JP6776577B2 - 樹脂組成物 - Google Patents
樹脂組成物 Download PDFInfo
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- JP6776577B2 JP6776577B2 JP2016064640A JP2016064640A JP6776577B2 JP 6776577 B2 JP6776577 B2 JP 6776577B2 JP 2016064640 A JP2016064640 A JP 2016064640A JP 2016064640 A JP2016064640 A JP 2016064640A JP 6776577 B2 JP6776577 B2 JP 6776577B2
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- ZKXWKVVCCTZOLD-FDGPNNRMSA-N copper;(z)-4-hydroxypent-3-en-2-one Chemical compound [Cu].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O ZKXWKVVCCTZOLD-FDGPNNRMSA-N 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 150000002168 ethanoic acid esters Chemical class 0.000 description 1
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 description 1
- 125000005677 ethinylene group Chemical group [*:2]C#C[*:1] 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- BDAGIHXWWSANSR-NJFSPNSNSA-N hydroxyformaldehyde Chemical compound O[14CH]=O BDAGIHXWWSANSR-NJFSPNSNSA-N 0.000 description 1
- 229910000378 hydroxylammonium sulfate Inorganic materials 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 125000003454 indenyl group Chemical group C1(C=CC2=CC=CC=C12)* 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- AQBLLJNPHDIAPN-LNTINUHCSA-K iron(3+);(z)-4-oxopent-2-en-2-olate Chemical compound [Fe+3].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O AQBLLJNPHDIAPN-LNTINUHCSA-K 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 150000002696 manganese Chemical class 0.000 description 1
- ZQZQURFYFJBOCE-FDGPNNRMSA-L manganese(2+);(z)-4-oxopent-2-en-2-olate Chemical compound [Mn+2].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O ZQZQURFYFJBOCE-FDGPNNRMSA-L 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- XZWYZXLIPXDOLR-UHFFFAOYSA-N metformin Chemical compound CN(C)C(=N)NC(N)=N XZWYZXLIPXDOLR-UHFFFAOYSA-N 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- FZZQNEVOYIYFPF-UHFFFAOYSA-N naphthalene-1,6-diol Chemical compound OC1=CC=CC2=CC(O)=CC=C21 FZZQNEVOYIYFPF-UHFFFAOYSA-N 0.000 description 1
- MNZMMCVIXORAQL-UHFFFAOYSA-N naphthalene-2,6-diol Chemical compound C1=C(O)C=CC2=CC(O)=CC=C21 MNZMMCVIXORAQL-UHFFFAOYSA-N 0.000 description 1
- 125000004957 naphthylene group Chemical group 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- BMGNSKKZFQMGDH-FDGPNNRMSA-L nickel(2+);(z)-4-oxopent-2-en-2-olate Chemical compound [Ni+2].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O BMGNSKKZFQMGDH-FDGPNNRMSA-L 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 125000003518 norbornenyl group Chemical group C12(C=CC(CC1)C2)* 0.000 description 1
- 125000003261 o-tolyl group Chemical group [H]C1=C([H])C(*)=C(C([H])=C1[H])C([H])([H])[H] 0.000 description 1
- JFOJYGMDZRCSPA-UHFFFAOYSA-J octadecanoate;tin(4+) Chemical compound [Sn+4].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O JFOJYGMDZRCSPA-UHFFFAOYSA-J 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 125000001477 organic nitrogen group Chemical group 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- PRCNQQRRDGMPKS-UHFFFAOYSA-N pentane-2,4-dione;zinc Chemical compound [Zn].CC(=O)CC(C)=O.CC(=O)CC(C)=O PRCNQQRRDGMPKS-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- CUQCMXFWIMOWRP-UHFFFAOYSA-N phenyl biguanide Chemical compound NC(N)=NC(N)=NC1=CC=CC=C1 CUQCMXFWIMOWRP-UHFFFAOYSA-N 0.000 description 1
- LYKRPDCJKSXAHS-UHFFFAOYSA-N phenyl-(2,3,4,5-tetrahydroxyphenyl)methanone Chemical compound OC1=C(O)C(O)=CC(C(=O)C=2C=CC=CC=2)=C1O LYKRPDCJKSXAHS-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 125000006410 propenylene group Chemical group 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910000018 strontium carbonate Inorganic materials 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- GHPYAGKTTCKKDF-UHFFFAOYSA-M tetraphenylphosphanium;thiocyanate Chemical compound [S-]C#N.C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 GHPYAGKTTCKKDF-UHFFFAOYSA-M 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical class SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 125000005270 trialkylamine group Chemical group 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L45/00—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
- C08L45/02—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers of coumarone-indene polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Adhesive Tapes (AREA)
Description
[1] (A)エポキシ樹脂、(B)硬化剤、(C)ビニル基を有する樹脂、及び(D)インデンクマロン樹脂を含む樹脂組成物であって、
(D)成分の含有量が、樹脂成分を100質量%とした場合、5質量%〜20質量%である、樹脂組成物。
[2] (C)成分の少なくとも1種は、芳香環を有する、[1]に記載の樹脂組成物。
[3] (C)成分の含有量が、樹脂成分を100質量%とした場合、5質量%〜20質量%である、[1]又は[2]に記載の樹脂組成物。
[4] (B)成分の少なくとも1種は、活性エステル系硬化剤である、[1]〜[3]のいずれかに記載の樹脂組成物。
[5] さらに(E)無機充填材を含む、[1]〜[4]のいずれかに記載の樹脂組成物。
[6] (E)成分の含有量が、樹脂組成物の不揮発成分を100質量%とした場合、50質量%以上である、[5]に記載の樹脂組成物。
[7] (D)成分が、インデン、クマロン、及びスチレンの共重合体である、[1]〜[6]のいずれかに記載の樹脂組成物。
[8] プリント配線板の絶縁層形成用である、[1]〜[7]のいずれかに記載の樹脂組成物。
[9] 支持体と、該支持体上に設けられた、[1]〜[8]のいずれかに記載の樹脂組成物を含む樹脂組成物層と、を有する接着フィルム。
[10] [1]〜[8]のいずれかに記載の樹脂組成物の硬化物により形成された絶縁層を含む、プリント配線板。
[11] [10]に記載のプリント配線板を備える、半導体装置。
本発明の樹脂組成物は、(A)エポキシ樹脂、(B)硬化剤、(C)ビニル基を有する樹脂、及び(D)インデンクマロン樹脂を含み、(D)成分の含有量が、樹脂成分を100質量%とした場合、5質量%〜20質量%である。なお、本発明において、「樹脂成分」とは、樹脂組成物を構成する不揮発成分のうち、後述する(E)無機充填材を除いた成分をいう。以下、本発明の樹脂組成物に含まれる各成分について詳細に説明する。
本発明の樹脂組成物は、(A)エポキシ樹脂を含有する。エポキシ樹脂としては、例えば、ビキシレノール型エポキシ樹脂、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、ビスフェノールAF型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、トリスフェノール型エポキシ樹脂、ナフトールノボラック型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、tert−ブチル−カテコール型エポキシ樹脂、ナフタレン型エポキシ樹脂、ナフトール型エポキシ樹脂、アントラセン型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、グリシジルエステル型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂、線状脂肪族エポキシ樹脂、ブタジエン構造を有するエポキシ樹脂、脂環式エポキシ樹脂、複素環式エポキシ樹脂、スピロ環含有エポキシ樹脂、シクロヘキサンジメタノール型エポキシ樹脂、ナフチレンエーテル型エポキシ樹脂、トリメチロール型エポキシ樹脂、テトラフェニルエタン型エポキシ樹脂等が挙げられる。エポキシ樹脂は1種単独で用いてもよく、2種以上を組み合わせて用いてもよい。(A)成分は、平均線熱膨張率を低下させる観点から、芳香族骨格含有エポキシ樹脂が好ましく、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ナフタレン型エポキシ樹脂、ビフェニル型エポキシ樹脂、及びジシクロペンタジエン型エポキシ樹脂から選択される1種以上であることがより好ましく、ビフェニル型エポキシ樹脂がさらに好ましい。芳香族骨格とは、一般に芳香族と定義される化学構造であり、多環芳香族及び芳香族複素環をも含む。
本発明の樹脂組成物は、(B)硬化剤を含有する。硬化剤としては、エポキシ樹脂を硬化する機能を有する限り特に限定されず、例えば、フェノール系硬化剤、ナフトール系硬化剤、活性エステル系硬化剤、ベンゾオキサジン系硬化剤、シアネートエステル系硬化剤、及びカルボジイミド系硬化剤などが挙げられる。硬化剤は1種単独で用いてもよく、又は2種以上を併用してもよい。(B)成分は、フェノール系硬化剤、ナフトール系硬化剤、活性エステル系硬化剤、カルボジイミド系硬化剤及びシアネートエステル系硬化剤から選択される1種以上であることが好ましく、活性エステル系硬化剤であることが好ましい。
本発明の樹脂組成物は(C)ビニル基を有する樹脂を含有する。(C)成分と後述する(D)成分とを組み合わせて含むことで誘電正接が低く且つめっき密着性及び下地密着性に優れる絶縁層をもたらす、相溶性、溶融粘度の良好な樹脂組成物を得ることができる。(C)成分は1種単独で用いてもよく、2種以上用いてもよい。
本発明の樹脂組成物は、所定量の(D)インデンクマロン樹脂を含有する。所定量の(D)成分を含むことで相溶性が改善し、物性バランスの良好な樹脂組成物を得ることができる。(D)成分に含まれるクマロン骨格は極性の高いエポキシ樹脂や硬化剤との相溶性がよく、またインデン骨格及びクマロン骨格は極性の低いビニル樹脂との相溶性がよい。そのため、極性の高い樹脂と低い樹脂間で相溶化剤として働き、樹脂組成物全体の相溶性が改善すると考えられる。
本発明の樹脂組成物は、さらに(E)無機充填材を含有していてもよい。無機充填材の材料は特に限定されないが、例えば、シリカ、アルミナ、ガラス、コーディエライト、シリコン酸化物、硫酸バリウム、炭酸バリウム、タルク、クレー、雲母粉、酸化亜鉛、ハイドロタルサイト、ベーマイト、水酸化アルミニウム、水酸化マグネシウム、炭酸カルシウム、炭酸マグネシウム、酸化マグネシウム、窒化ホウ素、窒化アルミニウム、窒化マンガン、ホウ酸アルミニウム、炭酸ストロンチウム、チタン酸ストロンチウム、チタン酸カルシウム、チタン酸マグネシウム、チタン酸ビスマス、酸化チタン、酸化ジルコニウム、チタン酸バリウム、チタン酸ジルコン酸バリウム、ジルコン酸バリウム、ジルコン酸カルシウム、リン酸ジルコニウム、及びリン酸タングステン酸ジルコニウム等が挙げられる。これらの中でもシリカが特に好適である。またシリカとしては球形シリカが好ましい。無機充填材は1種単独で用いてもよく、2種以上を組み合わせて用いてもよい。
本発明の樹脂組成物は、(F)硬化促進剤を含有していてもよい。硬化促進剤としては、例えば、リン系硬化促進剤、アミン系硬化促進剤、イミダゾール系硬化促進剤、グアニジン系硬化促進剤、金属系硬化促進剤等が挙げられ、リン系硬化促進剤、アミン系硬化促進剤、イミダゾール系硬化促進剤、金属系硬化促進剤が好ましく、アミン系硬化促進剤、イミダゾール系硬化促進剤、金属系硬化促進剤がより好ましい。硬化促進剤は、1種単独で用いてもよく、2種以上を組み合わせて用いてもよい。
本発明の樹脂組成物は、(G)熱可塑性樹脂を含有していてもよい。熱可塑性樹脂としては、例えば、フェノキシ樹脂、ポリビニルアセタール樹脂、ポリオレフィン樹脂、ポリブタジエン樹脂、ポリイミド樹脂、ポリアミドイミド樹脂、ポリエーテルイミド樹脂、ポリスルホン樹脂、ポリエーテルスルホン樹脂、ポリカーボネート樹脂、ポリエーテルエーテルケトン樹脂、ポリエステル樹脂が挙げられ、フェノキシ樹脂が好ましい。熱可塑性樹脂は、1種単独で用いてもよく、又は2種以上を組み合わせて用いてもよい。
本発明の樹脂組成物は、(H)難燃剤を含有していてもよい。難燃剤としては、例えば、有機リン系難燃剤、有機系窒素含有リン化合物、窒素化合物、シリコーン系難燃剤、金属水酸化物等が挙げられる。難燃剤は1種単独で用いてもよく、又は2種以上を併用してもよい。
本発明の樹脂組成物は、(I)有機充填材を含有していてもよい。有機充填材としては、プリント配線板の絶縁層を形成するに際し使用し得る任意の有機充填材を使用してよく、例えば、ゴム粒子、ポリアミド微粒子、シリコーン粒子等が挙げられる。
本発明の樹脂組成物は、さらに必要に応じて、他の添加剤を含んでいてもよく、斯かる他の添加剤としては、例えば、有機銅化合物、有機亜鉛化合物及び有機コバルト化合物等の有機金属化合物、並びに増粘剤、消泡剤、レベリング剤、密着性付与剤、及び着色剤等の樹脂添加剤等が挙げられる。
本発明の接着フィルムは、支持体と、該支持体上に設けられた、本発明の樹脂組成物を含む樹脂組成物層と、を有する。
本発明のプリント配線板は、本発明の樹脂組成物の硬化物により形成された絶縁層を含む。
(I)内層基板上に、接着フィルムを、該接着フィルムの樹脂組成物層が内層基板と接合するように積層する工程
(II)樹脂組成物層を熱硬化して絶縁層を形成する工程
本発明の半導体装置は、プリント配線板を含む。本発明の半導体装置は、本発明のプリント配線板を用いて製造することができる。
ビフェニル型エポキシ樹脂(エポキシ当量269、日本化薬(株)製「NC3000」)40部をソルベントナフサ25部に撹拌しながら加熱溶解させ、その後室温にまで冷却した。無機充填材((株)アドマテックス製「SO−C2」、平均粒径0.5μm、単位表面積当たりのカーボン量0.38mg/m2)330部を混合し、3本ロールで混練し分散させた。そこへ、活性エステル系硬化剤(DIC(株)製「HPC−8000−65T」、活性基当量約223の不揮発分65質量%のトルエン溶液)92.3部、ビニル基を有する樹脂(三菱瓦斯化学(株)製「OPE−2St 2200」不揮発分60質量%のトルエン溶液)25部、インデンクマロン樹脂(日塗化学(株)製「H−100」)15部、硬化促進剤として4−ジメチルアミノピリジン(DMAP)の5質量%のMEK溶液2部を混合し、回転ミキサーで均一に分散して、樹脂ワニス1を作製した。
実施例1において、ビニル基を有する樹脂(三菱瓦斯化学(株)製「OPE−2St 2200」不揮発分60質量%のトルエン溶液)を、ビニル基を有する樹脂(三菱瓦斯化学(株)製「OPE−2St 1200」不揮発分60質量%のトルエン溶液)に変更した。以上の事項以外は実施例1と同様にして樹脂ワニス2及び接着フィルム2を作製した。
実施例1において、インデンクマロン樹脂(日塗化学(株)製「H−100」)を、インデンクマロン樹脂(日塗化学(株)製「V−120S」)に変更した。以上の事項以外は実施例1と同様にして樹脂ワニス3及び接着フィルム3を作製した。
実施例1において、インデンクマロン樹脂(日塗化学(株)製「H−100」)を、インデンクマロン樹脂(日塗化学(株)製「V−120」)に変更した。以上の事項以外は実施例1と同様にして樹脂ワニス4及び接着フィルム4を作製した。
実施例1において、
(1)ビニル基を有する樹脂(三菱瓦斯化学(株)製「OPE−2St 2200」不揮発分60質量%のトルエン溶液)25部を、ビニル基を有する樹脂(三菱瓦斯化学(株)製「OPE−2St 2200」不揮発分60質量%のトルエン溶液)8.3部、及びビニル基を有する樹脂(三菱瓦斯化学(株)製「OPE−2St」不揮発分60質量%のトルエン溶液)16.7部に変え、
(2)インデンクマロン樹脂(日塗化学(株)製「H−100」)15部を、8部に変えた。
以上の事項以外は実施例1と同様にして樹脂ワニス5及び接着フィルム5を作製した。
実施例1において、
(1)ビニル基を有する樹脂(三菱瓦斯化学(株)製「OPE−2St 2200」不揮発分60質量%のトルエン溶液)25部を16.7部に変え、
(2)インデンクマロン樹脂(日塗化学(株)製「H−100」)15部を25部に変えた。
以上の事項以外は実施例1と同様にして樹脂ワニス6及び接着フィルム6を作製した。
実施例1において、
(1)ビニル基を有する樹脂(三菱瓦斯化学(株)製「OPE−2St 2200」不揮発分60質量%のトルエン溶液)25部を50部に変え、
(2)インデンクマロン樹脂(日塗化学(株)製「H−100」)15部を2部に変えた。
以上の事項以外は実施例1と同様にして樹脂ワニス7及び接着フィルム7を作製した。
実施例1において、
(1)ビニル基を有する樹脂(三菱瓦斯化学(株)製「OPE−2St 2200」不揮発分60質量%のトルエン溶液)25部を8.3部に変え、
(2)インデンクマロン樹脂(日塗化学(株)製「H−100」)15部を34部に変えた。
以上の事項以外は実施例1と同様にして樹脂ワニス8及び接着フィルム8を作製した。
<誘電正接の評価>
実施例及び比較例で作製した接着フィルムを190℃で90分間熱硬化させ、支持体を剥離することによりシート状の硬化物を得た。その硬化物を長さ80mm、幅2mmに切り出し評価サンプルとした。この評価サンプルについてアジレントテクノロジーズ(Agilent Technologies)社製HP8362B装置を用い空洞共振摂動法により測定周波数5.8GHz、測定温度23℃にて誘電正接を測定した。
実施例及び比較例で作製した接着フィルムの樹脂組成物層について、動的粘弾性測定装置((株)ユー・ビー・エム製「Rheosol−G3000」)を使用して溶融粘度を測定した。試料樹脂組成物1gについて、直径18mmのパラレルプレートを使用して、開始温度60℃から200℃まで昇温速度5℃/分にて昇温し、測定間隔温度2.5℃、振動数1Hz、歪み1degの測定条件にて動的粘弾性率を測定し、最低溶融粘度(ポイズ)を算出した。
実施例及び比較例で作製した接着フィルムの樹脂組成物層側を顕微鏡(ハイロックス(株)製「DIGITAL MICROSCOPE KH−8700」)を用いて観察し、粗粒の有無を確認し、以下の基準で評価した。
−相溶性の判定基準−
○:接着フィルムの樹脂組成物層に50μm以上の粗粒が析出してない。
×:接着フィルムの樹脂組成物層に50μm以上の粗粒が析出している。
<評価基板の調製>
(1)内層回路基板の下地処理
内層回路を形成したガラス布基材エポキシ樹脂両面銅張積層板(銅箔の厚さ18μm、基板の厚さ0.4mm、パナソニック(株)製「R1515A」)の両面を、メック(株)製「CZ8101」に浸漬し1μmエッチングして銅表面の粗化処理をおこなった。
実施例及び比較例で作製した接着フィルムを、バッチ式真空加圧ラミネーター(名機(株)製「MVLP-500」)を用いて、樹脂組成物層が内層回路基板と接合するように、内層回路基板の両面にラミネート処理した。ラミネート処理は、30秒間減圧して気圧を13hPa以下とした後、100℃、圧力0.74MPaで30秒間圧着することにより行った。
ラミネート処理された接着フィルムから支持体であるPETフィルムを剥離した。次いで、80℃にて30分間予備加熱した後、170℃にて30分間樹脂組成物層を熱硬化して、内層回路基板の両面上に硬化物(絶縁層)を形成した。
両面上に硬化物が形成された内層回路基板を、膨潤液(アトテックジャパン(株)製「スエリングディップ・セキュリガントP」、ジエチレングリコールモノブチルエーテル含有の水酸化ナトリウム水溶液)に60℃で10分間浸漬し、次いで粗化液(アトテックジャパン(株)製「コンセントレート・コンパクトP」、過マンガン酸カリウム濃度約6質量%、水酸化ナトリウム濃度約4質量%の水溶液)に80℃で20分間浸漬し、最後に中和液(アトテックジャパン(株)製「リダクションショリューシン・セキュリガントP」、硫酸ヒドロキシルアミン水溶液)に40℃で5分間浸漬した。次いで、80℃で30分間乾燥させた。
セミアディティブ法に従って、硬化物の粗化面に導体層を形成した。
すなわち、粗化処理後の基板を、PdCl2を含む無電解めっき液に40℃で5分間浸漬した後、無電解銅めっき液に25℃で20分間浸漬した。次いで、150℃にて30分間加熱してアニール処理を行った後、エッチングレジストを形成し、エッチングによりパターン形成した。その後、硫酸銅電解めっきを行い、厚さ30μmの導体層を形成した。アニール処理を200℃にて60分間行い、評価基板を得た。
評価基板の導体層に、幅10mm、長さ100mmの部分の切込みをいれ、この一端を剥がしてつかみ具で掴み、室温(25℃)中にて、50mm/分の速度で垂直方向に35mmを引き剥がした時の荷重(kgf/cm)を測定し、ピール強度を求めた。測定には、引っ張り試験機((株)TSE製のオートコム型試験機「AC−50C−SL」)を使用した。
(1)銅箔の下地処理
三井金属鉱山(株)製3EC−III(電界銅箔、35μm)の光沢面をメック(株)製メックエッチボンドCZ−8101に浸漬して銅表面に粗化処理(Ra値=1μm)を行い、防錆処理(CL8300)施した。この銅箔をCZ銅箔という。さらに、130℃のオーブンで30分間加熱処理した。
上記[めっき密着性の測定]の「(2)接着フィルムのラミネート処理」と同様の操作を行い、支持体であるPETフィルムを剥離した基板を用意した。その樹脂組成物層上に、3EC−IIIのCZ銅箔の処理面を、上記[めっき密着性の測定]の「(2)接着フィルムのラミネート処理」と同様の条件で、ラミネートした。そして、190℃、90分の硬化条件で樹脂組成物層を硬化して絶縁層を形成することで、サンプルを作製した。
作製したサンプルを150×30mmの小片に切断した。小片の銅箔部分に、幅10mm、長さ100mmの部分の切込みを、カッターを用いていれて、銅箔の一端を剥がしてつかみ具((株)ティー・エス・イー製、オートコム型試験機、AC−50C−SL)で掴み、インストロン万能試験機を用いて、室温中にて、50mm/分の速度で垂直方向に35mmを引き剥がした時の荷重をJIS C6481に準拠して測定し、「下地密着性」とした。
Claims (11)
- (A)エポキシ樹脂、(B)硬化剤、(C)ビニル基を有する樹脂、及び(D)インデンクマロン樹脂を含む樹脂組成物であって、
(D)成分の含有量が、樹脂成分を100質量%とした場合、5質量%〜20質量%であり、
(C)成分の含有量が、樹脂成分を100質量%とした場合、1質量%〜30質量%であり、
(C)成分は、下記式(1)で表される樹脂である、樹脂組成物。
- (C)成分の少なくとも1種は、芳香環を有する、請求項1に記載の樹脂組成物。
- (C)成分の含有量が、樹脂成分を100質量%とした場合、5質量%〜20質量%である、請求項1又は2に記載の樹脂組成物。
- (B)成分の少なくとも1種は、活性エステル系硬化剤である、請求項1〜3のいずれか1項に記載の樹脂組成物。
- さらに(E)無機充填材を含む、請求項1〜4のいずれか1項に記載の樹脂組成物。
- (E)成分の含有量が、樹脂組成物の不揮発成分を100質量%とした場合、50質量%以上である、請求項5に記載の樹脂組成物。
- (D)成分が、インデン、クマロン、及びスチレンの共重合体である、請求項1〜6のいずれか1項に記載の樹脂組成物。
- プリント配線板の絶縁層形成用である、請求項1〜7のいずれか1項に記載の樹脂組成物。
- 支持体と、該支持体上に設けられた、請求項1〜8のいずれか1項に記載の樹脂組成物を含む樹脂組成物層と、を有する接着フィルム。
- 請求項1〜8のいずれか1項に記載の樹脂組成物の硬化物により形成された絶縁層を含む、プリント配線板。
- 請求項10に記載のプリント配線板を備える、半導体装置。
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