JP7371172B2 - Substrate processing equipment - Google Patents

Description

The present invention relates to a substrate processing apparatus.

In the manufacturing process of semiconductor devices, in which a laminated structure of integrated circuits is formed on the surface of a semiconductor wafer (hereinafter referred to as a wafer), which is a substrate, cleaning solutions such as chemicals are used to remove minute dust and natural oxide films from the wafer surface. 2. Description of the Related Art A liquid processing process is performed in which a wafer surface is processed using a liquid.

A method is known in which a supercritical processing fluid is used to remove liquid remaining on the surface of a wafer in such a liquid processing step.

For example, Patent Document 1 discloses a substrate processing apparatus that removes liquid remaining on the substrate by bringing a fluid in a supercritical state into contact with the substrate. Further, Patent Document 2 discloses a substrate processing apparatus that uses a supercritical fluid to dissolve an organic solvent from above the substrate and dry the substrate.

Japanese Patent Application Publication No. 2013-12538 Japanese Patent Application Publication No. 2013-16798

By the way, conventionally, in substrate processing apparatuses that use supercritical fluid, the inside of the processing container is under high pressure, so the area of the substrate transfer port has been reduced in order to increase the pressure resistance of the processing container. ing. Therefore, there is a problem that maintenance work inside the processing container is not easy.

The present invention was made against this background, and an object of the present invention is to provide a substrate processing apparatus in which maintenance work inside a processing container can be easily performed.

One aspect of the present invention provides a substrate processing apparatus that includes a container body that accommodates a substrate and processes the substrate using a high-pressure processing fluid, and a container body that carries the substrate into and out of the container body. The present invention relates to a substrate processing apparatus including a transport port, an opening provided in a position different from the transport port in the container body, and a lid member for closing the opening.

According to the present invention, maintenance work inside the processing container can be easily performed.

FIG. 1 is a cross-sectional plan view showing the overall configuration of a cleaning treatment system. FIG. 2 is an external perspective view showing an example of a processing container of a supercritical processing apparatus. FIG. 3 is a sectional view showing an example of a processing container of a supercritical processing apparatus. FIG. 4 is a sectional view showing the periphery of the maintenance opening of the processing container. FIG. 5 is a sectional view showing the periphery of the maintenance opening of the processing container. FIG. 6 is a diagram showing an example of the overall system configuration of a supercritical processing apparatus. FIG. 7 is a diagram for explaining the drying mechanism of IPA, and is an enlarged cross-sectional view that simply shows a pattern as a recessed portion of a wafer. FIGS. 8(a) and 8(b) are cross-sectional views showing the operation when maintaining the processing container of the supercritical processing apparatus. FIG. 9 is a side view showing a modification of the processing container of the supercritical processing apparatus. FIG. 10 is a diagram showing a modified example of a processing container of a supercritical processing apparatus, and is a sectional view showing the vicinity of a fluid discharge part that discharges fluid inside the container main body.

Hereinafter, one embodiment of the present invention will be described with reference to the drawings. Note that the configurations shown in the drawings attached to this specification may include portions whose size, scale, etc. are changed from those of the actual structures for the sake of ease of illustration and understanding.

[Cleaning system configuration]
FIG. 1 is a cross-sectional plan view showing the overall configuration of a cleaning treatment system 1. As shown in FIG.

The cleaning processing system 1 includes a plurality of cleaning apparatuses 2 (two cleaning apparatuses 2 in the example shown in FIG. 1) that supply cleaning liquid to the wafer W to perform the cleaning process, and cleaning liquid remaining on the wafer W after the cleaning process. A plurality of supercritical processing apparatuses 3 (Fig _. 1 In the example shown in , two supercritical processing apparatuses 3) are provided.

In this cleaning processing system 1, a FOUP 100 is placed on a mounting section 11, and wafers W stored in this FOUP 100 are transferred to a cleaning processing section 14 and a supercritical processing section 15 via a loading/unloading section 12 and a delivery section 13. It is handed over. In the cleaning processing section 14 and the supercritical processing section 15 , the wafer W is first carried into the cleaning device 2 provided in the cleaning processing section 14 and subjected to cleaning processing, and then is washed in the supercritical processing section 15 provided in the supercritical processing section 15 . The wafer W is carried into the processing apparatus 3 and undergoes a drying process to remove IPA from the wafer W. In FIG. 1, the symbol "121" indicates the first transport mechanism that transports the wafer W between the FOUP 100 and the transfer section 13, and the symbol "131" indicates the loading/unloading section 12, the cleaning processing section 14, and the supercritical processing section. 15 shows a transfer shelf that serves as a buffer on which wafers W to be transferred to and from 15 are temporarily placed.

A wafer transport path 162 is connected to the opening of the transfer section 13, and a cleaning processing section 14 and a supercritical processing section 15 are provided along the wafer transport path 162. In the cleaning processing section 14, one cleaning device 2 is arranged across the wafer transport path 162, for a total of two cleaning devices 2. On the other hand, in the supercritical processing section 15, one supercritical processing apparatus 3, which functions as a substrate processing apparatus that performs a drying process to remove IPA from the wafer W, is arranged across the wafer transport path 162, and a total of Two supercritical processing apparatuses 3 are installed. A second transport mechanism 161 is arranged in the wafer transport path 162, and the second transport mechanism 161 is provided to be movable within the wafer transport path 162. The wafer W placed on the transfer shelf 131 is received by the second transport mechanism 161, and the second transport mechanism 161 transports the wafer W into the cleaning apparatus 2 and the supercritical processing apparatus 3. Note that the number and arrangement of the cleaning devices 2 and supercritical processing devices 3 are not particularly limited, and may vary depending on the number of wafers W processed per unit time, the processing time of each cleaning device 2 and each supercritical processing device 3, etc. , an appropriate number of cleaning devices 2 and supercritical processing devices 3 are arranged in an appropriate manner.

The cleaning apparatus 2 is configured as a single-wafer type apparatus that cleans the wafers W one by one by, for example, spin cleaning. In this case, while the wafer W is held horizontally and rotated around the vertical axis, a cleaning chemical solution or a rinsing solution for washing away the chemical solution is supplied to the processing surface of the wafer W at an appropriate timing. A cleaning process for the wafer W can be performed. The chemical liquid and rinse liquid used in the cleaning device 2 are not particularly limited. For example, particles and organic contaminants can be removed from the wafer W by supplying an alkaline chemical liquid SC1 (ie, a mixture of ammonia and hydrogen peroxide) to the wafer W. Thereafter, deionized water (DIW), which is a rinsing liquid, is supplied to the wafer W, and the SC1 liquid can be washed away from the wafer W. Furthermore, a diluted hydrofluoric acid aqueous solution (DHF), which is an acidic chemical solution, is supplied to the wafer W to remove the natural oxide film, and then DIW is supplied to the wafer W to remove the diluted hydrofluoric acid aqueous solution from the wafer W. It can also be washed off.

After completing the DIW rinsing process, the cleaning device 2 supplies IPA as a drying prevention liquid to the wafer W while rotating the wafer W, and replaces the DIW remaining on the processed surface of the wafer W with IPA. Thereafter, the rotation of the wafer W is gradually stopped. At this time, a sufficient amount of IPA is supplied to the wafer W, and the surface of the wafer W on which the semiconductor pattern is formed is filled with IPA, and a liquid film of IPA is formed on the surface of the wafer W. . The wafer W is carried out from the cleaning apparatus 2 by the second transport mechanism 161 while maintaining the state in which IPA is filled.

The IPA applied to the surface of the wafer W in this manner serves to prevent the wafer W from drying out. In particular, in order to prevent so-called pattern collapse on the wafer W due to evaporation of IPA during transfer of the wafer W from the cleaning apparatus 2 to the supercritical processing apparatus 3, the cleaning apparatus 2 uses IPA having a relatively large thickness. A sufficient amount of IPA is applied to the wafer W so that a film is formed on the surface of the wafer W.

The wafer W carried out from the cleaning apparatus 2 is carried by the second transport mechanism 161 into the processing container of the supercritical processing apparatus 3 with IPA filled therein, and the IPA is dried in the supercritical processing apparatus 3. will be held.

[Supercritical processing equipment]
Next, details of the drying process using a supercritical fluid performed in the supercritical processing apparatus (substrate processing apparatus) 3 will be explained. First, a configuration example of a processing container into which a wafer W is carried in the supercritical processing apparatus 3 will be described.

FIG. 2 is an external perspective view showing an example of the processing container 301 of the supercritical processing apparatus 3, and FIG. 3 is a sectional view showing an example of the processing container 301.

The processing container 301 accommodates the wafer W and processes the wafer W using a high-pressure processing fluid such as a supercritical fluid. The processing container 301 includes a case-like container main body 311 that accommodates a wafer W, a transfer port 312 for loading and unloading the wafer W into the container main body 311, and a holder for holding the wafer W to be processed horizontally. It includes a plate 316 and a first lid member 315 that supports the holding plate 316 and seals the transfer port 312 when the wafer W is carried into the container body 311. Further, a maintenance opening (opening) 321 is provided in the container body 311 at a position different from the transport port 312 . This maintenance opening 321 is closed by a second lid member 322 except during maintenance.

The container body 311 accommodates the wafer W and processes the wafer W using a processing fluid. The container body 311 is a container in which a processing space 319 capable of accommodating a wafer W having a diameter of 300 mm, for example, is formed. The aforementioned transport port 312 and maintenance opening 321 (for example, an opening with the same size and shape as the transport port 312) are formed at both ends of the processing space 319, and both communicate with the processing space 319.

Furthermore, a discharge port 314 is provided in the wall portion of the container body 311 on the side of the transport port 312 . The discharge port 314 is connected to a discharge side supply line 65 (see FIG. 6), which is provided on the downstream side of the processing container 301 and is used to circulate the processing fluid. Note that although two exhaust ports 314 are illustrated in FIG. 2, the number of exhaust ports 314 is not particularly limited.

Fitting holes 325 and 323 for fitting a first lock plate 327, which will be described later, are formed in a first upper block 312a and a first lower block 312b located above and below the transport port 312, respectively. . Each of the fitting holes 325 and 323 penetrates the first upper block 312a and the first lower block 312b in the vertical direction (direction perpendicular to the surface of the wafer W), respectively.

The holding plate 316 is a thin plate-shaped member configured to be horizontally disposed within the processing space 319 of the container body 311 while holding the wafer W, and is connected to the first lid member 315. Note that a discharge port 316a is provided on the first lid member 315 side of the holding plate 316.

A first lid member accommodation space 324 is formed in a region of the container body 311 on the near side (minus side in the Y direction). The first lid member 315 is accommodated in the first lid member housing space 324 when carrying the holding plate 316 into the processing container 301 and performing supercritical processing on the wafer W. In this case, the first lid member 315 closes the transport port 312 and seals the processing space 319.

The first lock plate 327 is provided on the front side of the processing container 301. The first lock plate 327 serves as a regulating member that prevents the first lid member 315 from moving due to the pressure inside the container body 311 when the holding plate 316 is moved to the processing position. This first lock plate 327 is fitted into the fitting hole 323 of the first lower block 312b and the fitting hole 325 of the first upper block 312a. At this time, since the first lock plate 327 functions as a bolt, the movement of the first lid member 315 and the retaining plate 316 in the front-rear direction (Y direction in FIGS. 2 and 3) is restricted. The first lock plate 327 has a lock position in which it is fitted into the insertion holes 323 and 325 and presses the first lid member 315, and an open position in which it retreats downward from this lock position to open the first lid member 315. The lifting mechanism 326 moves vertically between the positions. In this example, the first lock plate 327, the insertion holes 323 and 325, and the elevating mechanism 326 constitute a regulating mechanism that regulates movement of the first lid member 315 due to pressure within the container body 311. Note that the fitting holes 323 and 325 are each provided with a margin necessary for inserting and removing the first lock plate 327, so there is no space between the fitting holes 323 and 325 and the first lock plate 327 in the locked position. A slight gap C1 (FIG. 3) is formed. Note that, for convenience of illustration, the gap C1 is illustrated in an exaggerated manner in FIG.

The maintenance opening 321 is provided on the wall surface of the container body 311 at a position facing the transport port 312 . Since the maintenance opening 321 and the transport port 312 face each other in this way, when the container body 311 is sealed by the first lid member 315 and the second lid member 322, the pressure in the processing space 319 is reduced to the inner surface of the container body 311. Approximately evenly distributed. Therefore, stress is prevented from concentrating on a specific location of the container body 311. However, the maintenance opening 321 may be provided at a location other than the position facing the transfer port 312, for example, on a wall surface on a side with respect to the direction of movement of the wafer W (Y direction).

The second upper block 321a and the second lower block 321b are located above and below the maintenance opening 321, respectively. Fitting holes 335 and 333 for fitting the second lock plate 337 are formed in the second upper block 321a and the second lower block 321b, respectively. Each of the fitting holes 335 and 333 penetrates the second upper block 321a and the second lower block 321b in the vertical direction (direction perpendicular to the surface of the wafer W, Z direction), respectively.

A second lid member accommodating space 334 is formed in a region on the back side (positive side in the Y direction) of the container body 311. The second lid member 322 is accommodated in the second lid member housing space 334 and closes the maintenance opening 321 except during maintenance. Further, the second lid member 322 is provided with a supply port 313. The supply port 313 is provided on the upstream side of the processing container 301 and is connected to a first supply line 63 (see FIG. 6) through which the processing fluid flows. Note that although two supply ports 313 are illustrated in FIG. 2, the number of supply ports 313 is not particularly limited.

The second lock plate 337 serves as a regulating member that regulates movement of the second lid member 322 due to pressure within the container body 311. This second lock plate 337 is fitted into the fitting holes 333 and 335 around the maintenance opening 321. At this time, since the second lock plate 337 functions as a bolt, movement of the second lid member 322 in the front-rear direction (Y direction) is restricted. The second lock plate 337 has a lock position where it is fitted into the insertion holes 333 and 335 and presses the second lid member 322, and an open position where it retreats downward from this lock position to open the second lid member 322. It is configured to move vertically between the two. In this embodiment, the second lock plate 337 is moved manually, but it may be moved automatically by providing an elevating mechanism substantially similar to the elevating mechanism 326. Note that the fitting holes 333, 335 are provided with margins necessary for inserting and removing the second lock plate 337, so there is no space between the fitting holes 333, 335 and the second lock plate 337 in the locked position. A slight gap C2 (FIG. 3) is formed. Note that, for convenience of illustration, the gap C2 is illustrated in an exaggerated manner in FIG.

In this embodiment, the second lid member 322 is connected to the first supply line 63, and the second lid member 322 is provided with a large number of openings 332. The second lid member 322 serves as a fluid supply header that supplies the processing fluid from the first supply line 63 into the container body 311 . Thereby, when the second lid member 322 is removed during maintenance, maintenance work such as cleaning the opening 332 can be easily performed. Further, a fluid discharge header 318 that communicates with the discharge port 314 is provided on the wall portion of the container body 311 on the side of the transport port 312 . This fluid discharge header 318 is also provided with a number of openings.

The second lid member 322 and the fluid discharge header 318 are installed to face each other. The second lid member 322 functioning as a fluid supply section supplies processing fluid into the container body 311 in a substantially horizontal direction. The horizontal direction here is a direction perpendicular to the vertical direction in which gravity acts, and is usually a direction parallel to the direction in which the flat surface of the wafer W held by the holding plate 316 extends. The fluid discharge header 318, which functions as a fluid discharge section for discharging the fluid in the container body 311, guides the fluid in the container body 311 to the outside of the container body 311 through the discharge port 316a provided in the holding plate 316, and discharges the fluid in the container body 311. do. The fluid discharged to the outside of the container body 311 via the fluid discharge header 318 includes, in addition to the processing fluid supplied into the container body 311 via the second lid member 322, the fluid that has dissolved into the processing fluid from the surface of the wafer W. Contains IPA. In this way, by supplying the processing fluid into the container body 311 through the opening 332 of the second lid member 322 and by discharging the fluid from the container body 311 through the opening of the fluid discharge header 318, A laminar flow of processing fluid flowing approximately parallel to the surface of the wafer W is formed within the main body 311 .

Further, vacuum suction pipes 348 and 349 are connected to the side surface of the container body 311 on the transport port 312 side and the side surface on the maintenance opening 321 side, respectively. The vacuum suction tubes 348 and 349 communicate with a surface of the container body 311 on the first lid member storage space 324 side and a surface on the second lid member storage space 334 side, respectively. The vacuum suction tubes 348 and 349 each play a role of attracting the first lid member 315 and the second lid member 322 toward the container body 311 by vacuum suction force.

Furthermore, a bottom side fluid supply section 341 is formed on the bottom surface of the container body 311 to supply processing fluid into the interior of the container body 311 . The bottom side fluid supply section 341 is connected to a second supply line 64 (see FIG. 6) that supplies high-pressure fluid into the container body 311. The bottom side fluid supply section 341 supplies processing fluid into the container body 311 substantially from below to above. The processing fluid supplied from the bottom side fluid supply unit 341 flows from the back side of the wafer W through the outlet 316a provided in the holding plate 316 to the front surface of the wafer W, and together with the processing fluid from the second lid member 322, The fluid is discharged from the fluid discharge header 318 through a discharge port 316a provided in the holding plate 316. The bottom side fluid supply section 341 is preferably located, for example, below the wafer W introduced into the container body 311, and more preferably below the center of the wafer W. Thereby, the processing fluid from the bottom side fluid supply section 341 can be uniformly distributed around the surface of the wafer W.

As shown in FIG. 3, heaters 345 made of resistive heating elements such as tape heaters are provided on both upper and lower surfaces of the container body 311. The heater 345 is connected to a power supply section 346, and can increase or decrease the output of the power supply section 346 to maintain the temperature of the container body 311 and the processing space 319 within a range of, for example, 100° C. to 300° C.

[Configuration around maintenance opening]
Next, the configuration around the maintenance opening 321 will be further described with reference to FIGS. 4 and 5.

As shown in FIGS. 4 and 5, a recess 328 is formed in the side wall of the second lid member 322 on the processing space 319 side so as to surround a position corresponding to the periphery of the maintenance opening 321. By fitting the seal member 329 into the recess 328, the seal member 329 is arranged on the side wall surface on the second lid member 322 side that comes into contact with the side wall surface around the maintenance opening 321.

The seal member 329 is formed in an annular shape so as to be able to surround the maintenance opening 321 . Further, the cross-sectional shape of the seal member 329 is U-shaped. In the seal member 329 shown in FIGS. 4 and 5, the U-shaped notch 329a is formed along the inner peripheral surface of the annular seal member 329. In other words, the sealing member 329 is formed with an internal space (notch 329a) surrounded by a U-shape.

By closing the periphery of the maintenance opening 321 using the second lid member 322 provided with this seal member 329, the seal member 329 closes the gap between the second lid member 322 and the processing space 319. , is arranged between the opposing surfaces of the second lid member 322 and the container body 311. Since this gap is formed around the maintenance opening 321 in the container body 311, the notch 329a formed along the inner peripheral surface of the sealing member 329 is in communication with the processing space 319. It becomes.

The sealing member 329 whose notch 329a communicates with the processing space 319 will be exposed to the atmosphere of the processing fluid, but the processing fluid may elute components such as resin or rubber or impurities contained therein. There is. Therefore, in the seal member 329, at least the inside of the notch 329a that is open toward the processing space 319 is made of resin that has corrosion resistance against liquid IPA and processing fluid. Examples of such resins include polyimide, polyethylene, polypropylene, paraxylene, and polyetheretherketone (PEEK), and even if a small amount of the component elutes into the processing fluid, it will have little effect on semiconductor devices. It is preferable to use a non-fluorine resin.

The operation of the processing container 301 including the seal member 329 when processing the wafer W using a high-pressure processing fluid in the processing container 301 will be described below.

First, when high-pressure processing fluid is not supplied to the processing space 319 and the pressure inside the container body 311 is not increased, the second lid member is 322 is attracted to the container body 311 side. At this time, as shown in FIG. 4, the side wall surfaces of the second lid member 322 and the container body 311 directly face each other and crush the seal member 329, thereby airtightly closing the periphery of the maintenance opening 321. The seal member 329 crushed by the second lid member 322 and the container body 311 is deformed in a direction in which the notch 329a becomes narrower. If the notch 329a is not completely closed, at this point, the atmosphere in the processing space 319 is flowing into the notch 329a through the gap between the second lid member 322 and the container body 311. .

On the other hand, when high-pressure processing fluid is supplied into the processing space 319 through the opening 332, the second lid member 322 moves in a direction away from the maintenance opening 321. That is, the second lid member 322 moves by the gap C2 (FIG. 3) between the fitting holes 335, 333 around the maintenance opening 321 and the second lock plate 337 due to the pressure received from the processing fluid. When the gap between the second lid member 322 and the container body 311 widens due to the movement of the second lid member 322, the notch 329a expands due to the restoring force of the elastic seal member 329, and the notch 329a opens as shown in FIG. The atmosphere (processing fluid) of the processing space 319 further enters into the cutout 329a (internal space).

When the processing fluid enters the notch 329a, the sealing member 329 is pushed out from inside the notch 329a, and the outer peripheral surface of the sealing member 329 (the surface opposite to the notch 329a) is inserted into the recess 328 of the second lid member 322. A pressing force acts toward the side surface and the side wall surface of the container body 311. As a result, the outer circumferential surface of the seal member 329 comes into close contact with the second lid member 322 and the container body 311, and the gap between the second lid member 322 and the container body 311 is airtightly closed. This type of sealing member 329 has elasticity that can be deformed by the force received from the processing fluid, and is in a state where the gap is airtightly closed against the pressure difference (for example, about 16 to 20 MPa) between the processing space 319 and the outside. can be maintained.

In addition, in this embodiment, the transport port 312 of the container body 311 is also sealed by the first lid member 315 in the same manner as the transport port 312.

That is, as shown in FIG. 3, a recess 338 is formed in the side wall of the first lid member 315 on the processing space 319 side so as to surround a position corresponding to the periphery of the transport port 312. By fitting the seal member 339 into the recess 338, the seal member 339 is arranged on the side wall surface on the first lid member 315 side that comes into contact with the side wall surface around the transport port 312.

The seal member 339 is formed in an annular shape so as to be able to surround the transport port 312 . Further, the cross-sectional shape of the seal member 339 is U-shaped. In this way, by closing the transport port 312 using the first lid member 315 provided with the seal member 339, the seal member 339 closes the gap between the first lid member 315 and the transport port 312. , is arranged between the opposing surfaces of the first lid member 315 and the container body 311. In addition, the configuration for closing the transport port 312 using the first lid member 315 and the sealing member 339 is substantially the same as the configuration for closing the maintenance opening 321 described above.

[Overall system configuration of supercritical processing equipment]
FIG. 6 is a diagram showing an example of the overall system configuration of the supercritical processing apparatus 3. As shown in FIG.

A fluid supply tank 51 is provided upstream of the processing container 301, and the processing fluid is supplied from the fluid supply tank 51 to a supply line for distributing the processing fluid in the supercritical processing apparatus 3. Between the fluid supply tank 51 and the processing container 301, a flow on/off valve 52a, an orifice 55a, a filter 57, and a flow on/off valve 52b are sequentially provided from the upstream side to the downstream side. Note that the terms "upstream side" and "downstream side" as used herein are based on the flow direction of the processing fluid in the supply line.

The flow on/off valve 52a is a valve that adjusts on and off of the supply of processing fluid from the fluid supply tank 51, and when it is open, the processing fluid flows to the downstream supply line, and when it is closed, it flows to the downstream supply line. Do not drain process fluid. When the flow on/off valve 52a is in the open state, a high pressure processing fluid of, for example, 16 to 20 MPa (megapascals) is supplied from the fluid supply tank 51 to the supply line via the flow on/off valve 52a. The orifice 55a plays a role of adjusting the pressure of the processing fluid supplied from the fluid supply tank 51, and the processing fluid whose pressure is adjusted to about 16 MPa, for example, is allowed to flow through the supply line downstream of the orifice 55a. I can do it. The filter 57 removes foreign substances contained in the processing fluid sent from the orifice 55a, and allows the clean processing fluid to flow downstream.

The flow on/off valve 52b is a valve that adjusts supply of processing fluid to the processing container 301 on and off. The first supply line 63 extending from the circulation on-off valve 52b to the processing container 301 is connected to the supply port 313 shown in FIGS. The liquid is supplied into the container body 311 of the processing container 301 through the supply port 313 and the second lid member 322 shown in FIG.

In the supercritical processing apparatus 3 shown in FIG. 6, the supply line branches between the filter 57 and the flow on/off valve 52b. That is, from the supply line between the filter 57 and the flow on/off valve 52b, there is a supply line (second supply line 64) connected to the processing container 301 via the flow on/off valve 52c and the orifice 55b, the flow on/off valve 52d, and the check valve. A supply line connected to the purge device 62 via 58a and a supply line connected to the outside via the flow on/off valve 52e and orifice 55c branch and extend.

A second supply line 64 connected to the processing container 301 via the flow on/off valve 52c and the orifice 55b is connected to the bottom side fluid supply section 341 shown in FIGS. 2 and 3 described above, and is connected to the processing fluid from the flow on/off valve 52c. is supplied into the container body 311 of the processing container 301 via the bottom side fluid supply section 341 shown in FIGS. 2 and 3. The second supply line 64 may be used as an auxiliary flow path for supplying processing fluid to the processing container 301. For example, when supplying a relatively large amount of processing fluid to the processing container 301, such as at the beginning of supplying the processing fluid to the processing container 301, the flow on/off valve 52c is adjusted to the open state, and the pressure is adjusted by the orifice 55b. The processed processing fluid can be supplied to the processing vessel 301.

The supply line connected to the purge device 62 via the flow on/off valve 52d and the check valve 58a is a flow path for supplying an inert gas such as nitrogen to the processing container 301, and is a flow path for supplying an inert gas such as nitrogen to the processing container 301. Utilized while the processing fluid supply is stopped. For example, when the processing container 301 is filled with inert gas to maintain a clean state, the flow on/off valve 52d and the flow on/off valve 52b are adjusted to the open state, and the inert gas sent from the purge device 62 to the supply line is It is supplied to the processing container 301 via the check valve 58a, the flow on/off valve 52d, and the flow on/off valve 52b.

The supply line connected to the outside via the flow on/off valve 52e and the orifice 55c is a flow path for discharging the processing fluid from the supply line. For example, when the supercritical processing apparatus 3 is powered off and the processing fluid remaining in the supply line between the circulation on-off valve 52a and the circulation on-off valve 52b is discharged to the outside, the circulation on-off valve 52e is in an open state. The supply line between the flow on/off valve 52a and the flow on/off valve 52b is communicated with the outside.

On the downstream side of the processing container 301, a flow on/off valve 52f, an exhaust adjustment valve 59, a concentration measurement sensor 60, and a flow on/off valve 52g are sequentially provided from the upstream side to the downstream side.

The flow on/off valve 52f is a valve that adjusts whether or not the discharge of the processing fluid from the processing container 301 is turned on or off. When the processing fluid is to be discharged from the processing container 301, the flow on/off valve 52f is adjusted to the open state, and when the processing fluid is not to be discharged from the processing container 301, the flow on/off valve 52f is adjusted to the closed state. Note that the supply line (discharge side supply line 65) extending between the processing container 301 and the flow on/off valve 52f is connected to the discharge port 314 shown in FIGS. 2 and 3. The fluid in the container body 311 of the processing container 301 is sent toward the flow on/off valve 52f via the fluid discharge header 318 and discharge port 314 shown in FIGS. 2 and 3.

The exhaust adjustment valve 59 is a valve that adjusts the amount of fluid discharged from the processing container 301, and can be configured by, for example, a back pressure valve. The opening degree of the exhaust adjustment valve 59 is adaptively adjusted under the control of the control unit 4 according to the desired amount of fluid discharged from the processing container 301. In this embodiment, for example, a process is performed in which fluid is discharged from the processing container 301 until the pressure of the fluid in the processing container 301 reaches a predetermined pressure. Therefore, when the pressure of the fluid in the processing container 301 reaches a predetermined pressure, the exhaust adjustment valve 59 adjusts its opening so as to shift from the open state to the closed state, and removes the fluid from the processing container 301. Emissions can be stopped.

The concentration measurement sensor 60 is a sensor that measures the IPA concentration contained in the fluid sent from the exhaust adjustment valve 59.

The flow on/off valve 52g is a valve that adjusts whether or not the fluid is discharged from the processing container 301 to the outside. When the fluid is to be discharged to the outside, the flow on/off valve 52g is adjusted to the open state, and when the fluid is not to be discharged, the flow on/off valve 52g is adjusted to the closed state. Note that an exhaust adjustment needle valve 61a and a check valve 58b are provided downstream of the flow on/off valve 52g. The exhaust adjustment needle valve 61a is a valve that adjusts the amount of fluid sent to the outside via the circulation on/off valve 52g, and the opening degree of the exhaust adjustment needle valve 61a is determined according to the desired amount of fluid to be discharged. be adjusted. The check valve 58b is a valve that prevents the discharged fluid from flowing back, and plays a role in reliably discharging the fluid to the outside.

In the supercritical processing apparatus 3 shown in FIG. 6, the supply line branches between the concentration measurement sensor 60 and the flow on/off valve 52g. That is, from the supply line between the concentration measurement sensor 60 and the circulation on/off valve 52g, there is a supply line connected to the outside via the circulation on/off valve 52h, a supply line connected to the outside via the circulation on/off valve 52i, and a circulation on/off line. A supply line connected to the outside via the valve 52j branches and extends.

The flow on/off valve 52h and the flow on/off valve 52i are valves that adjust on and off of discharge of fluid to the outside, similar to the flow on/off valve 52g. An exhaust adjustment needle valve 61b and a check valve 58c are provided on the downstream side of the circulation on/off valve 52h to adjust the amount of fluid discharged and prevent backflow of the fluid. A check valve 58d is provided downstream of the flow on/off valve 52i to prevent backflow of fluid. The circulation on/off valve 52j is also a valve that adjusts the ON/OFF state of discharging fluid to the outside, and an orifice 55d is provided on the downstream side of the circulation on/off valve 52j, and the fluid is discharged from the circulation on/off valve 52j to the outside via the orifice 55d. can be discharged. However, in the example shown in FIG. 6, the destination of the fluid sent to the outside via the circulation on/off valve 52g, the circulation on/off valve 52h, and the circulation on/off valve 52i, and the destination of the fluid sent to the outside via the circulation on/off valve 52j. are different. Therefore, while the fluid is sent to a recovery device (not shown) via, for example, the flow on/off valve 52g, the flow on/off valve 52h, and the flow on/off valve 52i, it is also possible to discharge the fluid to the atmosphere via the flow on/off valve 52j.

When discharging fluid from the processing container 301, one or more of the flow on/off valve 52g, the flow on/off valve 52h, the flow on/off valve 52i, and the flow on/off valve 52j is adjusted to an open state. In particular, when the power of the supercritical processing apparatus 3 is turned off, the flow on/off valve 52j is adjusted to an open state so that the fluid remaining in the supply line between the concentration measurement sensor 60 and the flow on/off valve 52g is discharged to the outside. Good too.

Note that pressure sensors that detect the pressure of the fluid and temperature sensors that detect the temperature of the fluid are installed at various locations on the above-mentioned supply line. In the example shown in FIG. 6, a pressure sensor 53a and a temperature sensor 54a are provided between the flow on/off valve 52a and the orifice 55a, a pressure sensor 53b and a temperature sensor 54b are provided between the orifice 55a and the filter 57, and the filter A pressure sensor 53c is provided between the flow on/off valve 52b and the flow on/off valve 52b, a temperature sensor 54c is provided between the flow on/off valve 52b and the processing container 301, and a temperature sensor 54d is provided between the orifice 55b and the processing container 301. It is provided. Further, a pressure sensor 53d and a temperature sensor 54f are provided between the processing container 301 and the flow on/off valve 52f, and a pressure sensor 53e and a temperature sensor 54g are provided between the concentration measurement sensor 60 and the flow on/off valve 52g. Furthermore, a temperature sensor 54e for detecting the temperature of the fluid in the container body 311, which is the inside of the processing container 301, is provided.

Further, in the supercritical processing apparatus 3, a heater H is provided at any location through which the processing fluid flows. FIG. 6 shows supply lines upstream of the processing container 301 (i.e., between the flow on/off valve 52a and the orifice 55a, between the orifice 55a and the filter 57, between the filter 57 and the flow on/off valve 52b, and the flow on/off valve 52b). Although the heater H is shown in the figure between the processing container 301 and the processing container 301, the heater H may be provided at other locations including the processing container 301 and the supply line downstream of the processing container 301. Therefore, the heater H may be provided in the entire flow path until the processing fluid supplied from the fluid supply tank 51 is discharged to the outside. In particular, from the viewpoint of adjusting the temperature of the processing fluid supplied to the processing container 301, it is preferable that the heater H is provided at a position where the temperature of the processing fluid flowing upstream of the processing container 301 can be adjusted. preferable.

Further, a safety valve 56a is provided between the orifice 55a and the filter 57, a safety valve 56b is provided between the processing container 301 and the flow on/off valve 52f, and a safety valve 56b is provided between the concentration measurement sensor 60 and the flow on/off valve 52g. is provided with a safety valve 56c. These safety valves 56a to 56c serve to connect the supply line to the outside in an abnormal situation such as when the pressure in the supply line becomes excessive, and to emergencyally discharge the fluid in the supply line to the outside.

[Supercritical drying treatment]
Next, the drying mechanism of IPA using a processing fluid in a supercritical state will be explained.

FIG. 7 is a diagram for explaining the drying mechanism of IPA, and is an enlarged cross-sectional view schematically showing a pattern P as a recessed portion of the wafer W.

Initially, when the processing fluid R in a supercritical state is introduced into the container body 311 of the processing container 301 in the supercritical processing apparatus 3, only IPA is filled between the patterns P, as shown in FIG. 7(a). There is.

The IPA between the patterns P comes into contact with the processing fluid R in a supercritical state, gradually dissolves in the processing fluid R, and gradually replaces the processing fluid R as shown in FIG. 7(b). At this time, in addition to IPA and processing fluid R, a mixed fluid M in which IPA and processing fluid R are mixed exists between patterns P.

Then, as the replacement of IPA with processing fluid R progresses between patterns P, IPA is removed from between patterns P, and finally, as shown in FIG. 7(c), processing fluid R in a supercritical state The space between the patterns P is filled only by the pattern P.

After IPA is removed from between the patterns P, by lowering the pressure inside the container body 311 to atmospheric pressure, the processing fluid R changes from a supercritical state to a gaseous state, as shown in FIG. The space between P is occupied only by gas. In this way, the IPA between the patterns P is removed, and the drying process of the wafer W is completed.

Based on the mechanism shown in FIGS. 7(a) to 7(d) described above, the supercritical processing apparatus 3 of this embodiment performs the drying process of IPA as follows.

In other words, the substrate processing method performed by the supercritical processing apparatus 3 includes a step of transporting a wafer W having a pattern P filled with IPA for drying prevention into the container body 311 of the processing container 301, and a step of transporting the wafer W into the container body 311 of the processing container 301, and A step of supplying a supercritical processing fluid into the container body 311 via the supply tank 51, the flow on/off valve 52a, the flow on/off valve 52b, and the second lid member 322), and a step of performing a drying process to remove the , using a processing fluid in a supercritical state.

That is, first, a wafer W that has been subjected to a cleaning process in the cleaning apparatus 2 is transferred to the supercritical processing apparatus 3 . In this cleaning device 2, for example, particles and organic contaminants are removed using liquid SC1, which is an alkaline chemical solution, rinsing is performed using deionized water (DIW), which is a rinsing liquid, and dilute hydrofluoric acid aqueous solution (DHF), which is an acidic chemical liquid, is used. Removal of the natural oxide film and rinsing using DIW are performed in this order, and finally, IPA is deposited on the wafer surface. The wafer W is then carried out from the cleaning device 2 in this state and transferred to the processing container 301 of the supercritical processing device 3.

This transportation to the processing container 301 is performed using, for example, the second transportation mechanism 161 (see FIG. 1). When transporting a wafer to the processing container 301, the second transport mechanism 161 delivers the wafer W to the holding plate 316 waiting at the delivery position, and then retreats from a position above the holding plate 316.

Next, the holding plate 316 is slid horizontally to move the holding plate 316 to a processing position within the container body 311. At this time, the first lid member 315 is accommodated in the first lid member housing space 324 and covers the transport port 312. Subsequently, the first lid member 315 is attracted to the container body 311 by the suction force from the vacuum suction tube 348 (FIGS. 2 and 3), and the transport port 312 is closed by the first lid member 315. Next, the first lock plate 327 is raised to the lock position by the lifting mechanism 326, and the first lock plate 327 and the front surface of the first lid member 315 are brought into contact with each other, thereby restricting the movement of the first lid member 315.

Next, before the IPA pooled on the surface of the wafer W dries, the flow on/off valves 52b and 52c are opened to supply high pressure to the processing space 319 via the first supply line 63 and the second supply line 64. Supply processing fluid. As a result, the pressure within the processing space 319 is increased to, for example, about 14 to 16 MPa. As the processing space 319 is pressurized, a sealing member 339 with a U-shaped cross section provided in the recess 338 of the first lid member 315 is pushed open, and the gap between the first lid member 315 and the container body 311 is airtight. to block.

On the other hand, in the processing space 319, when the processing fluid supplied into the processing space 319 comes into contact with the IPA filled in the wafer W, the filled IPA gradually dissolves in the processing fluid, and the processing fluid gradually dissolves into the processing fluid. Replaced with As the replacement of IPA with the processing fluid progresses between the patterns on the wafer W, IPA is removed from between the patterns, and eventually the spaces between the patterns P are filled only with the processing fluid in the supercritical state. As a result, the surface of the wafer W is replaced with the processing fluid from liquid IPA, but since no interface is formed between the liquid IPA and the processing fluid in an equilibrium state, the wafer W can be processed without causing pattern collapse. The fluid on the W surface can be replaced with a processing fluid.

Thereafter, when a preset time has elapsed since the processing fluid was supplied into the processing space 319 and the surface of the wafer W has been replaced with the processing fluid, the flow on/off valve 52f is opened and the processing fluid is supplied to the processing space 319. The atmosphere inside the container body 311 is discharged from the fluid discharge header 318 toward the outside of the container body 311. As a result, the pressure within the container body 311 gradually decreases, and the processing fluid within the processing space 319 changes from a supercritical state to a gaseous state. At this time, since no interface is formed between the supercritical state and the gas, the wafer W can be dried without applying surface tension to the pattern formed on the surface of the wafer W.

After the supercritical processing of the wafer W is completed through the above process, in order to discharge the gas processing fluid remaining in the processing space 319, _N2 gas is supplied from a purge gas supply line (not shown) to the fluid discharge header. Purge towards 318. Then, when the purge is completed by supplying N ₂ gas for a predetermined time and the inside of the container body 311 returns to atmospheric pressure, the first lock plate 327 is lowered to the open position. Then, the holding plate 316 is moved horizontally to the delivery position, and the wafer W that has undergone supercritical processing is carried out using the second transport mechanism 161.

By the way, while performing the above-mentioned supercritical treatment, the second lock plate 337 is always raised to the lock position. As a result, the second lock plate 337 and the rear surface of the second lid member 322 come into contact with each other, and movement of the second lid member 322 is restricted. When high-pressure processing fluid is not supplied to the processing space 319 and the pressure within the container body 311 is not increased, the side wall surfaces of the second lid member 322 and the container main body 311 directly face each other and the seal member 329 is crushed to airtightly close the area around the maintenance opening 321.

On the other hand, when high-pressure processing fluid is supplied to the processing space 319, the second lid member 322 opens the processing space by a gap C2 between the fitting holes 335, 333 around the maintenance opening 321 and the second lock plate 337. 319 (positive side in the Y direction). The movement of the second lid member 322 widens the gap between the second lid member 322 and the container body 311. In this case, the notch 329a expands due to the restoring force of the elastic seal member 329, so that the outer circumferential surface of the seal member 329 comes into close contact with the second lid member 322 and the container body 311. The gap between the two is airtightly closed. In this manner, the second lid member 322 keeps the maintenance opening 321 closed while the above-described supercritical treatment is being performed.

[Effect during maintenance]
Next, a description will be given of the operation when maintenance of the processing container 301 is performed after the above-described supercritical processing is completed.

First, the inside of the processing space 319 is opened to atmospheric pressure. Next, the first lock plate 327 is moved downward from the insertion holes 323 and 325 by the elevating mechanism 326, and is brought to an open position where the first lid member 315 is opened. Next, the first lid member 315 and the holding plate 316 are moved to the front side (the negative side in the Y direction). As a result, the holding plate 316 is taken out from the processing space 319, and the first lid member 315 is separated from the transport port 312 (FIG. 8(a)).

Next, the second lock plate 337 is moved downward from the insertion holes 333 and 335 to an open position where the second lid member 322 is opened. Next, the second lid member 322 is moved to the back side (the positive side in the Y direction), and the second lid member 322 is separated from the maintenance opening 321 (FIG. 8(b)).

Subsequently, cleaning jigs, tools, and the like are inserted through the maintenance opening 321 to perform maintenance work (cleaning, adjustment, etc.) inside the processing space 319. In this embodiment, it is possible to access the inside of the processing space 319 by simply moving the second lock plate 337 downward and removing the second lid member 322, which facilitates such maintenance work. It can be carried out. In addition, since the supply port 313 is connected to the second lid member 322, maintenance work (cleaning, adjustment, etc.) of the supply port 313 and the opening 332 can be easily performed in addition to the maintenance work inside the processing space 319. be able to.

After the maintenance work is completed in this manner, the second lid member 322 and the first lid member 315 are respectively assembled to the container body 311 by performing the steps opposite to those described above. That is, first, the second lid member 322 is moved to the front side (the negative side in the Y direction), and the maintenance opening 321 is covered by the second lid member 322 . Next, the second lid member 322 is sucked toward the container body 311 by the suction force from the vacuum suction tube 349. Next, the second lock plate 337 is raised and inserted into the insertion holes 333 and 335, thereby setting the second lid member 322 in a locked position. As a result, the area around the maintenance opening 321 is airtightly closed.

Next, by moving the first lid member 315 and the holding plate 316 to the back side (positive side in the Y direction), the holding plate 316 enters into the processing space 319, and the transport port 312 is closed by the first lid member 315. cover. Next, the first lid member 315 is sucked toward the container body 311 by the suction force from the vacuum suction tube 348 . Subsequently, the first lock plate 327 is raised by the elevating mechanism 326, and the first lock plate 327 is fitted into the fitting holes 323 and 325 to be in the locked position. In this way, the area around the transfer port 312 is airtightly closed, and the processing space 319 is sealed again. Thereafter, the above-mentioned supercritical treatment is performed as necessary.

As described above, according to the present embodiment, the maintenance opening 321 is provided in the container body 311 at a position different from the transport port 312, and the maintenance opening 321 is closed by the second lid member 322. It will be done. Thereby, simply by removing the second lid member 322, the processing space 319 of the container body 311 can be easily accessed. In this case, maintenance work on the container body 311 can be easily performed, so that the work efficiency of the maintenance work can be improved.

Further, according to the present embodiment, a second lock plate 337 is provided that restricts movement of the second lid member 322 due to pressure within the container body 311. This prevents the second lid member 322 from moving by the second lock plate 337, and prevents the second lid member 322 from coming off from the maintenance opening 321 due to the pressure inside the container body 311. .

Further, according to the present embodiment, the container body 311 is provided with the fitting holes 323 and 325, and the second lock plate 337 regulates the second lid member 322 by being fitted into the fitting holes 323 and 325. Thereby, the second lid member 322 can be removed from the maintenance opening 321 by pulling out the second lock plate 337 from the insertion holes 323 and 325. In this case, for example, there is no need to perform work such as removing bolts, so maintenance work can be easily performed.

Further, according to this embodiment, the first supply line 63 that supplies the processing fluid into the container body 311 is connected to the second lid member 322 via the supply port 313. Thereby, when the second lid member 322 is removed from the maintenance opening 321, maintenance work on members for supplying processing fluid, such as the supply port 313, can also be performed.

Furthermore, according to this embodiment, the maintenance opening 321 is provided at a position facing the transport port 312. This prevents stress from concentrating on specific locations such as the maintenance opening 321 when the pressure of the container body 311 is increased, and the durability of the container body 311 can be increased.

Further, according to this embodiment, the second supply line 64 that supplies the processing fluid into the container body 311 is connected to the bottom surface of the container body 311 via the bottom side fluid supply section 341 . As a result, the processing fluid can be supplementarily supplied into the container body 311 from the back side of the wafer W, so that the process of supplying the processing fluid to the processing container 301 can be diversified. For example, the bottom side fluid supply section 341 may be used when supplying the processing fluid to the wafer W at a low flow rate, such as at the beginning of supplying the processing fluid to the processing container 301. Collapse can be more reliably prevented.

[Modified example of processing container]
Next, a modification of the processing container 301 of the supercritical processing apparatus 3 will be described with reference to FIG. FIG. 9 is a side view showing a modification of the processing container 301. In FIG. 9, the same parts as those in the embodiment shown in FIGS. 1 to 8 are given the same reference numerals.

In FIG. 9, the processing container 301 is placed on a chamber base 402, and the chamber base 402 is arranged above the main base 401 and apart from the main base 401. This main base 401 is a member that serves as a reference for installing the processing container 301, and is fixed horizontally within the cleaning processing system 1, for example. A plurality of level adjustment mechanisms 403 and 404 are provided between the main base 401 and the chamber base 402. These level adjustment mechanisms 403 and 404 finely adjust the position level (angle and height position) of the processing container 301 and chamber base 402 with respect to the main base 401, and are a first level adjustment mechanism located below the processing container 301. It consists of a mechanism 403 and a second level adjustment mechanism 404 located apart from the processing container 301 in the plane direction. Among these, the first level adjustment mechanism 403 mainly supports the processing container 301, which is a heavy object, and adjusts its height direction position, and has a higher load capacity than the second level adjustment mechanism 404. There is. Although only one first level adjustment mechanism 403 is shown in FIG. 9, a plurality of first level adjustment mechanisms 403 may be provided. Further, the second level adjustment mechanism 404 adjusts the level of the entire chamber base 402. Although four second level adjustment mechanisms 404 are illustrated in FIG. 9, the number of second level adjustment mechanisms 404 is not limited to this.

Further, in FIG. 9, the container body 311 of the processing container 301 is formed into one block shape as a whole. In the container body 311, two heater openings 411 are formed above and below the processing space 319, respectively. Each heater opening 411 extends in an elongated manner along the longitudinal direction of the transport port 312 (direction perpendicular to the paper surface of FIG. 9). An elongated heater block 412 is loosely inserted into each heater opening 411, respectively. That is, the cross-sectional shape of the heater block 412 perpendicular to the longitudinal direction is formed to be slightly smaller than the heater opening 411, so that the heater block 412 can be inserted into and removed from the heater opening 411. ing. Each heater block 412 is provided with an elongated heater 345 made of, for example, a resistance heating element. Heat from this heater 345 is transmitted to the container body 311 via the heater block 412. Note that each heater block 412 is preferably made of a metal with good thermal conductivity, such as aluminum.

A plurality of tapped holes 414 are formed through the top surface of the container body 311, and a pressing member 413 such as a bolt or screw is screwed into each tapped hole 414. Then, by screwing each pressing member 413 into the tapped hole 414, the tip of the pressing member 413 presses the heater block 412 downward. Thereby, the heater block 412 is fixed so as not to move relative to the container body 311. In this case, even if the position of the heater block 412 is slightly shifted in the longitudinal direction of the heater block 412 (direction perpendicular to the paper surface of FIG. 9), the heater block 412 can be securely fixed to the container body 311. . Furthermore, by pressing the heater block 412 downward, the lower surface of the heater block 412 is securely brought into close contact with the container body 311, so that heat from the heater 345 is efficiently transferred to the container body 311. can do. Although not shown, the bottom surface of the container body 311 has substantially the same structure. That is, a plurality of tap holes are formed through the bottom surface of the container body 311, and the heater block 412 is pressed upward by a pressing member screwed into each tap hole.

Next, another modification of the processing container 301 of the supercritical processing apparatus 3 will be described with reference to FIG. FIG. 10 is a sectional view showing another modification of the processing container 301. In FIG. 10, the same parts as those in the embodiment shown in FIGS. 1 to 8 are given the same reference numerals.

In FIG. 10, a fluid discharge pipe 501 is provided on the transport port 312 side within the container body 311 in place of the fluid discharge header 318 (FIGS. 2 and 3). In this case, the fluid discharge pipe 501 is made of a substantially cylindrical member. Furthermore, an elongated accommodation groove 502 is formed along the longitudinal direction (X direction) of the transport port 312 on the bottom surface of the processing space 319 near the transport port 312 side. The fluid discharge pipe 501 is removably housed in the housing groove 502 . A large number of holes 503 are provided in the fluid discharge pipe 501 at approximately equal intervals along the longitudinal direction. This fluid discharge pipe 501 functions as a fluid discharge part for discharging the fluid in the container body 311, and the fluid in the processing space 319 is discharged to the outside of the container body 311 through the opening 503. .

Circular fixing rings 504 are attached to both ends of the fluid discharge pipe 501, respectively. Note that in FIG. 10, only one fixing ring 504 is shown. A mounting hole 505 is formed in the surface of the fixing ring 504 facing the container body 311 side, and the mounting hole 505 communicates with an outer opening 506 . One end of the fluid discharge pipe 501 is inserted into the attachment hole 505, and the fluid discharge pipe 501 and the outer opening 506 are brought into airtight contact with the packing 507 disposed in the attachment hole 505. Furthermore, around the outer opening 506, a discharge port 314 is fixed to the fixing ring 504, for example by welding. In this way, the fluid from the processing space 319 is discharged to the outside through the fluid discharge pipe 501, the attachment hole 505, the outer opening 506, and the discharge port 314 in this order.

Each fixing ring 504 is accommodated in a recess 508 formed in the side surface of the container body 311, and is fixed to the container body 311 by a mounting member 511 such as a bolt. A packing 509 is fitted into the surface of the fixing ring 504 on the side of the container body 311, and the packing 509 brings the fixing ring 504 and the container body 311 into airtight contact.

In FIG. 10, the fluid discharge tube 501 can be removed from the container body 311 by removing the fixing ring 504 from the container body 311. Thereby, cleaning and replacement of the fluid discharge pipe 501 can be easily performed. Further, the opening 503 of the fluid discharge pipe 501 can be easily formed.

The present invention is not limited to the above-described embodiments and modified examples, and may include various aspects with various modifications that can be thought of by those skilled in the art, and the effects achieved by the present invention are not limited to the above-described embodiments and modifications. This is not limited to the following matters. Therefore, various additions, changes, and partial deletions can be made to each element described in the claims and specification without departing from the technical idea and gist of the present invention.

For example, the processing fluid used in the drying process may be a fluid other than CO ₂ , and any fluid that can remove the drying prevention liquid filled in the recess of the substrate in a supercritical state may be used as the processing fluid. be able to. Further, the liquid for preventing drying is not limited to IPA, and any liquid that can be used as a liquid for preventing drying can be used.

Furthermore, in the above description, the maintenance opening 321 has the same size as the opening of the transport port 312, but the size and shape of the maintenance opening 321 are not limited to this. The maintenance opening 321 may be provided with a size or shape that allows the wafer W housed in the container body 311 to be taken out, or a size or shape that allows the fragments of the broken wafer W to be taken out, for example. Further, the size or shape may be such that cleaning jigs, tools, and the like can be inserted to perform maintenance work (cleaning, adjustment, etc.) inside the processing space 319.

Further, in the above-described embodiments and modified examples, the present invention is applied to a substrate processing apparatus and a substrate processing method, but the subject matter to which the present invention is applied is not particularly limited. For example, the present invention is applicable to a program for causing a computer to execute the above-described substrate processing method, and a computer-readable non-transitory recording medium recording such a program.

3 Supercritical processing apparatus 301 Processing container 311 Container main body 312 Transfer port 313 Supply port 314 Discharge port 315 First lid member 316 Holding plate 318 Fluid discharge header 319 Processing space 321 Maintenance opening (opening)
322 Second lid member 327 First lock plate 337 Second lock plate W Wafer

Claims (3)

In the substrate processing equipment,
a container body that is a structure that houses a substrate and has a processing space in which the substrate is processed using a high-pressure processing fluid;
a transport port for loading and unloading the substrate into the container body;
an opening provided in the container body at a position different from the transport port;
comprising a lid member that closes the opening,
The container main body is provided with at least two heaters, the at least two heaters are provided at positions sandwiching the processing space ,
A heater opening is formed in the container body, and the heater can be inserted into and removed from the heater opening,
A substrate processing apparatus , wherein the heater is provided in a heater block, and the heater block is loosely inserted into the heater opening . The substrate processing apparatus according to claim 1, wherein a plurality of heaters are provided along the loading and unloading directions of the substrate. The substrate processing apparatus according to claim 1 or 2 , wherein the heater block is pressed by a pressing member.

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