JP6879172B2 - Light emitting device - Google Patents

Description

The present disclosure relates to a light emitting device.

As a kind of light emitting device using a semiconductor element such as an LED element, a light emitting device using a package in which a lead is held by a resin member has been proposed. Usually, such a light emitting device is bonded to a wiring board by using solder. In some cases, a recess is formed in the lower part of the side surface of the package of the light emitting device so that the shape (fillet) of the solder after joining can be confirmed (for example, Patent Documents 1 and 2).

A light emitting device provided with such a recess is made into individual pieces by cutting an aggregate of a resin member and a lead. Specifically, by cutting the cutting line including the recessed portion on the lower surface of the lead before cutting with a rotary blade such as a blade, recesses that open to the light emitting device and the side surface are formed.

Japanese Unexamined Patent Publication No. 2011-228812 Japanese Unexamined Patent Publication No. 2014-6404

When cutting the recessed portion of the reed, burrs due to the reed may occur.
One embodiment of the present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a light emitting device capable of suppressing the generation of burrs.

The light emitting device according to the embodiment includes a package, a light emitting element, and a sealing member. The package has a pair of reeds and a resin member that integrally holds the pair of reeds. The package is provided with an element mounting recess having a bottom surface and a side wall from which the upper surfaces of the pair of leads are exposed, and a recess that opens to the outer surface and the lower surface. The light emitting element is arranged on the bottom surface of the element mounting recess. The sealing member is arranged in the element mounting recess. At least one of the leads has a main body portion and a suspension portion. The main body is exposed on the lower surface of the package. The hanging portion extends from the main body portion and forms a part of the outer surface of the package. At least a part of the lower surface of the hanging portion is exposed in the recess above the lower surface of the main body portion. The package includes a soft resin portion softer than the resin member on the lower surface of the hanging portion.

According to the embodiment, it is possible to realize a light emitting device capable of suppressing the generation of burrs.

It is a perspective view seen from the diagonally upper side which shows the light emitting device which concerns on 1st Embodiment. It is a perspective view seen from the diagonally lower side which shows the light emitting device which concerns on 1st Embodiment. It is an end view which shows the light emitting device which concerns on 1st Embodiment. It is a perspective view which shows the lead, the soft resin part, the light emitting element and the wire of the light emitting device which concerns on 1st Embodiment, and is the figure which omitted the resin member and the sealing member. It is an end view which shows the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is an end view which shows the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is an end view which shows the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is an end view which shows the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is an end view which shows the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is a top view which shows the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is a side view which shows the light emitting device which concerns on 2nd Embodiment. It is a partially enlarged end view which shows the light emitting device which concerns on 2nd Embodiment. It is a partially enlarged end view which shows the light emitting device which concerns on 3rd Embodiment. It is a partially enlarged end view which shows the light emitting device which concerns on 4th Embodiment. It is a side view which shows the light emitting device which concerns on 5th Embodiment.

In this specification, the XYZ Cartesian coordinate system is adopted for convenience of explanation. For example, as shown in FIG. 1, the direction from the first lead 11 to the second lead 12 is defined as the “+ X direction”, and the opposite direction is defined as the “−X direction”. The + X direction and the -X direction are collectively referred to as the "X direction". The directions orthogonal to the X direction are referred to as "+ Y direction" and "-Y direction", and the directions orthogonal to the X direction and Y direction are referred to as "+ Z direction" and "-Z direction". The + Z direction is also called "up" and the -Z direction is also called "down", but this notation is also for convenience and is irrelevant to the direction of gravity. Further, the reed, the resin member and the like will be described using the same names before and after cutting.

<First Embodiment>
As shown in FIGS. 1 to 4, the light emitting device 1 according to the present embodiment includes a package 10, a light emitting element 17, and a sealing member 19.

The package 10 is a base on which an electronic component such as a light emitting element is placed, and includes, for example, a first lead 11 and a second lead 12 as leads 111 that function as a pair of electrodes. The first lead 11 and the second lead 12 are separated from each other and are integrally held by the insulating resin member 13. The resin member 13 is arranged in a part above the lead 111, between the leads 111 (between the first lead and the second lead), and a part below the lead 111.

The shape of the package 10 is a substantially rectangular parallelepiped, and the four outer surfaces S include a first side surface 10a, a second side surface 10b, a third side surface 10c, and a fourth side surface 10d. The second side surface 10b is arranged on the opposite side of the first side surface 10a, and the fourth side surface 10d is arranged on the opposite side of the third side surface 10c.

The package 10 includes an element mounting recess 10i that opens on the upper surface 10e. The package 10 includes a recess R that opens to the lower surface 10f and the outer surface S. The recess R includes, for example, a first recess 10g that opens in the first side surface 10a and the lower surface 10f, and a second recess 10h that opens in the second side surface 10b and the lower surface 10f. The recess R is a space for facilitating the formation of solder fillets, and at least a part of the inner surface of each recess is composed of leads.

The package 10 includes a soft resin portion 112 in the recess R. For example, the first soft resin portion 15a is provided in the first recess 10g, and the second soft resin portion 15b is provided in the second recess 10h. The shape of the soft resin portion 112 is, for example, a rectangular parallelepiped. The width of the soft resin portion 112 (width in the Y direction) is preferably the same as the width of the recess R. Further, the depth width (width in the X direction) of the soft resin portion 112 can be, for example, 50% to 80% with respect to the depth width of the recess R. The length between the inner surface of the soft resin portion 112 and the inner side surface of the recess R is, for example, 20% to 50% of the length between the outer surface of the package and the inner surface of the recess R. Can be. The thickness of the soft resin portion 112 (thickness in the Z direction) can be, for example, 33% to 67% with respect to the height of the recess R (the height from the lower surface of the package to the upper bottom of the recess).

The soft resin portion 112 is formed of a resin material that is softer than the resin material that forms the resin member 13. Further, the material of the soft resin portion 112 is preferably a material having better adhesion to the reed than the material of the resin member 13.

The leads 111 (first lead 11 and second lead 12) each include a main body portion and a hanging portion. The main body is a portion that is mainly exposed on the bottom surface of the element mounting recess. Further, the hanging portion is a portion connected to a lead portion, a support column, or a frame portion adjacent to each other at the time of manufacturing, and is a portion forming a part of an outer surface of the light emitting device by being cut. The hanging portion may or may not be exposed on the bottom surface of the element mounting recess. In FIG. 3 and the like, the hanging portion is arranged at the lower part of the side wall of the recess.

For example, the first lead 11 includes a first main body portion 11a, a first suspension portion 11b, and a first side suspension portion 11c and 11d. The first main body portion 11a includes an upper surface having an area on which a light emitting element can be mounted on the bottom surface of the element mounting recess.

The first hanging portion 11b extends from the first main body portion 11a to the first side surface 10a of the package 10. The tip surface of the first hanging portion 11b is exposed on the first side surface 10a and forms a part of the first side surface 10a. The first side suspension portion 11c extends from the first main body portion 11a to the third side surface 10c. The tip surface of the first side hanging portion 11c is exposed on the third side surface 10c and forms a part of the third side surface 10c. The first side suspension portion 11d extends from the first main body portion 11a to the fourth side surface 10d. The tip surface of the first side suspension portion 11d is exposed on the fourth side surface 10d and forms a part of the fourth side surface 10d.

The upper surfaces of the first main body portion 11a, the first hanging portion 11b, the first side hanging portions 11c and 11d form a continuous first upper surface 11e. On the other hand, the lower surface 11f of the first main body 11a is located below the lower surfaces of the first suspension 11b, the first suspension 11c and 11d, is exposed on the lower surface 10f of the package 10, and a part of the lower surface 10f is exposed. It is configured. The lower surface 11g of the first hanging portion 11b is not covered with the resin member 13. That is, in the first recess 10g, a part of the side surface of the first main body portion 11a and a part of the lower surface 11g of the first suspension portion 11b are exposed.

The second lead 12 basically has the same configuration as the first lead 11. In the example shown in FIG. 1 and the like, the second main body portion 12a of the second lead 12 includes an upper surface having an area to which a wire can be connected on the lower surface of the element mounting recess. Further, the length of the second main body portion 12a in the Y direction and the length in the Z direction are equal to the length of the first main body portion 11a of the first lead 11 in the Y direction and the length in the Z direction, respectively. On the other hand, the length of the second main body portion 12a in the X direction is shorter than the length of the first main body portion 11a in the X direction. The light emitting element may be placed on the second lead 12, and the length in the X direction may be the same as that of the first lead 11.

The lead 111 includes a base material and a metal layer such as plating provided on the surface thereof. Substrates include, for example, copper, aluminum, gold, silver, iron, nickel, or metals such as alloys thereof, phosphor bronze, iron-containing copper. These may be a single layer or a laminated structure (for example, a clad material). The surface of the base material contains, for example, silver, aluminum, nickel, palladium, rhodium, gold, copper, or an alloy thereof as the metal layer. Further, the metal layer formed on the upper surface of the reed and the metal layer formed on the lower surface may be different. Further, since the end surface of the hanging portion is a surface exposed by cutting, the base material of the reed is exposed. For example, when the base material is copper, the wettability of the solder is low, so that it is difficult for the solder to be bonded to the end face of the base material. However, since the lower surface of the hanging portion and the side surface of the main body portion that form a part of the inner surface of the recess have a metal layer such as silver on the outermost surface, the solder has good wettability. Since the metal layer having good wettability of the solder is exposed on the inner side surface of the recess, the fillet of the solder is easily formed.

When a silver or silver alloy plating layer is formed on the surface of the reed, it is preferable that a protective layer such as silicon oxide is provided on the surface of the silver or silver alloy plating layer. As a result, it is possible to suppress discoloration of the silver or silver alloy plating layer due to sulfur components in the atmosphere or the like. The protective layer can be formed by a vacuum process such as sputtering, but other known methods may be used.

The package includes an element mounting recess 10i in addition to the recess described above. The bottom surface of the element mounting recess 10i may have an area on which the light emitting element can be mounted. It is preferable that the height of the element mounting recess 10i, in other words, the height of the inner surface of the recess is higher than that of the light emitting element. Further, when the light emitting element and the lead are joined by using a wire, it is preferable that the height of the wire is higher than the total height of the light emitting element and the wire. The shape of the opening of the element mounting recess is, for example, a circular shape, an elliptical shape, a quadrangle, a polygonal shape, a shape obtained by combining these, a shape obtained by cutting out a part of these shapes, a rounded shape, etc. Can be. The inner surface of the element mounting recess may be a surface perpendicular to or inclined with respect to the bottom surface of the recess. The upper surface of the reed, specifically, the first upper surface 11e of the first lead 11 and the second upper surface 12e of the second lead 12 form a part of the lower surface of the element mounting recess 10i. The upper surface 10e of the package 10 is also the upper surface of the side wall of the recess, and is composed of the resin member 13. The inner surface of the element mounting recess 10i is made of a resin member 13.

As the material for forming the resin member 13, a thermoplastic resin, a thermosetting resin, or the like can be used as the resin material to be the base material. Specifically, an epoxy resin composition, a silicone resin composition, a modified epoxy resin composition such as a silicone-modified epoxy resin, a modified silicone resin composition such as an epoxy-modified silicone resin, an unsaturated polyester resin, a saturated polyester resin, and a polyimide resin. Cured products such as compositions and modified polyimide resin compositions, resins such as polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, and PBT resin. Can be used. In particular, it is preferable to use a thermosetting resin of an epoxy resin composition or a modified silicone resin composition. The resin member preferably has a viscosity of 10 pa · s to 40 pa · s in an uncured state, and more preferably 15 pa · s to 25 pa · s.

Further, the resin member 13 is a reflective member (for example, titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide, etc., which is difficult to absorb light from the light emitting element and has a large difference in refractive index with respect to the resin as the base material. By dispersing light-scattering particles such as aluminum nitride), light can be reflected efficiently. Alternatively, in order to improve the contrast of the light emitting device, one having a low light reflectance with respect to the external light (in many cases, sunlight) of the light emitting device may be used. In this case, it is usually preferable that the color is black or a color similar thereto. As the filler at this time, carbon such as acetylene black, activated charcoal, and graphite, transition metal oxides such as iron oxide, manganese dioxide, cobalt oxide, and molybdenum oxide, or colored organic pigments can be used depending on the purpose. it can.

The resin material forming the soft resin portion 112 is softer than the resin material forming the resin member 13. The hardness of the resin member 13 and the soft resin portion 112 is made different by using different materials. For example, the resin member 13 uses silicone as a base material, and the soft resin portion uses epoxy as a base material. Alternatively, the type of resin used as the base material is the same, and the hardness is made different by changing the content rate, type or size of the filler. For example, the content of the filler in the resin member 13 is made higher than the content of the filler in the soft resin portion. Alternatively, the composition of the filler contained in the resin member 13 is titanium oxide (TiO ₂ ), and the composition of the filler contained in the soft resin portion is zinc oxide (ZnO). Alternatively, the size of the filler contained in the resin member 13 is made larger than the size of the filler contained in the soft resin portion.

The light emitting device 1 includes an adhesive layer 16, a light emitting element 17, wires 18a and 18b, and a sealing member 19 in addition to the above-mentioned package. The light emitting element 17 is adhered to the upper surface of the first main body portion 11a of the first lead 11 via the adhesive layer 16. The light emitting element 17 is arranged on the bottom surface of the element mounting recess 10i of the package 10. The wires 18a and 18b connect the electrodes provided on the upper surface of the light emitting element 17 to the upper surfaces of the first main body 11a and the second main body 12a. The sealing member 19 is arranged in the element mounting recess 10i of the package 10 and seals the adhesive layer 16, the light emitting element 17, and the wires 18a and 18b. The sealing member 19 is composed of, for example, a phosphor dispersed in a base material made of a translucent resin.

Next, a method of manufacturing the light emitting device according to the present embodiment will be described.
5A to 5E are end views showing a method of manufacturing the light emitting device according to the present embodiment.
FIG. 6 is a plan view showing a method of manufacturing a light emitting device according to the present embodiment.
The process shown in FIG. 6 is the same as the process shown in FIG. 5A.

As shown in FIGS. 5A and 6, the lead frame 50 is prepared. In the lead frame 50, the leads 111, which become the first lead 11 and the second lead 12 when cut later, are arranged in a matrix along the X direction and the Y direction. A penetrating portion 52 extending in the Y direction is formed between the first lead 11 and the second lead 12 belonging to each lead 111. A frame 53 extending in the X direction is provided between the leads 111 adjacent to each other in the Y direction. The thickness of the frame 53 can be the same as the thickness of the first side hanging portion 11c or the like.

The first hanging portion 11b of the first lead 11 is connected to the second hanging portion 12b of the second lead 12 arranged on the −X direction side thereof. As a result, the area directly below the first hanging portion 11b and the second hanging portion 12b is a recess 54. Further, the first side hanging portion 11c and the first side hanging portion 11d of the first lead 11, the second side hanging portion 12c and the second side hanging portion 12d of the second lead 12 are connected to the frame 53.

Next, as shown in FIGS. 5B and 6, a resin member 13 made of, for example, a white resin material is formed on the first lead 11, the second lead 12, and between the first lead 11 and the second lead 12. To form. The resin member 13 is also arranged below the frame 53 and the first side hanging portions 11c and 11d, and the second side hanging portions 12c and 12d. However, the resin member 13 is not arranged in the recess 54.

Further, a soft resin portion 15 softer than the resin member 13 is formed on the central portion in the X direction on the lower surface of the recess 54. The resin member 13 and the soft resin portion 15 are formed by, for example, mold molding or a 3D printer. The soft resin portion 15 is separated from the first main body portion 11a and the second main body portion 12a. As a result, a structure in which a plurality of packages 10 are continuously arranged in a plane is formed. An element mounting recess 10i is formed on the upper surface of the portion corresponding to each package 10 in this structure.

Next, as shown in FIG. 5C, an adhesive layer 16 (see FIG. 3) is formed on the first main body portion 11a in the element mounting recess 10i, and the light emitting element 17 is placed on the adhesive layer 16. As a result, the light emitting element 17 is adhered to the first main body portion 11a via the adhesive layer 16. Next, the wire 18a is connected between one electrode of the light emitting element 17 and the first main body 11a, and the wire 18b is connected between the other electrode of the light emitting element 17 and the second main body 12a.

Next, as shown in FIG. 5D, a sealing member 19 in which a phosphor is dispersed in, for example, a transparent resin is arranged in the element mounting recess 10i. The adhesive layer 16 (see FIG. 3), the light emitting element 17, the wire 18a, and the wire 18b are coated in the sealing member 19.

Next, as shown in FIGS. 5E and 6, the lead frame 50 and the resin molded body are cut along the X and Y directions along the cutting line DL. At this time, the cutting line DL is set to a position where it passes through the soft resin portion 15. As a result, the soft resin portion 15 is arranged in both of the two recesses formed across the cutting position.

By this cutting, the first hanging portion 11b and the second hanging portion 12b are separated, the recess 54 is separated into the first recess 10g and the second recess 10h, and the soft resin portion 15 is the first soft resin portion 15a and the second. The light emitting device 1 is separated into the soft resin portion 15b, the first side hanging portions 11c and 11d, and the second side hanging portions 12c and 12d are separated from the frame 53, and the light emitting device 1 is separated. In this way, the light emitting device 1 is manufactured.

According to the present embodiment, in the cutting step, the soft resin portion 15 is arranged in the recess through which the blade passes. Since the first hanging portion 11b and the second hanging portion 12b are made of metal, they are likely to extend during cutting and generate burrs, but by arranging the soft resin portion 15, burrs can be made less likely to occur. As a result, the light emitting device 1 having good shape stability can be manufactured. For example, it is possible to prevent a burr extending downward (in the −Z direction) on the tip surface of the first hanging portion 11b from blocking the first recess 10g.

Further, in the present embodiment, since the first soft resin portion 15a is provided in the first recess 10g, the exposed surface of the first lead 11 in the first recess 10g passes through the outer surface of the light emitting device 1. Therefore, the path to the interface between the first lead 11 and the resin member 13 is lengthened by the amount of bypassing the first soft resin portion 15a. As a result, when the light emitting device 1 is mounted, the flux contained in the solder bonded to the first lead 11 in the first recess 10 g is less likely to reach the interface between the first lead 11 and the resin member 13. As a result, it is possible to prevent the flux from entering the light emitting device 1 and damaging the light emitting element 17 and the like. The same applies to the second recess 10h.

<Second embodiment>
FIG. 7 is a side view showing a light emitting device according to the present embodiment.
FIG. 8 is a partially enlarged end view showing the light emitting device according to the present embodiment.

As shown in FIGS. 7 and 8, in the light emitting device 2 according to the present embodiment, a through hole 21 is formed in the first suspension portion 11b. The through hole 21 penetrates the first hanging portion 11b from the upper surface to the lower surface. The soft resin portion 15 is integrally provided not only under the first hanging portion 11b but also above the first hanging portion 11b from under the first hanging portion 11b through the through hole 21. The soft resin portion 15 provided on the first suspension portion 11b may form a part of the first side surface 10a of the package 10, or may be separated from the first side surface 10a.

Similarly, a through hole 22 is formed in the second hanging portion 12b. The through hole 22 penetrates the second hanging portion 12b from the upper surface to the lower surface. The soft resin portion 15 is integrally provided under the second hanging portion 12b, in the through hole 22, and above the second hanging portion 12b. The soft resin portion 15 provided on the second hanging portion 12b may form a part of the second side surface 10b of the package 10, or may be separated from the second side surface 10b.

Since the soft resin portion 15 is integrally formed above and below the suspension portion via the inside of the through hole 21, the soft resin portion 15 is unlikely to fall off. The soft resin portion 15 may have the same width or different widths above and below the hanging portion. The width of the through hole is narrower than the width of the hanging part. Further, one or two or more through holes can be arranged in one hanging portion.

<Third embodiment>
FIG. 9 is a partially enlarged end view showing the light emitting device according to the present embodiment.

As shown in FIG. 9, the light emitting device 3 according to the present embodiment has a recess 12n formed at the tip of the lower surface 12 g of the first hanging portion as compared with the light emitting device 2 according to the second embodiment. The difference is that the lower portion of the soft resin portion 15 is arranged in the recess 12n. As a result, the lower surface 15h of the soft resin portion 15 is located on the same surface as the lower surface 12g of the second hanging portion. Similarly, the lower surface 15 g of the first soft resin portion 15a is located on the same surface as the lower surface 11 g of the first suspension portion.

According to the present embodiment, since the lower surface 15h of the soft resin portion 15 is located on the same surface as the lower surface 12g of the second hanging portion, the soft resin portion 15 does not block the second recess 10h. As a result, when the light emitting device 3 is mounted, the state of the solder bonded to the second lead 12 in the second recess 10h can be easily visually recognized through the second recess 10h. The same applies to the first lead 11. The configuration, manufacturing method, and effect other than the above in the present embodiment are the same as those in the second embodiment.

<Fourth Embodiment>
FIG. 10 is a partially enlarged end view showing a light emitting device according to the present embodiment.

As shown in FIG. 10, in the light emitting device 4 according to the present embodiment, the lower surface 15h of the soft resin portion 15 is higher than the lower surface 12g of the second hanging portion as compared with the light emitting device 3 according to the third embodiment. The difference is that it is located in. Similarly, the lower surface 15 g of the soft resin portion 15 is located above the lower surface 11 g of the first suspension portion. Also, the same effect as that of the third embodiment can be obtained. The configuration, manufacturing method, and effect other than the above in the present embodiment are the same as those in the third embodiment.

<Fifth Embodiment>
FIG. 11 is a side view showing a light emitting device according to the present embodiment.

As shown in FIG. 11, in the light emitting device 5 according to the present embodiment, the soft resin portion 15 is also arranged on the side surface of the first hanging portion 11b on the first side surface 10a of the package 10. Similarly, the second soft resin portion 15b is also arranged on the side surface of the second hanging portion 12b on the second side surface 10b of the package 10. The lower surface 15 g of the soft resin portion 15 may be located below the lower surface 11 g of the second suspension portion, may be located on the same surface, or may be located above.

According to the present embodiment, since the soft resin portion 15 is integrally formed so as to surround the first hanging portion 11b, it is difficult to fall off. The configuration, manufacturing method, and effect other than the above in the present embodiment are the same as those in the first embodiment described above.

Each of the above-described embodiments is an example embodying the present invention, and the present invention is not limited to these embodiments. For example, in each of the above-described embodiments, addition, deletion, or modification of some components or steps are also included in the present invention. Moreover, each of the above-described embodiments can be implemented in combination with each other.

The present invention can be used, for example, as a light source for a lighting device and a display device.

1-5: Light emitting device 10: Package S: Outer surface (10a: 1st side surface, 10b: 2nd side surface, 10c: 3rd side surface, 10d: 4th side surface)
10e: upper surface 10f: lower surface R: concave portion (10 g: first concave portion, 10h: second concave portion)
10i: Element mounting recess 111: Lead 11: First lead (11a: first main body, 11b: first suspension, 11c, 11d: first side suspension)
11e, 12e: Upper surface 11f, 12f: Lower surface 12: Second lead (12a: second main body, 12b: second suspension, 12c, 12d: second side suspension)
12n: Recessed portion 13: Resin member 112: Soft resin portion 15 g, 15h: Lower surface 16: Adhesive layer 17: Light emitting element 18a, 18b: Wire 19: Sealing member 21, 22: Through hole 50: Lead frame 53: Frame 54 : Recessed DL: Cutting line

Claims (6)

A package including a pair of reeds and a resin member that integrally holds the pair of reeds, and an element mounting recess having a bottom surface and a side wall on which the upper surface of the pair of reeds is exposed, and an outer surface. And a package provided with a recess that opens on the lower surface,
A light emitting element arranged on the bottom surface of the element mounting recess and
The sealing member arranged in the element mounting recess and
With
At least one of the leads
The body exposed on the underside of the package and
A hanging portion extending from the main body portion to form a part of the outer surface of the package, and at least a part of the lower surface is exposed in the recess on the upper side of the lower surface of the main body portion.
Have,
A light emitting device provided with a soft resin portion softer than the resin member on the lower surface of the hanging portion. The hanging portion has a through hole penetrating from the upper surface to the lower surface.
The soft resin portion is also arranged in the through hole and on the through hole.
The light emitting device according to claim 1, wherein the portion of the soft resin portion arranged on the through hole constitutes a part of the outer surface of the package. The light emitting device according to claim 1 or 2, wherein the soft resin portion is arranged on the outer surface of the package and on the side surface of the suspension portion. The light emitting device according to any one of claims 1 to 3, wherein the lower surface of the soft resin portion is located below the lower surface of the hanging portion. The light emitting device according to any one of claims 1 to 3, wherein the lower surface of the soft resin portion is located on the same surface as the lower surface of the hanging portion. The light emitting device according to any one of claims 1 to 3, wherein the lower surface of the soft resin portion is located above the lower surface of the hanging portion.

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