JP7296591B2 - UV-Curable Resin Composition, Method for Manufacturing Light-Emitting Device, and Light-Emitting Device - Google Patents

Description

TECHNICAL FIELD The present invention relates to an ultraviolet curable resin composition, a method for manufacturing a light emitting device, and a light emitting device, and more specifically, an ultraviolet curable resin composition containing a cationic polymerizable compound and a cationic curing catalyst, and the ultraviolet curable resin composition. and a light emitting device comprising a sealing material made of a cured product of an ultraviolet curable resin composition.

Light-emitting devices including light-emitting elements such as organic EL elements and micro-LEDs are used for lighting applications, display applications, and the like, and are expected to spread in the future.

A light-emitting element is covered with a sealing material so that the light-emitting element in the light-emitting device is not deteriorated by moisture. In this case, the light emitted by the light emitting element passes through the sealing material and is emitted to the outside. The encapsulant is made of, for example, a composition containing a cationic curable resin and a cationic polymerization initiator (see Patent Document 1). In this case, the encapsulant can be produced by curing the composition by ultraviolet irradiation or the like, so that the encapsulant can be produced without imposing a thermal load on the light emitting element.

Japanese Patent No. 5703429

According to the inventor's consideration, if the reactivity of the composition is increased in order to increase the efficiency in producing an optical part such as a sealing material from the cationically polymerizable composition, the storage stability of the composition tends to deteriorate. For example, during storage of the composition, the reaction of the composition progresses and the viscosity tends to increase. Moreover, if the reactivity is lowered in order to improve the storage stability, the production efficiency of the optical component will deteriorate.

An object of the present invention is to provide an ultraviolet curable resin composition that can be used to produce optical components and whose storage stability does not easily decrease even if the reactivity is increased, and a light emitting device that uses this ultraviolet curable resin composition. An object of the present invention is to provide a manufacturing method and a light-emitting device including a sealing material made of a cured product of an ultraviolet-curable resin composition.

An ultraviolet curable resin composition according to one aspect of the present invention contains a cationic polymerizable compound (F) and a cationic curing catalyst (G). The cationic curing catalyst (G) contains a plurality of types of ionic photoacid generators having different anionic conjugate acid strengths. The UV-curable resin composition is used to produce an optical component that transmits light emitted by a light source.

A method for manufacturing a light-emitting device according to an aspect of the present invention is a method for manufacturing a light-emitting device including a light source and an optical component that transmits light emitted by the light source. In this method, the ultraviolet curable resin composition is ejected by an inkjet method to a position through which the light emitted from the light source passes to prepare a coating film, and the optical component is prepared by irradiating the coating film with ultraviolet light. Including.

A light-emitting device according to an aspect of the present invention includes a light source and an optical component that transmits light emitted by the light source. The optical component is made of a cured product of the ultraviolet curable resin composition.

According to one aspect of the present invention, an ultraviolet curable resin composition that can be used for producing an optical component and whose storage stability is unlikely to decrease even if the reactivity is increased, and this ultraviolet curable resin composition is used. It is possible to provide a method for manufacturing a light-emitting device and a light-emitting device including an optical component made of a cured product of an ultraviolet-curable resin composition.

1 is a schematic cross-sectional view showing a first example of a light emitting device according to one embodiment of the present invention; FIG. FIG. 4 is a schematic cross-sectional view showing a second example of a light emitting device according to one embodiment of the present invention;

An embodiment of the present invention will be described below.

The ultraviolet curable resin composition (hereinafter also referred to as composition (X)) according to the present embodiment is used to produce an optical component that transmits light emitted by a light source. An optical component is a component for transmitting light emitted from a light source such as a light emitting element in a device having an optical system (for example, a light emitting device). An optical component is, for example, an encapsulant for a light-emitting element. The optical member is, for example, a thin film, more specifically, a film of 2 μm or more and 50 μm or less, or 2 μm or more and 30 μm or less.

Composition (X) contains a cationic polymerizable compound (F) and a cationic curing catalyst (G). The cationic curing catalyst (G) contains a plurality of ionic photoacid generators having different anionic conjugate acid strengths.

According to the present embodiment, among the multiple types of ionic photoacid generators, the ionic photoacid generator having a higher conjugate acid strength can enhance the reactivity of the composition (X), so that the composition Efficiency for fabricating optical components from (X) can be increased.

In addition, when composition (X) contains a plurality of types of ionic photoacid generators described above, composition (X) is less likely to gel during storage of composition (X). Stability is less likely to decrease. This is because even if an anion species with a high conjugate acid strength is released from the ionic photoacid generator during storage of the composition (X), an acid exchange reaction involving another ionic photoacid generator causes It is presumed that this is because anion species with a low strength conjugate acid are easily released, and therefore the concentration of anion species with a high strength conjugate acid in the composition (X) is difficult to increase.

In addition, according to the present embodiment, even if the composition (X) is irradiated with ultraviolet rays, the composition (X) is less likely to be cured too rapidly, so that the cured product is less likely to deteriorate in transparency due to white turbidity or the like. . This is because even if an anion species with a high conjugate acid strength is released from the ionic photoacid generator by irradiation with ultraviolet rays, an anion species with a low conjugate acid strength is likely to be released by the same mechanism as described above. It is presumed that this is because the anion species with a high strength of the conjugate acid can suppress an excessively rapid reaction.

As described above, according to the present embodiment, even if the reactivity of the composition (X) is increased, the storage stability of the composition (X) is less likely to deteriorate.

A cured product obtained by irradiating the composition (X) with light and then heating preferably has a glass transition temperature of 80° C. or higher. In this case, the cured product can have good heat resistance. Therefore, for example, when the cured product is subjected to a treatment that involves a temperature rise, the cured product is less likely to deteriorate. The glass transition temperature of the cured product is more preferably 90°C or higher, and even more preferably 100°C or higher.

The viscosity of composition (X) at 25° C. is preferably 1 mPa·s or more and 40 mPa·s or less. In this case, the composition (X) can be molded by applying the composition (X) at room temperature by a casting method or discharging it by an inkjet method. This viscosity is more preferably 35 mPa·s or less, more preferably 30 mPa·s or less, particularly preferably 20 mPa·s or less, and most preferably 15 mPa·s or less. The viscosity is preferably 5 mPa·s or more, more preferably 8 mPa·s or more. For example, the viscosity is preferably 8 mPa·s or more and 35 mPa·s or less.

It is also preferable that the composition (X) has a viscosity of 1 mPa·s or more and 40 mPa·s or less at 40°C. In this case, even if the viscosity of the composition (X) at room temperature is any value, the viscosity of the composition (X) can be lowered by slightly heating the composition (X). Therefore, if heated, the composition (X) can be easily molded by a method such as a casting method, and the composition (X) can also be ejected by an inkjet method. Moreover, since the viscosity of the composition (X) can be lowered without significantly heating the composition (X), changes in the composition of the composition (X) due to volatilization of the components in the composition (X) can be suppressed. This viscosity is more preferably 35 mPa·s or less, more preferably 30 mPa·s or less, particularly preferably 20 mPa·s or less, and most preferably 15 mPa·s or less. The viscosity is preferably 5 mPa·s or more, more preferably 8 mPa·s or more. For example, the viscosity is preferably 8 mPa·s or more and 35 mPa·s or less.

Such a low viscosity of composition (X) at 25° C. or 40° C. can be achieved by the composition of composition (X) described in detail below.

When the cured product of composition (X) has a thickness of 10 μm, the total light transmittance is preferably 90% or more. In this case, if the cured product is applied to an optical part such as the sealing material 5 in the light emitting device 1, the extraction efficiency of light transmitted through the optical part and emitted to the outside can be particularly improved. Such optical transparency of the cured product can also be achieved by the composition of composition (X) described in detail below.

It is also preferable that the composition (X) has a surface tension of 20 mN/cm or more and 40 mN/cm or less. In this case, when the composition (X) is ejected by an ink jet method, the ejection stability is good, and it is possible to prevent the formation of defective droplets called satellites. A surface tension of 30 mN/cm or more and 40 mN/cm or less is more preferable, and a surface tension of 31 mN/cm or more and 38 mN/cm or less is even more preferable.

The present embodiment will be described in more detail below.

1. Structure of Light-Emitting Device First, the structure of the light-emitting device 1 in the case where the device having the optical system is the light-emitting device 1 and the optical component is the sealing material 5 for sealing the light-emitting element 4 in the light-emitting device 1 will be described. . The light-emitting device 1 includes a light-emitting element 4 and a sealing material 5 covering the light-emitting element 4 . The sealing material 5 may cover the light emitting element 4 while being in direct contact with the light emitting element 4, or may cover the light emitting element 4 while some layer is interposed between the sealing material 5 and the light emitting element 4. good. The light emitting device 1 may be, for example, a lighting device or a display device (display).

Light emitting element 4 includes, for example, a light emitting diode. Light-emitting diodes include, for example, at least one of organic EL elements (organic light-emitting diodes) and micro light-emitting diodes. When the light-emitting element 4 includes an organic light-emitting diode, the light-emitting device 1 including the light-emitting element 4 is, for example, an organic EL display. If the light emitting element 4 comprises a micro light emitting diode, the light emitting device 1 comprising the light emitting element 4 is for example a micro LED display. Note that EL means electroluminescence, and LED means light emitting diode.

A first example of the structure of the light emitting device 1 will be described with reference to FIG. This light emitting device 1 is of a top emission type. A light-emitting device 1 includes a support substrate 2 , a transparent substrate 3 facing the support substrate 2 with a gap therebetween, a light-emitting element 4 on the surface of the support substrate 2 facing the transparent substrate 3 , and the support substrate 2 and the transparent substrate 3 . and a sealing material 5 filled between them. In the first example, the light-emitting device 1 also includes a passivation layer 6 that covers the surface of the support substrate 2 facing the transparent substrate 3 and the light-emitting elements 4 . That is, the passivation layer 6 is interposed between the light emitting element 4 and the sealing material 5 covering the light emitting element 4 .

The support substrate 2 is made of, for example, a resin material, but is not limited to this. The transparent substrate 3 is made of a translucent material. The transparent substrate 3 is, for example, a glass substrate or a transparent resin substrate. When the light-emitting element 4 includes an organic EL element, the organic EL element includes, for example, a pair of electrodes and an organic light-emitting layer between the electrodes. The organic light emitting layer includes, for example, a hole injection layer, a hole transport layer, an organic light emitting layer and an electron transport layer, and these layers are laminated in the order described above. Although only one light-emitting element 4 is shown in FIG. good. Passivation layer 6 is preferably made of silicon nitride or silicon oxide.

A second example of the structure of the light emitting device 1 will be described with reference to FIG. Elements common to those in the first example shown in FIG. 1 are denoted by the same reference numerals in FIG. 2 as those in FIG. 1, and detailed description thereof will be omitted as appropriate. The light emitting device 1 shown in FIG. 2 is also of the top emission type. The light-emitting device 1 includes a support substrate 2, a transparent substrate 3 facing the support substrate 2 with a gap therebetween, a light-emitting element 4 on the surface of the support substrate 2 facing the transparent substrate 3, and a seal covering the light-emitting element 4. Material 5 is provided.

When the light-emitting element 4 includes an organic EL element, the organic EL element includes, for example, a pair of electrodes 41 and 43 and an organic light-emitting layer 42 between the electrodes 41 and 43, as in the first example. The organic light emitting layer 42 includes, for example, a hole injection layer 421, a hole transport layer 422, an organic light emitting layer 423 and an electron transport layer 424, and these layers are laminated in the order described above.

The light-emitting device 1 includes a plurality of light-emitting elements 4 , and the plurality of light-emitting elements 4 form an array 9 (hereinafter referred to as element array 9 ) on the support substrate 2 . The element array 9 also comprises partition walls 7 . The partition wall 7 is located on the support substrate 2 and partitions between the two adjacent light emitting elements 4 . The partition wall 7 is produced by molding a photosensitive resin material by photolithography, for example. The element array 9 also includes connection wirings 8 that electrically connect the electrodes 43 and the electron transport layers 424 of the adjacent light emitting elements 4 to each other. The connection wiring 8 is provided on the partition wall 7 .

The light emitting device 1 also comprises a passivation layer 6 covering the light emitting element 4 . Passivation layer 6 is preferably made of silicon nitride or silicon oxide. Passivation layer 6 includes a first passivation layer 61 and a second passivation layer 62 . The first passivation layer 61 covers the light emitting elements 4 by covering the element array 9 while being in direct contact with the element array 9 . The second passivation layer 62 is arranged on the side opposite to the element array 9 with respect to the first passivation layer 61, and a space is provided between the second passivation layer 62 and the first passivation layer 61. ing. A sealing material 5 is filled between the first passivation layer 61 and the second passivation layer 62 . That is, the first passivation layer 61 is interposed between the light emitting element 4 and the sealing material 5 covering the light emitting element 4 .

Furthermore, a second sealing material 52 is filled between the second passivation layer 62 and the transparent substrate 3 . The second sealing material 52 is made of, for example, a transparent resin material. The material of the second sealing material 52 is not particularly limited. The material of the second sealing material 52 may be the same as or different from that of the sealing material 5 .

The encapsulant 5 in the light-emitting device 1 having the structure exemplified above can be produced from the composition (X). That is, the composition (X) is used to produce the encapsulant 5 for the light emitting element 4. In other words, the composition (X) is preferably a composition for producing a sealing material, a composition for sealing a light-emitting element, or a composition for manufacturing a light-emitting device.

2. Ultraviolet Curable Resin Composition The composition (X) contains a curable component having ultraviolet curability. The curable component contains a cationic polymerizable compound (F) and a cationic curing catalyst (photo-cationic curing catalyst) (G). The cationically polymerizable compound (F) contains, for example, at least one of a polyfunctional cationically polymerizable compound (F1) and a monofunctional cationically polymerizable compound (F2).

The polyfunctional cationically polymerizable compound (F1) is one or both of a polyfunctional cationically polymerizable compound (F11) having no siloxane skeleton and a polyfunctional cationically polymerizable compound (F12) having a siloxane skeleton. can contain

The polyfunctional cationically polymerizable compound (F11) does not have a siloxane skeleton and has two or more cationically polymerizable functional groups per molecule. The number of cationically polymerizable functional groups per molecule of the polyfunctional cationically polymerizable compound (F11) is preferably 2 to 4, more preferably 2 to 3.

The cationic polymerizable functional group is, for example, at least one group selected from the group consisting of epoxy group, oxetane group and vinyl ether group.

The polyfunctional cationically polymerizable compound (F11) is, for example, from the group consisting of polyfunctional alicyclic epoxy compounds, polyfunctional heterocyclic epoxy compounds, polyfunctional oxetane compounds, alkylene glycol diglycidyl ethers, and alkylene glycol monovinyl monoglycidyl ethers. It contains at least one selected compound.

The polyfunctional alicyclic epoxy compound contains, for example, one or both of a compound represented by the following formula (1) and a compound represented by the following formula (20).

In formula (1), each of R ¹ to R ¹⁸ is independently a hydrogen atom, a halogen atom, or a hydrocarbon group. The number of carbon atoms in the hydrocarbon group is preferably within the range of 1-20. The hydrocarbon group is, for example, an alkyl group having 1 to 20 carbon atoms such as a methyl group, an ethyl group, or a propyl group; an alkenyl group having 2 to 20 carbon atoms such as a vinyl group or an allyl group; or an ethylidene group or a propylidene group. 20 alkylidene groups. The hydrocarbon group may contain an oxygen atom or a halogen atom. each of R ¹ to R ¹⁸ independently represents a hydrogen atom or 1 to 2 carbon atoms;
0 is preferably a hydrocarbon group, more preferably a hydrogen atom or a methyl group, and most preferably a hydrogen atom.

In formula (1), X is a single bond or a divalent organic group, and the organic group is, for example, --CO--O-- _CH.sub.2-- .

Examples of the compound represented by formula (1) include the compound represented by formula (1a) below and the compound represented by formula (1b) below.

In formula (20), each of R ¹ to R ¹² is independently a hydrogen atom, a halogen atom, or a
20 hydrocarbon groups. Halogen is, for example, fluorine, chlorine, bromine or iodine. The hydrocarbon group having 1 to 20 carbon atoms is, for example, an alkyl group having 1 to 20 carbon atoms such as a methyl group, an ethyl group and a propyl group; an alkenyl group having 2 to 20 carbon atoms such as a vinyl group and an allyl group; or an ethylidene group and a propylidene group. It is an alkylidene group having 2 to 20 carbon atoms such as a group. The hydrocarbon group having 1 to 20 carbon atoms may contain an oxygen atom or a halogen atom.

Each of R ¹ to R ¹² is independently preferably a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, more preferably a hydrogen atom or a methyl group, most preferably a hydrogen atom.

Examples of compounds represented by formula (20) include tetrahydroindene diepoxide represented by formula (20a) below.

A polyfunctional heterocyclic epoxy compound contains, for example, a trifunctional epoxy compound as represented by the following formula (2).

The polyfunctional oxetane compound contains, for example, a bifunctional oxetane compound represented by the following formula (3).

Alkylene glycol diglycidyl ether contains, for example, at least one compound selected from the group consisting of compounds represented by the following formulas (4) to (7).

Alkylene glycol monovinyl monoglycidyl ether contains, for example, a compound represented by the following formula (8).

More specifically, the polyfunctional cationic polymerizable compound (F11) is, for example, Daicel Celoxide 2021P and Celoxide 8010, Nissan Chemical TEPIC-VL, Toagosei OXT-221, and Yokkaichi Gosei 1, It can contain at least one component selected from the group consisting of 3-PD-DEP, 1,4-BG-DEP, 1,6-HD-DEP, NPG-DEP and butylene glycol monovinyl monoglycidyl ether.

The polyfunctional cationically polymerizable compound (F11) also preferably contains a polyfunctional alicyclic epoxy compound. In this case, the composition (X) can have a particularly high cationic polymerization reactivity.

The polyfunctional alicyclic epoxy compound preferably contains either one or both of the compound represented by formula (1) and the compound represented by formula (20). In this case, composition (X) can have higher cationic polymerization reactivity.

When the polyfunctional alicyclic epoxy compound contains the compound represented by formula (1), the compound represented by formula (1) preferably contains the compound represented by formula (1a). In this case, the composition (X) can have a higher cationic polymerization reactivity and a particularly low viscosity.

In addition, in particular, the compound represented by formula (20) has a low viscosity, so when the compound represented by formula (20) is contained, the composition (X) can have good ultraviolet curability, and in particular It can have a low viscosity. Furthermore, the compound represented by formula (20) has a property of being difficult to volatilize in spite of having a low viscosity. Therefore, even if the composition (X) contains the compound represented by the formula (20), the composition (X) is unlikely to change in composition due to volatilization of the compound represented by the formula (20). Therefore, by containing the compound represented by formula (20), the composition (X) can have a low viscosity without impairing the storage stability.

The compound represented by formula (20) can be synthesized, for example, by oxidizing a cyclic olefin compound having a tetrahydroindene skeleton using an oxidizing agent.

The compound of formula (20) can contain four stereoisomers based on the configuration of the two epoxy rings. Compounds of formula (20) may include any of the four stereoisomers. That is, the compound represented by formula (20) can contain at least one component selected from the group consisting of four stereoisomers. In the compound represented by the formula (20), the ratio of the total amount of the exo-endo form and the endo-endo form among the four stereoisomers is 10% by mass or less with respect to the entire epoxy compound (A1). is preferred, and 5% by mass or less is more preferred. In this case, the heat resistance of the cured product can be improved. The proportion of a specific stereoisomer in the compound represented by formula (20) can be determined based on the peak area ratio appearing in the chromatogram obtained by gas chromatography.

In order to reduce the amounts of the exo-endo form and the endo-endo form in the compound represented by the formula (20), a method of precision distillation of the compound represented by the formula (20), column chromatography using silica gel or the like as a packing material Any suitable method can be applied, such as a method applying graphics.

When the composition (X) contains the polyfunctional cationically polymerizable compound (F11), the ratio of the polyfunctional cationically polymerizable compound (F11) to the total amount of the resin component is preferably in the range of 5 to 95% by mass. . The resin component refers to a cationically polymerizable compound in the composition (X), including a polyfunctional cationically polymerizable compound (F1) and a monofunctional cationically polymerizable compound (F2). When the proportion of the polyfunctional cationically polymerizable compound (F11) is 5% by mass or more, the composition (X) can have particularly excellent reactivity during the cationic photopolymerization reaction, and thereby the cured product has high strength. (hardness). Further, if the proportion of the polyfunctional cationically polymerizable compound (F11) is 95% by mass or less, when the composition (X) contains the moisture absorbent (C), the moisture absorbent (C ) can be particularly easily dispersed uniformly. The proportion of the polyfunctional cationically polymerizable compound (F11) is more preferably 12% by mass or more, still more preferably 15% by mass or more, even more preferably 20% by mass or more, even if it is 25% by mass or more. is particularly preferred. The proportion of this polyfunctional cationically polymerizable compound (F11) is more preferably 85% by mass or less, and even more preferably 60% by mass or less. For example, it is preferable that the proportion of the polyfunctional cationic polymerizable compound (F11) is within the range of 20 to 60% by mass.

When the polyfunctional cationically polymerizable compound (F11) contains a polyfunctional alicyclic epoxy compound, the polyfunctional alicyclic epoxy compound may be a part of the polyfunctional cationically polymerizable compound (F11), or the entire may be The ratio of the polyfunctional alicyclic epoxy compound to the polyfunctional cationically polymerizable compound (F11) is preferably within the range of 15 to 100% by mass. When this proportion is 15% by mass or more, the polyfunctional alicyclic epoxy compound can particularly contribute to improving the ultraviolet curability of the composition (X).

The polyfunctional cationically polymerizable compound (F12) has a siloxane skeleton and two or more cationically polymerizable functional groups per molecule. The number of cationically polymerizable functional groups per molecule of the polyfunctional cationically polymerizable compound (F12) is preferably 2 to 6, more preferably 2 to 4. The polyfunctional cationically polymerizable compound (F12) can contribute to improving the cationic polymerization reactivity of the composition (X), and can contribute to improving the resistance to heat discoloration of the cured product and optical parts. The polyfunctional cationically polymerizable compound (F12) can also contribute to lower elastic modulus of cured products and optical parts. When the composition (X) contains a moisture absorbent, the polyfunctional cationically polymerizable compound (F12) can also contribute to improving the dispersibility of the moisture absorbent in the composition (X) and in the cured product.

The polyfunctional cationic polymerizable compound (F12) is preferably liquid at 25°C. In particular, the viscosity at 25° C. of the polyfunctional cationic polymerizable compound (F12) is preferably in the range of 10 to 300 mPa·s. In this case, an increase in the viscosity of composition (X) can be suppressed.

The cationically polymerizable functional group possessed by the polyfunctional cationically polymerizable compound (F12) is, for example, at least one group selected from the group consisting of an epoxy group, an oxetane group and a vinyl ether group.

The siloxane skeleton of the polyfunctional cationically polymerizable compound (F12) may be linear, branched, or cyclic. The number of Si atoms in the siloxane skeleton is preferably within the range of 2-14. In this case, composition (X) can have a particularly low viscosity. The number of Si atoms is more preferably within the range of 2-10, more preferably within the range of 2-7, and particularly preferably within the range of 3-6.

The polyfunctional cationically polymerizable compound (F12) contains, for example, at least one of the compound represented by formula (10) and the compound represented by formula (11).

R in each of formulas (10) and (11) is a single bond or a divalent organic group, preferably an alkylene group. Y is a siloxane skeleton, which may be linear, branched, or cyclic, and the number of Si atoms is preferably within the range of 2 to 14, preferably within the range of 2 to 10. is more preferable, more preferably in the range of 2 to 7, and particularly preferably in the range of 3 to 6. n is an integer of 2 or more, preferably in the range of 2-4.

More specifically, for example, the polyfunctional cationically polymerizable compound (F12) contains a compound represented by the following formula (10a).

R in formula (10a) is a single bond or a divalent organic group, preferably an alkylene group having 1 to 4 carbon atoms. n in formula (10a) is an integer of 0 or more. n is from 0 to
It is preferably in the range of 12, more preferably in the range of 0 to 8, even more preferably in the range of 0 to 5, and particularly preferably in the range of 1 to 4.

The compound represented by formula (10a) preferably contains a compound represented by formula (30) below. That is, the polyfunctional cationically polymerizable compound (F12) preferably contains a compound represented by the following formula (30).

More specifically, the polyfunctional cationic polymerizable compound (F12) is, for example, Shin-Etsu Chemical Co., Ltd. product numbers X-40-2669, X-40-2670, X-40-2715, X-40-2732, X -Containing at least one component selected from the group consisting of 22-169AS, X-22-169B, X-22-2046, X-22-343, X-22-163, and X-22-163B is preferred.

The polyfunctional cationically polymerizable compound (F12) preferably has an alicyclic epoxy structure, and it is particularly preferable if the polyfunctional cationically polymerizable compound (F12) contains a compound represented by formula (10a). The compound represented by the formula (10a) can particularly contribute to improving the cationic polymerization reactivity and lowering the viscosity of the composition (X). can contribute. When the composition (X) contains the moisture absorbent (C), it can particularly contribute to improving the dispersibility of the moisture absorbent (C) in the composition (X).

When the composition (X) contains the polyfunctional cationically polymerizable compound (F12), the ratio of the polyfunctional cationically polymerizable compound (F12) to the total amount of the resin component is preferably in the range of 5 to 95% by mass. . In this case, especially when the composition (X) contains the moisture absorbent (C), the dispersibility of the moisture absorbent (C) in the composition (X) and in the cured product is particularly improved, and the composition (X) can have a particularly high photocationic polymerization reactivity.

The monofunctional cationically polymerizable compound (F2) has only one cationically polymerizable functional group per molecule. The cationic polymerizable functional group is, for example, at least one group selected from the group consisting of epoxy group, oxetane group and vinyl ether group.

The viscosity of the monofunctional cationic polymerizable compound (F2) at 25° C. is preferably 8 mPa·s or less. In this case, the monofunctional cationic polymerizable compound (F2) can reduce the viscosity of the composition (X) even if the composition (X) does not contain a solvent. In particular, the viscosity at 25° C. of the monofunctional cationic polymerizable compound (F2) is preferably in the range of 0.1 to 8 mPa·s.

The monofunctional cationically polymerizable compound (F2) can contain, for example, at least one compound selected from the group consisting of compounds represented by the following formulas (12) to (17) and limonene oxide.

The ratio of the monofunctional cationically polymerizable compound (F2) to the total amount of the resin component is preferably in the range of 5-50% by mass. If the proportion of the monofunctional cationically polymerizable compound (F2) is 5% by mass or more, the viscosity of the composition (X) can be particularly reduced. Further, when the ratio of the monofunctional cationically polymerizable compound (F2) is 50% by mass or less, the composition (X) can have particularly excellent reactivity during the photocationic polymerization reaction, and thereby, the cured product can have high strength (hardness). The proportion of the monofunctional cationically polymerizable compound (F2) is more preferably 10% by mass or more, and even more preferably 15% by mass or more. The proportion of the monofunctional cationically polymerizable compound (F2) is more preferably 40% by mass or less, even more preferably 35% by mass or less, and particularly preferably 30% by mass or less. If the ratio of the monofunctional cationically polymerizable compound (F2) is particularly 35% by mass or less, the amount of volatilization of the components in the composition (X) during storage of the composition (X) can be effectively reduced. Therefore, even if the composition (X) is stored for a long period of time, the properties of the composition (X) are unlikely to be impaired. Furthermore, it is possible to particularly suppress the generation of tack in the cured product. For example, it is preferable that the proportion of the monofunctional cationic polymerizable compound (F2) is within the range of 10 to 35% by mass.

Further, particularly when the composition (X) contains a polyfunctional cationically polymerizable compound (F11) and a polyfunctional cationically polymerizable compound (F12), the polyfunctional cationically polymerizable compound (F11) is is in the range of 30 to 60% by mass, the ratio of the polyfunctional cationically polymerizable compound (F12) is in the range of 15 to 30% by mass, and the ratio of the monofunctional cationically polymerizable compound (F2) is in the range of 15 to 40% by mass. % is preferred. In this case, good storage stability, low viscosity, and good cationic polymerization reactivity of the composition (X) can be achieved in a well-balanced manner. well achievable.

If the cationic polymerizable compound (F) contains the compound represented by the formula (3) and the compound represented by the formula (16), a photocured product can be produced from the composition (X) by adjusting the ratio of the two. It is possible to realize a low viscosity and an improvement in the storage stability of the composition (X) while appropriately adjusting the easiness of progress of the curing reaction when the composition (X) is used.

The amount of the compound represented by formula (16) is appropriately adjusted so that the composition (X) has the properties described above. For example, the amount of the compound represented by formula (16) is preferably 10% by mass or more and 40% by mass or less with respect to the total amount of the resin component.

The cationically polymerizable compound (F) preferably contains a compound (f1) represented by the following formula (30) (hereinafter also referred to as an aromatic epoxy compound (f1)).

In formula (30), X is at least one selected from the group consisting of halogen, H, a hydrocarbon group and an alkylene glycol group, and when there are multiple Xs in one molecule, they may be the same or different. may Hydrocarbon groups are, for example, alkyl groups or aryl groups. When X is a hydrocarbon group, the number of carbon atoms in X is in the range of 1 to 10, for example. R is a single bond or a divalent organic group. When R is a divalent organic group, the divalent organic group is, for example, an alkylene group, an oxyalkylene group, a carbonyloxyalkylene group (eg --CO--O--CH ₂
-), or a -C(Ph) ₂ -O-CH ₂ - group. Y is H or a monovalent organic group. When Y is a monovalent organic group, the monovalent organic group is for example an alkyl group or an aryl group.

When the cationically polymerizable compound (F) contains the aromatic epoxy compound (f1), the aromatic epoxy compound (f1) has a low viscosity, so the aromatic epoxy compound (f1) reduces the viscosity of the composition (X). easy to let In addition, the aromatic epoxy compound (f1) is difficult to volatilize, so even if the composition (X) is stored, the composition (X) is unlikely to change in composition due to volatilization of the aromatic epoxy compound (f1). . Therefore, the aromatic epoxy compound (f1) tends to improve the storage stability of the composition (X). In addition, since the aromatic epoxy compound (f1) has high reactivity, it is difficult for unreacted components to remain in the cured product, so that outgassing is less likely to occur from the cured product. Furthermore, the aromatic epoxy compound (f1) tends to increase the glass transition temperature of the cured product, and therefore tends to increase the heat resistance of the cured product.

In addition, the aromatic epoxy compound (f1) is less likely to produce defective droplets called satellites when the composition (X) is ejected by an inkjet method. A satellite is a droplet that separates from the original droplet and adheres to a position different from the original droplet adhesion position on the application target when the droplet is ejected by the ink jet method. If satellites are produced, the dimensional accuracy of optical parts such as a sealing material produced from the composition (X) will be deteriorated.

R in formula (30) is preferably a single bond or an alkylene group. When n in formula (30) is 2 or 3, at least one of the multiple Rs in formula (30) is preferably a single bond or an alkylene group. In these cases, the reactivity of the aromatic epoxy compound (f1) tends to be high, so that the curability of the composition (X) tends to be high when the composition (X) is irradiated with ultraviolet rays.

The aromatic epoxy compound (f1) preferably contains, for example, at least one compound selected from the group consisting of compounds represented by formulas (301) to (318) below.

In particular, the aromatic epoxy compound (f1) may contain at least one component selected from the group consisting of compounds represented by formulas (301) to (305), (312), (314) and (318). preferable. These compounds tend to have high reactivity because at least one epoxy group (oxirane) in the compound and a benzene ring are bonded via a single bond or an alkylene group, so that the composition (X) can be cured. easy to enhance.

The ratio of the aromatic epoxy compound (f1) to the total cationically polymerizable compound (F) is preferably 5% by mass or more. In this case, the above effects of the aromatic epoxy compound (f1) are particularly likely to be obtained. This proportion is also preferably 95% by mass or less. In this case, the storage stability of the composition (X) tends to be good. This ratio is more preferably 10% by mass or more and 90% by mass or less, and even more preferably 20% by mass or more and 85% by mass or less.

It is also preferred that the cationically polymerizable compound (F) contains a compound (f2) having an oxyalkylene skeleton. An oxyalkylene skeleton is a linear skeleton composed of one or more linear oxyalkylene units.

When the cationically polymerizable compound (F) contains the compound (f2), the compound (f2) has a low viscosity, so the compound (f2) tends to reduce the viscosity of the composition (X). In addition, the compound (f2) is difficult to volatilize, so even when the composition (X) is stored, the composition (X) is less likely to change in composition due to volatilization of the aromatic epoxy compound (f1). Therefore, compound (f2) tends to improve the storage stability of composition (X).

In addition, the compound (f2) is less likely to produce defective droplets called satellites when the composition (X) is ejected by an inkjet method. Furthermore, the compound (f2) can suppress the formation of satellites even when the velocity of droplets ejected by the inkjet method is increased. Therefore, depending on the inkjet conditions, for example, it is possible to increase the ejection speed of droplets by the inkjet method to 4 m/s or more without generating satellites. If the velocity of the droplet can be increased, the trajectory of the droplet is less susceptible to disturbance, and thus the dimensional accuracy of an optical component such as a sealing material produced from the composition (X) can be increased. Furthermore, since the compound (f2) can enhance the storage stability of the composition (X) as described above, the composition (X) is unlikely to form satellites even when the composition (X) is stored for a long period of time. characteristics are easily maintained.

The oxyalkylene skeleton particularly preferably has a structure of “—C—C—O—”, that is, contains an oxymethylene unit. In this case, satellites are particularly unlikely to occur, and for example, satellites are less likely to occur even if the driving frequency for discharging the composition (X) is changed by an ink jet method. In addition, the compound (f2) is less likely to volatilize and tends to have a lower viscosity, and the affinity (wettability) of the composition (X) for inorganic materials tends to increase.

The number of oxyalkylene units in the oxyalkylene skeleton in compound (f2) is preferably 1 or more and 8 or less. In this case, since the compound (f2) tends to have a lower viscosity, satellites are particularly unlikely to form, and the crosslink density of the cured product tends to increase, so the glass transition temperature of the cured product tends to increase. The number of oxyalkylene units is more preferably 1 or more and 6 or less, and more preferably 1 or more and 4 or less.

A substituent other than hydrogen may be bonded to the oxyalkylene unit in the oxyalkylene skeleton of the compound (f2). For example, an oxymethylene unit contained in an oxyalkylene skeleton may have a structure of "--CH( _CH.sub.3 )-- _CH.sub.2 --O--".

The proportion of the compound (f2) is preferably 10% by mass or more relative to the cationic polymerizable compound (F). In this case, the ink-jet property is improved and the wettability to the substrate is improved.
It is also preferred that this proportion is 70% by weight or less. In this case, the glass transition temperature can be sufficiently increased. This ratio is more preferably 15% by mass or more and 60% by mass or less, and even more preferably 20% by mass or more and 50% by mass or less.

The compound (f2) contains, for example, at least one compound selected from a compound (f21) having an oxyalkylene skeleton and an epoxy group and a compound (f22) having an oxyalkylene group and an oxetane group.

The compound (f21) is, for example, the compound represented by the above formula (1b), the compound represented by the formula (4), the compound represented by the formula (5), the compound represented by the formula (6), the compound represented by the formula (7), the compound represented by the formula It contains at least one compound selected from the group consisting of the compound represented by (8), the compound represented by formula (13), the compound represented by formula (14), and the like. In addition, the components that the compound (f21) may contain are not limited to those mentioned above.

The compound (f22) is at least one selected from the group consisting of, for example, the compound represented by the above formula (3), the compound represented by the formula (12), the compound represented by the formula (16), and the compound represented by the formula (17). contains a compound of In addition, the components that the compound (f22) may contain are not limited to those mentioned above.

The cationically polymerizable compound (F) also preferably contains an epoxy compound and the above compound (f22). The epoxy compound contains, for example, at least one compound having an epoxy group among the compounds that can be contained in the cationic polymerizable compound (F) described above. When the cationically polymerizable compound (F) contains the epoxy compound and the compound (f22), the curability of the composition (X) is likely to increase when the composition (X) is irradiated with ultraviolet rays, and the composition at this time Excessive hardening of the product (X) is less likely to occur, and thus the cured product is less likely to deteriorate in transparency due to white turbidity or the like. The mechanism that causes this effect is presumed to be as follows. Since the reactivity of the compound (f22) is lower than that of the epoxy compound, when the composition (X) is irradiated with ultraviolet rays, the epoxy compound reacts first. The reaction of this epoxy compound tends to increase the curability of the composition (X). Subsequently, the compound (f22) reacts, thereby making it difficult for the epoxy compound and the compound (f22) to react at once. It is thought that this makes it difficult for an excessively rapid reaction to occur. In this case, the ratio of the compound (f22) to the cationically polymerizable compound (F) is preferably 20% by mass or more. In this case, the compound (f22) particularly tends to lower the viscosity of the composition (X) and enhance the storage stability of the composition (X). Furthermore, the curability of the composition (X) is particularly likely to be enhanced by the compound (f22). It is also preferable that the proportion of the compound (f22) is 90 mass or less. In this case, the curability of the cured product can be sufficiently enhanced. The proportion of the compound (f22) is more preferably 10% by mass or more and 90% by mass or less, and even more preferably 20% by mass or more and 80% by mass or less. In this case, the proportion of the epoxy compound is preferably 10% by mass or more and 90% by mass or less, more preferably 20% by mass or more and 80% by mass or less, relative to the total amount of the cationic polymerizable compound (F). , more preferably 25% by mass or more and 75% by mass or less. In these cases, the unreacted groups in the cured product can be sufficiently reduced to sufficiently enhance the curability of the cured product.

The epoxy compound preferably contains a compound having at least one oxirane ring that does not constitute a glycidyl ether group. In this case, the epoxy compound tends to particularly enhance the curability of the composition (X). More preferably, the epoxy compound contains a compound having two or more oxirane rings that do not constitute a glycidyl ether group. It is also preferred that the epoxy compound contains a compound that does not have a glycidyl ether group. It is particularly preferable if the epoxy compound contains a compound that has two or more oxirane rings that do not constitute a glycidyl ether group and that does not have a glycidyl ether group.

It is particularly preferable if the cationically polymerizable compound (F) contains the compound (f2) and an epoxy compound, and the epoxy compound further contains the aromatic epoxy compound (f1) described above. In this case, the composition (X) tends to have particularly excellent storage stability, and when the composition (X) is ejected by an inkjet method, it is particularly difficult to produce defective droplets called satellites. Furthermore, even if the velocity of droplets ejected by the inkjet method is increased, satellites are particularly unlikely to occur. Furthermore, even when the composition (X) is stored for a long period of time, the characteristic of the composition (X) that satellites are less likely to occur is particularly likely to be maintained. In this case, it is particularly preferable if compound (f2) contains compound (f22).

The total ratio of the aromatic epoxy compound (f1) and the compound (f22) to the cationic polymerizable compound (F) is preferably 55% by mass or more. In this case, the effects of the combination of the aromatic epoxy compound (f1) and the compound (f22) are particularly pronounced. This ratio is more preferably 60% by mass or more, and even more preferably 70% by mass or more. It is particularly preferable if the cationically polymerizable compound (F) contains only the aromatic epoxy compound (f1) and the compound (f22).

The cationic curing catalyst (G) is not particularly limited as long as it is a catalyst that generates protonic acid or Lewis acid upon receiving light irradiation. The cationic curing catalyst (G) contains an ionic photoacid generator. The cationic curing catalyst (G) may further contain a nonionic photoacid generator.

The ionic photoacid generator can contain at least one of onium salts and organometallic complexes. Examples of onium salts include aromatic diazonium salts, aromatic halonium salts, and aromatic sulfonium salts. Examples of organometallic complexes include iron-arene complexes, titanocene complexes, and arylsilanol-aluminum complexes. The ionic photoacid generator can contain at least one of these components.

The nonionic photoacid generator contains at least one component selected from the group consisting of, for example, nitrobenzyl esters, sulfonic acid derivatives, phosphoric acid esters, phenolsulfonic acid esters, diazonaphthoquinones, and N-hydroxyimidophosphonates. can.

More specific examples of compounds that can be contained in the cationic curing catalyst (G) include Midori Chemical DPI series (105, 106, 109, 201, etc.), BI-105, MPI series (103, 105, 106, 109, etc.). ), BBI series (101, 102, 103, 105, 106, 109, 110, 200, 210, 300, 301, etc.), TSP series (102, 103, 105, 106, 109, 200, 300, 1000, etc.), HDS-109, MDS series (103, 105, 109, 203, 205, 209, etc.), BDS-109, MNPS-109, DTS series (102, 103, 105, 200, etc.), NDS series (103, 105, 155 , 165, etc.), DAM series (101, 102, 103, 105, 201, etc.), SI series (105, 106, etc.), PI-106, NDI series (105, 106, 109, 1001, 1004, etc.), PAI series (01, 101, 106, 1001, 1002, 1003, 1004, etc.), MBZ-101, PYR-100, NB series (101, 201, etc.), NAI series (100, 1002, 1003, 1004, 101, 105, 106) , 109, etc.), TAZ series (100, 101, 102, 103, 104, 107, 108, 109, 110, 113, 114, 118, 122, 123, 203, 204, etc.), NBC-101, ANC-101, TPS-Acetate, DTS-Acetate, Di-Boc Bisphinol A, tert-Butyl lithocholate, tert-Butyl deoxycholate, tert-Butyl cholate, BX, BC-2, MPI-103, BDS-105, TPS-103, NAT-
103, BMS-105, and TMS-105;
Cyracure UVI-6970, Cyracure UVI-6974, Cyracure UVI-6990, and Cyracure UVI-950 manufactured by Union Carbide, USA;
Irgacure 250, Irgacure 261 and Irgacure 264 from BASF;
CG-24-61 manufactured by Ciba-Geigy;
Adeka Optomer SP-150, Adeka Optomer SP-151, Adeka Optomer SP-170 and Adeka Optomer SP-171 manufactured by ADEKA Corporation;
DAICAT II manufactured by Daicel Corporation;
UVAC1590 and UVAC1591 manufactured by Daicel Cytec Co., Ltd.;
CI-2064, CI-2639, CI-2624, CI-2481, CI-2734, CI-2855, CI-2823, CI-2758, and CIT-1682 manufactured by Nippon Soda Co., Ltd.;
PI-2074, a tetrakis(pentafluorophenyl)borate toluyl cumyl iodonium salt from Rhodia;
FFC509 manufactured by 3M;
CD-1010, CD-1011 and CD-1012 manufactured by Sartomer, USA;
CPI-100P, CPI-101A, CPI-110P, CPI-110A and CPI-210S from Sun-Apro Corporation; and UVI-6992 and UVI-6976 from The Dow Chemical Company. The cationic curing catalyst (G) can contain at least one compound selected from the group consisting of these compounds.

As described above, in the present embodiment, the cationic curing catalyst (G) contains a plurality of types of ionic photoacid generators having mutually different strengths of conjugate acids of the anionic species, so that the reactivity of the composition (X) is Even if it is increased, the storage stability of composition (X) is less likely to deteriorate. Furthermore, even if the composition (X) is irradiated with ultraviolet rays, excessive rapid curing of the composition (X) is less likely to occur, and therefore deterioration of transparency due to cloudiness or the like in the cured product is less likely to occur.

The cationic curing catalyst (G) comprises a first agent (g1) containing an ionic photoacid generator having an anionic species with a higher conjugate acid strength, and an ionic photoacid having an anionic species with a lower conjugate acid strength. It is preferable to contain a second agent (g2) containing a generator. The first agent (g1) is, for example, selected from the group consisting of an ionic photoacid generator having (Rf) _n PF _6-n ^- and an ionic photoacid generator having (Rx) _n BX _4-n ^- containing at least one ionic photoacid generator. The second agent (g2) includes, for example, an ionic photoacid generator containing PF ₆ ^- , an ionic photoacid generator containing BF ₄ ^- , an ionic photoacid generator containing (Rf)SO ₃ ^- , and It contains at least one ionic photoacid generator selected from the group consisting of ionic photoacid generators having sulfite ions.

Rf in (Rf) _n PF _6-n ^- and (Rf) SO ₃ ^- is a perfluoroalkyl group, and n in (Rf) _n PF _6-n ^- is any number from 1 to 5. be. The number of carbon atoms in Rf in (Rf) _n PF _6-n ^- is, for example, 1 or more and 3 or less. The carbon number of Rf in (Rf)SO ₃ ^- is, for example, 1 or more and 8 or less.

Rx in (Rx) _n BX _4-n ^- is a phenyl group in which a portion of the hydrogen atoms are substituted with halogen atoms or electron-withdrawing substituents. A halogen atom is a fluorine atom, a chlorine atom, a bromine atom, or the like. Electron-withdrawing substituents are, for example, a trifluoromethyl group, a nitro group, a cyano group, and the like. X is a halogen atom, preferably a fluorine atom. n is any number from 1 to 4. When Rx is plural, Rx may be the same or different. (Rx) _{nBX4 -n-} ^is _{, for} example, ( _{C6F5 ) 4B-} ^, (( _CF3 ) _{2C6H3 ) 4B-} ^, ( _{CF3C6H4 )
4B-} ^{, (} _{C6F5 ) 2BF2-} ^, _{C6F5BF3- ,} ( _{C6H3F2 ) 4B-} ^, _{and the like} .

When the cationic curing catalyst (G) contains an ionic photoacid generator having PF ₆ ^- , the amount of the ionic photoacid generator having PF ₆ ^- with respect to the total amount of the cationic curing catalyst (G) is 50% by mass or less. is preferably PF ₆ ^- may generate a small amount of hydrofluoric acid, and this hydrofluoric acid may corrode inorganic materials such as silicon nitride and silicon oxide, which are materials of the passivation layer. However, if the amount of the ionic photoacid generator containing PF ₆ ^- is 50% by mass or less as described above, the risk of hydrofluoric acid attacking inorganic materials can be reduced. More preferably, the amount of the ionic photoacid generator containing PF ₆ ⁻ is 25% by mass or less.

When the cationic curing catalyst (G) contains an ^ionic photoacid generator having (Rf _{) n PF 6 -n} ^- , the ionic The amount of photoacid generator is preferably 75% by mass or less. (Rf) _n PF _6-n ^- may also generate a small amount of hydrofluoric acid, though not as much as PF ₆ ^- . However, when the amount of the ionic photoacid generator having (Rf) _n PF _6-n ^- is 75% by mass or less as described above, the risk of hydrofluoric acid attacking inorganic materials can be reduced.

Further, when the cationic curing catalyst (G) contains both an ionic photoacid generator having PF ₆ ^- and an ionic photoacid generator having (Rf) _n PF _6-n ^- , the cationic curing catalyst (G ) The amount of the ionic photoacid generator having PF ₆ ⁻ is preferably 25% by mass or less with respect to the total amount. If the total amount of the ionic photoacid generator having PF ₆ ^- and the ionic photoacid generator having (Rf) _n PF _6-n ^- is 80% by mass or less with respect to the total amount of the cationic curing catalyst (G) Especially preferred.

On the other hand, an ionic photoacid generator having (Rx) _n BX _4-n ^- is preferable because it hardly generates hydrofluoric acid.

The cationic species in the ionic photoacid generator contained in the first agent (g1) and the cationic species in the ionic acid generator contained in the second agent (g2) are not particularly limited. Specifically, at least one selected from the group consisting of various aromatic diazoniums, aromatic haloniums, aromatic sulfoniums, and the like may be used.

When the cationic curing catalyst (G) contains the first agent (g1) and the second agent (g2), the composition (X) has good curability, while the cured product of the composition (X) becomes cloudy. is particularly difficult to occur, and the storage stability of the composition (X) tends to be particularly high.

The ratio of the first agent to the total amount of the first agent and the second agent is preferably 50% by mass or more. In this case, composition (X) can have good curability. Moreover, this ratio is preferably 90% by mass or less. In this case, the cured product is particularly unlikely to become cloudy, and the storage stability of the composition (X) tends to be particularly high. This ratio is more preferably 60% by mass or more and 90% by mass or less, and even more preferably 70% by mass or more and 85% by mass or less.

The ratio of the cationic curing catalyst (G) to the total amount of the resin component is preferably 1% by mass or more and 4% by mass or less. When this proportion is 1% by mass or more, the composition (X) can have particularly good cationic polymerization reactivity. In addition, when this proportion is 4% by mass or less, the composition (X) can have good storage stability, and since it does not contain an excessive amount of the cationic curing catalyst (G), it is possible to reduce the production cost. is.

Composition (X) may contain a sensitizer (H). Sensitizer (H) contains, for example, one or both of 9,10-dibutoxyanthracene and 9,10-diethoxyanthracene. The ratio of the sensitizer (H) to the total amount of the resin component is preferably in the range of more than 0% by mass and 1% by mass or less. In this case, the sensitizer (H) is less likely to impair the transparency of the cured product, so that the cured product can have good transparency. More preferably, the amount of the sensitizer (H) is more than 0% by mass and 0.8% by mass or less with respect to the total amount of the resin component.

Composition (X) may further contain a moisture absorbent (C). When the composition (X) contains the hygroscopic agent (C), the cured product can have excellent hygroscopicity. It is preferable that the average particle size of the moisture absorbent (C) is 200 nm or less. In this case, the cured product can have high transparency in spite of containing the moisture absorbent (C). In addition, when the composition (X) is ejected by an ink jet method, if the average particle size of the moisture absorbent (C) is 200 nm or less, there is an advantage that the composition (X) is less likely to clog nozzles. Furthermore, when the average particle size of the moisture absorbent (C) is 200 nm or less, the moisture absorbent (C) does not easily impair the smoothness of the surface of the optical component produced from the composition (X). Therefore, the surface of the optical component can have good smoothness.

As described above, the hygroscopic agent (C) enables the cured product to have high hygroscopicity. The moisture absorption rate of the cured product is preferably 0.5% by mass or more, more preferably 1% by mass or more, and most preferably 2% by mass or more. Incidentally, the moisture absorption rate is obtained by the following method. A film having a thickness of 10 μm is produced by applying the composition (X) in an argon atmosphere and then irradiating it with ultraviolet rays. The ultraviolet irradiation conditions are, for example, an ultraviolet peak wavelength of 365 nm, an ultraviolet intensity of 3000 mW/cm ² , and an ultraviolet irradiation time of 10 seconds. This film is vacuum-dried using, for example, a vacuum dryer under conditions of a heating temperature of 120° C. and a heating time of 3 hours. Measure the mass of the film after drying. Let this measurement result be the initial mass (M ₀ ). Subsequently, the film is sufficiently moisture-absorbed. For this purpose, for example, the film is exposed to conditions of 85° C. and 85% RH for 24 hours. Measure the mass of the film after moisture absorption. The result of this measurement is called mass after moisture absorption (M). From these initial mass (M ₀ ) and mass after moisture absorption (M), the moisture absorption rate can be calculated by the formula (M−M ₀ )/M ₀ ×100 (% by mass).

The hygroscopic agent (C) is preferably inorganic particles having hygroscopicity, and contains at least one component selected from the group consisting of, for example, zeolite particles, silica gel particles, calcium chloride particles, and titanium oxide nanotube particles. is preferred. It is particularly preferred that the moisture absorbent (C) contains zeolite particles.

Zeolite particles having an average particle size of 200 nm or less can be produced, for example, by pulverizing general industrial zeolite. In producing the zeolite particles, the zeolite may be pulverized and then crystallized by hydrothermal synthesis or the like. In this case, the zeolite particles can have particularly high hygroscopicity. As a method for producing such nano-sized zeolite particles, for example, the methods disclosed in JP-A-2016-69266 and JP-A-2013-049602 can be used.

The zeolite particles are preferably produced using zeolite containing sodium ions as a raw material, and at least one type of zeolite containing sodium ions selected from the group consisting of A-type zeolite, X-type zeolite and Y-type zeolite is used as a raw material. is more preferable. It is particularly preferable that the zeolite particles are produced using 4A-type zeolite among A-type zeolites as a raw material. In these cases, the zeolite particles have a crystal structure suitable for moisture adsorption.

A specific example of a method for producing zeolite particles having an average particle size of 200 nm or less is shown. First, zeolite powder as a raw material is prepared, and this zeolite powder is physically pulverized. For example, zeolite powder can be physically pulverized by mixing zeolite powder with water to prepare a slurry and applying this slurry to a bead mill pulverizer.

Subsequently, the zeolite powder is crystallized by hydrothermal synthesis. For example, hydrothermal synthesis can be performed by heating a slurry containing zeolite powder after physical pulverization in an autoclave. Conditions for hydrothermal synthesis are, for example, a heating temperature range of 150 to 200° C. and a heating time range of 15 to 24 hours.

The zeolite powder is then dried. The drying temperature is, for example, in the range of 150-200° C., and the drying time is, for example, in the range of 2-3 hours. Subsequently, if necessary, the dried zeolite powder is pulverized using a mortar or the like, and then sieved to adjust the particle size.

Subsequently, if necessary, the zeolite powder is subjected to an ion exchange treatment. In particular, when the zeolite powder is sodium-containing zeolite such as LTA, it is preferable to perform an ion exchange treatment to exchange sodium in the zeolite powder with magnesium.

The ion exchange treatment is carried out by, for example, dispersing zeolite powder in an aqueous solution containing magnesium ions to prepare a mixture, and heating the mixture. More specifically, the ion exchange treatment is performed, for example, as follows. First, zeolite powder is mixed with magnesium chloride and water, and the resulting mixture is heated and stirred. During this process, it is preferable to repeat the operation of temporarily stopping the stirring, discarding the supernatant of the mixture, then replenishing the mixture with water, and then restarting the stirring a plurality of times at appropriate intervals. . The heating temperature in this treatment is preferably in the range of 40 to 80° C., and the treatment time is preferably in the range of 6 to 8 hours.

After the ion exchange treatment, the zeolite powder is dried. The drying temperature is, for example, in the range of 150-200° C., and the drying time is, for example, in the range of 2-3 hours. Subsequently, if necessary, the dried zeolite powder is pulverized using a mortar or the like, and then sieved to adjust the particle size. Thereby, zeolite particles having an average particle size of 200 nm or less can be obtained.

Crystallization of zeolite powder can also be carried out in the presence of silicates and alkali metal oxides. A specific example of a method for producing zeolite particles having an average particle size of 200 nm or less in that case will be shown. First, zeolite powder is prepared. The zeolite powder preferably has _{a composition of aM12O.bSiO2.Al2O3.cMe} . M1 is an alkali metal, proton, or ammonium ion (NH ₄ ⁺ ), Me is an alkaline earth metal, a is a number in the range of 0.01 to 1, and b is in the range of 20 to 80 and c is a number in the range of 0-1. The zeolite powder preferably contains zeolite containing sodium ions, and may contain at least one material selected from the group consisting of A-type zeolite, X-type zeolite and Y-type zeolite among zeolites containing sodium ions. more preferred. It is particularly preferred that the zeolite powder contains 4A-type zeolite among the A-type zeolites. This zeolite powder is physically pulverized. For example, zeolite powder can be physically pulverized by using a bead mill pulverizer.

The physically pulverized zeolite powder is dispersed in a solution containing M2 ₂ O, SiO ₂ and H ₂ O to prepare a slurry. M2 is an alkali metal, preferably K or Na. The M2 ₂ O/H ₂ O molar ratio is, for example, in the range from 0.003 to 0.01, and the SiO ₂ /H ₂ O molar ratio is, for example, in the range from 0.006 to 0.025. The amount of zeolite powder is, for example, 0.5-10 g per 100 ml of solution.

Zeolite powder can be crystallized by heating this slurry in an autoclave. The conditions are, for example, a heating temperature range of 100 to 230° C. and a heating time range of 1 to 24 hours. Subsequently, the zeolite powder is washed and then dried. Thereby, zeolite particles having an average particle size of 200 nm or less can be obtained.

The pH of the zeolite particles is preferably 7 or more and 10 or less. When the pH of the zeolite particles is 7 or more, the crystals of the zeolite particles are less likely to be broken, so that the optical component produced from the composition (X) containing the zeolite particles can have particularly high hygroscopicity. Further, when the pH of the zeolite particles is 10 or less, the zeolite particles are less likely to inhibit curing when the composition (X) is cured.

The pH of the zeolite particles was obtained by adding 0.05 g of the zeolite particles to 99.95 g of ion-exchanged water, heating the resulting dispersion at 90° C. for 24 hours, and measuring the pH of the supernatant of the dispersion with a pH measuring instrument. It is a value obtained by measuring with As a pH measuring device, for example, a compact pH meter <LAQUAtwin> B-711 manufactured by Horiba, Ltd. can be used.

In order for the pH of the zeolite particles to be 7 or more and 10 or less, the zeolite particles are preferably made of FAU Y-type zeolite having protons as counter cations.

In the process of producing zeolite particles, when performing hydrothermal synthesis of zeolite, a treatment for adjusting pH may be performed. The treatment for adjusting the pH is performed, for example, before heating the slurry containing the zeolite powder prepared for hydrothermal synthesis, during heating the slurry, or after heating the slurry. Adjustment of pH is performed by adding an acid to a slurry, for example. The acid contains at least one component selected from the group consisting of inorganic acids such as hydrochloric acid, sulfuric acid and nitric acid, and organic acids such as formic acid, acetic acid and oxalic acid.

The average particle size of the moisture absorbent (C) is preferably 10 nm or more and 200 nm or less. If this average particle diameter is 200 nm or less, the cured product can have particularly high transparency. In addition, when the average particle diameter is 10 nm or more, good hygroscopicity of the hygroscopic agent (C) can be maintained. The average particle diameter is the median diameter calculated from the measurement result by the dynamic light scattering method, that is, the cumulative 50% diameter (D50). As a measuring device, Nanotrac Wave series manufactured by Microtrac Bell Co., Ltd. can be used.

The average particle size of the moisture absorbent (C) is preferably 150 nm or less, more preferably 100 nm or less, and particularly preferably 70 nm or less. Also, the average particle size of the moisture absorbent (C) is preferably 20 nm or more, more preferably 50 nm or more. In this case, the cured product can have particularly good transparency and hygroscopicity.

It is also preferable that the cumulative 90% diameter (D90) of the moisture absorbent (C) is 100 nm or less. In this case, the cured product can have particularly high transparency.

The ratio of the moisture absorbent (C) to the total amount of the composition (X) is preferably 1% by mass or more and 20% by mass or less. If the proportion of the hygroscopic agent (C) is 1% by mass or more, the cured product can have particularly high hygroscopicity. In addition, if the proportion of the moisture absorbent (C) is 20% by mass or less, the viscosity of the composition (X) can be particularly reduced, and the composition (X) must have a sufficiently low viscosity that can be discharged by an inkjet method. can also The proportion of the moisture absorbent (C) is more preferably 3% by mass or more, and particularly preferably 5% by mass or more. Moreover, the proportion of the moisture absorbent (C) is more preferably 15% by mass or less, and particularly preferably 13% by mass or less.

The composition (X) may further contain an inorganic filler other than the moisture absorbent (C). In particular, the composition (X) preferably contains nano-sized high refractive index particles. Examples of high refractive index particles include zirconia particles. When the composition (X) contains high refractive index particles, the cured product can have a high refractive index while maintaining good transparency of the cured product. Therefore, when the cured product is applied to an optical component such as the sealing material 5 in the light emitting device 1, it is possible to improve the extraction efficiency of light transmitted through the optical component and emitted to the outside. The average particle size of the high refractive index particles is preferably in the range of 5 to 30 nm, more preferably in the range of 10 to 20 nm.

The ratio of the high refractive index particles in composition (X) is appropriately designed so that the cured product has a desired refractive index. In particular, the high refractive index particles are preferably contained in the composition (X) so that the cured product has a refractive index in the range of 1.45 or more and less than 1.55. In this case, the light extraction efficiency of the light emitting device 1 is particularly improved.

When the composition (X) contains a moisture absorbent (C), the composition (X) may further contain a dispersant (D). The dispersant (D) is a surfactant that can be adsorbed on the hygroscopic agent (C). The dispersing agent (D) includes, for example, an adsorbing group (also referred to as an anchor) that can adsorb to the particles of the moisture absorbent (C), and a chain-like adsorbing group that attaches to the particles of the moisture absorbent (C) by adsorbing the particles. or a tail, which is a comb-shaped molecular skeleton. The dispersant (D) includes, for example, an acrylic dispersant whose tail is an acrylic molecular chain, a urethane dispersant whose tail is a urethane molecular chain, and a polyester dispersant whose tail is a polyester molecular chain. It contains at least one component selected from the group consisting of agents.

When the composition (X) contains the dispersant (D), the moisture absorbent (C) can be well dispersed in the composition (X) and in the cured product. Therefore, although the cured product and the optical component contain the moisture absorbent (C), the transparency of the cured product and the optical component is less likely to be lowered by the moisture absorbent (C). In addition, the dispersant (D) can effectively suppress aggregation of the moisture absorbent (C) during storage of the composition (X). Therefore, the storage stability of the composition (X) is less likely to be lowered by the moisture absorbent (C).

Furthermore, the adhesion between the cured product and silicon nitride or silicon oxide is less likely to be reduced by the dispersant (D). This is because the dispersant (D) is easily adsorbed by the moisture absorbent (C) as described above, and thus the dispersant (D) hardly affects the interface between the cured product and the silicon nitride and silicon oxide. It is believed that there is. Therefore, the optical component can have high adhesion to the glass substrate. Also, silicon nitride and silicon oxide are sometimes used as materials for the passivation layer 6 in the light emitting device 1 . Therefore, when the passivation layer 6 is made of silicon nitride or silicon oxide, optical components such as the sealing material 5 can have high adhesion to the passivation layer 6 .

The boiling point of the dispersant (D) is preferably 200°C or higher. In this case, since the dispersant (D) is difficult to volatilize from the composition (X), the storage stability of the composition (X) is further improved.

It is preferable that the dispersant (D) has one or both of a basic polar functional group and an acidic polar functional group as an adsorptive group. In this case, the moisture absorbent (C) can be dispersed particularly well in the composition (X) and in the cured product. This is because the dispersant (D) has one or both of a basic polar functional group and an acidic polar functional group, so that it easily adsorbs to the hygroscopic agent (C), so that the hygroscopic agent (C) It is considered that the effect of dispersing is remarkably expressed.

Dispersant (D) may comprise a polymer. The weight average molecular weight of the polymer is, for example, 1000 or more. Polymers include, for example, hydroxyl-containing carboxylic acid esters, salts of long-chain polyaminoamides and high-molecular-weight acid esters, salts of high-molecular-weight polycarboxylic acids, salts of long-chain polyaminoamides and polar acid esters, and high-molecular-weight unsaturated acid esters. , modified polyurethane, modified polyacrylate, polyether ester type anionic surfactant, naphthalene sulfonic acid formalin condensate salt, polyoxyethylene alkyl phosphate, polyoxyethylene nonylphenyl ether, polyester polyamine, and stearylamine acetate It contains at least one component selected from the group. When the dispersant (D) contains a polymer, the steric hindrance effect generated when the polymer is adsorbed to the particles of the moisture absorbent (C) can be improved, thereby improving the dispersibility of the moisture absorbent (C).

The dispersant (D) can contain, for example, one or both of a dispersant (F1) having a basic polar functional group and a dispersant (F2) having an acidic polar functional group.

The basic polar functional group in the dispersant (F1) having a basic polar functional group is, for example, at least one selected from the group consisting of an amino group, an imino group, an amide group, an imide group, and a nitrogen-containing heterocyclic group. Including the group of When the dispersant (F1) has a basic polar functional group, the dispersant (F1) easily adsorbs to the moisture absorbent (C), and thus the dispersibility of the moisture absorbent (C) can be improved. The basic polar functional group can particularly enhance the adsorption ability of the dispersant (F1) to the moisture absorbent (C), can particularly improve the dispersibility of the moisture absorbent (C), and can improve the composition (X). It preferably contains an amino group, since it can particularly reduce the viscosity.

The dispersant (F1) having a basic polar functional group is, for example, trade name: Solsperse 24000 (amine value: 41.6 mgKOH/g), trade name: Solsperse 32000 (amine value: 31.2 mgKOH/g), trade name : Solsperse 39000 (amine value: 25.7 mgKOH/g), trade name: Solsperse J100, trade name: Solsperse series manufactured by Nihon Luvre Resol Co., Ltd. such as Solsperse J200; trade names: DISPERBYK-108, DISPERBYK-2013, DISPERBYK -180, DISPERBYK-106, DISPERBYK-162 (amine value: 13 mgKOH/g), product name: DISPERBYK-163 (amine value: 10 mgKOH/g), product name: DISPERBYK-168 (amine value: 11 mgKOH/g), product Name: DISPERBYK-2050 (amine value: 30.7 mgKOH/g), trade name: DISPERBYK-2150 (amine value: 56.7 mgKOH/g), etc. DISPERBYK series manufactured by BYK-Chemie Japan Co., Ltd.; trade name: BYKJET-9151 (amine value: 17.2 mgKOH / g), trade name: BYKJET-9152 (amine value: 27.3 mgKOH / g) BYKJET series manufactured by BYK Chemie Japan Co., Ltd.; and trade name: Ajisper PB821 (amine value: 11.2 mg KOH / g), trade name: Ajisper PB822 (amine value: 18.2 mg KOH / g), trade name: Ajisper PB881 (amine value: 17.4 mg KOH / g), etc. Ajinomoto Fine-Techno Co., Ltd. Ajisper series including.

The amine value of the dispersant (F1) is preferably 10 mgKOH/g or more, more preferably 10 mgKOH/g or more and 30 mgKOH/g or less, and even more preferably 15 mgKOH/g or more and 30 mgKOH/g or less. Moreover, it is preferable that the dispersant (F1) does not have a phosphate group. When the dispersant (F1) has a phosphoric acid group, the acid value derived from the phosphoric acid group is preferably equal to or less than the amine value. In this case, the dispersant (F1) can disperse the moisture absorbent (C) particularly well, can particularly enhance the storage stability of the composition (X), and can particularly enhance the transparency of the cured product. Furthermore, the adhesion between the cured product and silicon nitride and silicon oxide can be particularly enhanced. Among the components that can be contained in the dispersant (F1), an example of a dispersant having an amino group and no phosphoric acid group includes DISPERBYK-108 manufactured by BYK-Chemie. Examples of dispersants having an amino group and a phosphate group and having an acid value derived from the phosphate group equal to or less than the amine value include DISPERBYK-2013 manufactured by BYK-Chemie and DISPERBYK-180 manufactured by BYK-Chemie.

The acidic polar functional group in the dispersant (F2) having an acidic polar functional group is, for example, a carboxyl group. The dispersing agent (F2) is, for example, DISPERBYK-P manufactured by BYK-Chemie.
105.

The amount of the dispersant (D) is preferably 5 parts by mass or more and 60 parts by mass or less with respect to 100 parts by mass of the moisture absorbent (C). When the amount of the dispersant (D) is 5 parts by mass or more, the advantages of the dispersant (D) can be particularly exhibited. If the amount of the dispersant (D) is 60 parts by mass or less, the adhesion between the cured product and silicon nitride or silicon oxide can be further enhanced. More preferably, the amount of the dispersant (D) is 15 parts by mass or more. The amount of the dispersant (D) is more preferably 50 parts by mass or less, even more preferably 40 parts by mass or less, and particularly preferably 30 parts by mass or less.

It is preferable that the composition (X) does not contain a solvent or has a solvent content of 1% by mass or less. In this case, there is no need to dry the composition (X) to volatilize the solvent when producing a cured product from the composition (X). Moreover, the storage stability of the composition (X) is further enhanced. The solvent content is more preferably 0.5% by mass or less, even more preferably 0.3% by mass or less, and particularly preferably 0.1% by mass or less. It is particularly preferred that the composition (X) contains no solvent or only unavoidably mixed solvents.

Composition (X) can be prepared by mixing the above components. Composition (X) is preferably liquid at 25°C.

3. Method for Producing Encapsulating Material and Method for Producing Light Emitting Device A method for producing the encapsulating material 5 using the composition (X) and a method for producing the light emitting device 1 will be described.

In the present embodiment, the composition (X) is ejected by an inkjet method to form a coating film on an object, and then the composition (X) is irradiated with ultraviolet rays to the coating film, followed by heating. , the encapsulant 5 is preferably produced. In this embodiment, the composition (X) can be applied onto an object to form a coating film by discharging the composition (X) from an inkjet head. More specifically, a coating film can be formed by ejecting the composition (X) by an inkjet method onto a position through which light emitted from an organic EL element or the like, which is the light emitting element 4, passes.

When the composition (X) is ejected by an inkjet method and applied onto an object, when the composition (X) has a sufficiently low viscosity at room temperature, for example, the viscosity at 25° C. is 30 mPa·s or less, particularly 15 mPa. When it is s or less, the composition (X) can be ejected by an ink-jet method without being heated and applied onto an object.

In the case where the composition (X) has the property of having a low viscosity when heated, the composition (X) may be heated and then the composition (X) may be discharged by an inkjet method and applied onto the object. good. When the viscosity of the composition (X) at 40° C. is 30 mPa·s or less, particularly 15 mPa·s or less, the viscosity of the composition (X) can be lowered by only slightly heating the composition (X). Composition (X) can be discharged by an inkjet method. The heating temperature of the composition (X) is, for example, 20°C or higher and 50°C or lower.

When the coating film obtained by molding the composition (X) is irradiated with light to be cured, the light with which the coating film is irradiated is, for example, ultraviolet rays. Ultraviolet light means light having a wavelength in the range of 200 nm or more and 410 nm or less. The wavelength of the light with which the coating film is irradiated is preferably in the range of 350 nm or more and 410 nm or less, more preferably 385 nm or more and 405 nm or less. Light with a wavelength of 395 nm is a representative example of the light with which the coating film is irradiated. The wavelength of the light with which the coating film is irradiated is not limited to the above description as long as the coating film can be cured.

The irradiation intensity of the light applied to the coating film is preferably 20 mW/m ² or more and 20 W/cm ² or less. The irradiation intensity of light is not limited to the above description as long as the coating film can be cured.

In irradiating the coating film with light, the shape of the portion irradiated with light may be an area type having a certain area, or may be a line type. In the case of the line type, the entire coating film can be irradiated with light by moving the coating film with respect to the light source or by moving the light source with respect to the coating film. In this case, it is easy to adjust the time during which the coating film is irradiated with light, and by adjusting this time, it is easy to adjust the integrated amount of light.

When the cured coating film is further heated, the heating temperature is preferably 90° C. or higher. In this case, the curing of the coating film is further advanced, and the linear expansion coefficient of the sealing material 5 can be easily lowered, thereby realizing that the linear expansion coefficient of the sealing material 5 is 100 ppm/° C. or more and 130 ppm/° C. or less. It's easy to do. The heating temperature is preferably 150° C. or lower. In this case, the organic EL element or the like, which is the light emitting element 4, is less likely to deteriorate due to heat.

More specifically, for example, first, the support substrate 2 is prepared. A partition wall is formed on one surface of the support substrate 2 by photolithography using, for example, a photosensitive resin material. Subsequently, on one surface of the support substrate 2, a plurality of organic EL elements, which are the light emitting elements 4, are provided. An organic EL element or the like, which is the light emitting element 4, can be produced by an appropriate method such as a vapor deposition method or a coating method. In particular, it is preferable to prepare an organic EL element or the like, which is the light emitting element 4, by a coating method such as an inkjet method as in the case of the composition (X). Thus, an element array 9 is produced on the support substrate 2 .

Next, a first passivation layer 61 is provided over the device array 9 . The first passivation layer 61 can be produced by a vapor deposition method such as a plasma CVD method.

Next, the composition (X) is discharged onto the first passivation layer 61 by, for example, an inkjet method to form a coating film. The production efficiency of the light-emitting device 1 can be particularly improved by applying the ink jet method to both the formation of the organic EL element, which is the light-emitting element 4, and the application of the composition (X). Subsequently, the coating film is cured by irradiating it with ultraviolet rays, and the encapsulant 5 is produced. The thickness of the sealing material 5 is, for example, 2 μm or more and 50 μm or less.

The thickness of the sealing material 5 is preferably 2 μm or more and 30 μm or less, more preferably 2 μm or more and 15 μm or less. As described above, in the present embodiment, it is easy to form small droplets of the composition (X) at a high density by an ink jet method, so it is easy to realize a thin encapsulant 5 having a thickness of 2 μm or more and 15 μm or less. When the encapsulating material 5 is thinned in this way, tensile stress and compressive stress are less likely to occur in the encapsulating material 5 within the light emitting device 1 . Therefore, it becomes easier to realize a flexible light emitting device 1 .

Next, a second passivation layer 62 is provided on the encapsulant 5 . The second passivation layer 62 can be produced by a vapor deposition method such as a plasma CVD method.

Next, an ultraviolet curable resin material is provided on one surface of the support substrate 2 so as to cover the second passivation layer 62, and the transparent substrate 3 is placed on this resin material. The transparent substrate 3 is, for example, a glass substrate or a transparent resin substrate.

Next, the transparent substrate 3 is irradiated with ultraviolet rays from the outside. Ultraviolet rays pass through the transparent substrate 3 and reach the ultraviolet curable resin material. Thereby, the ultraviolet curable resin material is cured, and the second sealing material 52 is produced.

As described above, the sealing material 5 made of the cured composition (X) can have good heat resistance. Therefore, when the passivation layer 6 (second passivation layer 62) is formed over the sealing material 5 by vapor deposition such as plasma CVD, even if the temperature of the sealing material 5 rises, the sealing material 5 deteriorates. hard to do. Further, even if the temperature of the light emitting device 1 rises during use of the light emitting device 1, the sealing material 5 is less likely to deteriorate. Although the light emitting element 4 is, for example, an organic EL element as described above, the light emitting element 4 may be a micro light emitting diode or the like.

Note that the optical component is not limited to the sealing material 5 for the light emitting element 4 . Composition (X) can be used to produce various optical components. For example, the optical component may be a color resist. In this case, for example, the composition (X) is made to contain a phosphor, and a color resist for a color filter is produced from this composition (X). In this case, it is easy to manufacture the color resist in the color filter with high density and accuracy. This color filter can be provided in a display device such as an organic EL display or a micro LED display.

Specific examples of the present invention are presented below. However, the present invention is not limited only to the following examples.

1. Preparation of Composition Compositions of Examples and Comparative Examples were prepared by mixing the components shown in the table below.

The details of the components shown in the table are as follows. The viscosities of the following components are values measured using a rheometer (manufactured by Anton Paar Japan, Model No. DHR-2) under conditions of a temperature of 25° C. and a shear rate of 1000 s ⁻¹ .

(1) Cationic polymerizable compound • phenylmethyloxirane: boiling point 235°C, viscosity at 25°C 6 mPs·s.
4-fluorophenyloxirane: boiling point 220°C, viscosity at 25°C 8 mPs·s.
- Styrene oxide: boiling point 200°C, viscosity at 25°C 4 mPa·s.
BATG: Polyfunctional aromatic epoxy compound manufactured by Showa Denko, product number BATG, boiling point 300°C or higher, viscosity at 25°C 10000 mPa·s.
2-glycidyl-phenyloxirane: boiling point of 300°C or higher, viscosity at 25°C of 17 mPa·s.
OXT-221: manufactured by Toagosei, product number OXT-221, compound represented by formula (3), boiling point 275°C, viscosity 11 mPa·s.
Celoxide 8010: manufactured by Daicel, product name Celoxide 8010, compound represented by formula (1a), boiling point 265°C, viscosity at 25°C 60 mPa·s.
- Celoxide 8010 (heat-treated product): A treated product obtained by heat-treating the above-mentioned Celoxide 8010 at 100°C in an air atmosphere for 30 minutes, boiling point 265°C, viscosity at 25°C 60 mPa·s.
1,2,7,8-octane diepoxide: boiling point 230°C, viscosity at 25°C 3 mPa·s.

(2) Cationic curing catalyst CPI-310B: Triarylsulfonium salt type photoacid generator manufactured by San-Apro Co., Ltd., anionic species B (C ₆ F ₅ ) ₄ ⁻ , product number CPI-310B.
CPI-210S: Triarylsulfonium salt type photoacid generator manufactured by San-Apro, anion species (Rf) _n PF _6-n ⁻ , product number CPI-310B.
· IK-1: Diaryliodonium salt type photoacid generator manufactured by San-Apro Co., Ltd., anion species (Rf) _n PF _6-n , product number IK-1.
CPI-100P: San-Apro Co., Ltd., triarylsulfonium salt type photoacid generator, anion species PF ₆ ⁻ , product number CPI-100P.
- IRGACURE250: manufactured by BASF, diaryliodonium salt type photoacid generator, anion species _PF6- ^, product number IRGACURE250.

(3) Sensitizer UVS1331: 9,10-dibutoxyanthracene, product number UVS1331, manufactured by Kawasaki Kasei.
- DETX-s: 2,4-diethylthioxanthen-9-one, manufactured by Nippon Kayaku Co., Ltd., product number DETX-s.

(4) Additive • BYK333: Leveling agent, manufactured by BYK-Chemie, active ingredient polyether-modified polydimethylsiloxane.

2. Evaluation Tests The following evaluation tests were conducted for Examples and Comparative Examples. The results are shown in the table.

2.1. Curability After coating the composition on a slide glass, using an LED-UV irradiator manufactured by CCS Co., Ltd., light of 1.5 J/c under the conditions of a peak wavelength of 395 nm and an output of 1 W/cm ² was applied.
It was photocured by irradiating with a light amount of m ² . The atmosphere was dry air containing oxygen. A film having a thickness of 10 μm was thus produced. A tester touched the surface of this film with a finger to judge the presence or absence of tack. As a result, "A" indicates that the tester does not feel tackiness, "B" indicates that there is no adhesion to the finger but tackiness is felt, and "C" indicates that the tester feels tackiness and part of the film adheres to the finger. ”, evaluated.

2.2. Transmittance After coating the composition on a smooth surface, it was irradiated with an LED-UV irradiator manufactured by CCS Co., Ltd. in a dry atmosphere at a peak wavelength of 395 nm, an output of 1 W/cm ² , and an integrated light intensity of 1.00 nm.
Photocuring was performed by irradiating light under the condition of 5 J/cm ² . A film having a thickness of 15 μm was thus produced. The transmittance of light with a wavelength of 430 nm of this film was measured. For the measurement, a spectrophotometer (U-4100 manufactured by Hitachi, Ltd.) was used.

2.3. Viscosity The viscosity of the composition was measured using a rheometer (manufactured by Anton Paar Japan, Model No. DHR-2) under conditions of a temperature of 25° C. and a shear rate of 1000 s ⁻¹ .

2.4. Surface tension The surface tension of the composition was measured by the Wilhelmy method. For the measurement, a surface tensiometer (manufactured by Kyowa Interface Science, model: CBVP-Z) was used, and a platinum plate was used at a measurement temperature of 25°C.

2.5. Storage Stability The composition was left at a temperature of 60° C. for 2 weeks. The viscosity of the composition before and after this test was measured with a rheometer, and "A" when the viscosity change rate was less than 10%, and "A" when the viscosity change rate was 10% or more and no gelation of the composition was observed after the test. "B", and "C" when gelling of the composition was observed after the test.

2.6. Inkjet property 2.6.1. Presence or absence of satellites The resin composition is put into a cartridge of an inkjet printer ("MH2420" manufactured by Ricoh Co., Ltd.), and after confirming that the resin composition in the cartridge can be discharged from the nozzle of the inkjet printer, the resin composition is ejected from the nozzle. was ejected to continuously print test patterns. A state in which droplets are discharged from the nozzle was photographed with a high-speed camera, and it was confirmed whether the droplets were separated and satellites were generated. As a result, "A" indicates the case where the droplet does not separate, "B" indicates the case where the satellite separates from the original droplet, and then the satellite unites with the original droplet to become one droplet again, and "B" indicates the original droplet. A case where the satellite was separated from the droplet and was not integrated was evaluated as "C".

2.6.2. Inkjet speed (initial)
In the above test of "2.4. Inkjet property", the ejection speed of the droplet was changed, and the droplet did not separate, or after the satellite separated from the original droplet, the satellite merged with the original droplet. The maximum ejection speed was confirmed in the case of forming one droplet again.

2.6.3. Inkjet speed (after storage)
The composition was stored at a temperature of 60°C for 2 weeks. Subsequently, the same test as the above "2.4.2. Inkjet speed (initial)" was performed.

2.6.4. Maintenance rate The percentage of the result of "2.6.3. Inkjet speed (after storage)" to the result of "2.6.2. Inkjet speed (initial)" was calculated as the maintenance rate.

2.7. Barrier Film Compatibility A 500 nm-thick SiN film was prepared on a slide glass, and a 10 μm-thick film was prepared on this SiN film under the same conditions as in “2.1. Curability”. After the film was stored in a thermo-hygrostat at 85° C. and 85% RH for 168 hours, the surface of the film was observed by SEM. As a result, "A" when no change was observed in the film, "B" when the film had blisters or surface roughness but no cracks were observed, and "C" when the film cracked. evaluated.

2.8. Glass transition temperature A coating film is prepared by applying the composition, and this coating film is irradiated with light on one side at a peak wavelength of 395 nm and an output of 1 W / cm ² using an LED-UV irradiator manufactured by CCS Co., Ltd. A film with a thickness of 200 μm was produced by photocuring each of the films so that the total amount of light was 10 J/cm ² . The glass transition temperature of a sample cut out from this film was measured using a viscoelasticity measuring device (manufactured by Hitachi High-Tech Science, model number DMA7100).

2.9. Outgassing Evaluation Outgassing when the cured product of the composition was heated was measured by the following method. 100 mg of the composition is placed in a headspace vial, and the composition is irradiated with light at a peak wavelength of 395 nm and about 100 mW/cm ² using an LED-UV irradiator manufactured by CCS Co., Ltd. to cure the composition. After that, the vial was sealed and heated at 100° C. for 30 minutes, and then the gas phase portion in the vial was introduced into a gas chromatograph and analyzed. From the results, the mass ratio of the generated gas to the composition was determined. In order to prevent outgassing, this result is preferably 200 ppm or less, more preferably 100 ppm or less, even more preferably 50 ppm or less, and particularly preferably 25 ppm or less.

Claims (15)

a cationic polymerizable compound (F);
containing a cationic curing catalyst (G),
The cationic curing catalyst (G) comprises a first agent (g1) containing an ionic photoacid generator having an anion species with a higher conjugate acid strength, and an ionic photoacid generator having an anion species with a lower conjugate acid strength. and a second agent (g2) containing an acid generator,
The ratio of the first agent (g1) to the total amount of the first agent (g1) and the second agent (g2) is 50% by mass or more.
for making an optical component that transmits light emitted by a light source,
UV curable resin composition. a cationic polymerizable compound (F);
containing a cationic curing catalyst (G),
The cationic curing catalyst (G) comprises a first agent (g1) containing an ionic photoacid generator having an anion species with a higher conjugate acid strength, and an ionic photoacid generator having an anion species with a lower conjugate acid strength. and a second agent (g2) containing an acid generator,
Viscosity at 25 ° C. is 8 mPa s or more and 40 mPa s or less,
for making an optical component that transmits light emitted by a light source,
UV curable resin composition. a cationic polymerizable compound (F);
containing a cationic curing catalyst (G),
The cationic curing catalyst (G) comprises a first agent (g1) containing an ionic photoacid generator having an anion species with a higher conjugate acid strength, and an ionic photoacid generator having an anion species with a lower conjugate acid strength. and a second agent (g2) containing an acid generator,
Viscosity at 40 ° C. is 8 mPa s or more and 40 mPa s or less,
for making an optical component that transmits light emitted by a light source,
UV curable resin composition. a cationic polymerizable compound (F);
containing a cationic curing catalyst (G),
The cationic curing catalyst (G) comprises a first agent (g1) containing an ionic photoacid generator having an anion species with a higher conjugate acid strength, and an ionic photoacid generator having an anion species with a lower conjugate acid strength. and a second agent (g2) containing an acid generator,
It is possible to eject by inkjet method,
for making an optical component that transmits light emitted by a light source,
UV curable resin composition. a cationic polymerizable compound (F);
containing a cationic curing catalyst (G),
The cationic curing catalyst (G) comprises a first agent (g1) containing an ionic photoacid generator having an anion species with a higher conjugate acid strength, and an ionic photoacid generator having an anion species with a lower conjugate acid strength. and a second agent (g2) containing an acid generator (provided that the first agent (g1) is boron iodonium fluoride and the second agent (g2) is allylsulfonium hexafluorophosphate except for),
for making an optical component that transmits light emitted by a light source,
UV curable resin composition. 6. The ratio of the first agent (g1) to the total amount of the first agent (g1) and the second agent (g2) is 50% by mass or more, according to any one of claims 2 to 5 UV curable resin composition. Viscosity at 25 ° C. is 8 mPa s or more and 40 mPa s or less,
The ultraviolet curable resin composition according to any one of claims 1 and 3 to 6. Viscosity at 40 ° C. is 8 mPa s or more and 40 mPa s or less,
The ultraviolet curable resin composition according to any one of claims 1, 2 and 4 to 7. It is possible to eject by inkjet method,
The ultraviolet curable resin composition according to any one of claims 1 to 3 and 5 to 8. The second agent (g2) includes an ionic photoacid generator containing PF ₆ ^- , an ionic photoacid generator containing BF ₄ ^- , an ionic photoacid generator containing (Rf)SO ₃ ^- and sulfite ions. At least one ionic photoacid generator selected from the group consisting of ionic photoacid generators having
The Rf is a perfluoroalkyl group,
The ultraviolet curable resin composition according to any one of claims 1 to 9. Does not contain a solvent, or has a solvent content of 1% by mass or less,
The ultraviolet curable resin composition according to any one of claims 1 to 10. A method for manufacturing a light-emitting device comprising a light source and an optical component for transmitting light emitted by the light source,
An ultraviolet curable resin composition is ejected by an inkjet method to a position through which the light emitted by the light source passes to prepare a coating film,
The ultraviolet curable resin composition is
a cationic polymerizable compound (F);
containing a cationic curing catalyst (G),
The cationic curing catalyst (G) comprises a first agent (g1) containing an ionic photoacid generator having an anion species with a higher conjugate acid strength, and an ionic photoacid generator having an anion species with a lower conjugate acid strength. and a second agent (g2) containing an acid generator,
Producing the optical component by irradiating the coating film with ultraviolet light;
A method for manufacturing a light-emitting device. The second agent (g2) includes an ionic photoacid generator containing PF ₆ ^- , an ionic photoacid generator containing BF ₄ ^- , an ionic photoacid generator containing (Rf)SO ₃ ^- and sulfite ions. At least one ionic photoacid generator selected from the group consisting of ionic photoacid generators having
The Rf is a perfluoroalkyl group,
13. A method for manufacturing a light-emitting device according to claim 12. A method for manufacturing a light-emitting device comprising a light source and an optical component for transmitting light emitted by the light source,
A coating film is produced by ejecting the ultraviolet curable resin composition according to any one of claims 1 to 11 to a position through which the light emitted by the light source passes by an inkjet method,
Producing the optical component by irradiating the coating film with ultraviolet light;
A method for manufacturing a light-emitting device. A light source and an optical component that transmits light emitted by the light source, the optical component comprising a cured product of the ultraviolet curable resin composition according to any one of claims 1 to 11.
Luminescent device.

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