JP6619014B2 - Inspection contact device - Google Patents

Description

  The present invention relates to an inspection contact device provided in a probe card for inspecting electrical characteristics of a semiconductor integrated circuit, an electrical inspection jig (jig) inspecting electrical characteristics of a semiconductor package PCB, or the like.

  The inspection contact device is a device that transmits an electrical signal in contact with an electronic device in order to test whether the electronic device such as a semiconductor integrated circuit or a semiconductor package PCB is manufactured with an accurate specification. It is.

  An electronic element having an electrode formed on the surface becomes an inspection object (DUT: Device Under Test) to be inspected, and one end of the probe provided in the inspection contact device is in contact with the electrode of the inspection body, and the other end is Contact a Space Transformer. The space transformer is connected to a tester via a printed circuit board to inspect the inspection object. That is, the inspection contact device serves as a medium for electrically connecting the inspection body and the space transformer in the inspection process.

  FIG. 1 is a sectional view showing the structure of a conventional inspection contact device 6. The conventional inspection contact device 6 includes a plurality of probes 40 and non-conductive guide plates 10 and 20 in which probe holes 15 and 25 for inserting the probes are formed. Although FIG. 1 shows an example in which a cobra probe is used as the probe 40, the probe 40 may be another probe such as a linear probe. The central portions of the guide plates 10 and 20 are formed with grooves and are relatively thin, and probe holes 15 and 25 for inserting the probes 40 are precisely formed in these portions. Linear portions at both ends of the probe 40 are inserted into the probe holes 15 and 25 of the guide plates 10 and 20, respectively. The inserted probe 40 can move up and down in the probe holes 15 and 25, and the tips on both sides of the probe 40 are in contact with the test object and the space transformer, respectively.

  Usually, the inspection contact device is used by being assembled integrally with a space transformer (not shown) that increases the distance between the electrodes. When the inspection contact device 6 comes into close contact with the inspection body (not shown), the probe 40 is pressed vertically between the inspection body and the space transformer. Then, the intermediate part of the probe 40 is elastically deformed, and the inspection body and the space transformer are electrically connected via the probe 40.

  When the probes 40 are in close contact with the test object, if the intermediate portions of all the probes 40 are bent in the same direction and degree, the plurality of probes 40 can maintain a certain distance from each other. There is no (short). However, when the length of the probe 40, the electrode height of the inspection object, and the like are not uniform, the distances that are vertically pressed for each probe 40 are different from each other. As a result, the degree of bending between adjacent probes may be different from each other. Due to the difference in the amount of deformation, the middle part of the probe may come into contact with the intermediate part of another adjacent probe. A short circuit occurs. Such a problem is particularly serious in a fine pitch inspection contact apparatus in which probes are closely arranged.

  In order to solve the short-circuit problem between the probes that occurs during the inspection process, the intermediate portion of the probe 40 is usually coated with an insulating coating 41. However, the method of coating the fine probe with the insulator has problems such as lowering the productivity and causing deformation of the probe during the insulator coating process.

  Another problem with the conventional inspection contact device 6 is that it is difficult to replace the probe 40. If a defective probe is found when the assembly of the inspection contact device 6 is completed, or if the probe is damaged during the use of the inspection contact device, the probe must be replaced, but the process is very complicated and difficult. The conventional inspection contact device 6 has a thick portion in the middle portion of the probe 40 in order to keep the probe 40 assembled in the inspection contact device. In other words, in the conventional inspection contact device, the thick portion of the probe is locked to the probe holes 15 and 25 and cannot be pulled out, thereby maintaining the state where the probe is assembled to the inspection contact device.

  Therefore, in order to replace the probe 40, the probe 40 can be replaced only after separating the inspection contact device 6 from the space transformer and then separating the guide plates 10 and 20 from the inspection contact device 6.

  The present invention is intended to solve the above-described problems of the prior art, and an object of the present invention is to provide an inspection contact device that can prevent a short circuit between probes even with a fine pitch. is there.

  Another object of the present invention is to provide an inspection contact device capable of easily exchanging probes.

  Another object of the present invention is to improve the positional accuracy of the probe in the probe hole.

  Another object of the present invention is to provide an inspection contact device having a space deformation function for expanding a space between probes.

  In order to achieve the above object, an inspection contact apparatus according to the present invention includes a first guide plate in which a first probe hole is formed, and a first guide plate in which the second probe hole is formed in parallel with the first guide plate. Two guide plates, an intermediate plate located between the first guide plate and the second guide plate and having an intermediate hole formed therein, and inserted into the first probe hole, the second probe hole, and the intermediate hole The intermediate plate is movable relative to the first guide plate and the second guide plate. In this case, at least a part of the probe may be bent, and the bent part may be in contact with the wall surface of the intermediate hole. Further, the probe may be deformed by relative movement of the intermediate plate, and the probe may be fixed without moving in the direction of gravity by its own weight.

  With such a configuration, when the probe is pressed against the electrode of the test object, the probe can move the intermediate plate in the bending direction while being further bent in the bending direction.

  The intermediate hole formed in the intermediate plate may have a long hole shape, and the long axis direction of the long hole shape intermediate hole is inclined by a predetermined angle with respect to a line connecting the centers of adjacent probes. It may be.

  The diameter of the thickest part of the probe may be smaller than the inner diameter of the first probe hole or the second probe hole.

  The probe is bent at least partially, and the intermediate plate is further movable in a direction in which the probe is bent, and movement is restricted in a direction opposite to the direction in which the probe is bent. It may be a thing. At this time, a first post hole is formed in the first guide plate or a second post hole is formed in the second guide plate, and the movement restriction of the intermediate plate is limited to the first post hole or the second post hole. This can be done by a post pin inserted in the post hole. In addition, an intermediate post hole for inserting the post pin is formed in the intermediate plate, and the inner diameter of the intermediate post hole can be formed larger than the diameter of the post pin so that the intermediate plate can move.

  The inspection contact device according to the present invention further includes a position adjusting pin for moving the intermediate plate relative to the first guide plate and the second guide plate, and the probe is moved by the movement of the intermediate plate. At least a portion may be bent, and the bent portion may contact the wall surface of the intermediate hole. The position adjustment pin is rotatably inserted into a first position adjustment hole formed in the first guide plate or a second position adjustment hole formed in the second guide plate, and the first position adjustment hole or the A portion that rotates eccentrically may be provided so that the intermediate plate can be pushed and moved when rotated in the second position adjusting hole. At this time, an inner diameter of the first position adjusting hole or the second position adjusting hole is formed larger than a diameter of the thickest portion of the position adjusting pin, and the position adjusting pin is removed after the intermediate plate is moved. It may be configured to be able to.

  The position adjusting pin may be configured to be inserted into a position adjusting hole formed on a side surface of the inspection contact device so that the intermediate plate can be pushed and moved.

  In the inspection contact device according to the present invention, the pitch and / or arrangement of the first probe holes may be different from the pitch and / or arrangement of the second probe holes.

  In the inspection contact device according to the present invention, an insulating coating may be formed on at least one of the probes.

  According to the inspection contact device of the present invention, there is an effect that a short circuit between probes can be prevented even at a fine pitch by the intermediate plate.

  In the present invention, the probe is supported by the first probe hole, the second probe hole, and the intermediate hole while the probe is bent, so that a probe having no portion locked to the probe hole can be used. There is an effect that the probe can be easily replaced.

  Further, the present invention has an effect that the position accuracy of the probe in the probe hole can be improved because all the probes are brought into close contact with each other in the probe hole by the intermediate plate.

  Further, the present invention has an effect that it is possible to provide a space deformation function that widens the space between the probes by changing the pitch and / or arrangement of the first probe holes and the second probe holes.

It is sectional drawing which shows the structure of the conventional test | inspection contact apparatus. It is sectional drawing which shows the structure of the test | inspection contact apparatus which concerns on one Embodiment of this invention. 4A and 4B are cross-sectional views showing the principle of fixing a probe by an intermediate plate in an inspection contact device according to an embodiment of the present invention, wherein FIG. 5A is a probe insertion stage, FIG. It is sectional drawing of a step. It is the plane sectional view and side sectional view of the 1st guide plate, the 2nd guide plate, and the middle plate in the inspection contact device concerning one embodiment of the present invention. It is a top view which shows the arrangement | sequence of a probe and an intermediate | middle hole. It is sectional drawing of the test | inspection contact apparatus which concerns on other embodiment of this invention, Comprising: (a) is a probe insertion step, (b) is sectional drawing of a probe fixing step. It is sectional drawing of the test | inspection contact apparatus which concerns on another embodiment of this invention comprised so that a position adjustment pin could be removed. It is sectional drawing of the test | inspection contact apparatus which concerns on another embodiment of this invention in which the position adjustment hole was formed in the side surface. It is sectional drawing of the test | inspection contact apparatus which concerns on another embodiment of this invention from which the minimum pitch of the probe hole of a 1st guide plate and a 2nd guide plate differs. It is a conceptual diagram which shows the principle which expands the distance between probes by an inspection contact apparatus, (a) is a case where a probe is mutually parallel, (b) is a case where the position of the upper end of a probe is moved to x and y direction It is. It is a top view which illustrates the desirable arrangement of the 1st probe hole and the 2nd probe hole.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, an inspection contact apparatus for inspecting a semiconductor wafer will be mainly described. However, the present invention is not limited to an inspection contact apparatus for semiconductor wafer inspection, and all inspection contact apparatuses having a plurality of vertical probes. It is applicable to.

  FIG. 2 is a cross-sectional view showing the structure of the inspection contact device 1 according to one embodiment of the present invention. Referring to FIG. 2, an inspection contact apparatus 1 according to an embodiment of the present invention includes a first guide plate 10 in which a first probe hole 15 is formed, and a second probe that is positioned in parallel with the first guide plate 10. The second guide plate 20 in which the holes 25 are formed, the intermediate plate 30 that is positioned between the first guide plate 10 and the second guide plate 20 and in which the intermediate holes 35 are formed, and both ends are the first probe holes. 15 and a plurality of probes 50 inserted into the second probe hole 25 and having an intermediate portion inserted into the intermediate hole 35.

  The first guide plate 10 and the second guide plate 20 may be in contact with an inspection body (not shown) and a space transformer (not shown) during inspection. Further, the probe 50 may be a probe that is deformed while being pressed by being pressed between the inspection object and the space transformer during the inspection. The deformation of the probe 50 is almost elastic deformation, but does not exclude plastic deformation.

  The relative positions of the first guide plate 10 and the second guide plate 20 can be fixed by the post pins 60. That is, the post pin 60 is inserted into the first post hole 16 and the second post hole 26 respectively formed in the first guide plate 10 and the second guide plate 20, so that the relative relationship between the first and second guide plates 10 and 20. The positions can be fixed to each other. At this time, an intermediate post hole 36 having a long hole shape is formed in the intermediate plate 30, and the post pin 60 can support the intermediate plate 30 by contacting one side surface of the intermediate post hole 36. With such a configuration, the intermediate plate 30 is configured not to be fixed by the post pin 60 but to be able to move relative to the first and second guide plates 10 and 20.

  If a direction in which a portion bent when the probe 50 is bent is defined as a bending direction 55, in FIG. 2, the post pin 60 is prevented from returning to the original position in a state where the intermediate plate 30 is slightly moved in the bending direction 55. It is in a state supported by. That is, when looking at the position between the holes in which the same probe 50 is inserted in common, the intermediate hole 35 moves a little more in the bending direction than the first and second probe holes 15 and 25. Thereby, the intermediate portion of the probe 50 is bent and is in contact with the left side surface of the intermediate hole 35 in the drawing by an elastic restoring force.

  When the probe 50 is in close contact with the inspection object, the amount of bending of the probe 50 is further increased, and the intermediate portion of the probe 50 can press the right side surface of the intermediate hole 35 on the drawing. Since the intermediate plate 30 is not fixed by the post pin 60, the intermediate plate 30 can be further moved in the bending direction by the probe 50. That is, the intermediate plate 30 can be moved in the bending direction by the post pin 60 inserted in the long intermediate post hole 36 formed in the intermediate plate 30, but the movement is restricted in the opposite direction. . In FIG. 2, it has been described that the post pin 60 is inserted into the long intermediate post hole 36 formed in the intermediate plate 30, but a structure in which the post pin 60 supports the outer portion of the intermediate plate 30 is also possible. Also in this case, the movement of the intermediate plate 30 is restricted in the direction in which the post pin 60 is present, but can be moved in the opposite direction, that is, in the bending direction 55.

  The post hole 36 of the intermediate plate 30 can also be formed on the bending direction side of the probe with reference to the probe position. When the position of the post hole is changed to the opposite side as described above, the stress generated between the intermediate hole in which the probe is inserted and the post hole of the intermediate plate is also changed from the compressive stress to the tensile stress. It is also possible to form a plurality of post holes in one intermediate plate and disperse the stress applied to the post holes. In the conventional inspection contact device, if any one of the probes is long or if any one of the contacting electrodes is high, the probe deforms unevenly during the inspection. As a result, adjacent probes may come into contact with each other. Therefore, an insulating coating is usually formed on the middle part of the probe where bending occurs. However, in the structure of the inspection contact device 1 according to the present invention, all the probes 50 can be similarly deformed by the intermediate plate 30. Conventionally, only the vertical force applied to the probe 50 deforms the probe, but in the structure of the present invention, the horizontal force by the intermediate plate 30 can deform the probe 50 together with the vertical force.

  Therefore, in the inspection contact device 1 according to the present invention, the bending degree of the probe 50 is uniform, and the adjacent plates 50 are prevented from contacting each other by the intermediate plate 30, so that a short circuit between the probes 50 is effectively prevented. Is done. The use of the structure of the present invention is very efficient in manufacturing because it is not necessary to provide an insulating coating on the probe 50 even with a fine pitch.

  FIG. 3 is a diagram illustrating the principle that the probe 50 is fixed by the intermediate plate 30 in the embodiment of the present invention. FIG. 3A shows a stage in which the probe 50 is inserted when the inspection contact apparatus 1 is assembled. It is assumed that the probe 50 before being assembled into the inspection contact device is a straight probe having a uniform thickness throughout and no bending at the middle portion. In a state where the first probe hole 15, the second probe hole 25, and the intermediate hole 35 are all aligned on a straight line, the linear probe 50 is inserted through the three holes.

  FIG. 3B is the next assembly stage of FIG. 3A, in which the probe 50 is fixed by moving the intermediate plate 30 in the bending direction. As the intermediate plate 30 is moved in a direction perpendicular to the length direction of the probe 50 with the probe 50 inserted, the intermediate portion of the probe 50 is elastically deformed while being bent. The probe 50 is fixed in close contact with the intermediate hole 35 by an elastic restoring force in which one side surface of the elastically deformed probe 50 presses the inner wall of the intermediate hole 35. The probe 50 thus fixed cannot be pulled out of the hole by its own weight due to gravity. In this state, when the probe 50 is pushed vertically with a certain force or more, the probe 50 can move up and down.

  FIG. 3C shows a stage where the inspection body is inspected using the inspection contact device 1 and the probe 50 is deformed when one end of the probe 50 comes into close contact with the inspection body. A force is applied to one end of the probe 50, the probe 50 is pushed up into the first probe hole 15 of the first guide plate 10, and the probe 50 is interposed between the first guide plate 10 and the second guide plate 20. The amount of bending becomes even larger. The bending direction 55 of the probe 50 can be determined by the direction in which the intermediate plate 30 is moved in the assembly stage of the inspection contact device, that is, in the stage of FIG.

  3B, the probe 50 is deformed by the movement of the intermediate plate 30, but the intermediate plate 30 can be moved by the deformation of the probe 50 in the use stage. That is, the inner wall of the intermediate hole 35 pushes the side surface of the probe 50 in the bending direction at the assembly stage of the inspection contact device 1, and the bent portion of the probe 50 presses the inner wall on the opposite side of the intermediate hole 35 in the bending direction at the use stage. Therefore, the directions in which the side surface of the probe 50 abuts against the inner wall of the intermediate hole 35 in these two stages are opposite to each other.

  In the existing inspection contact device, a thick part is formed in the middle of the probe or a protrusion on the side of the probe so that the probe inserted into the probe hole cannot be locked in the probe hole and pass through the probe hole. Form. On the other hand, in the present invention, the probe 50 is fixed in close contact with the inner wall of the intermediate hole 35 and the inner walls of the probe holes 15 and 25 by an elastic restoring force. That is, even if there is no thick portion or protruding portion of the probe locked in the probe hole, the probe cannot be easily removed. Therefore, in the structure of the present invention, the probe 50 passes through the probe holes 15 and 25 by making the diameter of the cross section of the thickest part of the probe 50 smaller than the inner diameters of the first and second probe holes 15 and 25. It is possible to configure so that That is, in the structure of the present invention, the probe 50 can be extracted or inserted through the probe holes 15 and 25, so that the guide plates 10 and 20 can be easily separated through the probe holes 15 and 25 without being separated. The probe 50 can be exchanged.

  In the conventional inspection contact device, the probe is prevented from coming out of the probe hole by using the thick part of the probe. However, in the structure of the present invention, the probe 50 is located between the intermediate hole 35 and the inner walls of the probe holes 15 and 25. The probe 50 is held by the frictional force. Even with the structure of the present invention, a probe coated with an insulating coating can be used when the probe density is high enough to cause a short circuit between the probes. Since the inspection contact device is used for testing, it must maintain accurate performance even in extreme cases, and thus a structure that prevents double and triple short circuit and leakage current can be adopted. Thus, even when the probe has a thick portion, at least one of the first probe hole 15 and the second probe hole 25 can be formed larger than the thickest portion of the probe, so that the probe can be easily exchanged. Unlike the existing inspection contact device, the probe 50 is fixed by an elastic restoring force. Therefore, even when the inspection contact device is covered, the probe 50 does not move in the direction of gravity but is fixed in its original position. Such a structure is possible because the mass of the probe 50 is much lighter than the frictional force due to the elastic restoring force of the probe 50.

  Further, in the conventional inspection contact device, when the inner diameter of the probe hole is larger than the outer diameter of the probe, the movement of the probe in the probe hole is increased, so that the position accuracy of the probe is deteriorated. However, in the structure of the present invention, since the intermediate plate 30 pushes all the probes 50 in one direction of the probe holes 15 and 25 and there is no movement of the probe in the probe holes, the probe holes 15 and 25 are large. However, there is an advantage that the positional accuracy of the probe 50 becomes very high.

  In the embodiment of FIGS. 2 and 3, a probe having a straight line shape and the same overall thickness has been described as an example. However, in the case of a probe in which an intermediate portion including a cobra probe can be bent, The technical idea of the present invention can also be applied. Even in the case of a cobra probe with a bent middle part, if the probe is elastically deformed by slightly moving the relative position of the probe hole and the intermediate hole at the position where the probe is inserted, the probe will move to the given position. It is fixed with.

  Also, the pogo probe can be fixed by applying the same elastic deformation to the middle part of the probe on the same principle. In the case of a pogo probe, it is desirable that a plunger is in close contact with the inner wall of the probe hole in the guide plate, and a barrel is in close contact with the inner wall of the intermediate hole in the intermediate plate. The pogo probe maintains a linear shape even when compressed, so there may be little movement of the intermediate plate due to deformation of the pogo probe.

  FIG. 4 is a plan sectional view and a side sectional view of the first guide plate 10, the second guide plate 20, and the intermediate plate 30 in the inspection contact device 1 according to the embodiment of the present invention. The intermediate plate 30 moves in the bending direction as compared with the first and second guide plates 10 and 20 positioned above and below, whereby the probe 50 is elastically deformed and the intermediate hole 35 and the probe holes 15 and 25 Closely fixed inside. The intermediate plate 30 moved in the bending direction is supported by the post pin 60 although a force to return to the opposite direction of the bending direction is applied by the elastic restoring force of the probe 50. The post pin 60 is inserted through the first and second post holes 16 and 26 of the first and second guide plates 10 and 20 and the intermediate post hole 36 of the intermediate plate, and the first and second guide plates 10 and 20 and It plays a role of specifying the relative position of the intermediate plate 30. Since the first and second guide plates 10 and 20 must be fixed to each other in an accurate position, the first post hole 16 and the second post hole 26 may be circular in plan, and the intermediate plate 30 is bent. Since the intermediate post hole 36 needs to be supported so as to move in the opposite direction but not be pressed in the opposite direction, the intermediate post hole 36 may have a long hole shape in plan view.

  The actual situation in which an inspection contact device is used differs from the ideal situation, where the length of all probes is not perfectly uniform and the bending degree of all probes may not be the same. Since the distance obtained by subtracting the outer diameter of the probe 50 from the inner diameter of the intermediate hole 35 becomes a space that can absorb such uneven bending, the intermediate hole 35 needs to be formed to be somewhat large. However, since the distance between the dense intermediate holes 35 is small, there is a limit to increasing the size of the intermediate holes 35. When the intermediate holes 35 are formed long in the bending direction, a space capable of absorbing the bending unevenness of the probe is ensured in the bending direction 55 while maintaining a thick wall between the dense intermediate holes 35. be able to. Therefore, it is desirable that the planar shape of the intermediate hole 35 has a long axis such as a long hole, an ellipse, or a rectangle.

  At this time, the major axis direction of the intermediate hole 35 is preferably a direction having a predetermined inclination with respect to a straight line connecting the centers of the adjacent probes 50. The major axis direction of the intermediate hole 35 is basically the direction in which the probe 50 is bent, which is because the probe is easily abutted against other adjacent probes while being bent. That is, the direction in which the probe is bent is preferably a direction having a predetermined inclination with respect to a straight line connecting the centers of adjacent probes.

  FIG. 5 is a plan view showing the arrangement of the probes 50 and the intermediate holes 35, and illustrates the case where the probes 50 are densely arranged in a two-dimensional plane. As shown in FIG. 5, if the intermediate hole 35 is formed in a long hole shape and the long axis direction is 45 degrees with respect to the straight line connecting the centers of the adjacent probes 50, the intermediate hole 35 can be maximized for maximum space efficiency. When the probes 50 are arranged in a long line, it is preferable that the long axis direction of the intermediate hole 35 is 90 degrees with respect to a straight line connecting the centers of the adjacent probes 50. It may be the most disadvantageous in terms of space efficiency that the linear direction connecting the centers of the adjacent probes 50 and the major axis direction of the intermediate hole 35 coincide.

  The technical idea of the present invention can be applied even when there are two or more guide plates in which probe holes for inserting probes are formed. Also in this case, the plate through which the portion where the probe bends passes is an intermediate plate, and both sides that support the probe inserted so that the intermediate portion is bent are guide plates. The guide plate closest to the intermediate plate and close to the inspection object may be the first guide plate, and the guide plate closest to the intermediate plate on the opposite side may be the second guide plate.

  There can also be multiple intermediate plates. Any plate that can move in the probe bending direction in response to probe bending can be an intermediate plate. The more intermediate plates, the easier the probe can be inserted and the short circuit between the probes is prevented. Overlapping intermediate plates can share post pins. The intermediate plate can be separately formed by dividing the entire area into two or more. In such a case, each intermediate plate can independently have a post pin.

  In addition to the post pins 60, a separate fixing device for relatively fixing the first guide plate 10 and the second guide plate 20 may be further included. For example, the first and second guide plates 10 and 20 can be fixed by forming position fixing holes in the first guide plate 10 and the second guide plate 20 and inserting position fixing pins into the position fixing holes. In this case, the post pin 60 does not necessarily have to penetrate the first guide plate 10 and the second guide plate 20, and a post hole is formed only in one of the first and second guide plates 10 and 20. The post pin 60 may be inserted.

  FIG. 6 is a cross-sectional view of an inspection contact device 2 according to another embodiment of the present invention. The inspection contact device 2 according to the present embodiment includes a position adjustment pin 70 for adjusting the position of the intermediate plate 30.

  The structure of the inspection contact device 2 will be described with reference to FIG. 6. The first guide plate 10 in which the first probe hole 15 is formed, and the second probe hole 25 is formed in parallel with the first guide plate 10. The second guide plate 20, the intermediate plate 30 positioned between the first guide plate 10 and the second guide plate 20 and formed with the intermediate hole 35, and the both ends of the first probe hole 15 and the second guide plate 20, respectively. A plurality of probes 50 inserted into the probe hole 25 and having an intermediate portion inserted into the intermediate hole 35 are included. Grooves are formed on the surfaces of the first and second guide plates 10 and 20, respectively, and the first and second probe holes 15 and 25 are finely formed in the grooves. The same as the contact device 1.

  However, in the inspection contact device 2 of FIG. 6, the first position adjustment hole 17 is formed in the first guide plate 10, the second position adjustment hole 27 is formed in the second guide plate 20, and the intermediate position adjustment hole 37 is formed in the intermediate plate 30. Each of the position adjustment holes 17, 27, and 37 is provided with a position adjustment pin 70 so that the position of the intermediate plate 30 can be adjusted. The position adjusting pin 70 prevents the intermediate plate 30 from returning to the original position again by the elastic restoring force of the bent probe 50 after moving the intermediate plate 30 in the bending direction 55. It can also serve as the post pin 60 provided in the two inspection contact devices 1.

  The position adjusting pin 70 is rotatably provided in the position adjusting holes 17, 27, and 37, and the thickness of the position adjusting pin 70 located in the intermediate position adjusting hole 37 is the first and second position adjusting holes. 17 and 27 may be different from the thickness of the position adjustment pin 70 in the portion located in the position. Although FIG. 6 shows that the thickness of the position adjustment pin in the portion located in the intermediate position adjustment hole 37 is thicker, it can be formed thinner. When the position adjustment pin 70 having such a configuration is rotated around the rotation axis, the intermediate plate 30 is pressed against the position adjustment pin 70 and can move in the bending direction. Based on the position of the intermediate hole 35 into which the probe is inserted, the intermediate position adjusting hole 37 may be formed on the bending direction side of the probe, or the intermediate position adjusting hole may be formed on the opposite side.

  The inner diameter of the intermediate position adjusting hole 37 is such that the intermediate plate 30 can be moved and the intermediate plate 30 can be further moved in the bending direction in response to further bending of the probe 50 during inspection. It can be formed larger than the outer diameter. Alternatively, the position adjusting pin 70 can be configured to support the outer shell of the intermediate plate 30 without the intermediate position adjusting hole 37. The movement of the intermediate plate 30 by the position adjusting pin 70 will be described in more detail with reference to FIG. FIG. 6A shows the inspection contact device at the stage where the insertion of the probe 50 is completed in the intermediate process of assembly. After the first probe hole 15, the second probe hole 25, and the intermediate hole 35 are aligned in order to be advantageous for insertion of the linear probe 50, the probe 50 is aligned with the first probe hole 15, the first probe hole 15, and the second probe hole 15. The two probe holes 25 and the intermediate hole 35 are inserted in common.

  In order to accurately align the positions of the plates so that the first probe hole 15, the second probe hole 25, and the intermediate hole 35 are positioned in a straight line during the probe insertion stage, a separate alignment (not shown) is used. An alignment hole and an alignment pin can be provided, or the alignment holes 17, 27, and 37 and the alignment pin 70 can play such a role. By forming the position fixing holes 18 and 28 in the first and second guide plates 10 and 20 and inserting the position fixing pins 80 therein, the relative positions of the aligned first guide plate 10 and second guide plate 20 are relative to each other. Can be fixed.

  FIG. 6B shows a state in which the assembly is completed, and after the probe 50 is inserted, the intermediate plate 30 moves in a direction perpendicular to the length direction of the probe 50 so that the intermediate portion of the probe 50 is moved. It is in a bent state. When the position adjustment pin 70 inserted in the position adjustment holes 17, 27, 37 is rotated in a state where the probe 50 is inserted, the intermediate plate 30 is pressed against the position adjustment pin 70 and can move horizontally to the right. As the intermediate plate 30 moves, the probe 50 is fixed in close contact with the probe hole 15, 25, 35 in one direction.

  The position adjusting pin 70 in FIG. 6 is composed of two portions having different thicknesses, and the cross-sectional centers of the two portions do not coincide with each other. As the position adjusting pin 70 partially eccentric is rotated in this manner, the relative positions of the first and second guide plates 10 and 20 and the intermediate plate 30 change. As the intermediate plate 30 moves, the probe 50 is fixed in close contact with the inner wall of the intermediate hole 35 of the intermediate plate 30 while being elastically deformed. The position adjusting pin 70 of FIG. 6 functions as a post pin that remains in the inspection contact device while being inserted into the position adjusting holes 17, 27, and 37 so that the intermediate plate 30 cannot move in one direction. Can do. The position adjustment pin 70 preferably has a circular cross-sectional shape as a whole so as to be suitable for rotation, and the cross-sectional shape of the portions having different thicknesses is a circular shape, a long circular shape, or a circular cross-section in which one is cut off. It preferably has a shape.

  In order for the relative position of the first guide plate and the intermediate plate to change as the position adjustment pin 70 is rotated, the center of the position adjustment hole formed in the first guide plate and the position adjustment formed in the intermediate plate The centers of the holes should not coincide with each other, or the shape of the position adjustment hole formed in the first guide plate and the shape of the position adjustment hole formed in the intermediate plate should not be the same.

  In the structure of FIG. 6, the position adjustment pin 70 is exposed to the outside through the first and second position adjustment holes 17 and 27, and the position adjustment pin exposed to the outside in the assembled state of the inspection contact device 2. The intermediate plate 30 can be moved by rotating 70. The front end portion of the position adjusting pin 70 can be protruded, and the protruding portion can be gripped and rotated. For this purpose, the protruding portion of the position adjusting pin 70 has a polygonal cross-sectional shape such as a square or a hexagon. It is preferable. If the tip of the position adjusting pin 70 does not protrude outside the guide plates 10 and 20, a single or cross-shaped groove is formed in the cross section of the position adjusting pin 70 exposed to the outside, and the position is adjusted by the driver. The adjustment pin 70 can also be rotated. In order to fix the position adjusting pin 70 stably, a thread can be formed on one side of the position adjusting pin 70.

  By moving the intermediate plate 30 using the position adjusting pin 70, the probe 50 is fixed in close contact with the inner wall of the intermediate hole 35 of the intermediate plate 30, but in this process, the probe 50 is entirely removed from a straight line. It will elastically deform into a curved shape with curvature. In the case of a probe having an original curved shape, the curvature of the probe can be further increased by elastic deformation. In the step of inserting the probe into the probe hole, a probe having a straight line shape is more suitable. However, when the probe is bent, it is more advantageous for maintaining a lateral distance between the probes that the probe has a certain degree of curvature. The distance between the first probe hole of the first guide plate where the probe is bent and the second probe hole of the second guide plate is defined as a buckling length, and the intermediate portion of the probe is bent in the bending direction. When the distance moved is defined as a bending distance, the bending distance using the position adjusting pin is preferably 2% or more of the buckling length. When the bending distance is 2% of the buckling length, the amount of bending is so small that the probe may look like a straight line that is not bent at all. By specifying the bending direction of the probe, it is possible to obtain an effect that the probe is fixed by contacting the inner wall of the intermediate hole with the probe.

  FIG. 7 shows an example of the inspection contact device 3 according to another embodiment of the present invention configured to be able to remove the position adjustment pin 70 after the intermediate plate 30 is moved. In contrast to the embodiment of FIG. 6, the position adjustment pin 70 of FIG. 6 is partially thicker in the middle than the position adjustment holes 17 and 27, whereas the position adjustment pin 70 of FIG. The entirety is formed thinner than the first position adjusting hole 17. Therefore, the position adjustment pin 70 can be removed through the first position adjustment hole 17 after the intermediate plate 30 is moved in the bending direction using the position adjustment pin 70.

  When the position adjusting pin 70 is removed, the intermediate plate 30 can be returned to the original position by the elastic restoring force of the probe 50. Therefore, the post pin 60 is used to prevent this. That is, the first and second post holes 16 and 26 are formed in the first and second guide plates 10 and 20, and the post pin 60 can be inserted therein. In the drawing, the post pin 60 supports the intermediate plate 30 so that the intermediate plate 30 cannot move to the left. The post pin 60 may be configured to support the inner wall of the intermediate post hole 36 formed in the intermediate plate 30, or may be configured to support the outer side surface of the intermediate plate 30. In the structure in which the post pin supports the outer side surface of the intermediate plate, it is not necessary to form a separate post hole in the intermediate plate. Since the position adjusting pin 70 can be removed in the structure provided with the post pin 60, only the position adjusting holes 17, 27, and 37 without the position adjusting pin 70 can remain in the assembled state.

  When the post pin 60 is inserted into the intermediate post hole 36 as shown in FIG. 7, the inner diameter of the intermediate post hole 36 is larger than the outer diameter of the post pin 60 so that the intermediate plate 30 can move to the right according to the bending of the probe. Can be formed. As shown in FIG. 7, the intermediate post hole 36 can be formed in the shape of an elongated slot. Since the intermediate plate can move freely in the bending direction and at the same time reduce the movement in the other direction, the intermediate post hole is shaped like a long hole formed longer in the bending direction of the probe than circular. More preferably. When the cross section of the probe is a quadrangle, a rectangular shape formed long in the bending direction is preferable.

  When the area of the inspection contact device is large, a plurality of intermediate plates with a small area can be installed, and the position can be adjusted independently using a separate position adjusting pin for each intermediate plate. In such a case, position adjustment pins that are complicated in shape and relatively difficult to process are used only in the assembly stage. After assembling a post pin that is relatively simple in shape and relatively easy to process, It is more economical to make it remain. Constructing a screw at one end of the post pin and the post pin as a bolt helps to fix the post pin to the guide plate. Further, in the inspection contact device having such a structure, it is more advantageous in terms of space utilization to install the position adjusting pin on the side surface of the guide plate as shown in FIG. It is.

  Further, the position adjustment hole can be formed only in one of the first guide plate 10 and the second guide plate 20.

  Although not shown in FIG. 7, in order to align the relative positions of the first and second guide plates 10 and 20 and the intermediate plate 30 at the initial stage of assembly, a separate align hole and align pin are provided. Can do. Alternatively, the position adjustment holes 17, 27, and 37 and the position adjustment pin 70 can also serve as such a role.

  In order to fix the relative positions of the first guide plate 10 and the second guide plate 20, a position fixing pin 80 may be provided. The position fixing holes 18 and 28 into which the position fixing pins 80 are inserted are preferably formed in thick portions where no grooves are formed in the guide plates 10 and 20 so as to be durable. After aligning the relative positions of the first guide plate 10 and the second guide plate 20 using an alignment pin (not shown), a position adjustment pin 70, etc., the position fixing pin 80 is inserted into the position fixing holes 18, 28. And fix it firmly. A screw thread may be formed on the position fixing pin 80 so that the position fixing pin 80 can be firmly fixed by rotating with a screwdriver or the like. Although only one position fixing pin 80 is shown in the drawing, in practice, two or more position fixing pins may be provided symmetrically in the vertical and horizontal directions around the probe array.

  FIG. 8 is a cross-sectional view of an inspection contact device 4 according to another embodiment of the present invention, wherein the position adjustment hole 17 and the position adjustment pin 70 are arranged on the side surface. The inspection contact device 4 of FIG. 8 has a structure in which the position adjustment hole 17 is formed on the side surface, and the intermediate plate 30 is moved by the position adjustment pin 70 inserted into the position adjustment hole 17. The position adjusting pin 70 is used to adjust the position of the intermediate plate 30 and can serve as a post pin that supports the intermediate plate 30 so that it cannot move in the direction opposite to the bending direction of the probe 50. By forming a screw thread on the position adjustment pin 70, the intermediate plate 30 can be pushed while the position of the position adjustment pin 70 changes according to the rotation of the position adjustment pin 70. It may be a shape.

  The probe 50 is inserted in a state where the positions of the first probe hole 15, the second probe hole 25, and the intermediate hole 35 are accurately aligned. At this time, the alignment holes 19, 29, and 39 are formed in the first guide plate 10, the second guide plate 20, and the intermediate plate 30, respectively, and an alignment pin (not shown) is inserted, so that the relative positions of the plates 10, 20, and 30 The correct position can be accurately aligned. The align pin may be in the form of a straight line having a circular cross section and having an overall uniform thickness in the length direction.

  When the insertion of the probe 50 is completed, the alignment pin is removed to move the intermediate plate 30. Therefore, the alignment pins are removed from the inspection contact device 4 that has been assembled as shown in FIG. 8, and only the alignment holes 19, 29, and 39 remain. Two or more alignment holes may be formed, and at least one of the plurality of alignment holes may be formed in a long hole shape.

  On the other hand, in the inspection contact device according to the present invention, the minimum pitch of the first probe holes 15 formed in the first guide plate 10 is different from the minimum pitch of the second probe holes 25 formed in the second guide plate 20. It can also be formed. FIG. 9 is a sectional view of the inspection contact device 5 to which such a technique is applied. Although not shown in FIG. 9, a position adjustment hole and position adjustment pin for moving the intermediate plate 30, a post hole and a post pin for supporting the intermediate plate, an alignment hole and an alignment pin for aligning each plate, etc. The above-described configuration may optionally be further provided.

  Referring to FIG. 9, the inspection contact device 5 is formed such that the pitch of the second probe holes 15 is larger than the pitch of the first probe holes 15. The lower end of the probe 50 protruding from the first probe hole 15 is formed to have the same arrangement as the electrode formed on the surface of the test object. On the other hand, the second probe holes 25 are formed so as to be able to further secure the distance between the probes 50 by being more widely arranged. When the inspection contact device 5 is driven, the probes 50 are in contact with each other while being bent, and there is a risk of causing a short circuit. However, if the distance between the probes 50 can be further increased, this risk is reduced. Can do.

  FIG. 10 is a conceptual diagram showing the principle of enlarging the distance between the probes 50 in the inspection contact device 5. The probe 50 is entirely made of a conductive material and has no insulating coating. As the inspection contact device 5 comes into close contact with the inspection object, the lower end of the probe 50 is pressed by the surface of the inspection object, and the amount of bending of the probe increases. In FIG. 10, the guide plates 10 and 20 and the intermediate plate 30 are all omitted with the bending amount increased, and only the probe 50 is represented.

  FIG. 10A shows a case where the arrangement of the first probe holes 15 and the second probe holes 25 is the same, and all the probes 50 are maintained parallel to each other in the z direction. The pitch at the lower end of the probe 50 is the same as the pitch at the upper end of the probe 50. In such a structure, there is a risk of a short circuit between the probes caused by a probe having an uneven bending. In particular, at a fine pitch of 100 μm or less, the risk of a short circuit between the probes is very high. In spite of the presence of the intermediate plate, there can be a short circuit or leakage current between the probes between the intermediate plate and the guide plate due to the probe with very severe uneven bending.

  In FIG. 10B, by adjusting the relative arrangement of the first probe holes 15 and the second probe holes 25, the position of the upper end of each probe 50 is in the x and y directions compared to FIG. The distance between the probes 50 is expanded by moving little by little. According to such a structure, the probes 50 can be prevented from coming into contact with each other by extending the distance between the probes 50 while accurately contacting the probes 50 on the surface of the test object in a predetermined arrangement. When the upper ends of the probes 50 move, the distance between the probes 50 increases. In particular, when the upper ends of the probes 50 move in the x direction, the distortion curves of adjacent probes 50 do not overlap each other. The probe 50 has a circular cross section, and the most swollen portions in the middle are easily in contact with each other. However, since the most swollen portions of the probes 50 do not overlap, the possibility that the probes come into contact with each other and short-circuit is greatly reduced.

  Since the arrangement of the first probe holes 15 is determined by the electrode arrangement of the test object and cannot be arbitrarily changed, the interval and arrangement between the second probe holes 25 of the second guide plate 20 can be changed. is there. In this case, the arrangement of the electrodes formed in the space transformer must be changed in accordance with the arrangement of the second probe holes 25. In a situation where the probes are densely packed, the possibility of a short circuit between the probes 50 can be greatly reduced by changing the arrangement of the second probe holes 25 in this way. Since the distance between the probes is too close, there is a possibility that a short circuit between the probes may occur even if the distance between the probes is increased. A probe in which an insulator is coated on the intermediate portion of the probe can also be used. Even when only one of the two probes having the minimum pitch is coated with the insulator, the insulator coating is effective.

  Depending on the pitch and arrangement of the second probe holes 25, the pitch and arrangement of the intermediate holes 35 formed in the intermediate plate 30 must be changed together. That is, when a linear probe is inserted, the positions of the holes must be aligned so that the first probe hole 15, the intermediate hole 35, and the second probe hole 25 are all in a straight line at the insertion stage. When the intermediate plate 30 is at an intermediate point between the first guide plate 10 and the second guide plate 20, the intermediate hole 35 of the intermediate plate 30 is a distance traveled by the second probe hole 25 compared to the first probe hole 15. Can be configured to move only half of the distance.

  By making the pitch of the second probe holes 25 larger than the pitch of the first probe holes 15, the probe 50 is tilted away from the vertical, and compared with the case where the pitches are the same, The distance from the second probe hole 25 is further increased. However, the distance that the second probe hole 25 moves substantially on the second guide plate 20 is sufficiently small at 1% level compared to the distance between the first guide plate 10 and the second guide plate 20. The change in the distance between the two probe holes 15 and 25 due to the movement of the two probe holes 25 is at a negligible level. That is, since there is no special change in the length of the probe 50, the entire inspection contact device can be manufactured with one type of probe having the same length. The probe 50 can be tilted in the x direction and the y direction, respectively, and the length of the probe is affected by the tilted angle compared to the vertical probe when the two directions are combined, but the probe length is greatly affected. It is preferable to change the position of the second probe hole 25 of the second guide plate 20 within a range in which the second guide plate 20 is not given. The technique of changing the interval between the probes by changing the pitch of the second probe holes 25 in this way can be similarly applied to all vertical probes including a cobra probe, a wire probe, and a poco probe.

  FIG. 11 is a plan view illustrating a preferred arrangement of the first and second probe holes 15 and 25. FIG. 11A shows the first probe holes 15 formed in a row in the first guide plate 10. FIG. 11B shows a structure in which a part of the second probe hole 25 of the second guide plate 20 is moved in the x direction.

  The pitch 59 of the second probe holes 25 is increased as compared to the pitch 58 of the first probe holes 15, and the arrangement of the second probe holes 25 is also changed. If the arrangement of the second probe holes 25 is widely arranged, there is an advantage that the electrode formation of the corresponding space transformer becomes more advantageous. In FIG. 11, when the bending direction of the probe 50 is the x direction, the distortion curves of the probes 50 adjacent to each other do not overlap each other. If the distortion curves do not overlap, the adjacent probes 50 do not overlap with each other, and therefore, even when the intermediate portion of the probe 50 swings in the y direction, the probability that the adjacent probes 50 contact each other is greatly reduced.

  As described above, the embodiments have been described with reference to the drawings and the drawings. However, this is only an embodiment, and various modifications can be made within the scope of the technical idea of the present invention. It is self-explanatory. The inspection contact device described by each embodiment does not exclude the addition of other configurations, and, for example, can be implemented by selectively combining different embodiments. Therefore, the protection scope of the present invention should be determined by the description of the claims and the equivalent scope thereof.

Claims (13)

A first guide plate in which a plurality of first probe holes are formed;
A second guide plate positioned in parallel with the first guide plate and having a plurality of second probe holes;
An intermediate plate located between the first guide plate and the second guide plate and having a plurality of long hole-shaped intermediate holes;
A plurality of probes inserted into the first probe hole, the second probe hole, and the intermediate hole , wherein the diameters of the thickest portions of the plurality of probes are the inner diameters of the first probe hole and the second probe hole. Smaller than the probe, and
The intermediate plate is movable relative to the first guide plate and the second guide plate;
At least a portion of the probe is bent by the movement of the intermediate plate, the bent portion is in contact with the inner wall surface of the intermediate hole ,
The long axis direction of the intermediate hole Ri bending direction der of the probe,
When the probe is pressed in contact with the electrode of the inspection object, the probe is further bent, and the intermediate plate is further moved by pressing the opposite side of the inner wall surface of the intermediate hole in the bending direction.
Since the plurality of probes are not uniform in length, even if the plurality of probes are further bent in the bending direction, the intermediate hole lengthens the unevenness of the probe. An inspection contact device characterized by absorbing in the axial direction . The inspection contact apparatus according to claim 1 , wherein movement of the intermediate plate is restricted in a direction opposite to the bending direction of the probe. A first post hole is formed in the first guide plate, or a second post hole is formed in the second guide plate;
The inspection contact apparatus according to claim 2 , wherein the movement limitation of the intermediate plate is performed by a post pin inserted into the first post hole or the second post hole. An intermediate post hole for inserting the post pin is formed in the intermediate plate,
The inspection contact apparatus according to claim 3 , wherein an inner diameter of the intermediate post hole is formed larger than a diameter of the post pin so that the intermediate plate can move.   The inspection contact device according to claim 1, further comprising a position adjustment pin for moving the intermediate plate relative to the first guide plate and the second guide plate. The position adjustment pin is
The first position adjustment hole formed in the first guide plate or the second position adjustment hole formed in the second guide plate is rotatably inserted into the first position adjustment hole or the second position adjustment hole. The inspection contact device according to claim 5 , further comprising an eccentric rotation portion so that the intermediate plate can be pushed and moved when the intermediate plate is rotated. An inner diameter of the first position adjusting hole or the second position adjusting hole is formed larger than a diameter of the position adjusting pin, and the position adjusting pin can be removed after the intermediate plate is moved. The inspection contact device according to claim 6 , wherein the inspection contact device is a feature. The inspection according to claim 5 , wherein the position adjustment pin is inserted into a position adjustment hole formed on a side surface of the inspection contact device and configured to move the intermediate plate. Contact device.   The inspection contact apparatus according to claim 1, wherein the pitch of the first probe holes and the pitch of the second probe holes are different from each other.   The inspection contact apparatus according to claim 1, wherein an arrangement of the first probe holes and an arrangement of the second probe holes are different from each other.   2. The inspection contact device according to claim 1, wherein a major axis direction of the long hole-shaped intermediate hole is a direction inclined by a predetermined angle with respect to a line connecting the centers of adjacent probes.   The inspection contact apparatus according to claim 1, wherein an insulating coating is formed on at least one of the probes. The inspection contact apparatus according to claim 1, wherein the probe is fixed without moving in the direction of gravity due to its own weight.

Images