JP6762527B2 - Component mounting machine and component mounting head - Google Patents

Description

The present invention relates to a component mounting machine that mounts a plurality of components on a substrate, and a component mounting head that performs mounting operations. More specifically, the present invention relates to a component mounting machine that images a reference mark provided on the component mounting head.

Facilities for producing substrates on which a large number of components are mounted include solder printing machines, component mounting machines, reflow machines, and board inspection machines. It has become common to connect these facilities to form a substrate production line. Of these, the component mounting machine includes a board transfer device, a component supply device, a component transfer device, and a control device. In the mounting operation by the component mounting machine, first, the board transfer device carries in the board and positions and holds it. Next, the component mounting head of the component transfer device picks up a component from the component supply device, moves the component to a predetermined mounting position on the board, and mounts the component.

An imaging device is generally used in order to accurately recognize the position and rotational posture of a component collected on the component mounting head and realize a highly accurate mounting operation. The image pickup apparatus acquires image data by imaging the parts collected on the component mounting head and the reference mark provided on the component mounting head together. The control device performs image processing on the image data to obtain the relative positional relationship between the component and the reference mark, and reflects the image data in the movement control to the mounting position of the component mounting head. Patent Document 1 discloses a technical example of obtaining a relative positional relationship between a component and a reference mark using an imaging device.

The method for detecting the misalignment of an electric component in Patent Document 1 is a method for detecting the misalignment of the electric component with respect to the suction nozzle, and includes the following four steps. That is, this misalignment detection method includes a first imaging step of simultaneously imaging the suction nozzle and the dog arranged in the vicinity thereof, and a first data processing step of acquiring the relative positional relationship between the suction nozzle and the dog. The position of the electric component with respect to the suction nozzle based on the second imaging step of simultaneously imaging the electric component and the dog held by the suction nozzle, the relative positional relationship between the electric component and the dog, and the relative positional relationship between the suction nozzle and the dog. It includes a second data processing step of acquiring the deviation. According to this, it is said that the relative positional deviation between the suction nozzle and the image pickup device based on various causes can be corrected, and the electric component can be mounted on the circuit board with high position accuracy.

JP-A-2002-185198

By the way, recently, the miniaturization of parts has progressed, and it has become necessary to improve the accuracy of mounting operations more than before. For this reason, a reference mark is often provided on the component mounting head as an index of a position similar to the dog disclosed in Patent Document 1. In the case of this method, the component collected on the component mounting head and the reference mark are imaged together in one imaging. Here, a plurality of illumination conditions of the illumination unit of the image pickup apparatus are switched according to the properties of the component to be imaged. Then, the reference mark does not always match all the lighting conditions and is clearly imaged. As a result, the reference mark becomes unclear, the detection accuracy of the relative positional relationship with the component is lowered, and the accuracy of the mounting operation is lowered.

Further, recently, the mounting operation has become more accurate and the speed has been increased, and the component mounting head has been driven at a high speed. Further, on-the-fly imaging (On The Fly imaging) in which the component mounting head moves above the imaging device without stopping and images are taken while moving is becoming widespread. For this reason, the position of the component mounting head at the moment of imaging becomes indefinite, and imaging conditions such as the shutter speed of the imaging device are restricted, making it difficult to clearly image the component and the reference mark. The problem is becoming more prominent.

The above-mentioned problems may occur in common when the component mounting head collects a member other than the component, for example, a jig and mounts the jig on the substrate or the substrate simulation jig. Therefore, in the present specification, the parts and jigs collected and mounted by the component mounting head are collectively referred to as mounting objects.

The present invention has been made in view of the problems of the above background technology, and by using a plurality of types of reference marks, the position of the mounting object collected on the component mounting head can be accurately recognized and highly accurate. The problem to be solved is to provide a component mounting machine and a component mounting head that realize the mounting operation.

The invention of the component mounting machine according to claim 1 that solves the above problems is a component that collects a mounting object including at least one of a component or a jig and mounts it at a predetermined mounting position on a substrate or a substrate simulation jig. An image of the mounting head, a plurality of nozzles arranged on the circumference of the circle, the mounting object collected on the component mounting head, and the reference mark provided inside the circle. An imaging device that acquires data and a control device that obtains a relative positional relationship between the mounting object and the reference mark based on the image data and reflects it in the movement control of the component mounting head to the mounting position. The component mounting machine is provided with an epi-illuminating light source that irradiates the imaging surface from vertically below, an inclined light source that irradiates the imaging surface diagonally from below the surroundings, and the imaging surface horizontally from the surroundings. It has an illumination unit that can switch between a side-emitting light source that irradiates at a close angle, and the reference mark indicates the illumination conditions of the illumination unit, a mounting object having an electrode on the bottom surface, and a mounting having a mirror surface on the bottom surface. A plurality of types are provided corresponding to a plurality of classification categories classified into either an object or a mounting object having a bump on the bottom surface .

According to the invention of the component mounting machine according to claim 1, the image pickup apparatus can switch a plurality of lighting conditions, and a plurality of types of reference marks are provided corresponding to the plurality of lighting conditions. Therefore, the plurality of types of reference marks are formed so that at least one type is clearly imaged under each of the plurality of lighting conditions. Then, when appropriate lighting conditions are selected according to the mounting object collected on the component mounting head, at least one type of reference mark is clearly imaged together with the mounting target. Therefore, the control device can accurately detect the relative positional relationship between the mounting object and at least one type of reference mark, and can accurately recognize the position of the collected mounting object on the component mounting head. As a result, highly accurate mounting operation is realized.

It is a perspective view which shows the whole structure of the component mounting machine of embodiment of this invention. It is a side view which shows the structure of a component mounting head. It is a bottom view which shows the structure of a component mounting head. It is a figure explaining the 1st to 3rd reference mark provided on the bottom surface of the head body of a component mounting head. It is a perspective view explaining the shape of the 1st reference mark. It is a perspective view explaining the shape of the 2nd reference mark. It is a side view explaining the shape of the 3rd reference mark. It is a side partial sectional view which shows the structure of the image pickup apparatus. It is a figure of the list which shows the correspondence relationship between the 1st to 3rd reference mark, a plurality of lighting conditions, and a plurality of classifications of a mounting object. It is a figure explaining the operation of the component mounting machine of an embodiment, and shows the processing flow executed by a control device. It is a figure for exemplifying the image data for calibration and the center position of the 1st to 3rd marks. It is a figure exemplifying and explaining the method which the control device recognizes the position on the component mounting head of the component collected by suction. It is a figure explaining the reference mark of the prior art.

The component mounting machine 1 of the embodiment of the present invention and the component mounting head 5 of the embodiment will be described with reference to FIGS. 1 to 12. FIG. 1 is a perspective view showing the overall configuration of the component mounting machine 1 according to the embodiment of the present invention. The direction from the left back to the right front in FIG. 1 is the X-axis direction for loading and unloading the substrate K, the direction from the right back to the left front is the Y-axis direction, and the direction from the bottom to the top is the Z-axis direction. The component mounting machine 1 is configured by assembling a board transfer device 2, a plurality of feeder devices 3, a component transfer device 4, an image pickup device 7, and the like on the machine base 91 and covering them with a cover 92 (two-dot chain line). Has been done. The substrate transfer device 2, the feeder device 3, the component transfer device 4, and the image pickup device 7 are controlled by the control devices (not shown), and each of them performs a predetermined operation.

The board transfer device 2 carries in the board K to the mounting implementation position, positions it, and carries it out. The substrate transfer device 2 is composed of a pair of guide rails 21, a pair of conveyor belts 22, a plurality of support pins 23, and the like. The pair of guide rails 21 extend in the transport direction (X-axis direction) across the upper center of the machine base 91 and are erected in parallel with each other. A pair of endless annular conveyor belts 22 are provided on the inside of the pair of guide rails 21 facing each other. The pair of conveyor belts 22 rotate in a state where both edges of the substrate K are placed on the conveyor transport surface, and carry in and out the substrate K to the mounting implementation position set in the central portion of the machine base 91. The plurality of support pins 23 are provided so as to be vertically movable below the mounting implementation position. The support pin 23 rises to push up the substrate K and positions it at the mounting implementation position. As a result, the component transfer device 4 can perform the mounting operation at the mounting implementation position.

Each of the plurality of feeder devices 3 sequentially supplies parts. The plurality of feeder devices 3 are mounted side by side in the width direction (X-axis direction) of the upper surface of the machine base 91. Each feeder device 3 has a main body portion 31, a supply reel 32 provided at the rear portion of the main body portion 31, and a component take-out portion 33 provided at an upper portion near the front of the main body portion 31. An elongated tape (not shown) in which a large number of parts are stored at a predetermined pitch is wound and held on the supply reel 32. This tape is fed out by a tape feeding mechanism (not shown) at predetermined pitch intervals, and the parts are released from the stored state and sequentially supplied to the parts taking out unit 33.

The component transfer device 4 collects components from each component extraction unit 33 of the plurality of feeder devices 3 and transports the components to the positioned substrate K for mounting. The component transfer device 4 is an XY robot type device that can move horizontally in the X-axis direction and the Y-axis direction. The component transfer device 4 includes a pair of left and right Y-axis rails 41, a Y-axis slider 42, a pair of upper and lower X-axis rails 43, an X-axis slider 44, a component mounting head 5, an XY drive mechanism (not shown), and the like. Has been done. The pair of Y-axis rails 41 extend in the front-rear direction (Y-axis direction) of the machine base 91 and are arranged above the substrate transfer device 2 and the feeder device 3. A Y-axis slider 42 is mounted on the Y-axis rail 41 so as to be movable in the Y-axis direction. A pair of upper and lower X-axis rails 43 extend in the X-axis direction on the front surface of the Y-axis slider 42. An X-axis slider 44 is mounted on the front side of the X-axis rail 43 so as to be movable in the X-axis direction. A component mounting head 5 is arranged on the front side of the X-axis slider 44. The component mounting head 5 is driven in the X-axis direction and the Y-axis direction by the XY drive mechanism.

FIG. 2 is a side view showing the structure of the component mounting head 5, and FIG. 3 is a bottom view showing the structure of the component mounting head 5. Further, FIG. 4 is a diagram illustrating first to third reference marks 61 to 63 provided on the bottom surface 55 of the head main body 51 of the component mounting head 5. As shown in the figure, the component mounting head 5 is composed of a head body 51, a revolver device 53, a plurality of suction nozzles 54, and the like.

The head body 51 is formed in a substantially vertical rectangular parallelepiped shape. The head body 51 is attached to the X-axis slider 44 by a detachable portion 52 formed on one side surface. The revolver device 53 is built in the head body 51 and rotates around the rotation axis AX in the vertical direction (Z-axis direction). As shown in FIG. 3, the revolver device 53 has a maximum of 16 suction nozzles 54 detachably attached on a concentric circumference centered on the rotation axis AX. The suction nozzle 54 is an embodiment of a component mounting member, in which a component is suction-collected using negative pressure and the component is mounted on a substrate K using positive pressure. A drive mechanism and an air pressure adjusting mechanism are provided inside the head body 51. The drive mechanism drives the rotation of the revolver device 53 and also drives the elevating and rotating of the selected specific suction nozzle 54. The air pressure adjusting mechanism adjusts the air pressure acting on each nozzle 54 to negative pressure and positive pressure to realize the suction operation and the mounting operation.

The suction nozzle 54 sucks and mounts not only the parts but also the accuracy measuring jig. The accuracy measuring jig is used in combination with the substrate simulation jig and is provided for measuring the mounting accuracy at the mounting position. The accuracy measurement jig is, for example, a transparent glass formed with an accuracy measurement pattern. The substrate simulation jig is, for example, a plate material having the same size as a substrate on which a reference line or a reference code is formed at a constant pitch. When the suction nozzle 54 mounts the accuracy measurement jig on the substrate simulation jig, the relative positional relationship between the accuracy measurement pattern and the reference line or reference code is required. As a result, the position error of the mounting position, in other words, the mounting accuracy is measured. The mounting accuracy can also be measured using actual parts and substrates. Hereinafter, the components and jigs to be attracted and mounted by the component mounting head 5 are collectively referred to as mounting objects.

As shown in FIG. 4, the bottom surface 55 of the head main body 51 is provided with two first to third reference marks 61 to 63 of each of the three types. A total of six first to third reference marks 61 to 63 are arranged at a pitch of 60 ° on a concentric circumference centered on the rotation axis AX. Moreover, the two first to third reference marks 61 to 63 of the same type are arranged symmetrically with respect to the rotation axis AX. In the present embodiment, the first to third reference marks 61 to 63 are provided on the bottom surface 55 of the head body 51. Not limited to this, the first to third reference marks 61 to 63 may be arranged so as to rotate together with the revolver device 53.

5 to 7 are views for explaining the shapes of the first to third reference marks 61 to 63, respectively. In FIGS. 5 to 7, the bottom surfaces 611, 621, and 631 of the reference marks 61 to 63 are shown upside down so as to face upward. The first reference mark 61 shown in the perspective view of FIG. 5 is formed in a cylindrical shape having a small thickness. The bottom surface 611 of the first reference mark 61 is subjected to satin finish using a sandblasting device, and a large number of minute irregularities are formed. The second reference mark 62 shown in the perspective view of FIG. 6 is formed in the same shape as the first reference mark 61. However, the bottom surface 621 of the second reference mark 62 is mirror-finished by using a polishing device or the like. The third reference mark 63 shown in the side view of FIG. 7 is formed by adding a spherically bulging bottom surface 631 to a cylindrical shape similar to the first reference mark 61.

The first to third reference marks 61 to 63 are not limited to a circle when viewed from below, and may be, for example, a square. It is also possible to provide three or more reference marks of the same type. In this case, it is preferable that three or more reference marks of the same type are arranged symmetrically with respect to the rotation axis AX.

FIG. 8 is a side partial cross-sectional view showing the configuration of the image pickup apparatus 7. The image pickup device 7 is provided upward on the upper surface of the machine base 91 between the substrate transfer device 2 and the feeder device 3. The image pickup apparatus 7 simultaneously images the mounting object collected on the component mounting head 5 and the first to third reference marks 61 to 63 provided on the component mounting head 5 to acquire image data. The image pickup device 7 is an on-the-fly image pickup in which the component mounting head 5 is moving from the feeder device 2 to the substrate K without stopping, or an image pickup when the component mounting head 5 is temporarily stopped. Either can be done.

As shown in the figure, the image pickup apparatus 7 is composed of a camera unit 71, a connecting unit 72, an upper bowl unit 73, an illumination unit 74, and the like. The camera unit 71 that performs an imaging operation has an optical incident axis AO in the vertical direction (Z-axis direction), and is mounted on the machine base 91 via a support base 711. The upper center of the camera unit 71 is a light incident portion 712 on which light from above is incident. A cylindrical connecting portion 72 having a rectangular cross section is arranged above the camera portion 71. Further, on the upper side of the connecting portion 72, a bowl-shaped upper bowl portion 73 that is open upward and has no bottom is arranged.

The lighting unit 74 is arranged from the inner surface of the connecting portion 72 to the inner surface of the upper bowl portion 73. More specifically, an epi-illumination light source 741 composed of a large number of LEDs is provided on one side surface of the inner wall of the connecting portion 72. Further, a half mirror 742 is provided diagonally across the inside of the connecting portion 72. The half mirror 742 reflects the horizontal epi-illuminated light emitted from the epi-illuminated light source 741 vertically upward, and transmits the light from above toward the light incident portion 712 of the camera unit 71. On the bowl-shaped inner surface of the upper bowl portion 73, a tilting light source 744 composed of a large number of LEDs is arranged in four stages. Further, a side-emitting light source 746 composed of a large number of LEDs is arranged in one stage near the upper edge of the bowl-shaped inner surface of the upper bowl portion 73.

The imaging device 7 has the bottom surface 55 of the head main body 51 and the bottom surface of the revolver device 53 as imaging surfaces as targets for imaging. The parts sucked by the suction nozzle 54 and the first to third reference marks 61 to 63 are also included in the imaging surface. The epi-illumination light source 741 irradiates the imaging surface substantially straight from vertically below. The tilted light source 744 irradiates the imaging surface obliquely from below the periphery. The side-emitting light source 746 irradiates the imaging surface at an angle close to horizontal from the surroundings. By independently switching the lighting and extinguishing of the epi-illuminating light source 741, the tilting light source 744, and the side-illuminating light source 746, which are the illumination light sources, the first to third illumination conditions described later are set.

Returning to FIG. 1, the cleaning member 8 is arranged at a position adjacent to the image pickup apparatus 7 on the machine base 91. As the cleaning member 8, for example, a cleaning member such as a brush or a sponge is used. The cleaning member 8 has a size capable of collectively cleaning the first to third reference marks 61 to 63. The first to third reference marks 61 to 63 may be of a size that can be individually cleaned. The component transfer device 4 can swing the component mounting head 5 above the cleaning member 8 by the XY drive mechanism while bringing the bottom surface 55 of the head body 51 into contact with the cleaning member 8. As a result, the bottom surface 55 of the head body 51 is automatically cleaned together with the bottom surfaces 611, 621, and 631 of the first to third reference marks 61 to 63. That is, the function of the automatic cleaning device is realized by the cleaning member 8 and the XY drive mechanism.

The control device (not shown) controls the overall operation related to component mounting. The control device can be configured by, for example, an electronic control device having a CPU and operating by software, and a plurality of electronic control devices may be linked and configured. The control device controls the loading / unloading and positioning of the substrate K by the substrate transport device 2. The control device cooperates with each control unit of the plurality of feeder devices 3 to sequentially supply parts to each component supply position 33. The control device controls the movement of the component mounting head 5 of the component transfer device 4, the rotation of the revolver device 53, and the air pressure of the suction nozzle 54. The control device moves the component mounting head 5 above the image pickup device 7, and controls the image pickup operation of the image pickup device 7. The control device controls the function of the automatic cleaning device. Further, the control device includes four functional means, that is, a calibration means, an accuracy adjusting means, an initial value storage means, and an abnormality determination means described later.

In the present embodiment, the first to third reference marks 61 to 63 are provided corresponding to a plurality of lighting conditions and a plurality of classification categories classified according to differences in the properties of the mounting object. FIG. 9 is a list showing the correspondence between the first to third reference marks 61 to 63 and the plurality of lighting conditions and the plurality of classification categories of the mounting object.

As shown in FIG. 9, the first reference mark 61 corresponds to the first illumination condition in which the epi-illumination light source 741, the tilt-illumination light source 744, and the side-illumination light source 746 are all lit. Moreover, the first reference mark 61 corresponds to a mounting object having an electrode on the bottom surface. Examples of this type of mounting object include a chip component having a rectangular electrode and a lead component having a lead electrode. Since it is important to accurately determine the positions of these electrodes, a satin finish is applied to the bottom surface 611 of the first reference mark 61 so as to resemble the surface state of the electrodes. Then, in order to clearly image both the electrode of the mounting object and the first reference mark 61, suitable first illumination conditions are set in association with each other.

Further, the second reference mark 62 corresponds to the second illumination condition in which only the epi-illumination light source 741 is lit. Moreover, the second reference mark 62 corresponds to a mounting object whose bottom surface is a mirror surface. Examples of this type of mounting object include wafer parts cut out from a wafer base material and the above-mentioned accuracy measurement jig. Since it is important to accurately determine the expanding range of these bottom surfaces, the bottom surface 621 of the second reference mark 62 is mirror-finished so as to resemble the surface condition of the bottom surface of the mounting object. Then, in order to clearly image both the bottom surface of the mounting object and the second reference mark 62, suitable second illumination conditions are set in association with each other.

Further, the third reference mark 63 corresponds to the third lighting condition in which only the side emitting light source 746 is turned on. Moreover, the third reference mark 63 corresponds to a mounting object having a bump (spherical connecting portion) on the bottom surface. BGA parts (Ball Grid Array parts) and CSP parts (Chip Size Package parts) can be exemplified as mounting objects of this type. Since it is important to accurately determine the positions of these bumps, the bottom surface 631 of the third reference mark 63 is formed to bulge spherically so as to resemble the shape of the bumps. Then, in order to clearly image both the bump of the mounting object and the third reference mark 63, suitable third illumination conditions are set in association with each other.

Next, the operation of the component mounting machine 1 of the embodiment configured as described above will be described together with the four functional means of the control device. FIG. 10 is a diagram illustrating the operation of the component mounting machine of the embodiment, and shows the processing flow executed by the control device. The control device performs the calibration means in step S1 before starting the mounting of the mounting object, and then performs the accuracy adjusting means in step S2. Further, the control device performs the initial value storage means of step S3 after step S1 and step S2, or in parallel with step S1 and step S2. These three functional means are performed, for example, after the component mounting machine 1 is installed, after the component mounting head 5 is replaced, or after the components are replaced or maintained at the time of periodic inspection.

In the calibration means of step S1, the control device first moves the component mounting head 5 to a predetermined calibration position. The calibration position is set, for example, directly above the image pickup apparatus 7. As a result, the rotation axis AX of the revolver device 53 and the light incident axis AO of the image pickup device 7 overlap. The control device subsequently images the first to third reference marks 61 to 63 with the image pickup device 7 to acquire calibration image data. Thirdly, the control device obtains the first to third mark center positions M1 to M3 determined by two reference marks 61 to 63 of the same type based on the calibration image data.

FIG. 11 is a diagram illustrating and explaining calibration image data and first to third mark center positions M1 to M3. In FIG. 11, the position error is exaggerated for the sake of clarity. The control device obtains the circular center positions of the two first reference marks 61 of the calibration image data, and sets the midpoint of the line segment connecting the two center positions as the first mark center position M1 (FIG. 11). + Mark). Similarly, the control device obtains the second mark center position M2 (+ mark in FIG. 11) from the two second reference marks 62, and the two third reference marks 63 to the third mark center position M3 (FIG. 11). + Mark) is calculated. The control device stores the amount of deviation of the first to third mark center positions M1 to M3 with respect to the rotation axis AX in the X-axis direction and the Y-axis direction, and reflects them in the subsequent movement control of the component mounting head 5 to the mounting position. To do. Thereby, even if the arrangement positions of the two first to third reference marks 61 to 63 have an error deviated from the symmetrical position about the rotation axis AX, the influence of the error can be canceled.

In the accuracy adjusting means of step S2, the control device first sets the second reference mark 62 corresponding to the accuracy measuring jig of the object to be mounted as the master mark, and the illumination unit 74 of the imaging device 7 The second lighting condition corresponding to the accuracy measurement jig is set as the master lighting condition. The control device subsequently images the accuracy measurement jig and the master mark (second reference mark 62) collected on the component mounting head 5 under the master illumination condition (second illumination condition) by the image pickup device 7. And acquire the image data for accuracy adjustment. Thirdly, the control device obtains the relative positional relationship between the accuracy measurement jig and the master mark based on the accuracy adjustment image data, and reflects it in the movement control of the component mounting head 5 to the mounting position for accuracy measurement. The jig is mounted at a predetermined mounting position on the substrate simulation jig. Fourth, the control device acquires and stores the position error generated at the mounting position, and reflects it in the subsequent movement control of the component mounting head 5 to the mounting position. According to this, even if a position error occurs due to a difference in operating conditions, atmosphere conditions, etc. between the upper part of the image pickup apparatus 7 and the substrate K, high mounting accuracy can be maintained by adjustment.

In the initial value storage means in step S3, the control device first images the first to third reference marks 61 to 63 by the image pickup device 7 and acquires the image data for the initial value. The control device may use the calibration image data acquired in step S1 as the initial value image data. The control device subsequently determines at least the shape of the first to third reference marks 61 to 63, or the mutual distance between two two first to third reference marks 61 to 63 of the same type, based on the initial value image data. Find one and store it as the initial value. As a matter of course, the initial value of the shape of the first to third reference marks 61 to 63 is close to a perfect circle (perfect circle).

After completing step S3, the control device advances the execution of the processing flow to step S4. In step S4, the control device controls the board transfer device 2 to carry in the board K, and starts the component mounting operation. In the next step S5, the control device controls the component transfer device 4 to have the suction nozzle 54 of the component mounting head 5 suck and collect the component. In step S6, the control device moves the component mounting head 5 above the image pickup device 7, controls the image pickup device 7 to perform image pickup, and acquires image data. At this time, the control device controls so as to perform imaging using the illumination conditions corresponding to the classification of the parts collected by adsorption. Assuming that the classification categories of the parts sucked and collected by the 16 suction nozzles 54 span a plurality of classification categories, the control device controls to perform a plurality of imagings using a plurality of lighting conditions corresponding to the classification categories.

Next, in the abnormality determination means in step S7, the control device first determines the shapes of the first to third reference marks 61 to 63, or two two first to third reference marks 61 to the same type, based on the image data. At least one of the distances between 63 is obtained, and the amount of change from the stored initial value is obtained. Subsequently, the control device determines that the change is abnormal when the change exceeds a predetermined control value. The control value can be set in advance in consideration of the range in which the position error is appropriate.

As a cause of the abnormality, it is assumed that the first to third reference marks 61 to 63 and their surroundings are soiled. For example, if the bottom surfaces 611, 621, and 631 of the first to third reference marks 61 to 63 become dirty and the surface state changes, clear image data cannot be obtained. Alternatively, when a foreign substance adheres to or around the first to third reference marks 61 to 63, the image is imaged as if the mark shape has changed. Due to these causes, the shapes of the first to third reference marks 61 to 63 are distorted from a perfect circle, or the center position of the circle of each reference mark 61 to 63 shifts and the mutual distance changes. , The control device can determine the abnormality.

In step S8, the control device determines whether or not an abnormality has occurred. The control device advances the execution of the processing flow to step S9 when no abnormality has occurred, and proceeds to the execution of the processing flow to step S11 when an abnormality has occurred. In step S9, the control device accurately detects the relative positional relationship between the suction-collected component and the corresponding reference mark based on the image data, and determines the position of the suction-collected component on the component mounting head 5. Can be recognized accurately. Note that the reference mark that does not correspond to the parts collected by adsorption is not used for the detection process of the relative positional relationship even if it is captured together and included in the image data.

FIG. 12 is a diagram illustrating a method in which the control device recognizes the position of the suction-collected component on the component mounting head 5. FIG. 12 shows image data obtained by imaging the bottom surface 55 of the head body 51 and the bottom surface of the revolver device 53. As shown in the figure, the chip component P is sucked and collected by each of the 16 suction nozzles 54 of the revolver device 53. Therefore, the image pickup operation is performed under the first illumination condition corresponding to the chip component P, and the image data is acquired. The positional relationship between the component mounting head 5 and the imaging device 7 at the moment when the imaging operation is performed is indefinite. Nevertheless, since the first illumination condition is set, both the chip component P and the two first reference marks 61 are clearly imaged. Therefore, the control device can accurately detect the reference position of the component mounting head 5 from the first mark center position M1 by using the result of the calibration means. Further, the control device can accurately recognize the amount of change in the X-axis direction and the Y-axis direction of the specific chip component PA with respect to the rotation axis AX, and the position is accurately recognized. Further, the control device recognizes the rotational posture of the specific chip component PA. The position and rotation posture recognition process is performed on the entire number of chip components P that have been suction-collected by the 16 suction nozzles 54, respectively.

In the next step S10, the control device moves the component mounting head 5 above the substrate K, and sequentially mounts the suction-collected chip component P on the substrate K. At this time, the control device controls not only the recognized position and rotational posture of the chip component P but also the result of the accuracy adjusting means to control the final mounting position. After that, the control device returns the execution of the processing flow to step S5, and proceeds to the next component mounting operation.

In step S11, which is advanced when the abnormality has occurred, the control device activates the automatic cleaning device, and then returns the execution of the processing flow to step S6. In the second steps S6 to S8, the control device determines whether or not the abnormality occurs again. When the first to third reference marks 61 to 63 and their surroundings are cleaned by the automatic cleaning device and the abnormality is resolved, the control device proceeds to execute the processing flow in step S9. When the abnormality is not resolved even after repeating step S11 a predetermined number of times, the control device notifies the alarm of the abnormality to encourage the operator to recover the function, and also stands by.

Next, the operation of the component mounting machine 1 of the embodiment will be described in comparison with the prior art. FIG. 13 is a diagram illustrating a reference mark 69 of the prior art. In the prior art, four single types of reference marks 69 are provided on the bottom surface 59 of the head body 51 at a pitch of 90 °. Conventionally, the reference mark 69 is not clearly imaged depending on the lighting conditions, and even if the four reference marks 69 are used, the mark center position M9 tends to fluctuate and the accuracy of the reference position of the component mounting head 5 tends to decrease. For this reason, imaging is performed using the reference mark 69 as a position reference only under clearly imaged illumination conditions. In addition, on-the-fly imaging could not be performed under lighting conditions in which the reference mark 69 was not clearly imaged.

On the other hand, in the component mounting machine 1 of the embodiment, two different types of first to third reference marks 61 to 63 are used so as to be clearly imaged under the first to third lighting conditions. Therefore, clear imaging is performed under any lighting condition, and any of the first to third mark center positions M1 to M3 can be accurately and easily obtained even with the minimum two reference marks 61 to 63. ..

The component mounting machine 1 of the embodiment includes a component mounting head 5 that collects a mounting object including at least one of a component or a jig and mounts it at a predetermined mounting position on the board K or a board simulation jig, and component mounting. The mounting object collected on the head 5 and the first to third reference marks 61 to 63 provided on the component mounting head 5 are imaged together to acquire image data, and mounting is performed based on the image data. A component mounting machine 1 including a control device for obtaining a relative positional relationship between an object and the first to third reference marks 61 to 63 and reflecting the relative positional relationship to the movement control of the component mounting head 5 to the mounting position. The image pickup apparatus 7 has an illumination unit 74 capable of switching between the first to third illumination conditions in which the irradiation directions are different from each other, and the first to third reference marks 61 to 63 correspond to the first to third illumination conditions. There are three types.

According to this, the three types of the first to third reference marks 61 to 63 are formed so that at least one type is clearly imaged under each of the first to third lighting conditions. Then, when appropriate lighting conditions are selected according to the mounting object collected on the component mounting head 5, at least one type of reference mark is clearly imaged together with the mounting target. Therefore, the control device can accurately detect the relative positional relationship between the mounting object and at least one type of reference mark, and can accurately recognize the position of the collected mounting object on the component mounting head 5. As a result, highly accurate mounting operation is realized.

Further, in the component mounting machine 1 of the embodiment, the illumination unit 74 includes an epi-illumination light source 741, a tilt-illumination light source 744, and a side-illumination light source 746 that can be independently switched on and off. According to this, the first to third reference marks 61 to 63 are provided corresponding to the first to third lighting conditions set by combining the three types of lighting light sources 741, 744, and 746. Therefore, at least one type of reference mark is clearly imaged, and the effect of realizing a highly accurate mounting operation is assured.

From another point of view, in the component mounting machine 1 of the embodiment, the first to third reference marks 61 to 63 are classified into three types according to the first to third lighting conditions and the difference in the properties of the mounting object. Three types are provided according to the classification. According to this, when the first to third lighting conditions and the three types of classification categories of the mounting object have a one-to-one correspondence, the first to first to third lighting conditions correspond to the combination of the classification categories, respectively. Third reference marks 61 to 63 are provided. Therefore, the effect that at least one type of reference mark is clearly imaged is certain.

From another viewpoint, the component mounting machine 1 of the embodiment collects a mounting object including at least one of a component or a jig and mounts it at a predetermined mounting position on the board K or the board simulation jig. The component mounting head 5 to be mounted, the object to be mounted collected on the component mounting head 5, and the first to third reference marks 61 to 63 provided on the component mounting head 5 are imaged together to acquire image data. A control device that obtains the relative positional relationship between the mounting object and the first to third reference marks 61 to 63 based on the image data and reflects the device 7 in the movement control of the component mounting head 5 to the mounting position. In the component mounting machine 1, the first to third reference marks 61 to 63 are provided in three types corresponding to the three types of classification according to the difference in the properties of the mounting object.

According to this, the three types of the first to third reference marks 61 to 63 are formed so that their shapes and surface states correspond to a plurality of classifications of the mounting object. Then, when appropriate imaging conditions are selected according to the mounting object collected on the component mounting head 5, at least one type of reference mark is clearly imaged together with the mounting target. Therefore, the control device can accurately detect the relative positional relationship between the mounting object and at least one type of reference mark, and can accurately recognize the position 5 on the component mounting head of the collected mounting target. As a result, highly accurate mounting operation is realized.

Further, in the component mounting machine 1 of the embodiment, the first to third reference marks 61 to 63 are classified according to the difference of at least one of the shape and the surface state of the specific portion imaged by the imaging device of the mounting object 3 Three types are provided according to the classification of types. Specifically, the first reference mark 61 corresponds to a mounting object having an electrode on the bottom surface 611, and the bottom surface 611 is satin-finished so as to resemble the surface state of the electrode. The second reference mark 62 corresponds to a mounting object whose bottom surface is a mirror surface, and the bottom surface 621 is mirror-finished so as to resemble the surface state of the bottom surface of the mounting object. The third reference mark 63 corresponds to a mounting object having a bump on the bottom surface, and the bottom surface 631 is formed to bulge in a spherical shape so as to resemble the shape of the bump. According to this, since the first to third reference marks 61 to 63 are formed so that the shapes and surface states of the bottom surfaces 611, 621, and 631 are similar to the corresponding mounting objects, there is remarkable similarity as a subject. Be equipped. Therefore, the first to third reference marks 61 to 63 are clearly imaged together with the corresponding mounting object.

Further, in the component mounting machine 1 of the embodiment, two first to third reference marks 61 to 63 are provided, respectively, and two first to third reference marks 61 to 63 of the same type are heads. The bottom surface 55 of the main body 51 is symmetrically arranged around the rotation axis AX. According to this, even with the minimum number of two first to third reference marks 61 to 63, the first to third mark center positions M1 to M3 can be accurately and easily obtained.

Further, in the component mounting machine 1 of the embodiment, the control device includes a calibration means performed before the component mounting head 5 starts mounting the mounting object, and the calibration means calibrates the component mounting head 5 in a predetermined manner. The image data is moved to the mounting position, the first to third reference marks 61 to 63 are imaged by the image pickup device 7, and the calibration image data is acquired. Based on the calibration image data, two firsts of the same type are obtained. The first to third mark center positions M1 to M3 determined by the third reference marks 61 to 63 are obtained and stored, and reflected in the subsequent movement control of the component mounting head 5 to the mounting position. According to this, even if the arrangement positions of the two first to third reference marks 61 to 63 have an error deviated from the symmetrical position centered on the rotation axis AX, the influence of the error can be canceled. ..

Further, in the component mounting machine 1 of the embodiment, the control device includes the accuracy adjusting means performed after the calibration means, and the accuracy adjusting means is the second reference corresponding to the accuracy measuring jig of the mounting object. The mark 62 is set as the master mark, and the second lighting condition corresponding to the accuracy measurement jig of the lighting unit 74 of the image pickup device 7 is set as the master lighting condition, and the image pickup device 7 sets the component under the master lighting condition. The accuracy measurement jig and the master mark collected on the mounting head 5 are imaged together to acquire the accuracy adjustment image data, and the relative positional relationship between the accuracy measurement jig and the master mark based on the accuracy adjustment image data. Is reflected in the movement control of the component mounting head 5 to the mounting position, the accuracy measurement jig is mounted at a predetermined mounting position on the board simulation jig, and the position error generated at the mounting position is acquired. It is stored and reflected in the subsequent movement control of the component mounting head 5 to the mounting position. According to this, even if a position error occurs due to a difference in operating conditions, atmosphere conditions, etc. between the upper part of the image pickup apparatus 7 and the substrate K, high mounting accuracy can be maintained by adjustment.

Further, in the component mounting machine 1 of the embodiment, the control device implements the initial value storage means performed before the component mounting head 5 starts mounting the mounting object, and the component mounting head 5 mounts the mounting target. The initial value storage means, including the abnormality determination means performed at the time of the initial value, captures the first to third reference marks 61 to 63 by the imaging device 7 to acquire the initial value image data, and the initial value image data. Based on the above, at least one of the shapes of the first to third reference marks 61 to 63 or the mutual distance between two two first to third reference marks 61 to 63 of the same type is obtained and stored as an initial value, and an abnormality determination means is used. Obtains at least one of the shapes of the first to third reference marks 61 to 63 or the mutual distance between two two first to third reference marks 61 to 63 of the same type based on the image data, and further from the initial value. The amount of change in is obtained, and if the amount of change exceeds a predetermined control value, it is determined to be abnormal. According to this, the influence of stains on the reference marks 61 to 63 and their surroundings, which cause an abnormality, can be suppressed within a certain range, and the accuracy of the position can be maintained within a certain range. In addition, when the influence of fouling becomes large, it can be determined as abnormal and the operator can be encouraged to recover the function.

Further, in the component mounting machine 1 of the embodiment, when the abnormality determining means determines that the abnormality is determined, the bottom surface 55 of the head body 51 of the component mounting head 5 is changed to the bottom surfaces 611, 621 of the first to third reference marks 61 to 63. It is further equipped with an automatic cleaning device that automatically cleans together with 631. According to this, when the influence of stain becomes large and it is determined that there is an abnormality, automatic cleaning is performed. Therefore, it may be possible to automatically recover when an abnormality occurs, and it is not always necessary to wait until the operator recovers the function. As a result, it is possible to suppress a decrease in the operating rate of the component mounting machine 1.

Further, the component mounting head 5 of the embodiment is provided in the component mounting machine 1, and a mounting object including at least one of the component or the jig is collected and placed at a predetermined mounting position on the board K or the board simulation jig. The suction nozzle 54 (component mounting member) to be mounted is provided on the bottom surface (imaging surface) of the revolver device 54 facing the imaging device 7, and the first to third reference marks 61 to 63 are the bottom surface 55 (imaging surface) of the head body 51. ), And the illumination unit 74 of the imaging device 7 that simultaneously images the mounting object collected by the suction nozzle 54 and the first to third reference marks 61 to 63. Three types of first to third reference marks 61 to 63 corresponding to at least one of the three types of classification categories classified according to the first to third lighting conditions in which the directions are different from each other or the difference in the properties of the mounting object. It is provided.

According to this, at least one of the three types of the first to third reference marks 61 to 63 provided on the component mounting head 5 is clearly imaged under each of the first to third lighting conditions. Alternatively, the shape and surface state can be formed so as to correspond to a plurality of classifications of the mounting object. Then, regardless of the lighting conditions and the classification of the mounting object, at least one type of reference mark is clearly imaged together with the mounting target. Therefore, the relative positional relationship between the mounting object and at least one type of reference mark is accurately detected, and the position of the collected mounting object on the component mounting head 5 is accurately recognized. As a result, highly accurate mounting operation is realized.

In addition, when a plurality of lighting conditions and a plurality of classification categories of the mounting object do not have a one-to-one correspondence, even if a reference mark is provided for all combinations of the lighting conditions and the classification categories. Good. For example, the number of types of reference marks so that the second reference mark corresponds to the wafer component imaged under the second illumination condition and the fourth reference mark corresponds to the accuracy measurement jig imaged under the second illumination condition. May be increased.

Furthermore, a component supply device of another type other than the feeder device 3 described in the embodiment, for example, a tray-type component supply device may be used, or the feeder device 3 and the tray-type component supply device may be used in combination. Further, the component mounting head 5 may have only one suction nozzle 54 as the component mounting member of the component transfer device 4. Alternatively, the component mounting head 5 may have a component mounting member other than the suction nozzle 54, for example, a type in which the component is sandwiched between two claws. Furthermore, the calibration means, the accuracy adjustment means, the initial value storage means, and the abnormality determination means of the control device are not indispensable. For example, when the first to third reference marks 61 to 63 are arranged symmetrically with respect to the rotation axis AX with almost no error, the calibration means is unnecessary. The present invention can be applied and modified in various other ways.

1: Parts mounting machine
2: Board transfer device 3: Feeder device 4: Parts transfer device
5: Parts mounting head 51: Head body
53: Revolver device 54: Suction nozzle (part mounting member)
61-63: 1st to 3rd reference marks
611, 621, 631: Bottom
7: Imaging device 71: Camera unit 74: Lighting unit
741: Epi-illumination light source 742: Half mirror
744: Tilt light source 746: Side light source
8: Cleaning member
AX: Rotation axis AO: Light incident axis
M1 to M3: Center position of 1st to 3rd marks
K: Substrate P, PA: Chip parts

Claims (4)

A component mounting head that collects a mounting object including at least one of a component or a jig and mounts it at a predetermined mounting position on a board or a board simulation jig.
Multiple nozzles arranged on the circumference of a circle,
An imaging device that acquires image data by imaging together a mounting object collected on the component mounting head and a reference mark provided inside the circle.
A control device that obtains the relative positional relationship between the mounting object and the reference mark based on the image data and reflects it in the movement control of the component mounting head to the mounting position.
It is a component mounting machine equipped with
The imaging device includes an epi-illumination light source that irradiates the imaging surface from vertically below, an inclined light source that irradiates the imaging surface diagonally from below the surroundings, and a side-emitting light source that irradiates the imaging surface at an angle close to horizontal from the surroundings. Has a switchable lighting unit,
The reference mark is classified into one of the lighting conditions of the lighting unit, a mounting object having an electrode on the bottom surface, a mounting object having a mirror surface on the bottom surface, and a mounting object having a bump on the bottom surface. Multiple types of component mounting machines are provided according to the classification of . The component mounting machine according to claim 1, wherein the lighting unit includes a plurality of lighting light sources that can be turned on and off independently. The component mounting machine according to claim 1 or 2, wherein a plurality of types of the reference mark are provided corresponding to a plurality of classification categories classified according to the lighting conditions of the lighting unit and the difference in the properties of the mounting object. .. A plurality of the reference marks of the same type are provided for each type, and the plurality of reference marks of the same type are any one of claims 1 to 3 arranged on the imaging surface of the component mounting head facing the imaging device. The component mounting machine described in item 1.

Images