JP7352358B2 - Manufacturing method for multiple mounting boards - Google Patents

Description

The present invention relates to a method of manufacturing a plurality of mounting boards.

For example, Patent Document 1 discloses a method for manufacturing a plurality of mounting boards. In this manufacturing method, multiple wiring patterns are formed on a board, electronic components (e.g. light emitting elements) are mounted on each wiring pattern, and the board is cut with a blade to manufacture multiple mounted boards (patented). Specification paragraphs “0058” to “0071” of Document 1, FIG. 7, etc.).

JP2016-6828A

In the manufacturing method disclosed in Patent Document 1, after electronic components are mounted on a board, the board is cut to manufacture a plurality of mounting boards. In the case of this manufacturing method, a load (stress) is applied to, for example, a joint (for example, solder) between an electronic component and a wiring pattern when the board is cut. Therefore, the mounting board manufactured by this manufacturing method may have a bonding failure at the above-mentioned bonding portion.

The present invention aims to provide a highly reliable method for manufacturing a plurality of mounted boards from a plurality of individual boards obtained by cutting a board with a blade.

A method for manufacturing a plurality of mounted substrates according to a first aspect of the present invention is a step of obtaining a plurality of individual substrates by cutting a substrate having a plurality of wiring patterns formed on the front surface and fixed with a fixing member on the back surface. , a cutting step of cutting the substrate with a blade while the fixing member is fixed to the substrate, and a state in which the plurality of individual substrates are arranged in the positional relationship at the time of cutting while being fixed to the fixing member. , a mounting step of mounting electronic components on each of the plurality of individual boards to obtain a plurality of mounted boards, and a separating step of separating the fixing member from the plurality of mounted boards ,
Before the cutting step, a pattern forming step of forming the plurality of wiring patterns on the surface of the substrate,
After the pattern forming step and before the cutting step, a phosphor layer forming step of forming a phosphor layer on the surface of the substrate,
After the cutting step and before the separating step, performing the mounting step,
The mounting step is performed after the phosphor layer forming step .

The method for manufacturing a plurality of mounted boards according to a second aspect of the present invention is the method for manufacturing a plurality of mounted boards according to the first aspect, in which the electronic component is bonded to the wiring pattern with solder, and the electronic component is bonded to the wiring pattern by solder. implemented in each.

A method for manufacturing a plurality of mounting substrates according to a third aspect of the present invention is a method for manufacturing a plurality of mounting substrates according to the first or second aspect, wherein the thickness of the substrate is 600 μm or less.

A method for manufacturing a plurality of mounted substrates according to a fourth aspect of the present invention is a method for manufacturing a plurality of mounted substrates according to any one of the first to third aspects. It is fixed across both sides of the cut line formed by cutting with the blade.

A method for manufacturing a plurality of mounting substrates according to a fifth aspect of the present invention is a method for manufacturing a plurality of mounting substrates according to any one of the first to fourth aspects, wherein the fixing member is provided with an adhesive material or an adhesive layer. The fixing member is adhered and fixed to the back surface by the adhesive material or the adhesive layer.

A method for manufacturing a plurality of mounted substrates according to a sixth aspect of the present invention is a method for manufacturing a plurality of mounted substrates according to a fifth aspect, wherein the fixing member has a fixing member main body, and the adhesive material or the adhesive layer includes: It is adhered to the surface of the fixing member body, and the adhesive force of the adhesive material or the adhesive layer to the surface of the fixing member body is greater than the adhesive force of the adhesive material or the adhesive layer to the back surface of the substrate.

A method for manufacturing a plurality of mounted substrates according to a seventh aspect of the present invention is a method for manufacturing a plurality of mounted substrates according to any one of the first to sixth aspects , in which the step of manufacturing a plurality of mounted substrates is performed after the pattern forming step and before the separating step. , includes an inspection step of performing one or both of a mounting inspection of the electronic component and an appearance inspection of the plurality of mounting boards.

A method for manufacturing a plurality of mounting substrates according to an eighth aspect of the present invention is a method for manufacturing a plurality of mounting substrates according to any one of the first to seventh aspects, wherein the electronic component is a light emitting element.

A method for manufacturing a plurality of mounted substrates according to a ninth aspect of the present invention is a method for manufacturing a plurality of mounted substrates according to any one of the first to sixth aspects , after the pattern forming step and after the separating step. the electronic component is a light emitting element; Then, a lighting test of the light emitting element is performed.

According to the method of manufacturing a plurality of mounted boards of the present invention, reliability is high in the method of manufacturing a plurality of mounted boards from a plurality of individual boards obtained by cutting the board with a blade.

It is a flowchart of the manufacturing method of the light emitting board of this embodiment. FIG. 2 is a plan view of a light emitting substrate manufactured by the manufacturing method of the present embodiment. It is a bottom view of the light emitting board of this embodiment. 2A is a partial cross-sectional view of the light emitting substrate taken along the line 1C-1C in FIG. 2A. FIG. FIG. 2 is a plan view of a phosphor substrate (with a phosphor layer omitted) according to the present embodiment. FIG. 2 is a plan view of a phosphor substrate of this embodiment. FIG. 3 is a diagram for explaining the light emitting operation of the light emitting substrate of the present embodiment. FIG. 3 is an explanatory diagram of a first step in the method for manufacturing a light emitting substrate according to the present embodiment. FIG. 3 is an explanatory diagram of a second step in the method for manufacturing a light emitting substrate according to the present embodiment. FIG. 3 is a plan view of the motherboard on which a plurality of electrode layers (a plurality of wiring patterns) are formed at the end of a second step. It is an explanatory view of the 3rd process in the manufacturing method of the light emitting board of this embodiment. It is an explanatory view of the 4th process in the manufacturing method of the light emitting board of this embodiment. FIG. 7 is a plan view of the motherboard on which a plurality of electrode layers (a plurality of wiring patterns) are formed at the end of a fourth step. It is an explanatory view of the 5th process in the manufacturing method of the light emitting board of this embodiment. It is an explanatory view of the 6th process in the manufacturing method of the light emitting board of this embodiment. It is an explanatory view of the 7th process in the manufacturing method of the light emitting board of this embodiment. It is an explanatory view of the 8th process in the manufacturing method of the light emitting board of this embodiment.

≪Overview≫
This embodiment will be described below with reference to the drawings. First, the structure and function of the light emitting substrate 10 manufactured by the manufacturing method S100 (hereinafter referred to as the manufacturing method S100 of the present embodiment, see FIG. 1) of the light emitting substrate 10 (see FIGS. 2A to 2C) of the present embodiment will be explained. do. Next, the light emitting operation of the light emitting substrate 10 of this embodiment will be explained with reference to FIG. 4. Next, the manufacturing method S100 of this embodiment will be explained with reference to FIG. 1 and FIGS. 5A to 5J. Next, the effects of this embodiment will be explained with reference to FIG. 1 and the like. Note that in all the drawings referred to in the following description, similar components are denoted by the same reference numerals, and descriptions thereof will be omitted as appropriate.

<<Configuration and functions of light emitting substrate manufactured by manufacturing method S100 of this embodiment>>
FIG. 2A is a plan view (view from the front surface 31) of the light emitting board 10 (an example of a mounting board) of the present embodiment, and FIG. 2B is a bottom view (view from the back surface 33) of the light emitting board 10 of the present embodiment. be. FIG. 2C is a partial cross-sectional view of the light emitting substrate 10 taken along the line 1C-1C in FIG. 2A.
The light emitting substrate 10 of this embodiment has a rectangular shape, for example, when viewed from the front surface 31 and the back surface 33. Further, the light emitting board 10 of this embodiment includes a plurality of light emitting elements 20 (an example of an electronic component), a phosphor substrate 30, and electronic components (not shown) such as a connector and a driver IC. That is, the light emitting board 10 of the present embodiment has a plurality of light emitting elements 20 and the electronic components described above mounted on a phosphor board 30 (an example of an individual board and a wiring board).
The light emitting board 10 of this embodiment has a function of emitting light when supplied with power from an external power source (not shown) via a connector. Therefore, the light emitting substrate 10 of this embodiment is used as a main optical component in, for example, a lighting device (not shown).

<Multiple light emitting elements>
Each of the plurality of light emitting elements 20 is, for example, a CSP (Chip Scale Package) in which a flip chip LED 22 (hereinafter referred to as LED 22) is incorporated (see FIG. 2C). As shown in FIG. 2A, the plurality of light emitting elements 20 are mounted on the surface 31 of the phosphor substrate 30 in a state in which they are regularly arranged over the entire surface 31. Note that the correlated color temperature of the light emitted by each light emitting element 20 of this embodiment is, for example, 3,018K. In addition, during the light emitting operation, the plurality of light emitting elements 20 use a heat sink (not shown) and a cooling fan (not shown) to dissipate heat (using the phosphor substrate 30 as an example) so that the temperature ranges from room temperature to 50°C to 100°C. cooling). Here, to supplement the meaning of "~" used in numerical ranges in this specification, for example, "50°C to 100°C" means "50°C to 100°C". In this specification, "~" used in numerical ranges means "from the part written before '~' to the part written after '~'".

<Phosphor substrate>
FIG. 3A is a diagram of the phosphor substrate 30 of this embodiment, and is a plan view (viewed from the front surface 31) in which the phosphor layer 36 is omitted. FIG. 3B is a plan view (view from the front surface 31) of the phosphor substrate 30 of this embodiment. Note that the bottom view of the phosphor substrate 30 of this embodiment is the same as the view of the light emitting substrate 10 viewed from the back surface 33. Further, a partial cross-sectional view of the phosphor substrate 30 of this embodiment is the same as the partial cross-sectional view of FIG. 2C with the light emitting element 20 removed. That is, the phosphor substrate 30 of this embodiment has a rectangular shape, for example, when viewed from the front surface 31 and the back surface 33.

The phosphor substrate 30 of this embodiment includes an insulating layer 32, an electrode layer 34 (an example of a wiring pattern), a phosphor layer 36, and a back pattern layer 38 (FIGS. 2B, 2C, and 3A). and FIG. 3B). Note that although the phosphor layer 36 is omitted in FIG. 3A, the phosphor layer 36 may include a plurality of electrodes, which will be described later, on the surface 31 of the insulating layer 32 and the electrode layer 34, as shown in FIG. 3B. It is arranged in a part other than pair 34A.

Further, as shown in FIGS. 2B and 3A, through holes 39 are formed in six locations in the phosphor substrate 30, including four locations near the four corners and two locations near the center. The six through holes 39 are used as positioning holes when manufacturing the phosphor substrate 30 and the light emitting substrate 10. In addition, the six through-holes 39 are used as screw holes for mounting to ensure a heat removal effect (preventing board warping and floating) to the (light-emitting) lamp casing. Note that the phosphor substrate 30 of this embodiment is manufactured by processing (e.g., etching) a motherboard MB (an example of a substrate, see FIG. 5A) in which copper foil layers are provided on both sides of an insulating plate, as described later. Ru.

[Insulating layer]
The main features of the insulating layer 32 of this embodiment will be explained below.
As described above, the shape is, for example, a rectangle when viewed from the front surface 31 and the back surface 33.
The material is an insulating material including bismaleimide resin and glass cloth, for example. Further, the insulating material does not contain halogen or phosphorus (halogen-free, phosphorus-free).
The thickness is, for example, 50 μm to 600 μm, preferably 100 μm to 200 μm.
The coefficient of thermal expansion (CTE) in the longitudinal direction and in the transverse direction is, for example, 10 ppm/°C or less in the range of 50°C to 100°C, respectively. From another perspective, the longitudinal and transverse coefficients of thermal expansion (CTE) are each 6 ppm/K, for example. This value is almost the same as that of the light emitting element 20 of this embodiment (90% to 110%, ie, within ±10%).
The glass transition temperature is, for example, higher than 300°C.
As an example, the storage modulus is greater than 1.0×10 ¹⁰ Pa and smaller than 1.0×10 ¹¹ Pa in the range of 100° C. to 300° C.
The bending modulus in the longitudinal direction and in the transverse direction is, by way of example, 35 GPa and 34 GPa, respectively, under normal conditions.
The hot bending modulus in the longitudinal and transverse directions is, for example, 19 GPa at 250°C.
As an example, the water absorption rate is 0.13% when left for 24 hours in a temperature environment of 23°C.
The dielectric constant is, for example, 4.6 at 1 MHz normal state.
The dielectric loss tangent is, for example, 0.010 at a normal frequency of 1 MHz.
Note that the insulating layer 32 of this embodiment corresponds to the insulating layer portion of the motherboard MB, and as an example, CS-3305A manufactured by Risho Kogyo Co., Ltd. is used for the motherboard MB.

[Electrode layer]
The electrode layer 34 of this embodiment is a metal layer provided on the surface 31 side of the insulating layer 32. The electrode layer 34 of this embodiment is, for example, a copper foil layer (layer made of Cu). In other words, the electrode layer 34 of this embodiment is formed so that at least its surface contains copper.
The electrode layer 34 is a pattern provided on the insulating layer 32, and is electrically connected to a terminal 37 to which a connector (not shown) is connected. The electrode layer 34 is configured to supply power supplied from an external power source (not shown) via the connector to the plurality of light emitting elements 20 when the light emitting board 10 is configured. Therefore, a part of the electrode layer 34 is made into a plurality of electrode pairs 34A to which the plurality of light emitting elements 20 are respectively bonded. That is, the electrode layer 34 of the light emitting substrate 10 of this embodiment is arranged on the insulating layer 32 and connected to each light emitting element 20. From another perspective, the electrode layer 34 of the phosphor substrate 30 of this embodiment is arranged on the insulating layer 32 and connected to each light emitting element 20. Further, as described above, since the plurality of light emitting elements 20 in the light emitting substrate 10 of this embodiment are regularly arranged over the entire surface 31, the plurality of electrode pairs 34A are also arranged over the entire surface 31. They are arranged regularly (see Figure 3A). A portion of the electrode layer 34 other than the plurality of electrode pairs 34A is referred to as a wiring portion 34B. In this embodiment, as shown in FIG. 2C, for example, the plurality of electrode pairs 34A protrude outward in the thickness direction of the insulating layer 32 (phosphor substrate 30) beyond the wiring portion 34B. In other words, in the surface of the electrode layer 34 facing outward in the thickness direction of the insulating layer 32, the surface to which each light emitting element 20 is bonded (the bonding surface 34A1) is closer to the surface other than the bonding surface 34A1 (the non-bonding surface 34B1). are also located on the outside of the insulating layer 32 in the thickness direction.
Note that the area on the surface 31 of the insulating layer 32 where the electrode layer 34 is arranged (the exclusive area of the electrode layer 34) is, for example, a region (area) that is 60% or more of the surface 31 of the insulating layer 32. (See Figure 3A).

[Phosphor layer]
In the phosphor layer 36 of this embodiment, as shown in FIG. 3B, for example, the phosphor layer 36 is arranged in a portion other than the plurality of electrode pairs 34A on the surface 31 of the insulating layer 32 and the electrode layer 34. ing. That is, the phosphor layer 36 is arranged in a region of the electrode layer 34 other than the plurality of electrode pairs 34A. In other words, at least a portion of the phosphor layer 36 is arranged around each bonding surface 34A1 on the front surface 31 (see FIGS. 2C and 3B). Furthermore, from another perspective, at least a portion of the phosphor layer 36 is arranged so as to surround each bonding surface 34A1 all the way around when viewed from the front surface 31 side. In this embodiment, the region on the surface 31 of the insulating layer 32 where the phosphor layer 36 is arranged is, for example, 80% or more of the surface 31 of the insulating layer 32.
In this embodiment, the surface of the phosphor layer 36 on the outer side in the thickness direction of the insulating layer 32 is located on the outer side in the thickness direction than the bonding surface 34A1 of the electrode layer 34 (see FIGS. 2C and 5E). However, a configuration opposite to that of the present embodiment, that is, a configuration in which the outer surface of the insulating layer 32 in the thickness direction of the phosphor layer 36 is located inside the bonding surface 34A1 in the thickness direction (not shown) is possible. It's okay. Alternatively, a configuration (not shown) may be adopted in which the outer surface of the insulating layer 32 in the phosphor layer 36 in the thickness direction is located at the same position as the bonding surface 34A1 in the thickness direction.

The phosphor layer 36 of this embodiment is, for example, an insulating layer containing a phosphor and a binder, which will be described later. The phosphor contained in the phosphor layer 36 is made into fine particles that are held in a dispersed state in a binder, and has the property of exciting the light emitted from each light emitting element 20 as excitation light. Specifically, the phosphor of this embodiment has a property that the emission peak wavelength is in the visible light region when the emission from the light emitting element 20 is used as excitation light. Note that the binder may be, for example, an epoxy-based, acrylate-based, silicone-based, etc., as long as it has the same insulation properties as the binder contained in the solder resist.

(Specific example of phosphor)
Here, the phosphors included in the phosphor layer 36 of this embodiment include, for example, an α-sialon phosphor containing Eu, a β-sialon phosphor containing Eu, a CASN phosphor containing Eu, and an Eu-containing sialon phosphor. At least one type of phosphor selected from the group consisting of SCASN phosphors containing Note that the above-mentioned phosphor is an example of this embodiment, and phosphors other than the above-mentioned phosphor may be used, such as YAG, LuAG, BOS, and other visible light-excited phosphors.

The α-type sialon phosphor containing Eu is represented by the general formula: M _x Eu _y Si _12-(m+n) Al _(m+n) O _n N _16-n . In the above general formula, M is one or more elements containing at least Ca selected from the group consisting of Li, Mg, Ca, Y, and lanthanide elements (excluding La and Ce), and the valence of M is When a, ax+2y=m, x satisfies 0<x≦1.5, 0.3≦m<4.5, and 0<n<2.25.

The β-sialon phosphor containing Eu is a β-sialon expressed by the general formula: Si _6-z Al _z O _z N _8-z (z = 0.005 to 1) and divalent europium as a luminescent center. It is a phosphor containing (Eu ²⁺ ) as a solid solution.

Examples of the nitride phosphor include a CASN phosphor containing Eu and a SCASN phosphor containing Eu.

A CASN phosphor containing Eu (an example of a nitride phosphor) is, for example, represented by the formula CaAlSiN ₃ :Eu ²⁺ , in which Eu ²⁺ is used as an activator and crystals made of alkaline earth silicon nitride are used as a matrix. A red phosphor. Note that the definition of CASN phosphor containing Eu in this specification excludes SCASN phosphor containing Eu.

A SCASN phosphor containing Eu (an example of a nitride phosphor) is, for example, represented by the formula (Sr,Ca)AlSiN ₃ :Eu ²⁺ , using Eu ²⁺ as an activator, and consisting of an alkaline earth silicon nitride. A red phosphor that has a crystal matrix.

[Back pattern layer]
The back pattern layer 38 of this embodiment is a metal layer provided on the back surface 33 side of the insulating layer 32. The back pattern layer 38 of this embodiment is, for example, a copper foil layer (layer made of Cu).
In the back pattern layer 38, as shown in FIG. 2B, a plurality of rectangular blocks arranged in a straight line along the longitudinal direction of the insulating layer 32 are arranged adjacently so as to be out of phase in the transverse direction. This layer is considered to be
Note that the back pattern layer 38 is, for example, an independent floating layer. Further, the back pattern layer 38 overlaps with, for example, 80% or more of the electrode layer 34 disposed on the front surface 31 in the thickness direction of the insulating layer 32 (phosphor substrate 30).

The above is a description of the configurations of the light emitting substrate 10 and the phosphor substrate 30 manufactured by the manufacturing method of this embodiment.

<<Light-emitting operation of the light-emitting substrate of this embodiment>>
Next, the light emitting operation of the light emitting substrate 10 of this embodiment will be described with reference to FIG. 4. Here, FIG. 4 is a diagram for explaining the light emitting operation of the light emitting substrate 10 of this embodiment.

First, when an activation switch (not shown) for activating the plurality of light emitting elements 20 is turned on, power supply from an external power source (not shown) to the electrode layer 34 is started via a connector (not shown), and the plurality of light emitting elements 20 20 emits light L in a radial and divergent manner, and a portion of the light L reaches the surface 31 of the phosphor substrate 30 . Hereinafter, the behavior of the emitted light L will be explained in terms of the traveling direction of the emitted light L.

A portion of the light L emitted from each light emitting element 20 is emitted to the outside without entering the phosphor layer 36. In this case, the wavelength of the light L remains the same as the wavelength of the light L emitted from each light emitting element 20.

Further, the light of the LED 22 itself in a portion of the light L emitted from each light emitting element 20 enters the phosphor layer 36. Here, the above-mentioned "light of the LED 22 itself in a part of the light L" refers to the light that has not been color-converted by the phosphor of each light emitting element 20 (CSP itself) out of the emitted light L, that is, the light of the LED 22 itself in a part of the light L. It means its own light (for example, blue light (wavelength near 470 nm)). When the light L of the LED 22 itself collides with the phosphor dispersed in the phosphor layer 36, the phosphor is excited and emits excitation light. Here, the reason why the phosphor is excited is that the phosphor dispersed in the phosphor layer 36 is a phosphor having an excitation peak in blue light (visible light excited phosphor). Along with this, part of the energy of the light L is used to excite the phosphor, and the light L loses part of its energy. As a result, the wavelength of the light L is converted (wavelength conversion is performed). For example, depending on the type of phosphor in the phosphor layer 36 (for example, when red CASN is used as the phosphor), the wavelength of the light L becomes long (for example, 650 nm). Further, some of the excitation light in the phosphor layer 36 is emitted from the phosphor layer 36 as it is, but some of the excitation light is directed toward the lower electrode layer 34 . Then, a part of the excitation light is reflected by the electrode layer 34 and emitted to the outside. As described above, when the wavelength of excitation light from the phosphor is 600 nm or more, a reflection effect can be expected even if the electrode layer 34 is made of Cu. Although the wavelength of the light L differs from the above example depending on the type of phosphor in the phosphor layer 36, the wavelength of the light L is converted in any case. For example, when the wavelength of the excitation light is less than 600 nm, a reflective effect can be expected if the electrode layer 34 or its surface is made of Ag (plated), for example.

As described above, the light L emitted by each light emitting element 20 (the light L radially emitted by each light emitting element 20) is irradiated to the outside together with the excitation light through the plurality of optical paths as described above. . Therefore, when the emission wavelength of the phosphor included in the phosphor layer 36 is different from the emission wavelength of the phosphor that seals (or covers) the LED 22 in the light emitting element 20 (CSP), the light emitting substrate 10 of this embodiment , a bundle of light L emitted by each light emitting element 20 is irradiated together with the excitation light as a bundle of light L including light L having a wavelength different from the wavelength of light L emitted by each light emitting element 20. For example, the light emitting substrate 10 of this embodiment emits a composite light of the light (wavelength) emitted by the light emitting element 20 and the light (wavelength) emitted from the phosphor layer 36.
On the other hand, if the emission wavelength of the phosphor included in the phosphor layer 36 is the same as the emission wavelength of the phosphor that seals (or covers) the LED 22 in the light emitting element 20 (CSP) (with the same correlated color temperature) case), the light emitting substrate 10 of this embodiment converts the bundle of light L emitted by each light emitting element 20 into a light L containing light L having the same wavelength as the wavelength of light L emitted by each light emitting element 20. It is irradiated as a bundle with the above excitation light.

The above is a description of the light emitting operation of the light emitting substrate 10 of this embodiment.

<<Method for manufacturing the light emitting substrate of this embodiment>>
Next, the manufacturing method S100 of this embodiment will be described with reference to FIG. 1 and FIGS. 5A to 5J. Here, FIG. 1 is a flow diagram of a method for manufacturing a light emitting substrate according to this embodiment. The manufacturing method S100 of this embodiment includes a first step, a second step, a third step, a fourth step, a fifth step, a sixth step, a seventh step, and an eighth step, and each step is described in these steps. It is done in order.

<First step>
FIG. 5A is a diagram showing the start and end of the first step. The first step is a step of forming a pattern 34C that is the same as the electrode layer 34 when viewed from the thickness direction on the front surface 31 of the motherboard MB, and forming a back pattern layer 38 on the back surface 33. This step is performed, for example, by etching using a mask pattern (not shown).
Note that in this step, a set of paired patterns 34C and back pattern layer 38 are formed at multiple locations (15 locations as an example (see FIG. 5C)) on the motherboard MB.

<Second process>
FIG. 5B is a diagram showing the start and end of the second step. The second step is a step in which a part of each pattern 34 is half hatched (etched halfway in the thickness direction). When this step is completed, a plurality of (15 as an example) electrode layers 34 having a plurality of electrode pairs 34A and wiring portions 34B are formed as a result. That is, when this step is completed, a plurality of bonding surfaces 34A1 and a plurality of non-bonding surfaces 34B1 are formed in each electrode layer 34. This step is performed, for example, by etching using a mask pattern (not shown).
Here, FIG. 5C is a plan view of the motherboard on which a plurality of (15) electrode layers 34 (wiring patterns) are formed at the end of the second process. In addition, the process combining the first process and the second process is a pattern forming process (see S110 in FIG. 1) of forming a plurality of electrode layers 34 on the surface 31 of the motherboard MB before the sixth process (cutting process). This is an example.

<3rd process>
FIG. 5D is a diagram showing the start and end of the third step. The third step is a step of applying phosphor paint 36C to the entire surface 31 of the insulating layer 32, that is, the surface on which the electrode layer 34 is formed. In this step, for example, the fluorescent paint 36C is applied by printing. In this case, the phosphor paint 36C is applied thicker than all the electrode pairs 34A. In other words, in this case, the phosphor paint 36C is applied in the thickness direction of the insulating layer 32 so as to cover each joint surface 34A1 from the outside in the thickness direction (so that each joint surface 34A1 is hidden by the phosphor paint 36C). .
Note that in the third step, a phosphor layer 36 is formed on the surface 31 of the motherboard MB after the step (pattern forming step) that combines the first step and the second step and before the sixth step (cutting step). This is an example of the phosphor layer forming step (see S120 in FIG. 1).

<4th step>
FIG. 5E is a diagram showing the start and end of the fourth step. The fourth step is a step in which a part of the phosphor layer 36 on which the phosphor paint 36C has been cured is removed to expose the bonding surfaces 34A1 of all the electrode pairs 34A. Here, if the binder of the phosphor paint 36C is, for example, a thermosetting resin, each bond in the phosphor layer 36 is cured by heating and then a two-dimensional laser processing device (not shown) is used. A portion on the surface 34A1 is selectively irradiated with laser light. As a result, a portion of the phosphor layer 36 on each bonding surface 34A1 and a portion of the electrode pair 34A near each bonding surface 34A1 are ablated, and each bonding surface 34A1 is exposed. As a result of the above, the phosphor substrate 30 of this embodiment is manufactured.

Note that this step may be performed, for example, by the following method in addition to the method described above. When the binder of the phosphor paint 36C is, for example, a UV curable resin (photosensitive resin), a mask pattern is applied to the portions (paint openings) that overlap with each bonding surface 34A1, and UV light is exposed to remove the parts other than the mask pattern. is cured with UV light, and the non-exposed portions (uncured portions) are removed with a resin removal liquid to expose each bonding surface 34A1. After that, generally heat is applied to perform after-cure (photographic development method).

Here, FIG. 5F is a plan view of the motherboard MB on which a plurality of electrode layers 34 (a plurality of wiring patterns) are formed at the end of the fourth step. "The motherboard MB on which a plurality of electrode layers 34 (a plurality of wiring patterns) are formed at the end of the fourth step" refers to an aggregate 30A of a plurality of (15 as an example) phosphor substrates 30 connected to each other. means. That is, through the first to fourth steps, an aggregate 30A of a plurality of phosphor substrates 30 is manufactured. Here, the line CL (imaginary line) in the figure is a cutting line CL cut by a blade type BL (an example of a blade, see FIG. 5H), which will be described later, during a sixth step (cutting step), which will be described later. Note that this step is an example of a removal step (see S130 in FIG. 1) in which a part of the phosphor layer 36 is removed.

<5th step>
FIG. 5G is a diagram showing the end of the fifth step. The fifth step is a step of fixing a plate-shaped fixing member FM larger than the motherboard MB to the back surface 33 of the motherboard MB after the fourth step. That is, this step is a fixing step (see S140 in FIG. 1) that fixes the fixing member FM to the motherboard MB.
For example, the fixing member FM is made of a material harder than the motherboard MB. Furthermore, the fixing member FM includes a fixing member main body and an adhesive layer (not shown) disposed (attached) over the entire surface of the fixing member main body (the surface to be fixed to the motherboard MB). ing. That is, an adhesive layer is provided on the surface of the fixing member FM, for example. In addition, the above-mentioned fixing member main body has a shape as shown in FIGS. 5G, 5H, 5J, etc. in terms of appearance, and the adhesive layer is thinner than the thickness of the fixing member main body, and the adhesive layer is thinner than the thickness of the fixing member main body. It is provided on the surface of the member body. The fixing member FM of this embodiment is fixed to the back surface 33 of the motherboard MB. In this case, it is preferable that the adhesive force of the adhesive layer to the back surface 33 of the motherboard MB be as small as possible so that the motherboard MB does not move during cutting (sixth step) or mounting (seventh step). Furthermore, the fixing member FM is fixed across the portions on both sides of the back surface 33 of the motherboard MB across a cutting line CL cut by a blade type BL (see FIG. 5H), which will be described later. Note that in this embodiment, the adhesive force of the adhesive layer to the surface of the fixing member main body is, for example, greater than the adhesive force of the adhesive layer to the back surface 33 of the motherboard MB (or phosphor substrate 30).
In the above description, an adhesive layer is provided on the surface of the fixing member FM as an example, but a non-layered adhesive material may be used instead of the adhesive layer. The adhesive material may be arranged at multiple locations on the surface of the fixing member main body.

<6th step>
FIG. 5H is a diagram showing the start, execution, and end of the sixth step. The sixth step is a cutting step (see S150 in FIG. 1) in which the motherboard MB is cut with the blade BL after the end of the fifth step (with the fixing member FM still fixed to the motherboard MB).
Here, the blade die BL of this embodiment has a plurality of blades in the vertical direction and the horizontal direction, as shown by the cutting line CL (see FIG. 5F).
Then, in this step, the blade mold BL is set at a predetermined position on the front surface 31 side of the motherboard MB (aggregate 30A of a plurality of phosphor substrates 30) whose back surface 33 is fixed with the fixing member FM, and the blade mold Move the BL a predetermined distance and return it to its original position. In this case, the fixing member main body of the fixing member FM is set so as not to be cut by the blade BL. Here, the adhesive layer of the fixing member FM may be set to be completely cut by the blade BL, or may be set to be partially cut halfway in the thickness direction. As a result of the above, the aggregate 30A of the plurality of phosphor substrates 30 is cut into pieces along the cutting line CL while the back surface 33 is fixed to the fixing member FM.

Note that when the sixth step is completed, an assembly 30A of the plurality of phosphor substrates 30 including the plurality of phosphor substrates 30 and the fixing member FM fixed to the back surface 33 of the plurality of phosphor substrates 30 is manufactured. (See the diagram at the end of the sixth step in FIG. 5H). In this case, the plurality of phosphor substrates 30 are arranged in a predetermined positional relationship, and an electrode layer 34 and a phosphor layer 36 are disposed on each surface 31. Further, the fixing member FM is fixed to the back surface 33 of the plurality of phosphor substrates 30 so as to maintain the state in which the plurality of phosphor substrates 30 are arranged in a predetermined positional relationship (the sixth (See diagram at end of process). Here, the determined positional relationship means, as an example, the positional relationship of the plurality of phosphor substrates 30 in FIG. 5F.

<7th step>
FIG. 5I is a diagram showing the start and end of the seventh step. The seventh step is a step of mounting a plurality of light emitting elements 20 on the phosphor substrate 30. In this step, while the plurality of phosphor substrates 30 are fixed to the fixing member FM, solder paste SP (an example of solder) is printed on each joint surface 34A1 of the plurality of electrode pairs 34A of the phosphor substrate 30, and each joint For example, the solder paste is melted at about 250° C. with the electrodes of the plurality of light emitting elements 20 aligned with the surface 34A1. Thereafter, when the solder paste SP is cooled and solidified, each light emitting element 20 is joined to each electrode pair 34A. That is, this process is performed by a reflow process, for example.
As described above, in this process, light emitting elements are attached to each of the plurality of phosphor substrates 30 while the plurality of phosphor substrates 30 are arranged in the positional relationship at the time of cutting while being fixed to the fixing member FM. 20 to obtain a plurality of light emitting substrates 10 (see S160 in FIG. 1).

Note that when the seventh step is completed, an assembly 10A of the plurality of light emitting substrates 10 including the plurality of light emitting substrates 10 and the fixing member FM fixed to the back surface 33 of the plurality of light emitting substrates 10 is manufactured ( (see Figure 5J). In this case, the plurality of light emitting substrates 10 have light emitting elements arranged in a predetermined positional relationship and bonded to the electrode layer 34, the phosphor layer 36, and the electrode pair 34A of the electrode layer 34 on each surface 31. 20 (see FIGS. 5I and 5J). Further, the fixing member FM is fixed to the back surface 33 of the plurality of light emitting substrates 10 so as to maintain the state in which the plurality of light emitting substrates 10 are arranged in a predetermined positional relationship (see FIG. 5J). Here, the determined positional relationship means, as an example, the positional relationship of the plurality of phosphor substrates 30 in FIG. 5F.

<8th process>
FIG. 5J is a diagram showing the start and end of the eighth step. The eighth step is a separation step of separating the fixing member FM from the plurality of light emitting substrates 10 (see S170 in FIG. 1). This process is performed manually by an operator, for example.
Then, when the eighth step is completed, a plurality of light emitting substrates 10 are manufactured, and the manufacturing method of this embodiment is completed.

Note that after the end of the seventh step and before the start of the eighth step, with the plurality of light emitting substrates 10 fixed to the fixing member FM, check whether the plurality of electronic components such as the plurality of light emitting elements 20 are properly mounted. A mounting test to check whether the light emitting elements 20 are lit properly, a lighting test to check whether the plurality of light emitting elements 20 are lit properly, a visual inspection of the plurality of light emitting boards 10, etc. may be performed.

The above is the description of the manufacturing method of this embodiment.

<<Effects of this embodiment>>
Next, the effects of this embodiment will be explained with reference to the drawings.

<First effect>
The first effect will be explained by comparing this embodiment with a comparison mode (not shown) described below. Here, in the description of the comparative embodiment, when the same constituent elements as in the present embodiment are used, the same names, symbols, etc. as in the present embodiment are used for the constituent elements.

In the method for manufacturing the light emitting substrate 10 of the comparative embodiment (hereinafter referred to as the manufacturing method of the comparative embodiment), after performing the first to fourth steps in the manufacturing method of the present embodiment, the aggregate 30A of the plurality of phosphor substrates 30 is After mounting a plurality of light emitting elements 20 on each of the phosphor substrates 30 constituting the phosphor substrate 30, the assembly 30A is cut along the cutting line CL with a blade BL to obtain a plurality of light emitting substrates 10.
In the case of the comparative manufacturing method, when the assembly 30A is cut, a load (stress) is applied, for example, to the joint portion (for example, solder) between the light emitting element 20 and the electrode pair 34A of the electrode layer 34. Therefore, in the light emitting substrate 10 manufactured by the manufacturing method of the comparative embodiment, there is a possibility that a bonding failure occurs at the bonding portion.

On the other hand, in the case of this embodiment, the light emitting element 20 is mounted after cutting the assembly 30A (motherboard MB) (see FIG. 1). Therefore, in the case of this embodiment, the light emitting element 20 is not mounted on the assembly 30A (motherboard MB) when the assembly 30A (motherboard MB) is cut. That is, in the case of this embodiment, a situation in which poor bonding occurs as in the case of the comparative embodiment cannot occur in the first place.

Therefore, according to the manufacturing method of the present embodiment, in the method of manufacturing a plurality of light emitting substrates 10 from a plurality of phosphor substrates 30 obtained by cutting the motherboard MB with the blade type BL, compared to the manufacturing method of the comparative embodiment, High reliability as a mounting board. That is, according to the manufacturing method of this embodiment, potential causes of defects such as solder cracks and electrode damage due to stress can be reduced.

<Second effect>
Further, in the case of the present embodiment, in the fifth step (see S140 in FIG. 1, FIG. 5G, etc.), the fixing member FM cuts the cutting line CL formed by cutting with the blade type BL on the back surface 33 of the motherboard MB. It is sandwiched and fixed across both sides. Furthermore, in the case of the present embodiment, in the sixth step (see S150 in FIG. 1 and FIG. 5H), the blade BL cuts only the motherboard MB and does not cut the adhesive layer of the fixing member FM. After that, in the case of this embodiment, a mounting process of the light emitting element 20 is performed (see FIG. 1). As described above, in this embodiment, the light emitting elements 20 are mounted on each phosphor substrate 30 while maintaining the positional relationship between the phosphor substrates 30 after cutting. That is, in the case of this embodiment, the mounting process of the light emitting element 20 can be performed on a plurality of phosphor substrates 30 with the same setting (there is no need to perform it separately on a plurality of phosphor substrates 30).
Therefore, according to the manufacturing method of this embodiment, the manufacturing efficiency of the plurality of light emitting substrates 10 is high while achieving the first effect.

<Third effect>
Further, in the case of this embodiment, the fixing member FM is fixed to the motherboard MB with adhesive. Therefore, in the manufacturing method of this embodiment, the fixing member FM can be easily separated from the plurality of light emitting substrates 10 in the eighth step (see FIG. 5J).

<Fourth effect>
Further, in the case of this embodiment, the adhesive force of the adhesive layer to the surface of the fixing member main body is greater than the adhesive force of the adhesive layer to the back surface 33 of the motherboard MB (or phosphor substrate 30). Therefore, in the case of the present embodiment, when separating the fixing member FM from the plurality of light emitting substrates 10 in the eighth step, the adhesive layer is separated from the plurality of light emitting substrates 10 while adhering to the surface of the fixing member main body.
As described above, according to this embodiment, the fixing member FM can be reused multiple times. In other words, according to this embodiment, the manufacturing cost of the plurality of light emitting substrates 10 can be reduced.

<Fifth effect>
As described above, the manufacturing method of this embodiment has the first to third effects. Therefore, the assembly 10B of a plurality of light emitting substrates 10 obtained in the middle of the manufacturing method of this embodiment (see FIG. 5J) and the plurality of light emitting substrates 10 manufactured by the manufacturing method of this embodiment have high manufacturing stability. It can be said that it is a product manufactured by a manufacturing method.
Therefore, the aggregate 10B of the plurality of light emitting substrates 10 and the light emitting substrate 10 of this embodiment have high quality (stable light emitting operation can be realized).

The above is a description of the effects of this embodiment.

As mentioned above, although the present invention has been described by taking the above-described embodiments as examples, the present invention is not limited to the above-described embodiments. The technical scope of the present invention also includes, for example, the following forms (modifications).

For example, in the description of this embodiment, an example of the light emitting element 20 is a CSP. However, an example of the light emitting element 20 may be other than CSP. For example, it may simply be equipped with a flip chip. Moreover, it can also be applied to the substrate itself of a COB device.

Furthermore, the fixing member FM of this embodiment has been described as being fixed to the entire area of the back surface 33 of the motherboard MB with an adhesive layer. However, if each phosphor substrate 30 after cutting can be maintained in a predetermined positional relationship, the fixing member FM does not need to fix the entire back surface 33 of the motherboard MB. For example, it may be fixed across both sides of the cutting line CL.

In addition, in the description of this embodiment, the surface of the phosphor layer 36 on the outer side in the thickness direction of the insulating layer 32 is located on the outer side in the thickness direction than the bonding surface 34A1 of the electrode layer 34 (see FIG. 2C). . However, considering the mechanism explaining the first effect described above, the surface of the phosphor layer 36 on the outside in the thickness direction of the insulating layer 32 is the same as the bonding surface 34A1 of the electrode layer 34 in the thickness direction, or is larger than the bonding surface 34A1. The position may be located on the inner side in the thickness direction.

Furthermore, in the description of this embodiment, it is assumed that the back surface pattern layer 38 is provided on the back surface 33 of the phosphor substrate 30 (see FIG. 2B). However, considering the mechanism explained above for the first effect, it is clear that the first effect can be achieved even if the back surface pattern layer 38 is not provided on the back surface 33 of the phosphor substrate 30. Therefore, even if the configuration differs from the phosphor substrate 30 and the light emitting substrate 10 of this embodiment only in that the back surface pattern layer 38 is not provided on the back surface 33, it can be said that the configuration belongs to the technical scope of the present invention.

Furthermore, in the description of the present embodiment, it is assumed that the phosphor layer 36 is arranged in a portion of the surface 31 of the insulating layer 32 and the electrode layer 34 other than the plurality of electrode pairs 34A (see FIG. 3B). However, considering the mechanism explained above for the first effect, the first effect can be achieved even if the electrodes are not arranged over the entire area other than the plurality of electrode pairs 34A on the surface 31 of the phosphor substrate 30. is clear. Therefore, even if the form differs from the phosphor substrate 30 and light emitting substrate 10 of this embodiment only in that the phosphor layer 36 is disposed in a range of the surface 31 that is different from that of the present embodiment, the form is It can be said that it belongs to the technical scope of the present invention.

Furthermore, in the description of this embodiment, CS-3305A manufactured by Risho Kogyo Co., Ltd. is used as the motherboard MB in manufacturing the phosphor substrate 30 and the light emitting substrate 10. However, this is just an example, and a different motherboard MB may be used. For example, the standard specifications such as the insulation layer thickness and copper foil thickness of CS-3305A manufactured by Risho Kogyo Co., Ltd. are not limited, and a thicker copper foil thickness may be used.

In addition, in this embodiment, the light emitting board 10 was explained as an example of the mounting board. However, the manufacturing method of this embodiment may be applied to a method of manufacturing a plurality of mounting boards (boards in which electronic components are mounted on individual boards on which wiring patterns are formed) using the motherboard MB.

10 Light emitting board (an example of a mounting board)
10A Assembly of a plurality of light emitting substrates 10B Assembly of a plurality of phosphor substrates 20 Light emitting element (an example of an electronic component)
30 Phosphor substrate (an example of a discrete substrate)
31 Front surface 32 Insulating layer 33 Back surface 34 Electrode layer (an example of a wiring pattern)
34A Electrode pair 34A1 Bonding surface 34B Wiring portion 34B1 Non-bonding surface 36 Phosphor layer 38 Back pattern layer BL Blade shape (an example of a blade)
FM fixing member L Optical MB Motherboard (an example of a board)
SP Solder paste (an example of solder)

Claims (9)

A process of obtaining a plurality of individual boards by cutting a board on which a plurality of wiring patterns are formed on the front surface and fixed on the back side with a fixing member, the board being cut with a knife while the fixing member is fixed to the board. A cutting process of cutting with
Mounting electronic components on each of the plurality of individual substrates while the plurality of individual substrates are arranged in the positional relationship at the time of cutting while being fixed to the fixing member to obtain a plurality of mounted substrates. process and
a separation step of separating the fixing member from the plurality of mounting boards;
including;
Before the cutting step, a pattern forming step of forming the plurality of wiring patterns on the surface of the substrate,
After the pattern forming step and before the cutting step, a phosphor layer forming step of forming a phosphor layer on the surface of the substrate,
After the cutting step and before the separating step, performing the mounting step,
The mounting step is performed after the phosphor layer forming step.
A method for manufacturing multiple mounting boards. The electronic component is bonded to the wiring pattern with solder and mounted on each of the plurality of individual substrates,
The method of manufacturing a plurality of mounting boards according to claim 1. The thickness of the substrate is 600 μm or less,
The method for manufacturing a plurality of mounting boards according to claim 1 or 2. The fixing member is fixed across parts on both sides of the back surface of the substrate across a cutting line formed by cutting with the blade.
The method for manufacturing a plurality of mounting boards according to any one of claims 1 to 3. The fixing member is provided with an adhesive material or an adhesive layer,
The fixing member is adhered and fixed to the back surface by the adhesive material or the adhesive layer.
The method for manufacturing a plurality of mounting boards according to any one of claims 1 to 4. The fixing member has a fixing member main body,
The adhesive material or the adhesive layer is adhered to the surface of the fixing member main body,
The adhesive force of the adhesive material or the adhesive layer to the surface of the fixing member main body is greater than the adhesive force of the adhesive material or the adhesive layer to the back surface of the substrate.
The method for manufacturing a plurality of mounting boards according to claim 5. After the pattern formation step and before the separation step, an inspection step of performing one or both of a mounting inspection of the electronic component and an appearance inspection of the plurality of mounting boards;
A method for manufacturing a plurality of mounting boards according to any one of claims 1 to 6. the electronic component is a light emitting element;
A method for manufacturing a plurality of mounting boards according to any one of claims 1 to 7. After the pattern forming step and before the separating step, an inspection step of performing one or both of a mounting inspection of the electronic component and an appearance inspection of the plurality of mounting boards,
The electronic component is a light emitting element,
performing a lighting test of the light emitting element as the mounting test of the electronic component in the test step;
A method for manufacturing a plurality of mounting boards according to any one of claims 1 to 6.

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