JP6650496B2 - モジュール化液体冷却式サーバーシャーシ - Google Patents
モジュール化液体冷却式サーバーシャーシ Download PDFInfo
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- 239000007788 liquid Substances 0.000 claims description 186
- 238000001816 cooling Methods 0.000 claims description 121
- 239000000110 cooling liquid Substances 0.000 claims description 36
- 239000002826 coolant Substances 0.000 claims description 27
- 238000012545 processing Methods 0.000 claims description 20
- 238000012423 maintenance Methods 0.000 claims description 11
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 8
- 238000012544 monitoring process Methods 0.000 claims description 6
- 230000032258 transport Effects 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 3
- 239000000498 cooling water Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 15
- 238000009835 boiling Methods 0.000 description 4
- 238000013473 artificial intelligence Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000011149 active material Substances 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 150000002222 fluorine compounds Chemical group 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000012549 training Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20381—Thermal management, e.g. evaporation control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/12—Safety or protection arrangements; Arrangements for preventing malfunction for preventing overpressure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
箱体と、
ハウジングと、排気弁と、液戻し弁とを含む1つ又は複数の液体冷却モジュールと、
前記液体冷却モジュールを外部電源に接続するコネクタと、
排気管と、液戻し管と、蒸氣処理領域と、液体収集領域と、を含む循環部分と、を備え、
前記液体冷却モジュールが作動する時に、前記排気弁及び前記液戻し弁が開かれ、前記液体冷却モジュールは作動する時にシングルのサーバーが挿入されており、冷却液が充填され、
前記排気管が前記排気弁に接続され、前記液体冷却モジュールからのガスを前記蒸氣処理領域に輸送し、
前記液戻し管が前記液戻し弁に接続され、前記液体収集領域からの液体を前記液体冷却モジュールに輸送し、
前記蒸氣処理領域に前記蒸氣処理領域内のガスを冷却するためのコンデンサが設けられ、
前記液体収集領域が、前記蒸氣処理領域からの液体を収集するモジュール化液体冷却式サーバーシャーシを提供する。
前記コネクタに接続され、前記コネクタによって前記シャーシにおける他の部材に電力供給するための電源と、
前記シャーシにおける他の部材を制御するためのコントローラと、を含む電力供給及び制御システムを更に備える。
前記液体冷却モジュールにおける液面が第1閾値よりも高い場合、前記第1センサが第1信号を生成して前記コントローラに送信し、前記コントローラが前記第1信号を受信した後、前記液戻し弁を閉じるように制御し、
前記液体冷却モジュールにおける液面が第2閾値よりも低い場合、前記第1センサが第2信号を生成して前記コントローラに送信し、前記コントローラが前記第2信号を受信した後、前記液戻し弁を開くように制御する。
前記ガス圧力が第3閾値よりも大きい場合、前記第2センサが第3信号を生成して前記コントローラに送信し、前記コントローラが前記第3信号を受信した後、前記圧力リリーフ弁を開くように制御し、圧力リリーフを行う。
前記液体収集領域における冷却液の液面が第4閾値より低い場合、前記第3センサが第4信号を生成して前記コントローラに送信し、前記コントローラが前記第4信号を受信した後、アラーム信号を出し、液体を充填する必要があることを提示する。
前記第1冷却管と前記第2冷却管が前記コンデンサーに接続される。
110 箱体
120 液体冷却モジュール
121 ハウジング
122 排気弁
123 液戻し弁
130 コネクタ
141 排気管
142 液戻し管
143 蒸気処理領域
144 液体収集領域
1431 コンデンサー
200 モジュール化液体冷却式サーバーシャーシ
210 箱体
211 液体充填弁
220 液体冷却モジュール
221 ハウジング
222 排気弁
223 液戻し弁
224 メンテナンスエンドキャップ
230 コネクタ
241 排気管
242 液戻し管
243 蒸気処理領域
244 液体収集領域
245 第1冷却管
246 第2冷却管
250 電力供給と制御システム
251 電源
252 コントローラ
2431 コンデンサー
2432 圧力リリーフ弁
300 モジュール化液体冷却式サーバーシャーシ
310 箱体
311 液体充填弁
320 液体冷却モジュール
322 排気弁
323 液戻し弁
325 第1センサ
330 コネクタ
341 排気管
342 液戻し管
343 蒸気処理領域
344 液体収集領域
345 第1冷却管
346 第2冷却管
350 電力供給と制御システム
351 電源
352 コントローラ
3431 コンデンサー
3432 圧力リリーフ弁
3433 第2センサ
3441 第3センサ
G ガス領域
L 冷却液
S サーバー
Claims (15)
- モジュール化液体冷却式サーバーシャーシであって、
箱体と、
ハウジングと、排気弁と、液戻し弁とを含む1つ又は複数の液体冷却モジュールと、
前記液体冷却モジュールを外部電源に接続するコネクタと、
排気管と、液戻し管と、蒸氣処理領域と、液体収集領域とを含む循環部分と、を備え、
前記液体冷却モジュールが作動する時に、前記排気弁及び前記液戻し弁が開かれ、前記液体冷却モジュールは作動する時にシングルのサーバーが挿入されており、冷却液が充填され、
前記排気管が前記排気弁に接続され、前記液体冷却モジュールからのガスを前記蒸氣処理領域に輸送し、
前記液戻し管が前記液戻し弁に接続され、前記液体収集領域からの液体を前記液体冷却モジュールに輸送し、
前記蒸氣処理領域に前記蒸氣処理領域内のガスを冷却するコンデンサーが設けられ、
前記液体収集領域が、前記蒸氣処理領域からの液体を収集することを特徴とするモジュール化液体冷却式サーバーシャーシ。 - 前記シャーシは前記コネクタに接続され、前記コネクタによって前記シャーシにおける他の部材に電力を供給する電源と前記シャーシにおける他の部材を制御するコントローラとを含む電力供給及び制御システムを更に備えることを特徴とする請求項1に記載のサーバーシャーシ。
- 前記蒸氣処理領域は圧力リリーフ弁を更に備え、前記蒸氣処理領域におけるガスが該圧力リリーフ弁によって外部に排出されることが可能であることを特徴とする請求項2に記載のサーバーシャーシ。
- 前記圧力リリーフ弁は更に外部のエアバッグに接続され、該エアバッグは前記圧力リリーフ弁から排出されたガスを収集することを特徴とする請求項3に記載のサーバーシャーシ。
- 前記箱体は前記液体収集領域に接続される液体充填弁を更に備え、該液体充填弁によって前記液体収集領域に冷却液を加えることができることを特徴とする請求項1又は2に記載のサーバーシャーシ。
- 各液体冷却モジュールは前記コントローラに接続されて前記液体冷却モジュールにおける冷却液の液面をモニタする第1センサを更に備え、
前記液体冷却モジュールにおける液面が第1閾値よりも高い場合、前記第1センサが第1信号を生成して前記コントローラに送信し、前記コントローラが前記第1信号を受信した後、前記液戻し弁を閉じるように制御し、
前記液体冷却モジュールにおける液面が第2閾値よりも低い場合、前記第1センサが第2信号を生成して前記コントローラに送信し、前記コントローラが前記第2信号を受信した後、前記液戻し弁を開くように制御することを特徴とする請求項2に記載のサーバーシャーシ。 - 前記蒸氣処理領域は前記コントローラに接続されて前記蒸氣処理領域におけるガス圧力をモニタする第2センサを更に備え、
前記ガス圧力が第3閾値よりも大きい場合、前記第2センサが第3信号を生成して前記コントローラに送信し、前記コントローラが前記第3信号を受信した後、前記圧力リリーフ弁を開くように制御し、圧力リリーフを行うことを特徴とする請求項3に記載のサーバーシャーシ。 - 前記液体収集領域は、前記コントローラに接続されて前記液体収集領域における冷却液の液面をモニタする第3センサを更に備え、
前記液体収集領域における冷却液の液面が第4閾値より低い場合、前記第3センサが第4信号を生成して前記コントローラに送信し、前記コントローラが前記第4信号を受信した後、アラーム信号を出し、液体を充填する必要があることを提示することを特徴とする請求項2に記載のサーバーシャーシ。 - 各液体冷却モジュールは前記液体冷却モジュールが作動する時に閉じるメンテナンスエンドキャップを更に備えることを特徴とする請求項1に記載のサーバーシャーシ。
- 前記循環部分は前記コンデンサーにおける冷却剤を外部に輸送する第1冷却管と、外部の冷却剤を前記コンデンサーに輸送する第2冷却管とを更に備え、
前記第1冷却管と前記第2冷却管が前記コンデンサーに接続されることを特徴とする請求項1に記載のサーバーシャーシ。 - 前記第1冷却管と前記第2冷却管は外部の熱交換装置に接続されることを特徴とする請求項10に記載のサーバーシャーシ。
- 前記熱交換装置は乾式冷却器、冷却塔、又はビル冷水システムであることを特徴とする請求項11に記載のサーバーシャーシ。
- 前記冷却剤は冷却水であることを特徴とする請求項10に記載のサーバーシャーシ。
- 前記コネクタはクイックプラグイン装置であることを特徴とする請求項1に記載のサーバーシャーシ。
- 前記冷却液はフッ化物溶液であることを特徴とする請求項1に記載のサーバーシャーシ。
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CN201711193708.3 | 2017-11-24 | ||
CN201711193708.3A CN107979955B (zh) | 2017-11-24 | 2017-11-24 | 一种模块化液冷服务器机箱 |
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JP6650496B2 true JP6650496B2 (ja) | 2020-02-19 |
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US (1) | US11109516B2 (ja) |
EP (1) | EP3490357B1 (ja) |
JP (1) | JP6650496B2 (ja) |
KR (1) | KR102106037B1 (ja) |
CN (1) | CN107979955B (ja) |
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