JP7051349B2 - Constant power control device for tube joining device - Google Patents

Description

The present invention relates to, for example, a constant power control device for a tube joining device, which is suitable for a tube joining device for joining tubes .

As a technique for connecting resin tubes to each other, there is a joining method in which the ends of each tube are fused and the fused ends are pressed against each other to be pressure-bonded. This joining method is used in a tube joining device that joins tubes.

The tube joining device is made by stacking two tubes in the vertical direction (height direction) of the device and bringing them into close contact with each other, and moving the heated plate-shaped metal wafer closer to the two tubes. Fusing the tube. Battery power is used to heat the metal wafer. Conventionally, a metal wafer is heated by controlling a large voltage obtained from a battery and a current obtained by PWM control at a constant power.

As a technique for supplying battery power to a load by PWM control, there is one shown in Patent Document 1.

Japanese Unexamined Patent Publication No. 2010-143335

However, as in Patent Document 1, when the power of the battery is supplied to the load by PWM control, a large current is instantaneously supplied from the battery. Therefore, the battery cannot be discharged to a sufficient discharge depth, and the capacity of the battery cannot be fully utilized.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a constant power control device for a tube joining device capable of maximizing the capacity of a battery.

The constant power control device of the tube joining device according to the present invention has a DC-DC converter, a detection unit, and a control unit. The DC-DC converter outputs a voltage applied to a wafer heater provided for heating the wafer. The detection unit detects the voltage applied to the wafer heater and the current flowing through the wafer heater. The control unit calculates the target voltage that the DC-DC converter should output in order to operate the wafer heater with constant power based on the average value of the voltage and current of the wafer heater detected by the detector multiple times at regular intervals. Then, different target voltages are output to the DC-DC converter when the temperature of the wafer heater is raised, when the tube is cut, and when the tube is joined / separated .

According to the constant power control device of the tube joining device according to the present invention, the DC-DC converter is operated according to the target voltage calculated by the control unit, and the DC-DC converter supplies constant power to the wafer heater , so that the battery Therefore, a large current is not instantaneously supplied to the wafer heater . Therefore, the battery can be discharged to a sufficient discharge depth, and the capacity of the battery can be effectively utilized. Furthermore, the range of battery selection such as battery type and capacity is expanded.

It is a perspective view of the tube joining apparatus which concerns on this embodiment. It is a side view of the tube joining device seen from the direction of arrow J1 shown in FIG. It is a side view of the tube joining device seen from the direction of arrow J2 shown in FIG. It is a perspective view which looked at the tube joining device from the bottom side. 5 (A) is a view showing an operation panel portion provided on the front surface side of the housing shown in FIG. 1, and FIG. 5 (B) is provided on the upper surface portion of the housing shown in FIG. It is a figure which shows the display part. FIG. 3 is a perspective view showing a state in which the clamp lid portion is opened in the RT direction shown in FIG. It is a figure which shows the internal structure of a clamp lid portion and a housing. It is a perspective view which shows the arrangement of the component arranged in the housing of a tube joining apparatus. It is a block diagram of the control system of a tube joining device. 10 (A) is a view showing the wafer cassette insertion portion of the housing, FIG. 10 (B) is a view showing the vicinity of the wafer cassette eject button, and FIG. 10 (C) is a perspective view showing the wafer cassette together with the housing. Is. 11 (A) is a perspective view showing the bottom surface portion of the wafer cassette, and FIG. 11 (B) is a perspective view showing the top surface portion of the wafer cassette. It is a side view which shows the example of the positional relationship between each tube arranged in the fan and the clamp part on the housing side, and a wafer. It is a figure for demonstrating the tube after joining, FIG. 13 (A) is the figure which shows the enlarged view of each tube after joining, and FIG. 13 (B) is the arrangement state of each tube after joining. It is a figure which shows schematically. It is a block diagram of the constant power control device which concerns on this embodiment. It is a flowchart of the initialization process of the constant power control device which concerns on this embodiment. It is an operation flowchart of the constant power control device which concerns on this embodiment. It is a figure which provides the operation explanation of the constant power control apparatus which concerns on this embodiment. It is a figure which provides the operation explanation of the constant power control apparatus which concerns on this embodiment.

The constant power control device according to the present embodiment is suitable for a tube joining device that joins by fusing two tubes. Hereinafter, embodiments of a tube joining device to which this constant power control device is applied will be described with reference to the drawings. The dimensional ratios in the drawings are exaggerated for convenience of explanation and may differ from the actual dimensional ratios.

FIG. 1 is a perspective view of the tube joining device according to the present embodiment. FIG. 2 is a side view of the tube joining device seen from the direction of arrow J1 shown in FIG. FIG. 3 is a side view of the tube joining device seen from the direction of arrow J2 shown in FIG. FIG. 4 is a perspective view of the tube joining device as viewed from the bottom surface side.

As shown in FIG. 13, the tube joining device 1 shown in FIG. 1 fuses the ends of each of the plurality of tubes T1 and T2, and pressurizes and joins the fused ends in a sterile state. .. In this embodiment, the tube joining device will be described through an example applied to a medical device used for joining a dialysate tube of a peritoneal dialysis solution bag and a tube on the side of the peritoneal catheter of a patient used for peritoneal dialysis. do.

Each configuration of the tube joining device 1 will be described. As shown in FIGS. 1, 2 and 3, for example, the tube joining device 1 sets the housing 2 and the tubes T1 and T2 (not shown in FIGS. 1 to 3) in the tube joining device 1. It has a tube set assisting tool 4 which is used to assist the set.

The housing 2 has an upper housing portion 2W, a lower housing portion 2V combined with the upper housing portion 2W, and an openable / closable clamp lid portion 3 provided on the upper side of the upper housing portion 2W. are doing. The housing 2 including the clamp lid portion 3 and the tube set auxiliary tool 4 are made of, for example, hard plastic, but the material and the like are not particularly limited.

The housing 2 houses each component of the tube joining device 1, as will be described later. The clamp lid portion 3 is arranged on the upper part of the housing 2.

The tube set auxiliary tool 4 is detachably attached to the housing 2. The housing 2 and the clamp lid portion 3 can be configured, for example, in a bright color having a relatively high lightness, specifically, a cream color or a white color. Further, in order to enable the user (person or patient who actually uses the tube joining device 1) to visually and clearly distinguish each of the housing 2, the clamp lid portion 3, and the tube set assisting tool 4. , The tube set aid 4 can be configured, for example, in orange.

As shown in FIGS. 1 to 4, the housing 2 is composed of a case having a bottom surface portion 2A, a front surface portion 2B, a right side surface portion 2C, a left side surface portion 2D, a back surface portion 2E, and an upper surface portion 2F. ing. As shown in the figure, this case has a chamfered substantially rectangular parallelepiped shape.

As shown in FIG. 4, installation members 2G are attached to the four corners of the bottom surface portion 2A, respectively. These installation members 2G can be made of, for example, a circular plastic or rubber non-slip member. The tube joining device 1 having a relatively large weight is placed so as not to slip on an installation surface such as a desk surface by using these installation members 2G. As a result, it is possible to prevent the tube joining device 1 from being displaced during the work of joining the tubes T1 and T2, and the joining work can be carried out in a stable state.

For example, a lid member 2H for battery replacement can be provided on the bottom surface portion 2A. The lid member 2H can be detachably attached by a fixing member such as a screw 2I. If the screw 2I is removed and the lid member 2H is removed, the battery BA shown by the broken line in FIG. 4 can be replaced. The lid member 2H can be arranged, for example, closer to the back surface portion 2E than the front surface portion 2B. Further, the lid member 2H is arranged at a position away from the exhaust opening 6 of the fan FN.

As shown in FIG. 4, a voice opening 5 and an exhaust opening 6 are formed on the bottom surface 2A. The audio opening 5 and the exhaust opening 6 are formed, for example, between the battery replacement lid member 2H and the front surface portion 2B.

The audio opening 5 is composed of a plurality of elongated through holes 5A, and the exhaust opening 6 is composed of a plurality of elongated through holes 6A.

A speaker SP and a fan FN as an exhaust device are arranged inside the bottom surface portion 2A as shown by a broken line. This fan FN also has a function as a cooling fan for cooling the wafer WF after the joining operation is completed.

The voice opening 5 is provided to output voice guidance, warning sounds, and the like generated by the speaker SP to the outside of the housing 2. As a result, the user can clearly hear the voice guidance and the warning sound generated by the speaker SP.

The exhaust opening 6 is provided to forcibly discharge the heat generated inside the housing 2 and the gas passing through the inside to the outside of the housing 2 by operating the cooling fan FN. As a result, the heat inside the housing 2 and the gas passing through the inside can be discharged to the outside of the housing 2 from the bottom surface portion 2A side instead of the side surface portions 2C and 2D.

As shown in FIG. 4, a plurality of ribs 2J are also formed parallel to the Y direction on the bottom surface portion 2A of the housing 2. These ribs 2J have a function as a guide portion when the tube set assisting tool 4 is detachably attached to the housing 2.

Next, the operation panel unit 7 and the display unit 8 will be described with reference to FIG.

FIG. 5A shows an operation panel portion 7 provided on the front surface portion 2B side of the housing 2 shown in FIG. FIG. 5B shows a display unit 8 provided on the upper surface portion 2F of the housing 2 shown in FIG.

The operation panel unit 7 shown in FIG. 5A includes a [power switch] button 7B, a [power] lamp 7C, a [charging] lamp 7D, a [joint] button 7E, and a [join] lamp 7F. It has a [wafer take-out] lamp 7G.

The [Power] lamp 7C, [Charging] lamp 7D, [Joining] lamp 7F, and [Wafer take-out] lamp 7G are lamps for displaying various states in the operation panel unit 7. Each lamp can be composed of, for example, a green LED (light emitting diode) lamp.

The [power switch] button 7B is a button pressed to turn on the tube joining device 1. The [power] lamp 7C is turned on by pressing the [power switch] button 7B.

The [Join] button 7E is used to perform a fusing-joining operation in which the user blows the ends of the tubes T1 and T2 (see FIG. 13), and then replaces the ends of the tubes T1 and T2 to perform pressure joining. A button to press to get started. The [Join] lamp 7F is turned on when the [Join] button 7E is pressed. Further, the [joining] lamp 7F can be configured to blink in order to warn the user that the tube joining device 1 is in a failed state when the tube joining device 1 fails.

The [Charging] lamp 7D lights up when the battery BA shown in FIG. 4 is being charged from the commercial AC power supply side.

The [wafer take-out] lamp 7G lights up or blinks when the joining of the tubes T1 and T2 is completed and the user can take out the used wafer WF from the housing 2 and discharge the used wafer WF.

The display unit 8 shown in FIG. 5B includes a [cover close] lamp 8B, a [wafer cassette replacement] lamp 8C, a [wafer defective] lamp 8D, a [charge required] lamp 8E, and a [room temperature unsuitable] lamp. It has an 8F and a [device failure] lamp 8G.

[Device failure] The lamp 8G is a warning lamp for notifying that the tube joining device 1 has failed. [Device failure] The lamp 8G can be configured by, for example, a red LED lamp. The other lamps are configured as alarm indicator lamps and can be configured with, for example, a yellow LED lamp.

With reference to FIGS. 1 and 2 again, the side surface portion 2C of the housing 2 is provided with a wafer cassette insertion portion 20 and a wafer cassette eject button 21.

The wafer cassette insertion portion 20 is configured by a rectangular opening for inserting the wafer cassette WC shown in FIG. 1 in a detachable manner. With the wafer cassette WC inserted into the housing 2 through the wafer cassette insertion portion 20, the user pushes the wafer cassette eject button 21 with his or her finger. As a result, the wafer cassette WC can be taken out of the housing 2 through the wafer cassette insertion portion 20. The wafer cassette WC is composed of a container containing a plurality of wafer WFs used for fusing each tube T1 and T2.

As shown in FIG. 3, a volume adjusting volume 22 and a voice message changeover switch 23 are provided on the left side surface portion 2D of the housing 2.

The user can adjust the volume of the voice message according to his / her preference by sliding the volume adjustment volume 22. Further, when the user slides the voice message changeover switch 23 from, for example, the "absent" state to the "yes" state, a predetermined voice message can be output from the speaker SP shown in FIG. If the user sets the voice message changeover switch 23 to, for example, "none", the speaker SP can output, for example, a predetermined buzzer sound.

Next, the clamp lid portion 3 arranged in the housing 2 will be described.

As shown in FIG. 1, the clamp lid portion 3 can be arranged, for example, between the operation panel portion 7 and the display portion 8.

FIG. 6 is a perspective view showing the housing 2 in a state where the clamp lid portion 3 is opened in the direction of the arrow RT shown in FIG.

As shown in FIG. 6, the clamp lid portion 3 has a clamp plate 30, a clamp operation portion 31, and a covering cover 32.

The clamp operation unit 31 is used when the user opens and closes the clamp lid portion 3 with his / her fingers. The clamp operation unit 31, the clamp plate 30, and the covering cover 32 can be easily visually distinguished from each other. For this purpose, for example, the clamp operating portion 31 can be colored green, and the clamp plate 30 and the covering cover 32 can be colored, for example, cream or white.

As shown in FIG. 1, a confirmation sticker 30S schematically showing the insertion state of each tube T1 and T2 can be attached to the surface of the clamp plate 30. When using the tube joining device 1, the user can visually check the confirmation seal 30S to easily determine whether or not each tube T1 and T2 is correctly sandwiched between the clamp lid portion 3 and the housing side clamp portion 50. Can be confirmed.

As shown in FIGS. 1 and 6, the clamp plate 30 of the clamp lid 3 can be opened from the closed state shown in FIG. 1 to an angle exceeding 90 degrees shown in FIG. 6 with the central axis CL as the center. It is attached to the housing 2.

The covering cover 32 of the clamp lid portion 3 is attached to the housing 2 so as to be rotatable about the central axis CL1. The protrusion 32T provided on the covering cover 32 is fitted in the guide groove 30R provided on the clamp plate 30. By providing the protrusion 32T and the guide groove 30R, the covering cover 32 moves the clamp plate 30 when the clamp plate 30 opens to an angle exceeding 90 degrees shown in FIG. 6 about the central axis CL with respect to the housing 2. It works so that it can be lifted following.

As shown in FIGS. 1 and 6, the clamp operation portion 31 is attached to the tip portion 30D of the clamp plate 30 via a predetermined pin (not shown). The clamp operation unit 31 is pivotally supported by this pin so that it can rotate about the central axis CL2.

As shown in FIG. 6, the clamp operation unit 31 has a pair of engaging claws 31M arranged at predetermined intervals in the width direction. A pair of protrusions 33 arranged at predetermined intervals in the width direction are attached to the housing 2. Each engaging claw 31M of the clamp operating portion 31 is configured to be able to be hooked and fixed to each protruding portion 33 of the housing 2.

As shown in FIG. 6, when the user holds the clamp operation portion 31 with a finger and rotates it in the direction of the arrow RS about the central axis CL with the clamp lid portion 3 open, as shown in FIG. , The clamp plate 30 covers the housing side clamp portion 50 from above. Then, when the user holds the clamp operation unit 31 with his / her finger and rotates it in the direction of the arrow RG about the central axis CL2, the pair of engaging claws 31M shown in FIG. 6 are formed at the corresponding positions of the housing 2. It is meshed with the protruding portion 33. As a result, the clamp lid portion 3 closes the housing side clamp portion 50 provided in the housing 2 from the upper side.

As shown in FIGS. 6 and 7, an outlet 58 for feeding the wafer WF used for fusing is provided in the vicinity of the operation panel portion 7 of the housing 2. The take-out port 58 is arranged on an extension of a predetermined gap 57 (see FIG. 7) through which the wafer WF passes. Since the take-out port 58 is provided on the extension of the gap 57, the user can easily pick up the wafer WF guided to the take-out port 58 with a finger and take it out.

As shown by the broken line portion (enlarged view) in FIG. 7, a circular hole 59 is formed in the vicinity of the take-out port 58. Further, a rod-shaped interlock 60 is arranged in the circular hole 59.

The interlock 60 is composed of, for example, a rod of an electromagnetically driven solenoid 61. The solenoid 61 rises in the Z1 direction shown by the solid line from the state shown by the broken line in FIG. 7 by the command transmitted from the control unit 100. The raised interlock 60 presses the front end portion of the clamp operating portion 31. As a result, for example, while the tubes T1 and T2 are fused and joined, the clamp lid portion 3 can be prevented from opening and can be more reliably maintained in the closed state.

The solenoid detection sensor 89 shown in FIG. 7 can be composed of, for example, a photocoupler having a light emitting unit 89A that emits light 89L and a light receiving unit 89B that can receive light 89L. The solenoid detection sensor 89 detects the open / closed state of the clamp lid portion 3. The detection result is transmitted to the control unit 100 (see FIG. 9).

FIG. 8 is a perspective view showing a schematic arrangement example of the components arranged in the housing 2 of the tube joining device 1.

As shown in FIG. 8, the main board 80, the DC input board 81, the wafer cassette storage unit 82, the wafer feed unit 83, the movable clamp unit 71, the solenoid 61, the speaker SP, the fan FN, and the battery are contained in the housing 2. BA is housed.

It is preferable that the DC input board 81 is arranged at a position as far as possible from the main board 80, for example. This is to prevent noise from the DC input board 81 from affecting the circuit elements mounted on the main board 80.

Next, with reference to FIG. 9, the function of the control unit 100 of the tube joining device 1 will be described. FIG. 9 shows an electric block of the tube joining device 1.

The tube joining device 1 has a control unit 100 that controls the operation of each part of the device. The control unit 100 includes a CPU such as a microcomputer, a ROM for storing control programs and various data of the entire device executed by the CPU, and a RAM for temporarily storing measurement data and various data as a work area. There is.

The control unit 100 receives power from the battery BA on the DC input board 81 side. The DC input board 81 has a jack 84 and a changeover switch 85. The jack 84 receives a predetermined DC power source converted from AC / DC from a commercial AC power source by being connected to the connection pin 86P of the charger 86. The charger 86 and the jack 84 are also shown in FIG.

The changeover switch 85 connects the jack 84 and the battery BA. The DC power supply from the charger 86 is used to charge the battery BA. Then, the DC power supply charged in the battery BA is supplied to the control unit 100.

A temperature sensor 87 such as a thermistor is electrically connected to the control unit 100. The temperature sensor 87 detects the ambient temperature (outside air temperature) around the housing 2 and supplies the outside air temperature information TF to the control unit 100. The control unit 100 refers to the outside air temperature information TF when heating each tube T1 and T2, and for example, when each outside air temperature is lower than a predetermined temperature, the control unit 100 sets the heating time of each tube T1 and T2. Execute processing such as lengthening. Further, the control unit 100 controls the operation so as to notify the patient of the environmental temperature by the speaker SP, for example.

As shown in FIG. 9, the [power switch] button 7B, the [joint] button 7E, and the lamps 7C, 7D, 7F, and 7G of the operation panel unit 7 shown in FIG. 5A are control units 100. Is electrically connected to.

The speaker SP is electrically connected to the control unit 100 via the voice synthesis unit 88. The speaker SP emits voice guidance or the like predetermined by a command from the control unit 100.

The volume adjustment volume 22 and the voice message changeover switch 23 are electrically connected to the control unit 100. When the voice message changeover switch 23 is "Yes", the voice guidance can be output from the speaker SP, and when the voice message changeover switch 23 is "No", a buzzer (not shown) can be sounded.

As shown in FIG. 9, the [cover close] lamp 8B, the [wafer cassette replacement] lamp 8C, the [wafer defective] lamp 8D, and the [charge required] lamp 8E of the display unit 8 shown in FIG. 5 (B), respectively. The [room temperature inappropriate] lamp 8F and the [device failure] lamp 8G are configured to light or blink according to a command from the control unit 100.

As shown in FIG. 9, the solenoid 61 of the interlock 60 shown in FIG. 7 is operated by a command of the control unit 100. Specifically, as illustrated in FIG. 7, when the interlock 60 of the solenoid 61 is at the lower end position 60L, the interlock 60 blocks the light 89L from the light emitting unit 89A as shown by the broken line. Therefore, the light receiving unit 89B transmits a "signal that the clamp lid portion 3 is not interlocked" to the control unit 100. On the other hand, when the interlock 60 of the solenoid 61 is at the upper end position 60H, the interlock 60 does not block the light 89L from the light emitting unit 89A as shown by the solid line. Therefore, the light receiving unit 89B transmits a "signal that the clamp lid portion 3 is interlocked" to the control unit 100. As a result, the control unit 100 grasps the locked state or the unlocked state of the clamp lid portion 3.

The Hall sensor 90 of the housing-side clamp unit 50 is electrically connected to the control unit 100, and is configured to transmit the detection result to the control unit 100. As shown in FIG. 12, when the tube T1 and the tube T2 are sequentially fitted into the fitting groove 52C between the first protrusion 52A and the second protrusion 52B, the tube T1 and the tube T2 resist the force of the spring 92. The tube detection pin 75 is pushed in the Z2 direction. By this pushing, the tube detection pin 75 is lowered, so that the magnetic force of the magnet 91 is detected by the Hall sensor 90. Then, the hall sensor 90 transmits a signal to the control unit 100 to notify that "each tube T1 and T2 are correctly fitted". If the tube T1 and the tube T2 are not sufficiently fitted in the fitting groove 52C, or if only one of the tubes is fitted, the Hall sensor 90 cannot detect the magnetic force of the magnet 91. At this time, the Hall sensor 90 transmits a signal to the control unit 100 to notify that "each tube T1 and T2 are not correctly fitted".

The housing side clamp portion 50 has a micro switch 93. The micro switch 93 is a sensor that detects the open / closed state of the clamp lid portion 3. As shown in FIG. 6, the micro switch 93 clamps as shown in FIG. 1 when the clamp operating portion 31 of the clamp lid portion 3 is held by a finger and rotated around the central axis CL in the direction of arrow RS. It is detected that the plate 30 has closed the clamp portion 50 on the housing side. The micro switch 93 may include, for example, a mechanical sensor that detects when the clamp portion 50 on the housing side is closed by abutting against an arbitrary position of the housing 2, or the housing side. It is possible to use a known sensor such as an electric sensor that detects that the clamp portion 50 is closed based on the position of the clamp portion 50.

The wafer cassette storage unit 82 has a wafer presence / absence sensor 101 and a wafer remaining amount detection sensor 102. The wafer presence / absence sensor 101 is a sensor that detects whether or not a wafer WF remains in the wafer cassette WC shown in FIG. The wafer remaining amount detection sensor 102 is a sensor that detects how many wafers WF remain in the wafer cassette WC shown in FIG. 1, that is, the number of remaining wafers WF. For the wafer presence / absence sensor 101 and the wafer remaining amount detection sensor 102, for example, a known photo sensor or the like can be used.

The wafer feed unit 83 is a unit that linearly moves the wafer WF in the wafer cassette WC to a predetermined standby position PS1. The wafer feed unit 83 includes a motor 103, a motor drive 104, a forward end sensor 105, an intermediate sensor 106, and a reverse end sensor 107. When the motor drive 104 receives a command from the control unit 100, the motor drive 104 drives the motor 103 to linearly move the wafer WFs in the wafer cassette WC one by one to the standby position PS1.

The control unit 100 is electrically connected to each of a wafer heater 110, a motor drive 111, a cam motor sensor 112, a clamp motor sensor 113, a wafer current detection unit 115, a wafer voltage detection unit 116, and a fan FN. When the motor drive 111 receives a command from the control unit 100, the motor drive 111 drives a cam motor 117 and a clamp motor 56 in order to blow and join the tubes T1 and T2.

The cam motor 117 performs an operation of moving the wafer WF up and down and an operation of bringing the two tubes T1 and T2 closer together. The operation of moving the wafer WF up and down by the cam motor 117 is to raise the wafer WF from the standby position PS1 to the fusing position PSm located above it, and conversely, to move the wafer WF from the fusing position PSm to the standby position. It is an operation of lowering to PS1. Further, the cam motor 117 performs an operation of bringing the tubes T1 and T2 together after fusing the tubes T1 and T2. This pulling operation means that after the wafer WF is lowered from the fusing position PSm to the standby position PS1 to stand by, the fusing end of the first tube T1 and the fusing end of the second tube T2 are placed on the other tube. It is an operation of pressure-bonding by bringing each of the fused ends closer to each other.

The clamp motor 56 rotates the movable clamp unit 71 by 180 degrees and returns after rotating by 180 degrees.

The cam motor sensor 112 includes, for example, a photo sensor that detects a cam position and an origin. The clamp motor sensor 113 is composed of, for example, a photo sensor that detects the origin of the movable clamp unit 71 during rotation.

The wafer heater 110 is provided to heat the wafer WF in response to a command from the control unit 100. At the time of energization, the wafer current detection unit 115 detects the current value supplied to the wafer heater 110. Further, the wafer voltage detection unit 116 detects the voltage value supplied to the wafer heater 110.

Next, the wafer cassette storage unit 82 and the wafer cassette WC will be described with reference to FIGS. 10 and 11.

FIG. 10 shows the wafer cassette insertion portion 20 of the housing 2, the peripheral portion of the wafer cassette eject button 21, and the wafer cassette WC. 11 (A) is a perspective view showing the lower surface side of the wafer cassette WC, and FIG. 11 (B) is a perspective view showing the upper surface side of the wafer cassette WC.

The wafer cassette insertion unit 20 and the wafer cassette eject button 21 are arranged in the wafer cassette storage unit 82 shown in FIG.

As shown in FIG. 10A, the upper surface portion 120 of the wafer cassette WC is provided with an arrow 21Y indicating the insertion direction. The user inserts the wafer cassette WC into the wafer cassette insertion portion 20 as shown in FIG. 10 (B) according to the arrow 21Y. After that, when the wafer WF in the wafer cassette WC disappears due to the use of the wafer WF, the user presses the wafer cassette eject button 21 with a finger as shown in FIG. 10 (C). As a result, the empty wafer cassette WC can be taken out from the wafer cassette insertion unit 20.

As shown in FIGS. 11A and 11B, the wafer cassette WC is configured as a container for accommodating a plurality of wafer WFs. The wafer cassette WC is preferably made of clear plastic so that the wafer WF inside can be visually confirmed.

The wafer cassette WC is composed of an upper surface portion 120, a bottom surface portion 121, a front surface portion 122, side surface portions 123 and 124, and a back surface portion 125.

Wafers WF are arranged one by one inside the front portion 122. Then, as shown in FIG. 11B, by pressing the extrusion member 126 against the wafer WF in the Y1 direction, one wafer WF is formed one by one from the inside of the wafer cassette WC along the Y1 direction. Is pushed out to the predetermined standby position PS1.

As shown in FIGS. 11A and 11B, two springs 128 and a spring receiving member 129 are housed inside the wafer cassette WC. Each end of each of the two springs 128 is supported by the inner surface of the back surface 125 of the wafer cassette WC. On the other hand, the other ends of the two springs 128 are supported by the spring receiving member 129. The spring receiving member 129 has a misalignment prevention portion 130 for preventing the springs 128 from misaligning.

The two springs 128 press the plurality of wafers WF against the inner surface of the front surface portion 122 via the spring receiving member 129. With each wafer WF held by the two springs 128, the extrusion member 126 is pressed against the wafer WF located on the front portion 122 side in the Y1 direction. As a result, only one wafer WF located on the outermost side is taken out from the wafer cassette WC along the Y1 direction.

As shown in FIG. 11A, the wafer WF used as the cutting member is a copper metal plate (thickness) formed in a substantially rectangular shape that can be heated by the wafer heater 110 (see FIGS. 9 and 12). : About 0.3 mm, width: about 34 mm, height about 13 mm). The wafer WF has two contacts 131 for enabling energization of the wafer heater 110 when it is arranged in the standby position .

Next, the tube set assisting tool 4 will be described.

The tube set auxiliary tool 4 can be attached to the housing 2 by the user as needed. As shown in FIG. 10C, the tube set assisting tool 4 has a guide function for easily performing the work of holding the tubes T1 and T2 in the housing 2.

As shown in FIGS. 2, 3 and 4, the tube set assisting tool 4 has a first side portion 135, a second side portion 136, and a back surface connecting portion 137.

As shown in FIG. 2, the first side portion 135 has a claw portion 135A, a branch portion 135B, and a 135C. The claw portion 135A is configured to be attachable to a peripheral portion of the operation panel portion 7 of the housing 2.

As shown in FIG. 3, the second side portion 136 has a claw portion 136A, a branch portion 136B and 136C, and a U-shaped receiving portion 138 for receiving the tube. The claw portion 136A is configured to be attachable to a peripheral portion of the operation panel portion 7 of the housing 2. As shown in FIG. 10C, the receiving portion 138 receives the tubes T1 and T2, respectively. Further, as shown in FIG. 3, by providing a space between the branch portion 136B and the branch portion 136C, the volume adjustment volume 22 can be exposed, and the volume adjustment volume 22 can be easily operated by the user. Has been done.

As shown in FIG. 4, the back surface connecting portion 137 of the tube set auxiliary tool 4 has a first connecting portion 137A and a second connecting portion 137B. An opening 137C through which the installation member 2G is passed is formed in the first connecting portion 137A. The second connecting portion 137B is provided with a protrusion 137D that matches the height of the installation member 2G. As a result, the housing 2 can be installed in a state of being floated by a predetermined interval, for example, with respect to a desk surface or the like by the four installation members 2G and the two protrusions 137D.

Between the first connecting portion 137A and the second connecting portion 137B of the tube set auxiliary tool 4, the audio opening 5 and the exhaust opening 6 are exposed, and the exhaust opening of the fan FN which is an exhaust device is exposed. An open portion 144 is formed to open the 6 and the audio opening 5 for the speaker SP. Therefore, the fan FN can surely release the gas and heat inside the housing 2 to the outside of the housing 2 through the exhaust opening 6. Further, since the voice guidance and the warning sound generated by the speaker SP can be reliably output to the outside of the housing 2 through the voice opening 5, the voice guidance and the warning sound can be easily heard without being muffled.

Next, with reference to FIG. 12, the positional relationship between the fan FN, the tubes T1 and T2 in the housing-side clamp portion 50, and the wafer WF will be described.

FIG. 12 schematically shows a state before and after cutting each of the tubes T1 and T2 fixed and held by the clamp lid portion 3 and the housing side clamp portion 50 by the wafer WF delivered from the wafer cassette WC.

The wafer WF is fed from the wafer cassette WC in the Y1 direction by operating the wafer feed unit 83 shown in FIG. 8, and is arranged in the standby position PS1.

As shown in FIG. 12, when the wafer WF is arranged in the standby position PS1, the two contacts 131 of the wafer WF are connected to the wafer heater 110, enabling the wafer heater 110 to be energized. To. Then, the wafer heater 110 is energized via the contact 131 according to the command of the control unit 100 to generate heat. The wafer WF is heated by the wafer heater 110 by this heat generation. A fan FN is arranged below the wafer WF to be heated.

As shown in FIG. 12, the tubes T1 and T2 are fused by the wafer WF when the wafer WF rises from the standby position PS1 to the fusing position PS2. At this time, the plasticizer that is a constituent material of each tube T1 and T2 is vaporized to generate gas. The gas is discharged to the outside of the housing 2 from the exhaust opening 6 of the bottom surface 2A along the discharge path indicated by the arrow MY by the rotary-driven fan FN. Therefore, even if the plastic product or the like is placed near the housing 2, the plasticizer gas is not directly sprayed on the plastic product, so that there is no adverse effect such as a part of the plastic product melting. ..

FIG. 14 is a block diagram of the constant power control device according to the present embodiment. The block diagram of FIG. 14 is created by extracting only the portion related to the heating of the wafer WF from the block diagram of the control system of the tube joining device 1 shown in FIG.

The constant power control device 200 includes a battery BA, a control unit 100, a wafer heater 110, a detection unit 140, a DC-DC converter 150, a monitoring unit 160, a switch 170, and a backflow prevention diode 180.

The battery BA supplies electric power to the control unit 100, the DC-DC converter 150, and the wafer heater 110.

The DC-DC converter 150 converts the input voltage Vin from the battery BA into DC-DC according to the target voltage DAC output from the control unit 100, and outputs the output voltage Vout. The output voltage Vout of the DC-DC converter 150 is applied to the wafer heater 110, which is a load, via the switch 170.

The monitoring unit 160 is provided to monitor whether or not the output voltage Vout of the DC-DC converter 150 matches the target voltage DAC output from the control unit 100. The monitoring unit 160 is composed of two voltage dividing resistors R1 and R2. The voltage dividing voltage V_ADI1 at the connection point between the voltage dividing resistors R1 and R2 is proportional to the output voltage Vout of the DC-DC converter 150. The voltage dividing voltage V_ADI1 is fed back to the control unit 100. Therefore, the control unit 100 can recognize whether or not the target voltage DAC instructed by the control unit 100 is output from the DC-DC converter 150 by monitoring the voltage dividing voltage V_ADI1. In addition to confirming that the specified target voltage DAC is output to the voltage dividing resistors R1 and R2, input for calculating the correction value when the specified target voltage DAC is different from the specified target voltage DAC. Also used as.

The detection unit 140 detects the voltage V_ADI2 applied to the wafer heater 110 and the current I_ADI flowing through the wafer heater 110. As for the voltage V_ADI2 applied to the wafer heater 110, the wafer voltage detection unit 116 detects the voltage between the terminals of the wafer heater 110. The current I_ADI flowing in the wafer heater 110 is detected by the wafer current detection unit 115 by changing the current flowing in the wafer heater 110 into the voltage between the terminals of the resistor R3. The voltage V_ADI2 applied to the wafer heater 110 and the current I_ADI flowing through the wafer heater 110 are fed back to the control unit 100.

A switch 170 is provided between the DC-DC converter 150 and the wafer heater 110. The switch 170 is turned on and off by the PWM signal output from the control unit 100. The control unit 100 turns on the switch 170 when the wafer heater 110 is operated.

The backflow prevention diode 180 is provided in the signal line 182 instructing the DC-DC converter 150 from the control unit 100 to the target voltage DAC. The backflow prevention diode 180 prevents the voltage output by the DC-DC converter 150 from becoming overvoltage due to a failure of the signal line 182.

The control unit 100 calculates a target voltage DAC to be output by the DC-DC converter 150 in order to operate the wafer heater 110 with a constant power based on the voltage V_ADI2 and the current I_ADI of the wafer heater 110 detected by the detection unit 140. do. Then, the target voltage DAC is output to the DC-DC converter 150.

The control unit 100 inputs the voltage dividing voltage V_ADI1 of the monitoring unit 160 so that the output voltage Vout of the DC-DC converter 150 maintains the target voltage DAC calculated by the control unit 100, and instructs the DC-DC converter 150. Is output.

The control unit 100 calculates the resistance value of the wafer heater 110 based on the voltage V_ADI2 and the current I_ADI of the wafer heater 110 detected by the detection unit 140. Then, the target voltage DAC is calculated from the target power of the wafer heater 110 and the calculated resistance value.

Next, the operation of the constant power control device according to the present embodiment will be described. FIG. 15 is a flowchart of the initialization process of the constant power control device according to the present embodiment. This flowchart is an algorithm for correction processing that absorbs the characteristic variation (temperature characteristic) of the backflow prevention diode 180.

First, the PWM output of the control unit 100 is turned off, the target voltage DAC is set to 0, and the ENA output is enabled (S100). As a result, the switch 170 is turned off, the voltage specified by the hardware is set in the DC-DC converter 150, and the DC-DC converter 150 is reset.

Wait for the enable to stabilize (S101). That is, wait until the DC-DC converter 150 is completely reset.

The control unit 100 minimizes the output of the DAC (S102). At this time, the output of the DC-DC converter 150 becomes maximum. The PWM output of the control unit 100 is turned ON (S103). As a result, the switch 170 is turned on, and the output voltage Vout of the DC-DC converter 150 is applied to the wafer heater 110. Next, it waits for the output of the DC-DC converter 150 to stabilize (S104). The control unit 100 inputs the voltage V_ADI2 and the current I_ADI of the wafer heater 110 detected by the detection unit 140 (S105).

The PWM output of the control unit 100 is turned off (S106). As a result, the switch 170 is turned off. The control unit 100 maximizes the output of the DAC (S107). At this time, the output of the DC-DC converter 150 becomes the minimum. The PWM output of the control unit 100 is turned ON (S108). As a result, the switch 170 is turned on, and the output voltage Vout of the DC-DC converter 150 is applied to the wafer heater 110. Next, it waits for the output of the DC-DC converter 150 to stabilize (S109). The control unit 100 inputs the voltage V_ADI2 and the current I_ADI of the wafer heater 110 detected by the detection unit 140 (S110).

The PWM output of the control unit 100 is turned off (S111). As a result, the switch 170 is turned off. The control unit 100 calculates the resistance value of the wafer heater 110 from the voltage V_ADI2 and the current I_ADI of the wafer heater 110 input in steps S105 and S110. Then, the target voltage DAC is calculated from the target power of the wafer heater 110 and the calculated resistance value of the wafer heater 110 (S112).

The control unit 100 calculates the control width of the output voltage Vout of the DC-DC converter 150 from the voltage V_ADI2 of the wafer heater 110 input in steps S105 and S110. The amount of voltage change per digit of this control width is calculated. The initial value of the target voltage value DAC is calculated from the calculated target voltage value DAC and the amount of voltage change (S113). Then, the control unit 100 outputs the calculated initial value of the target voltage DAC (S114).

By performing the above initialization processing, the characteristic variation (temperature characteristic) of the backflow prevention diode 180 is absorbed, and the control unit 100 can accurately output the output voltage Vout from the DC-DC converter 150.

FIG. 16 is an operation flowchart of the constant power control device according to the present embodiment.

After the control unit 100 outputs the ENA signal HI and instructs the DC-DC converter 150 to enable it, it waits for the DC-DC converter 150 to stabilize for T1 sec (S200). After waiting for a certain period of time, the control unit 100 outputs the DC value of the initial value calculated by the DC-DC converter 150 (S201).

After waiting for a certain period of time, the control unit 100 inputs the voltage V_ADI2 and the current I_ADI of the wafer heater 110 detected by the detection unit 140 (S202). Further, after waiting for a certain period of time, the voltage V_ADI2 and the current I_ADI of the wafer heater 110 detected by the detection unit 140 are input (S203). Further, after waiting for a certain period of time, the voltage V_ADI2 and the current I_ADI of the wafer heater 110 detected by the detection unit 140 are input (S204).

In this way, the control unit 100 detects the voltage V_ADI2 and the current I_ADI of the wafer heater 110 a plurality of times by the detection unit 140.

The control unit 100 calculates the average value of the voltage V_ADI2 and the current I_ADI of the wafer heater 110 input three times (S205). The control unit 100 calculates the next target voltage DAC (S206), stabilizes the output of the target voltage DAC (S207), and stabilizes the voltage V_ADI2 of the wafer heater 110 from the detection unit 140 and the current I_ADI. Wait (S208).

If the tube joining is not completed (S209: NO), the processes from steps S201 to S208 are repeated, and when the tube joining is completed (S209: YES), the process is terminated.

As described above, the constant power control device 200 according to the present embodiment performs initialization processing in order to absorb variations in the temperature and voltage drop characteristics of the backflow prevention diode 180, and is a target for performing constant power control. Calculate the voltage DAC. Then, the wafer heater 110 is driven by the calculated target voltage DAC with a constant power.

FIG. 17 is a diagram for explaining the operation of the constant power control device according to the present embodiment.

When raising the temperature of the wafer heater 110, the constant power control device 200 according to the present embodiment changes the target voltage DAC so that 20 W of constant power is supplied to the wafer heater 110, as shown in the figure. Further, when cutting the tube, the target voltage DAC is changed so that a constant power of 23 W is supplied to the wafer heater 110. Further, when joining and separating the tubes, the target voltage DAC is changed so that a constant power of 18 W is supplied to the wafer heater 110.

How the control unit 100 changes the target voltage DAC is as shown in the operation flowchart of FIG.

FIG. 18 is a diagram for explaining the operation of the constant power control device 200 according to the present embodiment. The figure shown on the upper side of FIG. 18 shows the change state of the current when the constant power control is performed by using the conventional PWM control. The figure shown on the lower side of FIG. 18 shows the change state of the current when the constant power control is performed by using the constant power control device 200 according to the present embodiment.

In the conventional PWM control, as shown in the upper diagram of FIG. 18, the current is repeatedly turned on and off with time, and the current changes drastically when the constant power control is performed. Therefore, the battery BA is heavily burdened.

However, in the constant power control device 200 according to the present embodiment, since the constant power control is performed by fluctuating the target voltage DAC, the current does not change suddenly, and a large current is instantaneously supplied from the battery BA. There is no such thing. Therefore, the battery BA can be discharged to a sufficient discharge depth, and the capacity of the battery BA can be effectively utilized. Further, the selection range of the battery BA such as the type and capacity of the battery BA is expanded.

Although the constant power control device 200 according to the present invention has been described above through the tube joining device 1, the present invention is not limited to the configuration described in the embodiment, and is appropriately modified based on the description of the claims. It is possible.

For example, the constant power control device 200 according to the present invention can be applied not only to the tube joining device 1 but also to any electric device that generates heat.

1 Tube joining device,
100 control unit,
110 wafer heater,
115 Wafer current detector,
116 Wafer voltage detector,
140 detector,
150 DC-DC converter,
160 Monitoring Department,
170 switch,
180 Backflow prevention diode,
182 signal line,
200 constant power controller,
R1 to R3 resistors,
BA battery.

Claims (4)

It is a constant power control device applied to a tube joining device in which each end of a plurality of tubes is fused by a wafer and the fused ends are pressurized and joined to each other.
A DC-DC converter that outputs a voltage applied to a wafer heater provided for heating the wafer, and a DC-DC converter.
A detector that detects the voltage applied to the wafer heater and the current flowing through the wafer heater, and
Based on the average value of the voltage and current of the wafer heater detected by the detector a plurality of times at regular intervals, the target voltage to be output by the DC-DC converter in order to operate the wafer heater with constant power is set. It has a control unit that calculates and outputs different target voltages to the DC-DC converter when raising the temperature of the wafer heater, cutting the tube, and joining / separating the tube. , Constant power control device for tube joining device. Further, it has a monitoring unit that monitors the voltage output by the DC-DC converter.
The control unit outputs an instruction to the DC-DC converter via a signal line so that the voltage output by the DC-DC converter maintains the target voltage calculated by the control unit. Item 1. The constant power control device for the tube joining device according to Item 1. The control unit calculates the resistance of the wafer heater based on the voltage and current of the wafer heater detected by the detection unit, and the target voltage is calculated from the target power of the wafer heater and the calculated resistance. The constant power control device for the tube joining device according to claim 1. Further, a switch is provided between the DC-DC converter and the wafer heater.
The constant power control device for a tube joining device according to claim 1, wherein the control unit turns on the switch when the wafer heater is operated.

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