 2 and FIG. 4 between the second electrode 7 and the conductive plate 32, it is possible to more reliably electrically insulate the second electrode 7 and the conductive plate 32. The first fixing member 33 has an insulated surface, similar to the fixing member 18 shown in FIG. 4. This makes it possible to suppress the problem of current flowing between the second electrode 7 and the conductive plate 32 through the first fixing member 33.

In the embodiment shown in FIG. 5, a through hole 30a is formed that is continuous with the first electrode 6 of the shunt resistor module 30 and the Y1 end 32b of the conductive plate 32, and the first electrode 6 and the Y1 end 32b of the conductive plate 32 are fixed and supported by inserting the second fixing member 34 into the through hole 30a. At this time, the surfaces of the first electrode 6 and the Y1 end 32b of the conductive plate 32 are in contact with each other and are electrically connected. In addition, it is preferable that the surface of the second fixing member 34 is conductive. A normal screw can be used for the second fixing member 34. This makes it possible to more reliably electrically connect the first electrode 6 and the conductive plate 32.

5 also serves as a bus bar, and therefore the conductive plate 32 is formed to extend longer in the Y2 direction than the Y2-side end of the second electrode 7 of the shunt resistor 2. In this way, the conductive plate 32 also serves as a bus bar, thereby reducing the number of parts and suppressing the manufacturing cost of the shunt resistor module 30.
Although the present embodiment and the modified examples have been described above, other embodiments may be obtained by combining the above-described embodiment and modified examples in whole or in part.

Furthermore, the present embodiment is not limited to the above-mentioned embodiment and modifications, and may be modified, substituted, or altered in various ways without departing from the spirit of the technical idea. Furthermore, if the technical idea can be realized in a different way due to technological advances or derived other technologies, it may be implemented using that method. Therefore, the claims cover all embodiments that may fall within the scope of the technical idea.

For example, in the present embodiment, the power semiconductor module 10 is taken as an example of a mounting structure for the shunt resistor module 1 , but the electronic component on which the shunt resistor module 1 is mounted may be something other than the power semiconductor module 10 .
The features of the above embodiment are summarized below.

The shunt resistor module described in the above embodiment is characterized by comprising a shunt resistor having a resistor, a first electrode provided at one end of the resistor, and a second electrode provided at the other end of the resistor, and a conductive member electrically connected to the first electrode and disposed at a distance between the second electrode and the resistor, forming a current path in the opposite direction to the current path flowing through the shunt resistor.

In addition, in the shunt resistor module of this embodiment, it is preferable that an insulating member is interposed between the second electrode and the resistor and the conductive member.

In addition, in the shunt resistor module of this embodiment, a through hole is formed from the second electrode to the conductive member at a position opposite the second electrode, and it is preferable that an insulated fixing member is inserted into the through hole.

In addition, in the shunt resistor module of this embodiment, the conductive member can also serve as a bus bar.

In addition, in the shunt resistor module of this embodiment, it is preferable that the first electrode and the second electrode are provided with a voltage detection terminal on the side opposite to the conductive member side.

The mounting structure of the shunt resistor module of the above embodiment is a mounting structure that connects the shunt resistor module to a current measurement circuit, and is characterized in that it has an external connection terminal at a position opposite the second electrode of the shunt resistor module, and the fixing member described above is inserted to fix the shunt resistor module to the external connection terminal and electrically connect the second electrode to the external connection terminal.

In addition, in the mounting structure of the shunt resistor module of this embodiment, it is preferable that the voltage detection terminal described above is connected to the current measurement circuit in addition to fixing the shunt resistor module to the external connection terminal.

As described above, the shunt resistor module of the present invention can detect current with high accuracy and can be used, for example, for current detection in control applications such as power semiconductor devices and for battery energy management.

Reference Signs List 1, 30: shunt resistor module 1a, 30a: through hole 2, 31: shunt resistor 3: insulating sheet 4, 32: conductive plate 5: resistor 6: first electrode 7: second electrode 8a, 8b: voltage detection terminal 10: power semiconductor module 10a: external connection terminal 11: bus bar 15: housing 16: drive board 16a, 16b: connection hole 18: fixing member 22: conductive ring 26: insulating tube 27a, 27b: connection portion 33: first fixing member 34: second fixing member C1, C2: current path

Claims (7)

a flat shunt resistor including a resistor, a first electrode provided at one end of the resistor, and a second electrode provided at the other end of the resistor;
a plate-shaped conductive member electrically connected to the first electrode, disposed at a distance between the second electrode and the resistor, and constituting a current path in a direction opposite to the current path flowing through the shunt resistor;
In the current path formed by the conductive member and in parallel with the first electrode, the second electrode, and the resistor, a distance in parallel with the resistor is shorter than a distance in parallel with the first electrode and the second electrode,
Voltage detection terminals are formed on both sides of the resistor,
A substrate connected to a current measuring circuit is disposed on the surface on which the voltage detection terminal is formed.
A shunt resistor module comprising: The shunt resistor module according to claim 1, characterized in that an insulating member is interposed between the second electrode and the resistor and the conductive member. The shunt resistor module according to claim 1 or 2, characterized in that a through hole is formed from the second electrode to the conductive member at a position opposite the second electrode, and an insulated fixing member is inserted into the through hole. A shunt resistor module according to any one of claims 1 to 3, characterized in that the conductive member also serves as a bus bar. The shunt resistor module according to claim 1, characterized in that a through hole is formed through the end of the second electrode and the end of the conductive member, and the end of the second electrode and the end of the conductive member are configured close to each other. A mounting structure of a shunt resistor module including a shunt resistor module , a current measurement circuit , and a power semiconductor module, the shunt resistor module, the current measurement circuit, and the power semiconductor module being connected to each other ,
The shunt resistor module includes a plate-shaped shunt resistor having a resistor, a first electrode provided at one end of the resistor, and a second electrode provided at the other end of the resistor, and a plate-shaped conductive member electrically connected to the first electrode, disposed at a distance between the second electrode and the resistor, and constituting a current path in a direction opposite to the current path flowing through the shunt resistor ;
In the current path through the conductive member arranged in parallel with the first electrode, the second electrode, and the resistor, a distance in parallel with the resistor is shorter than a distance in parallel with the first electrode and the second electrode;
A through hole is formed at an end of the second electrode,
an external connection terminal of the power semiconductor module is disposed at a position facing the second electrode of the shunt resistor module;
A mounting structure for a shunt resistor module, characterized in that a fixing member for fixing the shunt resistor module to the external connection terminal is inserted into the through hole, and the second electrode is electrically connected and fixed to the external connection terminal. The mounting structure of the shunt resistor module described in claim 6, characterized in that voltage detection terminals are formed on both sides of the resistor, and a substrate connected to the current measurement circuit is disposed on the surface on which the voltage detection terminals are formed.

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