JP7229088B2 - Workpiece processing method - Google Patents

Description

The present invention relates to a method for processing a workpiece.

A cutting device equipped with a cutting blade, generally called a dicer, is used to produce chips from a semiconductor wafer (see Patent Document 1, for example).

JP 2015-12264 A

However, in the cutting method using a dicer disclosed in Patent Literature 1, when the external shape of the device is not square but pentagonal, hexagonal, or the like, the shape of the chip cannot be obtained at once. That is, after a wafer is adhered to a tape and cut into rectangular pieces, the individualized pieces are adhered to the tape again, and the edges are cut off to obtain chips of a desired shape.

However, this method has the problem that it takes time to re-apply the tape, and the tape must be used twice to obtain one chip, which is uneconomical.

The present invention has been made in view of such problems, and an object of the present invention is to provide a method of processing a workpiece that can suppress an increase in processing costs even when the outer shape of the device is not rectangular. to provide.

In order to solve the above-described problems and achieve the object, a method for processing a workpiece according to the present invention provides a workpiece having a surface formed with a home base-shaped device having a mountain shape on the short side of a rectangle. a holding surface for holding the back side of the workpiece, and a plurality of suction devices formed at positions corresponding to respective devices on the holding surface. A first chuck table to be processed having a hole, a suction path communicating with a suction source that applies suction to the suction hole, and a plurality of escape grooves formed in the holding surface to avoid contact with the cutting blade. a placing step of placing an object, and after the placing step, a dividing line set in the workpiece extending in a first direction and extending in a second direction perpendicular to the first direction. A first cutting step of cutting the planned division line with a cutting blade to form a rectangular chip from the work piece, and setting the distance between devices in the first direction of the work piece to A, in the second direction Part of the rectangular chip formed in the first cutting step is held using transfer pads arranged at intervals of nA and mB (n and m are natural numbers), where B is the distance between devices. a holding surface on which convex portions capable of holding the back side of the rectangular chip are formed at predetermined intervals; a plurality of suction holes formed in the convex portions of the holding surface; a conveying step of conveying and placing the rectangular chip on a second chuck table having a suction path communicating with a power supply; and a second cutting step of cutting, with a cutting blade, a line to be divided extending in a fourth direction that intersects with the third direction to form the short side of the rectangular chip in a mountain shape. Characterized by

INDUSTRIAL APPLICABILITY The invention of the present application has the effect of suppressing an increase in processing costs even when the external shape of a device is not rectangular.

FIG. 1 is a perspective view showing an example of a workpiece to be processed by a method for machining a workpiece according to Embodiment 1. FIG. 2 is a plan view of the workpiece shown in FIG. 1; FIG. FIG. 3 is a plan view schematically showing a configuration example of a processing apparatus that implements the method for processing a workpiece according to the first embodiment. 4 is a perspective view showing a configuration example of a first chuck table of the processing apparatus shown in FIG. 3. FIG. 5 is a perspective view showing a configuration example of a second chuck table of the processing apparatus shown in FIG. 3. FIG. 6 is a plan view showing a configuration example of a second chuck table of the processing apparatus shown in FIG. 3. FIG. 7 is a perspective view showing the essential parts of the chip transport unit and the device transport unit of the processing apparatus shown in FIG. 3. FIG. 8 is a plan view of the transfer pads of the chip transfer unit and the device transfer unit shown in FIG. 7 as viewed from below. FIG. 9 is a flow chart showing the flow of the processing method for the workpiece according to the first embodiment. FIG. 10 is a cross-sectional view of the main parts of the first chuck table and the workpiece after the mounting step of the workpiece machining method shown in FIG. 11 is a cross-sectional view of the main parts of the first chuck table and the workpiece during the first cutting step of the workpiece machining method shown in FIG. 9. FIG. FIG. 12 is a cross-sectional view of a main part in a state in which the tip carrying unit sucks and holds the tip held on the first chuck table in the carrying step of the method for machining the workpiece shown in FIG. FIG. 13 is a cross-sectional view of a main part in a state in which the chip conveying unit places the chip on the second chuck table in the conveying step of the method of machining the workpiece shown in FIG. FIG. 14 is a plan view schematically showing the second cutting step of the method for machining the workpiece shown in FIG. 9. FIG. 15 is a plan view of a second chuck table of a processing apparatus that implements a method for processing a workpiece according to Modification 1 of Embodiment 1. FIG. FIG. 16 is a plan view of a second chuck table of a processing apparatus that implements a method for processing a workpiece according to Modification 2 of Embodiment 1. FIG.

A form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
A method for processing a workpiece according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an example of a workpiece to be processed by a method for machining a workpiece according to Embodiment 1. FIG. 2 is a plan view of the workpiece shown in FIG. 1; FIG. FIG. 3 is a plan view schematically showing a configuration example of a processing apparatus that implements the method for processing a workpiece according to the first embodiment. 4 is a perspective view showing a configuration example of a first chuck table of the processing apparatus shown in FIG. 3. FIG. 5 is a perspective view showing a configuration example of a second chuck table of the processing apparatus shown in FIG. 3. FIG. 6 is a plan view showing a configuration example of a second chuck table of the processing apparatus shown in FIG. 3. FIG. 7 is a perspective view showing the essential parts of the chip transport unit and the device transport unit of the processing apparatus shown in FIG. 3. FIG. 8 is a plan view of the transfer pads of the chip transfer unit and the device transfer unit shown in FIG. 7 as viewed from below.

(Workpiece)
In the method for processing a workpiece according to the first embodiment, the workpiece 200 shown in FIGS. It is a method of dividing. As shown in FIGS. 1 and 2, a workpiece 200 to be processed by the method for machining a workpiece according to the first embodiment is formed in a rectangular flat plate shape in plan view.

In the first embodiment, as shown in FIGS. 1 and 2, the workpiece 200 includes a plurality of parallel first planned division lines 210 extending in the first direction, the Y-axis direction. 211 and a plurality of parallel second planned division lines 212 extending in the X-axis direction, which is the second direction orthogonal to the Y-axis direction, are set, and the device 202 is arranged between the first planned division lines 211 and the second planned division lines 212 . It is formed in each region 203 of the surface 201 partitioned by the two planned division lines 212 . In the embodiment, the region 203 in which the device 202 is formed is formed in a rectangular shape with the Y-axis direction in FIGS. 1 and 2 as the lateral direction and the X-axis direction as the longitudinal direction.

In Embodiment 1, the device 202 is formed in a home base shape (pentagonal shape) having a mountain-shaped portion 204 on the short side (one end in the longitudinal direction) of the region 203 described above in the longitudinal direction. . For this reason, in the first embodiment, the dividing line 210 has a mountain shape on the short side of each device 202, that is, because the mountain portion 204 is formed at one end of the device 202 in the longitudinal direction. A third planned division line 213 and a fourth planned division line 214 are set. The first planned division line 211, the second planned division line 212, the third planned division line 213, and the fourth planned division line 214 each extend linearly.

The third planned division line 213 is a planned division line that extends in a third direction that intersects both the Y-axis direction and the X-axis direction. A fourth planned division line 214 is a planned division line extending in a fourth direction that intersects all of the Y-axis direction, the X-axis direction, and the third direction. In the first embodiment, the workpiece 200 has 19 devices 202 arranged in the Y-axis direction and 5 devices 202 arranged in the X-axis direction, for a total of 95 devices 202 .

(processing equipment)
A processing apparatus 1 shown in FIG. 3 implements a processing method for a workpiece according to the first embodiment. The processing apparatus 1 shown in FIG. 3 sequentially holds a workpiece 200 on a first chuck table 10 and a second chuck table 30, and cuts the workpiece 200 along dividing lines 211 and 212. 1 and 2) and cuts along the dividing lines 213 and 214 to form the rectangular chips 220 into the device 202. FIG. The planar shape of the rectangular chip 220 is the same shape as the region 203 described above. In the first embodiment, the processing apparatus 1 holds the workpiece 200 to which the dicing tape is not adhered on the chuck tables 10 and 30, and divides the workpiece 200 along the dividing lines 211, 212, 213, and 214 so-called full cuts. and divides the workpiece 200 into individual devices 202 .

As shown in FIG. 3 , the processing apparatus 1 includes a first chuck table 10 that sucks and holds a workpiece 200 on a holding surface 11 , and a first chuck table 10 that sucks and holds the workpiece 200 on the first chuck table 10 . a first cutting unit 20-1 for cutting the planned division line 211 and the second planned division line 212 with the cutting blade 21;

As shown in FIG. 4, the first chuck table 10 is formed in a rectangular shape and has a holding surface 11 for holding the back surface 205 (shown in FIG. 1) of the workpiece 200, and a plurality of suction holes 12. , a plurality of suction paths 13 and a plurality of relief grooves 14. The holding surface 11 is flat and parallel to the horizontal direction. In Embodiment 1, it is the upper surface of the first chuck table 10 .

The suction holes 12 are formed on the holding surface 11 at positions corresponding to the devices 202 . In Embodiment 1, the suction holes 12 are formed at positions overlapping the devices 202 of the workpiece 200 held on the holding surface 11, and correspond to the devices 202 on a one-to-one basis. The suction path 13 communicates with a suction source 15 such as a vacuum pump that sucks through the suction holes 12 to apply suction to the suction holes 12 . The suction paths 13 are in one-to-one correspondence with the suction holes 12 and communicate the corresponding suction holes 12 and the suction source 15 .

The escape groove 14 is recessed from the holding surface 11 and is formed at a position overlapping the first planned division line 211 and the second planned division line 212 of the workpiece 200 held on the holding surface 11 . The escape groove 14 allows the cutting blade 21 for cutting the first planned division line 211 and the second planned division line 212 to pass through the escape groove 14 to avoid contact between the cutting blade 21 and the first chuck table 10 . be.

The suction hole 12 of the first chuck table 10 is connected to the suction source 15 through the suction path 13 , and the suction hole 12 is suctioned by the suction source 15 , thereby sucking the workpiece 200 onto the holding surface 11 . Hold. The first chuck table 10 is movable in the X-axis direction by a processing feed unit 40 shown in FIG. 3, and is rotatable about an axis parallel to the Z-axis direction by a rotation drive source (not shown). In Embodiment 1, one first chuck table 10 is installed on the rotary drive source.

The first cutting unit 20-1 cuts the first planned division line 211 and the second planned division line 212 of the workpiece 200 held on the first chuck table 10, thereby cutting the workpiece 200. It is divided into rectangular chips 220 having the same shape as the region 203 described above. The first cutting unit 20-1 comprises a spindle 22 on which a cutting blade 21 for cutting the workpiece 200 is mounted. The cutting blade 21 is an ultra-thin cutting whetstone having a substantially ring shape. The spindle 22 cuts the workpiece 200 by rotating the cutting blade 21 . The spindle 22 is housed within a spindle housing 23 . Axial centers of the spindle 22 and the cutting blade 21 of the cutting unit 20 are set parallel to the Y-axis direction.

The processing apparatus 1 also includes a second chuck table 30 that sucks and holds a plurality of rectangular chips 220 on the holding surface 31, and a third division schedule of the rectangular chips 220 sucked and held by the second chuck table 30. and a second cutting unit 20-2 for cutting the line 213 and the fourth dividing line 214 with the cutting blade 21. FIG.

As shown in FIG. 5 , the second chuck table 30 is formed in a rectangular shape, and has a holding surface 31 formed with a plurality of projections 34 capable of holding a plurality of rectangular chips 220 , and a plurality of suction holes 32 . , and a plurality of suction paths 33 . The holding surface 31 is flat and parallel to the horizontal direction, and is the upper surface of the second chuck table 30 in the first embodiment.

A plurality of protrusions 34 are formed to protrude from the holding surface 31, and the upper surfaces thereof are flat and parallel to the horizontal direction. In the first embodiment, seven projections 34 are arranged at equal intervals in the Y-axis direction, and three projections 34 are arranged at equal intervals in the X-axis direction, for a total of 21 projections 34 arranged on the holding surface 31 . In the present invention, as shown in FIG. is also made smaller.

Further, when the width of the device 202 in the Y-axis direction, which is the distance between the devices 202 in the Y-axis direction adjacent to each other on the workpiece 200, is A (shown in FIG. 2), the distance between the protrusions 34 adjacent in the Y-axis direction is As shown in FIG. 6, the interval corresponds to n×A (n is a natural number of 2 or more), and in the present invention, it may be equal to n×A or slightly longer than n×A. The interval nA between the protrusions 34 adjacent in the Y-axis direction is the distance between the outer edges of the protrusions 34 located on the same side in the Y-axis direction.

Further, if the length of the device 202 in the X-axis direction, which is the distance between the devices 202 in the X-axis direction adjacent to each other on the workpiece 200, is B (shown in FIG. 2), the protrusions 34 adjacent in the X-axis direction The interval between them corresponds to m×B (m is a natural number equal to or greater than 2), and may be equal to m×B or slightly longer than m×B in the present invention. The distance mB between the convex portions 34 adjacent to each other in the X-axis direction is the distance between the outer edges of the convex portions 34 located on the same side in the X-axis direction.

In short, in the present invention, the interval nA between the convex portions 34 adjacent in the Y-axis direction should be a distance capable of holding every n-1 chips 220 out of the plurality of divided chips 220 of the workpiece 200. , the interval mB between the convex portions 34 adjacent to each other in the X-axis direction may be a distance capable of holding every m−1 chips 220 out of the plurality of divided chips 220 of the workpiece 200 . Thus, according to the present invention, the projections 34 capable of holding the rear surface 205 side of the rectangular chip 220 are formed on the holding surface 31 at predetermined intervals nA and mB.

One suction hole 32 is formed on the upper surface of each projection 34 . In the first embodiment, the suction holes 32 are formed at positions overlapping the chips 220 held on the upper surfaces of the projections 34 and correspond to the chips 220 one-to-one. The suction path 33 communicates with a suction source 35 such as a vacuum pump that sucks through the suction holes 32 to apply suction to the suction holes 32 . The suction paths 33 are in one-to-one correspondence with the suction holes 32 and communicate the corresponding suction holes 32 and suction sources 35 .

The suction hole 32 of the second chuck table 30 is connected to the suction source 35 via the suction path 333 , and the suction hole 32 is suctioned by the suction source 35 , thereby sucking the tip 220 onto the upper surface of the projection 34 . Hold. As shown in FIG. 3, the second chuck table 30 is arranged next to the first chuck table 10 in the Y-axis direction, and is movable in the X-axis direction by the processing feed unit 40, and is driven by a rotation drive source (not shown). is rotatably provided around an axis parallel to the Z-axis direction. In the second embodiment, one second chuck table 30 is installed on the rotary drive source.

The second cutting unit 20-2 cuts the third planned division line 213 and the fourth planned division line 214 of the tip 220 held on the second chuck table 30 with the cutting blade 21 to cut the tip 220. The lateral side (one end in the longitudinal direction is formed in a mountain shape to form a mountain-shaped portion 204, and the chip 220 is formed in the device 202. The second cutting unit 20-2 Since the configuration is the same as that of the first cutting unit 20-1, the same parts as those of the first cutting unit 20-1 are denoted by the same reference numerals, and the description thereof is omitted. , that is, a two-spindle dicer, a so-called facing dual type cutting device.

The cutting units 20-1 and 20-2 are provided movably in the Y-axis direction by an indexing feed unit 50 with respect to the workpiece 200 or the chip 220 held by the chuck tables 10 and 30, and are capable of cutting and feeding. It is provided movably in the Z-axis direction by the unit 60 . The cutting unit 20 can position the cutting blade 21 at an arbitrary position on the holding surfaces 11 and 31 of the chuck tables 10 and 30 by the indexing feed unit 50 and the cutting feed unit 60 to cut the workpiece 200 or the chip 220. be.

The processing apparatus 1 also includes a cassette elevator 70 that supports a cassette (not shown) that stores a plurality of workpieces 200 before cutting and moves the supported cassettes up and down in the Z-axis direction, and a cassette elevator 70 that removes workpieces 200 from the cassettes. a carry-out unit that does not cut, a package transport unit 71 that transports the uncut workpiece 200 taken out from the cassette to the first chuck table 10, the workpiece 200 held on the first chuck table 10, and cutting An imaging unit (not shown) that obtains an image for aligning the cutting blades 21 of the units 20-1 and 20-2, and cleaning that cleans the rear surface 205 of the device 202 that has been divided into individual chips 220. A unit 72, a drying unit 73 for drying the device 202 after being washed by the washing unit 72, and a housing tray (not shown) for housing each device after being dried by the drying unit 73 are arranged in the Z-axis direction. A tray elevator 74 for raising and lowering a tray, a tray supply unit 75 for supplying storage trays to the tray elevator 74, and a transport unit 80 are provided.

The cassette elevator 70 is arranged next to the first chuck table 10 in the Y-axis direction. The cleaning unit 72 is arranged between the second chuck table 30 and the tray elevator 74 and next to the second chuck table 30 in the Y-axis direction. The drying unit 73 is arranged between the washing unit 72 and the tray elevator 74 .

The transport unit 80 includes a chip transport unit 81 that transports the rectangular chips 220 individually divided by the first cutting unit 20-1 from the first chuck table 10 to the second chuck table; A device 202 having a third planned division line 213 and a fourth planned division line 214 cut by the unit 20-2 was supported from the second chuck table 30 to the cleaning unit 72, the drying unit 73, and the tray elevator 74. and a device transport unit 90 that sequentially transports the device to the storage tray.

Since the configurations of the transport units 81 and 90 are substantially the same, the chip transport unit 81 will be described below as a representative. As shown in FIGS. 7 and 8, the chip transport unit 81 includes a transport head 86 provided with a plurality of transport pads 84 for sucking and holding the chip 220, and moving the transport head 86 in the Y-axis direction and moving the transport head 86 in the Z-axis direction. and a moving unit (not shown) that moves up and down.

As shown in FIG. 8 , the transport head 86 has a plurality of transport pads 84 on a holding surface 87 facing the chip 220 , and each transport pad 84 is provided with a suction hole 82 . The suction hole 82 communicates with a suction source 85 such as a vacuum pump, and exerts a suction action of sucking the tip 220 by being sucked by the suction source 85 .

In the first embodiment, seven transfer pads 84 are arranged at equal intervals in the Y-axis direction, and three transfer pads are arranged at equal intervals in the X-axis direction, so that a total of 21 transfer pads 84 are arranged on the holding surface 87 . In the present invention, as shown in FIG. 8, the planar shape of the transfer pad 84 is formed in an oval shape with the longitudinal direction parallel to the X-axis direction and the width direction parallel to the Y-axis direction.

Further, the interval between the transfer pads 84 adjacent in the Y-axis direction corresponds to n×A (n is a natural number of 2 or more), as shown in FIG. It is equal, but may be slightly longer than n×A in the present invention. The interval nA between the transfer pads 84 adjacent in the Y-axis direction is the distance between the outer edges of the transfer pads 84 located on the same side in the Y-axis direction.

Further, the interval between the transport pads 84 adjacent to each other in the X-axis direction corresponds to m×B (m is a natural number of 2 or more), which is equal to m×B in the first embodiment. It may be slightly longer than m×B. The distance mB between the transport pads 84 adjacent in the X-axis direction is the distance between the outer edges of the transport pads 84 located on the same side in the X-axis direction. In short, in the present invention, the interval nA between the transfer pads 84 adjacent in the Y-axis direction should be a distance capable of holding every n-1 chips 220 out of the plurality of divided chips 220 of the workpiece 200. , the distance mB between the transfer pads 84 adjacent to each other in the X-axis direction may be a distance capable of holding every m−1 chips 220 out of the plurality of divided chips 220 of the workpiece 200 . Thus, in Embodiment 1, the plurality of transport pads 84 are arranged at intervals of n×A and m×B.

After the transfer pad 84 of the chip transfer unit 81 is positioned to face the chip 220 on the first chuck table 10 in the Z-axis direction, the transfer head 86 is lowered to move the suction hole 82 to the first chuck. The chip 220 on the table 10 is closed. The chip conveying unit 81 sucks the suction holes 82 to hold one chip 220 on each conveying pad 84 . When the suction holding of the chip 220 on the first chuck table 10 is stopped, the chip conveying unit 81 raises the conveying head 86 while sucking and holding the chip 220 on each of the conveying pads 84, and the chip sucked by the moving unit is lifted. 220 is positioned to face the projection 34 formed on the holding surface 31 of the second chuck table 30 in the Z-axis direction. In the chip transport unit 81 , the transport head 86 is lowered to place the chip 220 sucked and held on the transport pad 84 on the upper surface of the projection 34 of the second chuck table 30 . When the tip 220 is sucked and held in the suction hole 32 of the second chuck table 30, the chip conveying unit 81 stops sucking and holding the chip 220 in the suction hole 82, and the conveying head 86 is lifted by the moving unit. The second chuck table 30 is retracted. Thus, the chip transfer unit 81 transfers the chip 220 from the first chuck table 10 to the second chuck table 30. FIG.

Note that, in the first embodiment, n is 3 and m is 2 in the chip conveying unit 81 . The chip conveying unit 81 sucks and holds every two chips 220 on the holding surface 11 of the first chuck table 10 in the Y-axis direction, and sucks and holds every other chip 220 in the X-axis direction. , the chip 220 is transferred from the first chuck table 10 to the second chuck table 30 .

The control unit 100 controls each component of the processing device 1 to cause the processing device 1 to perform a processing operation on the workpiece 200 . The control unit 100 includes an arithmetic processing unit having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as ROM (read only memory) or RAM (random access memory), and an input/output interface device. is a computer having The arithmetic processing device of the control unit 100 performs arithmetic processing according to a computer program stored in the storage device, and outputs control signals for controlling the processing device 1 to the processing device 1 via the input/output interface device. output to the configured element.

The control unit 100 is connected to a display device (not shown) such as a liquid crystal display device for displaying the state of machining operations and images, and an input device (not shown) used by an operator to register machining content information. The input device is composed of a touch panel provided on the display device and an external input device such as a keyboard.

(Processing method of workpiece)
Next, the machining operation of the machining device 1 shown in FIG. 3, that is, the machining method for the workpiece according to the first embodiment will be described. FIG. 9 is a flow chart showing the flow of the processing method for the workpiece according to the first embodiment. The method of processing a workpiece according to the first embodiment is a method of cutting a workpiece 200 along division lines 211 , 212 , 213 , and 214 to divide the workpiece 200 into individual devices 202 . As shown in FIG. 9, the method for processing a workpiece according to the first embodiment includes a placement step ST1, a first cutting step ST2, a transport step ST3, a second cutting step ST4, and a carry-out step ST5. and

In the processing operation of the processing apparatus 1, first, the operator installs a cassette containing the workpieces 200 before cutting in the cassette elevator 70, installs a plurality of storage trays in the tray elevator 74, and operates the input device. Then, the processing content information is registered in the control unit 100 . When the control unit 100 receives an instruction to start the machining operation from the operator, the processing apparatus 1 starts the machining operation, that is, sequentially implements the machining method of the workpiece from the placement step ST1.

(Placement step)
FIG. 10 is a cross-sectional view of the main parts of the first chuck table and the workpiece after the mounting step of the workpiece machining method shown in FIG. The mounting step ST<b>1 is a step of mounting the workpiece 200 on the first chuck table 10 .

In the placing step ST1, the processing apparatus 1 causes the carry-out unit to take out one workpiece 200 from the cassette, causes the package conveying unit to convey the workpiece 200 to the first chuck table 10, and places the workpiece 200 on the first chuck table 10. 200 is placed on the holding surface 11 of the first chuck table 10 . At this time, the first planned division line 211 and the second planned division line 212 are superimposed on the escape groove 14 , and the device 202 is superimposed on the suction hole 12 . In the mounting step ST1, as shown in FIG. 10, the processing apparatus 1 causes the suction source 15 to suck the suction holes 12, sucks and holds the workpiece 200 on the holding surface 11 of the first chuck table 10, The processing feed unit 40 moves the first chuck table 10 toward the lower side of the imaging unit to cause the imaging unit to image the workpiece 200 . In the mounting step ST1, the processing device 1 aligns the cutting blade 21 of the first cutting unit 20-1 with the division lines 211 and 212 of the workpiece 200 held on the first chuck table 10. Alignment is performed and the process proceeds to the first cutting step ST2.

(first cutting step)
11 is a cross-sectional view of the main parts of the first chuck table and the workpiece during the first cutting step of the workpiece machining method shown in FIG. 9. FIG. In the first cutting step ST2, after the placing step ST1, the first planned division line and the second planned division line 212 set on the workpiece 200 are cut by the cutting blade 21 of the first cutting unit 20-1. , to form a rectangular tip 220 from the workpiece 200 .

In the first cutting step ST2, the processing apparatus 1 operates the processing feed unit 40, the indexing feed unit 50, the cutting feed unit 60, and the rotary drive source based on the processing content information, as shown in FIG. While relatively moving the cutting unit 20-1 and the first chuck table 10 along the dividing lines 211 and 212, the cutting blade 21 cuts along the dividing lines 211 and 212 until it reaches the relief groove 14. Then, the planned division lines 211 and 212 are cut. In the first cutting step ST2, the processing device 1 cuts all the dividing lines 211 and 212 with the cutting blade 21 of the first cutting unit 20-1 to divide the workpiece 200 into individual chips 220. Then, the process proceeds to the transport step ST3.

(Conveyance step)
FIG. 12 is a cross-sectional view of a main part in a state in which the tip carrying unit sucks and holds the tip held on the first chuck table in the carrying step of the method for machining the workpiece shown in FIG. FIG. 13 is a cross-sectional view of a main part in a state in which the chip conveying unit places the chip on the second chuck table in the conveying step of the method of machining the workpiece shown in FIG.

The transporting step ST3 uses the transporting pad 84 of the chip transporting unit 81 to hold a part of the rectangular chip 220 formed in the first cutting step ST2, and transports the rectangular chip 220 to the second chuck table 30. This is the step of placing the In the transport step ST3, the processing apparatus 1 moves the chip 220 on the first chuck table 10 to the transport pad 84 of the chip transport unit 81 as shown in FIG. Some chips 220 are held by suction.

In the transport step ST3, the processing apparatus 1 partly releases the suction-holding of the first chuck table 10, and transfers the chip 220 suction-held by the chip transport unit 81 from the first chuck table 10 to the second chuck table 30. , and placed on the upper surface of the projection 34 of the second chuck table 30 as shown in FIG. In the transport step ST3, the processing apparatus 1 sucks and holds the chip 220 on the second chuck table 30, then cancels the suction and hold of the chip transport unit 81, and retracts the chip transport unit 81 from the second chuck table 30. Then, the process proceeds to the second cutting step ST4.

(second cutting step)
FIG. 14 is a plan view schematically showing the second cutting step of the method for machining the workpiece shown in FIG. 9. FIG. In the second cutting step ST4, the rectangular chip 220 formed in the first cutting step ST2 is conveyed from the first chuck table 10 to the second chuck table 30 in the conveying step ST3, and then the workpiece 200 is cut. The cutting blade 21 of the second cutting unit 20-2 cuts the third planned division line 213 and the fourth planned division line 214 set to . Then, the step of forming the mountain-shaped portion 204 and forming the chip 220 held on the second chuck table 30 into the device 202 .

In the second cutting step ST4, the processing device 1 causes the imaging unit to image the chip 220 held on the second chuck table 30, and the cutting blade 21 of the second cutting unit 20-2 and the second chuck. Alignment is performed to align the chips 220 held on the table 30 with the dividing lines 213 and 214 . In the second cutting step ST4, the processing device 1 moves the second cutting unit 20-2 and the While relatively moving the second chuck table 30 along the division lines 213 and 214, the cutting blade 21 is cut into the division lines 213 and 214 as indicated by the solid lines in FIG. Cut lines 213 and 214; In the second cutting step ST4, the processing device 1 cuts the dividing lines 213 and 214 of all the chips 220 held by the second chuck table 30 with the cutting blades 21 of the second cutting unit 20-2. After the chip 220 is formed in the device 202, the process advances to the unloading step ST5.

(Unloading step)
The unloading step ST5 is a step of unloading from the second chuck table 30 the device 202 held on the second chuck table 30 and having the dividing lines 213 and 214 cut in the second cutting step ST4. In the unloading step ST5, the processing apparatus 1 causes the device transport unit 90 to hold the device 202 on the second chuck table 30 by suction, then cancels the suction hold of the second chuck table 30, and transports the device to the cleaning unit 72. Let

In the unloading step ST5, the processing apparatus 1 causes the cleaning unit 72 to clean the device 202, then causes the device transport unit 90 to transport the cleaned device 202 to the drying unit 73, and causes the drying unit 73 to dry the device 202. In the carrying-out step ST5, the processing apparatus 1 causes the device carrying unit 90 to carry the device 202 after cutting, cleaning and drying to the accommodation tray supported by the tray elevator 74, and the carrying-out step ST5 ends.

In addition, in the method for processing a workpiece according to the first embodiment, after the device 202 on the second chuck table 30 is carried out in the carrying-out step ST5, the carrying step ST3 is carried out again, and the chip carrying unit 81 carries out the first device. The chip 220 on the second chuck table 10 is transported to the second chuck table 30, the second cutting step ST4 is performed again, and the carry-out step ST5 is performed. Thus, the method of machining a workpiece is such that when dividing one workpiece 200 into devices 202, all the chips 220 formed in the first cutting step ST2 and on the first chuck table 10 are divided into the devices 202. The conveying step ST3 and the second cutting step ST4 are repeated a plurality of times until the substrate is formed into a .

The method of machining the workpiece ends when all the chips 220 formed in the first cutting step ST2 and on the first chuck table 10 are formed into devices 202. FIG. After that, the processing apparatus 1 cuts the next workpiece 200, sequentially cuts the workpieces 200 in the cassette, and ends the machining operation when all the workpieces 200 in the cassette are cut. .

The method of processing a workpiece according to the first embodiment described above is performed using the processing apparatus 1 having two chuck tables 10 and 30, and the workpiece is held by the first chuck table 10 and cut into a rectangular shape. The chip 220 is sucked and held by a plurality of transfer pads 84 of the chip transfer unit 81 with intervals nA and mB longer than the intervals A and B between the devices 202 and transferred to the second chuck table 30 . The method of machining the workpiece is such that the chip 220 is held by suction on the second chuck table 30, and the dividing lines 213 and 214 are cut by the second cutting unit 20-2 to form the chip 220 on the device 202. do. As a result, the method for processing the workpiece does not need to use a dicing tape to obtain the device 202 of the desired shape, which contributes to cost reduction.

Also, the distance between the projections 34 sucking and holding the tip 220 of the second chuck table 30 is nA, mB, or slightly longer than nA, mB. For this reason, the machining method of the workpiece can cut the dividing lines 213 and 214 of the chip 220 suction-held on the second chuck table 30 . As a result, the method for processing a workpiece can suppress an increase in processing costs even when the outer shape of the device 202 is not rectangular.

In addition, since the method of processing the workpiece repeats the conveying step ST3 and the second cutting step ST4 a plurality of times, all the rectangularly cut chips 220 on the first chuck table 10 are transferred to the second chuck table 30. , and can be cut into a desired shape on the second chuck table 30 .

[Modification]
A method for processing a workpiece according to a modification of Embodiment 1 of the present invention will be described with reference to the drawings. 15 is a plan view of a second chuck table of a processing apparatus that implements a method for processing a workpiece according to Modification 1 of Embodiment 1. FIG. FIG. 16 is a plan view of a second chuck table of a processing apparatus that implements a method for processing a workpiece according to Modification 2 of Embodiment 1. FIG. In FIGS. 15 and 16, the same reference numerals are assigned to the same parts as in the first embodiment, and the description thereof is omitted.

The workpiece processing methods according to Modifications 1 and 2 differ in the configuration of the second chuck tables 30-1 and 30-2 shown in FIGS. 220 on the first chuck table 10 are conveyed to the second chuck table 30 by repeating the conveying step ST3 a plurality of times. It is the same as Embodiment 1 except that 220 is formed in the device 202 .

The second chuck tables 30-1 and 30-2 shown in FIGS. 15 and 16 have the same number of protrusions 34 as the devices 202 of the workpiece 200. As shown in FIG. In the second chuck table 30 shown in FIG. 15, similarly to the first embodiment, the projections 34 are arranged at intervals of nA and mB in the X-axis direction and the Y-axis direction. The second chuck table 30-1 shown in FIG. 15 has five rows of protrusions 36 each composed of a plurality of protrusions 34 arranged in the Y-axis direction.

The second chuck table 30-2 shown in FIG. 16 includes the lower two rows of projections 36 ( 15 with the mountain-shaped portions reversed to form the upper three rows of projections 36 (hereinafter referred to as 36-1, 36-2, 36-1, 36-2, 36-2). The second chuck table 30-2 shown in FIG. 16 has a third dividing line 213 of the chips 220 held by the convex portions 34 forming the convex portion row 36-3 and convex portions forming the convex portion row 36-4. The third dividing line 213 of the chip 220 held by the portion 34 is located on the same line, and the fourth dividing line 214 of the chip 220 held by the convex portion 34 constituting the convex portion row 36-3 is projected. The projections 34 are arranged so that the fourth dividing line 214 of the chip 220 held by the projections 34 constituting the row 36-4 is on the same line.

The second chuck table 30-2 shown in FIG. 16 has a third dividing line 213 of the chips 220 held by the convex portions 34 forming the convex portion row 36-2 and convex portions forming the convex portion row 36-5. The third dividing line 213 of the chip 220 held by the portion 34 is located on the same line, and the fourth dividing line 214 of the chip 220 held by the convex portion 34 constituting the convex portion row 36-2 is projected. The projections 34 are arranged so that the fourth dividing line 214 of the chip 220 held by the projections 34 constituting the row 36-5 is on the same line.

In the workpiece processing method according to Modifications 1 and 2, the chips 220 held on the first chuck table 10 and cut into rectangles are sucked and held by the plurality of transfer pads 84 of the chip transfer unit 81 . , is conveyed to the second chuck table 30, and the second cutting unit 20-2 cuts the dividing lines 213 and 214 to form chips 220 on the device 202. As shown in FIG. As a result, as in the first embodiment, the method of processing a workpiece does not require the use of a dicing tape to obtain the device 202 of a desired shape, and even if the outer shape of the device 202 is not rectangular, it can be easily processed. It is effective in being able to suppress the rise of the related cost.

In addition, in the workpiece processing methods according to Modifications 1 and 2, the conveying step ST3 is repeated a plurality of times. 30 and can be cut into a desired shape on the second chuck table 30 .

In addition, the method of processing a workpiece according to Modification 2 includes dividing lines 213 and 214 of the chips 220 held by the convex portions 34 forming the convex portion row 36-3 and the convex portions forming the convex portion row 36-4. The division lines 213 and 214 of the chips 220 held by the portion 34 are positioned on the same line, and the division lines 213 and 214 of the chips 220 held by the projections 34 and the projection row constitute the projection row 36-2. The dividing lines 213 and 214 of the chip 220 held by the convex portion 34 constituting 36-5 are located on the same line.

As a result, the machining method of the workpiece according to Modification 2 can reduce the time required for cutting the dividing lines 213 and 214 of the chip 220 compared to Modification 1. FIG.

Further, in the method of processing a workpiece according to Modification Example 2, the projection rows 36-4 and 36-5 of the second chuck table 30-2 are reversed with the mountain-shaped portions facing upward. -1, 36-2, and 36-3, the area of the holding surface 31 can be reduced more than in the first modification.

It should be noted that the present invention is not limited to the above embodiments. That is, various modifications can be made without departing from the gist of the present invention.

Reference Signs List 1 processing device 10 first chuck table 11 holding surface 12 suction hole 13 suction path 14 escape groove 15 suction source 21 cutting blade 31 holding surface 30 second chuck table 32 suction hole 33 suction path 34 convex portion 35 suction source 84 transport Pad 200 Work piece 201 Front surface 202 Device 205 Back surface 210 Planned division line 211 First planned division line (planned division line extending in the first direction)
212 second line to be divided (line to be divided extending in the second direction)
213 third line to be divided (line to be divided extending in the third direction)
214 fourth line to be divided (line to be divided extending in the fourth direction)
220 Chip ST1 Placement step ST2 First cutting step ST3 Transfer step ST4 Second cutting step

Claims (1)

A workpiece dividing method for dividing a workpiece having a home-base-shaped device formed on the surface thereof with mountain-shaped rectangular short sides along a planned dividing line,
A holding surface for holding the back side of the workpiece, a plurality of suction holes formed at positions corresponding to respective devices on the holding surface, and a suction path communicating with a suction source for applying suction to the suction holes. a placing step of placing the workpiece on a first chuck table having a plurality of escape grooves formed on the holding surface to avoid contact with the cutting blade;
After the mounting step, a cutting blade is used to cut a planned division line extending in a first direction and a planned division line extending in a second direction orthogonal to the first direction set in the workpiece. , a first cutting step of forming a rectangular chip from the workpiece;
Transfer pads arranged at intervals of nA and mB (where n and m are natural numbers), where A is the distance between devices in the first direction of the workpiece and B is the distance between devices in the second direction. a holding surface having protrusions formed at predetermined intervals that can hold a part of the rectangular chip formed in the first cutting step and can hold the back side of the rectangular chip using a holding surface; a conveying step of conveying and placing the rectangular chip on a second chuck table having a plurality of suction holes formed in a convex portion and a suction path communicating with a suction source that applies suction to the suction holes; ,
A line to be divided extending in a third direction and a line to be divided extending in a fourth direction intersecting the third direction set in the workpiece are cut with a cutting blade to form a short rectangular tip. a second cutting step for forming the hand side into a chevron shape;
A method of processing a workpiece, comprising:

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