JP6644845B2 - Particle removal tip and index type particle removal device using the same - Google Patents

Description

  The present invention relates to a particle removing tip and an index type particle removing device using the same.

  Semiconductor devices such as integrated circuits and memory cells are manufactured by performing semiconductor manufacturing processes such as patterning and etching on a series of wafers. On the other hand, elements mounted on the camera module are manufactured on a metal substrate. In the process of manufacturing a semiconductor device or an element from such a wafer or a substrate, when particles adhere to the device of the wafer or the element of the substrate, a defect occurs in the device or the element.

  Patent Literature 1 includes a press jig having an adhesive applied to a lower surface thereof and a transfer unit for moving the press jig up and down. The press jig is detachably coupled to the main body connected to the transfer unit and the main body, There is disclosed an apparatus for removing particles from a semiconductor chip, which comprises a pressure block having an adhesive applied to a lower surface. In the invention of Patent Document 1, the adhesive applied to the lower surface of the press jig removes particles attached to the chips of the wafer while the press jig moves up and down by the operation of the transfer unit. However, in the invention described in Patent Document 1, the particles are removed by the adhesive applied to the lower surface of the press jig. Therefore, it is easy to remove the particles of the chip located on the same large area. If the plane is not uniform, there is a disadvantage that it is not easy to remove the particles attached to the chip, and if the particles sufficiently adhere to the adhesive applied to the lower surface of the press jig, the pressure block is cut. The new pressure block to which the adhesive is applied is attached to the cut body to be used after being separated from the cut body, resulting in loss of parts.

Republic of Korea Registered Patent Publication No. 10-1270026

SUMMARY OF THE INVENTION The present invention has been made to improve the above-described drawbacks, and an object of the present invention is to not only efficiently remove particles adhering to an element (chip), but also minimize component loss. An object of the present invention is to provide a particle removing tip and an index type particle removing apparatus using the same.
It is another object of the present invention to provide a particle removing tip having a simple configuration and improving work efficiency, and an index type particle removing apparatus using the same.

  In order to achieve the above object, an index type particle removing apparatus according to the present invention includes a tray transfer unit for transferring an element tray on which a number of elements are arranged to a work position, and a tip tray on which a number of particle removal tips are arranged. A tray mounting table on which is placed, an adhesive liquid supply unit for applying the adhesive liquid, an index member which is provided with a number of mounting holes at regular intervals in a circular shape on a frame, and rotates around a central axis, and a tray Pick up and rotate the particle removal tip of the tip tray placed on the mounting table, apply the adhesive liquid to the particle removal tip from the adhesive liquid supply unit, and rotate it to settle in the seating hole of the index member Pick a particle removal tip seated in the seat of the flip unit or index member An index drive unit that rotates the index member so that the adhesive liquid of the particle removing tip is cured while moving to the tip position, an adhesive gel removing member from which the adhesive gel in which the adhesive liquid of the particle removing tip is cured is removed, The particle removal tip of the index member is picked up at the pickup position and moved, and the adhesive gel of the particle removal tip is used to remove the particles attached to the elements of the element tray located at the working position, and the particle removal tip of the particle removal tip is used. Is removed by an adhesive gel removing unit, and a particle removing tip from which the adhesive gel has been removed is seated in a seating hole of an index member.

  Further, a particle removing tip of the present invention made to achieve the above object includes a tip body, a solution contact cap coupled to one end of the tip body and to which an adhesive liquid is to be attached, and a tip body. A body part having a set length and a cross-sectional area, a round bar part having a cross-sectional area smaller than the cross-sectional area of the body, being formed to be extended on one side of the body part, and the other of the body part A step connecting portion extending on the side surface, the solution contact cap has a round rod-shaped barrel portion having a set length, and a conical extension formed at one end of the barrel portion, The tip body includes a tip portion having a shape having a cut end portion and an end surface, and a coupling hole formed at a depth set at the other end surface of the barrel portion and into which a step coupling portion is inserted. Including, solution contact Cap is characterized in that it comprises a silicon material.

1 is a plan view illustrating an embodiment of an index type particle removing apparatus according to the present invention. It is a top view showing the tip tray applied to one embodiment of the index type particle removal device concerning the present invention. It is a front view showing one example of a particle removal tip concerning the present invention. 1 is a front view showing a state in which a particle removing tip according to an embodiment of the present invention is seated on a tip tray. FIG. 2 is a front view showing a part of an adhesive gel supply unit and a flip unit which constitute one embodiment of the index type particle removing apparatus according to the present invention. It is a top view which shows the index member which comprises one Example of the index type particle removal apparatus which concerns on this invention. It is a front view showing a swing arm unit which constitutes one example of an index type particle removal device concerning the present invention.

Hereinafter, an embodiment of a particle removing tip and an index type particle removing apparatus using the same according to the present invention will be described with reference to the accompanying drawings.
FIG. 1 is a plan view showing one embodiment of the index type particle removing apparatus according to the present invention.
As shown in FIG. 1, the index type particle removing apparatus using the particle removing tip according to the present invention includes a tray transfer unit 100, a tray mounting base 200, an adhesive liquid supply unit 300, an index member 400, a flip unit 500, an index. A driving unit 600, an adhesive gel removing member 700, and a swing arm unit 800 are included.

  The tray transfer unit 100 transfers an element tray 10 on which a number of elements are arranged to a work position P. As an example of the element tray 10, the element tray 10 has a rectangular plate shape having a uniform thickness, and has a large number of pockets 11 formed in a square matrix on an upper surface, and elements are arranged in the pockets 11 of the element tray 10. As an example of the tray transfer unit 100, the tray transfer unit 100 includes a guide rail 110, a vertical guide member 120 that moves in a horizontal direction along the guide rail 110, a first drive unit 130 that moves the vertical guide member 120, It includes a tray suction unit 140 that moves in the vertical direction (vertical direction of the guide rail) along the vertical guide member 120 and suctions the element tray 10. The vertical guide member 120 moves in the horizontal direction along the guide rail 110, and the tray suction unit 140 moves in the X and Y axis directions while the tray suction unit 140 moves in the vertical direction along the vertical guide member 120. One of the tray transfer units 100 is provided with a tray supply unit 150 that supplies the element tray 10 to the tray transfer unit 100.

The number of the tray transfer units 100 and the number of the tray supply units 150 are preferably two each. The two tray transfer units 100 may be located side by side with an interval therebetween. When there are two tray transfer units 100 and two tray supply units 150, the element trays 10 are alternately located at the work position P, so that work efficiency can be improved.
On one side of the work position P, a tray collection unit 900 for collecting the element tray 10 of the tray transfer unit 100 located at the work position P is provided.
The tray mounting table 200 has a tip tray 20 on which a number of particle removal tips T are arranged. As an example of the tip tray 20, as shown in FIG. 2, the tip tray 20 has a large number of pockets 21 formed in a square matrix on the upper surface in a square plate shape having a uniform thickness.

  As an example of the particle removing tip, as shown in FIG. 3, the particle removing tip T includes a tip body 30 and a solution contact cap 40 that is coupled to one end of the tip body 30 and to which the adhesive liquid is to be attached. Including. The tip body 30 has a body portion 31 having a set length and a cross-sectional area, and a round bar-shaped round bar extending from one side surface of the body portion 31 and having a cross-sectional area smaller than the cross-sectional area of the body portion 31. A portion 32 and a step connection portion 33 extended and formed on the other side surface of the body portion 31 are included. It is preferable that the body 31 is formed in a round rod shape having a circular cross section. The end of the round bar 32 is preferably chamfered. The step connection portion 33 is provided with cut grooves 34 that are decut on both sides in a round bar shape having an outer diameter smaller than the outer diameter of the round bar portion 32.

The solution contact cap 40 has a round bar-shaped barrel portion 41 having a set length, and a conical extension formed at one end of the barrel portion 41, and an end surface 42 from which the tip of the cone is cut. It has a tip portion 43 having the same shape and a coupling hole 44 formed at a predetermined depth inside the barrel portion 41 and into which the step coupling portion 33 is inserted. The outer diameter of the barrel 41 is smaller than the outer diameter of the body 31 of the tip body 30. The adhesive liquid is put on the end surface 42 of the tip portion of the solution contact cap 40.
The tip body 30 preferably includes a stainless steel material, and the solution contact cap 40 preferably includes a silicon material.

  The outer diameter of the barrel 41 of the solution contact cap 40 is smaller than the inner diameter of the pocket 21 of the tip tray 20, and the outer diameter of the body 31 of the tip body 30 is larger than the inner diameter of the pocket of the tip tray 20. A particle removal tip T is arranged in a pocket 21 of the tip tray 20. As shown in FIG. 4, when the particle removing tip T is placed in the pocket 21 of the tip tray 20, the solution contact cap 40 is inserted into the pocket 21, and the solution contact cap 40 moves downward and the tip body 30 moves upward. It is arranged to face.

  The adhesive liquid supply unit 300 applies the adhesive liquid to the particle removal tip T. As an example of the adhesive liquid supply unit 300, as shown in FIG. 5, the adhesive liquid supply unit 300 includes a head unit 310, a syringe 320 mounted on the head unit 310 and filled with an adhesive liquid, and the syringe 320. A nozzle 330 is provided at an end of the nozzle 320 and is coated with an adhesive liquid. The head unit 310 can be located above the tray mounting base 200.

  The index member 400 is provided with a large number of seating holes H at predetermined intervals in a circular shape on a frame, and rotates around a central axis. The index member 400 is preferably located beside the tray mounting base 200. As an example of the index member 400, as shown in FIG. 5, the index member 400 includes a disk portion 410 having a uniform thickness, and a number of seating holes H provided on the frame side of the disk portion 410. The connecting portion 420 is provided near the center of one surface of the disk portion 410. The seating hole H is formed so as to penetrate the disk portion 410, and the inner diameter of the seating hole H is larger than the outer diameter of the barrel portion 41 of the solution contact cap 40 of the particle removal tip T, and Is smaller than the outer diameter of the torso portion 31.

The flip unit 500 picks up and rotates the particle removing tip T of the tip tray 20 placed on the tray mounting base 200, and rotates after the adhesive liquid is applied to the particle removing tip T from the adhesive liquid supply unit 300. To settle in the seating hole H of the index member 400. The flip unit 500 is preferably located so as to be movable between the syringe 320 of the adhesive liquid supply unit 300 and the tip tray 20.
The flip unit 500 picks up the particle removing tip T, rotates the particle removing tip T by 180 degrees, the adhesive liquid is attached to the end surface 42 of the solution contact cap of the particle removing tip T, and then rotates the particle removing tip T by 180 degrees. It is seated in the seating hole H of the index member 400.

  As an example of the flip unit 500, as shown in FIG. 5, the flip unit 500 includes a flip head 510 that moves in a horizontal direction and a vertical direction, and is rotatably coupled to one side of the flip head 510, and has a suction portion at an end. A flip bar 520 provided with 521 and a bar rotation unit 530 for rotating the flip bar 520 are provided. With the flip bar 520 positioned vertically so that the suction portion 521 of the flip bar is positioned below, the flip head 510 moves the flip bar 520 to the upper side of the tip tray 20, and then lowers the flip bar 520. Then, the suction unit 521 suctions the round bar 32 of the tip body 30 of the particle removal tip T arranged on the tip tray 20, and then the bar rotation unit 530 rotates the flip bar 520 by 180 degrees to thereby remove the particle removal tip T. Is rotated 180 degrees to position the solution contact cap 40 of the particle removal tip T on the upper side.

  Subsequently, the adhesive liquid is attached from the syringe 320 of the adhesive liquid supply unit 300 to the end surface 42 of the tip portion of the solution contact cap 40 of the particle removing tip T, and the bar rotation unit 530 rotates the flip bar 520 by 180 degrees to thereby remove the particles. By rotating the removal tip T by 180 degrees, the adhesive liquid that has been put on the solution contact cap 40 of the particle removal tip T is positioned on the lower side, and subsequently, the flip head 510 moves and the particle removal tip on which the adhesive liquid has been placed. T is seated in the seating hole H of the index member 400.

  FIG. 6 is a plan view showing an index member constituting an embodiment of the index type particle removing apparatus according to the present invention. As shown in FIG. 6, the index driving unit 600 is connected to the center of the lower surface of the index member 400, and rotates the index member 400. The index drive unit 600 rotates the index member 400 to move the particle removing tip T seated in the seating hole H of the index member 400 to the pickup position, and the particle removing tip T moves to the pickup position. During this, the adhesive liquid of the particle removal tip T is cured.

  The adhesive gel removing member 700 removes the adhesive gel in which the adhesive liquid of the particle removal tip T is hardened. The adhesive gel removing member 700 is preferably located beside the index member 400. As an example of the adhesive gel removing member 700, the adhesive gel removing member 700 includes a block having a flat upper surface and an adhesive layer provided on the upper surface of the block. The adhesive layer may be provided with a tape on which the adhesive layer is formed on the upper surface of the block, or the adhesive layer may be formed as a layer on the upper surface of the block.

  The swing arm unit 800 picks up and moves the particle removal tip T located at the pickup position of the index member 400 and adheres to the element of the element tray 10 placed on the tray transfer unit 100 with the adhesive gel of the particle removal tip T. The adhesive gel from which the particles have been removed and the particles of the particle removing tip T have been removed is removed by the adhesive gel removing member 700, and the particle removing tip T from which the adhesive gel has been removed is seated in the seating hole H of the index member 400. . The swing arm unit 800 includes a support frame F that traverses the tray transfer unit 100, and is preferably installed on the support frame F. The support frame F includes two vertical members that are spaced apart from each other, and a connecting member that connects upper ends of the vertical members to each other.

  As an example of the swing arm unit 800, as shown in FIG. 7, the swing arm unit 800 includes a main body 810 that moves up and down, a swing arm 820 that is rotatably coupled to the main body 810, and a swing arm 820. A swing arm drive unit 830 for reciprocally rotating the swing arm in the horizontal direction, and a tip suction unit 840 provided at an end of the swing arm 820 to apply a suction force. While the swing arm 820 rotates (angularly rotates) with one end of the swing arm 820 as a reference axis by the operation of the swing arm drive unit 830, the index member is provided by the tip suction unit 840 provided at the other end of the swing arm 820. The particle removal tip T located at 400 is sucked, or the particle removal tip T sucked by the tip suction unit 840 is settled on the index member 400.

Hereinafter, the operation and effects of the particle removing tip according to the present invention and the index type particle removing device using the same will be described.
First, the tip tray 20 on which the particle removal tips T are arranged is placed on the tray mounting base 200, and the element tray 10 on which the elements are arranged is sucked by the tray suction unit 140 of the tray transfer unit 100. Inspection of 10 elements is performed, and information on the elements to which particles are attached is input. Then, the tray suction unit 140 of the tray transfer unit 100 is transferred to the work position P, and the element tray 10 is located at the work position P.

  In such a state, the flip bar 520 of the flip unit 500 picks up and rotates the particle removal tip T placed on the tip tray 20. The adhesive liquid filled in the syringe 320 of the adhesive liquid supply unit 300 is applied to the solution contact cap 40 of the particle removal tip T, and subsequently, the flip bar 520 of the flip unit 500 rotates and moves, and the adhesive liquid is subjected to dotting. The particle removal tip T is inserted into the seating hole H of the index member 400. At this time, the particle removing tip T is inserted and settled in the seating hole H in a state where the solution contact cap 40 of the particle removing tip T is positioned below.

  When the particle removing tip T is seated in the seating hole H of the index member 400, the index driving unit 600 rotates the index member 400 at a set angle. At the same time, the flip unit 500 moves to pick up another particle removal tip T arranged on the tip tray 20, and the adhesive liquid is applied from the adhesive liquid supply unit 300 by the above operation, and the index member 400 is settled. Settle in Hall H. When the particle removing tip T in which the adhesive liquid has been set in the mounting hole H of the index member 400 is settled, the index driving unit 600 rotates the index member 400 at a set angle. Such an operation is repeated, and the adhesive liquid is put on the particle removing tips T arranged on the tip tray 20 to be seated in the seating holes H of the index member 400.

  When the particle removing tip T settled in the seating hole H is located at the pickup position while repeating the angular rotation of the index member 400 at the set angle, the particle removing tip T is moved while moving to the pickup position. The adhesive liquid that has been set is semi-cured. The swing arm 820 of the swing arm unit 800 picks up and rotates the particle removal tip T located at the pickup position, and is located at the element to which particles are attached among the elements arranged on the tip tray 20 of the tray mounting base 200, The particles attached to the element are attached to an adhesive gel to remove the particles of the element. Subsequently, the swing arm 820 rotates to position the particle removing tip T on the adhesive gel removing member 700, and the adhesive gel to which the particles of the particle removing tip T adhere is removed by the adhesive gel removing member 700. At this time, the adhesive gel of the particle removing tip T is adhered to the adhesive gel removing member 700, so that the adhesive gel to which the particles are attached is separated and removed from the particle removing tip T.

  Subsequently, the swing arm 820 is rotated to check whether or not the adhesive gel remains on the particle removing tip T through the vision, and is inserted into the seating hole H of the index member 400 to be seated. Then, the index member 400 is rotated at the set angle so that another particle removing tip T is located at the pickup position, and the swing arm 820 picks up the other particle removing tip T located at the position of the pickup. Then, the particles of the elements to which the particles adhere are removed from the elements arranged in the element tray 10 by the above operation.

  Such an operation is repeated, and the swing arm 820 of the swing arm unit 800 picks up the particle removal tip T settled at the pickup position of the index member 400 and removes the particles of the elements arranged in the element tray 10. . On the other hand, the particle removal tip T settled on the index member 400 and from which the adhesive gel has been removed is set in the seating hole H of the tip tray 20 picked up by the flip unit 500 and settled on the tray mounting base 200. At this time, it is settled so that the solution contact cap 40 of the particle removing tip T is positioned below.

  Since the particle removing tip T of the present invention includes the tip body 30 including a stainless steel material and the silicon material solution contact cap 40 coupled to one end of the tip body 30, the adhesive liquid is applied to the solution contact cap 40. In a state where the adhesive liquid is semi-cured while being well adhered, the adhesive gel which is semi-cured on the solution contact cap 40 when the adhesive liquid is removed from the solution contact cap 40 is removed so as not to remain. This makes it possible to adhere the adhesive liquid to the particle removal tip T, cure and remove the particles, and then attach the adhesive liquid again to the particle removal tip T for repeated use.

  As described above, according to the present invention, the adhesive liquid is adhered to the particle removing tip T, the adhesive liquid is cured (dried) to gel, and the adhesive gel attached to the particle removing tip T is brought into contact with the element to adhere to the element. After removing the adhered particles and removing the adhesive gel to which the particles have adhered from the particle removal tip T, an adhesive liquid is attached to the particle removal tip T and cured, and the adhesive gel of the particle removal tip T is attached to the element. The particles attached to the element are removed while repeating the removal of particles. Thus, the operation of quickly and accurately removing the particles attached to the element and removing the particles attached to the element is efficiently performed. Also, since only the adhesive gel attached to the particle removing tip T is removed, the adhesive liquid is often attached to the particle removing tip T of the present invention, and after the adhesive liquid is cured, while maintaining the adhesiveness in a gel state, Since the particle removal tip T is cleanly and well removed, the particle removal tip T can be continuously used, and the loss of components can be minimized.

  Further, the present invention includes the tray transfer unit 100, the tray mounting base 200, the adhesive liquid supply unit 300, the index member 400, the flip unit 500, the index drive unit 600, the adhesive gel removing member 700, and the swing arm unit 800. Therefore, the configuration is simple, and the particle removing tip T in which the adhesive liquid is put on the seating hole H of the index member 400 at the seating position at the seating position continuously while rotating the index member 400 repeatedly at the set angle is continuously used. Since the particle removing tips T which are settled and settled in the respective mounting holes H of the index member 400 are sequentially picked up at the pickup position, the adhesive liquid which is put on the particle removing tip T while the index member 400 rotates. Is cured It is possible to enhance the work efficiency.

10: element tray 11: pocket (of element tray) 20: tip tray
21: Pocket (of tip tray) 30: Tip body 31: Body part 32: Round bar part 33: Step connection part 34: Cut groove 40: Solution contact cap 41: Body cylinder part 42: End face 43: Tip part 44: Connection Hall 100: tray transfer unit 110: guide rail 120: vertical guide member 130: first drive unit
140: Tray suction unit 150: Tray supply unit 200: Tray seating table 300: Adhesive liquid supply unit 310: Head unit 320: Syringe 330: Nozzle 400: Index member 410: Disk part 420: Connecting part 500: Flip unit 510 : Flip head 520: Flip bar 521: Suction unit 530: Bar rotation unit 600: Index drive unit 700: Adhesive gel removing member 800: Swing arm unit 810: Main body (of swing arm unit) 820: Swing arm 830: Swing arm drive Unit 840: Tip suction unit 900: Tray collection unit F: Support frame H: Security hole P: Working position T: Particle removal tip

Claims (6)

A tray transfer unit for transferring an element tray in which a number of elements are arranged to a work position,
A tray mount on which a tip tray on which a number of particle removal tips are arranged is placed,
Adhesive liquid supply unit for applying adhesive liquid,
An index member that is provided with a number of seating holes at regular intervals in a circular shape on a frame and rotates around a central axis,
Said placed on the tray seated stand is rotated to pick up the particle removal tip tip tray, after which the adhesive liquid from the adhesive liquid supply unit to the particle removal tip is applied, the index member is rotated flip unit for seated on the seating hole,
Index drive unit for rotating the index member so that the while the particle removal tip which is seated on the seating hole of the index member is moved to the pick-up position, the adhesive liquid in the particle removal tip is hardened,
Adhesive gel removal member adhesive gel the adhesive solution of the particle removal tip is cured is removed,
The index the particle removal tip of the member moves to pick up by the pick-up position, and the particles removed adhere to elements of the device tray positioned in the working position by the adhesive gel of the particle removal tip, the particle removal an adhesive gel to remove the particles of tips, the removed with adhesive gel removal member, that the particle removal tip of the adhesive gel has been removed including the swing arm unit, to be seated on the seating hole of said index member An index-type particle removing apparatus characterized by the following. Wherein on one side of the working position, the index-type particle removing apparatus according to claim 1, characterized in that the tray recovery unit is provided for collecting the device tray of the tray transfer unit located at the working position. The flip unit picks up the particle removing tip, the adhesive liquid to one end of the particle removal tip is rotated 180 degrees is dotting, followed by rotating 180 degrees the particle removing tip, the index index type particle removing apparatus according to claim 1, characterized in that seated on the seating hole of the member.   The index-type particle removing apparatus according to claim 1, wherein the adhesive gel removing member includes a block having a flat upper surface and an adhesive layer provided on an upper surface of the block.   The swing arm unit includes a main body that moves up and down, a swing arm that is rotatably coupled to the main body in a horizontal direction, a swing arm drive unit that horizontally reciprocates the swing arm, and one of the swing arms. The index type particle removing apparatus according to claim 1, further comprising: a tip suction unit provided at an end portion for suctioning the particle removal tip. Tip body,
A solution contact cap coupled to one end of the tip body and to which an adhesive liquid is to be attached,
The tip body has a body portion having a set length and a cross-sectional area, and a round bar portion extending from one side surface of the body portion and having a cross-sectional area smaller than the cross-sectional area of the body portion, A step coupling portion extending from the other side surface of the body portion,
The solution contact cap has a round bar-shaped barrel portion having a set length, and is formed in a conical shape at one end of the barrel portion, and the tip of the cone is cut to have an end surface. A tip portion and a coupling hole formed at a depth set on the other end surface of the barrel portion and including the step coupling portion,
2. The particle removing tip according to claim 1, wherein the tip body includes a stainless material, and the solution contact cap includes a silicon material.

Images