JP7306381B2 - 導体基板、伸縮性配線基板、及び配線基板用伸縮性樹脂フィルム - Google Patents
導体基板、伸縮性配線基板、及び配線基板用伸縮性樹脂フィルム Download PDFInfo
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- JP7306381B2 JP7306381B2 JP2020518322A JP2020518322A JP7306381B2 JP 7306381 B2 JP7306381 B2 JP 7306381B2 JP 2020518322 A JP2020518322 A JP 2020518322A JP 2020518322 A JP2020518322 A JP 2020518322A JP 7306381 B2 JP7306381 B2 JP 7306381B2
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- 238000000790 scattering method Methods 0.000 description 1
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- 238000003756 stirring Methods 0.000 description 1
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- KDYFGRWQOYBRFD-UHFFFAOYSA-L succinate(2-) Chemical compound [O-]C(=O)CCC([O-])=O KDYFGRWQOYBRFD-UHFFFAOYSA-L 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
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- 239000004636 vulcanized rubber Substances 0.000 description 1
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Images
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L21/00—Compositions of unspecified rubbers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
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Description
伸縮性樹脂フィルムを作製するための原材料として以下を準備した。
(A)ゴム成分
・無水マレイン酸変性スチレン-エチレンブチレン-スチレンブロック共重合体エラストマー(商品名「FG1924GT」、クレイトンポリマージャパン株式会社製)
(B)架橋成分
・ジシクロペンタジエン型エポキシ樹脂(商品名「EPICLON HP7200H」、DIC(株)製)
(C)硬化促進剤
・1-ベンジル-2-メチルイミダゾール(商品名「1B2MZ」、四国化成株式会社製)
(D)フィラ
・シリカフィラスラリSE2050(商品名「SE2050KNK」、株式会社アドマテックス製、平均粒径500nm、フェニルアミノ基で表面修飾された球状シリカ粒子、シリカ濃度70質量%のメチルイソブチルケトン分散液)
・シリカフィラスラリC40(商品名「C40」、CIKナノテック株式会社製、フェニルアミノ基で表面修飾されたシリカ粒子、平均粒径100nm、シリカ濃度65質量%のMIBK(メチルイソブチルケトン)分散液)
・シリカフィラスラリC120(商品名「C120」、CIKナノテック株式会社製、フェニルアミノ基で表面修飾されたシリカ粒子、平均粒径30nm、シリカ濃度30質量%のMIBK分散液)
・シリカフィラスラリF19(商品名「F19」、CIKナノテック株式会社製、フェニル基で表面修飾されたシリカ粒子、平均粒径100nm、シリカ濃度70質量%のMIBK分散液)
(E)溶剤
・トルエン
(キャリアフィルム/保護フィルム)
・離型処理ポリエチレンテレフタレート(PET)フィルム(商品名「ピューレックスA31」、帝人デュポンフィルム株式会社製、厚み25μm)
実施例1
100質量部の無水マレイン酸変性スチレン-エチレンブチレン-スチレンブロック共重合体エラストマー(FG1924GT)、200質量部のシリカフィラスラリ(SE2050)、及び50質量部のトルエンを撹拌しながら均一に混合した。得られた混合物に、25質量部のジシクロペンタジエン型エポキシ樹脂(HP7200H)、及び3.75質量部の1-ベンジル-2-メチルイミダゾール(1B2MZ)を加え、混合物を更に撹拌して、樹脂ワニスを得た。得られた樹脂ワニスを、キャリアフィルムの離型処理面上にナイフコータ(株式会社康井精機製「SNC-350」を用いて塗布した。塗膜を乾燥機(株式会社二葉科学製「MSO-80TPS」)中で100℃で20分の加熱により乾燥して、厚み100μmの樹脂層を形成させた。形成された樹脂層に、キャリアフィルムと同じ離型処理PETフィルムを、離型処理面が樹脂層側になる向きで保護フィルムとして貼付けて、積層フィルムを得た。積層フィルムを180℃で60分加熱することにより樹脂層を硬化させて、伸縮性樹脂フィルム(樹脂層の硬化物)を有する積層フィルムを得た。
200質量部のシリカフィラスラリ(SE2050)を70質量部のフィラを含む108質量部のシリカフィラスラリ(C40)に代えたこと以外は実施例1と同様にして、樹脂ワニスを調製した。得られた樹脂ワニスを用いて、実施例1と同様の方法で伸縮性樹脂フィルムを有する積層フィルムを得た。
200質量部のシリカフィラスラリ(SE2050)を70質量部のフィラを含む233質量部のシリカフィラスラリ(C120)に代えたこと以外は実施例1と同様にして、樹脂ワニスを調製した。得られた樹脂ワニスを用いて、実施例1と同様の方法で伸縮性樹脂フィルムを有する積層フィルムを得た。
200質量部のシリカフィラスラリ(SE2050)を70質量部のフィラを含む100質量部のシリカフィラスラリ(F19)に代えたこと以外は実施例1と同様にして、樹脂ワニスを調製した。得られた樹脂ワニスを用いて、実施例1と同様の方法で伸縮性樹脂フィルムを有する積層フィルムを得た。
シリカフィラスラリ(SE2050)、ジシクロペンタジエン型エポキシ樹脂(HP7200H)、及び1-ベンジル-2-メチルイミダゾール(1B2MZ)の配合量を表1に示されるように変更したこと以外は実施例1と同様にして、樹脂ワニスを調製した。得られた樹脂ワニスを用いて、実施例1と同様の方法で伸縮性樹脂フィルムを有する積層フィルムを得た。
100質量部の無水マレイン酸変性スチレン-エチレンブチレン-スチレンブロック共重合体エラストマー(FG1924GT)、25質量部のジシクロペンタジエン型エポキシ樹脂(HP7200H)、及び3.75質量部の1-ベンジル-2-メチルイミダゾール(1B2MZ)を、50質量部のトルエンと混合し、混合物を撹拌して、樹脂ワニスを得た。得られた樹脂ワニスを用いて、実施例1と同様の方法で伸縮性樹脂フィルムを有する積層フィルムを得た。
無水マレイン酸変性スチレン-エチレンブチレン-スチレンブロック共重合体エラストマー(FG1924GT)、及びジシクロペンタジエン型エポキシ樹脂(HP7200H)の配合量を表1に示されるように変更したこと以外は比較例1と同様にして、樹脂ワニス及び積層フィルムを得た。
熱膨張率(CTE)
積層フィルムから得た伸縮性樹脂フィルムのサンプルを用いて、伸縮性樹脂フィルムの0℃から120℃にかけての熱膨張率を以下の条件の熱機械分析(TMA)法で測定した。
装置:SS6000(セイコーインスツル株式会社)
サンプルサイズ:10mm長×3mm幅
荷重:0.05MPa
温度:0~120℃
昇温速度:5℃/min
長さ40mm、幅10mmの短冊状で、キャリアフィルム及び保護フィルムが除去された伸縮性樹脂フィルムの試験片を準備した。この試験片の引張試験をオートグラフ(株式会社島津製作所「EZ-S」)を用いて行い、応力-ひずみ曲線を得た。得られた応力-ひずみ曲線から、室温における引張弾性率を求めた。引張試験は、チャック間距離20mm、引張速度50mm/分の条件で行った。引張弾性率は、応力0.5~1.0Nの範囲の応力-ひずみ曲線の傾きから求めた。
長さ40mm、幅10mmの短冊状で、キャリアフィルム及び保護フィルムが除去された伸縮性樹脂フィルムの試験片を準備した。この試験片の回復率をマイクロフォース試験機(IllinoisTool WorksInc「Instron 5948」)を用いた引張試験により測定した。1回目の引張試験で変位量(ひずみ)Xに達した時点で引張応力を開放して試験片を初期位置に戻し、その後、2回目の引張試験を行ったときに荷重が掛かり始めた時点の位置とXとの差をYとしたとき、式:R=(Y/X)×100で計算されるRの値を回復率として記録した。本実施例では、ひずみXを50%とした。
積層フィルムから保護フィルムを除去し、露出した伸縮性樹脂フィルムの表面のタック値を、タッキング試験機(株式会社レスカ製「TACII」)を用いて測定した。測定条件は、定荷重モード、浸没速度120mm/分、テスト速度600mm/分、荷重100gf、荷重保持時間1秒、温度30℃又は200℃に設定した。
Claims (9)
- 伸縮性樹脂フィルムと、
前記伸縮性樹脂フィルム上に設けられた導体層と、を有し、
前記伸縮性樹脂フィルムがゴム成分、フィラ及び架橋成分を含有する硬化性樹脂組成物の硬化物を含み、前記ゴム成分が、(メタ)アクリロイル基、エポキシ基、スチリル基、アミノ基、イソシアヌレート基、ウレイド基、シアネート基、イソシアネート基、メルカプト基、水酸基、カルボキシル基、及び酸無水物基から選ばれる架橋基を有するゴムを含み、前記ゴム成分が、前記架橋成分との反応により架橋されている、導体基板。 - 前記フィラの平均粒径が10~500nmである、請求項1に記載の導体基板。
- 前記架橋基が、酸無水物基又はカルボキシル基のうち少なくとも一方である、請求項1又は2に記載の導体基板。
- 前記架橋成分が、エポキシ基を有する化合物を含む、請求項3に記載の導体基板。
- 請求項1~4のいずれか一項に記載の導体基板を含み、前記導体層が配線パターンを形成している、伸縮性配線基板。
- ゴム成分、フィラ及び架橋成分を含有する硬化性樹脂組成物の硬化物を含み、前記ゴム成分が、(メタ)アクリロイル基、エポキシ基、スチリル基、アミノ基、イソシアヌレート基、ウレイド基、シアネート基、イソシアネート基、メルカプト基、水酸基、カルボキシル基、及び酸無水物基から選ばれる架橋基を有するゴムを含み、前記ゴム成分が前記架橋成分との反応により架橋されている、配線基板用伸縮性樹脂フィルム。
- 前記フィラの平均粒径が10~500nmである、請求項6に記載の配線基板用伸縮性樹脂フィルム。
- 前記架橋基が、酸無水物基又はカルボキシル基のうち少なくとも一方である、請求項6又は7に記載の配線基板用伸縮性樹脂フィルム。
- 前記架橋成分が、エポキシ基を有する化合物を含む、請求項8に記載の配線基板用伸縮性樹脂フィルム。
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WO2017026420A1 (ja) | 2015-08-07 | 2017-02-16 | 太陽インキ製造株式会社 | 導電性組成物、導電体およびフレキシブルプリント配線板 |
JP2017183328A (ja) | 2016-03-28 | 2017-10-05 | 住友ベークライト株式会社 | 電子装置および電子装置の製造方法 |
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