JP7283851B2 - Laser processing equipment - Google Patents

Description

TECHNICAL FIELD The present invention relates to a laser processing apparatus for drilling holes by irradiating a laser onto a printed circuit board, for example.

In recent years, as a laser processing apparatus, for example, as disclosed in Patent Document 1, a laser processing machine main body, a single work supply side stocker, a single work discharge stocker, and a work temporarily It is composed of a supply-side moving device and a discharge-side moving device having a work mounting table to hold, and when performing processing of simultaneously supplying a plurality of works, processing them at the same time, and discharging them at the same time, the work is temporarily placed on the work mounting table. In some cases, it is possible to reduce the installation area of the apparatus by using a single supply stocker and a single discharge stocker by holding the same.

However, in the method disclosed in Patent Document 1, the works placed on the work cradle or stocker are not aligned. The alignment marks are out of the imaging area of the camera for reading the alignment marks. Therefore, it takes time to read the alignment marks, and the processing efficiency is lowered.

Japanese Patent Application Laid-Open No. 2005-297007

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a laser processing apparatus capable of shortening the time for reading alignment marks and improving processing efficiency.

Among the inventions disclosed in the present application, a typical laser processing apparatus includes a carry-in side stocker on which works to be processed are loaded, and a plurality of works placed side by side in a first direction. A laser processing apparatus comprising: a table that moves in a second direction orthogonal to the first direction; and laser units arranged side by side in the first direction for processing each of the plurality of works. a suction head on the carry-in side arranged in the first direction in the same number as the plurality of works; each of which has a function of aligning the placed works, one of which is of a movable type that moves in the second direction to receive the work from the loading-side stocker; The movable work mounting table is arranged in the first direction together with other work mounting tables, and the work is moved from the movable work mounting table to another work mounting table by the suction head, and all the work mounting tables are moved. are aligned in the first direction, and the workpieces after being aligned by the suction head are transferred from each of all the workpiece mounting tables to the table.

The typical features of the invention disclosed in the present application are as described above, but the features not described here are described in the detailed description below, and also in the claims. It is as shown also in the range.

According to the present invention, the alignment mark reading time can be shortened and the processing efficiency can be improved.

It is a figure for demonstrating the structure of the laser processing apparatus which concerns on one Example of this invention. It is a figure which shows the structure for performing the alignment function of a workpiece|work in an Example. It is a figure for demonstrating the alignment operation|movement of the workpiece|work in an Example. It is a flow chart for explaining work carrying-in operation in an example. It is a flow chart for explaining work carrying-in operation in an example. 4 is a flow chart for explaining a series of machining operations in the embodiment;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described along with examples with reference to the drawings. In addition, in the following description, the same code|symbol is attached|subjected to each equivalent part, and description is abbreviate|omitted.

FIG. 1 is a diagram showing the structure of a laser processing apparatus according to one embodiment of the present invention. In the figure, the laser processing apparatus includes a laser processing machine 2 for laser processing holes and grooves in a work 1, a loading device 3 for supplying the unprocessed work 1 to the laser processing machine 2, and a laser processing machine 2. and a carry-out device (not shown) provided at a position symmetrical to the carry-in device 3 for discharging the processed workpiece 1 . The laser processing machine 2 includes an XY table 4 on which a plurality of (two in the figure) workpieces 1 placed can be moved in the X and Y directions, and a vacuum adsorption that is fixed on the XY table 4 to adsorb or release the workpieces. A table (not shown), a plurality of (two in the figure) laser units 5 for irradiating a laser beam to each of a plurality of workpieces 1 arranged side by side in the Y direction, and a plurality of laser units 5, a bed 7 on which an XY table 4 is installed, and a control device 8 for controlling a laser processing machine 5 and a loading device 3 to be described later.

On the other hand, the carrying-in device 3 includes a suction head 10a provided with a plurality of suction pads 9a for sucking or releasing the workpiece 1, a lifter 11a for raising and lowering the suction head 10a, and a suction head provided with a plurality of suction pads 9b. a lifter 11b for raising and lowering the workpiece 10b; a slider 12 to which the lifters 11a and 11b are fixed; a guide rail 13 for guiding the slider 12; 14, a workpiece mounting table 15 movable in the X direction, a stocker 16 loaded with a plurality of workpieces 1 to be processed, a slider 12, a workpiece mounting table 14, a workpiece mounting table 15 and a stocker 16. It comprises a carrying-in device pedestal 17 . The suction heads 10a and 10b are arranged side by side in the Y direction and are movable in the Y direction. The lifters 11a and 11b can be raised and lowered independently. Above the stocker 16, a suction head 10c having a plurality of suction nozzles 9c and a lifter 11c for moving the suction head 10c in the Z direction of the drawing are arranged. When moving from the workpiece mounting tables 14 and 15 to the XY table 4, as shown in FIG. are arranged in a straight line.

The work 1 is mounted on each of the work mounting tables 14 and 15 as follows.
First, regarding the work table 14 , the work table 15 is moved from the illustrated position to the stocker 16 side, and one work 1 is transferred from the stocker 16 to the work table 15 . After that, the workpiece mounting table 15 returns to the position shown in the figure, and the workpiece 1 mounted on the workpiece mounting table 15 is transferred to the workpiece mounting table 14 by the suction head 10b.
Next, the workpiece mounting table 15 is moved again from the illustrated position to the stocker 16 side, and one workpiece 1 is transferred to the workpiece mounting table 15 . It then returns to the position shown.
In this way, one work 1 is placed on each of the work placement tables 14 and 15 .
Each of the workpiece mounting tables 14 and 15 has a function of aligning the workpieces 1 mounted thereon.

FIGS. 2A and 2B are diagrams for explaining the structure for the alignment function of the workpiece mounting tables 14 and 15, where (a) shows the state before alignment and (b) shows the state after alignment.
In FIG. 2, reference numerals 18 and 19 denote workpiece alignment members, which abut on two sides of a rectangular workpiece 1 when aligning workpieces. The workpiece alignment members 18 and 19 are driven by drive means (not shown) controlled by the controller 8 . Before the work 1 is placed, the work aligning member 18 and the work aligning member 19 are moved to the lower side and the left side of the paper, respectively. After the work 1 is placed, the work aligning member 18 is driven in the X direction (arrow direction) and the work aligning member 19 is driven in the Y direction (arrow direction) to align the work 1 .
In FIG. 3, a solid line 20 indicates the position of the workpiece 1 before alignment, and a dotted line 21 indicates the position of the workpiece 1 after alignment. Immediately after the work 1 is mounted on each of the work mounting tables 14 and 15 by the suction head 10b, the work 1 is positioned at position 20, and is aligned at position 21 indicated by the dotted line by the work alignment means.
The work 1 placed on the work placement tables 14 and 15 and having been aligned is moved to the XY table 4 by the suction heads 10a and 10b.

4 and 5 are flow charts for explaining the work loading process described above. The operation of each step is as follows.
Step 501: One of the works 1 loaded on the stocker 16 is lifted while being sucked by the suction head 10c.
Step 502 : Move the work table 15 to the rear of the apparatus, that is, above the work 1 loaded on the stocker 16 and below the work 1 sucked in step 501 .
Step 503: The suction head 10c is lowered to place the workpiece 1 on the upper surface of the work table 15, and the suction head 10c is raised. At this time, the workpiece alignment members 19 and 20 of the workpiece mounting table 15 are in a state of being released from pressing.
Step 504: Move the work table 15 on which the work 1 is placed to the position shown in FIG.
Step 505: The suction head 10b is lowered to lift the workpiece 1 after suction.
Step 506: The suction head 10b is moved above the work table 14. FIG.
Step 507: The suction head 10b is lowered to place the workpiece 1 on the work table 15, and then the suction head 10b is raised.
Step 508: The suction head 10b is moved above the work table 15. FIG.
Step 509: The suction head 10c is lowered to lift the workpiece 1 after suction.
Step 510: The work table 15 is moved to the rear of the apparatus, that is, above the works 1 stacked on the stocker 16 and below the works 1 picked up by the suction head 10c raised in step 509.
Step 511: The suction head 10c is lowered to place the workpiece 1 on the work table 15, and then the suction head 10c is moved upward.
Step 512: Move the work table 15 to the position shown in FIG.
Step 513: Drive the work aligning members 18 and 19 to align the work 1 placed on the work mounting tables 14 and 15 at a predetermined position, then move the work aligning member 18 downward in the plane of the paper and move the work aligning member 19 is driven to the left side of the paper to release the pressing.
Step 514: The suction heads 10a and 10b are lowered to lift the workpieces 1 aligned on the workpiece mounting tables 14 and 15 after suction.
Step 515 : Move the suction heads 10 a and 10 b above the XY table 4 .
Step 516: The suction heads 10a and 10b are lowered, the workpiece 1 is placed on the XY table 4, and then the suction heads 10a and 10b are raised.
Step 517: The suction heads 10a and 10b are moved to the right side of the apparatus, that is, above the workpiece mounting tables 14 and 15. FIG.

FIG. 6 is a flow chart for explaining a series of machining operations in the embodiment. Under the control of the controller 8, laser processing is performed by the following processing steps.
Step 601: The control device 8 determines whether there is a work 1 to be processed in the stocker 16. If there is a work 1 to be processed, the process proceeds to step 602. If there is no work 1 to be processed, a series of operations are performed. finish.
Step 602 : The work 1 is carried from the carry-in device 3 to the XY table 4 of the laser processing machine 2 . After carrying in, the process moves to step 603 .
Step 603: laser process the workpiece 1;
Step 604: Move the machined workpiece 1 from the laser processing machine 2 to a carry-out device (not shown).
Here, Steps 501 to 514 of the loading step 602 may be performed while the processing step 603 is being performed, and the workpiece 1 to be loaded next may be suctioned and lifted by the suction heads 10a and 10b for preparation. In this case, the setup time can be shortened and the machining efficiency can be improved.

According to the above-described embodiment, since the workpiece 1 is aligned on both the workpiece mounting tables 14 and 15 and then transferred to the XY table 4, the width of the apparatus is not increased, and the alignment mark reading time is shortened. Efficiency can be improved.
Furthermore, while the workpiece 1 is being moved from the workpiece mounting table 15 to the workpiece mounting table 14, a new workpiece 1 can be mounted on the workpiece mounting table 15 using the suction head 10c, that is, step 505 in FIG. Since steps 509 to 512 can be processed in parallel while steps 508 to 508 are being performed, the preparation time for the workpiece 1 can be shortened and the machining efficiency can be improved.

Although the present invention has been described above based on the embodiments, it goes without saying that the present invention is not limited to the embodiments, and various modifications can be made without departing from the scope of the invention. is included.

1: Work 2: Laser processing machine 3: Loading device 4: XY table 5: Laser unit 6: Column 7: Bed 8: Control device 9a, 9b, 9c: Suction pads 10a, 10b, 10c: Suction heads 11a, 11b, 11c: Lifter 12: Slider 13: Guide Rail 14: Work Mounting Table 15: Work Mounting Table 16: Stocker 17: Loading Device Pedestal 18, 19: Work Aligning Member

Claims (2)

a carry-in side stocker on which workpieces before processing are loaded;
a table for moving a plurality of works placed side by side in a first direction in the first direction and in a second direction orthogonal to the first direction;
laser units arranged side by side in the first direction for processing each of the plurality of works;
In a laser processing device having
a suction head on the loading side arranged in the first direction in the same number as the plurality of works;
The same number of workpiece mounting tables as the plurality of workpieces for temporarily mounting the workpieces before being transferred to the table, each having a function of aligning the mounted workpieces, one of which is the a movable type that moves in a second direction to receive a work from the carry-in side stocker;
arranging the movable work mounting table together with another work mounting table in the first direction, moving the work from the movable work mounting table to another work mounting table by the suction head;
All the workpiece mounting tables are arranged in the first direction, and the workpiece after being aligned by the suction head is transferred from each of the workpiece mounting tables to the table. laser processing equipment. 2. The laser processing apparatus according to claim 1, wherein after moving the works placed on all of the work mounting tables to the table and before performing the same operation again, at least the movable work mounting table is moved to the second work mounting table. direction to receive the work from the carry-in side stocker, and keep the movable work mounting table aligned with the other work mounting tables in the first direction.

Images