JP3767283B2 - Method and apparatus for peeling parts from adhesive plate - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for peeling a chip-type electronic component such as a ceramic oscillator, a ceramic filter, and a chip capacitor from an adhesive plate, and an apparatus for removing the same.
[0002]
[Prior art]
In the process of manufacturing chip-type electronic components such as ceramic oscillators and ceramic filters, an elastic adhesive material such as silicon rubber is usually pasted on a plate made of a metal plate such as SUS and the like. Each process is moved by aligning the parts with weak adhesion. When the predetermined process is completed, these components are peeled off from the adhesive layer by a jig and delivered to the next process. For example, when the next process is an inspection process, the parts peeled off from the adhesive layer are moved to the parts feeder, aligned in a certain direction, and moved to the inspection machine via the linear feeder.
[0003]
Conventionally, in the above-described process, in order to peel off the component adhered to the adhesive layer, each component has been manually peeled off using a squeegee as shown in FIG. In the figure, 1 is a plate made of SUS, 2 is an adhesive layer made of silicon rubber, 3 is a component, and 4 is a squeegee. As shown in the figure, when the tip of the squeegee 4 is pressed against the adhesive layer 2 and moved in the direction of the arrow in the figure, the weakly bonded part 3 is peeled off from the adhesive layer 2 and falls downward. become.
[0004]
[Problems to be solved by the invention]
However, in the above method, since the operation of the squeegee 4 itself is manual, the workability is poor, and the parts 3 that have dropped down are scattered, so this can be used for the next step, for example, a parts feeder. The setting must be manual, and the directionality varies, so realignment is required, and the workability as a whole is extremely poor. Further, since the component 3 falls downward, there is a problem that the component 3 is damaged or becomes defective due to an impact at the time of dropping.
[0005]
An object of the present invention is to provide a component peeling method and apparatus capable of automatically peeling a component from an adhesive layer.
[0006]
[Means for Solving the Problems]
The present invention has the following configuration in order to solve the above problems.
[0007]
(1) With a plurality of parts aligned and bonded to each other on the elastic adhesive layer affixed on the plate, the adhesive layer in the vicinity of the plurality of parts is pushed at once with a pusher. A series of operations are performed in units of a plurality of parts arranged in a row, which are pushed in, and each part is sucked and peeled at once by a suction nozzle from above.
[0008]
In the present invention, the parts are not dropped by using a squeegee as shown in FIG. 6, but attention is paid to the fact that each part is adhered to the adhesive layer in a weakly adhered state. By weakening, each component is sucked from above by the suction nozzle. Here, it is a condition that the suction force by the suction nozzle is larger than the adhesive force relaxed by pushing with the pusher.
[0009]
In this way, each part can be peeled from the adhesive layer without using a squeegee by peeling the part from the adhesive layer with an adsorption force that exceeds the adhesive force that is relaxed by pushing the adhesive layer with a pusher such as a pin. it can. In this case, since the part is sucked to the tip of the suction nozzle, the part peeling can be automated, and the part can be accurately moved to an arbitrary position by moving the suction nozzle. Can be shortened, and since there is no drop of parts, it is possible to eliminate damage and failure due to impact.
Further, by performing the above operation in units of one row of components, these components can be peeled from the adhesive layer at one time while maintaining the alignment state of the components. As a result, the alignment state can be maintained and passed to the next process.
[0010]
(2) With a plurality of parts aligned and bonded to each other on the elastic adhesive layer affixed on the plate, force is applied with a pusher at the same time in the lateral direction of the parts. Then, the pusher is rotated, and further, each part is picked up at once by a suction nozzle and peeled off from above , and a series of operations are performed in units of a plurality of parts arranged in a row .
[0011]
In the above method (1), relaxation of the adhesive force caused by pushing the pusher is used. However, in the present invention, by moving the pusher in the lateral direction, the shearing stress in the lateral direction is applied to the bonded portion between the component and the adhesive layer. The component is easily peeled off from the pressure-sensitive adhesive layer, and then the momentary force is generated by rotating the pusher to relieve the adhesive force between the component and the pressure-sensitive adhesive layer. In this state, when the component is sucked from above by the suction nozzle, the adhesive force is relaxed, and therefore the component is sucked by the suction nozzle.
Further, by performing the above operation in units of one row of components, these components can be peeled from the adhesive layer at one time while maintaining the alignment state of the components. As a result, the alignment state can be maintained and passed to the next process.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 shows a schematic configuration diagram of a component peeling apparatus according to an embodiment of the present invention.
[0015]
A tray 4 to which a large number of components are bonded is disposed below the component peeling device.
[0016]
As shown in FIG. 6, the tray 4 has an adhesive layer 2 made of silicon rubber uniformly attached on a plate 1 made of SUS, and the components 3 are adhered to the tray 4 at regular intervals. Unlike the conventional method of FIG. 6, in the apparatus shown in FIG. 1, the tray 4 is arranged upward and the part 3 and the apparatus are arranged to face each other.
[0017]
In the component peeling apparatus, the movable body 10 can move in the X-axis frame 11 in the lateral direction (the direction of arrow A or B in the figure), and the position control of the movable body 10 in the X direction can be performed by the control unit 12 outside the figure. Done.
[0018]
The moving body 10 includes cylinder bases 13 and 14, and cylinders 15 and 16 are attached to the cylinder bases 13 and 14, respectively, and can be driven in the vertical direction. The cylinder 15 is L-shaped, and a suction chuck 17 is attached to the tip thereof. A pusher 18 is attached to the tip of the cylinder 16. Each of the suction chuck 17 and the pusher 18 has a substantially flat plate shape extending in a direction perpendicular to the paper surface, and the width thereof is substantially equal to the width in the direction perpendicular to the paper surface of the tray 4.
[0019]
In said structure, each component on the tray 4 is peeled off from the adhesion layer 2 by repeating the following process (1)-(5).
[0020]
(1) The position of the moving body 10 is controlled by the control unit 12 so that the suction chuck 17 is positioned on the upper surface of the component 3 positioned on the rightmost side of the tray 4. Note that the positional relationship between the tray 4 and the apparatus is determined by the alignment means (not shown) in the direction perpendicular to the X-axis frame 11 (Z direction) and the direction perpendicular to the paper surface (Y direction). 12 aligns the moving body 10 only in the X direction.
[0021]
(2) The suction chuck 17 is lowered by the cylinder 15 and its tip is brought into contact with the upper surface of the component 3. FIG. 2A shows the state at this time. Note that the mounting position of the pusher 18 is determined so that the distance between the component 3 and the pusher 18 is about 0.1 to 0.5 mm.
[0022]
(3) Subsequently, the pusher 18 is lowered and the adhesive layer 2 is pushed in at the tip. At the same time, the suction chuck 17 is evacuated by a device not shown in the drawing, and the component 3 is sucked. At this time, since the pressure-sensitive adhesive layer 2 is pushed in by the pusher 18, the pressure-sensitive adhesive layer 2 on the side of the component 3 becomes concave, and the adhesion start surface of the component 3 is peeled off. Thereby, since the adhesive force which adhere | attaches the components 3 is relieve | moderated, the suction force by the suction chuck 17 comes to exceed the said adhesive force. FIG. 2B shows this state.
[0023]
(4) Subsequently, the suction chuck 17 is raised by the cylinder 15 while the pusher 18 is pushed in. Since the suction force by the suction chuck 17 at this time exceeds the relaxed adhesive force, the component 3 is raised in the suction state by the lift of the suction chuck 17. FIG. 2C shows the state at this time.
[0024]
(5) Next, the pusher 18 is raised. FIG. 2D shows the state at this time.
[0025]
The above steps (1) to (5) are performed for each column in the X direction as one operation of the apparatus. Since a plurality of components 3 are arranged in the column direction, all the components in the column direction can be peeled from the adhesive layer 2 at a time by performing the above-described one operation. After the step (5) is completed, the moving body 10 moves to the predetermined position in the X direction, the suction chuck 17 that sucks the component 3 is lowered, and each component is placed at the predetermined position. . At this time, since the positional relationship in the row direction of each component 3 holds the positional relationship that has been arranged on the tray 4, it is not necessary to perform alignment again .
[0026]
In addition, since the adhesive force of the component 3 when the pusher 18 is pushed in varies depending on the position of the pusher 18 in the X direction with respect to the suction chuck 17, the attachment position of the pusher 18 in the X direction can be finely adjusted. Thus, it is possible to set an optimal position of the pusher 18 that does not fail to remove parts.
[0027]
FIG. 3 is an enlarged perspective view showing the state shown in FIG. In the region indicated by P in the figure, peeling occurs between the bottom surface of the component 3 and the adhesive layer 2, thereby relaxing the adhesive force of the component 3.
[0028]
FIG. 4 shows a component peeling apparatus according to another embodiment of the present invention.
[0029]
In this apparatus, a force is applied by a pusher in the lateral direction of the component, and then the pusher is rotated to apply a moment, and further, the component is adsorbed and removed from above by an adsorption nozzle.
[0030]
Three cylinders 23 to 25 are attached to the moving body 10 whose movement is controlled by the control unit 12 in the A or B direction on the X-axis frame 11. These cylinders 23 to 25 are attached to the cylinder bases 20 to 22, respectively.
[0031]
The cylinder 23 is L-shaped, and a suction chuck 26 is provided at the tip thereof. A rotating plate 27 is rotatably attached to the tip of the cylinder 24, and a pusher 28 is integrally provided at the tip of the rotating plate 27. The tip of the cylinder 25 is in contact with the free end of the rotating plate 27.
[0032]
With the above configuration, the suction chuck 26 is raised or lowered by the vertical movement of the cylinder 23, and the pusher 28 is raised or lowered by the vertical movement of the cylinder 24. Further, the rotary plate 27 is rotated by the vertical movement of the cylinder 25, whereby the pusher 28 is rotated.
[0033]
The above apparatus repeats the following steps (1) to (4) as a set of operations. (1) The moving body 10 is moved to an appropriate position in the X direction by the control unit 12. As in the embodiment shown in FIG. 1, the tray 4 is aligned with the apparatus in the Z direction and the Y direction perpendicular to the paper surface.
[0034]
(2) The pusher 28 is lowered by the cylinder 24 and its tip is made to face the side surface of the component 3. FIG. 5A shows the state at this time.
[0035]
(3) The moving body 10 is moved in the B direction of the X-axis frame 11 by the control unit 12, and the side surface of the component 3 is pressed by the tip of the pusher 28. As a result, a transverse shear stress is generated at the contact surface of the component 3 with the adhesive layer 2.
[0036]
(4) The suction chuck 26 is lowered by the cylinder 23, and its tip abuts against the upper surface of the component 3. As a result, the component 3 is sucked by the suction chuck 26. FIG. 5C shows a state immediately before the suction state is reached.
[0037]
(5) The pusher 28 is rotated clockwise by several to ten and several degrees by the cylinder 25. Thereby, a bending moment force acts on the component 3, and the adhesive force of the component 3 to the adhesive layer 2 is relaxed. When the suction force of the suction chuck 26 exceeds the relaxed adhesive force, the component 3 is peeled from the adhesive layer 2. FIG. 5D shows the state at this time.
[0038]
Thereafter, the suction chuck 26 is raised (at this time, the component 3 is also sucked and raised), and the pusher 28 is returned to its initial state (by raising the cylinder 25, the pusher 28 is counteracted by a spring not shown). The rotation is clockwise and the cylinder 24 is raised), and one operation is completed. As in the embodiment shown in FIG. 1, the suction chuck 26 and the pusher 28 have substantially the same width as the tray 4, and therefore, the above-described one operation allows the peeling operation to be performed on all the parts in a row at a time. Done. When the stripping operation for one row of components is completed, the moving body 10 is moved to the position of the next row of components, and the above-described one operation is repeated again. In addition, about 0.5-1 mm is suitable for the distance which the pusher 28 moves to a B direction at the process of said (3). If it is higher than this, the component 3 may be peeled off before being sucked by the suction chuck 26 and moved in the left direction (B direction). In order to prevent this, the suction chuck 26 may first be lowered to suck the component 3 and the pusher 28 may be moved to the left in this state.
[0039]
【The invention's effect】
According to the present invention, parts can be automatically peeled off from the adhesive layer, so that manual work as in the prior art is not required. Further, since it is possible to move and release the peeled component to a predetermined position while being sucked by the suction nozzle, it is possible to automate all operations up to the next step. Further, since the parts do not fall as in the conventional case, even parts that are vulnerable to impact can be handled without being damaged or defective. Furthermore, since it can process as a unit of parts of a row, it can take to the next process, without destroying the alignment state between parts. As a result, both process time reduction and cost reduction can be realized.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of a component peeling apparatus according to a first embodiment of the present invention. FIG. 2 is a diagram showing an operation of the apparatus. FIG. 3 is a perspective view during the operation of the apparatus. FIG. 5 is a diagram showing the operation of the apparatus according to the second embodiment. FIG. 6 is a diagram showing a conventional part peeling method.
1-plate 2-adhesive layer 3-component 4-tray 17-suction chuck 18-pusher

Claims (4)

In a state where a plurality of parts are aligned and bonded to each other on the elastic adhesive layer attached on the plate,
Push the adhesive layer in the vicinity of a plurality of components at a time in the pusher, peeled adsorbed once each component by the suction nozzle further from above, a series of operations in units of a plurality of parts arranged in a row, sticky How to remove parts from the plate. In a state where a plurality of parts are aligned and bonded to each other on the elastic adhesive layer attached on the plate,
The force with pusher added in one portion to the transverse direction of the plurality of parts, then rotates the pusher, further peeled adsorbed once each component by the suction nozzle from above, a plurality of aligned series of operations in a row performing component units, component peeled method from sticky plate. In an apparatus that peels off each component in a state where a plurality of components are aligned and adhered to each other on an elastic adhesive layer that is adhered on the plate,
A pusher that pushes the adhesive layer in the vicinity of a plurality of parts at a time, and a suction nozzle that picks up and peels off each part that has been lowered in adhesive force by being pushed from above.
An apparatus for peeling parts from an adhesive plate , wherein the pusher and the suction nozzle have a width capable of being processed at a time with a plurality of parts arranged in a row as a unit. In an apparatus that peels off each component in a state where a plurality of components are aligned and adhered to each other on an elastic adhesive layer that is adhered on the plate,
A pusher that applies a force in the lateral direction of a plurality of parts at a time and then rotates, and a suction nozzle that sucks and peels off each part that is going to be turned up by turning at once from above,
An apparatus for peeling parts from an adhesive plate , wherein the pusher and the suction nozzle have a width capable of being processed at a time with a plurality of parts arranged in a row as a unit.

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