JP6511762B2 - 発光素子実装基板 - Google Patents

発光素子実装基板 Download PDF

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Publication number: JP6511762B2
Authority: JP; Japan
Prior art keywords: pad portions; copper foil; electrode pad; row; mounting substrate
Prior art date: 2014-10-03
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

JP2014205060A

Other languages

English (en)

Japanese (ja)

Other versions

JP2016076552A5 (fr

JP2016076552A (ja

Inventor

典明奥田

光広下嶋

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Mitsubishi Electric Corp

Mitsubishi Electric Lighting Corp

Original Assignee

Mitsubishi Electric Corp

Mitsubishi Electric Lighting Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2014-10-03

Filing date

2014-10-03

Publication date

2019-05-15

2014-10-03 Application filed by Mitsubishi Electric Corp, Mitsubishi Electric Lighting Corp filed Critical Mitsubishi Electric Corp

2014-10-03 Priority to JP2014205060A priority Critical patent/JP6511762B2/ja

2016-05-12 Publication of JP2016076552A publication Critical patent/JP2016076552A/ja

2017-10-05 Publication of JP2016076552A5 publication Critical patent/JP2016076552A5/ja

2019-05-15 Application granted granted Critical

2019-05-15 Publication of JP6511762B2 publication Critical patent/JP6511762B2/ja

Status Active legal-status Critical Current

2034-10-03 Anticipated expiration legal-status Critical

Images

Landscapes

Fastening Of Light Sources Or Lamp Holders (AREA)
Non-Portable Lighting Devices Or Systems Thereof (AREA)
Structure Of Printed Boards (AREA)
Led Device Packages (AREA)

JP2014205060A 2014-10-03 2014-10-03 発光素子実装基板 Active JP6511762B2 (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP2014205060A JP6511762B2 (ja)	2014-10-03	2014-10-03	発光素子実装基板

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2014205060A JP6511762B2 (ja)	2014-10-03	2014-10-03	発光素子実装基板

Publications (3)

Publication Number	Publication Date
JP2016076552A JP2016076552A (ja)	2016-05-12
JP2016076552A5 JP2016076552A5 (fr)	2017-10-05
JP6511762B2 true JP6511762B2 (ja)	2019-05-15

Family

ID=55950037

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2014205060A Active JP6511762B2 (ja)	2014-10-03	2014-10-03	発光素子実装基板

Country Status (1)

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JP (1)	JP6511762B2 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2021087475A (ja)	2019-12-02	2021-06-10	株式会社大一商会	遊技機
JP2021087474A (ja)	2019-12-02	2021-06-10	株式会社大一商会	遊技機
JP2021142020A (ja) *	2020-03-11	2021-09-24	株式会社大一商会	遊技機
JP2021142016A (ja) *	2020-03-11	2021-09-24	株式会社大一商会	遊技機
JP2021142021A (ja) *	2020-03-11	2021-09-24	株式会社大一商会	遊技機
JP2021186278A (ja) *	2020-05-29	2021-12-13	株式会社大一商会	遊技機
JP2022006266A (ja) *	2020-06-24	2022-01-13	株式会社大一商会	遊技機
JP2022006265A (ja) *	2020-06-24	2022-01-13	株式会社大一商会	遊技機
JP2022006267A (ja) *	2020-06-24	2022-01-13	株式会社大一商会	遊技機
CN114535734B (zh) *	2020-11-25	2024-01-26	东莞市中麒光电技术有限公司	一种led的激光焊接方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6269582A (ja) *	1985-09-21	1987-03-30	富士通株式会社	プリント板の回路形成方法
JPH0344080A (ja) *	1989-07-11	1991-02-25	Hitachi Cable Ltd	半導体装置
JP5128881B2 (ja) *	2007-08-31	2013-01-23	パナソニック株式会社	実装用基板及び発光モジュール
JP5053829B2 (ja) *	2007-12-28	2012-10-24	パナソニック株式会社	基板及び発光モジュール
KR101192181B1 (ko) *	2010-03-31	2012-10-17	(주)포인트엔지니어링	광 소자 디바이스 및 그 제조 방법
JP2011258381A (ja) *	2010-06-08	2011-12-22	Sharp Corp	配線基板及び照明装置
JP2012094661A (ja) *	2010-10-26	2012-05-17	Toshiba Lighting & Technology Corp	発光装置及び照明装置
JP2012124248A (ja) *	2010-12-07	2012-06-28	Toppan Printing Co Ltd	Ｌｅｄチップ搭載用リードフレーム基板及びその製造方法並びにｌｅｄパッケージ
JP5812845B2 (ja) *	2011-12-19	2015-11-17	新光電気工業株式会社	発光素子搭載用パッケージ及び発光素子パッケージ並びにそれらの製造方法
JP6096413B2 (ja) *	2012-01-25	2017-03-15	新光電気工業株式会社	配線基板、発光装置及び配線基板の製造方法
JP6157062B2 (ja) *	2012-05-15	2017-07-05	三菱電機株式会社	プリント配線板及び光源モジュール及び照明器具及び製造方法
JP5991065B2 (ja) *	2012-07-31	2016-09-14	日亜化学工業株式会社	発光装置
JP5985341B2 (ja) *	2012-10-03	2016-09-06	シャープ株式会社	導電フレームおよび光源基板の製造方法
JP2014107369A (ja) *	2012-11-27	2014-06-09	Citizen Holdings Co Ltd	半導体発光装置

2014
- 2014-10-03 JP JP2014205060A patent/JP6511762B2/ja active Active

Also Published As

Publication number	Publication date
JP2016076552A (ja)	2016-05-12

Publication	Publication Date	Title
JP6511762B2 (ja)	2019-05-15	発光素子実装基板
JP5283195B2 (ja)	2013-09-04	Ｌｅｄ配線基板及び光照射装置
US10905008B2 (en)	2021-01-26	Wiring board
JP4724700B2 (ja)	2011-07-13	発光装置
KR101860735B1 (ko)	2018-07-05	배선 기판
US9374909B2 (en)	2016-06-21	Method of manufacturing LED module
JP5295807B2 (ja)	2013-09-18	配線基板多数個取り用の母基板
KR20100134229A (ko)	2010-12-23	반도체 패키지
JP2011009441A (ja)	2011-01-13	発光装置
KR101321789B1 (ko)	2013-11-04	엘이디 모듈 제조방법
US9484330B2 (en)	2016-11-01	Light-emitting device
KR20140038881A (ko)	2014-03-31	발광다이오드 모듈 및 그 제작방법
JP2018535451A (ja)	2018-11-29	ビデオウォールのためのモジュール
JP6104616B2 (ja)	2017-03-29	Ｌｅｄモジュール
KR20100082394A (ko)	2010-07-19	Ｐｃｂ 블록 및 그것을 포함하는 블록형 ｌｅｄ 모듈
JP2019106505A (ja)	2019-06-27	フレキシブルｌｅｄ照明モジュール
CN103047575A (zh)	2013-04-17	发光二极管灯条及其制造方法
JP2022088567A5 (fr)	2022-07-28
JP6187897B2 (ja)	2017-08-30	光源装置
JP2008152291A5 (fr)	2008-09-04
KR20150001423A (ko)	2015-01-06	배터리 보호 회로 모듈용 기판, 배터리 보호 회로 모듈용 기판 제조 유닛, 배터리 보호 회로 모듈용 기판 제조 방법, 전자 장치
JP6157062B2 (ja)	2017-07-05	プリント配線板及び光源モジュール及び照明器具及び製造方法
RU2014144356A (ru)	2016-05-27	Светоизлучающая структура на основе светоизлучающих устройств
JP2009194000A (ja)	2009-08-27	多数個取り配線基板
JP2019087658A (ja)	2019-06-06	Ｌｅｄモジュール

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