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JP6539917B2 - 熱伝導性接着シート、その製造方法及びそれを用いた電子デバイス - Google Patents

熱伝導性接着シート、その製造方法及びそれを用いた電子デバイス Download PDF

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Publication number
JP6539917B2
JP6539917B2 JP2016565953A JP2016565953A JP6539917B2 JP 6539917 B2 JP6539917 B2 JP 6539917B2 JP 2016565953 A JP2016565953 A JP 2016565953A JP 2016565953 A JP2016565953 A JP 2016565953A JP 6539917 B2 JP6539917 B2 JP 6539917B2
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Japan
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thermal conductivity
adhesive sheet
conductive adhesive
thermally conductive
low thermal
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JP2016565953A
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English (en)
Japanese (ja)
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JPWO2016103784A1 (ja
Inventor
邦久 加藤
邦久 加藤
亘 森田
亘 森田
豪志 武藤
豪志 武藤
祐馬 勝田
祐馬 勝田
近藤　健
健 近藤
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Lintec Corp
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Lintec Corp
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Publication of JP6539917B2 publication Critical patent/JP6539917B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N3/00—Generators in which thermal or kinetic energy is converted into electrical energy by ionisation of a fluid and removal of the charge therefrom
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/105—Metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/107—Ceramic
    • B32B2264/108—Carbon, e.g. graphite particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
JP2016565953A 2014-12-26 2015-08-20 熱伝導性接着シート、その製造方法及びそれを用いた電子デバイス Active JP6539917B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014265645 2014-12-26
JP2014265645 2014-12-26
PCT/JP2015/073290 WO2016103784A1 (ja) 2014-12-26 2015-08-20 熱伝導性接着シート、その製造方法及びそれを用いた電子デバイス

Publications (2)

Publication Number Publication Date
JPWO2016103784A1 JPWO2016103784A1 (ja) 2017-10-05
JP6539917B2 true JP6539917B2 (ja) 2019-07-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016565953A Active JP6539917B2 (ja) 2014-12-26 2015-08-20 熱伝導性接着シート、その製造方法及びそれを用いた電子デバイス

Country Status (5)

Country Link
JP (1) JP6539917B2 (zh)
KR (1) KR102389426B1 (zh)
CN (1) CN107109151B (zh)
TW (1) TWI661026B (zh)
WO (1) WO2016103784A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106281206B (zh) * 2016-08-24 2020-05-08 上海颐行高分子材料有限公司 一种抗静电导热有机硅胶黏剂
CN108251076B (zh) * 2016-12-29 2020-03-27 中国科学院苏州纳米技术与纳米仿生研究所 碳纳米管-石墨烯复合散热膜、其制备方法与应用
JP7245652B2 (ja) * 2017-01-27 2023-03-24 リンテック株式会社 フレキシブル熱電変換素子及びその製造方法
CN107275019B (zh) * 2017-06-14 2018-12-11 上海萃励电子科技有限公司 一种具有局部制冷功能的ptc贴片元件
US10727195B2 (en) * 2017-09-15 2020-07-28 Technetics Group Llc Bond materials with enhanced plasma resistant characteristics and associated methods
DE102017217123A1 (de) * 2017-09-26 2019-03-28 Mahle International Gmbh Verfahren zum Herstellen eines thermoelektrischen Wandlers
CN109572504B (zh) * 2018-11-30 2022-02-18 苏州烯时代材料科技有限公司 一种汽车座椅
JP2020176201A (ja) * 2019-04-18 2020-10-29 信越化学工業株式会社 熱伝導性樹脂組成物及び熱伝導性樹脂硬化物
JP7662522B2 (ja) 2019-08-08 2025-04-15 デンカ株式会社 熱電変換素子
EP4012788B1 (en) 2019-08-08 2024-01-03 Denka Company Limited Thermoelectric conversion element
TWI822297B (zh) * 2022-09-02 2023-11-11 達邁科技股份有限公司 黑色消光之聚醯亞胺膜

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07111345A (ja) * 1993-10-14 1995-04-25 Matsushita Electric Ind Co Ltd 熱電発電デバイス
JP3740745B2 (ja) * 1995-08-28 2006-02-01 旭硝子株式会社 微小中空ガラス球状体の製造方法
JP4003254B2 (ja) * 1997-04-25 2007-11-07 アイシン精機株式会社 熱電変換素子及びその製造方法
JP2004143270A (ja) * 2002-10-23 2004-05-20 Nippon Petrochemicals Co Ltd 液晶ポリエステル樹脂組成物
JP2006030825A (ja) * 2004-07-21 2006-02-02 Ricoh Co Ltd 加圧定着部材、定着装置、画像形成装置
JP3981738B2 (ja) 2004-12-28 2007-09-26 国立大学法人長岡技術科学大学 熱電変換素子
JP2007198806A (ja) * 2006-01-24 2007-08-09 Mitsubishi Materials Corp 温度センサ
JP4895293B2 (ja) 2007-01-26 2012-03-14 新日鐵化学株式会社 フレキシブル熱電変換素子及びその製造方法
JP5087757B2 (ja) * 2007-06-08 2012-12-05 住友金属鉱山株式会社 熱電変換モジュールとこれを用いた発電装置
JP5493562B2 (ja) 2009-08-03 2014-05-14 富士通株式会社 熱電変換モジュール
JP5589672B2 (ja) * 2010-08-20 2014-09-17 富士通株式会社 熱電変換装置およびその製造方法
WO2012070395A1 (ja) * 2010-11-25 2012-05-31 住友金属鉱山株式会社 熱電変換モジュール
WO2013121486A1 (ja) * 2012-02-16 2013-08-22 日本電気株式会社 熱電変換モジュール装置、及び電子機器
EP2978032B1 (en) * 2013-03-21 2018-01-31 National University Corporation Nagaoka University of Technology Thermoelectric conversion element
CN104183691B (zh) * 2014-07-18 2017-01-25 浙江大学 平面型柔性温差发电结构

Also Published As

Publication number Publication date
TW201623504A (zh) 2016-07-01
JPWO2016103784A1 (ja) 2017-10-05
CN107109151A (zh) 2017-08-29
KR102389426B1 (ko) 2022-04-21
TWI661026B (zh) 2019-06-01
CN107109151B (zh) 2020-07-28
KR20170100515A (ko) 2017-09-04
WO2016103784A1 (ja) 2016-06-30

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