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JP2016018990A - Package structure and method of manufacturing the same and mounting member - Google Patents

Package structure and method of manufacturing the same and mounting member Download PDF

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Publication number
JP2016018990A
JP2016018990A JP2015101713A JP2015101713A JP2016018990A JP 2016018990 A JP2016018990 A JP 2016018990A JP 2015101713 A JP2015101713 A JP 2015101713A JP 2015101713 A JP2015101713 A JP 2015101713A JP 2016018990 A JP2016018990 A JP 2016018990A
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Prior art keywords
light emitting
package structure
conductive
emitting element
structure according
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Japanese (ja)
Inventor
ペイチン・リン
Peiching Ling
デュッタ・ヴィヴェク
Vivek Dutta
デジョン・リウ
Dezhong Liu
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Achrolux Inc
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Achrolux Inc
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Priority claimed from TW103139873A external-priority patent/TW201603327A/en
Application filed by Achrolux Inc filed Critical Achrolux Inc
Publication of JP2016018990A publication Critical patent/JP2016018990A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18162—Exposing the passive side of the semiconductor or solid-state body of a chip with build-up interconnect

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Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a package structure, a package structure and a mounting member.SOLUTION: At first, a plurality of conductive parts 200 and light-emitting elements 21 are prepared, and then, the light-emitting elements 21 and conductive parts 200 are coated with a coating body 22. Thereafter, the light-emitting elements 21 and conductive parts 200 are connected by conductive elements 23, while insulating the side face of the light-emitting elements 21 with the coating body 22, thus forming the conductive elements 23. Consequently, the conductive elements 23 can be formed by a plurality of methods.SELECTED DRAWING: Figure 2G

Description

本発明は、パッケージ構造及びその製法に関し、特に発光型パッケージ構造及びその製法に関するものである。   The present invention relates to a package structure and a manufacturing method thereof, and more particularly to a light emitting package structure and a manufacturing method thereof.

電子産業の飛躍的な発展に伴い、電子製品は外観的には軽薄短小になりつつあり、機能的には高性能、高機能、高速度化の方向へ研究が進んでいる。このうち、発光ダイオード（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ、ＬＥＤ）は、寿命が長く、体積が小さく、高耐震性及び低電力消費等の利点を有するため、照明を必要とする電子製品に広く利用されている。従って、工業的には、さまざまな電子製品、民生用電気製品への応用がますます増えている。   With the rapid development of the electronics industry, electronic products are becoming lighter, thinner, and smaller, and research is progressing toward higher performance, higher functionality, and higher speed in terms of functionality. Among these, light emitting diodes (LEDs) are widely used in electronic products that require lighting because they have advantages such as long life, small volume, high earthquake resistance, and low power consumption. Therefore, industrially, the application to various electronic products and consumer electronic products is increasing more and more.

図１Ａ〜図１Ｂは、従来のＬＥＤパッケージ１の製法の断面図である。この製法は、まず、基板１０に開口１１０を有する反射コップ１１を形成し、ＬＥＤ素子１２を開口１１０に設けた後、例えば金線である複数の導線１２０によりＬＥＤ素子１２と基板１０とを電気的に接続し、最後に、ＬＥＤ素子１２を、蛍光粉層を有するパッケージ樹脂体１３で被覆する。   1A to 1B are cross-sectional views of a method for manufacturing a conventional LED package 1. In this manufacturing method, first, the reflective cup 11 having the opening 110 is formed on the substrate 10, the LED element 12 is provided in the opening 110, and then the LED element 12 and the substrate 10 are electrically connected by a plurality of conductive wires 120, for example, gold wires. Finally, the LED element 12 is covered with a package resin body 13 having a fluorescent powder layer.

しかしながら、従来のＬＥＤパッケージ１の製法では、まず電気的接続工程を行った後、パッケージ樹脂体１３を形成するため、電気的接続工程が行われている場合には、ＬＥＤ素子１２の側面には絶縁材質が一切なく、そのため、ワイヤボンディング作業（例えば導線１２０の形成）しか選択することができない。導電ペーストを選択した場合は、導電ペーストがＬＥＤ素子１２の側面にオーバーフローし易くなり、ＬＥＤ素子１２の正面（Ｐ極）が側面（Ｎ極）と互いと電気的に導通することになるため、ショート現象が発生する。   However, in the conventional manufacturing method of the LED package 1, after the electrical connection process is performed first, the package resin body 13 is formed. Therefore, when the electrical connection process is performed, the side surface of the LED element 12 is formed. There is no insulating material, so only a wire bonding operation (for example, formation of the conducting wire 120) can be selected. When the conductive paste is selected, the conductive paste easily overflows to the side surface of the LED element 12, and the front surface (P pole) of the LED element 12 is electrically connected to the side surface (N pole). Short circuit occurs.

このため、従来のＬＥＤパッケージ１の導電素子の種類の選択は限られている。従って、従来技術のような導電素子の選択が限られている問題を解決することは、極めて重要な課題となっている。   For this reason, selection of the kind of the conductive element of the conventional LED package 1 is limited. Therefore, solving the problem of limited selection of conductive elements as in the prior art is an extremely important issue.

そこで、以上のとおりの事情に鑑み、本発明は、
対向する非発光側及び発光側と、非発光側及び発光側に隣接する側面とを有する少なくとも１つの発光素子と、
発光素子の側面を発光素子の発光側が露出するように直接被覆する被覆体と、
発光素子の側面との間のスペースの一部が被覆体によって充填されるように被覆体に結合される複数の導電部と、
被覆体の表面に設けられ、発光素子とそれらの導電部とを接続するための少なくとも１つの導電素子と、
を備えるパッケージ構造を提供する。 Therefore, in view of the circumstances as described above, the present invention
At least one light-emitting element having a non-light-emitting side and a light-emitting side facing each other, and a side surface adjacent to the non-light-emitting side and the light-emitting side;
A covering that directly covers the side surface of the light emitting element so that the light emitting side of the light emitting element is exposed;
A plurality of conductive portions coupled to the covering so that a part of a space between the side surfaces of the light emitting element is filled with the covering;
At least one conductive element provided on the surface of the covering for connecting the light emitting elements and their conductive parts;
A package structure comprising:

また、本発明は、
複数の導電部と、対向する非発光側及び発光側と、前記非発光側及び前記発光側に隣接する側面とを有する少なくとも１つの発光素子とを用意する工程と、
前記発光素子及びそれらの導電部を被覆体で被覆し、前記被覆体は前記発光素子の側面を、前記発光素子の側面と前記導電部との間が前記被覆体によって充填され、前記発光素子の発光側及びそれらの導電部が露出するように直接被覆する工程と、
少なくとも１つの導電素子を前記発光素子及びそれらの導電部に接続するように前記被覆体の表面に形成する工程と、
を含むパッケージ構造の製法を提供する。 The present invention also provides:
Preparing a plurality of conductive portions, at least one light emitting element having a non-light emitting side and a light emitting side facing each other, and a side surface adjacent to the non-light emitting side and the light emitting side;
The light emitting elements and their conductive portions are covered with a covering, and the covering is filled with the covering between the side surfaces of the light emitting elements and between the side surfaces of the light emitting elements and the conductive portions. Directly covering the light emitting side and the conductive parts so that they are exposed;
Forming at least one conductive element on the surface of the covering so as to be connected to the light emitting elements and their conductive parts;
A manufacturing method of a package structure including

さらに、本発明は、少なくとも１つの載置部と、載置部と面一であり、高さが載置部の高さよりも高い複数の導電部とを含む搭載部材を提供する。   Furthermore, the present invention provides a mounting member including at least one mounting portion and a plurality of conductive portions that are flush with the mounting portion and whose height is higher than the height of the mounting portion.

上記のように、本発明に係るパッケージ構造及びその製法によれば、まず発光素子の側面を被覆体で被覆し外部から離隔した後、導電素子を形成するため、複数の方法により導電素子を選択的に形成することができ、従来技術における導電素子の選択が限られる問題を解決することができる。   As described above, according to the package structure and the manufacturing method thereof according to the present invention, first, the side surface of the light emitting element is covered with the covering body and separated from the outside, and then the conductive element is formed. This can solve the problem that the selection of conductive elements in the prior art is limited.

従来のＬＥＤパッケージの製法の断面図である。It is sectional drawing of the manufacturing method of the conventional LED package. 従来のＬＥＤパッケージの製法の断面図である。It is sectional drawing of the manufacturing method of the conventional LED package. 本発明に係るパッケージ構造の製法の断面図である。It is sectional drawing of the manufacturing method of the package structure which concerns on this invention. 本発明に係るパッケージ構造の製法の断面図である。It is sectional drawing of the manufacturing method of the package structure which concerns on this invention. 図２Ｂの上面図である。FIG. 2B is a top view of FIG. 2B. 本発明に係るパッケージ構造の製法の断面図である。It is sectional drawing of the manufacturing method of the package structure which concerns on this invention. 本発明に係るパッケージ構造の製法の断面図である。It is sectional drawing of the manufacturing method of the package structure which concerns on this invention. 図２Ｄの他の実施例である。2D is another embodiment of FIG. 2D. 本発明に係るパッケージ構造の製法の断面図である。It is sectional drawing of the manufacturing method of the package structure which concerns on this invention. 図２Ｅの他の実施例である。2E is another embodiment of FIG. 2E. 本発明に係るパッケージ構造の製法の断面図である。It is sectional drawing of the manufacturing method of the package structure which concerns on this invention. 本発明に係るパッケージ構造の製法の断面図である。It is sectional drawing of the manufacturing method of the package structure which concerns on this invention. 図２Ｇの他の実施例であるFIG. 2G is another embodiment. 図２Ｇの他の実施例であるFIG. 2G is another embodiment. 本発明に係るパッケージ構造の製法の他の実施例の断面図である。It is sectional drawing of the other Example of the manufacturing method of the package structure based on this invention. 本発明に係るパッケージ構造の製法の他の実施例の断面図である。It is sectional drawing of the other Example of the manufacturing method of the package structure based on this invention. 本発明に係るパッケージ構造の製法の他の実施例の断面図である。It is sectional drawing of the other Example of the manufacturing method of the package structure based on this invention. 本発明に係るパッケージ構造の製法の他の実施例の断面図である。It is sectional drawing of the other Example of the manufacturing method of the package structure based on this invention. 本発明に係るパッケージ構造の製法の他の実施例の断面図である。It is sectional drawing of the other Example of the manufacturing method of the package structure based on this invention. 本発明に係るパッケージ構造の製法の他の実施例の断面図である。It is sectional drawing of the other Example of the manufacturing method of the package structure based on this invention. 図４Ｃの他の実施例である。4D is another embodiment of FIG. 4C. 本発明に係るパッケージ構造の他の実施例の断面及び上面図である。It is the cross section and top view of another Example of the package structure based on this invention. 本発明に係るパッケージ構造の他の実施例の断面及び上面図である。It is the cross section and top view of another Example of the package structure based on this invention. 本発明に係るパッケージ構造の製法の他の実施例の断面図である。It is sectional drawing of the other Example of the manufacturing method of the package structure based on this invention. 本発明に係るパッケージ構造の製法の他の実施例の断面図である。It is sectional drawing of the other Example of the manufacturing method of the package structure based on this invention. 本発明に係るパッケージ構造の製法の他の実施例の断面図である。It is sectional drawing of the other Example of the manufacturing method of the package structure based on this invention. 本発明に係るパッケージ構造の製法の他の実施例の断面図である。It is sectional drawing of the other Example of the manufacturing method of the package structure based on this invention. 本発明に係るパッケージ構造の製法の他の実施例の断面図である。It is sectional drawing of the other Example of the manufacturing method of the package structure based on this invention. 本発明に係るパッケージ構造の製法の他の実施例の断面図である。It is sectional drawing of the other Example of the manufacturing method of the package structure based on this invention. 本発明に係るパッケージ構造の製法の他の実施例の断面図である。It is sectional drawing of the other Example of the manufacturing method of the package structure based on this invention. 本発明に係るパッケージ構造の製法の他の実施例の断面図である。It is sectional drawing of the other Example of the manufacturing method of the package structure based on this invention. 本発明に係るパッケージ構造の他の実施例の断面図である。It is sectional drawing of the other Example of the package structure based on this invention. 本発明に係るパッケージ構造の他の実施例の上面図である。It is a top view of the other Example of the package structure based on this invention. 本発明に係るパッケージ構造の他の実施例の断面図である。It is sectional drawing of the other Example of the package structure based on this invention.

以下、具体的な実施例を用いて本発明の実施形態を説明する。この技術分野の当業者は、本明細書の記載内容によって簡単に本発明のその他の利点や効果を理解できる。   Hereinafter, embodiments of the present invention will be described using specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention based on the description of the present specification.

また、明細書に添付された図面に示す構造、比例、寸法等は、この技術分野の当業者が理解できるように明細書に記載の内容に合わせて説明されるものであり、本発明の実施を制限するものではないため、技術上の実質的な意味を有せず、いかなる構造の修正、比例関係の変更又は寸法の調整は、本発明の効果及び目的に影響を与えるものでなければ、本発明に開示された技術内容の範囲に入る。また、明細書に記載の例えば「上」、「第１」、「第２」、「一」等の用語は、説明が容易に理解できるようにするためのものであり、本発明の実施可能な範囲を限定するものではなく、その相対関係の変更又は調整は、技術内容の実質的変更がなければ、本発明の実施可能の範囲と見なされる。   In addition, the structures, proportions, dimensions, and the like shown in the drawings attached to the specification are explained according to the contents described in the specification so that those skilled in the art can understand, and the implementation of the present invention. Therefore, any modification of the structure, change of the proportional relationship or adjustment of the dimensions does not affect the effect and purpose of the present invention. It falls within the scope of the technical content disclosed in the present invention. In addition, terms such as “upper”, “first”, “second”, “one”, etc., described in the specification are for facilitating understanding of the explanation, and the present invention can be implemented. It is not intended to limit the scope of the present invention, and any change or adjustment of the relative relationship is considered to be within the scope of implementation of the present invention unless there is a substantial change in the technical contents.

図２Ａないし図２Ｇは、本発明に係るパッケージ構造の製法の断面図である。   2A to 2G are cross-sectional views of a method for manufacturing a package structure according to the present invention.

図２Ａに示すように、金属基材２０’は、対向する第１側２０ａと第２側２０ｂとを含む。   As shown in FIG. 2A, the metal substrate 20 'includes a first side 20a and a second side 20b facing each other.

図２Ｂないし図２Ｂ−１に示すように、基材２０’の第１側２０ａの一部の材質をエッチング及びセミエッチングにより除去することで複数の載置部２０１を形成し、基材２０’の第１側２０ａの除去されていない部分を複数の導電部２００とし、基材２０’の第１側２０ａから第２側２０ｂまで貫通することで第１側２０ａと第２側２０ｂとを連通する複数の開口２０２及び溝道２０３を形成することにより、例えばリードフレームである搭載部材２０を複数製造する。   As shown in FIGS. 2B to 2B-1, a part of the material on the first side 20a of the base material 20 ′ is removed by etching and semi-etching to form a plurality of placement portions 201, and the base material 20 ′. The portions of the first side 20a that are not removed are formed as a plurality of conductive portions 200, and the first side 20a and the second side 20b are communicated by penetrating from the first side 20a to the second side 20b of the base material 20 ′. By forming a plurality of openings 202 and groove paths 203, a plurality of mounting members 20 that are lead frames, for example, are manufactured.

この実施例において、図２Ｂは、図２Ｂ−１のＢ−Ｂ断面線の断面図である。それらの搭載部材２０の周囲の製造工程が同様であることから、説明の簡単化のために、単一の搭載部材２０のみ図示する。   In this embodiment, FIG. 2B is a cross-sectional view taken along the line BB of FIG. 2B-1. Since the manufacturing process around these mounting members 20 is the same, only a single mounting member 20 is shown for simplicity of explanation.

さらに、それらの搭載部材２０は、少なくとも１つの載置部２０１と複数の導電部２００とを有する。載置部２０１は、導電部２００と面一であり（例えば水平線Ｘ）、導電部２００の高さＨは載置部２０１の高さｈよりも大きい。例えば、導電部２００の高さＨは３００μｍであり、載置部２０１の高さｈは１３０μｍであり、導電部２００の高さＨは３００μｍ以下である。   Furthermore, those mounting members 20 have at least one placement portion 201 and a plurality of conductive portions 200. The placement unit 201 is flush with the conductive unit 200 (for example, the horizontal line X), and the height H of the conductive unit 200 is greater than the height h of the placement unit 201. For example, the height H of the conductive part 200 is 300 μm, the height h of the mounting part 201 is 130 μm, and the height H of the conductive part 200 is 300 μm or less.

また、開口２０２は、載置部２０１の周囲に位置し、溝道２０３は、切断道として用いられる。   Moreover, the opening 202 is located around the mounting portion 201, and the groove path 203 is used as a cutting path.

また、基材２０’の第１側２０ａの一部を除去することで接続部２０４を形成し、また、次の発光素子の載置のために、基材２０’に位置決め孔２０５として貫通部分を形成する。   Further, the connection portion 204 is formed by removing a part of the first side 20a of the base material 20 ′, and a through-hole is formed as a positioning hole 205 in the base material 20 ′ for mounting the next light emitting element. Form.

図２Ｃに示すように、発光素子２１を搭載部材２０の載置部２０１に設置する。   As illustrated in FIG. 2C, the light emitting element 21 is installed on the mounting portion 201 of the mounting member 20.

この実施例において、発光素子２１は、発光ダイオードであり、載置部２０１に結合された非発光側２１ｂと、非発光側２１ｂに対向する発光側２１ａと、非発光側２１ｂ及び発光側２１ａに隣接する側面２１ｃとを有し、発光側２１ａ上には複数の電極２１０が設けられ、非発光側２１ｂは、発光素子２１の放熱側として用いられる。   In this embodiment, the light-emitting element 21 is a light-emitting diode, and includes a non-light-emitting side 21b coupled to the mounting portion 201, a light-emitting side 21a facing the non-light-emitting side 21b, a non-light-emitting side 21b, and a light-emitting side 21a. A plurality of electrodes 210 are provided on the light emitting side 21 a, and the non-light emitting side 21 b is used as a heat radiating side of the light emitting element 21.

さらに、搭載部材２０の導電部２００の高さは、発光素子２１の発光側２１ａの高さと同等である。   Furthermore, the height of the conductive portion 200 of the mounting member 20 is equal to the height of the light emitting side 21 a of the light emitting element 21.

また、それらの導電部２００は、図２Ｂ−１に示すように、発光素子２１の左右の両側面２１ｃの外周に位置する。しかしながら、それらの導電部２００の位置は上記に限定されず、必要に応じて構成することができる。   Moreover, those conductive parts 200 are located on the outer periphery of the left and right side surfaces 21c of the light emitting element 21, as shown in FIG. 2B-1. However, the positions of the conductive portions 200 are not limited to the above, and can be configured as necessary.

図２Ｄに示すように、被覆体２２を、発光素子２１及び載置部２０１を被覆するとともに発光素子２１の側面２１ｃを直接被覆するように搭載部材２０に形成する。また、被覆体２２は、発光素子２１の側面２１ｃとそれらの導電部２００との間に位置する。被覆体２２は、対向する第１の表面２２ａと第２の表面２２ｂとを有し、発光素子２１の発光側２１ａ及び導電部２００の上表面２００ａは、被覆体２２の第１の表面２２ａに露出している。   As illustrated in FIG. 2D, the covering 22 is formed on the mounting member 20 so as to cover the light emitting element 21 and the mounting portion 201 and directly cover the side surface 21 c of the light emitting element 21. The covering 22 is located between the side surface 21 c of the light emitting element 21 and the conductive portion 200. The covering body 22 has a first surface 22 a and a second surface 22 b facing each other, and the light emitting side 21 a of the light emitting element 21 and the upper surface 200 a of the conductive portion 200 are on the first surface 22 a of the covering body 22. Exposed.

この実施例において、被覆体２２は、発光素子２１がその発光側２１ａのみから出射するように、シリカゲルであり、例えばホワイトグルーである。また、被覆体２２は、発光素子２１がその発光側２１ａ及び側面２１ｃから出射し、被覆体２２が開口２０２（及び溝道２０３）に形成されるように、透明シリカゲルであってもよい。   In this embodiment, the covering 22 is silica gel such as white glue so that the light emitting element 21 emits only from the light emitting side 21a. The covering 22 may be transparent silica gel so that the light emitting element 21 emits from the light emitting side 21a and the side surface 21c and the covering 22 is formed in the opening 202 (and the groove 203).

さらに、導電部２００の上表面２００ａ及び発光素子２１の発光側２１ａは、被覆体２２の第１の表面２２ａと面一である。   Furthermore, the upper surface 200 a of the conductive part 200 and the light emitting side 21 a of the light emitting element 21 are flush with the first surface 22 a of the covering 22.

また、図２Ｄ−１に示すように、ダイ３の内側表面に離型膜３０を貼設することで離型膜３０を発光側２１ａ及び導電部２００の上表面２００ａに被覆することにより、被覆体２２を形成するとともにダイ３及びその離型膜３０を除去した後、発光素子２１の発光側２１ａ及び導電部２００の上表面２００ａが被覆体２２の第１の表面２２ａに露出することを確保することができる。   Also, as shown in FIG. 2D-1, by covering the release film 30 on the light emitting side 21a and the upper surface 200a of the conductive portion 200 by attaching the release film 30 to the inner surface of the die 3, the coating is performed. After forming the body 22 and removing the die 3 and its release film 30, it is ensured that the light emitting side 21 a of the light emitting element 21 and the upper surface 200 a of the conductive part 200 are exposed to the first surface 22 a of the covering 22. can do.

図２Ｅに示すように、例えば導電ペーストまたは金属メッキ回路である導電素子２３を被覆体２２の第１の表面２２ａに形成することにより、導電素子２３を発光素子２１の電極２１０及びそれらの導電部２００の上表面２００ａに電気的に接続する。   As shown in FIG. 2E, the conductive element 23 is formed on the first surface 22a of the covering 22 by, for example, a conductive paste or a metal plating circuit, so that the conductive element 23 becomes the electrode 210 of the light emitting element 21 and their conductive portions. It is electrically connected to the upper surface 200a of the 200.

この実施例において、導電素子２３は、例えば銀ペーストまたは銅ペーストである導電ペーストであり、塗布により形成されるものである。被覆体２２が発光素子２１の側面２１ｃ（非発光側２１ｂ及び発光側２１ａに隣接する）を被覆しているため、導電ペーストを導電素子２３として用いる場合、導電ペーストは、発光素子２１の側面２１ｃにオーバフローすることができず、発光素子２１の電極２１０と側面２１ｃの電極（図示せず）と電気的に導通することはなく、ショートの発生を回避することができる。   In this embodiment, the conductive element 23 is a conductive paste such as a silver paste or a copper paste, and is formed by coating. Since the covering 22 covers the side surface 21c of the light emitting element 21 (adjacent to the non-light emitting side 21b and the light emitting side 21a), when the conductive paste is used as the conductive element 23, the conductive paste is the side surface 21c of the light emitting element 21. , The electrode 210 of the light emitting element 21 and the electrode (not shown) of the side surface 21c are not electrically connected, and the occurrence of a short circuit can be avoided.

また、図２Ｅ−１に示すように、ワイヤボンディング作業を選択することができ、即ち導電素子２３’は導線である。   Further, as shown in FIG. 2E-1, a wire bonding operation can be selected, that is, the conductive element 23 'is a conductive wire.

また、図２Ｆに示すように、複数の蛍光粒子２４０を有する蛍光層２４を被覆体２２の第１の表面２２ａに形成することにより、発光素子２１の発光側２１ａ、導電部２００の上表面２００ａ及び導電素子２３を被覆する。   Further, as shown in FIG. 2F, by forming a fluorescent layer 24 having a plurality of fluorescent particles 240 on the first surface 22a of the covering 22, the light emitting side 21a of the light emitting element 21 and the upper surface 200a of the conductive part 200 are formed. And the conductive element 23 is covered.

この実施例において、導電ペーストを発光素子２１とそれらの導電部２００とを接続するための導電素子２３として用いているため、従来の導線の弧度を考慮する必要はなく、必要に応じて蛍光層２４を薄くすることにより構造全体の高さを低減することができる。   In this embodiment, since the conductive paste is used as the conductive element 23 for connecting the light emitting element 21 and the conductive portion 200, it is not necessary to consider the arc degree of the conventional conductor, and the fluorescent layer is used as necessary. By reducing the thickness 24, the height of the entire structure can be reduced.

図２Ｇに示すように、蛍光層２４を保護するための保護層（図示せず）、または例えばレンズである光透過層２５を蛍光層２４に形成し、溝道２０３に沿って（図２Ｂ−１参照）切断作業を行うことにより、複数の発光型パッケージ構造２を製造する。導電部２００及び接続部２０４は、導電部２００及び接続部２０４が被覆体２２の側面に露出するように被覆体２２の側面に嵌合されている。   As shown in FIG. 2G, a protective layer (not shown) for protecting the fluorescent layer 24, or a light transmission layer 25, for example, a lens is formed on the fluorescent layer 24, and along the groove 203 (FIG. 2B- 1) A plurality of light emitting package structures 2 are manufactured by performing a cutting operation. The conductive portion 200 and the connection portion 204 are fitted to the side surface of the cover body 22 so that the conductive portion 200 and the connection portion 204 are exposed on the side surface of the cover body 22.

さらに、図２Ｅ−１に示す製造工程に続き、図２Ｇ−１に示すパッケージ構造２’を得ることができる。   Further, following the manufacturing process shown in FIG. 2E-1, a package structure 2 'shown in FIG. 2G-1 can be obtained.

また、図２Ｇ−２におけるパッケージ構造２’’に示すように、それらの蛍光粒子２４０は、蛍光層２４’’の一側に位置してもよい。   Further, as shown in the package structure 2 ″ in FIG. 2G-2, the fluorescent particles 240 may be positioned on one side of the fluorescent layer 24 ″.

図３Ａないし図３Ｃは、本発明に係るパッケージ構造の製法の他の実施例の断面図である。   3A to 3C are cross-sectional views of another embodiment of a method for manufacturing a package structure according to the present invention.

図３Ａに示すように、まず、金属基材をエッチング及びセミエッチング等の工程により搭載部材として形成する。搭載部材は、複数の導電部３００と、導電部の一端に形成され、側方に延在する載置部３０１とを有する。図に示すように、２つの導電部３００の一端に互いに延在する載置部３０１がそれぞれ形成され、互いに延在する載置部３０１は接触していない。   As shown in FIG. 3A, first, a metal substrate is formed as a mounting member by processes such as etching and semi-etching. The mounting member includes a plurality of conductive portions 300 and a placement portion 301 formed at one end of the conductive portion and extending laterally. As shown in the figure, mounting portions 301 extending from each other are formed at one ends of the two conductive portions 300, and the mounting portions 301 extending from each other are not in contact with each other.

図３Ｂに示すように、載置部３０１に結合される非発光側３１ｂと、非発光側３１ｂに対向する発光側３１ａと、非発光側３１ｂ及び発光側３１ａに隣接する側面３１ｃとを有する発光ダイオードである発光素子３１を載置部３０１に接続する。非発光側３１ｂ上には、発光素子３１がフリップチップ反転により載置部３０１に電気的に接続されるようにする複数の電極３１０が設けられている。   As shown in FIG. 3B, a light emission having a non-light emitting side 31b coupled to the mounting portion 301, a light emitting side 31a facing the non-light emitting side 31b, and a side surface 31c adjacent to the non-light emitting side 31b and the light emitting side 31a. A light emitting element 31 that is a diode is connected to the mounting portion 301. On the non-light emitting side 31b, there are provided a plurality of electrodes 310 that allow the light emitting element 31 to be electrically connected to the mounting portion 301 by flip chip inversion.

次に、発光素子の側面３１ｃを被覆するための被覆体３２、例えばシリカゲルまたはホワイトグルーを形成するとともに、発光素子３１の発光側３１ａ及び導電部３００を被覆体３２に露出させる。   Next, a cover 32 for covering the side surface 31 c of the light emitting element, for example, silica gel or white glue, is formed, and the light emitting side 31 a and the conductive portion 300 of the light emitting element 31 are exposed to the cover 32.

図３Ｃに示すように、発光素子３１の発光側３１ａに蛍光層３４を形成し、またはさらに保護層若しくは光透過層３５を形成する。   As shown in FIG. 3C, a fluorescent layer 34 is formed on the light emitting side 31a of the light emitting element 31, or a protective layer or a light transmitting layer 35 is further formed.

図４Ａないし図４Ｃは、本発明に係るパッケージ構造の製法の他の実施例の断面図である。   4A to 4C are cross-sectional views of another embodiment of a method for manufacturing a package structure according to the present invention.

図４Ａに示すように、複数の導電部４００を有する搭載部材及び発光素子４１を例えば離型膜である搭載体４６に載置する。   As shown in FIG. 4A, the mounting member having the plurality of conductive portions 400 and the light emitting element 41 are mounted on a mounting body 46 that is a release film, for example.

発光素子４１は、発光ダイオードであり、搭載体４６に結合された非発光側４１ｂと、非発光側４１ｂに対向する発光側４１ａと、非発光側４１ｂ及び発光側４１ａに隣接する側面４１ｃとを有し、非発光側４１ｂ上には複数の電極４１０が設けられている。   The light-emitting element 41 is a light-emitting diode, and includes a non-light-emitting side 41b coupled to the mounting body 46, a light-emitting side 41a facing the non-light-emitting side 41b, and a side surface 41c adjacent to the non-light-emitting side 41b and the light-emitting side 41a. And a plurality of electrodes 410 are provided on the non-light emitting side 41b.

次に、図４Ｂに示すように、発光素子の側面４１ｃを被覆する、例えばシリカゲルまたはホワイトグルーである被覆体４２を形成するとともに、発光素子４１の発光側４１ａ及び導電部４００を被覆体４２に露出させる。   Next, as shown in FIG. 4B, a covering 42 that is, for example, silica gel or white glue is formed to cover the side surface 41 c of the light emitting element, and the light emitting side 41 a and the conductive portion 400 of the light emitting element 41 are formed on the covering 42. Expose.

この後、発光素子４１の発光側４１ａに蛍光層４４を形成し、またはさらに保護層若しくは光透過層４５を形成する。   Thereafter, a fluorescent layer 44 is formed on the light emitting side 41 a of the light emitting element 41, or a protective layer or a light transmitting layer 45 is further formed.

図４Ｃに示すように、搭載体４６を除去し、発光素子４１と導電部４００とを電気的に接続する。   As shown in FIG. 4C, the mounting body 46 is removed, and the light emitting element 41 and the conductive portion 400 are electrically connected.

また、図４Ｃ−１は、本発明に係るパッケージ構造の他の実施例の断面図である。この実施例におけるパッケージ構造は上記と略同一であり、主な相違点は、導電部４００’の発光素子４１に対応する位置に曲面または斜面４００ａが形成され、導電部４００’と発光素子４１との間に発光素子４１の側面の光源の反射のために透明被覆体４２が形成されている点にある。   FIG. 4C-1 is a cross-sectional view of another embodiment of the package structure according to the present invention. The package structure in this embodiment is substantially the same as described above, and the main difference is that a curved surface or inclined surface 400a is formed at a position corresponding to the light emitting element 41 of the conductive portion 400 ′. The transparent covering 42 is formed for the reflection of the light source on the side surface of the light emitting element 41 between the two.

図５Ａないし図５Ｂは、本発明に係るパッケージ構造の他の実施例の断面及び上面図である。この実施例におけるパッケージ構造は上記と略同一であり、主な相違点は、金属基材にエッチング工程を行うことにより搭載部材を形成する点にある。搭載部材は、発光素子５１を収容するための開口５００ａを有し、開口５００ａの両側には導電部５００が設けられており、発光素子５１が導電部５００に電気的に接続される。また、それらの開口５００ａの間に溝５００ｂを形成することにより、発光素子５１と導電部５００との間に被覆体５２が形成された場合には、被覆体５２の材料は溝５００ｂから注入され、発光素子５１の周囲を被覆することができる。   5A to 5B are a cross-sectional view and a top view of another embodiment of the package structure according to the present invention. The package structure in this embodiment is substantially the same as described above, and the main difference is that a mounting member is formed by performing an etching process on a metal substrate. The mounting member has an opening 500 a for accommodating the light emitting element 51. The conductive part 500 is provided on both sides of the opening 500 a, and the light emitting element 51 is electrically connected to the conductive part 500. In addition, when the cover 52 is formed between the light emitting element 51 and the conductive portion 500 by forming the groove 500b between the openings 500a, the material of the cover 52 is injected from the groove 500b. The periphery of the light emitting element 51 can be covered.

図６Ａないし図６Ｄは、本発明に係るパッケージ構造の製法の他の実施例の断面図である。この実施例におけるパッケージ構造の製法は上記と略同一であり、主な相違点は発光素子に離型膜が被覆されている点にある。   6A to 6D are cross-sectional views of another embodiment of a method for manufacturing a package structure according to the present invention. The manufacturing method of the package structure in this embodiment is substantially the same as described above, and the main difference is that the light emitting element is covered with a release film.

図６Ａに示すように、複数の発光素子６１を含む基板６１１を離型膜６７１全体に載置する。   As shown in FIG. 6A, a substrate 611 including a plurality of light emitting elements 61 is placed on the entire release film 671.

この後、それらの発光素子６１の周囲に対応して基板６１１及び離型膜６７１全体を切断することで、表面に離型膜６７１が貼付された発光素子６１を複数形成する。発光素子６１は、対向する発光側６１ａ及び非発光側６１ｂを有し、発光側は複数の電極６１０を有し、離型膜６７１は発光側６１ａに貼付されている。   Thereafter, the substrate 611 and the entire release film 671 are cut in correspondence with the periphery of the light emitting elements 61 to form a plurality of light emitting elements 61 each having a release film 671 attached to the surface. The light emitting element 61 has a light emitting side 61a and a non-light emitting side 61b facing each other, the light emitting side has a plurality of electrodes 610, and a release film 671 is attached to the light emitting side 61a.

図６Ｂに示すように、表面に離型膜６７１が貼付された発光素子６１、及び複数の導電部６００を有する搭載部材を搭載体６６に載置する。発光素子６１は、非発光側６１ｂが搭載体６６に載置される。次に、発光素子６１と導電部６００との間に被覆体６２を形成する。発光素子６１の発光側６１ａに離型膜６７が貼付されているため、被覆体６２の形成時に発光側６１ａを汚染することを回避することができる。   As shown in FIG. 6B, a light emitting element 61 having a release film 671 attached to the surface and a mounting member having a plurality of conductive parts 600 are placed on a mounting body 66. The non-light emitting side 61 b of the light emitting element 61 is placed on the mounting body 66. Next, a covering 62 is formed between the light emitting element 61 and the conductive portion 600. Since the release film 67 is affixed to the light emitting side 61 a of the light emitting element 61, it is possible to avoid contamination of the light emitting side 61 a when the covering 62 is formed.

図６Ｃに示すように、発光素子６１の発光側６１ａ上の離型膜６７を除去するとともに発光素子６１の電極６１０と導電部６００とを電気的に接続する。この実施例において、導電材料の塗布により発光素子６１と導電部６００とを電気的に接続する。当然ながら、その他の方法、例えばワイヤボンディングにより行ってもよい。また、この実施例において、導電部６００の高さは、被覆体６２と略同一であり、発光素子６１の高さは被覆体６２よりも小さく、所定の段差が形成されている。   As shown in FIG. 6C, the release film 67 on the light emitting side 61a of the light emitting element 61 is removed, and the electrode 610 of the light emitting element 61 and the conductive portion 600 are electrically connected. In this embodiment, the light emitting element 61 and the conductive portion 600 are electrically connected by applying a conductive material. Of course, other methods such as wire bonding may be used. Further, in this embodiment, the height of the conductive portion 600 is substantially the same as that of the cover 62, the height of the light emitting element 61 is smaller than that of the cover 62, and a predetermined step is formed.

この後、図６Ｄに示すように、発光素子６１の発光側６１ａに蛍光層６４を形成し、またはさらに保護層若しくは光透過層６５を形成するとともに搭載体６６を除去する。   Thereafter, as shown in FIG. 6D, the fluorescent layer 64 is formed on the light emitting side 61a of the light emitting element 61, or the protective layer or the light transmitting layer 65 is further formed and the mounting body 66 is removed.

図７Ａないし図７Ｄは、本発明に係るパッケージ構造の製法の他の実施例の断面図である。この実施例におけるパッケージ構造の製法は上記と略同一であり、主な相違点は、発光素子に離型膜が被覆され、フリップチップ反転により搭載部材に電気的に接続される点にある。   7A to 7D are cross-sectional views of another embodiment of a method for manufacturing a package structure according to the present invention. The manufacturing method of the package structure in this embodiment is substantially the same as described above, and the main difference is that the light emitting element is covered with a release film and electrically connected to the mounting member by flip chip inversion.

図７Ａに示すように、複数の発光素子７１を含む基板７１１を離型膜７７１全体に載置する。   As shown in FIG. 7A, a substrate 711 including a plurality of light emitting elements 71 is placed on the entire release film 771.

この後、それらの発光素子７１の周囲に対応して基板７１１及び離型膜７７１全体を切断することで、表面に離型膜７７が貼付された発光素子７１を複数形成する。発光素子７１は、対向する発光側７１ａ及び非発光側７１ｂを有し、発光側は複数の電極７１０を有し、離型膜７７は発光側７１ａに貼付されている。   Thereafter, the substrate 711 and the entire release film 771 are cut in correspondence with the periphery of the light-emitting elements 71 to form a plurality of light-emitting elements 71 having the release film 77 attached to the surface. The light emitting element 71 has a light emitting side 71a and a non-light emitting side 71b facing each other, the light emitting side has a plurality of electrodes 710, and a release film 77 is attached to the light emitting side 71a.

図７Ｂに示すように、表面に離型膜７７が貼付された発光素子７１、及び複数の導電部７００を有する搭載部材を搭載体７６に載置する。発光素子７１は、非発光側７１ｂを介して搭載体７６に載置する。次に、発光素子７１と導電部７００との間に被覆体７２を形成する。発光素子７１の発光側７１ａに離型膜７７が貼付されているため、被覆体７２の形成時に発光側７１ａを汚染することを回避することができる。   As shown in FIG. 7B, a mounting member having a light emitting element 71 having a release film 77 attached to the surface and a plurality of conductive portions 700 is placed on a mounting body 76. The light emitting element 71 is placed on the mounting body 76 via the non-light emitting side 71b. Next, a covering body 72 is formed between the light emitting element 71 and the conductive portion 700. Since the release film 77 is affixed to the light emitting side 71 a of the light emitting element 71, it is possible to avoid contamination of the light emitting side 71 a when the covering 72 is formed.

図７Ｃに示すように、発光素子７１の発光側７１ａ上の離型膜７７を除去し、次に、発光素子７１の発光側７１ａ上に蛍光層７４を形成し、またはさらに保護層若しくは光透過層７５を形成する。   As shown in FIG. 7C, the release film 77 on the light emitting side 71a of the light emitting element 71 is removed, and then a fluorescent layer 74 is formed on the light emitting side 71a of the light emitting element 71, or further, a protective layer or a light transmitting layer. Layer 75 is formed.

図７Ｄに示すように、発光素子７１の電極７１０と導電部７００とを電気的に接続する。   As shown in FIG. 7D, the electrode 710 of the light emitting element 71 and the conductive portion 700 are electrically connected.

図８Ａないし図８Ｂは、本発明に係るパッケージ構造の他の実施例の断面及び上面図である。この実施例におけるパッケージ構造は上記と略同一であり、主な相違点は、金属基材にエッチング及びセミエッチング工程を行うことにより搭載部材８０を形成する点にある。この搭載部材８０は、載置部８０１と、載置部８０１の両側に設けられた複数の導電部８００とを有する。この載置部８０１は、一側の導電部と電気的に導通し、他側の導電部との間に絶縁ペースト８０２が充填されることにより、両側の導電部の電気的ショートを回避する。また、金属基材をエッチングした場合、縦に配列されたそれらの導電部８００の間に溝８０３を形成している。   8A to 8B are cross-sectional and top views of another embodiment of the package structure according to the present invention. The package structure in this embodiment is substantially the same as described above, and the main difference is that the mounting member 80 is formed by performing etching and semi-etching processes on the metal substrate. The mounting member 80 includes a placement portion 801 and a plurality of conductive portions 800 provided on both sides of the placement portion 801. The mounting portion 801 is electrically connected to the conductive portion on one side and is filled with the insulating paste 802 between the conductive portion on the other side, thereby avoiding an electrical short between the conductive portions on both sides. Further, when the metal base material is etched, a groove 803 is formed between the conductive portions 800 arranged in the vertical direction.

載置部８０１に発光素子８１を載置し、発光素子８１を導線８３を介して両側の導電部８００に電気的に接続する。さらに、発光素子の表面に蛍光層８４を形成し、蛍光層上に蛍光層８４及び導線８３を被覆する光透過層８５、例えば透明シリカゲルを形成するとともに、先に形成された溝８０３により、光透過層８５を搭載部材に効果的に固着することができる。   The light emitting element 81 is mounted on the mounting portion 801, and the light emitting element 81 is electrically connected to the conductive portions 800 on both sides via a conductive wire 83. Further, a fluorescent layer 84 is formed on the surface of the light emitting element, and a light transmission layer 85 that covers the fluorescent layer 84 and the conductive wire 83, for example, transparent silica gel, is formed on the fluorescent layer. The transmissive layer 85 can be effectively fixed to the mounting member.

図９は、本発明に係るパッケージ構造の他の実施例の断面図である。この実施例におけるパッケージ構造は上記と略同一であり、主な相違点は、複数の導電部９００と導電部の一端に形成され内側へ延在する載置部９０１とを有する搭載部材９００が設けられている点にある。図に示すように、発光素子３１をフリップチップ反転により載置するともに載置部９０１に電気的に接続するために、２つの導電部９００の一端に互いに延在する載置部９０１がそれぞれ形成され、互いに延在する載置部９０１は接触していない。発光素子９１の表面に蛍光層９４を形成し、さらに蛍光層９４を被覆する光透過層９５を形成することができる。   FIG. 9 is a cross-sectional view of another embodiment of the package structure according to the present invention. The package structure in this embodiment is substantially the same as described above, and the main difference is that a mounting member 900 having a plurality of conductive portions 900 and a mounting portion 901 formed at one end of the conductive portion and extending inward is provided. It is in the point. As shown in the drawing, in order to place the light emitting element 31 by flip chip reversal and to electrically connect to the placement portion 901, a placement portion 901 extending from each other is formed at one end of the two conductive portions 900, respectively. The mounting portions 901 extending from each other are not in contact with each other. A fluorescent layer 94 can be formed on the surface of the light emitting element 91, and a light transmission layer 95 covering the fluorescent layer 94 can be formed.

また、上記各パッケージ構造には電圧の安定化のためにツェナーダイオード（Ｚｅｎｅｒ ｄｉｏｄｅ）が設けられている。また、各パッケージ構造における導電部は、発光素子の一側に対応して曲面又は斜面が選択的に形成され、側面から出射可能な発光素子に合わせて３次元ＬＥＤパッケージ構造が形成される。また、各パッケージ構造における発光素子は、垂直式またはフリップチップ式により搭載部材の導電部に選択的に電気的に接続することができる。   Each package structure is provided with a Zener diode for voltage stabilization. In addition, the conductive portion in each package structure is selectively formed with a curved surface or a slope corresponding to one side of the light emitting element, and a three-dimensional LED package structure is formed according to the light emitting element that can emit light from the side surface. The light emitting element in each package structure can be selectively electrically connected to the conductive portion of the mounting member by a vertical type or a flip chip type.

上記のように、それらの実施の形態は本発明の原理および効果・機能を例示的に説明するに過ぎず、本発明はこれらによって限定されるものではない。本発明は、この技術分野の当業者により本発明の主旨を逸脱しない範囲で様々な修正や変更をすることが可能であり、そうした修正や変更は本発明の特許請求の範囲に含まれるものである。   As described above, these embodiments are merely illustrative of the principles, effects, and functions of the present invention, and the present invention is not limited thereto. The present invention can be variously modified and changed by those skilled in the art without departing from the gist of the present invention, and such modifications and changes are included in the scope of the claims of the present invention. is there.

１ ＬＥＤパッケージ
１０ 基板
１１ 反射コップ
１１０、２０２、５００ａ 開口
１２ ＬＥＤ素子
１２０、８３ 導線
１３ パッケージ樹脂体
２、２’、２ ’’ パッケージ構造
２０、８０、９０ 搭載部材
２０’ 基材
２０ａ 第１側
２０ｂ 第２側
２００、３００、４００、４００’、５００、６００、７００、８００、９００ 導電部
２００ａ 上表面
４００ａ 斜面
２０１、３０１、８０１、９０１ 載置部
２０３ 溝道
２０４ 接続部
２０５ 位置決め孔
２１、３１、４１、５１、６１、７１、８１、９１ 発光素子
２１ａ、３１ａ、４１ａ、６１ａ、７１ａ 発光側
２１ｂ、３１ｂ、４１ｂ、６１ｂ、７１ｂ 非発光側
２１ｃ、３１ｃ、４１ｃ 側面
２１０、３１０、４１０、６１０、７１０ 電極
２２、３２、４２、５２、６２、７２ 被覆体
２２ａ 第１の表面
２２ｂ 第２の表面
２３、２３’ 導電素子
２４、２４’’、３４、４４、６４、７４、８４、９４ 蛍光層
２４０ 蛍光粒子
２５、３５、４５、６５、７５、８５、９５ 光透過層
３ ダイ
３０ 離型膜
４６、６６、７６ 搭載体
５０ 搭載部材
５００ｂ、８０３ 溝
６１１、７１１ 基板
６７１、６７、７７、７７１ 離型膜
８０２ 絶縁ペースト
Ｈ、ｈ 高さ
Ｘ 水平線 DESCRIPTION OF SYMBOLS 1 LED package 10 Board | substrate 11 Reflective cup 110, 202, 500a Opening 12 LED element 120, 83 Conductor 13 Package resin body 2, 2 ', 2''Package structure 20, 80, 90 Mounting member 20' Base material 20a 1st side 20b Second side 200, 300, 400, 400 ′, 500, 600, 700, 800, 900 Conductive portion 200a Upper surface 400a Slope 201, 301, 801, 901 Placement portion 203 Groove 204 Connection portion 205 Positioning hole 21, 31, 41, 51, 61, 71, 81, 91 Light emitting element 21a, 31a, 41a, 61a, 71a Light emitting side 21b, 31b, 41b, 61b, 71b Non light emitting side 21c, 31c, 41c 610, 710 Electrode 22, 32, 42, 52, 62, 72 Cover 2 a First surface 22b Second surface 23, 23 'Conductive element 24, 24'', 34, 44, 64, 74, 84, 94 Fluorescent layer 240 Fluorescent particles 25, 35, 45, 65, 75, 85, 95 Light transmission layer 3 Die 30 Release film 46, 66, 76 Mounted body 50 Mounted member 500b, 803 Groove 611, 711 Substrate 671, 67, 77, 771 Release film 802 Insulation paste H, h Height X Horizontal line

Claims (47)

対向する非発光側及び発光側と、前記非発光側及び前記発光側に隣接する側面とを有する発光素子と、
前記発光素子の前記側面を前記発光素子の前記発光側が露出するように被覆する被覆体と、
前記発光素子の前記側面との間のスペースが前記被覆体に充填されるように、前記被覆体に結合された複数の導電部と、
を備えることを特徴とするパッケージ構造。 A light emitting element having a non-light-emitting side and a light-emitting side facing each other, and a side surface adjacent to the non-light-emitting side and the light-emitting side;
A covering for covering the side surface of the light emitting element so that the light emitting side of the light emitting element is exposed;
A plurality of conductive portions coupled to the covering so that a space between the side surfaces of the light emitting element is filled in the covering;
A package structure characterized by comprising: 載置部と前記複数の導電部とを有する搭載部材をさらに備え、前記発光素子は前記非発光側が前記載置部に設置され、前記被覆体は前記載置部に形成され、前記複数の導電部の高さは前記載置部よりも大きいことを特徴とする、請求項１に記載のパッケージ構造。   The light emitting device further includes a mounting member having a mounting portion and a plurality of conductive portions, and the light emitting element is disposed on the mounting portion on the non-light emitting side, and the covering is formed on the mounting portion, and the plurality of conductive members. The package structure according to claim 1, wherein the height of the portion is larger than the placement portion. 前記搭載部材が開口をさらに備え、前記被覆体が前記開口に形成されていることを特徴とする、請求項２に記載のパッケージ構造。   The package structure according to claim 2, wherein the mounting member further includes an opening, and the covering is formed in the opening. 前記開口が、前記載置部の周囲に形成されていることを特徴とする、請求項３に記載のパッケージ構造。   The package structure according to claim 3, wherein the opening is formed around the mounting portion. 前記導電部の高さが、前記発光素子の前記発光側の高さと同等であることを特徴とする、請求項１に記載のパッケージ構造。   The package structure according to claim 1, wherein a height of the conductive portion is equal to a height of the light emitting element on the light emitting side. 前記発光素子の前記発光側の高さが、前記被覆体の高さと同等であることを特徴とする、請求項１に記載のパッケージ構造。   The package structure according to claim 1, wherein a height of the light emitting side of the light emitting element is equal to a height of the covering. 前記発光素子の前記発光側の高さが、前記被覆体の高さと同等またはそれ以下であることを特徴とする、請求項１に記載のパッケージ構造。   The package structure according to claim 1, wherein a height of the light emitting side of the light emitting element is equal to or less than a height of the covering body. 前記発光素子と前記複数の導電部とを電気的に接続するための導電素子をさらに備えることを特徴とする、請求項１に記載のパッケージ構造。   The package structure according to claim 1, further comprising a conductive element for electrically connecting the light emitting element and the plurality of conductive portions. 前記導電素子が、導電ペースト、導線または金属回路であることを特徴とする、請求項８に記載のパッケージ構造。   The package structure according to claim 8, wherein the conductive element is a conductive paste, a conductive wire, or a metal circuit. 前記発光素子の前記発光側に形成された蛍光層をさらに備えることを特徴とする請求項１に記載のパッケージ構造。   The package structure according to claim 1, further comprising a fluorescent layer formed on the light emitting side of the light emitting element. 前記蛍光層に形成された保護層または光透過層をさらに備えることを特徴とする、請求項１０に記載のパッケージ構造。   The package structure according to claim 10, further comprising a protective layer or a light transmission layer formed on the fluorescent layer. 前記導電部の前記発光素子に対応する一側が、曲面または斜面であることを特徴とする、請求項１に記載のパッケージ構造。   The package structure according to claim 1, wherein one side of the conductive portion corresponding to the light emitting element is a curved surface or a slope. 前記発光素子が複数の電極を有し、前記導電部が対向する第１の表面と第２の表面とを有し、前記発光素子の前記電極が前記導電部の前記第１の表面または前記第２の表面に電気的に接続されることを特徴とする、請求項１に記載のパッケージ構造。   The light emitting element has a plurality of electrodes, the conductive portion has a first surface and a second surface facing each other, and the electrode of the light emitting element is the first surface of the conductive portion or the first surface. The package structure according to claim 1, wherein the package structure is electrically connected to two surfaces. 載置部と前記複数の導電部とを有する搭載部材をさらに備え、前記発光素子が、前記非発光側が前記載置部に設置され、前記載置部が一部の前記導電部と接続するとともに、その他の部分の前記導電部との間が絶縁ペーストによって離間されていることを特徴とする、請求項１に記載のパッケージ構造。   The light emitting device further includes a mounting member having a mounting portion and the plurality of conductive portions, and the light emitting element is installed on the mounting portion on the non-light emitting side, and the mounting portion is connected to a part of the conductive portions. 2. The package structure according to claim 1, wherein the conductive portions of other portions are separated from each other by an insulating paste. 前記導電部の高さが３００μｍ以下であることを特徴とする、請求項１に記載のパッケージ構造。   The package structure according to claim 1, wherein a height of the conductive portion is 300 μm or less. 複数の導電部と、対向する非発光側及び発光側と前記非発光側及び前記発光側に隣接する側面とを有する少なくとも１つの発光素子と、を用意する工程と、
前記発光素子及び前記複数の導電部を被覆体で被覆し、前記被覆体は前記発光素子の前記側面を、前記発光素子の前記側面と前記導電部との間が前記被覆体によって充填されるとともに前記発光素子の前記発光側及び前記複数の導電部が前記被覆体に露出するように被覆する工程と、
を備えることを特徴とするパッケージ構造の製法。 Preparing a plurality of conductive portions, at least one light emitting element having a non-light-emitting side and a light-emitting side facing each other, and a side surface adjacent to the non-light-emitting side and the light-emitting side;
The light emitting element and the plurality of conductive portions are covered with a covering, and the covering fills the side surface of the light emitting element, and the space between the side surface of the light emitting element and the conductive portion is filled with the covering. Covering the light emitting side of the light emitting element and the plurality of conductive portions so as to be exposed to the covering;
A process for producing a package structure, comprising: 前記発光素子と前記複数の導電部とを電気的に接続するための少なくとも１つの導電素子を形成する工程をさらに備えることを特徴とする、請求項１６に記載のパッケージ構造の製法。   The method of manufacturing a package structure according to claim 16, further comprising forming at least one conductive element for electrically connecting the light emitting element and the plurality of conductive portions. 載置部と前記複数の導電部とを有する少なくとも１つの搭載部材を用意する工程をさらに備え、前記発光素子が前記載置部に設置され、前記被覆体が前記載置部に形成され、前記複数の導電部の高さが前記載置部よりも大きいことを特徴とする、請求項１６に記載のパッケージ構造の製法。   A step of preparing at least one mounting member having a mounting portion and the plurality of conductive portions, wherein the light emitting element is installed on the mounting portion, and the covering is formed on the mounting portion, The method of manufacturing a package structure according to claim 16, wherein the height of the plurality of conductive portions is larger than the placement portion. 前記搭載部材の製造工程が、対向する第１側及び第２側を有する基材を用意する工程を備え、
前記基材の前記第１側の一部の材質を除去することで前記載置部を形成し、前記基材の前記第１側の除去されていない部分が前記導電部として用いられていることを特徴とする、請求項１８に記載のパッケージ構造の製法。 The manufacturing process of the mounting member includes a step of preparing a substrate having a first side and a second side facing each other,
The placement part is formed by removing a part of the material on the first side of the base material, and the non-removed part on the first side of the base material is used as the conductive part. The manufacturing method of the package structure of Claim 18 characterized by these. 前記搭載部材の製造工程が、前記基材の前記第１側から前記第２側まで貫通し、前記第１側と前記第２側とを連通する開口を形成する工程をさらに備えることを特徴とする請求項１９に記載のパッケージ構造の製法。   The mounting member manufacturing process further includes a step of forming an opening that penetrates from the first side to the second side of the base material and communicates the first side and the second side. The manufacturing method of the package structure of Claim 19. 前記被覆体が前記開口に形成されていることを特徴とする、請求項２０に記載のパッケージ構造の製法。   The method for manufacturing a package structure according to claim 20, wherein the covering is formed in the opening. 前記開口が前記載置部の周囲に形成されていることを特徴とする、請求項２０に記載のパッケージ構造の製法。   The method for manufacturing a package structure according to claim 20, wherein the opening is formed around the mounting portion. 前記載置部が一部の前記導電部と接続するとともに、その他の部分の前記導電部との間が絶縁ペーストによって離間されていることを特徴とする、請求項１６に記載のパッケージ構造の製法。   The manufacturing method of the package structure according to claim 16, wherein the placement part is connected to a part of the conductive part, and the other part is separated from the conductive part by an insulating paste. . 前記導電部の高さが、前記発光素子の前記発光側の高さと同等であることを特徴とする、請求項１６に記載のパッケージ構造の製法。   The method of manufacturing a package structure according to claim 16, wherein the height of the conductive part is equal to the height of the light emitting element on the light emitting side. 前記発光素子の前記発光側の高さが、前記被覆体の高さと同等またはそれ以下であることを特徴とする、請求項１６に記載のパッケージ構造の製法。   The method of manufacturing a package structure according to claim 16, wherein a height of the light emitting side of the light emitting element is equal to or less than a height of the covering body. 前記導電素子が、導電ペースト、導線または金属回路であることを特徴とする、請求項１６に記載のパッケージ構造の製法。   The method of manufacturing a package structure according to claim 16, wherein the conductive element is a conductive paste, a conductive wire, or a metal circuit. 前記発光素子の前記発光側に蛍光層を形成する工程をさらに備えることを特徴とする、請求項１６に記載のパッケージ構造の製法。   The method of manufacturing a package structure according to claim 16, further comprising a step of forming a fluorescent layer on the light emitting side of the light emitting element. 前記蛍光層に保護層または光透過層を形成する工程をさらに備えることを特徴とする、請求項２７に記載のパッケージ構造の製法。   28. The method of manufacturing a package structure according to claim 27, further comprising a step of forming a protective layer or a light transmission layer on the fluorescent layer. 前記導電部の前記発光素子に対応する一側が、曲面または斜面であることを特徴とする、請求項１６に記載のパッケージ構造の製法。   The method of manufacturing a package structure according to claim 16, wherein one side of the conductive portion corresponding to the light emitting element is a curved surface or a slope. 前記発光素子が複数の電極を有し、前記導電部が対向する第１の表面と第２の表面とを有し、前記発光素子の前記電極が前記導電部の前記第１の表面または前記第２の表面に電気的に接続されることを特徴とする、請求項１６に記載のパッケージ構造の製法。   The light emitting element has a plurality of electrodes, the conductive portion has a first surface and a second surface facing each other, and the electrode of the light emitting element is the first surface of the conductive portion or the first surface. The method of manufacturing a package structure according to claim 16, wherein the package structure is electrically connected to the surface of the package 2. 前記複数の導電部を有する搭載部材を用意する工程をさらに備え、前記搭載部材には複数の開口が形成されており、複数の前記発光素子が前記複数の開口に設けられていることを特徴とする、請求項１６に記載のパッケージ構造の製法。   The method further comprises the step of preparing a mounting member having the plurality of conductive portions, wherein the mounting member has a plurality of openings, and the plurality of light emitting elements are provided in the plurality of openings. The manufacturing method of the package structure of Claim 16. 前記複数の開口の間には連通する溝が形成されていることを特徴とする、請求項３１に記載のパッケージ構造の製法。   32. The method of manufacturing a package structure according to claim 31, wherein a groove communicating with the plurality of openings is formed. 前記複数の開口の両側には複数の前記導電部がそれぞれ設けられており、互いに隣り合う２つの前記導電部の間には溝が形成されていることを特徴とする、請求項３１に記載のパッケージ構造の製法。   The plurality of conductive portions are respectively provided on both sides of the plurality of openings, and a groove is formed between two adjacent conductive portions. Package structure manufacturing method. 前記複数の導電部及び発光素子は搭載体に載置されていることを特徴とする、請求項１６に記載のパッケージ構造の製法。   The method of manufacturing a package structure according to claim 16, wherein the plurality of conductive portions and the light emitting elements are mounted on a mounting body. 前記発光素子の前記発光側には離型膜が設けられており、前記被覆体が形成された後、前記離型膜を除去することを特徴とする、請求項１６に記載のパッケージ構造の製法。   The method for manufacturing a package structure according to claim 16, wherein a release film is provided on the light emitting side of the light emitting element, and the release film is removed after the covering is formed. . 前記導電部の高さが、３００μｍ以下であることを特徴とする、請求項１６に記載のパッケージ構造の製法。   The method of manufacturing a package structure according to claim 16, wherein a height of the conductive portion is 300 μm or less. 発光素子を収容するための載置部と、
高さが、前記載置部の高さよりも大きく、且つ３００μｍ以下である複数の導電部と、
を含むことを特徴とする搭載部材。 A mounting portion for accommodating the light emitting element;
A plurality of conductive portions having a height greater than the height of the placement portion and 300 μm or less;
The mounting member characterized by including. 前記載置部の周囲に形成された貫通した開口をさらに含むことを特徴とする、請求項３７に記載の搭載部材。   38. The mounting member according to claim 37, further comprising a through opening formed around the mounting portion. 前記載置部が、一部の前記導電部と接続し、その他の部分の前記導電部との間が絶縁ペーストによって離間されていることを特徴とする、請求項３７に記載の搭載部材。   38. The mounting member according to claim 37, wherein the placement portion is connected to a part of the conductive portions and is separated from the other conductive portions by an insulating paste. 前記導電部の一側が、曲面または斜面であることを特徴とする、請求項３７に記載の搭載部材。   The mounting member according to claim 37, wherein one side of the conductive portion is a curved surface or an inclined surface. 発光素子を収容するための複数の開口が形成されていることを特徴とする、請求項３７に記載の搭載部材。   The mounting member according to claim 37, wherein a plurality of openings for accommodating the light emitting elements are formed. 前記複数の開口の間には連通する溝が形成されていることを特徴とする、請求項４１に記載の搭載部材。   42. The mounting member according to claim 41, wherein a groove communicating with the plurality of openings is formed. 前記複数の開口の両側には複数の前記導電部がそれぞれ設けられ、互いに隣り合う２つの導電部の間には溝が形成されていることを特徴とする、請求項４１に記載の搭載部材。   42. The mounting member according to claim 41, wherein a plurality of the conductive portions are provided on both sides of the plurality of openings, and a groove is formed between two adjacent conductive portions. 発光素子を収容するための複数の開口と、
前記開口の両側に設けられ、高さが３００μｍ以下である複数の導電部と、
を含むことを特徴とする搭載部材。 A plurality of openings for accommodating the light emitting elements;
A plurality of conductive portions provided on both sides of the opening and having a height of 300 μm or less;
The mounting member characterized by including. 前記導電部の一側が、曲面または斜面であることを特徴とする、請求項４４に記載の搭載部材。   45. The mounting member according to claim 44, wherein one side of the conductive portion is a curved surface or an inclined surface. 前記複数の開口の間には連通する溝が形成されていることを特徴とする、請求項４４に記載の搭載部材。   45. The mounting member according to claim 44, wherein a groove communicating with the plurality of openings is formed. 前記互いに隣り合う２つの前記導電部の間には溝が形成されていることを特徴とする、請求項４４に記載の搭載部材。   45. The mounting member according to claim 44, wherein a groove is formed between the two conductive portions adjacent to each other.
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