JP7050627B2 - Printed circuit board division device, printed circuit board division holding jig, printed circuit board division method, and manufacturing method of printed circuit board - Google Patents

Description

The present invention relates to a printed circuit board dividing device, a holding jig for dividing a printed circuit board, a method for dividing a printed circuit board, and a method for manufacturing a printed circuit board.

Japanese Unexamined Patent Publication No. 7-231148 (Patent Document 1) discloses a substrate dividing device and a method for dividing a circuit board using the substrate dividing device. The board dividing device includes a board holding mechanism, a board receiving portion, a cutting blade, and a movable body. The circuit board includes a component mounting area in which electronic components are mounted and a component non-mounting area in which electronic components are not mounted. The circuit board is clamped by the board holding mechanism and the board receiving portion. Align the cutting blade with the dividing line of the circuit board. A movable body is used to press the component non-mounting area of the circuit board. In this way, the circuit board is divided along the dividing line.

Japanese Unexamined Patent Publication No. 7-231148

In the substrate dividing device disclosed in Patent Document 1 and the method for dividing a circuit board using this board dividing device, electronic components may be damaged when the circuit board is divided. The present invention has been made in view of the above problems, and an object thereof is a printed circuit board dividing device, a printed circuit, which can prevent electronic components from being damaged when the printed circuit board is divided. It is an object of the present invention to provide a holding jig for dividing a board, a method for dividing a printed circuit board, and a method for manufacturing a printed circuit device.

The printed circuit board dividing device of the present invention includes a first pressing jig and a pressing member. The first holding jig includes a first surface and a first protruding portion protruding from the first surface. The first surface is configured to make surface contact with the first region of the first main surface of the printed circuit board on which the electronic component is mounted. The first protrusion includes a first surface portion configured to be in surface contact with the first side surface of the first groove of the printed circuit board. The first groove is formed on the first main surface. The first groove has a first side surface connected to the first region and a second side surface facing the first side surface. The pressing member is configured to press the second region of the first main surface connected to the second side surface.

The printed circuit board dividing holding jig of the present invention includes a first surface and a first protruding portion protruding from the first surface. The first surface is configured to make surface contact with the first region of the first main surface of the printed circuit board on which the electronic component is mounted. The first protrusion includes a first surface portion configured to be in surface contact with the first side surface of the first groove of the printed circuit board. The first groove is formed on the first main surface. The first groove has a first side surface connected to the first region and a second side surface facing the first side surface.

The printed circuit board division method of the present invention comprises clamping the printed circuit board using a first holding jig. The first holding jig includes a first surface and a first protruding portion protruding from the first surface. The first surface makes surface contact with the first region of the first main surface of the printed circuit board on which the electronic component is mounted. The first protrusion includes a first surface portion that comes into surface contact with the first side surface of the first groove of the printed circuit board. The first groove is formed on the first main surface. The first groove has a first side surface connected to the first region and a second side surface facing the first side surface. The method for dividing a printed circuit board of the present invention comprises pressing a second region of a first main surface connected to a second side surface by using a pressing member to divide the printed circuit board.

The method for manufacturing a printed circuit board of the present invention is to mount an electronic component on the first region of the first main surface of the printed circuit board and to divide the printed circuit board by the printed circuit board dividing method of the present invention. Be prepared.

In the printed circuit board dividing device, the holding jig for dividing the printed circuit board, the printed circuit board dividing method, and the manufacturing method of the printed circuit board of the present invention, when the printed circuit board is divided, the first surface of the holding jig is used. Between the first region of the first main surface of the printed circuit board, and between the first surface portion of the first protrusion of the first holding jig and the first side surface of the first groove of the printed circuit board. , The frictional force acts. When the printed circuit board is divided, this frictional force reduces the amount of deformation of the printed circuit board. The reduced amount of deformation of the printed circuit board reduces the stress applied to the electronic components when the printed circuit board is divided. In this way, it is possible to prevent the electronic components from being damaged when the printed circuit board is divided.

It is a schematic perspective view of the printed circuit board division apparatus which concerns on Embodiment 1. FIG. It is a schematic partial side view of the printed circuit board division apparatus which concerns on Embodiment 1. FIG. It is a schematic partial side view of the printed circuit board division apparatus which concerns on Embodiment 1. FIG. It is a schematic partial side view of the printed circuit board division apparatus which concerns on Embodiment 1. FIG. It is a schematic partial side view of the printed circuit board division apparatus which concerns on Embodiment 1. FIG. It is a schematic partial enlarged sectional view of the 1st holding jig which concerns on Embodiment 1. FIG. It is a schematic partial enlarged sectional view of the 2nd holding jig which concerns on Embodiment 1. FIG. It is a schematic perspective view of a printed circuit board. It is a schematic partial enlarged sectional view of a printed circuit board. It is a figure which shows the flowchart of the printed circuit board division method and the manufacturing method of a printed circuit apparatus which concerns on Embodiment 1. FIG. It is a schematic partial enlarged sectional view which shows one step of the printed circuit board division method which concerns on Embodiment 1. FIG. It is a schematic partial enlarged sectional view which shows the next process of the process shown in FIG. 11 in the printed circuit board division method which concerns on Embodiment 1. FIG. It is a schematic partial enlarged sectional view which shows the next process of the process shown in FIG. 12 in the printed circuit board division method which concerns on Embodiment 1. FIG. It is a schematic partial enlarged sectional view which shows the distribution of the deformation amount of the printed circuit board at the time of dividing a printed circuit board in the printed circuit board division method which concerns on Embodiment 1. FIG. It is a schematic partial enlarged sectional view which shows one process of the printed circuit board division method of the comparative example. It is a schematic partial enlarged sectional view which shows the distribution of the deformation amount of the printed circuit board when the printed circuit board is divided in the printed circuit board division method of the comparative example. It is a schematic partial enlarged sectional view of the 1st holding jig which concerns on the modification of Embodiment 1. FIG. It is a schematic partial enlarged sectional view of the 1st holding jig which concerns on Embodiment 2. FIG. It is a schematic partial enlarged sectional view of the 1st holding jig which concerns on Embodiment 3. FIG. It is a schematic partial enlarged sectional view of the 1st holding jig which concerns on the modification of Embodiment 3. FIG. It is a schematic partial enlarged sectional view of the 1st holding jig which concerns on Embodiment 4. FIG. It is a schematic partial enlarged sectional view of the 1st holding jig which concerns on 1st modification of Embodiment 4. FIG. It is a schematic partial enlarged sectional view of the 1st holding jig which concerns on the 2nd modification of Embodiment 4. FIG. It is a schematic partial enlarged sectional view of the 1st holding jig which concerns on 3rd modification of Embodiment 4. FIG.

Hereinafter, embodiments of the present invention will be described. The same reference number is assigned to the same configuration, and the description thereof will not be repeated.

Embodiment 1.
The printed circuit board dividing device 1 of the first embodiment will be described with reference to FIGS. 1 to 7. The printed circuit board dividing device 1 mainly includes a first pressing jig 10 and a pressing member 18. The printed circuit board dividing device 1 further includes a second holding jig 14. The printed circuit board dividing device 1 further includes a second shaft 30, a cam 32, and a gear 34. The printed circuit board dividing device 1 further includes a handle 24.

A printed circuit board 3 to be divided by using the printed circuit board dividing device 1 will be described with reference to FIGS. 8 and 9. The printed circuit board 3 includes a first main surface 4 and a second main surface 5 opposite to the first main surface 4. The base material of the printed circuit board 3 is not particularly limited, but is formed of, for example, a glass fiber impregnated with an epoxy resin or a polyimide resin, or a paper fiber impregnated with an epoxy resin or a phenol resin.

The first main surface 4 includes a first region 4a and a second region 4b. The electronic component 3e is mounted on the first region 4a. The electronic component 3e is not mounted on the second region 4b. The electronic component 3e is not particularly limited, and is, for example, a capacitor, a resistor, an inductor, an integrated circuit (IC) chip, a semiconductor module, or the like. The first groove 6 is formed on the first main surface 4. The first groove 6 is formed, for example, by moving the cutting edge relative to the printed circuit board 3 in a state where the cutting edge is in contact with the first main surface 4.

The first groove 6 is formed between the first region 4a and the second region 4b. The first groove 6 defines a first region 4a and a second region 4b. The first groove 6 extends along the first main surface 4. The first groove 6 is, for example, a V groove. The first groove 6 has a first side surface 6a and a second side surface 6b facing the first side surface 6a. The first side surface 6a is connected to the first region 4a. The second side surface 6b is connected to the second region 4b. The depth of the first groove 6 is, for example, one-fourth or more of the thickness of the printed circuit board 3. The depth of the first groove 6 is, for example, one-third or less of the thickness of the printed circuit board 3.

The second main surface 5 includes a third region 5a on the opposite side of the first region 4a and a fourth region 5b on the opposite side of the second region 4b. The second groove 7 is formed on the second main surface 5. The second groove 7 is formed, for example, by moving the cutting edge relative to the printed circuit board 3 in a state where the cutting edge is in contact with the second main surface 5.

The second groove 7 is formed between the third region 5a and the fourth region 5b. The second groove 7 defines a third region 5a and a fourth region 5b. The second groove 7 extends along the second main surface 5. The second groove 7 is, for example, a V groove. The second groove 7 has a third side surface 7a and a fourth side surface 7b facing the third side surface 7a. The third side surface 7a is connected to the third region 5a. The fourth side surface 7b is connected to the fourth region 5b. The depth of the second groove 7 is, for example, one-fourth or more of the thickness of the printed circuit board 3. The depth of the second groove 7 is, for example, one-third or less of the thickness of the printed circuit board 3.

In the plan view of the first main surface 4 of the printed circuit board 3, the second groove 7 overlaps with the first groove 6. In the plan view of the first main surface 4 of the printed circuit board 3, the second corner portion of the second groove 7 (for example, the tip portion of the V groove) is the first corner portion of the first groove 6 (for example, V). It overlaps with the tip of the groove). The first corner portion of the first groove 6 and the second corner portion of the second groove 7 serve as a starting point for division of the printed circuit board 3 when the printed circuit board 3 is divided.

With reference to FIG. 6, the first holding jig 10 includes a first surface 11 at its tip. The first holding jig 10 further includes a first protruding portion 12 protruding from the first surface 11. The first surface 11 is configured to be in surface contact with the first region 4a of the first main surface 4 of the printed circuit board 3 (see FIGS. 11 and 12). The first protruding portion 12 includes a first surface portion 12a. The first surface portion 12a is configured to be in surface contact with the first side surface 6a of the first groove 6 of the printed circuit board 3 (see FIGS. 11 and 12). As shown in FIGS. 1 to 3, the first holding jig 10 is supported by the first support member 46. The first support member 46 is, for example, a metal fitting having an L-shape. The first holding jig 10 is made of, for example, iron.

With reference to FIG. 7, the second holding jig 14 includes a second surface 15 at its tip. The second pressing jig 14 further includes a second protruding portion 16 projecting from the second surface 15. The second surface 15 is configured to be in surface contact with the third region 5a of the second main surface 5 of the printed circuit board 3 (see FIGS. 11 and 12). The second protrusion 16 includes a third surface portion 16a. The third surface portion 16a is configured to be in surface contact with the third side surface 7a of the second groove 7 of the printed circuit board 3 (see FIGS. 11 and 12). As shown in FIGS. 1 to 3, the second holding jig 14 is supported by the second support member 21. The second support member 21 is, for example, a metal fitting having an L-shape. The second support member 21 is fixed to the base 20. The second holding jig 14 is made of, for example, iron.

The pressing member 18 is configured to press the second region 4b of the first main surface 4 (see FIG. 12). In a plan view of the first surface 11, the pressing member 18 is arranged on the opposite side of the first surface 11 with respect to the first protrusion 12. As shown in FIGS. 1, 4 and 5, the pressing member 18 is supported by the third support member 35. Specifically, the pressing member 18 includes a pressing portion 18a and a mounting portion 18b connected to the pressing portion 18a. The pressing portion 18a extends along the base 20. The pressing portion 18a extends along the printed circuit board 3. The mounting portion 18b is mounted on the third support member 35.

In the printed circuit board dividing device 1, the first pressing jig 10 and the pressing member 18 are configured to interlock with each other. Specifically, as shown in FIG. 1, the handle 24 is attached to the first shaft 25. The first shaft 25 is rotatably supported by the fourth support member 26. The fourth support member 26 is fixed to the first side plate 22a. The first side plate 22a is fixed to the base 20. A first bevel gear 27 is provided at the end of the first shaft 25.

The second side plate 22b is fixed to the base 20. The second side plate 22b faces the first side plate 22a. The second shaft 30 is rotatably supported by the first side plate 22a and the second side plate 22b. A second bevel gear 31 is provided at the end of the second shaft 30. The second bevel gear 31 meshes with the first bevel gear 27. A cam 32 is attached to the second shaft 30. The cam 32 is configured to rotate coaxially with the second shaft 30. As shown in FIGS. 2 and 3, the cam 32 includes a first cam surface 32a and a second cam surface 32b. The first cam surface 32a is configured such that the distance from the rotation center of the cam 32 to the first cam surface 32a gradually increases toward the end of the first cam surface 32a from the center of the first cam surface 32a. There is. The second cam surface 32b is a circumferential surface. The distance from the rotation center of the cam 32 to the second cam surface 32ba is constant in the entire second cam surface 32b.

The outer peripheral surface of the ring member 40 is pressed against the first cam surface 32a and the second cam surface 32b by the elastic member 44. Specifically, the ring member 40 is attached to the first fixing member 41. The first fixing member 41 is, for example, a metal fitting having an L-shape. The first fixing member 41 is attached to the second fixing member 42. The second fixing member 42 is, for example, a metal fitting having an L-shape. One end of the elastic member 44 is attached to the second fixing member 42 via the first attachment member 43. The other end of the elastic member 44 is attached to the first support member 46 via the second attachment member 45. The elastic member 44 is, for example, a compression spring.

The first support member 46 is attached to the first movable member 47. The second fixing member 42 is attached to the second movable member 48. The first movable member 47 and the second movable member 48 are configured to move along the third shaft 49. The third shaft 49 is attached to the first side plate 22a and the second side plate 22b. The first movable member 47, the second movable member 48, and the third shaft 49 refer to the moving directions of the ring member 40, the first fixing member 41, the second fixing member 42, the first support member 46, and the first holding jig 10. Prescribe. The first holding jig 10 is configured to move with respect to the printed circuit board 3 in accordance with the rotation of the cam 32 (see FIGS. 2 and 3). The first holding jig 10 is configured to move toward the printed circuit board 3 or in the direction opposite to the printed circuit board 3 according to the rotation of the cam 32.

A gear 34 is attached to the second shaft 30. The gear 34 is configured to rotate coaxially with the second shaft 30. As shown in FIGS. 4 and 5, the teeth 34t of the gear 34 mesh with the teeth 35t provided on the third support member 35. When the gear 34 rotates, the third support member 35 moves with respect to the printed circuit board 3, and the pressing member 18 supported by the third support member 35 also moves with respect to the printed circuit board 3. The third support member 35 is attached to the third movable member 36. The third movable member 36 is configured to move along the fourth shaft 37. The fourth shaft 37 is attached to the first side plate 22a and the second side plate 22b. The third movable member 36 and the fourth shaft 37 define the moving direction of the third movable member 36 and the pressing member 18. The pressing member 18 is configured to move with respect to the printed circuit board 3 in accordance with the rotation of the gear 34. The pressing member 18 is configured to move toward the printed circuit board 3 or in the direction opposite to the printed circuit board 3 in response to the rotation of the gear 34.

A manufacturing method of the manufacturing method of the printed circuit apparatus of the first embodiment will be described mainly with reference to FIGS. 10 to 14. The method for manufacturing the printed circuit device of the present embodiment includes mounting the electronic component 3e on the first region 4a of the first main surface 4 of the printed circuit board 3 (S10). For example, the electronic component 3e is soldered onto the first region 4a of the first main surface 4 of the printed circuit board 3. The method for manufacturing the printed circuit board of the present embodiment includes dividing the printed circuit board 3 by the printed circuit board dividing method of the present embodiment (S20).

The printed circuit board dividing method of the present embodiment includes clamping the printed circuit board 3 using the first holding jig 10 (S21). Specifically, the printed circuit board 3 is clamped by using the first holding jig 10 and the second holding jig 14. Specifically, as shown in FIG. 2, the printed circuit board 3 is brought into contact with the second holding jig 14. As shown in FIG. 11, the second surface 15 of the second pressing jig 14 comes into surface contact with the third region 5a of the second main surface 5 of the printed circuit board 3. The third surface portion 16a of the second protrusion 16 of the second holding jig 14 comes into surface contact with the third side surface 7a of the second groove 7 of the printed circuit board 3.

Then, the worker moves the handle 24. The first shaft 25 rotates. The second shaft 30 rotates via the first bevel gear 27 and the second bevel gear 31. The cam 32 rotates as the second shaft 30 rotates. The outer peripheral surface of the ring member 40 is in contact with the first cam surface 32a. As the cam 32 rotates, the ring member 40, the first fixing member 41, the second fixing member 42, the first support member 46, the first movable member 47, and the second movable member depend on the shape of the first cam surface 32a. The 48 and the first holding jig 10 move toward the first main surface 4 of the printed circuit board 3. As shown in FIGS. 3 and 11, the first surface 11 of the first holding jig 10 comes into surface contact with the first region 4a of the first main surface 4 of the printed circuit board 3. The first surface portion 12a of the first protrusion 12 of the first holding jig 10 comes into surface contact with the first side surface 6a of the first groove 6 of the printed circuit board 3. In this way, the printed circuit board 3 is clamped by using the first holding jig 10 and the second holding jig 14.

While the operator is moving the handle 24 to clamp the printed circuit board 3, the gear 34 also rotates with the rotation of the second shaft 30. The pressing member 18 moves toward the printed circuit board 3 while the operator is moving the handle 24 to clamp the printed circuit board 3. As shown in FIG. 4, the pressing member 18 is separated from the first main surface 4 of the printed circuit board 3 until the printed circuit board 3 is clamped.

In the printed circuit board dividing method of the present embodiment, the printed circuit board 3 is divided by pressing the second region 4b of the first main surface 4 of the printed circuit board 3 using the pressing member 18 (S22). Be prepared. Specifically, after the printed circuit board 3 is clamped, the operator continues to move the handle 24 further. The gear 34 rotates with the rotation of the second shaft 30. The pressing member 18 further moves toward the printed circuit board 3. As shown in FIGS. 5 and 12, the pressing member 18 presses the second region 4b of the first main surface 4. As shown in FIG. 13, the printed circuit board 3 is divided starting from the first groove 6.

After the printed circuit board 3 is clamped, the outer peripheral surface of the ring member 40 comes into contact with the second cam surface 32b. Since the second cam surface 32b is a circumferential surface, even if the operator continues to move the handle 24 after the printed circuit board 3 is clamped, the first pressing jig 10 further faces the second pressing jig 14. Do not move.

In the present embodiment, the first surface 11 of the first holding jig 10 is in surface contact with the first region 4a of the first main surface 4 of the printed circuit board 3. The first surface portion 12a of the first protrusion 12 of the first holding jig 10 is in surface contact with the first side surface 6a of the first groove 6 of the printed circuit board 3. Therefore, between the first surface 11 of the first holding jig 10 and the first region 4a of the first main surface 4 of the printed circuit board 3, and the first of the first protruding portion 12 of the first holding jig 10. A frictional force acts between the surface portion 12a and the first side surface 6a of the first groove 6 of the printed circuit board 3.

As shown in FIG. 14, when the printed circuit board 3 is divided, this frictional force reduces the amount of deformation of the printed circuit board 3. The reduced amount of deformation of the printed circuit board 3 reduces the stress applied to the electronic component 3e when the printed circuit board 3 is divided. In this way, it is possible to prevent the electronic component 3e from being damaged when the printed circuit board 3 is divided. The amount of deformation of the grid shown in FIG. 14 indicates the amount of deformation of the printed circuit board 3 when the printed circuit board 3 is divided by using the pressing member 18. When the stress applied to the printed circuit board 3 is tensile stress, the grid spacing is widened. When the stress applied to the printed circuit board 3 is compressive stress, the grid spacing is narrowed.

On the other hand, the first holding jig 10a of the comparative example shown in FIG. 15 is not provided with the first protruding portion 12. The first holding jig 10a is not in surface contact with the first side surface 6a of the first groove 6 of the printed circuit board 3. No frictional force acts between the first holding jig 10a and the first side surface 6a of the first groove 6 of the printed circuit board 3. Therefore, as shown in FIG. 16, the amount of deformation of the printed circuit board 3 when the printed circuit board 3 is divided becomes large. When the printed circuit board 3 is divided, the stress applied to the electronic component 3e becomes large. When the printed circuit board 3 is divided, the electronic component 3e is easily damaged.

As shown in FIG. 17, the first holding jig 10b of the modification of the present embodiment may include the first jig portion 13a and the second jig portion 13b. The first jig portion 13a includes the first surface 11. The second jig portion 13b includes the first protruding portion 12. The second jig portion 13b may be attached to the first jig portion 13a using a fixing member such as a screw, or may be welded to the first jig portion 13a. The second jig portion 13b may be made of the same material as the first jig portion 13a, or may be made of a material different from that of the first jig portion 13a. The second holding jig 14 may be configured in the same manner as the first holding jig 10b.

The effects of the printed circuit board dividing device 1, the printed circuit board dividing holding jigs (first holding jigs 10, 10b), the printed circuit board dividing method, and the printed circuit board manufacturing method of the present embodiment will be described.

The printed circuit board dividing device 1 of the present embodiment includes first holding jigs 10 and 10b and a pressing member 18. The first holding jigs 10 and 10b include a first surface 11 and a first protruding portion 12 protruding from the first surface 11. The first surface 11 is configured to make surface contact with the first region 4a of the first main surface 4 of the printed circuit board 3 on which the electronic component 3e is mounted. The first protrusion 12 includes a first surface portion 12a configured to make surface contact with the first side surface 6a of the first groove 6 of the printed circuit board 3. The first groove 6 is formed on the first main surface 4. The first groove 6 has a first side surface 6a connected to the first region 4a and a second side surface 6b facing the first side surface 6a. The pressing member 18 is configured to press the second region 4b of the first main surface 4 connected to the second side surface 6b.

The printed circuit board dividing holding jig (first holding jigs 10, 10b) of the present embodiment includes a first surface 11 and a first protruding portion 12 protruding from the first surface 11. The first surface 11 is configured to make surface contact with the first region 4a of the first main surface 4 of the printed circuit board 3 on which the electronic component 3e is mounted. The first protrusion 12 includes a first surface portion 12a configured to make surface contact with the first side surface 6a of the first groove 6 of the printed circuit board 3. The first groove 6 is formed on the first main surface 4. The first groove 6 has a first side surface 6a connected to the first region 4a and a second side surface 6b facing the first side surface 6a.

When the printed circuit board 3 is divided by using the printed circuit board dividing device 1 and the printed circuit board dividing holding jigs (first holding jigs 10 and 10b) of the present embodiment, the first holding jigs 10 and 10b are used. Between the first surface 11 of the above and the first region 4a of the first main surface 4 of the printed circuit board 3, and the first surface portion 12a of the first protrusion 12 of the first holding jigs 10 and 10b and the printed circuit. A frictional force acts between the first side surface 6a of the first groove 6 of the substrate 3. When the printed circuit board 3 is divided, this frictional force reduces the amount of deformation of the printed circuit board 3. The reduced amount of deformation of the printed circuit board 3 reduces the stress applied to the electronic component 3e when the printed circuit board 3 is divided. In this way, it is possible to prevent the electronic component 3e from being damaged when the printed circuit board 3 is divided.

The printed circuit board dividing method of the present embodiment includes clamping the printed circuit board 3 using the first holding jigs 10 and 10b (S21). The first holding jigs 10 and 10b include a first surface 11 and a first protruding portion 12 protruding from the first surface 11. The first surface 11 comes into surface contact with the first region 4a of the first main surface 4 of the printed circuit board 3 on which the electronic component 3e is mounted. The first protrusion 12 includes a first surface portion 12a that comes into surface contact with the first side surface 6a of the first groove 6 of the printed circuit board 3. The first groove 6 is formed on the first main surface 4. The first groove 6 has a first side surface 6a connected to the first region 4a and a second side surface 6b facing the first side surface 6a. In the printed circuit board dividing method of the present embodiment, the printed circuit board 3 is divided by pressing the second region 4b of the first main surface 4 connected to the second side surface 6b by using the pressing member 18. (S22) is provided.

The method for manufacturing the printed circuit board of the present embodiment is to mount the electronic component 3e on the first region 4a of the first main surface 4 of the printed circuit board 3 (S10), and the printed circuit board of the present embodiment. The printed circuit board 3 is divided by a division method (S20).

When the printed circuit board 3 is divided by the printed circuit board dividing method and the printed circuit board manufacturing method of the present embodiment, the first surface 11 of the first holding jigs 10 and 10b and the first main surface of the printed circuit board 3 are used. Between the first region 4a of 4 and the first surface portion 12a of the first protruding portion 12 of the first holding jigs 10 and 10b and the first side surface 6a of the first groove 6 of the printed circuit board 3. In the meantime, a frictional force acts. When the printed circuit board 3 is divided, this frictional force reduces the amount of deformation of the printed circuit board 3. The reduced amount of deformation of the printed circuit board 3 reduces the stress applied to the electronic component 3e when the printed circuit board 3 is divided. In this way, it is possible to prevent the electronic component 3e from being damaged when the printed circuit board 3 is divided.

Embodiment 2.
The printed circuit board dividing holding jig (first holding jig 10c) of the second embodiment will be described with reference to FIG. The printed circuit board dividing holding jig (first holding jig 10c) of the present embodiment has the same configuration as the printed circuit board dividing holding jig (first holding jig 10) of the first embodiment. However, it differs mainly in the following points.

The first protruding portion 12 of the first holding jig 10c further includes a second surface portion 12b. The second surface portion 12b is configured to be in surface contact with the second side surface 6b of the first groove 6. The second surface portion 12b is on the opposite side of the first surface portion 12a. Specifically, the first protrusion 12 has a similar shape to the first groove 6. More specifically, the first protrusion 12 has the same shape as the first groove 6. The second holding jig 14 may be configured in the same manner as the first holding jig 10c.

The printed circuit board dividing device of the present embodiment has the same configuration as that of the printed circuit board dividing device 1 of the first embodiment, but instead of the first holding jig 10 of the first embodiment, the present embodiment is provided. The first holding jig 10c in the form of the above is provided. The printed circuit board dividing method and the printed circuit board manufacturing method of the present embodiment include the same steps as the printed circuit board dividing method and the printed circuit board manufacturing method of the first embodiment, but the first embodiment. Instead of the first holding jig 10 of the above, the first holding jig 10c of the present embodiment is used.

The printed circuit board dividing device, the printed circuit board dividing holding jig (first holding jig 10c), the printed circuit board dividing method, and the printed circuit board manufacturing method of the present embodiment have the following effects.

When the printed circuit board 3 is divided, the space between the first surface 11 of the first holding jig 10c and the first region 4a (see FIGS. 11 and 12) of the first main surface 4 of the printed circuit board 3 and , Not only between the first surface portion 12a of the first protrusion 12 of the first holding jig 10c and the first side surface 6a of the first groove 6 of the printed circuit board 3 (see FIGS. 11 and 12). Also, between the second surface portion 12b of the first protrusion 12 of the first holding jig 10c and the second side surface 6b (see FIGS. 11 and 12) of the first groove 6 of the printed circuit board 3. Friction force acts. When the printed circuit board 3 is divided, this frictional force reduces the amount of deformation of the printed circuit board 3. The reduced amount of deformation of the printed circuit board 3 reduces the stress applied to the electronic components 3e (see FIGS. 2 to 5 and 8) when the printed circuit board 3 is divided. In this way, it is possible to prevent the electronic component 3e from being damaged when the printed circuit board 3 is divided.

Embodiment 3.
The printed circuit board dividing holding jig (first holding jig 10d) of the third embodiment will be described with reference to FIG. The printed circuit board dividing holding jig (first holding jig 10d) of the present embodiment has the same configuration as the printed circuit board dividing holding jig (first holding jig 10) of the first embodiment. However, it differs mainly in the following points.

In the first holding jig 10d of the present embodiment, the first surface portion 12a is the first rough surface. The first rough surface may include a random uneven structure or may include a regular uneven structure. The second holding jig 14 may be configured in the same manner as the first holding jig 10d.

The printed circuit board dividing holding jig (first holding jig 10e) of the modified example of the third embodiment will be described with reference to FIG. 20. The printed circuit board dividing holding jig (first holding jig 10e) of the modified example of the present embodiment is the same as the printed circuit board dividing holding jig (first holding jig 10c) of the second embodiment. It has a configuration, but it differs mainly in the following points.

In the first holding jig 10e of the modified example of the present embodiment, the first surface portion 12a is the first rough surface and the second surface portion 12b is the second rough surface. The first rough surface may include a random uneven structure or may include a regular uneven structure. The second rough surface may include a random uneven structure or may include a regular uneven structure. The second pressing jig 14 may be configured in the same manner as the first pressing jig 10e.

The printed circuit board dividing device of the present embodiment has the same configuration as that of the printed circuit board dividing device 1 of the first embodiment, but instead of the first holding jig 10 of the first embodiment, the present embodiment is provided. The first holding jigs 10d and 10e in the form of the above are provided. The printed circuit board dividing method and the printed circuit board manufacturing method of the present embodiment include the same steps as the printed circuit board dividing method and the printed circuit board manufacturing method of the first embodiment, but the first embodiment. Instead of the first holding jig 10 of the above, the first holding jigs 10d and 10e of the present embodiment are used.

The printed circuit board dividing device, the printed circuit board dividing holding jigs (first holding jigs 10d, 10e), the printed circuit board dividing method, and the printed circuit board manufacturing method of the present embodiment are the printing of the first embodiment. In addition to the effects of the circuit board dividing device 1, the printed circuit board dividing holding jig (first holding jig 10), the printed circuit board dividing method, and the printed circuit board manufacturing method, the following effects are obtained.

Since the first surface portion 12a is the first rough surface, the first surface portion 12a of the first protrusion 12 of the first holding jigs 10d and 10e and the first side surface 6a of the first groove 6 of the printed circuit board 3 The frictional force between (see FIGS. 11 and 12) increases. When the printed circuit board 3 is divided, this increased frictional force further reduces the amount of deformation of the printed circuit board 3. The reduced amount of deformation of the printed circuit board 3 reduces the stress applied to the electronic components 3e (see FIGS. 2 to 5 and 8) when the printed circuit board 3 is divided. It is possible to prevent the electronic component 3e from being damaged when the printed circuit board 3 is divided.

Since the second surface portion 12b is a second rough surface, the second surface portion 12b of the first protrusion 12 of the first holding jig 10e and the second side surface 6b of the first groove 6 of the printed circuit board 3 (FIG. 11 and FIG. 12) increase the frictional force. When the printed circuit board 3 is divided, this increased frictional force further reduces the amount of deformation of the printed circuit board 3. The reduced amount of deformation of the printed circuit board 3 reduces the stress applied to the electronic components 3e (see FIGS. 2 to 5 and 8) when the printed circuit board 3 is divided. It is possible to prevent the electronic component 3e from being damaged when the printed circuit board 3 is divided.

Embodiment 4.
The printed circuit board dividing holding jig (first holding jig 10f) of the fourth embodiment will be described with reference to FIG. 21. The printed circuit board dividing holding jig (first holding jig 10f) of the present embodiment has the same configuration as the printed circuit board dividing holding jig (first holding jig 10) of the first embodiment. However, it differs mainly in the following points.

In the first holding jig 10f of the present embodiment, the recess 13f is formed between the first surface 11 and the first surface portion 12a. The recess 13f functions as a slime portion. In the first holding jig 10g of the first modification of the present embodiment, the recess 13g may be formed as shown in FIG. 22. Due to the recess 13g, the first holding jig 10g has a first region 4a of the first main surface 4 (see FIGS. 11 and 12) and a first side surface 6a of the first groove 6 (see FIGS. 11 and 12). ), It is configured so as not to come into contact with a part of the first region 4a of the first main surface 4 in the vicinity of the boundary portion.

In the first holding jig 10h of the second modification of the present embodiment, the recess 13h may be formed as shown in FIG. 23. Due to the recess 13h, the first holding jig 10h is the first of the first main surface 4 in the vicinity of the boundary portion between the first region 4a of the first main surface 4 and the first side surface 6a of the first groove 6. It is configured so as not to contact a part of the region 4a and a part of the first side surface 6a in the vicinity of the boundary portion. As shown in FIG. 24, in the first holding jig 10i of the third modification of the present embodiment, the recess 13i is provided in the first holding jig 10b (see FIG. 17) of the modification of the first embodiment. It may be formed. Due to the recess 13i, the first holding jig 10i becomes a part of the first side surface 6a in the vicinity of the boundary portion between the first region 4a of the first main surface 4 and the first side surface 6a of the first groove 6. It is configured to be out of contact. The second holding jig 14 may also be configured in the same manner as the first holding jigs 10f, 10g, 10h, 10i.

In the first holding jigs 10g and 10h shown in FIGS. 22 and 23, the first surface portion 12a of the first holding jigs 10g and 10h is, for example, at least the first side surface 6a (see FIGS. 11 and 12). Is in surface contact with the first part of the. The first portion of the first side surface 6a is from the first corner portion (the tip portion of the V groove) of the first groove 6 which is the starting point of division of the printed circuit board 3 and the first corner portion of the first groove 6. It means the area between the point of the first side surface 6a corresponding to the depth of one half of the depth of the first groove 6. The first surface portion 12a of the first holding jigs 10g and 10h is in surface contact with, for example, at least the second portion of the first side surface 6a. The second portion of the first side surface 6a is a first corner portion of the first groove 6 which is a starting point of division of the printed circuit board 3, and a depth of the first groove 6 from the first corner portion of the first groove 6. It means the area between the point of the first side surface 6a corresponding to the depth of two-thirds of the sword.

The printed circuit board dividing device of the present embodiment has the same configuration as that of the printed circuit board dividing device 1 of the first embodiment, but instead of the first holding jig 10 of the first embodiment, the present embodiment is provided. The first holding jigs 10f, 10g, 10h, 10i in the form of the above are provided. The printed circuit board dividing method and the printed circuit board manufacturing method of the present embodiment include the same steps as the printed circuit board dividing method and the printed circuit board manufacturing method of the first embodiment, but the first embodiment. Instead of the first holding jig 10 of the above, the first holding jigs 10f, 10g, 10h, 10i of the present embodiment are used.

The printed circuit board dividing device, the printed circuit board dividing holding jig (first holding jig 10f, 10g, 10h, 10i), the printed circuit board dividing method, and the printed circuit board manufacturing method of the present embodiment are carried out. In addition to the effects of the printed circuit board dividing device 1, the printed circuit board dividing holding jig (first holding jigs 10, 10b) of the first embodiment, the printed circuit board dividing method, and the printed circuit board manufacturing method, the following effects are obtained. Play.

When forming the first groove 6 on the first main surface 4 of the printed circuit board 3, the first region 4a (see FIGS. 11 and 12) of the first main surface 4 and the first groove 6 are formed. Even if a burr occurs at the boundary portion with the side surface 6a (see FIGS. 11 and 12), the recesses 13f, 13g, 13h, 13i accommodate the burr. The recesses 13f, 13g, 13h, 13i are the first surface portion 12a of the first protrusion 12 of the first holding jigs 10f, 10g, 10h, 10i and the first side surface 6a of the first groove 6 of the printed circuit board 3. Make sure to make surface contact with.

When the printed circuit board 3 is divided, the first surface 11 of the first holding jigs 10f, 10g, 10h, 10i and the first region 4a of the first main surface 4 of the printed circuit board 3 (see FIGS. 11 and 12). ), And the first surface portion 12a of the first protruding portion 12 of the first holding jigs 10f, 10g, 10h, 10i and the first side surface 6a of the first groove 6 of the printed circuit board 3 (FIG. 11). And (see FIG. 12), the frictional force acts reliably. When the printed circuit board 3 is divided, this frictional force reduces the amount of deformation of the printed circuit board 3. The reduced amount of deformation of the printed circuit board 3 reduces the stress applied to the electronic components 3e (see FIGS. 2 to 5 and 8) when the printed circuit board 3 is divided. In this way, it is more reliable to prevent the electronic component 3e from being damaged when the printed circuit board 3 is divided.

It should be considered that the embodiments 1-4 and their variations disclosed this time are exemplary in all respects and not restrictive. As long as there is no contradiction, at least two of Embodiments 1-4 disclosed this time and examples thereof may be combined. The scope of the present invention is shown by the scope of claims rather than the above description, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

1 Printed circuit board divider, 3 Printed circuit board, 3e Electronic components, 4 First main surface, 4a 1st area, 4b 2nd area, 5 2nd main surface, 5a 3rd area, 5b 4th area, 6th 1 groove, 6a 1st side surface, 6b 2nd side surface, 7 2nd groove, 7a 3rd side surface, 7b 4th side surface 10,10a, 10b, 10c, 10d, 10e, 10f, 10g, 10h, 10i first 1 holding jig, 11 first surface, 12 first protruding part, 12a first surface part, 12b second surface part, 13a first jig part, 13b second jig part, 13f, 13g, 13h, 13i recess , 14 2nd holding jig, 15 2nd surface, 16 2nd protruding part, 16a 3rd surface part, 18 pressing member, 18a pressing part, 18b mounting part, 20 base, 21 2nd support member, 22a 1st Side plate, 22b 2nd side plate, 24 handle, 25 1st shaft, 26 4th support member, 27 1st cap gear, 30 2nd shaft, 31 2nd cap gear, 32 cam, 32a 1st cam surface, 32b 2nd Cam surface, 34 gears, 34t teeth, 35 3rd support member, 35t teeth, 36 3rd movable member, 37 4th shaft, 40 ring member, 41 1st fixing member, 42 2nd fixing member, 43 1st mounting member , 44 elastic member, 45 second mounting member, 46 first support member, 47 first movable member, 48 second movable member, 49 third shaft.

Claims (19)

The first holding jig and
Equipped with a pressing member
The first holding jig includes a first surface and a first protruding portion protruding from the first surface.
The first surface is configured to make surface contact with the first region of the first main surface of the printed circuit board on which the electronic component is mounted.
The first protrusion includes a first surface portion configured to be in surface contact with the first side surface of the first groove of the printed circuit board, and the first groove is formed on the first main surface. The first groove has a first side surface connected to the first region and a second side surface facing the first side surface.
The printed circuit board dividing device is configured such that the pressing member presses a second region of the first main surface connected to the second side surface. The printed circuit board dividing device according to claim 1, wherein the first surface portion is a first rough surface. The printed circuit board dividing device according to claim 1 or 2, wherein the first protruding portion further includes a second surface portion configured to make surface contact with the second side surface. The printed circuit board dividing device according to claim 3, wherein the second surface portion is a second rough surface. The printed circuit board dividing device according to any one of claims 1 to 4, wherein a recess is formed between the first surface and the first surface portion. A second pressing jig is further provided, and the second pressing jig includes a second surface and a second protruding portion protruding from the second surface.
The second surface is configured to be in surface contact with the third region of the second main surface of the printed circuit board on the side opposite to the first region.
The second protrusion includes a third surface portion configured to make surface contact with the third side surface of the second groove of the printed circuit board, and the second groove is formed on the second main surface. The second groove is any one of claims 1 to 5, wherein the second groove has the third side surface connected to the third region and the fourth side surface facing the third side surface. The printed circuit board dividing device according to item 1. The printed circuit board dividing device according to any one of claims 1 to 6, wherein the first pressing jig and the pressing member are configured to interlock with each other. With the shaft
A cam configured to rotate coaxially with the shaft,
Further equipped with a gear configured to rotate coaxially with the shaft,
The first holding jig is configured to move with respect to the printed circuit board in accordance with the rotation of the cam.
The printed circuit board dividing device according to claim 7, wherein the pressing member is configured to move with respect to the printed circuit board in accordance with the rotation of the gear. A first surface and a first protruding portion protruding from the first surface are included.
The first surface is configured to make surface contact with the first region of the first main surface of the printed circuit board on which the electronic component is mounted.
The first protrusion includes a first surface portion configured to make surface contact with the first side surface of the first groove of the printed circuit board, and the first groove is formed on the first main surface. The first groove is a holding jig for dividing a printed circuit board, which has the first side surface connected to the first region and the second side surface facing the first side surface. The presser jig for dividing a printed circuit board according to claim 9, wherein the first surface portion is a first rough surface. The printed circuit board division pressing jig according to claim 9, wherein the first protruding portion further includes a second surface portion configured to come into surface contact with the second side surface. The presser jig for dividing a printed circuit board according to claim 11, wherein the second surface portion is a second rough surface. The presser jig for dividing a printed circuit board according to any one of claims 9 to 12, wherein a recess is formed between the first surface and the first surface portion. The printed circuit board is clamped by using a first holding jig, and the first holding jig includes a first surface and a first protruding portion protruding from the first surface, and the first surface thereof. Is in surface contact with the first region of the first main surface of the printed circuit board on which the electronic component is mounted, and the first protruding portion is in surface contact with the first side surface of the first groove of the printed circuit board. The first groove is formed on the first main surface, and the first groove is the first side surface connected to the first region and the first surface. It has a second side surface facing the side surface and has a second side surface.
A method for dividing a printed circuit board, comprising pressing a second region of the first main surface connected to the second side surface with a pressing member to divide the printed circuit board. The printed circuit board division method according to claim 14, wherein the first surface portion is a first rough surface. The printed circuit board division method according to claim 14, wherein the first protruding portion further includes a second surface portion configured to make surface contact with the second side surface. The printed circuit board division method according to claim 16, wherein the second surface portion is a second rough surface. The printed circuit board division method according to any one of claims 14 to 17, wherein a recess is formed between the first surface and the first surface portion. The electronic components are mounted on the first region of the first main surface of the printed circuit board.
A method for manufacturing a printed circuit board, comprising dividing the printed circuit board by the printed circuit board dividing method according to any one of claims 14 to 18.

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