JP7294190B2 - Laser processing system, controller, and control program - Google Patents

Description

The present disclosure relates to a laser processing system, control device, and control program.

2. Description of the Related Art Conventionally, a laser processing apparatus capable of marking (printing) a desired processing pattern by irradiating a laser beam onto an object to be processed has been known, for example, as described in Patent Document 1 below.

JP 2018-149579 A

In the above-described laser processing apparatus, when the processing target is glass, ceramic, or the like, a desired processing pattern is marked (printed) by generating cracks inside the processing target with a laser beam. However, for example, if the inside of the object to be processed is distorted, the generated cracks may be so small as to be invisible. In this case, the working pattern cannot be seen and the marking (printing) is unsuccessful.

Therefore, the present disclosure has been made in view of the above points, and is intended to re-process an object at a position on a workpiece that has been unsuccessfully processed despite being irradiated with a laser beam. To provide a laser processing system, a control device, and a control program capable of

The present specification includes a laser light emitting unit that emits laser light, a scanning unit that irradiates and scans the laser light toward the object to be processed, and a control unit. A creation process of creating first processing data for an object to be processed, and a first processing of controlling a laser light emitting unit and a scanning unit based on the first processing data to irradiate a laser beam for processing the object to be processed. a process of specifying, based on the first processing data, a specific area including at least a part of the processing position of the object on the workpiece irradiated with the laser beam in the first processing; and a specific area. and a generation process for generating second processing data for processing, and a laser light emitting unit and a scanning unit are controlled based on the second processing data to re-process the object that has been processed in the first processing. A laser processing system characterized by executing a second processing of irradiating a laser beam for processing.

The present specification is a control device for a laser processing machine comprising a laser light emitting unit that emits a laser beam and a scanning unit that irradiates and scans a laser beam onto an object to be processed. a creation step of creating first processing data for an object to be processed; and a first step of controlling a laser light emitting unit and a scanning unit based on the first processing data to irradiate the laser light for processing the object. a specifying step of specifying, based on the first processing data, a specified region including at least a portion of the processing position of the object on the workpiece irradiated with the laser beam in the first processing step; A generation step of generating second processing data for processing a region, and a laser light emitting unit and a scanning unit are controlled based on the second processing data to re-process the processing object that has been processed in the first processing step. and a second processing step of irradiating a laser beam in order to perform a control device.

In this specification, a laser beam emitting unit that emits a laser beam and a scanning unit that irradiates and scans a laser beam onto an object to be processed is provided in a control device for a laser beam machine. a creation step of creating first processing data for an object to be processed; and a first processing step of controlling a laser light emitting unit and a scanning unit based on the first processing data to irradiate a laser beam for processing the object to be processed. a specifying step of specifying, based on the first processing data, a specific region including at least part of the processing position of the object on the workpiece irradiated with the laser beam in the first processing step; A generation step of generating second processing data to be processed, and a laser light emitting unit and a scanning unit are controlled based on the second processing data to re-process the object processed in the first processing step. and a second processing step of irradiating a laser beam on the .

According to the present disclosure, the laser processing system, the control device, and the control program reprocess the object at the position on the processing target of which the processing was unsuccessfully completed despite being irradiated with laser light. Is possible.

BRIEF DESCRIPTION OF THE DRAWINGS It is the figure by which the schematic structure of the laser processing system of this embodiment was represented. It is a block diagram showing the electrical configuration of the same laser processing system. It is a flow chart showing each processing which the same laser processing system performs. FIG. 10 is a diagram showing an example of an object to be processed in the first processing; It is a figure in which the data table was represented. FIG. 10 is a diagram showing an example of an object processed by the first processing; FIG. 3 is a diagram showing an example of an image displayed on a liquid crystal display; FIG. FIG. 11 is a diagram showing an example of a rectangle surrounding objects that have not been selected in the selection process; FIG. 11 is a diagram showing an example of a specified area specified by specifying processing; FIG. 11 is a diagram showing a modified example of a specified area specified by specifying processing; FIG. 11 is a diagram showing a modified example of a specified area specified by specifying processing; FIG. 11 is a diagram showing a modified example of a specified area specified by specifying processing; FIG. 11 is a diagram showing a modified example of a specified area specified by specifying processing; FIG. 3 is a diagram showing each line segment that constitutes an object of the English letter "T";

Hereinafter, a laser processing system of the present disclosure will be described based on specific embodiments with reference to the drawings. In FIGS. 1 and 2 used for the following explanation, a part of the basic configuration is omitted, and the dimensional ratios and the like of the drawn parts are not necessarily accurate.

[1. Schematic configuration of laser processing system]
First, based on FIG.1 and FIG.2, schematic structure of the laser processing system 1 of this embodiment is demonstrated. A laser processing system 1 of the present embodiment is composed of a print information creating section 2 and a laser processing section 3 . The print information creation unit 2 is composed of a personal computer or the like.

The laser processing unit 3 performs laser marking (printing) processing (hereinafter referred to as “marking processing”) by two-dimensionally scanning the processing surface 8 of the processing object 7 with a laser beam R. The laser processing unit 3 has a laser controller 6 .

The laser controller 6 is composed of a computer, and is connected to the print information creating section 2 so as to be able to communicate bidirectionally. The laser controller 6 drives and controls the laser processing section 3 based on the print data, control parameters, various instruction information and the like transmitted from the print information creation section 2 . Here, the printing data refers to processing data (XY coordinate data) indicating the processing position of the printing pattern marked by the laser beam R on the processing surface 8 of the processing object 7, and processing data (XY coordinate data). This data is associated with processing condition data indicating conditions for marking processing. Hereinafter, the processing condition data will be referred to as "processing conditions". In the processing data, XY coordinate data indicating the start point and the end point are set for each of the plurality of line segments that form the print pattern.

In this embodiment, as will be described later, the processing data (XY coordinate data) includes first processing data and second processing data, and the processing conditions include first processing conditions and second processing conditions. . Furthermore, the first processing conditions are associated with the first processing data, and the second processing conditions are associated with the second processing data.

A schematic configuration of the laser processing unit 3 will be described. The laser processing unit 3 includes a laser light emitting unit 12, a visible laser light emitting unit 15, a dichroic mirror 101, a galvanometer scanner 18, an fθ lens 19, and the like, and is covered with a substantially rectangular parallelepiped housing cover (not shown). ing.

The laser light emitting unit 12 is composed of a laser oscillator 21 and the like. A laser oscillator 21 is composed of a CO2 laser, a YAG laser, or the like, and oscillates and emits laser light R. As shown in FIG. The diameter of the laser beam R is adjusted (eg, enlarged) by a beam expander (not shown).

The visible laser light emitting unit 15 is composed of a visible semiconductor laser 28 and the like. The visible semiconductor laser 28 emits visible laser light Q, which is visible coherent light, such as red laser light. The visible laser beam Q is collimated by a lens group (not shown) and is scanned two-dimensionally to form, for example, an image of a printing pattern to be marked with the laser beam R and a rectangular image surrounding the image. Alternatively, an image of a predetermined shape or the like is projected onto the processing surface 8 of the processing object 7 in a locus (time afterimage). In other words, the visible laser beam Q does not have marking processing capability.

Almost all of the incident laser light R is transmitted through the dichroic mirror 101 . In the dichroic mirror 101, the visible laser beam Q is incident at an incident angle of 45 degrees at a substantially central position through which the laser beam R is transmitted, and is reflected onto the optical path of the laser beam R at a reflection angle of 45 degrees. The reflectance of the dichroic mirror 101 has wavelength dependence. Specifically, the dichroic mirror 101 is surface-treated to have a multilayer structure of dielectric layers and metal layers, and has a high reflectance with respect to the wavelength of the visible laser light Q, and other wavelengths. It is constructed to transmit most (99%) of light.

The galvanometer scanner 18 two-dimensionally scans the laser light R and the visible laser light Q that have passed through the dichroic mirror 101 . In the galvano scanner 18, a galvano X-axis motor 31 and a galvano Y-axis motor 32 are mounted so that their motor shafts are orthogonal to each other, and a first galvano mirror 18X and a second galvano mirror 18X are mounted at the tip of each motor shaft. The galvanomirrors 18Y face each other inside. By rotating the first galvanometer mirror 18X and the second galvanometer mirror 18Y by controlling the rotation of the motors 31 and 32, the laser beam R and the visible laser beam Q are two-dimensionally scanned. The two-dimensional scanning directions are the X direction and the Y direction. Scanning in the X direction is performed by rotating the first galvanomirror 18X. Scanning in the Y direction is performed by rotating the second galvanomirror 18Y. A laser beam R with excellent directivity is incident on the first galvanomirror 18X. On the other hand, the laser beam R reflected by the rotating first galvanometer mirror 18X is incident on the second galvanometer mirror 18Y. Therefore, the second galvanometer mirror 18Y is larger and heavier than the first galvanometer mirror 18X.

The f.theta. Therefore, the laser beam R and the visible laser beam Q are two-dimensionally scanned in the X direction and the Y direction on the processing surface 8 of the processing object 7 by controlling the rotation of the respective motors 31 and 32 .

Next, the circuit configurations of the print information generating section 2 and the laser processing section 3 that constitute the laser processing system 1 will be described with reference to FIG. First, the circuit configuration of the laser processing unit 3 will be described.

As shown in FIG. 2, the laser processing unit 3 includes a laser controller 6, a galvano controller 35, a galvano driver 36, a laser driver 37, a semiconductor laser driver 38, and the like. A laser controller 6 controls the entire laser processing unit 3 . The laser controller 6 is electrically connected to a galvanometer controller 35, a laser driver 37, a semiconductor laser driver 38, and the like. The laser controller 6 is also connected to an external print information generator 2 so as to be capable of two-way communication. The laser controller 6 is configured to be able to receive each piece of information (eg, print data, various instruction information from the user, etc.) transmitted from the print information creation unit 2 .

The laser controller 6 includes a CPU 41, a RAM 42, a ROM 43, and the like. The CPU 41 is an arithmetic device and a control device for controlling the laser processing unit 3 as a whole. The CPU 41, RAM 42, and ROM 43 are interconnected by a bus line (not shown) to exchange data with each other.

The RAM 42 is for temporarily storing various calculation results calculated by the CPU 41, print data of print patterns, and the like.

The ROM 43 stores various programs, for example, a program for calculating processing data (XY coordinate data) of the print pattern based on the print data transmitted from the print information creation unit 2 and storing the data in the RAM 42. etc. are stored. In addition to the programs described above, the various programs include, for example, the thickness, depth and number of print patterns corresponding to the processing conditions of the print data input from the print information creation unit 2, the power of the laser oscillator 21, The laser pulse width of the laser light R, the scanning speed at which the laser light R is scanned by the galvanometer scanner 18, and the number of times the laser light R is repeatedly scanned on the processing surface 8 of the workpiece 7 (hereinafter referred to as the "repetition number of the laser light R There is a program or the like for storing various control parameters indicating such as "number" in the RAM 42. FIG. Further, the ROM 43 stores data such as the start point, end point, focal point, curvature, etc. of each character composed of a straight line and an elliptical arc for each type of font.

The CPU 41 performs various calculations and controls based on various programs stored in the ROM 43 .

The CPU 41 controls the processing data (XY coordinate data) of the print pattern calculated based on the print data input from the print information generation unit 2, the scanning speed of the laser light R by the galvanometer scanner 18, and the repetition rate of the laser light R. Galvano scanning speed information and the like indicating the number and the like are output to the galvano controller 35 . The CPU 41 also outputs laser drive information indicating the power of the laser oscillator 21 and the laser pulse width of the laser light R set based on the print data input from the print information creation unit 2 to the laser driver 37 .

The CPU 41 outputs to the semiconductor laser driver 38 an ON signal instructing the start of lighting of the visible semiconductor laser 28 or an OFF signal instructing the extinguishing of the visible semiconductor laser 28 .

The galvano controller 35 controls the galvano X-axis motor 31 and the galvano Y-axis motor 32 based on each information input from the laser controller 6 (for example, printing pattern processing data (XY coordinate data), galvano scanning speed information, etc.). It calculates the drive angle, rotation speed, etc., and outputs motor drive information indicating the drive angle and rotation speed to the galvano driver 36 . The galvano driver 36 drives and controls the galvano X-axis motor 31 and the galvano Y-axis motor 32 based on the motor drive information input from the galvano controller 35 to two-dimensionally scan the laser beam R and the visible laser beam Q. FIG.

The laser driver 37 drives the laser oscillator 21 based on the power of the laser oscillator 21 input from the laser controller 6, the laser driving information indicating the laser pulse width of the laser light R, and the like. The semiconductor laser driver 38 turns on or extinguishes the visible semiconductor laser 28 based on the ON signal or OFF signal input from the laser controller 6 .

Next, the circuit configuration of the print information creating section 2 will be described. The print information creation section 2 includes a control section 51, an input operation section 55, a liquid crystal display (LCD) 56, a CD-ROM drive 58, and the like. An input operation unit 55, a liquid crystal display 56, a CD-ROM drive 58, and the like are connected to the control unit 51 via an input/output interface (not shown).

The input operation unit 55 includes a mouse and a keyboard (not shown) and the like, and is used, for example, when the user inputs various instruction information.

The CD-ROM drive 58 reads various data, various application software, etc. from the CD-ROM 57 .

The control unit 51 controls the entire print information creation unit 2, and includes a CPU 61, a RAM 62, a ROM 63, a hard disk drive (hereinafter referred to as "HDD") 66, and the like. The CPU 61 is an arithmetic device and a control device that controls the print information creation section 2 as a whole. The CPU 61, RAM 62, and ROM 63 are interconnected by a bus line (not shown) and exchange data with each other. Furthermore, the CPU 61 and the HDD 66 are connected via an input/output interface (not shown) and exchange data with each other.

The RAM 62 is for temporarily storing various calculation results and the like calculated by the CPU 61 . The ROM 63 stores various programs and the like.

The HDD 66 stores various application software programs, various data files, and the like.

[2. control flow]
Next, the control flow of the laser processing system 1 of this embodiment will be described. A control program 100 shown in the flowchart of FIG. 3 is stored in the ROM 63 of the control unit 51, and is executed by the CPU 61 of the control unit 51 when marking processing with the laser beam R is performed. Therefore, in the processing to be described later, control is performed via the laser controller 6 when the control target is a component of the laser processing unit 3 . The control program 100 may be stored in the CD-ROM 57 , read by the CD-ROM drive 58 and executed by the CPU 61 . The control program 100 will be described below with reference to specific examples shown in FIGS.

In the control program 100, first, in step (hereinafter simply referred to as "S") 10, designation processing is performed. In that process, the material of the workpiece 7 is designated. The designation is performed by the user operating the input operation unit 55 .

In the creation process S12, XY coordinate data indicating the processing position on the processing surface 8 of the processing object 7 is created as first processing data for the print pattern desired by the user to be marked. A GUI (Graphical User Interface) is used for its creation. That is, the creating process S12 is performed by the user performing an input operation on the graphics displayed on the liquid crystal display 56 using the input operation unit 55, in the same manner as the specifying process S10.

Here, in order to specifically describe each process to be described later, each English letter "A", "T", and "B" is used as a print pattern that the user desires to be marked. That is, in the creation process S12, as shown in FIG. 4, on the processing surface 8 of the workpiece 7, the letters "A", "T", and "B" are marked in the order in which they are written. Thus, the first processing data (XY coordinate data) is created. In the following description using such a specific example, the English letter "A" is denoted as object O1, the English letter "T" is denoted as object O2, and the English letter "B" is denoted as object O3. do. Object O1, object O2, and object O3 are collectively referred to as object O without distinguishing between them.

In the first processing S14, first processing conditions are generated. The first processing conditions correspond to the first processing data (XY coordinate data) created in the creating process S12. Furthermore, in the first processing S14, the processing surface 8 of the object 7 is processed based on the generated first processing conditions and the first processing data (XY coordinate data) created in the creation processing S12. Marking processing is performed on it. Thereby, each object O is drawn on the processing surface 8 of the processing object 7 .

The generation of the first machining conditions is performed using the material of the workpiece 7 specified in the specifying process S10 and the data table 70 shown in FIG. The data table 70 is stored in the ROM 63 of the control section 51 . In the data table 70, each column of the material of the workpiece 7, the control parameter, the first machining condition, and the second machining condition is associated. The column of the material of the workpiece 7 includes items of the first glass material, the second glass material, the first ceramic material, and the first resin material. The first glass material and the second glass material indicate different glass specific materials. The first ceramic material indicates a ceramic specific material. The first resin material indicates a specific material of resin.

Items such as power, scanning speed, and number of repetitions are provided in the control parameter column. The power is the output power of the laser light R and indicates the intensity of the light energy of the laser light R. FIG. The scanning speed indicates the speed at which the galvanometer scanner 18 scans the laser light R, as described above. The number of repetitions indicates the number of times the galvanometer scanner 18 repeatedly scans the processing surface 8 of the object 7 with the laser beam R, as described above.

In the first processing S14, if the first glass material is designated as the material of the object 7 in the designation processing S10, the power is 80%, the scanning speed is 3000 mm/s, and the repetition number of "1" Data indicating the numerical value of each control parameter such as is generated as the first machining condition. If the second glass material is designated as the material of the workpiece 7 in the designation process S10, the control parameters such as 80% power, 3000 mm/s scanning speed, and "4" repetition count are set. Data indicating numerical values are generated as the first processing conditions.

When the first ceramic material is specified as the material of the workpiece 7 in the specifying process S10, each control parameter such as a power of 90%, a scanning speed of 1000 mm/s, and the number of repetitions of "1" Data indicating numerical values are generated as the first processing conditions. When the first resin material is specified as the material of the workpiece 7 in the specifying process S10, the control parameters such as power of 80%, scanning speed of 1000 mm/s, and number of repetitions of "1" Data indicating numerical values are generated as the first processing conditions. Note that the second processing conditions will be described later.

After the marking process is performed in this way, it is determined whether or not the marking process needs to be performed again in the determination process of S16. The determination is made based on instruction information input by the user who has visually observed the processing surface 8 of the processing object 7 by operating the input operation unit 55 according to the visual observation result.

For example, when at least one of all the objects O on the processing surface 8 of the object 7 is invisible, the user inputs instruction information indicating that the marking processing needs to be performed again.

In FIG. 6, as a specific example of the object O that cannot be visually recognized by the user, an object O2 of the English letter "T" is indicated by a chain double-dashed line. This point also applies to FIGS. 8 to 13 described later. It should be noted that the object O2 of the English letter "T" is processed by the laser beam R in the first processing S14 with respect to the processing position on the processing surface 8 of the processing object 7 indicated by the first processing data (XY coordinate data). is irradiated and scanned, the marking process is unsuccessful and the user cannot see it.

Here, if the marking process needs to be performed again (S16: YES), selection processing S18 is performed. In that process, the user selects an object O that needs to be marked again. Specifically, as shown in FIG. 7, the user manipulates the pointer 59 with the input operation unit 55 on the liquid crystal display 56 on which the images of all the objects O are displayed, thereby processing the object 7 to be processed. The object O2 of the English letter "T" that cannot be visually recognized on the plane 8 is selected. At that time, on the liquid crystal display 56, the mode of image display of the object O2 of the selected English letter "T" is changed.

The image display of all the objects O on the liquid crystal display 56 may be performed based on the first processing data (XY coordinate data) of all the objects O created in the creating process S12, or the first processing data ( XY coordinate data) (for example, imaging data of the processing surface 8 of the processing object 7 acquired by a camera (not shown)) or the like.

In the irradiation process S20, the (processing position of) the object O which is not selected in the selection process S18 is projected as a time afterimage of the visible laser beam Q on the processing surface 8 of the object 7 to be processed. Specifically, as shown in FIG. 8, on the processing surface 8 of the object 7, a rectangular image P1 surrounding an object O1 of the marked English letter "A" and a marked English letter A rectangular image P2 surrounding the "B" object O3 is painted out by the scanning of the visible laser beam Q. FIG. At this time, the visible laser beam Q is irregularly reflected by the respective marking traces at each machining position on the workpiece 7 of the object O1 of the English letter "A" and the object O3 of the English letter "B". As a result, the marked object O1 of the English letter "A" and the object O3 of the English letter "B" are projected on the processing surface 8 of the processing object 7 as a temporal afterimage of the visible laser beam Q. It should be noted that this projection ends before the second processing S28, which will be described later, is performed at the latest.

When the temporal afterimage of the visible laser beam Q is projected in this way, it is determined in the determination process of S22 whether or not the selection in the selection process S18 is ended. This determination is made based on instruction information input by the user by operating the input operation unit 55 . Here, if the selection in the selection process S18 is not completed (S22: NO), the selection process S18 and the irradiation process S20 are repeated.

On the other hand, when the selection in the selection process S18 is finished (S22: YES), the specific process S24 is performed. In this process, of the first processed data (XY coordinate data) created in the creation process S12, the area indicated by the first processed data (XY coordinate data) of the object O selected in the selection process S18 is Identified as a specific area. Specifically, among the first processed data (XY coordinate data) of all the objects O created in the creation process S12, the first processed data of the object O2 of the English character "T" selected in the selection process S18 The area indicated by (XY coordinate data) is identified as the specific area. It should be noted that such a specific region represents the machining position of the invisible English letter "T" object O2 on the machining surface 8 of the object 7, as indicated by reference numeral D1 in FIG.

In the generating process S26, XY coordinate data indicating the machining position on the machining surface 8 of the workpiece 7 in the specific region specified in the specifying process S24 is created as second machining data. The creation is performed based on the first processing data (XY coordinate data) created in the creating process S12. Specifically, the XY coordinate data indicating the machining position on the machining surface 8 of the workpiece 7 of the specified area D1 specified in the specifying process S24, that is, the English letter "T" selected in the selecting process S18 The same data as the first processing data (XY coordinate data) of the object O2 is created as the second processing data.

In the second processing S28, second processing conditions are generated. The second processing conditions correspond to the second processing data (XY coordinate data) generated in the generating process S26. Furthermore, in the second processing S28, based on the generated second processing conditions and the second processing data (XY coordinate data) generated in the generation processing S26, the marking has already been performed in the first processing S14. Marking is performed again on the machined surface 8 of the machined object 7 . As a result, although the laser beam R was irradiated and scanned on the processing surface 8 of the object 7 in the first processing S14, the marking processing was unsuccessful, and the invisible English letter "T , the object O2 of the English letter "T" is drawn again at the processing position of the object O2 of ".

The generation of the second machining conditions is similar to the generation of the first machining conditions described above, using the material of the workpiece 7 designated in the designation process S10 and the data table 70 shown in FIG. done.

In the second processing S28, if the first glass material is designated as the material of the object 7 in the designation processing S10, the power is 50%, the scanning speed is 3000 mm/s, the number of repetitions of "1", etc. , data indicating the numerical value of each control parameter is generated as the second processing line. Comparing the second processing condition and the first processing condition associated with the first glass material, the power value of the second processing condition is less than the power value of the first processing condition. On the other hand, the values of the scanning speed and the number of repetitions under the second processing condition are the same as the values of the scanning speed and the number of repetitions under the first processing condition.

When the second glass material is designated as the material of the workpiece 7 in the designation process S10, numerical values of each control parameter such as power of 80%, scanning speed of 3000 mm/s, number of repetitions of "2", etc. is generated as the second processing condition. Comparing the second processing condition and the first processing condition associated with the second glass material, the number of repetitions value for the second processing condition is less than the number of repetitions value for the first processing condition. On the other hand, the power and scanning speed values of the second processing condition are the same as the power and scanning speed values of the first processing condition.

When the first ceramic material is designated as the material of the workpiece 7 in the designation process S10, numerical values of each control parameter such as power of 80%, scanning speed of 2000 mm/s, number of repetitions of "1", etc. is generated as the second processing condition. Comparing the second processing condition and the first processing condition associated with the first ceramic material, the power value for the second processing condition is less than the power value for the first processing condition, and the scan for the second processing condition The speed value is greater than the scanning speed value of the first processing condition. On the other hand, the value of the number of repetitions of the second machining condition is the same as the value of the number of repetitions of the first machining condition.

When the first resin material is specified as the material of the workpiece 7 in the specifying process S10, numerical values of each control parameter such as power of 80%, scanning speed of 3000 mm/s, number of repetitions of "1", etc. is generated as the second processing condition. Comparing the second processing condition and the first processing condition associated with the first resin material, the scanning speed value of the second processing condition is greater than the scanning speed value of the first processing condition. On the other hand, the values of power and number of repetitions under the second machining condition are the same as the values of power and number of repetitions under the first machining condition.

After the marking process is performed again in this manner, the process returns to the determination process of S16 to determine whether or not the marking process needs to be performed again. Specifically, for example, as shown in FIG. 6 described above, when the object O2 of the English letter “T” is still not visible on the processing surface 8 of the processing object 7, it is necessary to perform the marking process again. When the user inputs the instruction information to the effect that the marking process needs to be performed again (S16: YES), each process after the selection process S18 is repeatedly performed.

On the other hand, for example, as shown in FIG. 4 described above, when all objects O can be visually recognized on the processing surface 8 of the processing object 7, there is instruction information to the effect that the marking process does not need to be performed again. , is input by the user, it is determined that the marking process does not need to be performed again (S16: NO), and the control program 100 ends.

[3. summary]
As described in detail above, in the present embodiment, since all objects O are subjected to marking processing on the workpiece 7, the first processing data of all the objects O are created (S12), and the first processing data are created (S12). Based on the data, the object 7 is irradiated and scanned with the laser beam R (S14). After that, for the object O2 of the English letter "T" that is invisible to the user among all the objects O, the specific region D1 representing the machining position on the workpiece 7 is specified based on the first machining data. Then (S24), XY coordinate data indicating the machining position of the specific area D1 on the workpiece 7 is generated as second machining data based on the first machining data (S26). Furthermore, based on the second processing data, the object 7 is again irradiated and scanned with the laser beam R (S28).

As a result, the laser processing system 1, the control unit 51, and the control program 100 of the present embodiment, despite the laser beam R being irradiated and scanned in the first processing S14 on the processing object 7, It is possible to mark the object O2 of the English letter "T" again in the second processing S28 with respect to the processing position of the object O2 of the English letter "T" that is unsuccessful in the marking process. be.

Further, in the processing object 7 after the marking processing of all the objects O has been performed in the first processing S14, the material of the processing object 7 is the first glass material, the second glass material, the first ceramic material, or the like. , a large number of invisible microcracks are generated inside the workpiece 7 at the machining position of the invisible English letter "T" object O2. Alternatively, if the material of the object to be processed 7 is the first resin material or the like, a large number of invisible microbubbles are generated inside the object to be processed 7 at the processing position of the object O2 of the invisible English letter "T". ing. However, in the laser processing system 1, the control unit 51, and the control program 100 of the present embodiment, marking processing can be performed again by the second processing step S28. The object O2 of "T" becomes visible.

Also, the irradiation/scanning of the laser beam R performed based on the first processing data is performed based on the first processing conditions composed of control parameters relating to the irradiation/scanning of the laser beam R (S14). On the other hand, the re-irradiation/scanning of the laser light R performed based on the second processing data is based on the second processing conditions configured by each control parameter related to the re-irradiation/scanning of the laser light R. is performed (S28). Each control parameter of the first machining condition and the second machining condition is power, scanning speed, number of repetitions, and the like. Among the control parameters such as the number of returns, at least one control parameter has a different value (FIG. 5).

As a result, the laser processing system 1, the control unit 51, and the control program 100 of the present embodiment irradiate and irradiate the laser beam R with control parameters suitable for marking all the objects O in the first processing S14. It is possible to scan. Furthermore, in the second processing step S28, the object O2 of the English letter "T", for which the marking processing was unsuccessful despite being irradiated and scanned with the laser beam R in the first processing processing S14, is marked again. It is possible to irradiate and scan the laser light R with control parameters suitable for the purpose. That is, since irradiation and scanning with the laser beam R are performed under the second processing conditions different from the first processing conditions, the probability that the marking processing will be successful, that is, the probability that the object O2 of the English letter "T" will be visible increases. .

Further, if a large number of invisible microcracks or microbubbles generated in the first processing S14 are connected, the object O2 of the English letter "T" becomes visible. The power density of the laser light for causing such connection, that is, the light intensity per unit area of the laser light R with which the object 7 is irradiated may be smaller than in the first processing S14.

Therefore, in the second processing S28, the laser processing system 1, the control unit 51, and the control program 100 of the present embodiment make the power density of the laser beam R smaller than that in the first processing S14. Generate second processing conditions. Therefore, when the material of the workpiece 7 is the first glass material, the power value of the second processing condition is set smaller than the power value of the first processing condition. When the material of the workpiece 7 is the second glass material, the value of the number of repetitions of the second processing conditions is set smaller than the value of the number of repetitions of the first processing conditions. When the material of the workpiece 7 is the first ceramic material, the power value of the second machining condition is set smaller than the power value of the first machining condition, and the scanning speed of the second machining condition is set to It is set faster than the scanning speed of the first processing condition. When the material of the workpiece 7 is the first resin material, the scanning speed under the second processing conditions is set faster than the scanning speed under the first processing conditions.

When the spot diameter of the laser beam R irradiated onto the workpiece 7 is set as one of the items of the control parameters of the first machining condition and the second machining condition, the value of the spot diameter of the second machining condition is 1 Make the spot diameter larger than the value of the processing condition. Thereby, the second processing conditions may be generated such that the power density of the laser beam R in the second processing S28 is smaller than that in the first processing S14.

Further, when the laser oscillator 21 is composed of a YAG laser or the like, the repetition frequency is set as one of the control parameter items of the first processing condition and the second processing condition, and the value of the repetition frequency of the second processing condition is , smaller than the value of the repetition frequency of the first machining condition. Thereby, the second processing conditions may be generated such that the power density of the laser beam R in the second processing S28 is smaller than that in the first processing S14.

Further, in the second machining process S28, with respect to the material of the workpiece 7 specified in the specifying process S10, by the value of each control parameter associated in the second machining condition column of the data table 70 of the ROM 63, A second machining condition is generated. Thereby, the laser processing system 1, the control unit 51, and the control program 100 of the present embodiment can easily generate the second processing conditions according to the material of the object 7 to be processed.

In addition, by operating the pointer 59 with the input operation unit 55 on the liquid crystal display 56 on which the image of all the objects O is displayed, the object of the English letter "T" that cannot be visually recognized on the processing surface 8 of the workpiece 7 can be displayed. When O2 is selected (S18), in the specifying process S24, the area indicated by the first processed data of the object O2 of the selected English letter "T" is specified as the specified area D1. Thereby, the laser processing system 1, the control unit 51, and the control program 100 of the present embodiment can easily identify the specific region D1.

In the irradiation process S20, among all the objects O whose images are displayed on the liquid crystal display 56, the objects O1 and O3 that the user has not selected with the input operation unit 55 are processed on the respective workpieces 7. Each rectangular image P1, P2 surrounding the position is painted out by scanning the visible laser beam Q (FIG. 8). As a result, the laser processing system 1, the control unit 51, and the control program 100 of the present embodiment diffusely reflect the objects O1 and O3, which the user did not select, at the processing position on the processing target 7. It is possible to project by the time afterimage of the laser beam Q. FIG. Therefore, by referring to the objects O1 and O3 projected on the object to be processed 7, it becomes easy to determine the irradiation position of the laser beam R with respect to the object O2 based on the second processing data. In the irradiation process S20, instead of filling the rectangular images P1 and P2 surrounding the objects O1 and O3 with the visible laser beam Q on the processing surface 8 of the object 7, Based on the processing data (XY coordinate data), the visible laser beam Q may be irradiated and scanned so as to draw each of the objects O1 and O3.

The specified area D1 specified in the specifying process S24 is the object O selected by the user using the input operation unit 55, and is the processing position of the object O2 of the invisible English letter "T" on the workpiece 7. represents. Further, in the generating process S26, the XY coordinate data indicating the machining position on the workpiece 7 of the specified area D1 specified in the specifying process S24, that is, the object O2 of the invisible English letter "T", is generated by the second machining. Created as data. Therefore, in the second processing S28, the laser processing system 1, the control unit 51, and the control program 100 of the present embodiment draw the object O2 of the English letter "T", It is possible to irradiate and scan the light R.

In the second processing step S28, the laser beam R is not irradiated, or the output power of the laser beam R is set higher than the second processing condition, for the first predetermined range of the processing positions of the object O2 of the English letter "T". can also be smaller. This is because, in the first processing S14, the output state of the laser light R is not stable at the beginning of drawing each object O, and the output power of the laser light R tends to increase. Therefore, in the second processing S28, in the first predetermined range at the start of drawing, among the processing positions of the object O2 of the alphabetic character "T", by stopping the emission of the laser light R or reducing the output power, the position It is possible to suppress the deterioration of the processing accuracy at.

Further, in scanning the object O2 of the English letter "T" with the laser light R, even if the scanning order of the laser light R in the second processing S28 and the scanning order of the laser light R in the first processing S14 are different. good. Specifically, for example, in the second processing S28, the laser light R is scanned in a scanning order opposite to the scanning order of the laser light R in the first processing S14. In this case, each of the XY coordinate data indicating the start point and the end point of the line segment forming the object O2 of the English letter "T" generated as the second processing data is generated as the first processing data, the English letter " XY coordinate data indicating the end point and the start point of the line segment forming the object O2 of "T". As a result, in the second processing S28, the laser beam R is irradiated in a scanning order different from that in the first processing S14, so that microcracks or microbubbles are easily connected, and the probability of successful marking processing increases. .

Incidentally, in this embodiment, the laser controller 6 and the control section 51 are an example of a "control unit." Galvanometer scanner 18 is an example of a "scanning unit." The control unit 51 is an example of a "control device". The input operation unit 55 is an example of the "operation unit". The liquid crystal display 56 is an example of a "display". The ROM 63 is an example of a "storage unit". The creating process S12 is an example of a "creating step". The first processing S14 is an example of a "first processing step." The specific process S24 is an example of a "specific step". The generating process S26 is an example of a "generating step". The second processing S28 is an example of a "second processing step."

[4. others]
It should be noted that the present disclosure is not limited to the present embodiment, and various modifications can be made without departing from the scope of the present disclosure.

For example, the specified area specified in the specifying process S24 is the object O selected by the user with the input operation unit 55, such as the specified area D2 shown in FIG. The machining position on the workpiece 7 may be represented by a rectangular area surrounding all the machining positions of the object O2. In such a case, in the generating process S26, the specific area D2 specified in the specifying process S24, that is, the XY coordinate data of the rectangular area surrounding the object O2 of the invisible English letter "T" is converted into the second processed data. created as As a result, in the second processing step S28, the laser beam R is irradiated onto the workpiece 7 so that the rectangular area surrounding the entire object O2 of the English letter "T" is painted out by the scanning of the laser beam R. Scanned.

Alternatively, the specified area specified in the specifying process S24 is an object O selected by the user with the input operation unit 55, such as the specified area D3 shown in FIG. A rectangular area surrounding part of the O2 machining position may represent the machining position on the workpiece 7 . In such a case, in the generating process S26, the XY coordinate data of the specific area D3 specified in the specifying process S24, that is, the rectangular area surrounding a part of the object O2 of the invisible English letter "T" is 2 Created as processed data. As a result, in the second processing step S28, the laser beam R is irradiated onto the workpiece 7 such that the rectangular area surrounding the part of the object O2 of the English letter "T" is painted out by the scanning of the laser beam R. • be scanned; As described above, in the second processing S28, if even a part of the object O2 of the English letter "T" that cannot be visually recognized is irradiated with the laser beam R, the impact of the marking processing by the laser beam R causes the first processing. Since a large number of microcracks or microbubbles generated in the process S14 are connected in a chain, the object O2 of the English letter "T" becomes visible.

Alternatively, the specified area specified in the specifying process S24 may be the object O selected by the user with the input operation unit 55, such as the specified area D4 shown in FIG. A rectangular area that intersects part of the processing position of the object O2 may represent the processing position on the workpiece 7 . In such a case, in the generating process S26, the XY coordinate data of the specific area D4 specified in the specifying process S24, that is, the rectangular area intersecting a part of the object O2 of the invisible English letter "T" is It is created as second processed data. As a result, in the second processing step S28, the laser beam R is projected onto the object 7 so that the rectangular area intersecting with a part of the object O2 of the English letter "T" is painted out by scanning the laser beam R. Irradiated and scanned. As described above, in the second processing S28, if even a part of the object O2 of the English letter "T" that cannot be visually recognized is irradiated with the laser beam R, the impact of the marking processing by the laser beam R causes the first processing. Since a large number of microcracks or microbubbles generated in the process S14 are connected in a chain, the object O2 of the English letter "T" becomes visible.

However, in each of the cases shown in FIGS. 10 to 12, when the second processing data is generated in the generation process S26, the scanning position of the laser beam R within each rectangular area is determined by the XY coordinate data. The power density of the laser light R in the second processing S28 is made smaller than that in the first processing S14 depending on the scanning interval of the laser light R (that is, the filling interval).

Alternatively, the specified area specified in the specifying process S24 may be the object O selected by the user with the input operation unit 55, such as the specified area D5 shown in FIG. A processing position on the workpiece 7 may be represented by a line segment that intersects a part of the processing position of the object O2. In such a case, in the generating process S26, the XY coordinate data of the line segment that intersects with the specific area D5 specified in the specifying process S24, that is, the part of the object O2 of the invisible English letter "T" is It is created as second processed data. As a result, in the second processing S28, the object 7 is irradiated and scanned with the laser beam R so as to draw a line segment that intersects a part of the object O2 of the English letter "T". As described above, in the second processing S28, if even a part of the object O2 of the English letter "T" that cannot be visually recognized is irradiated with the laser beam R, the impact of the marking processing by the laser beam R causes the first processing. Since a large number of microcracks or microbubbles generated in the process S14 are connected in a chain, the object O2 of the English letter "T" becomes visible.

However, in the case shown in FIG. 13, when the second processing conditions are generated in the second processing S28, the power density of the laser beam R in the second processing S28 is changed by the control parameter of the scanning speed to It is made smaller than in the first processing S14.

10 to 13, the specific regions D2 to D5 are specified based on the object O selected by the user using the input operation unit 55, but the present invention is not limited to this. isn't it. For example, in the liquid crystal display 56 shown in FIG. 7, when the user operates the pointer 59 with the input operation unit 55 to select one of a plurality of areas, the selected one area is specified. It may be specified as a region.

Further, as shown in FIG. 14A, when the object O2 of the English letter "T" is composed of a plurality of line segments L and is subjected to marking processing, the starting point of each line segment L is set as the first processing data. and XY coordinate data indicating the end point are created. Furthermore, in the present embodiment, the same XY coordinate data as the first processed data of the object O2 of the English letter "T" is generated as the second processed data, but it is not limited to this. That is, if the second processing data is data indicating the range on the processing surface 8 of the object 7 on which the object O2 of the English letter "T" is marked, the first processing data of the object O2 of the English letter "T" is processed. It does not have to be the same as the processed data.

For example, as shown in FIG. 14B, the XY coordinate data of a line segment L obtained by thinning at least one line segment L among a plurality of line segments L forming an object O2 of the English letter "T" is , may be generated as the second processed data.

Further, as shown in FIG. 14C, based on the shape of the object O2 of the English letter "T", the XY coordinate data of the line segment L indicating the shape of the object O2 of the English letter "T" is obtained from the second It may be generated as processed data. In this case, for example, a well-known thinning process is performed on the shape of the object O2 of the English letter "T", and a line segment L indicating the thinned shape of the object O2 of the English letter "T" is marked. may be generated as the second processing data. In particular, since the object O2 is an English letter "T", the skeleton line of the English letter "T" represented by a single line vector is set as a line segment L indicating the shape of the object O2, and this line segment L is marked. It is preferable to generate the XY coordinate data for the second processing data as the second processing data. This point is the same for other characters.

In the second processing step S28, if the line segment L shown in FIGS. 14(B) and 14(C) is marked, the microcracks or microbubbles generated in the first processing step S14 are chained together. can be made Further, the machining position on the machining surface 8 of the object 7 to be marked by the second machining data is the position marked on the basis of the first machining data in the first machining process S14. Therefore, in the second processing step S28, the laser beam R is not irradiated/scanned except for the position where the object O2 of the English letter "T" is marked based on the second processing data. Processing is prevented.

Incidentally, the specific area D2, the specific area D3, and the specific area D4 are examples of "rectangular areas". The specific area D5 is an example of the "intersection area".

1: laser processing system, 6: laser controller, 7: object to be processed, 12: laser light emission unit, 15: visible laser emission unit, 18: galvano scanner, 51: control unit, 55: input operation unit, 56: liquid crystal Display, 63: ROM, 100: Control program, D1, D2, D3, D4, D5: Specific area, L: Line segment, O: Object, Q: Visible laser beam, R: Laser beam, S10: Designation process, S12 : creation processing, S14: first processing, S20: irradiation processing, S24: specific processing, S26: generation processing, S28: second processing

Claims (21)

a laser light emitting unit that emits laser light;
a scanning unit that irradiates and scans the laser beam toward an object to be processed;
a control unit;
The control unit is
a creation process of creating first machining data of an object to be machined on the workpiece;
a first processing of controlling the laser light emitting unit and the scanning unit based on the first processing data to irradiate the laser light to process the object;
a specifying process of specifying, based on the first processing data, a specific region including at least part of a processing position of the object on the workpiece irradiated with the laser beam in the first processing;
a generating process for generating second processed data for processing the specific region;
A second method for controlling the laser light emitting unit and the scanning unit based on the second processing data to irradiate the laser light to re-process the object that has been processed in the first processing. 2 Execute processing and
Furthermore, when performing the second processing, the laser beam is irradiated under second processing conditions different from the first processing conditions that are the conditions for the laser beam irradiation in the first processing. A laser processing system characterized by: The first processing condition and the second processing condition include the power density of the laser beam, which is the light intensity per unit area of the laser beam irradiated to the workpiece,
2. The laser processing system according to claim 1 , wherein the second processing condition has a lower power density of the laser beam than the first processing condition. The first processing condition and the second processing condition include the scanning speed of the scanning unit,
3. The laser processing system according to claim 1 , wherein the scanning speed of the scanning unit is faster under the second processing condition than under the first processing condition. The first processing condition and the second processing condition include the output power of the laser beam, which is the intensity of the light energy of the laser beam,
4. The laser processing system according to any one of claims 1 to 3 , wherein the output power of the laser light under the second processing condition is smaller than that under the first processing condition. The first processing condition and the second processing condition include a repetition number, which is the number of times the scanning unit repeatedly scans the object to be processed during irradiation with the laser beam,
5. The laser processing system according to any one of claims 1 to 4 , wherein the second processing condition has a smaller number of repetitions than the first processing condition. a storage unit that stores the material of the workpiece and the machining conditions in association with each other;
The control unit is
executing a designation process for designating the material of the object to be processed;
6. In the second machining process, machining conditions associated with the material specified in the specifying process in the storage unit are used as the second machining conditions. A laser processing system according to any one of the preceding claims. a laser light emitting unit that emits laser light;
a scanning unit that irradiates and scans the laser beam toward an object to be processed;
a display that displays images of a plurality of objects in the workpiece ;
an operation unit for selecting one or more objects from among the plurality of objects displayed on the display;
a control unit;
The control unit is
a creation process of creating first processing data of the plurality of objects to be processed on the processing object;
a first processing of controlling the laser light emitting unit and the scanning unit based on the first processing data to irradiate the laser light to process the object;
a specifying process of specifying, based on the first processing data, a specific region including at least part of a processing position of the object on the workpiece irradiated with the laser beam in the first processing;
a generating process for generating second processed data for processing the specific region;
A second method for controlling the laser light emitting unit and the scanning unit based on the second processing data to irradiate the laser light to re-process the object that has been processed in the first processing. 2 Execute processing and
Further, in the specifying process, a region including at least a part of the object selected by the operation unit is specified as the specified region. The laser processing system includes a visible laser light emitting unit that emits visible laser light,
The scanning unit irradiates and scans the visible laser light toward the object to be processed,
The control unit is
controlling the visible laser light emitting unit and the scanning unit to use the visible laser light to position an object, among the plurality of objects displayed on the display, that is not selected by the operation unit on the workpiece 8. The laser processing system according to claim 7 , wherein an irradiation process of irradiating is executed. 9. The laser processing system according to claim 7 , wherein in the specifying process, the control unit specifies an object selected by the operation unit as the specified area. The object selected by the operation unit is composed of a plurality of line segments,
The control unit is
In the generating process, data for processing a line segment obtained by thinning one or more line segments among the plurality of line segments forming the object is generated as the second processing data. The laser processing system according to claim 9 . The control unit is
10. The method according to claim 9 , wherein in the generating process, the object is subjected to a thinning process, and data for processing a line segment representing a shape of the thinned object is generated as the second processing data. The described laser processing system. a laser light emitting unit that emits laser light;
a scanning unit that irradiates and scans the laser beam toward an object to be processed;
a control unit;
The control unit is
a creation process of creating first machining data of an object to be machined on the workpiece;
a first processing of controlling the laser light emitting unit and the scanning unit based on the first processing data to irradiate the laser light to process the object;
a specifying process of specifying, based on the first processing data, a specific region including at least part of a processing position of the object on the workpiece irradiated with the laser beam in the first processing;
a generating process for generating second processed data for processing the specific region;
A second method for controlling the laser light emitting unit and the scanning unit based on the second processing data to irradiate the laser light to re-process the object that has been processed in the first processing. 2 Execute processing and
Further, in the specifying process, a rectangular area surrounding a processing position of the object on the workpiece irradiated with the laser beam in the first processing is specified as the specific area,
The laser processing system, wherein, in the generating process, data for filling the rectangular area by scanning with the laser beam is generated as the second processing data. a laser light emitting unit that emits laser light;
a scanning unit that irradiates and scans the laser beam toward an object to be processed;
a control unit;
The control unit is
a creation process of creating first machining data of an object to be machined on the workpiece;
a first processing of controlling the laser light emitting unit and the scanning unit based on the first processing data to irradiate the laser light to process the object;
a specifying process of specifying, based on the first processing data, a specific region including at least part of a processing position of the object on the workpiece irradiated with the laser beam in the first processing;
a generating process for generating second processed data for processing the specific region;
A second method for controlling the laser light emitting unit and the scanning unit based on the second processing data to irradiate the laser light to re-process the object that has been processed in the first processing. 2 Execute processing and
Further, in the specifying process, an intersection area that intersects the processing position of the object on the workpiece irradiated with the laser beam in the first processing is specified as the specific area,
The laser processing system, wherein, in the generating process, data for tracing the intersection area by scanning the laser beam is generated as the second processing data. A control device for a laser processing machine, comprising: a laser beam emitting unit that emits a laser beam; and a scanning unit that irradiates and scans an object to be processed with the laser beam,
a creating step of creating first machining data for an object to be machined on the workpiece;
a first processing step of controlling the laser light emitting unit and the scanning unit based on the first processing data to irradiate the laser light for processing the object;
a specifying step of specifying, based on the first processing data, a specific region including at least part of a processing position of the object on the workpiece irradiated with the laser beam in the first processing step;
a generation step of generating second processing data for processing the specific region;
A second method for controlling the laser light emitting unit and the scanning unit based on the second processing data to irradiate the laser light to re-process the object that has been processed in the first processing step; 2 processing steps, and
Furthermore, when performing the second processing step, the laser beam is irradiated under a second processing condition different from the first processing condition that is the condition for the laser beam irradiation in the first processing step. A control device characterized by: A laser light emitting unit that emits laser light, a scanning unit that irradiates and scans an object to be processed with the laser light , a display that displays images of a plurality of objects on the object to be processed, and a display on the display. A control device for a laser processing machine , comprising an operation unit for selecting one or more objects from among the plurality of objects to be processed ,
a creating step of creating first machining data for an object to be machined on the workpiece;
a first processing step of controlling the laser light emitting unit and the scanning unit based on the first processing data to irradiate the laser light for processing the object;
a specifying step of specifying, based on the first processing data, a specific region including at least part of a processing position of the object on the workpiece irradiated with the laser beam in the first processing step;
a generation step of generating second processing data for processing the specific region;
A second method for controlling the laser light emitting unit and the scanning unit based on the second processing data to irradiate the laser light to re-process the object that has been processed in the first processing step; 2 processing steps, and
Furthermore, in the specifying step, a region including at least a part of the object selected by the operation unit is specified as the specified region . A control device for a laser processing machine, comprising: a laser beam emitting unit that emits a laser beam; and a scanning unit that irradiates and scans an object to be processed with the laser beam,
a creating step of creating first machining data for an object to be machined on the workpiece;
a first processing step of controlling the laser light emitting unit and the scanning unit based on the first processing data to irradiate the laser light for processing the object;
a specifying step of specifying, based on the first processing data, a specific region including at least part of a processing position of the object on the workpiece irradiated with the laser beam in the first processing step;
a generation step of generating second processing data for processing the specific region;
A second method for controlling the laser light emitting unit and the scanning unit based on the second processing data to irradiate the laser light to re-process the object that has been processed in the first processing step; 2 processing steps, and
Further, in the identifying step, identifying a rectangular area surrounding a processing position of the object on the workpiece irradiated with the laser beam in the first processing step as the specific area,
In the generating step, the controller generates, as the second processing data, data for filling the rectangular area by scanning with the laser beam . A control device for a laser processing machine, comprising: a laser beam emitting unit that emits a laser beam; and a scanning unit that irradiates and scans an object to be processed with the laser beam,
a creating step of creating first machining data for an object to be machined on the workpiece;
a first processing step of controlling the laser light emitting unit and the scanning unit based on the first processing data to irradiate the laser light for processing the object;
a specifying step of specifying, based on the first processing data, a specific region including at least part of a processing position of the object on the workpiece irradiated with the laser beam in the first processing step;
a generation step of generating second processing data for processing the specific region;
A second method for controlling the laser light emitting unit and the scanning unit based on the second processing data to irradiate the laser light to re-process the object that has been processed in the first processing step; 2 processing steps, and
Further, in the identifying step, identifying, as the specific region, an intersection region that intersects the processing position of the object on the workpiece irradiated with the laser beam in the first processing step,
The control device , wherein in the generating step, data for tracing the intersection area by scanning the laser beam is generated as the second processing data . A control device for a laser processing machine comprising a laser light emitting unit that emits laser light and a scanning unit that irradiates and scans an object to be processed with the laser light,
a creating step of creating first machining data for an object to be machined on the workpiece;
a first processing step of controlling the laser light emitting unit and the scanning unit based on the first processing data to irradiate the laser light for processing the object;
a specifying step of specifying, based on the first processing data, a specific region including at least part of a processing position of the object on the workpiece irradiated with the laser beam in the first processing step;
a generation step of generating second processing data for processing the specific region;
A second method for controlling the laser light emitting unit and the scanning unit based on the second processing data to irradiate the laser light to re-process the object that has been processed in the first processing step; 2 processing steps , and
Furthermore, when executing the second processing step, the laser beam is irradiated under a second processing condition different from the first processing condition that is the condition for the laser beam irradiation in the first processing step. A control program characterized by: A laser light emitting unit that emits laser light, a scanning unit that irradiates and scans an object to be processed with the laser light , a display that displays images of a plurality of objects on the object to be processed, and a display on the display. A control device for a laser processing machine comprising an operation unit for selecting one or more objects from among the plurality of objects to be processed,
a creating step of creating first machining data for an object to be machined on the workpiece;
a first processing step of controlling the laser light emitting unit and the scanning unit based on the first processing data to irradiate the laser light for processing the object;
a specifying step of specifying, based on the first processing data, a specific region including at least part of a processing position of the object on the workpiece irradiated with the laser beam in the first processing step;
a generation step of generating second processing data for processing the specific region;
A second method for controlling the laser light emitting unit and the scanning unit based on the second processing data to irradiate the laser light to re-process the object that has been processed in the first processing step; 2 processing steps , and
Further, in the identifying step, the control program identifies, as the specific area, an area including at least a part of the object selected by the operation unit . A control device for a laser processing machine comprising a laser light emitting unit that emits laser light and a scanning unit that irradiates and scans an object to be processed with the laser light,
a creating step of creating first machining data for an object to be machined on the workpiece;
a first processing step of controlling the laser light emitting unit and the scanning unit based on the first processing data to irradiate the laser light for processing the object;
a specifying step of specifying, based on the first processing data, a specific region including at least part of a processing position of the object on the workpiece irradiated with the laser beam in the first processing step;
a generation step of generating second processing data for processing the specific region;
A second method for controlling the laser light emitting unit and the scanning unit based on the second processing data to irradiate the laser light to re-process the object that has been processed in the first processing step; 2 processing steps , and
Further, in the identifying step, identifying a rectangular area surrounding a processing position of the object on the workpiece irradiated with the laser beam in the first processing step as the specific area,
The control program , wherein, in the generating step, data for filling the rectangular area by scanning with the laser beam is generated as the second processing data. A control device for a laser processing machine comprising a laser light emitting unit that emits laser light and a scanning unit that irradiates and scans an object to be processed with the laser light,
a creating step of creating first machining data for an object to be machined on the workpiece;
a first processing step of controlling the laser light emitting unit and the scanning unit based on the first processing data to irradiate the laser light for processing the object;
a specifying step of specifying, based on the first processing data, a specific region including at least part of a processing position of the object on the workpiece irradiated with the laser beam in the first processing step;
a generation step of generating second processing data for processing the specific region;
A second method for controlling the laser light emitting unit and the scanning unit based on the second processing data to irradiate the laser light to re-process the object that has been processed in the first processing step; 2 processing steps , and
Further, in the identifying step, identifying, as the specific region, an intersection region that intersects the processing position of the object on the workpiece irradiated with the laser beam in the first processing step,
The control program , wherein, in the generating step, data for tracing the intersection area by scanning the laser beam is generated as the second processing data.

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