JP6896837B2 - Load measurement system and load analysis method - Google Patents

Description

The present invention relates to a load measuring system for measuring a load applied to a mounting head of a mounting machine and a load analysis method .

A mounting machine that mounts electronic components (hereinafter, may be simply referred to as "components") on a circuit board (hereinafter, may be simply referred to as "board") suppresses damage to the board and defects in electrical connection. Therefore, it is required to set an appropriate value for the load that presses the component against the substrate. Further, it is desired to manage the load pressing the parts with higher accuracy due to the recent increase in integration, miniaturization, thinning, etc. of the parts. On the other hand, there is a load measuring device that measures the load of pressing the component by the suction nozzle of the mounting head when the component is mounted on the substrate (for example, Patent Document 1).

The load measuring device disclosed in Patent Document 1 (in the document, "mounted load measuring device") includes a load cell that detects the load applied by the suction nozzle and a data logger that measures the load based on the detection result of the load cell. It has. The load measuring device is formed according to the width of the transport path for transporting the substrate in the mounting machine. Then, the load measuring device is conveyed on the transport path in the same manner as the substrate, and measures the load at a predetermined mounting position.

Japanese Unexamined Patent Publication No. 2015-20294

The load measuring device described above is taken out from the mounting machine, then collected, connected to a personal computer, and the measured data is read out. However, the above-mentioned Patent Document 1 does not specifically describe what kind of standard or data the personal computer analyzes the measurement data of the load measuring device based on. Therefore, there is room for improvement in the process of analyzing the measurement data.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a load measurement system and a load analysis method capable of analyzing load measurement data based on the measurement conditions of a mounting machine. Is.

In order to solve the above problems, the present specification is arranged in a mounting machine having a mounting head for mounting a component on a board, and a load measurement for measuring a load applied to the component by the mounting head at the time of mounting. The mounting head comprises an apparatus and an analyzer, the mounting head includes a plurality of suction nozzles for sucking and holding the component, and the load measuring device is one from each of the plurality of suction nozzles in a predetermined order. granted multiple load for suction nozzle, and save the measurement data which is the result of a load measured in that order, the analyzer, Ri condition der of said mounting device when measuring the load was performed to measure a first acquisition processing for acquiring condition data including the order of the suction nozzle, the measurement data, a second acquisition processing for acquiring from said load measuring device, based on the condition data acquired by the first acquisition processing, An analysis process is executed in which the measurement data acquired in the second acquisition process is analyzed , a plurality of the measurement data are aggregated for each of the plurality of suction nozzles, and the aggregation result for each of the plurality of suction nozzles is displayed. , Disclose the load measurement system.
Further, the present specification includes a load measuring device and an analyzer which are arranged in a mounting machine having a mounting head for mounting a component on a substrate and measure a load applied to the component by the mounting head at the time of mounting. The analyzer is a condition of the mounting machine when measuring a load, and has a load width determined by a ratio of a difference to a reference load value as a load width indicating a range of allowable load values. Based on the first acquisition process for acquiring the included condition data, the second acquisition process for acquiring the measurement data as a result of measuring the load from the load measuring device, and the condition data acquired in the first acquisition process. Discloses a load measurement system that executes an analysis process for analyzing the quality of the load of the measurement data acquired in the second acquisition process.
The content of the present disclosure is not limited to the implementation as a load measurement system, and can be implemented in various forms. For example, the contents of the present disclosure may be useful as a load analysis method.

According to the present disclosure, the analyzer acquires condition data of the mounting machine at the time of load measurement. In addition, the analyzer acquires load measurement data from the load measuring device. The analyzer analyzes the measurement data based on the conditions of the mounting machine at the time of load measurement. This makes it possible to analyze the measured load based on the conditions at the time of measurement of the mounting machine.

It is a schematic diagram which shows the structure of the board-to-board work system. It is a top view of the mounting machine. It is sectional drawing in the state which the substrate is arranged at the working position of a mounting machine. It is a top view of the load measuring device. It is sectional drawing in the state which the load measuring apparatus is arranged at the working position of a mounting machine. It is a block diagram of a load measuring device. It is a flowchart which shows a series of processing procedures from the generation of control data for load measurement to the analysis of measurement data. It is a flowchart which shows the load measurement process. It is a figure which shows an example of the analysis result displayed on the analysis computer. It is a figure which shows an example of the display screen which selects the condition data. It is a top view of the load measuring apparatus of another example.

Hereinafter, as an example of the embodiment of the load measurement system of the present invention, the substrate working system 10 will be described in detail with reference to the drawings.

(Configuration of board-to-board work system)
FIG. 1 shows a schematic configuration of a board-to-board work system 10 including the mounting machine 11 of the present embodiment. The board-to-board work system 10 is a system in which components are mounted on a circuit board (hereinafter referred to as “board”) CB. The board-to-board work system 10 includes one component mounting line 12, a production control computer 18, an analysis computer 19, and a load measuring device 81 described later. The substrate CB is conveyed along the component mounting line 12 from the left side to the right side in FIG. 1, and work is performed by various devices. The component mounting line 12 is configured by connecting a plurality of (four in this embodiment) mounting machines 11, a solder printing machine 13, an inspection device 14, a reflow device 15, and a board handling device 17. .. The devices and the like are arranged in a row adjacent to each other and are collectively controlled by the production control computer 18. In the following description, the direction in which the devices are lined up is referred to as the X-axis direction, and the direction orthogonal to the X-axis direction and parallel to the plane of the substrate CB is referred to as the Y-axis direction.

The solder printing machine 13 prints the solder paste on the substrate CB. The mounting machine 11 mounts the components on the substrate CB on which the solder paste is printed. The details of the mounting machine 11 will be described later. The inspection device 14 inspects the state of the parts mounted on the substrate CB, the presence or absence of foreign matter, and the like. The reflow device 15 heats the paste-like solder, remelts it, and then cools and solidifies it to complete the mounting of the parts. The board handling device 17 is provided upstream and downstream of the component mounting line 12 with respect to the mounting machine 11 and the like. Each of the board handling devices 17 transports the board CB to the next device, makes it stand by, or turns it upside down.

The production control computer 18 is mainly composed of a computer equipped with a CPU, RAM, and the like. The production control computer 18 is connected to the mounting machine 11 and the like via the network NW1. The production control computer 18 transmits the control data D1 for controlling the operation of the mounting machine 11 and the like to the mounting machine 11 and the like. The mounting machine 11 and the like execute mounting work and the like based on the control data D1 received from the production control computer 18. The production control computer 18 stores a plurality of control data D1 and various data for generating the control data D1 (target load value, load width, etc., which will be described later).

The analysis computer 19 is connected to the production control computer 18 via the network NW2. The analysis computer 19 is mainly composed of a computer equipped with a CPU, RAM, and the like, and has an operation unit 19A and a display unit 19B. The operation unit 19A is, for example, an input device such as a keyboard or a mouse. The display unit 19B is, for example, a display that displays various types of information.

By operating the operation unit 19A of the analysis computer 19, the user can change the content of the control data D1 stored in the production control computer 18 via the network NW2, for example. Further, the user can transmit the control data D1 from the production control computer 18 to the specific mounting machine 11 or the like by operating the operation unit 19A. As a result, the user operates the operation unit 19A of the analysis computer 19 to generate control data D1 for performing mounting work for measuring the load, and transmits the generated control data D1 to the mounting machine 11 to be measured. Can be processed.

Further, the analysis computer 19 of the present embodiment acquires condition data D2, which is a condition for measuring the load, from the mounting machine 11 whose load is measured by the load measuring device 81 described later via the production control computer 18 ( First acquisition process). That is, the condition data D2 is transferred from the mounting machine 11 to the analysis computer 19 via the network NW1, the production control computer 18, and the network NW2.

Further, the analysis computer 19 of the present embodiment has an external interface 19C for connecting to the load measuring device 81. The external interface 19C is an interface for connecting to the external interface 101 (see FIG. 6) of the load measuring device 81. The external interfaces 19C and 101 are not particularly limited in standard and the like, but for example, an interface compliant with the USB (Universal Serial Bus) standard can be adopted. The analysis computer 19 may be configured to be capable of wireless communication with the load measuring device 81.

The analysis computer 19 acquires the measurement data D3 for which the load is measured from the load measuring device 81 via the external interface 19C (second acquisition process). The analysis computer 19 analyzes the measurement data D3 based on the condition data D2 and displays the analysis result on the display unit 19B.
The details of the load measuring device 81 will be described later.

(Configuration of mounting machine)
FIG. 2 shows a plan view of the mounting machine 11. As shown in FIG. 2, the mounting machine 11 includes a transport device 20, a mounting head moving device (hereinafter, may be abbreviated as “moving device”) 22, a mounting head 24, and a supply device 26.

The transport device 20 has a conveyor 31 extending in the X-axis direction. The substrate CB is supported by the conveyor 31 and conveyed in the X-axis direction. FIG. 3 shows the working position of the mounting machine 11, and shows a cross-sectional view cut along a plane perpendicular to the X-axis direction. As shown in FIG. 3, the conveyor 31 has a conveyor belt 33, a stopper 35, and a clamper 36. The conveyor belts 33 are provided with a set separated by a predetermined distance in the Y-axis direction, and orbit the conveyor belt CB with the substrate CB placed on the conveyor belt 33 to a predetermined working position (for example, the position shown in FIG. 2). Transport. The clamper 36 is provided at a position facing the stopper 35 in the vertical direction with the substrate CB sandwiched between them at the working position. When the conveyor 31 orbits the conveyor belt 33 and conveys the substrate CB to the working position, the clamper 36 is raised. The substrate CB is sandwiched between the clamper 36 and the stopper 35, and is fixedly held at the working position.

Further, at the working position of the mounting machine 11, a lift 43 that can be raised and lowered by a drive unit 41 (for example, an air cylinder) is provided. A backup base 44 that can be replaced with respect to the lift 43 is provided on the lift 43. A plurality of backup pins 46 are erected on the upper surface of the backup base 44. When mounting the components, the mounting machine 11 drives the drive unit 41 to raise the lift 43, and brings the backup pin 46 into contact with the lower surface of the substrate CB whose position is held by the stopper 35 and the clamper 36. As a result, the backup pin 46 supports the substrate CB so as not to bend when the component is mounted.

Further, as shown in FIG. 2, the moving device 22 has an X-axis direction slide mechanism 50 and a Y-axis direction slide mechanism 52. The X-axis direction slide mechanism 50 has an X-axis slider 56 provided on the base 54 so as to be movable in the X-axis direction. The X-axis slider 56 moves to an arbitrary position in the X-axis direction by driving an electromagnetic motor (not shown). Further, the Y-axis direction slide mechanism 52 has a Y-axis slider 60. The Y-axis slider 60 is provided on the side surface of the X-axis slider 56 so as to be movable in the Y-axis direction. The Y-axis slider 60 moves to an arbitrary position in the Y-axis direction by driving an electromagnetic motor (not shown). The mounting head 24 is mounted on the Y-axis slider 60. With such a structure, the mounting head 24 is moved to an arbitrary position on the base 54 by the moving device 22. The mounting head 24 is detachable from the Y-axis slider 60 and can be replaced with a head according to the work.

The mounting head 24 mounts components on the substrate CB. The mounting head 24 has a plurality of suction nozzles 70 (only one is shown in FIG. 2) provided on the lower surface. Each suction nozzle 70 communicates with a positive / negative pressure supply device (not shown) via a negative pressure air and a positive pressure air passage. The suction nozzle 70 sucks and holds the component by negative pressure, and releases the held component by positive pressure. Further, the mounting head 24 has an elevating device (not shown) for elevating and lowering the suction nozzle 70. The lifting device causes the mounting head 24 to change the vertical position of the suction nozzle 70 that holds the component. The suction nozzle 70 is removable from the mounting head 24, and can be replaced with a suction nozzle or a large number of holding members (chuck or the like) according to the component to be held.

The feeder 26 is a feeder type feeder, and has a plurality of tape feeders 72. The tape feeder 72 houses the taped parts in a wound state. The taped part is a taped part. The tape feeder 72 feeds the taped parts by a feeding device (not shown) and supplies the parts to the supply position.

(Mounting work by mounting machine)
The mounting machine 11 performs mounting work of parts on the substrate CB according to the above-described configuration. More specifically, the mounting machine 11 transports the substrate CB carried in from the substrate handling device 17 on the upstream side to the working position by the transport device 20. The stopper 35 and the clamper 36 fixedly hold the substrate CB at the working position. Further, the tape feeder 72 sends out the taped parts and supplies the parts to the supply position. The mounting head 24 moves above the supply position of the tape feeder 72, and the suction nozzle 70 sucks and holds the component. The mounting head 24 moves above the board CB arranged at the working position, and mounts the held component on the board CB. When the mounting work of the parts by the mounting machine 11 is completed, the board handling device 17 on the downstream side conveys the board CB to another mounting on the downstream side.

(Configuration of load measuring device)
Next, the configuration of the load measuring device 81 of the present embodiment will be described. FIG. 4 shows a plan view of the load measuring device 81 of the present embodiment. FIG. 5 is a cross-sectional view of the load measuring device 81, showing a state in which the load measuring device 81 is arranged at the working position of the mounting machine 11. That is, FIG. 5 corresponds to FIG. 3 and shows a state in which the load measuring device 81 is arranged in place of the substrate CB. Further, FIG. 6 shows the electrical configuration of the load measuring device 81.

The configuration of the load measuring device 81 of the present embodiment is an example, and other configurations capable of measuring the load may be used. Further, in FIG. 5, the backup base 44 is in a state in which the backup pin 46 is removed. This makes it possible to secure a larger space between the backup base 44 and the conveyor 31. Further, in the following description, the positions of each member of the load measuring device 81 and the like will be described using the directions (X-axis direction and Y-axis direction) when the load measuring device 81 is conveyed.

As shown in FIGS. 4 and 5, the load measuring device 81 has a housing 83 and holding plates 85 and 86 attached to the upper surface of the housing 83. The housing 83 has a substantially square shape when viewed from above. The housing 83 extends in the X-axis direction and the Y-axis direction, and has a thick plate shape having a predetermined thickness in the vertical direction. The vertical thickness L2 (see FIG. 5) of the housing 83 is, for example, 50 mm. When the load measuring device 81 is made thin, the load measuring device 81 may be conveyed by the conveyor 31 with the backup pin 46 attached to the backup base 44.

The sandwiched plates 85 and 86 are provided at both ends in the Y-axis direction on the upper surface 83A of the housing 83. The sandwiched plates 85 and 86 have a plate shape extending in the X-axis direction while having substantially the same width in the Y-axis direction. The vertical thickness L3 of the sandwiched plates 85 and 86 is the same as the thickness L1 of the substrate CB shown in FIG. 3 (for example, 2 mm). The sandwiched plates 85 and 86 extend outward from the side edges of the housing 83 in the Y-axis direction and along the plane of the upper surface 83A. The conveyor belt 33 supports the lower surface of the portion of the sandwiched plates 85, 86 that protrudes outward in the Y-axis direction. Further, each of the sandwiched plates 85 and 86 is fixed to the housing 83 by a plurality of (five in this embodiment) screws 88. The conveyor 31 conveys the load measuring device 81 with the portions of the sandwiched plates 85 and 86 protruding outward in the Y-axis direction from the housings 83 on the conveyor belt 33. The width W2 of the load measuring device 81 along the Y-axis direction is substantially the same as the substrate width W1 of the substrate CB (see FIG. 3).

As shown in FIG. 6, the load measuring device 81 includes a power supply 91, a power supply switch 93, a remaining amount meter 94, a load sensor 95, a data logger 97, a measurement start switch 99, an external interface 101, and the like. doing. The power supply 91 is, for example, a rechargeable battery, and supplies a DC voltage V1 to the load sensor 95 and the data logger 97.

The power switch 93 is a switch for switching between starting and stopping the supply of the voltage V1 from the power supply 91 to the load sensor 95 and the like. The power switch 93 is attached to the bottom surface 83E (see FIG. 5) of the housing 83. The power switch 93 is, for example, a slide switch, a tact switch (registered trademark), or the like, and outputs an ON / OFF signal S1 according to an operation from the user to the power supply 91. The power supply 91 starts or stops supplying the voltage V1 to the load sensor 95 or the like in response to the ON / OFF signal S1 from the power switch 93. The remaining amount meter 94 is attached to the bottom surface 83E of the housing 83. The remaining amount meter 94 is connected to the power supply 91 and displays the remaining amount of the battery of the power supply 91.

The load sensor 95 is a sensor that detects a load (such as a force that presses a component) pressed by the suction nozzle 70 of the mounting head 24. The load sensor 95 is, for example, a crystal piezoelectric type load sensor, and is configured as a uniaxial sensor that detects only a load in the vertical direction. The load sensor 95 may be a load sensor of another type such as a strain gauge type. From the viewpoint of responsiveness, the strain gauge type load sensor may not be able to detect the impact load (dynamic force) more accurately than the quartz piezoelectric type. Therefore, as the load sensor 95, a crystal piezoelectric type load sensor is preferable. Further, the load sensor 95 may be a load sensor having a plurality of axes capable of detecting loads in a plurality of directions.

The load sensor 95 has a load input unit 95A attached to the upper surface 83A of the housing 83. As shown in FIG. 4, the upper surface 83A is provided with the measuring plate 83C at a position close to the sandwiched plate 86. The measuring plate 83C is formed with a through hole 83D penetrating in the vertical direction. The load input unit 95A has a substantially cylindrical shape and is inserted in the through hole 83D in the vertical direction.

Here, the user does not set the component on the tape feeder 72, for example, when measuring the load. Then, the mounting machine 11 drives the mounting head 24 based on the control data D1 and presses the load input unit 95A by the suction nozzle 70 that does not suck and hold the parts. When the load input unit 95A is pushed downward by the suction nozzle 70, the load sensor 95 generates compressive stress inside the quartz piezoelectric element (not shown) by the load, and detects analog according to the magnitude of the stress. The voltage V2 is output. The load sensor 95 outputs the detection voltage V2 to the data logger 97. The load sensor 95 may include an amplifier or the like that amplifies the detection voltage V2.

The load sensor 95 of the present embodiment can measure, for example, a static load and a dynamic load. The static load referred to here is, for example, a load that does not change with the passage of time and becomes a constant value among the loads applied from the suction nozzle 70 to the load sensor 95 (parts and substrate CB at the time of mounting). The dynamic load is a load that changes with the passage of time among the loads applied from the suction nozzle 70 to the load sensor 95. Specifically, the dynamic load is, for example, a collision load generated when the suction nozzle 70 is brought into contact (collision) with the load input unit 95A. The static load is, for example, a pressing load generated when the load input portion 95A is pressed by the suction nozzle 70 after contact. The data logger 97 continuously records the dynamic load and the static load (detection voltage V2) output from the load sensor 95 in this mounting operation. By analyzing whether or not the recorded dynamic load and static load (detection voltage V2) satisfy the conditions for withstand load of the substrate CB and parts, the quality of the load can be determined.

The measurement start switch 99 has a pressing switch 99A that can be operated by the suction nozzle 70. The pressing switch 99A is provided on the measuring plate 83C at a position close to the load input unit 95A (see FIG. 4). The measurement start switch 99 is turned off, for example, when the pressure switch 99A is not pressed by the suction nozzle 70, and outputs a low-level recording start signal S2 (see FIG. 6) to the data logger 97. Further, the measurement start switch 99 outputs a high-level recording start signal S2 to the data logger 97, for example, when the pressing switch 99A is pressed downward to a certain reference position by the suction nozzle 70.

The data logger 97 does not store the detection voltage V2 input from the load sensor 95 while the low-level recording start signal S2 is input. Further, the data logger 97 records the detection voltage V2 for a predetermined time from the timing when the high-level recording start signal S2 is input from the measurement start switch 99. This predetermined time is set according to the operation sequence of the suction nozzle 70, more specifically, the actual operation time and the operation state when the component is mounted on the substrate CB. For example, the mounting machine 11 first presses the pressing switch 99A by the suction nozzle 70, and then presses the load input unit 95A. The predetermined time is set to the time required for the operation sequence of the suction nozzle 70. Then, the data logger 97 records the detection voltage V2 output from the load sensor 95 for a predetermined time after the pressing switch 99A is pressed by the suction nozzle 70. The data logger 97 records the input detection voltage V2 as the measurement data D3. This makes it possible to extremely reduce unnecessary data (load due to vibration, etc.) before and after load measurement. The data logger 97 may detect the timing at which the recording of the detection voltage V2 ends by another method. For example, the data logger 97 may continue recording the detection voltage V2 until the pressing switch 99A is pressed again after the recording is started and the high-level recording start signal S2 is input.

The external interface 101 is an interface for connecting to the analysis computer 19 described above. As shown in FIG. 5, the external interface 101 is attached to, for example, the side surface 83B. The user can operate the analysis computer 19 (operation unit 19A) connected to the load measuring device 81 via the external interface 101 to read the measurement data D3 from the data logger 97. As a result, the user can display the measurement data D3 (load measurement result) on the display unit 19B of the analysis computer 19. For example, in the analysis computer 19, the load by the suction nozzle 70 is normal based on whether or not the peak value of the measurement data D3 (value obtained by converting the detection voltage V2 into a load) is within the range of a desired value. Judge whether or not.

Further, as shown in FIG. 4, on the upper surface 83A, 2 for detecting the accurate position of the load measuring device 81 fixed to the working position, in other words, the accurate position of the load input unit 95A and the pressing switch 99A. Two fiducial marks 111 are provided. Fidal marks 111 are provided at positions where the measuring plate 83C is sandwiched on both sides in the X-axis direction. Further, the upper surface 83A is provided with a cord portion 113 at a position close to the sandwiched plate 85. The code unit 113 is, for example, a two-dimensional code for distinguishing the load measuring device 81 from the substrate CB. The code unit 113 may be other identification information such as a bar code as long as it can identify the load measuring device 81 and the substrate CB.

The mounting machine 11 captures the fiducial mark 111 and the cord portion 113 provided on the upper surface 83A of the load measuring device 81 with a camera (not shown) of the mounting head 24 to acquire image data. The mounting machine 11 performs image processing on the image data obtained by capturing the fiducial mark 111 to obtain accurate coordinate positions (positions in the X-axis direction and the Y-axis direction) of the positioned load measuring device 81, the pressing switch 99A, and the like. Is detected. Further, the mounting machine 11 can determine whether or not the load measuring device 81 is the load measuring device 81 by performing image processing on the image data obtained by capturing the image of the code unit 113.

(About load measurement and analysis)
Next, the method of measuring the load by the load measuring device 81 and the method of analysis by the analysis computer 19 will be described with reference to FIGS. 7 and 8. FIG. 7 shows a series of processing procedures from the generation of the control data D1 for load measurement to the analysis of the measurement data D3. FIG. 8 shows the procedure of the load measurement process. The procedure shown in FIGS. 7 and 8 is an example, and can be appropriately changed depending on the configuration of the board-to-board work system 10 and the like.

First, in step 11 of FIG. 7 (hereinafter, simply referred to as “S”) 11, the user generates control data D1 for operating the mounting machine 11 for which the load is to be measured, that is, control data D1 for measurement. .. For example, the user operates the operation unit 19A of the analysis computer 19 to generate the control data D1. The control data D1 executes, for example, an operation as if the parts are acquired from the tape feeder 72 in which the parts are not set (operations that are not actually acquired), and the working position (for example, the position shown in FIG. 2). This is data for executing mounting work on the load measuring device 81 fixed to. The load measuring device 81 measures and stores the load by pressing the load input unit 95A against the suction nozzle 70 during this mounting operation.

Further, in the control data D1, a load applied from the suction nozzle 70 to the component or the substrate CB in the mounting operation, that is, a load applied to the load measuring device 81 at the time of measurement is set. This load is, for example, a load width indicating a target target load value or a range of allowable load values. The target load value and load width are set based on the type of substrate CB to be produced, the load capacity of the components to be mounted, and the like. As a result, the mounting machine 11 to be measured performs the mounting work within the range of the target load value and the load width. As a result, the quality of the load can be determined by comparing the measurement data D3 of the load measuring device 81, which will be described later, with the target load value of the control data D1 (condition data D2).

In particular, the load measuring device 81 of the present embodiment does not have a means or a function of communicating with the mounting machine 11. Therefore, the measurement data D3 of the load measuring device 81 is the data measured without being interfered by the mounting machine 11. More specifically, since the load measuring device 81 cannot execute communication with the mounting machine 11, there is no possibility that the measurement data D3 can be overwritten or rewritten by the mounting machine 11, and the load measuring device 81 is physically assigned by the mounting machine 11. The load can be recorded as the measurement data D3 as it is. As a result, the objectivity of the measurement data D3 as seen by the user can be ensured, and the reliability of the measurement data D3 can be improved.

Next, in S13, the user operates the analysis computer 19 to transmit the control data D1 from the production control computer 18 to the mounting machine 11 to be measured. When the mounting machine 11 of the present embodiment receives the control data D1 from the production control computer 18 prior to the load measurement, the mounting operation based on the received control data D1 is started until the start instruction from the user is received. Wait to do. For example, when the mounting machine 11 receives the control data D1, the mounting machine 11 displays a screen on the display panel 11A (see FIG. 1) for selecting whether or not to carry out the mounting work for measurement. The display panel 11A has, for example, a configuration in which a capacitance type touch panel and a liquid crystal display type display panel are stacked in the thickness direction, and various types can be obtained by pressing the operation keys displayed on the touch panel. It is configured so that input operations can be performed. When the mounting machine 11 receives an input instructing execution to the display panel 11A from the user, the mounting machine 11 starts the mounting work based on the control data D1. The mounting machine 11 may be set to execute the control data D1 without waiting for the user's instruction when the control data D1 is received.

Upon receiving the input from the user to the display panel 11A in S13, the mounting machine 11 starts the load measurement process (S15). For example, the mounting machine 11 displays on the display panel 11A that the load measuring device 81 is carried in from the upstream side of the component mounting line 12 shown in FIG. In S31 of FIG. 8, the user operates the power switch 93 of the load measuring device 81 to turn it on. The power supply 91 starts supplying the voltage V1 to the load sensor 95 and the data logger 97 in response to the input of the ON / OFF signal S1 indicating the ON state.

The user arranges the load measuring device 81 whose power supply is started on the upstream side of the component mounting line 12 (S31). The board-to-board work system 10 selectively operates only the mounting machine 11 whose load is to be measured, for example, based on the control data D1. The board-to-board work system 10 conveys the load measuring device 81 from the upstream side (solder printing machine 13 side) of the component mounting line 12 to the working position of the mounting machine 11 to be measured. Further, the board-to-board work system 10 does not execute the work by the solder printing machine 13 or the like while the load measuring device 81 is conveyed. Then, the mounting machine 11 to be measured operates the mounting head 24 and the suction nozzle 70 based on the control data D1 acquired from the production control computer 18, and executes the mounting work on the load measuring device 81. Since the data logger 97 inputs the low-level recording start signal S2 during the transfer of the load measuring device 81, even if the detection voltage V2 is input from the load sensor 95, the data logger 97 does not record. This makes it possible for the load measuring device 81 to prevent the data logger 97 from erroneously recording vibration or the like during transportation as a load.

Next, the mounting machine 11 to be measured carries in the load measuring device 81 from the board handling device 17 on the upstream side and positions it at the working position (S33). Next, the mounting machine 11 to be measured moves the mounting head 24 based on the control data D1 and images the code portion 113 of the load measuring device 81 held at the working position. The mounting machine 11 detects the code unit 113 from the captured image data (S35). The mounting machine 11 determines whether or not the detected code unit 113 is identification information indicating the load measuring device 81 (S37).

When the mounting machine 11 determines that the detected code unit 113 is not the identification information of the load measuring device 81 (S37: NO), for example, after displaying an error on the display panel 11A and notifying the user of the abnormality (S39), The process shown in FIG. 8 is terminated. In this case, for example, the user will redo the process from S11 in FIG. 7.

On the other hand, when the detected code unit 113 matches the identification information of the load measuring device 81 (S37: YES), the mounting machine 11 images the two fictional marks 111 (S41). The mounting machine 11 detects the accurate coordinate position of the positioned load measuring device 81 based on the position of the fiducial mark 111 detected from the imaging data. The mounting machine 11 corrects the coordinate position for moving the mounting head 24 according to the detected position of the fiducial mark 111 (S41).

Next, the mounting machine 11 executes the mounting work (S43). In the mounting operation, the mounting machine 11 moves the mounting head 24 above the pressing switch 99A. The mounting machine 11 lowers the mounting head 24 and presses the pressing switch 99A by the suction nozzle 70. The measurement start switch 99 outputs the high-level recording start signal S2 to the data logger 97 by pressing the press switch 99A. The data logger 97 starts recording the detection voltage V2 for a predetermined time from this point. The mounting machine 11 moves the mounting head 24 above the load input unit 95A, and pushes the load input unit 95A by the suction nozzle 70. The load sensor 95 outputs the detection voltage V2 corresponding to the pressing load by the suction nozzle 70 to the data logger 97. The data logger 97 ends recording of the detection voltage V2 at a timing when a predetermined time elapses after inputting the high-level recording start signal S2. Therefore, the recording time by the data logger 97 can be set to an appropriate time in advance according to the operation of the mounting head 24 and the suction nozzle 70, more specifically according to the above-mentioned operation.

When the mounting machine 11 executes the mounting work (load measurement) on the load measuring device 81 by the plurality of suction nozzles 70, the above mounting work is sequentially performed by using each of the plurality of suction nozzles 70. Execute. The load for each suction nozzle 70 is sequentially stored in the data logger 97.

Further, when the measurement of all the suction nozzles 70 is completed, the mounting machine 11 saves the condition data D2 at the time of measuring the load. This condition data D2 is data showing various conditions when the measurement is performed. Specifically, the condition data D2 includes, for example, the date and time when the measurement was performed, the identification information of the mounting machine 11 (serial number of the module in FIG. 9), the identification information of the mounting head 24 (head serial number in FIG. 9), and the nozzle. Information such as species (see FIG. 9), target load value, load width, and the like. The mounting machine 11 generates and stores the condition data D2 based on the control data D1 and the like. The mounting machine 11 may be set to delete the old condition data D2 every time a new measurement is performed. This makes it easier to identify the latest condition data D2 in one mounting machine 11. Further, it is possible to prevent the mounting machine 11 from accumulating unnecessary past condition data D2 and pressing the memory or the like.

Next, the mounting machine 11 to be measured carries out the load measuring device 81 to the downstream side (S49). The board-to-board work system 10 conveys the load measuring device 81 carried out from the mounting machine 11 to be measured to the most downstream side (reflow device 15 side) (S49). Then, the user takes out the load measuring device 81 carried out from the component mounting line 12.

Returning to FIG. 7, the user operates the analysis computer 19 to acquire the condition data D2 from the mounting machine 11 that has executed the measurement (S17). The analysis computer 19 acquires the condition data D2 from the mounting machine 11 via the production control computer 18 (see FIG. 1). For example, when the analysis computer 19 receives an operation to acquire the condition data D2 from the user to the operation unit 19A, the analysis computer 19 stores the condition data D2 among the plurality of mounting machines 11 installed on the component mounting line 12. The screen for selecting 11 is displayed on the display unit 19B.

FIG. 10 shows an example of the display screen 121 of the display unit 19B. As shown in FIG. 10, the module S / N (serial number), the condition data acquisition date and time, and the download button 123 are displayed on the display screen 121. For example, the analysis computer 19 inquires of the production control computer 18 for such information and displays it. The module S / N is a unique number for identifying a plurality of mounting machines 11 from each other. The condition data acquisition date and time indicates the date and time when the condition data D2 was acquired. For example, the time information 125 shown in the condition data acquisition date and time is the date and time when the condition data D2 is saved by the mounting machine 11 after the measurement is completed, and is information that can be used to specify the condition data D2. The time information 125 is not limited to the time when the condition data D2 is stored, but may be information that can identify other condition data D2, for example, the time when the load measurement is started by the mounting machine 11. The download button 123 is a button that instructs the analysis computer 19 to start downloading the condition data D2. For example, in the analysis computer 19, when the operation unit 19A (mouse) is operated by the user and one of the download buttons 123 is clicked, the condition data D2 of the selected module is output from the production control computer 18 (mounting machine 11). to download. As a result, the user can download the condition data D2 by pressing the download button 123 while checking the mounting machine 11 that wants to acquire the condition data D2 on the module S / N displayed on the display screen 121.

When the download of the condition data D2 by the analysis computer 19 is completed (S17 in FIG. 7), the user connects the load measuring device 81 to the analysis computer 19 (S19). The user connects the external interface 101 of the load measuring device 81 and the external interface 19C of the analysis computer 19 with a USB cable. When the load measuring device 81 is connected to the analysis computer 19, the analysis computer 19 is in a state where the load can be analyzed.

In this state, for example, when the analysis computer 19 receives an input that the operation unit 19A is operated by the user to start the analysis, the analysis computer 19 reads and reads the measurement data D3 stored in the data logger 97 of the load measuring device 81. However, the measurement data D3 (value of the detected voltage V2) is converted into a load. The analysis computer 19 analyzes the value of the load after conversion based on the downloaded condition data D2 (S21). Therefore, the analysis computer 19 of the present embodiment executes the analysis assuming that the condition data D2 downloaded from the mounting machine 11 selected by the user in S17 and the measurement data D3 read from the load measuring device 81 correspond to each other.

The analysis computer 19 may determine the measurement data D3 corresponding to the condition data D2 based on the information indicating the relationship between the condition data D2 and the measurement data D3. For example, the analysis computer 19 may determine the measurement data D3 corresponding to the condition data D2 based on the time information 125 of the condition data D2 (see FIG. 10) and the time information of the measurement data D3. The time information of the measurement data D3 referred to here is, for example, the time when the load is measured (acquired) by the load measuring device 81. Further, when determining the correspondence relationship based on the time information 125, it is preferable that the reference times of the mounting machine 11 and the load measuring device 81 are matched in advance. For example, the load measuring device 81 may be configured to match the reference time with the mounting machine 11 by being connected to the analysis computer 19 before the measurement. Then, when the load measuring device 81 after the measurement is connected, the analysis computer 19 corresponds to the measurement data D3 based on the time information of the measurement data D3 read from the load measuring device 81 (the time information matches). The condition data D2 may be searched from the mounting machine 11. This eliminates the trouble of having the user select the condition data D2, and can automatically determine and associate the condition data D2 corresponding to the measurement data D3 read by the analysis computer 19.

Further, the analysis computer 19 may determine the measurement data D3 corresponding to the condition data D2 based on information other than the time information 125 (information indicating the relationship between the condition data D2 and the measurement data D3). .. For example, the mounting machine 11 may be configured to be communicable with the load measuring device 81, and may notify the load measuring device 81 of identification information (information indicating relevance) at the time of measurement. Then, the load measuring device 81 may store the identification information notified from the mounting machine 11 in association with the measurement data D3. As a result, the analysis computer 19 can search the condition data D2 corresponding to the measurement data D3 from the mounting machine 11 based on the identification information of the measurement data D3 read from the load measuring device 81.

Further, the load measuring device 81 may include an input unit capable of inputting identification information (information indicating relevance) of the measurement data D3. For example, the user confirms the identification information (module, number that can specify the measurement date and time, etc.) displayed on the display panel 11A (see FIG. 1) of the mounting machine 11 before measuring the load, and the input unit of the load measuring device 81. Enter the identification information confirmed using. The load measuring device 81 may store the input identification information in association with the measurement data D3. Also in this case, the analysis computer 19 can search the condition data D2 corresponding to the measurement data D3 from the mounting machine 11 based on the identification information of the measurement data D3 read from the load measuring device 81.

Further, the analysis computer 19 does not have to determine the correspondence between the condition data D2 and the measurement data D3. For example, the load measuring device 81 may be configured so that only one measurement data D3 can be stored in the data logger 97. The substrate working system 10 may be configured so that the next load measurement cannot be executed until the analysis of the measurement data D3 is executed by the analysis computer 19. As a result, the user always performs the analysis by the analysis computer 19 every time the load is measured once. That is, the user is restricted to perform the work from measurement to analysis as a series of processes. In this case, the measurement data D3 acquired from the load measuring device 81 and the condition data D2 acquired from the production control computer 18 have a one-to-one relationship, and it is not necessary to determine the correspondence relationship. Therefore, the analysis computer 19 can associate the condition data D2 acquired from the production control computer 18 with the measurement data D3 acquired from the load measuring device 81 without determining the correspondence relationship.

Next, when the analysis computer 19 analyzes the measurement data D3 based on the condition data D2, the analysis result is displayed on the display unit 19B (S23). The analysis computer 19 may print the analysis result, for example, without displaying the analysis result on the display unit 19B.

FIG. 9 shows an example of the analysis result. In the upper left of FIG. 9, the serial number of the load measuring device 81 (measuring device S / N in FIG. 9), the serial number of the mounting machine 11 (module S / N in FIG. 9), and the serial number of the mounting head (FIG. 9). The head S / N) in 9 is displayed. This information is set in the condition data D2 and is displayed by the analysis computer 19.

Further, below each serial number, information on the suction nozzle 70 is displayed. In the example shown in FIG. 9, 12 suction nozzles 70 are mounted on the mounting head 24. The information on the suction nozzle 70 includes a number corresponding to the position held in the nozzle holder of the suction nozzle 70 (NO in FIG. 9), a model number of the suction nozzle 70 (nozzle type in FIG. 9), and a serial number of the suction nozzle 70. The number (S / N in FIG. 9) and the judgment result of the quality of the load (result in FIG. 9) are displayed. The NO, model number, and serial number described above are set in the condition data D2 and are displayed by the analysis computer 19. Further, the determination result is analyzed by the analysis computer 19.

Below the information of the suction nozzle 70, the information of the load analysis result is displayed. In the example shown in FIG. 9, the result of measuring the load eight times for each of the twelve suction nozzles 70 is displayed. For example, when the mounting machine 11 measures the load on the load measuring device 81 by a plurality of suction nozzles 70, the mounting machine 11 uses each of the plurality of suction nozzles 70 in order to perform mounting work (pressing the load input unit 95A). To execute. Regarding the measurement of the plurality of suction nozzles 70, the mounting machine 11 performs a cycle of, for example, the first nozzle → the second nozzle → ..... 12th nozzle → the first nozzle ... only eight times in order. repeat. Alternatively, the mounting machine 11 may measure the plurality of suction nozzles 70 for each nozzle, for example, the first nozzle 8 times → the second nozzle 8 times → ..... 12th nozzle 8 times. It may be repeated in the order of times.

The load measuring device 81 measures the load in order for each of the plurality of suction nozzles 70, and stores the load as measurement data D3 in each order. The load for each suction nozzle 70 is sequentially stored in the data logger 97. Further, for example, when the mounting machine 11 saves the condition data D2, the mounting machine 11 saves the order of the suction nozzles 70 that have executed the measurement based on the control data D1 in the condition data D2. Thereby, in the above-mentioned S21, the analysis computer 19 can detect the measurement order of the plurality of suction nozzles 70 based on the condition data D2, and can analyze the measurement data D3 in association with each other according to the detected order. Then, as shown in FIG. 9, the analysis computer 19 displays the load values in the associative order.

Further, as described above, the condition data D2 includes a target target load value for controlling the load applied by the suction nozzle 70 of the mounting head 24 by the mounting machine 11 when measuring the load, and an allowable load. A load width indicating a range of values is set. As shown in FIG. 9, in the information of the load analysis result, the target load value and the load width for each suction nozzle 70 are displayed. The analysis computer 19 analyzes the quality of the load of the measurement data D3 based on the target load value and the load width of the condition data D2 (S21).

For example, the analysis computer 19 targets one suction nozzle 70 and determines whether or not the eight load values obtained by the eight measurements are within the range of the load width with the target load value as a reference. For example, in the suction nozzle 70 of NO1, 181 gf (gram force) is set as the target load value, and 20% is set as the load width. In this case, the analysis computer 19 has, for example, all of the load values measured eight times are equal to or less than the upper limit value (217.2 gf = 181 gf * 1.2) and the lower limit value (144.8 gf = 181 gf * 0.8). In the above cases, it is determined that the load is good.

The criteria for judging quality is not limited to this, and the load is good when, for example, a part of the load value measured eight times (such as a majority) is included between the upper limit value and the lower limit value. May be determined. Further, the analysis computer 19 may determine the quality of the load while the target load value or the load width. For example, the analysis computer 19 may determine the quality of the load depending on whether or not the measured load matches the target load value. Alternatively, the analysis computer 19 may determine whether or not the load is good or bad depending on whether or not the plurality of measured loads are within a certain load width with reference to the average value thereof.

Further, as shown in FIG. 9, in addition to the above-mentioned target load value and load width, the analysis computer 19 provides useful information for the user, for example, the average value of the load width measured eight times, the three sigma value, and the minimum. The value and the maximum value are analyzed (S21) and displayed on the display unit 19B (S23). The information useful to the user is not limited to this, and may be a value calculated using another load value or the like.

Further, as shown in the upper right of FIG. 9, the analysis computer 19 displays the load values measured eight times for each suction nozzle 70 as a scatter diagram. The analysis computer 19 sets the nozzle numbers (1 to 12) on the horizontal axis, sets the load value (gf) on the vertical axis, and plots the load value measured eight times. As a result, the user can easily visually recognize the load value of each suction nozzle 70. The graph is not limited to a scatter diagram, but may be a bar graph or a line graph.

Further, the analysis computer 19 may execute a process of deleting the condition data D2 used for the analysis from the mounting machine 11 at the end of the analysis (S21) or the display of the result (S23). For example, the analysis computer 19 deletes the downloaded condition data D2 and the original data stored in the mounting machine 11 at the timing when the analysis is completed (S21). The analysis computer 19 notifies the production control computer 18 that the condition data D2 (original data) of the mounting machine 11 is to be deleted. As a result, the condition data D2 stored in the mounting machine 11 is deleted when it is used in the analysis and is no longer needed.

Incidentally, in the above embodiment, the substrate working system 10 is an example of a load measuring system. The display panel 11A is an example of a reception unit. The production control computer 18 is an example of a control device. The analysis computer 19 is an example of an analyzer. The process of S17 is an example of the first acquisition process. The process of S21 is an example of the second acquisition process and the analysis process.

According to the above embodiment, the following effects are obtained.
(Effect 1) The board-to-board work system 10 (load measurement system) of the present embodiment is arranged on a mounting machine 11 having a mounting head 24 for mounting components on the board CB, and the mounting head 24 is a component at the time of mounting. A load measuring device 81 for measuring the load applied to the device and an analysis computer 19 (analyzer) are provided. The analysis computer 19 executes the first acquisition process (S17 in FIG. 7) for acquiring the condition data D2, which is the condition of the mounting machine 11 when measuring the load. Further, the analysis computer 19 executes a second acquisition process (S21 in FIG. 7) for acquiring the measurement data D3, which is the result of measuring the load, from the load measuring device 81. Then, the analysis computer 19 executes an analysis process (S21) for analyzing the measurement data D3 acquired in the second acquisition process based on the condition data D2 acquired in the first acquisition process.

According to this, the analysis computer 19 acquires the condition data D2 of the mounting machine 11 at the time of measuring the load. Further, the analysis computer 19 acquires the load measurement data D3 from the load measuring device 81. Then, the analysis computer 19 analyzes the measurement data D3 based on the condition data D2. That is, the analysis computer 19 analyzes the measurement data D3 based on the conditions of the mounting machine 11 at the time of load measurement. The condition data D2 referred to here is, for example, the measurement date and time, the set value of the control data D1 for controlling the mounting machine 11, the type of the device mounted on the mounting machine 11, the mounting state of the device of the mounting machine 11, the temperature, and the like. Humidity etc. Further, the analysis is a process of adding the serial number of the mounting machine 11 to the measurement data D3, a process of calculating the maximum value and the sigma value of the measured load, a process of graphing the calculation result, or a process of determining the quality of the load. And so on. Further, the analysis is, for example, an association between each of the plurality of suction nozzles 70 (held positions and numbers) held in the nozzle holder and the measured measurement data D3. This makes it possible to analyze the measured load based on the conditions at the time of measurement of the mounting machine 11.

(Effect 2) Further, in the condition data D2, the target load value (see FIG. 9) that is the target when the mounting machine 11 controls the load applied by the mounting head 24 in the load measurement, and the allowable load value. At least one of the load widths (see FIG. 9) indicating the range of is set. The analysis computer 19 (analyzer) analyzes the quality of the load of the measurement data D3 based on at least one of the target load value and the load width of the condition data D2.

According to this, the target load value and the load width used by the mounting machine 11 for the actual control at the time of measurement are set in the condition data D2. The analysis computer 19 determines whether or not the load of the measurement data D3 is good or bad based on the target load value and the load width. For example, the analysis computer 19 determines whether or not the load value of the measurement data D3 matches the target load value, so that the control load value matches the measured load value, that is, whether the load is good or bad. Can be determined.

(Effect 3) Further, the analysis computer 19 includes an operation unit 19A that receives an operation from the user, and condition data corresponding to the mounting machine 11 selected by the operation unit 19A in the first acquisition process (S17 in FIG. 7). Acquire D2 (see FIG. 10).

According to this, the user can select from which mounting machine 11 the condition data D2 necessary for analyzing the measurement data D3 of the load measuring device 81 should be acquired by operating the operation unit 19A. .. Therefore, the user can more reliably associate the measurement data D3 with the condition data D2 of the mounting machine 11 that measured the measurement data D3.

(Effect 4) Further, the analysis computer 19 may determine the measurement data D3 corresponding to the condition data D2 based on the information indicating the relationship between the condition data D2 and the measurement data D3.

When the load is measured by a plurality of mounting machines 11 or when the load is measured by the same mounting machine 11 at different times and dates, the correspondence between the condition data D2 and the measurement data D3 may become unclear. On the other hand, the analysis computer 19 determines the correspondence relationship based on the information indicating the relationship between the condition data D2 and the measurement data D3. As a result, the condition data D2 and the measurement data D3 can be appropriately associated with each other even when the load is measured by a plurality of mounting machines 11.

(Effect 5) Further, the analysis computer 19 may use the time information 125 of the condition data D2 and the time information of the measurement data D3 as the information indicating the relationship between the condition data D2 and the measurement data D3.

The analysis computer 19 determines the correspondence relationship based on the time information 125 of the condition data D2 and the time information of the measurement data D3. The time information 125 of the condition data D2 is, for example, the time when the mounting operation for measuring the load is executed. The time information of the measurement data D3 is, for example, the time when the load is measured (acquired) by the load measuring device 81. When the reference time of the mounting machine 11 and the load measuring device 81 are the same, the time when the mounting head 24 of the mounting machine 11 applies the load to the load measuring device 81 and the load applied to the load measuring device 81 are loaded. Should match the time it was acquired. As a result, the condition data D2 and the measurement data D3 can be appropriately associated with each other even when the load is measured by a plurality of mounting machines 11.

(Effect 6) Further, the mounting head 24 includes a plurality of suction nozzles 70 that suck and hold the parts. The load measuring device 81 applies loads in order from each of the plurality of suction nozzles 70, and stores the loads measured in that order as measurement data D3. The analysis computer 19 detects the measurement order of the plurality of suction nozzles 70 based on the condition data D2, and analyzes the measurement data D3 in association with each of the plurality of suction nozzles 70 according to the detected order.

According to this, the analysis computer 19 detects the order of measurement of the plurality of suction nozzles 70 based on the condition data D2, and analyzes the measurement data D3 in association with each of the plurality of suction nozzles 70 according to the detected order. Therefore, even when the plurality of suction nozzles 70 are sequentially measured and the measured plurality of load values are collectively stored in the load measuring device 81, the analysis computer 19 applies the load to the plurality of suction nozzles 70. The suction nozzle 70 and the measurement data D3 can be appropriately associated with each other according to the order obtained.

(Effect 7) Further, the mounting machine 11 executes the work of mounting the parts based on the control data D1. The board-to-board work system 10 is connected to the mounting machine 11 and transmits a production control computer 18 (management device) that transmits control data D1 in which the contents of mounting work for measuring the load are set to the mounting machine 11 to be measured. , Further prepare. The analysis computer 19 (analyzer) acquires the condition data D2 from the mounting machine 11 via the production control computer 18.

According to this, the on-board work system 10 (load measurement system) includes a production control computer 18 (management device) that manages the control data D1 of the mounting machine 11 in addition to the analysis computer 19. The production control computer 18 is installed, for example, in the vicinity of the component mounting line 12 (see FIG. 1) in which the mounting machine 11 is installed, or in a server room located in a place different from the component mounting line 12. The analysis computer 19 acquires the condition data D2 from the mounting machine 11 via the production control computer 18. Therefore, the network on the mounting machine 11 (production line) side and the analysis computer 19 (analysis device) side can be divided by the production control computer 18. For example, it is possible to prevent an error that occurs in one network from spreading to the other network.

(Effect 8) Further, the mounting machine 11 includes a display panel 11A (reception unit) for receiving instructions from the user. When the mounting machine 11 receives the control data D1 in which the contents of the mounting work for measuring the load are set from the production control computer 18 prior to the measurement of the load, the user instructs the display panel 11A to start. Waits to start the mounting work based on the received control data D1 until the reception is received.

According to this, when the mounting machine 11 receives the control data D1 from the production control computer 18, the mounting operation for measuring the load is not immediately started, but waits for a start instruction from the user. Therefore, the user can visually confirm the current state of the mounting machine 11 and then operate the display panel 11A (reception unit) to arrange the load measuring device 81 and start the measurement.

(Effect 9) Further, the analysis computer 19 may delete the condition data D2 used for the analysis from the mounting machine 11 at the end of the analysis work (S23 in FIG. 7).

According to this, by deleting the condition data D2 of the mounting machine 11 at the end of the analysis by the analysis computer 19, it is possible to suppress the accumulation of unnecessary condition data D2 in the mounting machine 11.

Further, the present invention is not limited to the above-described embodiment, and can be implemented in various embodiments with various modifications and improvements based on the knowledge of those skilled in the art.
For example, in the above embodiment, the load measuring device 81 may be configured to display information indicating the relationship between the condition data D2 and the measurement data D3. For example, as shown in FIG. 11, the load measuring device 81 may have a display screen 131 on the upper surface 83A and display the two-dimensional code 133 as information indicating relevance on the display screen 131. By operating the power switch 93 and other switches, the load measuring device 81 displays the two-dimensional code 133 capable of identifying the measurement data D3 measured for the first time after the operation on the display screen 131. Then, when the measurement is completed, the load measuring device 81 associates and saves the measurement data D3 and the two-dimensional code 133. On the other hand, the mounting machine 11 captures and processes the two-dimensional code 133 with a camera or the like provided on the mounting head 24 after the start or measurement of the measurement, and associates the information of the two-dimensional code 133 with the condition data D2. As a result, the analysis computer 19 can search the condition data D2 corresponding to the measurement data D3 from the mounting machine 11 based on the information of the two-dimensional code 133 of the measurement data D3 read from the load measuring device 81.
Further, in the above embodiment, the load may be measured by using a plurality of load measuring devices 81. In this case, the mounting machine 11 may, for example, take an image of the code unit 113 (see FIG. 4) of each load measuring device 81 at the start of measurement, and associate the information of the code unit 113 with the condition data D2. As a result, for example, when the analysis computer 19 connects the load measuring device 81, the code unit 113 of the load measuring device 81 is read by a bar code reader, and the information of the code unit 113 is used as the key information to measure the measurement data D3. The condition data D2 corresponding to can be searched from the mounting machine 11.

Further, in the above embodiment, the case where the board-to-board work system 10 including the mounting machine 11, the solder printing machine 13, the production control computer 18, and the like is adopted as the load measuring system of the present application has been described, but the present invention is not limited to this. The load measuring system of the present application may be configured to include, for example, only an analysis computer 19 and a load measuring device 81.
Further, the analysis computer 19 may directly acquire the condition data D2 from an arbitrary mounting machine 11 without going through the production control computer 18.
Further, the reception unit of the mounting machine 11 in the present application is not limited to the display panel 11A, and may be, for example, a switch or a button.
Further, the production control computer 18 and the analysis computer 19 are not limited to the personal computer, but may be a server device.

Further, the target for measuring the load of the present application is not limited to the suction nozzle 70. In the above embodiment, the mounting head 24 presses the pressing switch 99A or the like by the suction nozzle 70. However, for example, the mounting head 24 may press the pressing switch 99A by another member (chuck or the like) that holds the component.
Further, the configuration of the load measuring device 81 of the above embodiment is an example and can be changed as appropriate. For example, the number of fiducial marks 111 is not limited to two, and may be one or three or more. Further, for example, the pressing switch 99A and the load input unit 95A may be provided at distant positions. Further, for example, the power switch 93 and the external interface 101 may be provided on the upper surface 83A.

10 Board work system (load measurement system), 11 mounting machine, 11A display panel (reception unit), 18 production management computer (management device), 19 analysis computer (analysis device), 19A operation unit, 24 mounting head, 70 suction Nozzle, 81 load measuring device, 125 hours information, CB board, D1 control data, D2 condition data, D3 measurement data.

Claims (9)

A load measuring device that is placed on a mounting machine that has a mounting head that mounts components on a board and measures the load that the mounting head applies to the components during mounting.
Equipped with an analyzer,
The mounting head includes a plurality of suction nozzles for sucking and holding the component.
The load measuring device applies a load to one suction nozzle a plurality of times from each of the plurality of suction nozzles in a predetermined order, and saves measurement data as a result of measuring the load in that order.
The analyzer
Ri condition der of said mounting device when measuring the load, a first acquisition processing for acquiring condition data including the order of suction nozzles perform measurements,
The measurement data, a second acquisition processing for acquiring from said load measuring device,
Based on the condition data acquired in the first acquisition process, the measurement data acquired in the second acquisition process is analyzed, and the plurality of measurement data are aggregated for each of the plurality of suction nozzles and the plurality of suctions are collected. A load measurement system that executes analysis processing that displays the aggregated results for each nozzle. A load measuring device that is placed on a mounting machine that has a mounting head that mounts components on a board and measures the load that the mounting head applies to the components during mounting.
Equipped with an analyzer,
The analyzer
First acquisition to acquire condition data including the load width, which is the condition of the mounting machine when measuring the load and is determined by the ratio of the difference to the reference load value as the load width indicating the range of the allowable load value. Processing and
The second acquisition process of acquiring the measurement data, which is the result of measuring the load, from the load measuring device, and
An analysis process that analyzes the quality of the load of the measurement data acquired in the second acquisition process based on the condition data acquired in the first acquisition process, and an analysis process.
A load measurement system that runs. The first or second aspect of the analyzer, wherein the analyzer includes an operation unit that accepts an operation from a user, and acquires the condition data corresponding to the mounting machine selected by the operation unit in the first acquisition process. Load measurement system. The load measurement system according to any one of claims 1 to 3, wherein the analyzer determines the measurement data corresponding to the condition data based on information indicating the relationship between the condition data and the measurement data. .. The load measurement system according to claim 4, wherein the analyzer uses the time information of the condition data and the time information of the measurement data as information indicating the relationship between the condition data and the measurement data. The mounting machine executes the work of mounting the component based on the control data.
Further equipped with a management device connected to the mounting machine and transmitting the control data in which the contents of the mounting work for measuring the load are set to the mounting machine to be measured.
The analyzing apparatus obtains the condition data via the management device from said mounting machine, the load measuring system according to claim 1乃optimum 5. The mounting machine is provided with a reception unit that receives instructions from the user, and when the control data in which the contents of the mounting work for measuring the load are set is received from the management device prior to the measurement of the load, the user The load measuring system according to claim 6, wherein the load measuring system waits for starting the mounting work based on the received control data until the reception unit receives a start instruction. The analyzer, the condition data is deleted from the mounter to fit the end of the analytical work, the load measuring system according to claim 1乃Itaru 7 used in the analysis. It is a load analysis method using a load measuring device that is arranged on a mounting machine having a mounting head for mounting a component on a substrate and measures the load applied to the component by the mounting head at the time of mounting.
A step of applying a load to the load measuring device a plurality of times by each of the plurality of suction nozzles in a predetermined order based on the condition data by the plurality of suction nozzles provided in the mounting head.
The process of saving the measurement data, which is the result of measuring the load in the predetermined order, and
A step of analyzing the measurement data based on the condition data, totaling the plurality of the measurement data for each of the plurality of suction nozzles, and displaying the total result for each of the plurality of suction nozzles.
How to analyze the load with.

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