JP2022052565A - Uv curable resin composition, optical component, manufacturing method of optical component, light emitting device, manufacturing method of light emitting device - Google Patents

Abstract

To provide an ultraviolet curable resin composition in which a cured film tends to be flat and smooth when the cured film is produced by curing on an inorganic material.SOLUTION: An ultraviolet curable resin composition includes a photopolymerizable compound (A) and a photopolymerization initiator (B). The photopolymerizable compound (A) contains a water-soluble compound (C), and the percentage of the water-soluble compound (C) to the ultraviolet curable resin composition is 10 mass% or more. The viscosity of the ultraviolet curable resin composition at 25°C is 30 mPa s or less.SELECTED DRAWING: Figure 1

Description

The present invention relates to an ultraviolet curable resin composition, an optical component, a method for manufacturing an optical component, a light emitting device, and a method for manufacturing a light emitting device. The present invention relates to an optical component manufactured from a resin composition, a method for manufacturing an optical component using the ultraviolet curable resin composition, a light emitting device provided with the optical component, and a method for manufacturing a light emitting device using the ultraviolet curable resin composition.

Light emitting devices such as organic EL light emitting devices are applied to lighting, displays, and the like, and are expected to be widely used in the future.

The light emitting device is configured by, for example, arranging a light emitting element on a support substrate and arranging a transparent substrate so as to face the support substrate. In this case, the light emitted by the light emitting element passes through the transparent substrate and is emitted to the outside.

When a light emitting element such as an organic EL element is deteriorated by moisture, a portion called a dark spot that does not emit light may occur. Therefore, by covering the light emitting element with a transparent encapsulant and a passivation layer made of a nitrogen compound, the invasion of water into the light emitting element from the outside is suppressed (see Patent Document 1).

Japanese Unexamined Patent Publication No. 2014-186850

The inventor tried to reduce the thickness of the encapsulant when producing the encapsulant on the passivation layer with the thinning of the light emitting device. As a result, the thinner the encapsulant, the surface of the encapsulant. We have found the problem of poor flatness and smoothness. If the flatness and smoothness of the surface of the encapsulant deteriorates, the light emitting performance of the light emitting device deteriorates.

The subject of the present invention is an ultraviolet curable resin composition in which the cured film tends to be flat and smooth when cured on an inorganic material to produce a cured film, an optical component produced from the ultraviolet curable resin composition, and ultraviolet rays. It is an object of the present invention to provide a method for manufacturing an optical component using a curable resin composition, a light emitting device including the optical component, and a method for manufacturing a light emitting device using an ultraviolet curable resin composition.

The ultraviolet curable resin composition according to one aspect of the present invention contains a photopolymerizable compound (A) and a photopolymerization initiator (B). The photopolymerizable compound (A) contains the water-soluble compound (C), and the percentage of the water-soluble compound (C) to the ultraviolet curable resin composition is 10% by mass or more. The viscosity of the ultraviolet curable resin composition at 25 ° C. is 30 mPa · s or less.

The optical component according to one aspect of the present invention includes a cured product of the ultraviolet curable resin composition.

The method for manufacturing an optical component according to one aspect of the present invention includes molding the ultraviolet curable resin composition by an ultraviolet method and then irradiating the ultraviolet curable resin composition with ultraviolet rays to cure the composition.

The light emitting device according to one aspect of the present invention includes a light source and an optical component that transmits light emitted by the light source. The optical component includes a cured product of the ultraviolet curable resin composition.

The method for manufacturing a light emitting device according to one aspect of the present invention is a method for manufacturing a light emitting device including a light source and an optical component that transmits light emitted by the light source. The method includes manufacturing the optical component by a method of manufacturing the optical component.

According to one aspect of the present invention, an ultraviolet curable resin composition that tends to be flat and smooth when formed into a film on an inorganic material, an optical component made from an ultraviolet curable resin composition, and an ultraviolet curable resin. A method for manufacturing an optical component using a composition, a light emitting device including the optical component, and a method for manufacturing a light emitting device using an ultraviolet curable resin composition can be obtained.

It is a schematic cross-sectional view which shows an example of the light emitting device in one Embodiment of this invention.

Hereinafter, an embodiment of the present invention will be described.

The ultraviolet curable resin composition (hereinafter, also referred to as composition (X)) according to the present embodiment contains a photopolymerizable compound (A) and a photopolymerization initiator (B). The photopolymerizable compound (A) contains a water-soluble compound (C). The percentage of the water-soluble compound (C) to the composition (X) is 10% by mass or more. The viscosity of the composition (X) at 25 ° C. is 30 mPa · s or less.

The water-soluble compound (C) is a compound having photopolymerizability and water solubility. A water-soluble compound is a mixed solution prepared by mixing with pure water of the same volume at a temperature of 20 ° C. at 1 atm, gently stirring the mixed solution, and then allowing the mixture to flow. A compound that maintains a uniform appearance of the mixed solution even after it has subsided.

According to this embodiment, the water-soluble compound (C) can enhance the affinity between the composition (X) and an inorganic material such as silicon nitride, and the viscosity of the composition (X) is 30 mPa · s or less. Therefore, the fluidity of the composition (X) can be increased. Therefore, when the composition (X) is applied onto an inorganic material such as silicon nitride to form a coating film, the surface of the coating film and the cured film obtained by curing the coating film is flat and smooth. Prone. Therefore, when a cured film is produced from the composition (X) on the inorganic material, the cured film becomes flat and smooth even when the surface of the inorganic material has irregularities or the thickness of the cured film is small. Cheap.

The percentage of the water-soluble compound (C) to the composition (X) is more preferably 10% by mass or more, further preferably 15% by mass or more. The percentage of the water-soluble compound (C) to the composition (X) is preferably 50% by mass or less. In this case, outgas due to volatilization of the water-soluble compound (C) from the composition (X) and the cured product is suppressed. The percentage of the water-soluble compound (C) is more preferably 40% by mass or less, and further preferably 30% by mass or less.

An optical component can be manufactured from the composition (X), and a light emitting device including the optical component can also be manufactured. The use of the composition (X) is not limited to the production of optical components, and can be applied to various uses utilizing the characteristics of the composition (X).

The composition (X) is preferably molded by an inkjet method. In this case, it is easy to produce a cured product of the composition (X) with high positional accuracy. Further, when the composition (X) is molded by the inkjet method, foreign matter is less likely to be mixed into the composition (X) and its cured product as compared with the case of molding by a printing method involving contact such as a screen printing method. Therefore, the yield in manufacturing the optical component is unlikely to deteriorate. In the present embodiment, as described above, when the viscosity of the composition (X) at 25 ° C. is 30 mPa · s or less, the composition (X) can be easily molded by the inkjet method. If the viscosity is 25 mPa · s or less, it is more preferable, if it is 20 mPa · s or less, it is further preferable, and if it is 15 mPa · s or less, it is particularly preferable. It is preferable that the viscosity is 1 mPa · s or more, and it is also preferable that the viscosity is 5 mPa · s or more.

Such a low viscosity of composition (X) can be achieved by the composition of composition (X) described in detail below. The method and conditions for measuring the viscosity will be described in detail in the column of Examples described later.

The proportion of outgas produced when the cured product of the composition (X) is heated at 100 ° C. for 30 minutes is preferably 200 ppm or less. In this case, outgas is less likely to be generated from the cured product. Therefore, for example, it is possible to prevent the formation of voids due to outgas in a light emitting device including an optical component containing a cured product. Therefore, it is difficult for water and oxygen to reach the light emitting element through the void, and the light emitting element can be less likely to be deteriorated by water and oxygen. It is more preferable that the outgas ratio is 100 ppm or less, and further preferably 50 ppm or less. The method and conditions for measuring the outgas ratio will be described in detail in the section of Examples described later.

The composition (X) preferably contains no solvent or has a solvent content of 1% by mass or less. In this case, outgas derived from the solvent is unlikely to be generated from the composition (X) and the cured product of the composition (X). Further, it is possible to eliminate the need for a drying step for removing the solvent from the composition (X) and the cured product at the time of manufacturing the optical component and the light emitting device. There may be a drying step for removing the solvent from at least one of the composition (X) and the cured product, but in this case, at least one of reduction of the heating temperature and shortening of the heating time in the drying step is possible. Can be done. Therefore, outgas can be less likely to be generated from the optical component without lowering the manufacturing efficiency of the optical component and the light emitting device. Further, when the composition (X) is molded by an inkjet method in particular, the thickness of the composition (X) after molding is less likely to decrease due to the volatilization of the solvent, and therefore the thickness of the optical component is less likely to decrease. Therefore, it is possible to secure the thickness of the optical component as large as possible while molding by the inkjet method. The content of the solvent is more preferably 0.5% by mass or less, further preferably 0.3% by mass or less, and particularly preferably 0.1% by mass or less. It is particularly preferable that the composition (X) does not contain a solvent or contains only a solvent that is inevitably mixed.

The glass transition temperature of the cured product of the composition (X) is preferably 80 ° C. or higher. That is, it is preferable that the composition (X) has a property of becoming a cured product having a glass transition temperature of 80 ° C. or higher when cured. In this case, the cured product can have good heat resistance. Therefore, for example, when the cured product is subjected to a treatment accompanied by a temperature rise, the cured product is less likely to deteriorate. Therefore, for example, when a layer of an inorganic material (for example, a passivation layer 6) overlapping an optical component is manufactured by a vapor deposition method such as a plasma CVD method, the optical component is less likely to deteriorate even if the optical component is heated. Further, by increasing the heat resistance, the optical component can be adapted to the in-vehicle application where the demand for heat resistance is strict. The glass transition temperature of the cured product is more preferably 100 ° C. or higher, and even more preferably 120 ° C. or higher. The glass transition temperature of this cured product can be achieved by the composition of the composition (X) described in detail below.

The volatility of the composition (X) when 20 mg is heated using a thermogravimetric analyzer at 100 ° C. for 30 minutes is preferably 40% or less. The volatility of the composition (X) is the weight loss of the composition (X) after the treatment with respect to the weight of the composition (X) before the treatment (the weight of the composition (X) before the treatment and the weight after the treatment). It is defined as a percentage of the difference from the weight). In this case, the low volatility of the composition (X) can enhance the storage stability of the composition (X). In addition, outgas is less likely to be generated from the cured product of the composition (X) and the optical components. Therefore, voids due to outgas are less likely to occur in the light emitting device. The volatility of the composition (X) is determined by heating 20 mg of the composition (X) using a thermogravimetric analyzer under the condition of 100 ° C. for 30 minutes, and the weight loss after the treatment with respect to the weight before the treatment. Can be obtained by calculating. The volatility when 20 mg of the composition (X) is heated using a thermogravimetric analyzer at 100 ° C. for 30 minutes is more preferably 30% or less, and further preferably 20% or less. preferable. The lower limit of the volatility of the composition (X) is not particularly limited, but may be, for example, 0.1% or more.

The components contained in the composition (X) will be described in more detail.

The photopolymerizable compound (A) is a compound capable of causing a polymerization reaction by being irradiated with ultraviolet rays. The photopolymerizable compound (A) contains at least one component selected from the group consisting of, for example, monomers, oligomers and prepolymers.

The photopolymerizable compound (A) contains, for example, at least one of a radically polymerizable compound (A1) and a cationically polymerizable compound (A2). When the photopolymerizable compound (A) contains a radically polymerizable compound (A1), the photopolymerization initiator (B) preferably contains a photoradical polymerization initiator (B1). When the photopolymerizable compound (A) contains the cationically polymerizable compound (A2), the photopolymerization initiator (B) preferably contains the photocationic polymerization initiator (B2) (cationic curing catalyst).

When the photopolymerizable compound (A) contains the radically polymerizable compound (A1), the radically polymerizable compound (A1) preferably contains the acrylic compound (Y). The acrylic compound (Y) has one or more (meth) acryloyl groups in one molecule.

The acrylic compound (Y) preferably contains a polyfunctional acrylic compound (Y1) having two or more radically polymerizable functional groups containing a (meth) acryloyl group in one molecule. In this case, the polyfunctional acrylic compound (Y1) can increase the glass transition temperature of the cured product, and thus can increase the heat resistance of the cured product. The percentage of the polyfunctional acrylic compound (Y1) is preferably 50% by mass or more and 100% by mass or less with respect to the entire acrylic compound (Y). The acrylic compound (Y) may contain only the polyfunctional acrylic compound (Y1).

The polyfunctional acrylic compound (Y1) may contain a compound (Y11) having a structure represented by the following formula (200).

CH ₂ = CR ¹ -COO- (R ³ -O) n-CO-CR ² = CH ₂ ... (200)
In formula (200), each of R ¹ and R ² is a hydrogen or methyl group, n is an integer of 1 or more, R ³ is an alkylene group having 1 or more carbon atoms, and when n is 2 or more, it is in one molecule. The plurality of ^R3s may be the same as or different from each other. The percentage of the compound (Y11) to the acrylic compound (Y) is preferably 50% by mass or more. In this case, it is difficult to increase the affinity of the cured product for water. The percentage of the compound (Y11) to the acrylic compound (Y) is, for example, 100% by mass or less, or 95% by mass or less, preferably 80% by mass or less. The compound (Y11) is, for example, at least one compound selected from the group consisting of an alkylene glycol di (meth) acrylate, a polyalkylene glycol di (meth) acrylate, and an alkylene oxide-modified alkylene glycol di (meth) acrylate. contains.

It is particularly preferable that the polyfunctional acrylic compound (Y1) contains a polyalkylene glycol di (meth) acrylate. Since the polyalkylene glycol di (meth) acrylate has a low viscosity and is hard to volatilize, it can contribute to lowering the viscosity of the composition (X), and the storage stability of the composition (X) is improved and the cured product is used. It can contribute to the reduction of outgas. The percentage of the polyalkylene glycol di (meth) acrylate to the acrylic compound (Y) is preferably 40% by mass or more and 80% by mass or less.

The polyfunctional acrylic compound (Y1) may contain a compound having three or more radically polymerizable functional groups containing a (meth) acryloyl group in one molecule. In this case, the polyfunctional acrylic compound (Y1) can contain at least one selected from the group consisting of, for example, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate and pentaerythritol tetra (meth) acrylate. In this case, the glass transition temperature of the cured product can be particularly increased, and therefore the heat resistance of the cured product can be particularly increased. The polyfunctional acrylic compound (Y1) preferably contains pentaerythritol tetra (meth) acrylate. The percentage of the pentaerythritol tetra (meth) acrylate to the acrylic compound (Y) is preferably 0.5% by mass or more and 10% by mass or less.

The acrylic compound (Y) also preferably contains a monofunctional acrylic compound (Y2) in which the radically polymerizable functional group in one molecule is only one (meth) acryloyl group. The monofunctional acrylic compound (Y2) can suppress shrinkage of the composition (X) during curing. The amount of the monofunctional acrylic compound (Y2) with respect to the total amount of the acrylic compound (Y) is preferably more than 0% by mass and 50% by mass or less.

The monofunctional acrylic compound (Y2) is, for example, tetrahydrofurfuryl acrylate, isobornyl acrylate, 2-hydroxyethyl acrylate, 4-hydroxybutyl acrylate, isobutyl acrylate, t-butyl acrylate, isooctyl acrylate, 2-methoxyethyl acrylate. , Methoxytriethylene glycol acrylate, 2-ethoxyethyl acrylate, 3-methoxybutyl acrylate, ethoxyethyl acrylate, butoxyethyl acrylate, ethoxydiethylene glycol acrylate, methoxydixyl ethyl acrylate, ethyl diglycol acrylate, cyclic trimethyl propaneformal monoacrylate, Iimide acrylate, isoamyl acrylate, ethoxylated succinic acid acrylate, trifluoroethyl acrylate, ω-carboxypolycaprolactone monoacrylate, cyclohexyl acrylate, 2- (2-ethoxyethoxy) ethyl acrylate, stearyl acrylate, diethylene glycol monobutyl ether acrylate, lauryl acrylate, Isodecyl acrylate, 3,3,5-trimethylcyclohexanol acrylate, isooctyl acrylate, octyl / decyl acrylate, tridecyl acrylate, caprolactone acrylate, ethoxylated (4) nonylphenol acrylate, methoxypolyethylene glycol (350) monoacrylate, methoxypolyethylene Glycol (550) monoacrylate, phenoxyethyl acrylate, cyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, benzyl acrylate, methylphenoxyethyl acrylate, 4-t-butylcyclohexyl acrylate, Caprolactone-modified tetrahydrofurfuryl acrylate, tribromophenyl acrylate, ethoxylated tribromophenyl acrylate, 2-phenoxyethyl acrylate, ethylene oxide adduct of 2-phenoxyethyl acrylate, propylene oxide adduct of 2-phenoxyethyl acrylate, acryloylmorpholine, Morpholine-4-yl acrylate, dicyclopentanyl acrylate, phenoxydiethylene glycol acrylate, 2-hydroxy-3-phenoxypropyl acrylate , 1,4-Cyclohexanedimethanol monoacrylate, 3-methacryloyloxymethylcyclohexene oxide and 3-acryloyloxymethylcyclohexene oxide, which contain at least one compound selected from the group.

The acrylic compound (Y) may contain a compound represented by the following formula (100). In this case, the reactivity of the composition (X) can be enhanced, and the adhesion between the cured product and the inorganic material can be improved.

In formula (100), ^R0 is an H or a methyl group. X is a single bond or divalent hydrocarbon group. Each of R ¹ to R ¹¹ is H, an alkyl group or -R ¹² -OH, R ¹² is an alkylene group and at least one of R ¹ to R ¹¹ is an alkyl group or -R ¹² -OH. R ¹ to R ¹¹ are not chemically bonded to each other.

The radically polymerizable compound (A1) may contain a radically polymerizable compound (Z) other than the acrylic compound (Y). The amount of the radically polymerizable compound (Z) with respect to the total amount of the acrylic compound (Y) and the polymerizable compound (Z) is, for example, 10% by mass or less.

When the photopolymerizable compound (A) contains the radically polymerizable compound (A1), the radically polymerizable compound (A1) is a radically polymerizable water-soluble compound (C1) which is at least a part of the water-soluble compound (C). ) May be contained. The water-soluble compound (C1) is, for example, HO-250 (N), 130MA, EG, HOA (N) of the light ester series manufactured by Kyoeisha Chemical Corporation, 130A, 3EG-A of the light acrylate series, and Mitsubishi. Includes at least one selected from the group consisting of methacrylic acid and the like manufactured by Chemical Corporation.

The photoradical polymerization initiator (B1) is not particularly limited as long as it is a compound that produces radical species when irradiated with ultraviolet rays. The photoradical polymerization initiator (B1) is, for example, aromatic ketones, acylphosphine oxide compounds, aromatic onium salt compounds, organic peroxides, thio compounds (thioxanthone compounds, thiophenyl group-containing compounds, etc.), hexaarylbiimidazole. It contains at least one compound selected from the group consisting of a compound, an oxime ester compound, a borate compound, an azinium compound, a metallocene compound, an active ester compound, a compound having a carbon halogen bond, and an alkylamine compound.

The ratio of the photoradical polymerization initiator (B1) to the radically polymerizable compound (A1) is preferably 6% by mass or more. This percentage is more preferably 7% by mass or more, and even more preferably 8% by mass or more. The percentage is, for example, 30% by mass or less, preferably 20% by mass or less, and even more preferably 18% by mass or less.

The photoradical polymerization initiator (B1) may contain a sensitizer as a part of the photoradical polymerization initiator (B1). The sensitizer is, for example, 9,10-dibutoxyanthracene, 9-hydroxymethylanthracene, thioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2-chlorothioxanthone, 2,4-diethylthioxanthone, anthracinone, 1,2-. Dihydroxyanthracene, 2-ethylanthracene, 1,4-diethoxynaphthalene, p-dimethylaminoacetophenone, p-diethylaminoacetophenone, p-dimethylaminobenzophenone, p-diethylaminobenzophenone, 4,4'-bis (dimethylamino) benzophenone, It can contain at least one compound selected from the group consisting of 4,4'-bis (diethylamino) benzophenone, p-dimethylaminobenzaldehyde, and p-diethylaminobenzaldehyde. The components that the sensitizer can contain are not limited to the above. The content of the sensitizer in the composition (X) is, for example, 0.1 part by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the solid content of the composition (X).

The composition (X) may contain a polymerization accelerator in addition to the photoradical polymerization initiator (B1). Examples of the polymerization accelerator include ethyl p-dimethylaminobenzoate, -2-ethylhexyl p-dimethylaminobenzoate, methyl p-dimethylaminobenzoate, -2-dimethylaminoethyl benzoate, and butoxy p-dimethylaminobenzoate. Contains amine compounds such as ethyl. The components that can be contained in the polymerization accelerator are not limited to the above.

When the photopolymerizable compound (A) contains the cationically polymerizable compound (A2), the cationically polymerizable compound (A2) may be, for example, a polyfunctional cationically polymerizable compound (W1) and a monofunctional cationically polymerizable compound (W2). Contains at least one of them.

The polyfunctional cationically polymerizable compound (W1) is either one or both of a polyfunctional cationically polymerizable compound (W11) having no siloxane skeleton and a polyfunctional cationically polymerizable compound (W12) having a siloxane skeleton. Can be contained.

The polyfunctional cationically polymerizable compound (W11) does not have a siloxane skeleton and has two or more cationically polymerizable functional groups per molecule. The number of cationically polymerizable functional groups per molecule of the polyfunctional cationically polymerizable compound (W11) is preferably 2 to 4, more preferably 2 to 3.

The cationically polymerizable functional group is at least one group selected from the group consisting of, for example, a cyclic ether group and a vinyl ether group. The cyclic ether group is, for example, at least one of an epoxy group and an oxetane group.

The polyfunctional cationically polymerizable compound (W11) is composed of, for example, a polyfunctional alicyclic epoxy compound, a polyfunctional heterocyclic epoxy compound, a polyfunctional oxetane compound, an alkylene glycol diglycidyl ether, and an alkylene glycol monovinyl monoglycidyl ether. It contains at least one compound among the selected compounds.

The polyfunctional alicyclic epoxy compound contains, for example, one or both of the compound represented by the following formula (1) and the compound represented by the following formula (20).

In formula (1), each of R ¹ to R ¹⁸ is independently a hydrogen atom, a halogen atom, or a hydrocarbon group. The number of carbon atoms of the hydrocarbon group is preferably in the range of 1 to 20. The hydrocarbon group is an alkyl group having 1 to 20 carbon atoms such as a methyl group, an ethyl group and a propyl group; an alkenyl group having 2 to 20 carbon atoms such as a vinyl group and an allyl group; or an alkenyl group having 2 to 20 carbon atoms such as an ethylidene group and a propylidene group. There are 20 alkylidene groups. The hydrocarbon group may contain an oxygen atom or a halogen atom. Each of R ¹ to R ¹⁸ is preferably a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms independently, more preferably a hydrogen atom or a methyl group, and most preferably a hydrogen atom.

In formula (1), X is a single bond or divalent organic group, and the organic group is, for example, —CO—O—CH ₂ −.

Examples of the compound represented by the formula (1) include the compound represented by the following formula (1a) and the compound represented by the following formula (1b).

In formula (20), each of R ¹ to R ¹² is independently a hydrogen atom, a halogen atom, or a hydrocarbon group having 1 to 20 carbon atoms. The halogen atom is, for example, a fluorine atom, a chlorine atom, a bromine atom or an iodine atom. The hydrocarbon group having 1 to 20 carbon atoms is an alkyl group having 1 to 20 carbon atoms such as a methyl group, an ethyl group and a propyl group; an alkenyl group having 2 to 20 carbon atoms such as a vinyl group and an allyl group; or an ethylidene group and propyridene. It is an alkylidene group having 2 to 20 carbon atoms such as a group. The hydrocarbon group having 1 to 20 carbon atoms may contain an oxygen atom or a halogen atom.

Each of R ¹ to R ¹² is preferably a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms independently, more preferably a hydrogen atom or a methyl group, and most preferably a hydrogen atom.

Examples of the compound represented by the formula (20) include a tetrahydroinden epoxide represented by the following formula (20a).

The polyfunctional heterocyclic epoxy compound contains, for example, a trifunctional epoxy compound as shown in the following formula (2).

The polyfunctional oxetane compound contains, for example, a bifunctional oxetane compound as represented by the following formula (3).

The alkylene glycol diglycidyl ether contains, for example, at least one compound selected from the group consisting of the compounds represented by the following formulas (4) to (7).

The alkylene glycol monovinyl monoglycidyl ether contains, for example, a compound represented by the following formula (8).

More specifically, the polyfunctional cationically polymerizable compound (W11) includes, for example, celoxide 2021P and celoxide 8010 manufactured by Daicel, TEPIC-VL manufactured by Nissan Chemical Industries, OXT-221 manufactured by Toagosei, and 1, It can contain at least one component selected from the group consisting of 3-PD-DEP, 1,4-BG-DEP, 1,6-HD-DEP, NPG-DEP and butylene glycol monovinyl monoglycidyl ether.

The polyfunctional cationically polymerizable compound (W11) also preferably contains a polyfunctional alicyclic epoxy compound. In this case, the composition (X) can have a particularly high cationic polymerization reactivity.

The polyfunctional alicyclic epoxy compound preferably contains either one or both of the compound represented by the formula (1) and the compound represented by the formula (20). In this case, the composition (X) can have a higher cationic polymerization reactivity.

When the polyfunctional alicyclic epoxy compound contains the compound represented by the formula (1), the compound represented by the formula (1) preferably contains the compound represented by the formula (1a). In this case, the composition (X) can have a higher cationic polymerization reactivity and a particularly low viscosity.

Further, since the compound represented by the formula (20) has a low viscosity, the composition (X) can have good ultraviolet curability and particularly when the compound represented by the formula (20) is contained. It can have a low viscosity. Further, the compound represented by the formula (20) has a property of being hard to volatilize in spite of having a low viscosity. Therefore, even if the composition (X) contains the compound represented by the formula (20), the composition (X) is unlikely to change in composition due to the volatilization of the compound represented by the formula (20). Therefore, the composition (X) can be reduced in viscosity by containing the compound represented by the formula (20) without impairing the storage stability.

The compound represented by the formula (20) can be synthesized, for example, by oxidizing a cyclic olefin compound having a tetrahydroindene skeleton with an oxidizing agent.

The compound represented by the formula (20) may contain four stereoisomers based on the configuration of the two epoxy rings. The compound represented by the formula (20) may contain any of the four stereoisomers. That is, the compound represented by the formula (20) can contain at least one component selected from the group consisting of four stereoisomers. The percentage of the total amount of the exo-end form and the end-end form among the four stereoisomers in the compound represented by the formula (20) is 10% by mass or less with respect to the entire epoxy compound (A1). Is preferable, and more preferably 5% by mass or less. In this case, the heat resistance of the cured product can be improved. The percentage of the specific stereoisomer in the compound represented by the formula (20) can be determined based on the peak area ratio appearing in the chromatogram obtained by gas chromatography.

In order to reduce the amount of exo-end compound and end-end compound in the compound represented by the formula (20), a method for precision distillation of the compound represented by the formula (20), column chromatography using silica gel or the like as a filler is used. Any method can be applied, such as the method of applying the technique.

When the composition (X) contains the polyfunctional cationically polymerizable compound (W11), the percentage of the polyfunctional cationically polymerizable compound (W11) to the total amount of the resin component is preferably 5% by mass or more and 95% by mass or less. .. The resin component refers to a cationically polymerizable compound in the composition (X), and includes a polyfunctional cationically polymerizable compound (W1) and a monofunctional cationically polymerizable compound (W2). When the percentage of the polyfunctional cationically polymerizable compound (W11) is 5% by mass or more, the composition (X) can have particularly excellent reactivity during the photocationic polymerization reaction, whereby the cured product has high strength. Can have (hardness). Further, when the percentage of the polyfunctional cationically polymerizable compound (W11) is 95% by mass or less, when the composition (X) contains the hygroscopic agent (D), the hygroscopic agent (D) is contained in the composition (X). ) Can be easily dispersed evenly. The percentage of the polyfunctional cationically polymerizable compound (W11) is more preferably 12% by mass or more, further preferably 15% by mass or more, further preferably 20% by mass or more, and 25% by mass or more. Is particularly preferable. The percentage of the polyfunctional cationically polymerizable compound (W11) is more preferably 85% by mass or less, and further preferably 60% by mass or less. For example, the percentage of the polyfunctional cationically polymerizable compound (W11) is preferably in the range of 20 to 60% by mass.

When the polyfunctional cationically polymerizable compound (W11) contains a polyfunctional alicyclic epoxy compound, the polyfunctional alicyclic epoxy compound may be a part of the polyfunctional cationically polymerizable compound (W11), and all of them may be. May be. The percentage of the polyfunctional alicyclic epoxy compound to the polyfunctional cationically polymerizable compound (W11) is preferably 15% by mass or more and 100% by mass or less. When the percentage is 15% by mass or more, the polyfunctional alicyclic epoxy compound can particularly contribute to the improvement of the ultraviolet curability of the composition (X).

The polyfunctional cationically polymerizable compound (W12) has a siloxane skeleton and two or more cationically polymerizable functional groups per molecule. The number of cationically polymerizable functional groups per molecule of the polyfunctional cationically polymerizable compound (W12) is preferably 2 to 6, and more preferably 2 to 4. The polyfunctional cationically polymerizable compound (W12) can contribute to the improvement of the cationic polymerization reactivity of the composition (X) and the heat-resistant discoloration of the cured product and the optical component. The polyfunctional cationically polymerizable compound (W12) can also contribute to lowering the elastic modulus of the cured product and the optical component. When the composition (X) contains a hygroscopic agent, the polyfunctional cationically polymerizable compound (W12) can also contribute to the improvement of the dispersibility of the hygroscopic agent in the composition (X) and the cured product.

The polyfunctional cationically polymerizable compound (W12) is preferably liquid at 25 ° C. In particular, the viscosity of the polyfunctional cationically polymerizable compound (W12) at 25 ° C. is preferably in the range of 10 to 300 mPa · s. In this case, the increase in viscosity of the composition (X) can be suppressed.

The cationically polymerizable functional group contained in the polyfunctional cationically polymerizable compound (W12) is at least one group selected from the group consisting of, for example, an epoxy group, an oxetane group and a vinyl ether group.

The siloxane skeleton of the polyfunctional cationically polymerizable compound (W12) may be linear, branched or cyclic. The number of Si atoms contained in the siloxane skeleton is preferably in the range of 2 to 14. In this case, the composition (X) can have a particularly low viscosity. The number of Si atoms is more preferably in the range of 2 to 10, further preferably in the range of 2 to 7, and particularly preferably in the range of 3 to 6.

The polyfunctional cationically polymerizable compound (W12) contains, for example, at least one of the compound represented by the formula (10) and the compound represented by the formula (11).

R in each of the formula (10) and the formula (11) is a single bond or a divalent organic group, and is preferably an alkylene group. Y is a siloxane skeleton, which may be linear, branched or cyclic, and the number of Si atoms thereof is preferably in the range of 2 to 14, and preferably in the range of 2 to 10. Is more preferable, more preferably in the range of 2 to 7, and particularly preferably in the range of 3 to 6. n is an integer of 2 or more, preferably in the range of 2-4.

More specifically, for example, the polyfunctional cationically polymerizable compound (W12) contains the compound represented by the following formula (10a).

R in the formula (10a) is a single bond or a divalent organic group, and is preferably an alkylene group having 1 to 4 carbon atoms. N in the equation (10a) is an integer of 0 or more. n is preferably in the range of 0 to 12, more preferably in the range of 0 to 8, more preferably in the range of 0 to 5, and particularly preferably in the range of 1 to 4. preferable.

The compound represented by the formula (10a) preferably contains the compound represented by the following formula (30). That is, the polyfunctional cationically polymerizable compound (W12) preferably contains the compound represented by the following formula (30).

More specifically, the polyfunctional cationically polymerizable compound (W12) is, for example, product numbers X-40-2669, X-40-2670, X-40-2715, X-40-2732, X manufactured by Shin-Etsu Chemical Co., Ltd. Containing at least one component selected from the group consisting of -22-169AS, X-22-169B, X-22-2046, X-22-343, X-22-163, and X-22-163B. Is preferable.

The polyfunctional cationically polymerizable compound (W12) preferably has an alicyclic epoxy structure, and it is particularly preferable that the polyfunctional cationically polymerizable compound (W12) contains the compound represented by the formula (10a). The compound represented by the formula (10a) can particularly contribute to the improvement of the cationic polymerization reactivity and the reduction of the viscosity of the composition (X), and particularly to the improvement of the heat-resistant discoloration property and the low elastic modulus of the cured product and the optical component. Can contribute. When the composition (X) contains the hygroscopic agent (D), it can particularly contribute to the improvement of the dispersibility of the hygroscopic agent (D) in the composition (X).

When the composition (X) contains the polyfunctional cationically polymerizable compound (W12), the percentage of the polyfunctional cationically polymerizable compound (W12) to the total amount of the resin component is preferably 5% by mass or more and 95% by mass or less. .. In this case, particularly when the composition (X) contains the hygroscopic agent (D), the dispersibility of the hygroscopic agent (D) in the composition (X) and the cured product is particularly improved, and the composition (X) Can have a particularly high photocationic polymerization reactivity.

The monofunctional cationically polymerizable compound (W2) has only one cationically polymerizable functional group per molecule. The cationically polymerizable functional group is at least one group selected from the group consisting of, for example, an epoxy group, an oxetane group and a vinyl ether group.

The viscosity of the monofunctional cationically polymerizable compound (W2) at 25 ° C. is preferably 8 mPa · s or less. In this case, even if the composition (X) does not contain a solvent, the monofunctional cationically polymerizable compound (W2) can reduce the viscosity of the composition (X). In particular, the viscosity of the monofunctional cationically polymerizable compound (W2) at 25 ° C. is preferably in the range of 0.1 to 8 mPa · s.

The monofunctional cationically polymerizable compound (W2) can contain, for example, at least one compound selected from the group consisting of the compounds represented by the following formulas (12) to (17) and limonene oxide.

The percentage of the monofunctional cationically polymerizable compound (W2) to the total amount of the resin component is preferably 5% by mass or more and 50% by mass or less. When the percentage of the monofunctional cationically polymerizable compound (W2) is 5% by mass or more, the viscosity of the composition (X) can be particularly reduced. Further, when the percentage of the monofunctional cationically polymerizable compound (W2) is 50% by mass or less, the composition (X) can have particularly excellent reactivity during the photocationic polymerization reaction, and thereby the cured product. Can have high strength (hardness). The percentage of the monofunctional cationically polymerizable compound (W2) is more preferably 10% by mass or more, still more preferably 15% by mass or more. The percentage of the monofunctional cationically polymerizable compound (W2) is more preferably 40% by mass or less, further preferably 35% by mass or less, and particularly preferably 30% by mass or less. When the percentage of the monofunctional cationically polymerizable compound (W2) is 35% by mass or less, the amount of volatilization of the components in the composition (X) can be effectively reduced while the composition (X) is stored. Therefore, even if the composition (X) is stored for a long period of time, the characteristics of the composition (X) are not easily impaired. Further, it is possible to particularly suppress the occurrence of tack on the cured product. For example, the percentage of the monofunctional cationically polymerizable compound (W2) is preferably in the range of 10 to 35% by mass.

Further, particularly when the composition (X) contains the polyfunctional cationically polymerizable compound (W11) and the polyfunctional cationically polymerizable compound (W12), the polyfunctional cationically polymerizable compound (W11) is used with respect to the total amount of the resin component. The percentage of the polyfunctional cationically polymerizable compound (W12) is 15% by mass or more and 30% by mass or less, and the percentage of the monofunctional cationically polymerizable compound (W2) is 15% by mass or more. It is preferably 40% by mass or less. In this case, good storage stability of the composition (X), low viscosity and good cationic polymerization reactivity can be achieved in a well-balanced manner, and further, excellent transparency, excellent hygroscopicity and high refractive index of the cured product are balanced. Can be achieved well.

If the cationically polymerizable compound (A2) contains the compound represented by the formula (3) and the compound represented by the formula (16), a photocured product is produced from the composition (X) by adjusting the ratio of both. It is possible to reduce the viscosity of the composition (X) and improve the storage stability while appropriately adjusting the ease of progress of the curing reaction in the case of the above.

The amount of the compound represented by the formula (16) is appropriately adjusted so that the composition (X) has the above-mentioned characteristics. For example, the amount of the compound represented by the formula (16) is preferably 10% by mass or more and 40% by mass or less with respect to the total amount of the resin component.

The cationically polymerizable compound (A2) preferably contains a compound (f1) represented by the following formula (30) (hereinafter, also referred to as an aromatic epoxy compound (f1)).

In formula (30), X is at least one selected from the group consisting of halogen, H, hydrocarbon group and alkylene glucol group, and when there are a plurality of X in one molecule, they are different even if they are the same. You may. The hydrocarbon group is, for example, an alkyl group or an aryl group. When X is a hydrocarbon group, the number of carbon atoms of X is, for example, in the range of 1 to 10. R is a single bond or divalent organic group. When R is a divalent organic group, the divalent organic group is, for example, an alkylene group, an oxyalkylene group, a carbonyloxyalkylene group (for example, -CO-O-CH _2- ), or -C (Ph) ₂ -O. -CH ₂ -group. Y is H or a monovalent organic group. When Y is a monovalent organic group, the monovalent organic group is, for example, an alkyl group or an aryl group.

When the cationically polymerizable compound (A2) contains the aromatic epoxy compound (f1), the aromatic epoxy compound (f1) has a low viscosity, so that the aromatic epoxy compound (f1) lowers the viscosity of the composition (X). Easy to make. Further, the aromatic epoxy compound (f1) is less likely to volatilize, so that even if the composition (X) is stored, the composition (X) is less likely to change in composition due to the volatilization of the aromatic epoxy compound (f1). .. Therefore, the aromatic epoxy compound (f1) tends to enhance the storage stability of the composition (X). Further, since the aromatic epoxy compound (f1) has high reactivity, unreacted components are less likely to remain in the cured product, and therefore outgas is less likely to be generated from the cured product. Further, the aromatic epoxy compound (f1) tends to increase the glass transition temperature of the cured product, and therefore tends to increase the heat resistance of the cured product.

Further, the aromatic epoxy compound (f1) is less likely to generate defective droplets called satellites when the composition (X) is ejected by an inkjet method.

It is preferable that R in the formula (30) is a single bond or an alkylene group. When n in the formula (30) is 2 or 3, it is preferable that at least one of the plurality of Rs in the formula (30) is a single bond or an alkylene group. In these cases, the reactivity of the aromatic epoxy compound (f1) tends to be high, and therefore the curability of the composition (X) when the composition (X) is irradiated with ultraviolet rays tends to be high.

The aromatic epoxy compound (f1) preferably contains, for example, at least one compound selected from the group consisting of the compounds represented by the following formulas (301) to (318).

In particular, the aromatic epoxy compound (f1) may contain at least one component selected from the group consisting of the compounds represented by the formulas (301) to (305), (312), (314) and (318), respectively. preferable. These compounds tend to have high reactivity because at least one epoxy group (oxylan) in the compound and a benze ring are bonded by a single bond or an alkylene group, so that the composition (X) is cured. Easy to enhance sex.

The percentage of the aromatic epoxy compound (f1) to the entire cationically polymerizable compound (A2) is preferably 5% by mass or more. In this case, the above-mentioned action by the aromatic epoxy compound (f1) is particularly easy to obtain. This percentage is also preferably 95% by mass or less. In this case, the storability of the composition (X) tends to be good. This percentage is more preferably 10% by mass or more and 90% by mass or less, and further preferably 20% by mass or more and 85% by mass or less.

The cationically polymerizable compound (A2) may contain a compound (f2) having an oxyalkylene skeleton. The oxyalkylene skeleton is a linear skeleton composed of one or more linear oxyalkylene units.

When the cationically polymerizable compound (A2) contains the compound (f2), the compound (f2) has a low viscosity, so that the compound (f2) tends to lower the viscosity of the composition (X). Further, the compound (f2) is less likely to volatilize, and therefore, even if the composition (X) is stored, the composition (X) is less likely to change in composition due to the volatilization of the aromatic epoxy compound (f1). Therefore, the compound (f2) tends to enhance the storage stability of the composition (X).

Further, the compound (f2) is less likely to generate defective droplets called satellites when the composition (X) is ejected by an inkjet method. Further, the compound (f2) can make satellites less likely to occur even if the speed of the droplets ejected by the inkjet method is increased. Therefore, depending on the conditions of the inkjet, for example, it is possible to set the ejection speed of the droplet by the inkjet method to 4 m / s or more without causing satellites. If the velocity of the droplet can be increased, the trajectory of the droplet is less likely to be affected by disturbance, so that the dimensional accuracy of the cured product produced from the composition (X) can be improved. Further, since the compound (f2) can enhance the storage stability of the composition (X) as described above, the composition (X) is less likely to generate satellites even if the composition (X) is stored for a long period of time. The characteristics are easily maintained.

The oxyalkylene skeleton preferably contains a structure of "-C-C-O-", that is, an oximethylene unit. In this case, satellites are less likely to be generated, and satellites are less likely to be generated even if the drive frequency at which the composition (X) is ejected by, for example, an inkjet method is changed. In addition, the compound (f2) is less likely to volatilize and tends to have a lower viscosity, and the affinity (wetting property) of the composition (X) with respect to the inorganic material tends to increase.

The number of oxyalkylene units in the oxyalkylene skeleton of compound (f2) is preferably 1 or more and 8 or less. In this case, since the compound (f2) tends to have a lower viscosity, satellites are less likely to occur, and the crosslink density of the cured product tends to increase, so that the glass transition temperature of the cured product tends to increase. The number of the oxyalkylene units is more preferably 1 or more and 6 or less, and further preferably 1 or more and 4 or less.

A substituent other than hydrogen may be bonded to the oxyalkylene unit in the oxyalkylene skeleton of the compound (f2). For example, the oxymethylene unit contained in the oxyalkylene skeleton may have a structure of "-CH (CH ₃ ) -CH ₂ -O-".

The percentage of the compound (f2) is preferably 10% by mass or more with respect to the cationically polymerizable compound (A2). In this case, the ink jet property becomes good and the wettability to the base material becomes good. It is also preferable that this percentage is 70% by mass or less. In this case, the glass transition temperature can be sufficiently increased. This percentage is more preferably 15% by mass or more and 60% by mass or less, and further preferably 20% by mass or more and 50% by mass or less.

The compound (f2) contains, for example, at least one compound among a compound (f21) having an oxyalkylene skeleton and an epoxy group and a compound (f22) having an oxyalkylene group and an oxetane group.

The compound (f21) is, for example, the compound represented by the above formula (1b), the compound represented by the formula (4), the compound represented by the formula (5), the compound represented by the formula (6), the compound represented by the formula (7), and the formula. It contains at least one compound selected from the group consisting of the compound represented by (8), the compound represented by the formula (13), the compound represented by the formula (14) and the like. The components that can be contained in the compound (f21) are not limited to the above.

The compound (f22) is at least one selected from the group consisting of, for example, the compound represented by the above formula (3), the compound represented by the formula (12), the compound represented by the formula (16), and the compound represented by the formula (17). Contains the compound of. The components that can be contained in the compound (f22) are not limited to the above.

The cationically polymerizable compound (A2) preferably contains a cyclic ether compound. The epoxy compound contains, for example, at least one of the compounds having a cyclic ether group among the compounds that can be contained in the above-mentioned cationically polymerizable compound (A2).

The cyclic ether compound contains, for example, at least one of an epoxy compound and an oxetane compound. The epoxy compound contains, for example, at least one of the compounds having an epoxy group among the compounds that can be contained in the above-mentioned cationically polymerizable compound (A2). The oxetane compound contains, for example, at least one of the compounds having an oxetane group among the compounds that can be contained in the above-mentioned cationically polymerizable compound (A2).

When the cyclic ether compound contains an epoxy compound, the curing reaction tends to proceed rapidly when the composition (X) is irradiated with ultraviolet rays, and the curability of the composition (X) tends to increase. The percentage of the epoxy compound to the whole of the cationically polymerizable compound (A2) is preferably 20% by mass or more. The percentage of this epoxy compound is preferably 60% by mass or less.

Further, when the cyclic ether compound contains an oxetane compound, it is possible to suppress the rapid progress of the reaction when the composition (X) is irradiated with ultraviolet rays, to prevent yellowing and cloudiness of the cured product, and to sufficiently carry out the reaction. It is possible to make it difficult to generate outgas from the cured product. The percentage of the oxetane compound with respect to the entire cationically polymerizable compound (A2) is preferably 40% by mass or more. Further, this percentage is preferably 80% by mass or less.

When the composition (X) contains a cyclic ether compound, the cyclic ether compound may contain a water-soluble compound (C2) having a cyclic ether group which is at least a part of the water-soluble compound (C). The cyclic ether compound originally tends to impair the affinity between the composition (X) and the inorganic material, and therefore tends to impair the flatness and smoothness of the coating film and the cured product formed on the inorganic material. However, when the cyclic ether compound contains the water-soluble compound (C2), the surface of the coating film and the cured product tends to be flat and smooth even if the composition (X) contains the cyclic ether compound. The water-soluble compound (C2) contains, for example, at least one of a water-soluble epoxy compound (C21) and a water-soluble oxetane compound (C22).

The water-soluble epoxy compound (C21) is, for example, EX-145, EX-171, EX-810, EX-920 manufactured by Nagase ChemteX Corporation, SR-PG, SR-EGM, SR- of Sakamoto Pharmaceutical Co., Ltd. At least one selected from the group consisting of 2EG, A-EP, DY-BP manufactured by Yokkaichi Chemical Co., Ltd., Epogosei BD (D), Epolite 40E, Epolite 100E, Epolite 200E, and Epolite 400E manufactured by Kyoeisha Chemical Co., Ltd. include.

The water-soluble oxetane compound (C22) is at least one selected from the group consisting of, for example, OXT-101 manufactured by Toagosei Corporation, EXO and HBOX manufactured by Ube Kosan Co., Ltd., and AL-OX manufactured by Yokkaichi Synthetic Co., Ltd. include.

When the composition (X) contains the cationically polymerizable compound (A2), it is preferable that the composition (X) further contains a sensitizer. In this case, the composition (X) can have a particularly high cationic polymerization reactivity. The sensitizer contains, for example, one or both of 9,10-dibutoxyanthracene and 9,10-diethoxyanthracene. The percentage of the sensitizer to the cationically polymerizable compound (A2) is preferably more than 0% by mass and preferably in the range of 1% by mass or less. In this case, the sensitizer does not easily impair the transparency of the cured product, so that the cured product can have good transparency.

When the composition (X) contains the cationically polymerizable compound (A2), the photopolymerization initiator (B) preferably contains the photocationic polymerization initiator (B2). The photocationic polymerization initiator (B2) is not particularly limited as long as it is a catalyst that generates protonic acid or Lewis acid by being irradiated with light. The photocationic polymerization initiator (B2) can contain at least one of an ionic photoacid generation type cation curing catalyst and a nonionic photoacid generation type cation curing catalyst.

The ionic photoacid generation type cationic curing catalyst can contain at least one of an onium salt and an organic metal complex. Examples of onium salts include aromatic diazonium salts, aromatic halonium salts, and aromatic sulfonium salts. Examples of organometallic complexes include iron-allene complexes, titanosen complexes, and arylsilanol-aluminum complexes. The ionic photoacid generation type cationic curing catalyst can contain at least one of these components.

The nonionic photoacid generation type cationic curing catalyst is at least one selected from the group consisting of, for example, nitrobenzyl ester, sulfonic acid derivative, phosphoric acid ester, phenol sulfonic acid ester, diazonaphthoquinone, and N-hydroxyimide phosphonate. Can contain the components of. The components that can be contained in the nonionic photoacid generation type cationic curing catalyst are not limited to the above.

More specific examples of compounds that can be contained in the photocationic polymerization initiator (B2) are DPI series (105, 106, 109, 201, etc.), BI-105, MPI series (103, 105, 106, etc.) manufactured by Midori Kagaku. 109, etc.), BBI series (101, 102, 103, 105, 106, 109, 110, 200, 210, 300, 301, etc.), TSP series (102, 103, 105, 106, 109, 200, 300, 1000, etc.) ), HDS-109, MDS series (103, 105, 109, 203, 205, 209, etc.), BDS-109, MNPS-109, DTS series (102, 103, 105, 200, etc.), NDS series (103, 105, etc.) , 155, 165, etc.), DAM series (101, 102, 103, 105, 201, etc.), SI series (105, 106, etc.), PI-106, NDI series (105, 106, 109, 1001, 1004, etc.), PAI series (01, 101, 106, 1001, 1002, 1003, 1004, etc.), MBZ-101, PYR-100, NB series (101, 201, etc.), NAI series (100, 1002, 1003, 1004, 101, 105, etc.) , 106, 109, etc.), TAZ series (100, 101, 102, 103, 104, 107, 10
8, 109, 110, 113, 114, 118, 122, 123, 203, 204, etc.), NBC-101, ANC-101, TPS-Acetate, DTS-Acetate, Di-Boc Bisphinol A, tert-Butyl lithocholic, tert. -Butyl deoxycholate, tert-Butyl alcohol, BX, BC-2, MPI-103, BDS-105, TPS-103, NAT-103, BMS-105, and TMS-105;
Union Carbide, USA Cyracure UVI-6970, Cyracure UVI-6974, Cyracure UVI-6990, and Cyracure UVI-950;
BASF's Irgacure 250, Irgacure 261 and Irgacure 264;
CG-24-61 manufactured by Ciba Geigy Co., Ltd .;
ADEKA CORPORATION ADEKA CORPORATION SP-150, ADEKA CORPORATION SP-151, ADEKA CORPORATION SP-170 and ADEKA CORPORATION SP-171;
DAICAT II manufactured by Daicel Corporation;
UVAC1590 and UVAC1591 manufactured by Daicel Cytec Co., Ltd .;
CI-2064, CI-2369, CI-2624, CI-2481, CI-2734, CI-2855, CI-2823, CI-2758, and CIT-1682; manufactured by Nippon Soda Corporation;
PI-2074, a tetrakis (pentafluorophenyl) borate toluyl cumyliodonium salt manufactured by Rhodia;
3M FFC509;
CD-1010, CD-1011 and CD-1012 manufactured by Sartomer, USA;
Includes CPI-100P, CPI-101A, CPI-110P, CPI-110A and CPI-210S from Sun Appro Co., Ltd .; and UVI-6992 and UVI-6976 from Dow Chemical. The photocationic polymerization initiator (B2) can contain at least one compound selected from the group consisting of these compounds.

The percentage of the photocationic polymerization initiator (B2) to the cationically polymerizable compound (A2) is preferably 1% by mass or more and 4% by mass or less. When the percentage is 1% by mass or more, the composition (X) can have a particularly good cationic polymerization reactivity. Further, when the percentage is 4% by mass or less, the composition (X) can have good storage stability, and the production cost is reduced by not containing an excess photocationic polymerization initiator (B2). Is possible.

The composition (X) may further contain a hygroscopic agent (D). When the composition (X) contains the hygroscopic agent (D), the cured product of the composition (X) can have hygroscopicity. Therefore, the sealing material 5 containing the cured product can further prevent moisture from entering the light emitting element 4 in the light emitting device 1. The average particle size of the hygroscopic agent (D) is preferably 200 nm or less. In this case, the cured product can have high transparency.

The hygroscopic agent (D) is preferably an inorganic particle having hygroscopicity, and contains at least one component selected from the group consisting of, for example, zeolite particles, silica gel particles, calcium chloride particles, and titanium oxide nanotube particles. Is preferable. It is particularly preferable that the hygroscopic agent (D) contains zeolite particles.

Zeolite particles having an average particle size of 200 nm or less can be produced, for example, by pulverizing a general industrial zeolite. In producing the zeolite particles, the zeolite may be crushed and then crystallized by hydrothermal synthesis or the like. In this case, the zeolite particles can have particularly high hygroscopicity. Examples of such a method for producing zeolite particles are disclosed in JP-A-2016-69266A, JP-A-2013-049602, and the like.

Zeolite particles preferably contain sodium ions. Therefore, the zeolite particles are preferably produced from at least one selected from the group consisting of A-type zeolite, X-type zeolite and Y-type zeolite. It is particularly preferable that the zeolite particles are produced from 4A-type zeolite among A-type zeolites. In these cases, the zeolite particles have a crystal structure suitable for adsorbing water.

The pH of the zeolite particles is preferably 7 or more and 10 or less. When the pH of the zeolite particles is 7 or more, the crystals of the zeolite particles are less likely to be destroyed, so that the cured product of the composition (X) containing the zeolite particles can have particularly high hygroscopicity. Further, when the pH of the zeolite particles is 10 or less, the zeolite particles are less likely to inhibit the curing when the composition (X) is cured. The pH of the zeolite particles is determined by heating a dispersion obtained by adding 0.05 g of zeolite particles to 99.95 g of ion-exchanged water at 90 ° C. for 24 hours, and then measuring the pH of the supernatant of the dispersion with a pH meter. It is a value obtained by measuring with. As the pH measuring device, for example, a compact pH meter <LAQUAtwin> B-711 manufactured by HORIBA, Ltd. can be used.

The average particle size of the hygroscopic agent (D) is preferably 10 nm or more and 200 nm or less. When the average particle size is 200 nm or less, the cured product can have particularly high transparency. Further, when the average particle size is 10 nm or more, good hygroscopicity of the hygroscopic agent (D) can be maintained. The average particle size is the median diameter calculated from the measurement result by the dynamic light scattering method, that is, the cumulative 50% diameter (D50). As the measuring device, Nanotrack Nanotrac Wave series manufactured by Microtrack Bell Co., Ltd. can be used.

The average particle size of the hygroscopic agent (D) is more preferably 150 nm or less, further preferably 100 nm or less, and particularly preferably 70 nm or less. Further, the average particle size of the hygroscopic agent (D) is preferably 20 nm or more, and more preferably 50 nm or more. In this case, the cured product can have particularly good transparency and hygroscopicity.

It is also preferable that the cumulative 90% diameter (D90) of the hygroscopic agent (D) is 100 nm or less. In this case, the cured product can have particularly high transparency.

When the composition (X) contains the hygroscopic agent (D), the percentage of the hygroscopic agent (D) with respect to the total amount of the composition (X) is preferably 1% by mass or more and 20% by mass or less. When the percentage of the hygroscopic agent (D) is 1% by mass or more, the cured product can have particularly high hygroscopicity. Further, if the percentage of the hygroscopic agent (D) is 20% by mass or less, the viscosity of the composition (X) can be particularly reduced, and the composition (X) has a sufficiently low viscosity that can be applied by an inkjet method. You can also. The percentage of the hygroscopic agent (D) is more preferably 3% by mass or more, and particularly preferably 5% by mass or more. The percentage of the hygroscopic agent (D) is more preferably 15% by mass or less, and particularly preferably 13% by mass or less.

The composition (X) may further contain an inorganic filler other than the hygroscopic agent (D). For example, the composition (X) may contain nano-sized high refractive index particles. Examples of high refractive index particles include zirconia particles. When the composition (X) contains high refractive index particles, the cured product can have a high refractive index while maintaining good transparency of the cured product. Therefore, when the cured product is applied to an optical component, it is possible to improve the efficiency of extracting light that is transmitted through the optical component and emitted to the outside. The average particle size of the high-refractive index particles is preferably in the range of 5 to 30 nm, and more preferably in the range of 10 to 20 nm.

The percentage of the high refractive index particles in the composition (X) is appropriately designed so that the cured product has the desired refractive index. In particular, the high refractive index particles are preferably contained in the composition (X) so that the refractive index of the cured product is in the range of 1.45 or more and less than 1.55. In this case, the light extraction efficiency of the light emitting device 1 is particularly improved.

When the composition (X) contains the hygroscopic agent (D), it is preferable that the composition (X) further contains the dispersant (E). In this case, the dispersant (E) can improve the dispersibility of the hygroscopic agent (D) in the composition (X). Therefore, in the composition (X), the increase in viscosity and the decrease in storage stability due to the hygroscopic agent (D) are unlikely to occur.

The dispersant (E) is a surfactant that can be adsorbed on the particles. The dispersant (E) has an adsorbent group (generally also referred to as an anchor) that can be adsorbed on the particles and a molecular skeleton (generally also referred to as a tail) that adheres to the particles when the adsorbent group is adsorbed on the particles. The dispersant (E) is, for example, an acrylic dispersant having an acrylic molecular chain at the tail, a urethane dispersant having a urethane molecular chain at the tail, and a polyester-based dispersion having a polyester molecular chain at the tail. It contains at least one ingredient selected from the group if it is an agent. The adsorbent group contains, for example, at least one of a basic polar functional group and an acidic polar functional group. The basic polar functional group includes, for example, at least one group selected from the group consisting of an amino group, an imino group, an amide group, an imide group, and a nitrogen-containing heterocyclic group. The acidic polar functional group includes, for example, at least one group selected from the group consisting of a carboxyl group and a phosphoric acid group. The dispersant (E) is at least one compound selected from the group consisting of, for example, Solsperth series manufactured by Nippon Louvre Resol Co., Ltd., DISPERBYK series manufactured by Big Chemie Japan Co., Ltd., and Ajinomoto Fine Techno Co., Ltd. Can be contained.

When the composition (X) contains the hygroscopic agent (D), the amount of the dispersant (E) with respect to 100 parts by mass of the hygroscopic agent (D) is preferably 5 parts by mass or more and 60 parts by mass or less. When the amount of the dispersant (E) is 5 parts by mass or more, the function of the dispersant (E) can be effectively exhibited, and when it is 60 parts by mass or less, the dispersant (E) is released in the cured product. It is possible to prevent the molecules of the above from inhibiting the adhesion between the cured product and the member made of the inorganic material. Further, the amount of the dispersant (E) is more preferably 15 parts by mass or more, more preferably 50 parts by mass or less, further preferably 40 parts by mass or less, and particularly preferably 30 parts by mass or less. preferable.

The structure of the light emitting device 1 will be described. The light emitting device 1 includes a light source and an optical component that transmits light emitted by the light source. For example, the light emitting device 1 includes a light emitting element 4, a sealing material 5 that covers the light emitting element 4, and a passivation layer 6. In this case, the light emitting element 4 is a light source, the sealing material 5 is an optical component, and the passivation layer 6 is an inorganic layer such as a silicon nitride film. The sealing material 5 and the passivation layer 6 overlap each other.

The light emitting element 4 includes, for example, a light emitting diode. The light emitting diode includes, for example, at least one of an organic EL element (organic light emitting diode) and a micro light emitting diode. When the light emitting element 4 includes an organic light emitting diode, the light emitting device 1 provided with the light emitting element 4 is, for example, an organic EL display. When the light emitting element 4 includes a micro light emitting diode, the light emitting device 1 provided with the light emitting element 4 is, for example, a micro LED display. In addition, EL is an abbreviation for electroluminescence.

An example of the structure of the light emitting device 1 will be described with reference to FIG. This light emitting device 1 is a top emission type. The light emitting device 1 includes a support substrate 2, a transparent substrate 3 facing the support substrate 2 at intervals, a light emitting element 4 on a surface of the support substrate 2 facing the transparent substrate 3, and a passion layer covering the light emitting element 4. 6 and a sealing material 5 are provided.

The support substrate 2 is made of, for example, a resin material, but is not limited thereto. The transparent substrate 3 is made of a translucent material. The transparent substrate 3 is, for example, a glass substrate or a transparent resin substrate. The light emitting element 4 includes, for example, a pair of electrodes 41 and 43 and an organic light emitting layer 42 between the electrodes 41 and 43. The organic light emitting layer 42 includes, for example, a hole injection layer 421, a hole transport layer 422, an organic light emitting layer 423, and an electron transport layer 424, and these layers are laminated in the above order.

The light emitting device 1 includes a plurality of light emitting elements 4, and the plurality of light emitting elements 4 form an array 9 (hereinafter referred to as an element array 9) on the support substrate 2. The element array 9 also includes a partition wall 7. The partition wall 7 is located on the support substrate 2 and partitions between two adjacent light emitting elements 4. The partition wall 7 is manufactured, for example, by molding a photosensitive resin material by a photolithography method. The element array 9 also includes a connection wiring 8 for electrically connecting the electrodes 43 of the adjacent light emitting elements 4 and the electron transport layers 424. The connection wiring 8 is provided on the partition wall 7.

The passivation layer 6 is preferably a silicon nitride film or a silicon oxide film, and particularly preferably a silicon nitride film. In the example shown in FIG. 1, the passivation layer 6 includes a first passivation layer 61 and a second passivation layer 62. The first passivation layer 61 covers the light emitting element 4 by covering the element array 9 in a state of being in direct contact with the element array 9. The second passivation layer 62 is arranged at a position opposite to the element array 9 with respect to the first passivation layer 61, and a space is provided between the second passivation layer 62 and the first passivation layer 61. ing. A sealing material 5 is filled between the first passivation layer 61 and the second passivation layer 62. That is, the first passivation layer 61 is interposed between the light emitting element 4 and the sealing material 5 that covers the light emitting element 4.

Further, a second encapsulant 52 is filled between the second passivation layer 62 and the transparent substrate 3. The second encapsulant 52 is made of, for example, a transparent resin material. The material of the second sealing material 52 is not particularly limited. The material of the second encapsulant 52 may be the same as or different from that of the encapsulant 5.

A method for producing the encapsulant 5 using the composition (X) and a method for producing the light emitting device 1 will be described.

In the present embodiment, it is preferable to form the encapsulant 5 by molding the composition (X) by an inkjet method and then irradiating the composition (X) with ultraviolet rays to cure the composition (X). In the present embodiment, the composition (X) can be applied and molded by an inkjet method. In the present embodiment, as described above, since the percentage of oxygen in the composition (X) is 75% by mass or less, defects are unlikely to occur when the composition (X) is molded by the inkjet method.

More specifically, for example, first, the support substrate 2 is prepared. A partition wall 7 is formed on one surface of the support substrate 2 by a photolithography method using, for example, a photosensitive resin material. Subsequently, a plurality of light emitting elements 4 are provided on one surface of the support substrate 2. The light emitting element 4 can be manufactured by an appropriate method such as a vapor deposition method or a coating method. In particular, it is preferable to manufacture the light emitting element 4 by a coating method such as an inkjet method. As a result, the element array 9 is manufactured on the support substrate 2. The top of the partition wall 7 protrudes from the surface of the light emitting element 4, and the dimension from the surface of the light emitting element 4 to the top of the partition wall 7 is, for example, 0.1 μm or more and 1.5 μm or less. Further, the distance between the adjacent partition walls 7 is, for example, 30 μm or more and 150 μm or less.

Next, the first passivation layer 61 is provided on the element array 9. The first passivation layer 61 can be produced by a vapor deposition method such as a plasma CVD method.

The first passivation layer 61 is formed so as to cover the plurality of light emitting elements 4 and the partition wall 7. Since the top of the partition wall 7 protrudes from the surface of the light emitting element 4 as described above, the surface of the first passivation layer 61 has irregularities along the shape of the partition wall 7.

Next, the composition (X) is molded on the first passivation layer 61 by, for example, an inkjet method to prepare a coating film. If the inkjet method is applied to both the formation of the light emitting element 4 and the coating of the composition (X), the manufacturing efficiency of the light emitting device 1 can be particularly improved.

As described above, in the present embodiment, since the composition (X) contains 10% by mass or more of the water-soluble compound (C) and the viscosity of the composition (X) is 30 mPa · s or less, the silicon nitride film is formed. Even if the coating film of the composition (X) is formed on the first passivation layer 61 and the surface of the first passivation layer 61 has irregularities, the surface of the coating film tends to be flat and smooth. ..

The coating film of the composition (X) is cured by irradiating it with ultraviolet rays. As a result, the encapsulant 5 which is a cured film of the composition (X) is produced. The surface of the encapsulant 5 tends to be flat and smooth.

Next, the second passivation layer 62 is provided on the sealing material 5. The second passivation layer 62 can be manufactured by a vapor deposition method such as a plasma CVD method.

Next, an ultraviolet curable resin material is provided on one surface of the support substrate 2 so as to cover the second passivation layer 62, and then the transparent substrate 3 is superposed on this resin material. The transparent substrate 3 is, for example, a glass substrate or a transparent resin substrate.

Next, ultraviolet rays are irradiated from the outside toward the transparent substrate 3. Ultraviolet rays pass through the transparent substrate 3 and reach the ultraviolet curable resin material. As a result, the ultraviolet curable resin material is cured, and the second encapsulant 52 is produced.

The thickness of the sealing material 5 is, for example, 50 μm or less. In this case, by making the sealing material 5 thinner, the light emitting device 1 can be made thinner, and the light emitting device 1 having flexibility can be obtained. Further, in the present embodiment, since the surface of the encapsulant 5 tends to be flat and smooth, the encapsulant 5 having a flat and smooth surface can be obtained even if the thickness of the encapsulant 5 is 15 μm or less. Cheap. The thickness of the encapsulant is more preferably 10 μm or less, and even more preferably 5 μm or less. Further, in order to effectively suppress the water content to the light emitting element 4 by the sealing material 5, the thickness of the sealing material 5 is preferably 1 μm or more, and more preferably 2 μm or more.

The thickness of the passivation layer 6 overlapping the encapsulant 5 is, for example, 0.1 μm or more and 2 μm or less. When the passivation layer 6 includes the first passivation layer 61 and the second passivation layer 62 as described above, the thickness of each of the first passivation layer 61 and the second passivation layer 62 is 0.1 μm or more and 2 μm or less. Is preferable.

The application of the composition (X) according to the present embodiment is not limited to the production of the sealing material 5 for the light emitting element 4. The composition (X) can be used to make various optical components that transmit light emitted by a light source. For example, the optical component may be a color resist. That is, for example, the composition (X) may contain a fluorescent substance, and a color resist in a color filter may be produced from the composition (X) on an inorganic material. This color filter can be provided in a display device such as an organic EL display or a micro LED display which is a light emitting device.

1. 1. Preparation of Composition The compositions of Examples and Comparative Examples were prepared by mixing the components shown in the table below.

The details of the components shown in the table are as follows. The viscosities of the following components are measured using a rheometer (manufactured by Anton Paar Japan Co., Ltd., model number DHR-2) under the conditions of a temperature of 25 ° C. and a shear rate of 1000 s ^-1 .
-Epoxy compound 1: Water-insoluble, compound name tetrahydroindendiepoxide, manufactured by ENEOS Co., Ltd., product name THI-DE, viscosity 20 mPa · s.
-Epoxy compound 2: Water-soluble, 1,4-butanediol diglycidyl ether, manufactured by Yokkaichi Chemical Co., Ltd., product name Epogoose BD (D), viscosity 8.4 mPa · s.
-Epoxy compound 3: Water-soluble, ethylene glycol diglycidyl ether, manufactured by Kyoeisha Chemical Co., Ltd., product name Epolite 400E, viscosity 85 mPa · s.
-Oxetane compound 1: water-insoluble, 3-ethyl-3-{[(3-ethyloxetane-3-yl) methoxy] methyl} oxetane (compound represented by formula (3)), manufactured by Toagosei Co., Ltd., product number OXT- 221 and viscosity 10 mPa · s.
-Oxetane compound 2: Water-soluble, 3-ethyl-3-hydroxymethyloxetane (oxetane alcohol), manufactured by Toagosei Co., Ltd., product number OXT-101, viscosity 19.5 mPa · s.
-Oxetane compound 3: Water-soluble, (3-ethyl-3- (4-hydroxybutyloxymethyl) oxetane, manufactured by Ube Kosan Co., Ltd., product number ETERNCOLL (registered trademark) HBOX, viscosity 29 mPa · s.
-Photopolymerization initiator: Triarylsulfonium salt-based photoacid generator, San-Apro Co., Ltd., product number CPI-210S.
-Sensitizer: manufactured by Kawasaki Kasei Kogyo Co., Ltd., product name Anthracure (registered trademark) UVS1331.
-Leveling agent: Phenyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd., product name KBM-103.

2. 2. Evaluation test The following evaluation test was carried out for Examples and Comparative Examples. The results are shown in the table.

(1) Flatness / smoothness (Urocomra)
A prebake film was prepared by applying a photosensitive polyimide resin (manufactured by Toray Industries, Inc., product name Photoneece DL-1000) on a glass substrate and then heating at 120 ° C. for 3 minutes using a hot plate. The thickness of the prebake film was measured with a spectrophotometer (U-4100) of Hitachi High Technology and found to be 2 μm. This prebake film was exposed through Photomax, developed by exposing it to a developing solution (2.38% by mass solution of tetramethylammonium hydroxide) for 60 seconds, and further heated at 250 ° C. for 60 minutes in a clean oven. As a result, partition walls (black matrix) having a height of 0.5 μm arranged in a grid pattern were produced on the glass substrate. The plan view dimension of the opening surrounded by the partition wall is 70 μm × 250 μm.

A silicon nitride film having a thickness of 500 nm was formed so as to cover the partition wall on the entire surface of the glass substrate on which the partition wall was formed.

Place the composition in the cartridge of an inkjet printer (manufactured by Fujifilm, Material Printer MP2831), confirm that the composition in the cartridge can be ejected from the nozzle of the inkjet printer, and then drop the composition droplets from the nozzle at 600 dpi. A coating film having a maximum thickness of 5 μm was prepared by discharging under the conditions of.

Five minutes after the coating film was prepared, light was used in a dry atmosphere using an LED-UV irradiator manufactured by CCS Co., Ltd. under the conditions of a peak wavelength of 395 nm, an output of 100 mW / cm ² , and an integrated light intensity of 1500 mJ / cm ² . The coating film was photo-cured by irradiating with the above, and a sealing material was prepared.

The coating film was observed immediately before irradiation with light 5 minutes after the coating film was prepared, and the case where the surface of the coating film was flat was evaluated as "A".

When it was not evaluated as "A", in the above, the coating film was observed after being left for 20 minutes without irradiating with light after preparing the coating film. As a result, when the surface of the coating film was flat, it was evaluated as "B", and when the surface of the coating film was wavy, it was evaluated as "C".

(2) Viscosity The viscosity of the composition was measured using a rheometer (manufactured by Anton Paar Japan Co., Ltd., model number DHR-2) under the conditions of a temperature of 25 ° C. and a shear rate of 1000 s ^-1 .

(3) Transmittance A coating film having a thickness of 10 μm is prepared by applying the composition, and an LED-UV irradiator (model number E075IIHD, peak wavelength 395 nm) manufactured by Ushio Co., Ltd. is used for this coating film in the atmosphere. A film was prepared by irradiating with ultraviolet rays at an irradiation intensity of 3 W / cm ² for 5.3 seconds and then heating at 100 ° C. for 5 minutes. The total light transmittance of this film according to JIS K7361-1 was measured.

(4) Inkjet property The composition was placed in a cartridge of an inkjet printer (manufactured by Fujifilm, type DMP2831), and droplets of the composition were ejected from the nozzle of the inkjet printer under the conditions of a temperature of 30 ° C. and a frequency of 1 kHz. The droplets were observed with a high-speed camera and evaluated as "A" when neither mist nor satellite was observed, and as "B" when at least one of mist and satellite was observed.

(5) Glass transition temperature A coating film is prepared by applying the composition, and the coating film is irradiated with ultraviolet rays at an intensity of 5 W / cm using a model number Unijet E075IIHD (peak wavelength 395 nm) manufactured by Ushio Denki in an air atmosphere. ^2. The coating film was photocured by irradiation under the conditions of an integrated light amount of 5000 mJ / cm ² , and a film having a thickness of 200 μm was prepared. The glass transition temperature of the sample cut out from this film was measured using a viscoelasticity measuring device (manufactured by Hitachi High-Tech Science Co., Ltd., model number DMA7100).

(6) Outgas evaluation The outgas when the cured product of the composition was heated was sampled by the headspace method and measured by a gas chromatograph. Specifically, first, 100 mg of the composition was placed in a headspace vial having a volume of 22 mL. Subsequently, the composition was irradiated with ultraviolet rays in an atmospheric atmosphere using a model number Unijet E075IIHD (peak wavelength 395 nm) manufactured by Ushio, Inc. under the conditions of an irradiation intensity of 5 W / cm ² and an integrated light intensity of 1500 mJ / cm ² . After curing the composition, the vial was sealed. Subsequently, the composition was heated at 100 ° C. for 30 minutes, and then the gas phase portion in the vial was introduced into a gas chromatograph for analysis. As a result, the concentration of outgas generated from the composition was specified based on the peak area of the obtained gas chromatogram. The outgas concentration is the volume fraction of outgas in the gas phase of the vial with respect to the volume of the vial (22 mL).

The concentration of outgas was specified using toluene as a reference substance. Specifically, by volatilizing toluene in a vial, two reference samples having a toluene concentration of 1000 ppm and 100 ppm were prepared. Each reference sample was introduced into a gas chromatograph and analyzed. From the peak areas of the two chromatograms thus obtained, the relationship between the peak area and the concentration was defined, and based on this result, the above-mentioned outgas concentration was specified.

As a result, "A" is when the outgas concentration (volume fraction) is 50 ppm or less, "B" is when it is more than 50 ppm and 100 ppm or less, and "C" is when it is more than 100 ppm and 200 ppm or less. , The case of exceeding 200 ppm was evaluated as "D".

Claims (11)

An ultraviolet curable resin composition containing a photopolymerizable compound (A) and a photopolymerization initiator (B).
The photopolymerizable compound (A) contains the water-soluble compound (C), and the percentage of the water-soluble compound (C) to the ultraviolet curable resin composition is 10% by mass or more.
The viscosity at 25 ° C. is 30 mPa · s or less.
UV curable resin composition. The photopolymerizable compound (A) contains a cyclic ether compound.
The ultraviolet curable resin composition according to claim 1. The percentage of the water-soluble compound (C) to the photopolymerizable compound (A) is 50% by mass or less.
The ultraviolet curable resin composition according to claim 1 or 2. For making optical components that transmit the light emitted by a light source,
The ultraviolet curable resin composition according to any one of claims 1 to 3. Molded by inkjet method,
The ultraviolet curable resin composition according to any one of claims 1 to 4. A cured product of the ultraviolet curable resin composition according to any one of claims 1 to 5.
Optical parts. The present invention comprises molding the ultraviolet curable resin composition according to any one of claims 1 to 6 by an inkjet method, and then irradiating the ultraviolet curable resin composition with ultraviolet rays to cure the composition.
Manufacturing method of optical parts. The optical component is manufactured on the silicon nitride film.
The method for manufacturing an optical component according to claim 7. The optical component comprises a light source and an optical component that transmits light emitted by the light source, and the optical component includes a cured product of the ultraviolet curable resin composition according to any one of claims 1 to 6.
Light emitting device. Further equipped with a silicon nitride film,
The optical component overlaps the silicon nitride film.
The light emitting device according to claim 9. It is a method of manufacturing a light emitting device including a light source and an optical component that transmits light emitted by the light source.
The optical component is manufactured by the method according to claim 7 or 8.
Manufacturing method of light emitting device.

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