JP6575436B2 - Method for manufacturing light emitting device - Google Patents

Description

  The present invention relates to a method for manufacturing a light emitting device.

  A side-emitting light-emitting device in which a side surface of a light-emitting element is covered with a reflective member instead of providing a housing that houses the light-emitting element is known (for example, Patent Document 1). In this light emitting device, a wavelength conversion unit is formed on a plurality of light emitting elements, and a side surface obtained by cutting the wavelength conversion unit is used as a light emission unit.

Japanese Patent Laying-Open No. 2015-97235

  By the method disclosed in Patent Document 1, a small light-emitting device can be obtained. In such a small light emitting device, a method for obtaining a light emitting device with high light extraction efficiency is demanded.

The manufacturing method of the light-emitting device which concerns on embodiment of this invention contains the following structures.
A first main surface having electrodes, a second main surface opposite to the first main surface, a first long side surface between the first main surface and the second main surface, and an opposite side of the first long side surface A rectangular parallelepiped laminated structure comprising: a second short side surface; a first short side surface between the first main surface and the second main surface; and a second short side surface opposite to the first short side surface. A step of preparing the light emitting element provided, a first concave first side surface and a first concave second long side surface that can accommodate the light emitting element and respectively face the first and second long side surfaces of the light emitting element; A first recess having a pair of first recess short sides facing the first and second short sides of the light emitting element and a bottom surface is provided, and is slidable into the first recess on the first recess first long side. A step of preparing a lower mold having a slide portion having a height lower than the height of the first recess and a width smaller than the width of the first recess, and the first recess of the lower mold, A pair of convex long sides having the same height as the light emitting element, the same width as the first concave first long side or the first concave second long side, and the first concave short side. A step of preparing a first upper mold having a convex portion having a pair of convex short sides that are smaller than the width of the convex portion, and the side of the slide portion so as to contact the convex first long side. A step of closing the mold and the first upper mold, injecting a first light-shielding resin material into the first recess, and molding the first light-shielding resin; and a first upper mold and a lower mold A second recess comprising a bottom surface and a second recess second long side surface comprising a first light-shielding resin, and a second recess first long side and second recess short side surface comprising a lower mold. A step of forming, a step of disposing the light emitting element on the first light-shielding resin so that the first main surface faces upward, and the first long side surface and the slide portion face each other; A step of closing the lower die so that the lower surface of the die faces the electrode, a step of sliding the slide portion so as to contact the first long side surface of the light emitting element, and a second portion in the second recess. A light-blocking resin material is injected to contact the first light-blocking resin and the surface of the light emitting element other than the first long side contacting the first long side slide of the light emitting element, and covers the outer periphery of the slide. A step of molding the second light-shielding resin, a step of opening the lower die and the second upper die, and taking out the light emitting device intermediate body in which at least a part of the first long side surface of the light emitting element is exposed, Forming a translucent member that covers the first long side surface of the light emitting element.

  According to the embodiment of the present invention, a light emitting device with high light extraction efficiency can be easily obtained.

1A is a schematic perspective view illustrating an example of a light-emitting device obtained by the method for manufacturing a light-emitting device according to Embodiment 1. FIG. FIG. 1B is a schematic perspective view illustrating an example of a light-emitting device obtained by the method for manufacturing a light-emitting device according to Embodiment 1. 1C is a schematic cross-sectional view taken along the line AA of FIG. 1A. 2A is a schematic perspective view illustrating an example of a light-emitting element used in the method for manufacturing a light-emitting device according to Embodiment 1. FIG. 1B is a schematic perspective view illustrating an example of a light-emitting element used in the method for manufacturing a light-emitting device according to Embodiment 1. FIG. 2C is a schematic cross-sectional view taken along line BB in FIG. 2A. FIG. 3A is a schematic end view showing an example of a lower mold used in the method for manufacturing a light emitting device according to Embodiment 1. FIG. 3B is a schematic end view illustrating an example of a lower mold used in the method for manufacturing the light emitting device according to Embodiment 1. 3C is a schematic view of a lower mold used in the method for manufacturing the light emitting device according to Embodiment 1. FIG. FIG. 4A is a schematic end view illustrating an example of a first upper mold used in the method for manufacturing a light emitting device according to Embodiment 1. 4B is a schematic end view illustrating an example of a first upper mold used in the method for manufacturing the light emitting device according to Embodiment 1. FIG. FIG. 4C is a schematic view illustrating the movement of the slide portion of the first upper mold used in the method for manufacturing the light emitting device according to Embodiment 1. FIG. 5A is a schematic diagram illustrating a method for manufacturing the light emitting device according to Embodiment 1. FIG. 5B is a schematic view illustrating the method for manufacturing the light emitting device according to Embodiment 1. 6A is a schematic diagram illustrating a method for manufacturing the light emitting device according to Embodiment 1. FIG. FIG. 6B is a schematic diagram illustrating a method for manufacturing the light emitting device according to Embodiment 1. FIG. 7A is a schematic view illustrating a method for manufacturing the light emitting device according to Embodiment 1. FIG. 7B is a schematic diagram illustrating a method for manufacturing the light-emitting device according to Embodiment 1. FIG. 8A is a schematic diagram illustrating a method for manufacturing the light emitting device according to Embodiment 1. FIG. 8B is a schematic diagram illustrating a method for manufacturing the light emitting device according to Embodiment 1. FIG. 9A is a schematic view illustrating a method for manufacturing the light emitting device according to Embodiment 1. FIG. 9B is a schematic diagram illustrating a method for manufacturing the light emitting device according to Embodiment 1. FIG. 10 is a schematic diagram illustrating a method for manufacturing the light emitting device according to the first embodiment. FIG. 11A is a schematic diagram illustrating a method for manufacturing the light-emitting device according to Embodiment 1. FIG. 11B is a schematic view illustrating the method for manufacturing the light emitting device according to Embodiment 1. FIG. 12A is a schematic diagram illustrating a method for manufacturing the light-emitting device according to Embodiment 1. FIG. 12B is a schematic diagram illustrating a method for manufacturing the light-emitting device according to Embodiment 1. FIG. 13A is a schematic diagram illustrating a method for manufacturing the light emitting device according to Embodiment 1. FIG. 13B is a schematic diagram illustrating a method for manufacturing the light-emitting device according to Embodiment 1. FIG. 14A is a schematic diagram illustrating a method for manufacturing the light emitting device according to Embodiment 1. FIG. 14B is a schematic diagram illustrating a method for manufacturing the light emitting device according to Embodiment 1. 15A to 15C are schematic views illustrating a method for manufacturing the light emitting device according to the second embodiment. FIGS. 16A to 16C show a light emitting device obtained by the method for manufacturing a light emitting device according to the second embodiment. FIG. 17 is a schematic cross-sectional view illustrating the method for manufacturing the light emitting device according to the third embodiment. FIG. 18 is a schematic cross-sectional view illustrating the method for manufacturing the light emitting device according to the fourth embodiment. FIG. 19 is a schematic perspective view showing a modification of the first mold used in the method for manufacturing the light emitting device according to the embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, terms indicating specific directions and positions (for example, “up”, “down”, “right”, “left” and other terms including those terms) are used as necessary. . The use of these terms is to facilitate understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of these terms. Moreover, the part of the same code | symbol which appears in several drawing shows the same part or member.

<Embodiment 1>
A light-emitting device 10 obtained by the method for manufacturing a light-emitting device according to Embodiment 1 is shown in FIGS. 1A, 1B, and 1C. The light emitting device 10 includes a light emitting element 20, a translucent member 30 that transmits light from the light emitting element 20, and a light blocking resin 40 that blocks light from the light emitting element 20.

  The light emitting device 10 is a side emission type (side view type). A pair of electrodes 28 is provided on the lower surface 11 of the light emitting device 10. The pair of electrodes 28 is electrically joined to the wiring on the secondary substrate. The front surface (light emitting surface) 13 provided with the translucent member 30 is disposed so as to face sideward (direction substantially parallel to the upper surface of the secondary substrate) when mounted on the secondary substrate. Surfaces other than the front surface 13 and the lower surface 11, that is, the upper surface 12, the back surface 14, and the two side surfaces 15 are formed of a light shielding resin 40.

  When viewed from the front, the light emitting surface 13 of the light emitting device 10 and the light emitting surface 23 of the light emitting element 20 overlap each other, so that the light extraction efficiency is good. The light emitting surface 13 of the light emitting device 10 includes a light transmissive member 30 and a light shielding resin 40 disposed on the outer periphery thereof. As a result, a light-emitting device with a clear outline of the light-emitting region and a so-called good parting property can be obtained.

  A method for manufacturing the light emitting device according to Embodiment 1 will be described with reference to FIGS. In the first embodiment, as shown in FIG. 1A and the like, a manufacturing method for obtaining the light emitting device 10 in which the ratio of the translucent member 30 in the front surface 13 is relatively large will be described.

(Process for preparing light emitting element)
For example, a semiconductor light emitting element such as a light emitting diode is prepared as the light emitting element 20. As shown in FIGS. 2A, 2B, and 2C, the light emitting element includes a laminated structure 27 and a pair of positive and negative electrodes. The laminated structure 27 is a substantially rectangular parallelepiped. The laminated structure 27 has six surfaces. Specifically, the laminated structure 27 includes a first main surface 21 provided with electrodes 28 and a second main surface 22 opposite to the first main surface 21. Further, the laminated structure 27 includes a first long side surface 23 between the first main surface 21 and the second main surface 22 and a second long side surface 24 opposite to the first long side surface 23. Furthermore, a first short side surface 25 between the first main surface 21 and the second main surface 22 and a second short side surface 26 opposite to the first short side surface 25 are provided.

(Process for preparing lower mold)
As shown in FIGS. 3A, 3B, and 3C, a lower mold 100 having a plurality of first recesses 110 on the upper surface is prepared. One lower mold 100 includes a plurality of first recesses 110, and here, two first recesses 110 are illustrated. One light emitting device can be formed by one first recess 110. As shown in FIG. 3C, in the lower mold 100, the two adjacent first recesses 110 are disposed via a wall including the first recess short side surface 115. 3A is a schematic end view of the long side surface, and FIG. 3B is a schematic end view of the short side surface. FIG. 3C is a partial cross-sectional view of the inside of the first recess 110 in which one of the long side surfaces is omitted so that the movement of the slide part 120 described later can be seen. In FIG. 3C, the first recess 110 on the right side and the first recess on the left side show a state where they are arranged at different positions so that the movement of the slide unit 120 can be seen.

  Each first recess 110 is large enough to accommodate a light emitting element. Specifically, each first recess 110 includes a bottom surface (first recess bottom surface 112) and four side surfaces. The four side surfaces are two long side surfaces and two short side surfaces, the long side surfaces face each other, and the short side surfaces face each other. The long side surface of the first recess 110 of the lower mold 100 includes a first recess first long side surface 113 that faces the first long side surface 23 of the light emitting element when the light emitting element is accommodated in the first recess, and the light emitting element. The first concave second long side 114 facing the second long side 24 is provided. The short side surface of the first recess 110 of the lower mold 100 has two first side surfaces that respectively face the first short side surface 25 and the second short side surface 26 of the light emitting element when the light emitting element is accommodated in the first recess 110. A recess short side surface 115.

  The first recess first long side surface 113 of the lower mold 100 includes a slide portion 120 that can slide into the first recess 110. In FIG. 3C, two first recesses 110 are illustrated, and in the left first recess 110, the side surface of the slide part 120 is flush with the first recess first long side surface 113 other than the slide part 120. Is arranged. A state in which the slide part 120 is slid (moved) in the direction of the arrow shown in the first concave part 110 on the left side of FIG. 3C is indicated by the first concave part 110 on the right side of FIG. 3C.

  Such a slide part 120 can be slid by, for example, pushing or pulling the slide part with a movable pin provided inside the lower mold 100. Specifically, a pin can be placed inside the hole reaching the slide part, and the slide part can be moved into the first recess by pressing the pin in the hole by pressurization. Moreover, the slide part in a 1st recessed part can be moved to an original position by pulling out the pin in a hole by pressure reduction.

The height H _S of the slide part 120 is lower than the height H _b1 of the first recess 110. In other words, the upper end of the slide portion 120 is positioned below the upper end of the first recess 110, and the lower end of the slide portion 120 is positioned above the first recess bottom surface 112 of the first recess 110. .

The width W _S of the slide part 120 is smaller than the width W _b1 of the first recess 110. In other words, the right end and the left end of the slide portion 120 are separated from the first recess short side surface 115 which is the side surface of the first recess 110.

The slide part 120 is a formation planned position of a translucent member to be described later. That is, the size (area) of the slide part 120 is the size of the light emitting surface of the light emitting device. Further, the shape of the slide part 120 is the shape of the light emitting surface of the light emitting device. Therefore, the height, width, and shape of the slide portion 120 can be appropriately selected according to the shape of the target light emitting device, such as the size of the light emitting element, the size of the light emitting device, and the light distribution characteristics. In the first embodiment, the light emitting surface is rectangular in order to obtain a light emitting device having a relatively large light emitting surface. Further, the width W _S of the slide portion 120 is about 70% to 95% of the width W _b1 of the first recess 110, and the height H _S of the slide portion 120 is 60% to the height H _b1 of the first recess 110. It can be about 95%.

  It is preferable that the slide part 120 is located in the center in the up-down direction and the left-right direction on the first concave first long side surface 113. In other words, it is preferable that the distance between the upper end of the slide portion 120 and the upper end of the first concave first long side surface is substantially equal to the distance between the lower end of the slide portion 120 and the lower end of the first concave first long side surface. Furthermore, it is preferable that the distance between the right end of the slide portion 120 and the right end of the first concave first long side surface and the distance between the left end of the slide portion 120 and the left end of the first concave first long side surface are substantially equal.

(Step of preparing the first upper mold)
As shown in FIGS. 4A, 4B, and 4C, the first upper mold 200 includes a convex portion 210 that faces the first concave portion 110 of the lower mold 100. The convex portion 210 has a top surface 212 at a position higher than the flat surface portion 219 of the first upper mold 200 (lower side in FIG. 4A). The plane portion 219 is a surface facing the upper surface of the side wall of the first recess 110 of the lower mold 100. The height of the convex portion 210 (distance from the flat surface portion to the top surface) is substantially the same as the light emitting element described later. In addition, when a convex part has the projection part mentioned later, the distance from the top surface of the part except a projection part to a flat part is substantially the same height as a light emitting element. Protrusion 210 includes a pair of first recess length side (first recess first long side surface 113 and the first recess second long side 114), substantially a pair of convex director side (first long convex portion of the same width W _t Side surface 213 and convex second long side surface 214). Further, the convex portion 210 has a pair of protrusions short side surface 215 of the second recess short length of side 135 _(depth) smaller length than _{D b1} (depth) _{D t} shown in Figure 3B.

Further, in the first embodiment, the convex portion 210 has a protrusion 220 on the top surface 212. The protrusion 220 is provided on a part of the top surface 212 of the protrusion 210. Specifically, the protrusion 220 includes a long side surface 223 that is flush with the convex first long side surface 213. Length _{(width) W t1} of the protruding portion 220 is the same as the length side length (width) _{W t} of the protrusion 210. The top surface 222 of the protrusion 220 is provided at a height that does not reach the first recess bottom surface 112 of the first recess 110. That is, the total height of the height _{H t} of the protrusions 210 of the other protrusion height _{H t1} of the protruding portion 220 has a height _(depth) of the first recess 110 is lower than the _{H b1.} Note that the “height of the convex portion” refers to the height including the protruding portion when the protruding portion is included, and the height to the top surface in the region not including the protruding portion.

Length (depth) D _t1 short side 225 of the protrusion 220, the length of the top surface of the projection other than the protrusions (depth) D _t2 is the length of the short side surface of the light emitting element shown in FIG. 2C (depth ) set to be substantially equal to D _d. Further, the length (depth) D _t1 of the short side surface 225 of the protrusion 220 is substantially equal to the height (thickness) of the translucent member in the light emitting device.

(Closing the mold and molding the first light-shielding resin)
The lower mold 100 and the first upper mold 200 prepared as described above are closed as shown in FIGS. 5A and 5B. Specifically, the lower mold 100 and the first mold side are arranged such that the side surface of the slide portion 120 of the first concave first long side surface 113 of the lower mold 100 is in contact with the convex first long side surface 213 of the first upper mold 200. The upper mold 200 is closed. As a result, a space having a substantially L-shaped cross section as shown in FIG. 5B is formed between the lower mold 100 and the first upper mold 200.

  Next, as shown in FIGS. 6A and 6B, a first light-shielding resin material is injected into the space formed between the lower mold 100 and the first upper mold 200 to mold the first light-shielding resin 41. Note that the inlet for the first light-shielding resin material can be provided in either one or both of the lower mold and the upper mold.

(Step of opening the mold and forming the second recess)
The first upper mold 200 and the lower mold 100 are opened. Specifically, the mold is opened by removing the first upper mold 200 so that the first light-shielding resin 41 molded in the lower mold 100 remains. Thereby, the 2nd recessed part 130 as shown to FIG. 7A and FIG. 7B is formed. The second recess 130 includes the first light shielding resin 41 and the lower mold 100. Specifically, the second recess bottom surface 132 and the second recess second long side surface 134 are configured by the first light shielding resin 41. The two second recess short side surfaces 135 and the second recess first long side surface 133 are configured by the lower mold 100. Furthermore, as shown in FIG. 7B, the first light-shielding resin 41 constituting the second concave bottom surface 132 has a concave portion corresponding to the protrusion 220 of the first upper mold. The slide part 120 is arranged so as to be above the recessed part.

  The height of the second concave portion 130, the length of the long side surface, and the length of the short side surface are respectively the height and length corresponding to the convex portion 210 (including the protruding portion 220) of the first upper mold.

(Process for arranging light emitting elements)
Next, as shown in FIGS. 8A and 8B, the light emitting element 20 is placed on the second recess bottom surface 132 in the second recess 130, that is, on the first light shielding resin 41. Specifically, the light emitting element 20 is placed with the first main surface 21 on which the electrode 28 is formed facing upward. At this time, the light emitting element 20 is disposed so as to be separated from the short side surface (second concave portion short side surface 135) of the second concave portion 130 so that the first long side surface 23 and the slide portion 120 face each other. At this stage, the light emitting element 20 is separated from the second recess first long side surface 133 so as not to contact the slide portion 120. The light emitting element 20 is disposed so as to be in contact with the second concave second long side surface 134 made of the first light shielding resin 41.

(Process of closing the second upper mold and the lower mold)
Next, as shown in FIGS. 9A and 9B, the second upper mold 300 and the lower mold 100 are closed with the light emitting element 20 included therein. The second upper mold 300 is different from the first upper mold 200 in that the lower surface 312 is a flat surface (one plane). The lower surface 312 of the second upper mold 300 is disposed so as to face the electrode 28 of the light emitting element 20. At this time, the lower surface 312 of the second upper mold 300 may be disposed so as to be in contact with the electrode 28 of the light emitting element 20 via the sheet S. The lower surface 312 of the second upper mold 300 is further arranged so as to be in contact with the upper surface of the concave portion (second concave portion 130) of the lower mold 100 via the sheet S. Thereby, a space surrounded by the second upper mold 300 and the lower mold 100 through the first light-shielding resin 41, the light emitting element 20, and the sheet S is formed in the recess 130.

  Examples of the sheet S include a sheet made of silicone, vinyl chloride, polyolefin, polyurethane, polyimide, and the like. The thickness of the sheet is not particularly limited. The sheet S can also be used when the first mold and the lower mold are closed.

(Step of sliding the slide part)
Next, as shown in FIG. 10, the slide part 120 is slid so as to contact the first long side surface 23 of the light emitting element 20 shown in FIG. 9B. Thereby, in the 2nd recessed part 130, the space is formed between the 1st main surface 21 of the light emitting element 20, the 2nd upper metal mold | die 300, and between the light emitting element 20 and the 2nd recessed part short side surface. The The slide part 120 may be slid after the light emitting element 20 is placed in the second recess 130 and before the second upper mold 300 and the lower mold 100 are closed.

(Process of molding the second light-shielding resin)
Next, as shown in FIGS. 11A and 11B, the second light shielding resin material is injected into the second recess 130 to form the second light shielding resin 42. Specifically, the second light shielding resin 42 is formed so as to be in contact with the first light shielding resin 41. Further, the second light shielding resin 42 is formed so as to be in contact with the surface of the light emitting element 20 other than the first long side surface 23 with which the slide portion 120 is in contact. Further, the second light shielding resin 42 is formed so as to cover the outer peripheral portion of the slide portion 120 exposed by sliding into the second recess 130.

(Step of taking out the light emitting device intermediate)
Next, the lower mold 100 and the second upper mold 300 are opened, and the light emitting device intermediate 10A with the first long side surface 23 of the light emitting element 20 exposed is taken out as shown in FIGS. 12A and 12B. Before taking out, the slide part 120 is moved to the original position in advance. Further, the plurality of light emitting device intermediates 10A are in contact with the sheet S and can be handled in units of the sheet S after the mold is opened.

  The obtained light emitting device intermediate 10 </ b> A has a structure in which the first long side surface 23 of the light emitting element 20 and the lower surface of the electrode 28 are covered with a light shielding resin 40. The long side surface including the first long side surface 23 of the light emitting element 20 is referred to as a front surface 13, and the long side surface facing the front surface 13 is referred to as a back surface 14. The long side surface of the light emitting element 20 where the electrode 28 is exposed is the lower surface 11, the long side surface facing the lower surface 11 is the upper surface 12, and the pair of surfaces covering the short side surfaces 25 and 26 of the light emitting element 20 are the side surface 15. To do.

  Further, on the front surface 13 of the light emitting device intermediate 10 </ b> A, a light shielding resin 40 that protrudes from the first long side surface 23 of the light emitting element 20 is formed in a frame shape. In other words, a concave portion (light emitting device intermediate concave portion) having the first long side surface 23 of the light emitting element 20 as a bottom surface and the light shielding resin 40 as a side wall is formed. At the stage where the mold is opened and taken out, each of the light emitting device intermediates 10A has the lower surface 11 in contact with the sheet S. Therefore, the light emitting device intermediate recesses R are arranged to open sideways.

  Next, as shown in FIGS. 13A and 13B, the direction of the light emitting device intermediate 10A is changed so that the first long side surface 23 of the light emitting element 20 faces upward. That is, the light emitting device intermediate body 10 </ b> A is disposed so that the front surface 13 faces upward and the back surface (long side surface) 14 contacts the sheet S. Thus, the light emitting device intermediate recess R is arranged so that the upper side is an opening. When changing the direction of the light emitting device intermediate 10A, the light emitting device intermediate 10A may be placed on another sheet S, or may be changed by rotating it on the same sheet S. .

  Next, as shown in FIG. 14A and FIG. 14B, a translucent member 30 is formed in the light emitting device intermediate recess R. The translucent member 30 can be used by methods such as potting, printing, and spraying. Finally, by peeling from the sheet S, the light emitting device 10 shown in FIG. 1A and the like can be obtained.

  In the light emitting device 10, the light emitting element 20 is located on the back of the translucent member 30 serving as a light emitting unit. Therefore, the light extraction efficiency is good. Moreover, since the periphery of the translucent member 30 is surrounded by the light-shielding resin 40, the light-emitting device has a clear outline of the light-emitting region and can have a good parting property.

  In the light emitting device 10 obtained as described above, as shown in FIGS. 1A, 1B, and C, the front surface 13 is composed of a translucent member 30 and a frame-shaped light shielding resin 40 surrounding the periphery. Is done. Specifically, the second light-shielding resin 42 is disposed on the lower long side of the translucent member 30 (the long side on the lower surface 11 side) and a part of the side connected to the lower long side. The first light-shielding resin 41 is disposed on the upper long side (the long side on the upper surface 12 side) of the optical member 30 and a part of the side that is continuous with the upper long side.

  The upper surface 12 of the light emitting device 10 is composed of a first light shielding resin 41. The lower surface 11 of the light emitting device 10 is composed of two light emitting element electrodes 28 and a light shielding resin 40 surrounding them. Specifically, it is composed of a second light-shielding resin 42 that directly covers the electrode 28 of the light-emitting element, and a first light-shielding resin 41 disposed on the back surface 14 side.

  The side surface (short side surface) 15 of the light-emitting device 10 is configured by an L-shaped first light-shielding resin 41 and a quadrangular second light-shielding resin 42 surrounded by the L-shaped first light-shielding resin 41.

  The boundary between the first light-shielding resin 41 and the second light-shielding resin 42 can be clearly recognized or difficult to recognize depending on the resin used. When it is easy to recognize, for example, the cathode or the anode can be recognized by the L-shaped direction of the side surface 15 of the light emitting device 10.

<Embodiment 2>
In the method for manufacturing the light emitting device according to the second embodiment, the height and length (width and depth) of the protrusions of the first upper mold are different from those of the first embodiment. FIG. 15A is a cross-sectional view showing a state in which the lower mold 100A and the first upper mold 200A are closed, and corresponds to FIG. 5B described in the first embodiment. The second embodiment is different from the first embodiment in that the protrusion 220A of the convex portion 210A of the first upper mold 200A is provided at a height that reaches the first concave bottom surface 112 of the lower mold 100A.

Further, the length of the projection of the (depth) _{D t,} the length _Dt1A of projections 220A is wider than in the embodiment 1, the length of the top surface of the projection other than the protrusions _{(depth) D t2A} is, emission the length of the short side of the element (depth) less than D _d. Therefore, when the light-emitting element 20 is placed on the first light-shielding resin 41 after forming the first light-shielding resin 41, a part of the lower surface of the light-emitting element 20 is in a floating state as shown in FIG. And the 2nd recessed part 1st long side surface 133 will be in the state spaced apart from the 1st light shielding resin 41 in the whole surface.

  Thereafter, as shown in FIG. 15C, the second upper mold 300 and the lower mold 100 </ b> A are closed to form the second light-shielding resin 42. At this time, the second light shielding resin 42 is also formed in the space between the first recess bottom surface 112 and the light emitting element 20.

  The light-emitting device 50 obtained in this way is shown in FIGS. Similar to the light emitting device 10 obtained in the first embodiment, the light emitting element 20 is located on the back of the translucent member 30 serving as the light emitting unit. Therefore, the light extraction efficiency is good. Moreover, since the periphery of the translucent member 30 is surrounded by the light-shielding resin 40, the light-emitting device has a clear outline of the light-emitting region and can have a good parting property.

  On the front surface 13 of the light emitting device 50, the translucent member 30 and the frame-shaped light shielding resin 40 surrounding the periphery thereof are all made of the second light shielding resin 42. Thereby, for example, since the translucent member 30 can be surrounded by the seamless frame-shaped light-shielding resin 40, the outline of the light-emitting region is easily clarified.

  The upper surface 12 of the light emitting device 10 is composed of a first light shielding resin 41 and a second light shielding resin 42. Other aspects are the same as in the first embodiment.

  The manufacturing method of the light emitting device according to the second embodiment can increase the height of the slide portion 120A as compared with the first embodiment. This is because, as shown in FIG. 15C, when the slide part 120A is moved, the slide part 120A is moved in an area where the first light shielding resin 41 is not formed. Thereby, a light emitting device having a wider light emitting region can be obtained. Further, even when the length Dd of the short side surface of the light emitting element, that is, the width of the light emitting element varies, the light emitting element is not easily affected.

<Embodiment 3>
In the method for manufacturing the light emitting device according to the third embodiment, as shown in FIG. 17, the top surface of the convex portion 210B does not have a protrusion, and the first upper mold 200B including the depression 230 is used. The same as in the first embodiment. When such a first upper mold 200B is used, it is necessary to reduce the area of the slide portion 120B provided in the lower mold 100B. And the area of the translucent member used as the light emission part of a light-emitting device becomes small by reducing the area of the slide part 120B. Therefore, a light-emitting device with high light density can be obtained. The light-emitting device having such a configuration is the same as the other embodiments in that the light-emitting element is located on the back of the translucent member serving as the light-emitting unit. Therefore, the light extraction efficiency is high, the outline of the light emitting region is clear, and the light emitting device with good parting ability can be obtained. In particular, in Embodiment 3, since the ratio of the light blocking resin in the front surface of the light emitting device is large, the outline of the light emitting region becomes clearer. In FIG. 17, the depression 230 is an inclined surface obtained by chamfering a part of the top surface of the convex portion. However, the present invention is not limited thereto, and may be a depression (step) having a surface parallel to the top surface. .

<Embodiment 4>
The light emitting device manufacturing method according to Embodiment 4 is the same as that of Embodiment 1 except that a first upper mold 200C having a flat top surface of the convex portion 210C is used as shown in FIG. That is, it does not have a protrusion or a depression as in other embodiments. Since such a first upper mold 200C does not need to process the protrusions and depressions with high accuracy, the cost can be reduced as compared with the first upper mold including them. The size of the slide part 120C provided in the lower mold 100C can be adjusted according to the height of the convex part 210C of the first upper mold 200C.

  In each of the above-described embodiments, the slide portion may have a rectangular shape as illustrated in FIG. 3C. However, the present invention is not limited to this, and for example, in addition to an elliptical slide portion 120D as shown in the lower mold 100D shown in FIG. 19, a circular shape, a polygonal shape, or a combination thereof can be used. Since the shape of the light emitting portion is determined by the shape of the slide portion, it can be appropriately selected depending on the purpose and application. Moreover, you may provide one slide part or two or more slide parts in one recessed part (a 1st recessed part, a 2nd recessed part).

  As described above, in the method for manufacturing a light emitting device in the embodiment, the light shielding resin that covers the light emitting element is formed in two portions, and a mold having a slide portion is used when forming the light shielding resin for the second time. Forming a light-shielding resin in a frame shape, and forming a translucent member in a region surrounded by the frame-shaped light shielding resin.

  Below, the material etc. which are suitable for each structural member of the light-emitting device of each embodiment are demonstrated.

(Light emitting element)
As the light emitting element, for example, a semiconductor light emitting element such as a light emitting diode can be used, and a light emitting element capable of emitting visible light such as blue, green, and red can be used. The semiconductor light emitting device can include a translucent substrate and a semiconductor stacked body formed thereon. Moreover, the semiconductor laminated body is provided with the electrode formation surface provided with the electrode in the opposite side (surface which opposes) a translucent board | substrate. The translucent substrate side is used as a light extraction surface.

(Semiconductor laminate)
The semiconductor stacked body includes a plurality of semiconductor layers. As an example of the semiconductor stacked body, three semiconductor layers including a first conductivity type semiconductor layer (for example, n-type semiconductor layer), a light emitting layer (active layer), and a second conductivity type semiconductor layer (for example, p-type semiconductor layer) are included. Can do. The semiconductor layer capable of emitting visible light from ultraviolet light or blue light to green light can be formed from a semiconductor material such as a III-V group compound semiconductor or a II-VI group compound semiconductor, for example. _{Specifically, In X Al Y Ga 1-} X-Y N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) nitride semiconductor material (e.g., InN such, AlN, GaN, InGaN, AlGaN , InGaAlN Etc.) can be used. As the semiconductor stack capable of emitting red light, GaAs, GaAlAs, GaP, InGaAs, InGaAsP, or the like can be used.

(Translucent substrate)
For the light-transmitting substrate of the light-emitting element, for example, in the case of the nitride semiconductor material described above, a light-transmitting insulating material such as sapphire (Al ₂ O ₃ ) or spinel (MgA 1 ₂ O ₄ ), or a semiconductor A semiconductor material (eg, a nitride semiconductor material) that transmits light emitted from the stacked body can be used. In the case of a semiconductor material such as GaAs, GaAlAs, InGaAs, and the like can be given. Here, the translucency refers to the property of transmitting about 60%, 65%, 70%, or 80% or more of the light emitted from the light emitting element.

(electrode)
The pair of electrodes included in the light-emitting element is disposed on the same surface side of the semiconductor layer. The pair of electrodes is a single layer as long as it is ohmic-connected to the first conductive type semiconductor layer and the second conductive type semiconductor layer described above so that the current-voltage characteristics are straight or substantially straight. A structure may be sufficient and a laminated structure may be sufficient. Such an electrode can be formed with an arbitrary thickness using materials and configurations known in the art. For example, 10 to 300 μm is preferable. Moreover, a good electrical conductor can be used as an electrode, for example, metals, such as Cu, Au, Ag, AuSn, are suitable.

(Translucent member)
As the translucent member, translucent resin, glass or the like can be used. In particular, a translucent resin is preferable, and a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin, or a thermoplastic resin such as a polycarbonate resin, an acrylic resin, a methylpentene resin, or a polynorbornene resin is used. it can. In particular, a silicone resin excellent in light resistance and heat resistance is suitable.

The translucent member may include a phosphor in addition to the above translucent material. A phosphor that can be excited by light emitted from the light emitting element is used. For example, phosphors that can be excited by blue light-emitting elements or ultraviolet light-emitting elements include yttrium-aluminum-garnet phosphors (YAG: Ce) activated by cerium; lutetium-aluminum-garnet-based phosphors activated by cerium (LAG: Ce); nitrogen-containing calcium aluminosilicate phosphor activated with europium and / or chromium (CaO—Al ₂ O ₃ —SiO ₂ ); silicate phosphor activated with europium ((Sr, Ba) ₂ SiO ₄ ); nitride phosphor such as β sialon phosphor, CASN phosphor, SCASN phosphor; KSF phosphor (K ₂ SiF ₆ : Mn); sulfide phosphor, quantum dot phosphor Etc. By combining these phosphors with a blue light emitting element or an ultraviolet light emitting element, light emitting devices of various colors (for example, white light emitting devices) can be manufactured. The first light transmissive member may contain various fillers for the purpose of adjusting the viscosity.

(Light shielding resin)
The light shielding resin includes a first light shielding resin and a second light shielding resin. The resin material that can be used for the light-shielding resin is particularly preferably a thermosetting translucent resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin.

  The light shielding resin can be formed of a light reflecting resin. The light reflecting resin means a resin material having a reflectance of 70% or more with respect to light from the light emitting element. The light reaching the light shielding resin is reflected and travels toward the light emitting surface of the light emitting device, whereby the light extraction efficiency of the light emitting device can be increased.

  As the light-reflective resin, for example, a light-transmitting resin in which a light-reflective substance is dispersed can be used. As the light reflective substance, for example, titanium oxide, silicon oxide, zirconium oxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, mullite and the like are suitable. The light-reflective substance can be in the form of particles, fibers, thin plate pieces, etc., but the fiber-like substance is particularly preferable because it can be expected to reduce the thermal expansion coefficient of the light-shielding resin.

  As mentioned above, although some embodiment which concerns on this invention was illustrated, this invention is not limited to embodiment mentioned above, It cannot be overemphasized that it can be made arbitrary, unless it deviates from the summary of this invention. .

DESCRIPTION OF SYMBOLS 10, 50 ... Light-emitting device 10A ... Light-emitting device intermediate body 11 ... Lower surface (surface where the electrode was exposed)
12 ... Upper surface 13 ... Front (light emitting surface)
14 ... Back (long side)
15 ... Side (short side)
R: recess (light emitting device intermediate recess)
20 ... Light emitting element 21 ... 1st main surface (surface which has an electrode)
22 ... 2nd main surface 23 ... 1st long side surface (light emission surface)
24 ... 2nd long side surface 25 ... 1st short side surface 26 ... 2nd short side surface 27 ... Laminated structure 28 ... Electrode
H _d ... Height
W _d ... length of the long side (width)
D _d ... Length of the short side (depth)
DESCRIPTION OF SYMBOLS 30 ... Translucent member 40 ... Light-shielding resin 41 ... 1st light-shielding resin 42 ... 2nd light-shielding resin 100, 100A, 100B, 100C, 100D ... Lower metal mold 110 ... 1st recessed part 112 ... 1st recessed part bottom face 113 ... 1st concave part 1st long side (light emitting surface)
114: 1st recessed part 2nd long side surface 115 ... 1st recessed part short side surface
H _b1 ... height (depth) of the first recess
W _b1 ... Length (width) of the long side surface of the first recess
D _b1 ... Length of the short side surface of the first recess (depth)
120, 120A, 120B, 120C, 120D ... Slide part
H _S ... Slide part height
W S _... slide portion length of the (width)
W _d ... Length of slide part (depth)
W _d1 ... Length of the slide portion that has slid into the recess (depth)
130 ... second recess 132 ... second recess bottom surface 133 ... second recess first long side surface (light emitting surface)
134: Second concave second side surface 135 ... Second concave short side surface 200, 200A, 200B, 200C ... First upper mold 210, 210A, 210B, 210C ... Convex portion 212 ... Convex top surface 213 ... Convex portion First long side surface (surface forming a light emitting surface)
214 ... convex second long side 215 ... convex short side 219 ... flat surface
H _t ... Height of convex part
W _t ... length (width) of the long side surface of the convex portion
D _t : Length of the short side surface of the convex portion (depth)
220, 220A ... projection 222: top surface of projection 223 ... long side of projection 225 ... short side of projection
H _t1 ... the height of the protrusion
W _t1 ... Length (width) of the protrusion
D _t1 , D _t1A ... Length of projection (depth)
D _t2 , D _t2A ... Length other than the protrusion (depth)
230 ... Depression 300 ... Second upper mold 312 ... Lower surface of second upper mold S ... Sheet

Claims (7)

A first main surface having electrodes; a second main surface opposite to the first main surface; a first long side surface between the first main surface and the second main surface; and the first length A second long side surface opposite to the side surface, a first short side surface between the first main surface and the second main surface, and a second short side surface opposite to the first short side surface. A step of preparing a light-emitting element including a stacked rectangular parallelepiped structure;
The light-emitting element can be accommodated, and the first recess first long side and the first recess second long side facing the first and second long sides of the light-emitting element respectively, and the first and first long sides of the light-emitting element. A first concave portion provided with a pair of first concave short sides facing the short side surface and a bottom surface; slidable into the first concave portion on the first concave first long side surface; Preparing a lower mold having a slide portion having a height lower than the height of the first recess and a width smaller than the width of the first recess;
A convex portion facing the first concave portion of the lower mold, the same height as the light emitting element, and the same width as the width of the first concave first long side surface or the first concave second long side surface Preparing a first upper mold having a convex portion having a pair of convex long side surfaces and a pair of convex short side surfaces having a width smaller than the width of the first concave short side surface;
The lower mold and the first upper mold are closed so that the side surface of the slide portion is in contact with the first long side surface of the convex portion, and the first light shielding resin material is injected into the first concave portion. A step of molding the first light-shielding resin;

The first upper mold and the lower mold are opened, and a bottom surface and a second concave second long side surface including the first light-shielding resin, a second concave first long side composed of the lower mold, and Forming a second recess comprising a second recess short side surface;
Disposing the light emitting element on the first light-shielding resin so that the first main surface is on the upper side and the first long side surface is opposed to the slide portion;
Closing the lower mold such that the lower surface of the second upper mold faces the electrode;
Sliding the slide portion so as to contact the first long side surface of the light emitting element;
A second light-shielding resin material is injected into the second recess, and the light-emitting element other than the first long side surface is in contact with the first light-shielding resin and the slide part of the first long side surface of the light-emitting element. Forming a second light-shielding resin in contact with the surface and covering the outer periphery of the slide portion;
Opening the lower mold and the second upper mold, and taking out a light emitting device intermediate in which at least a part of the first long side surface of the light emitting element is exposed; and
Forming a translucent member covering the first long side surface of the light emitting element;
Manufacturing method of light-emitting device provided with.   The method for manufacturing a light-emitting device according to claim 1, wherein the convex portion of the first upper mold has a protrusion on a top surface.   The method of manufacturing a light emitting device according to claim 2, wherein the protrusion is in contact with the lower mold.   The method for manufacturing a light emitting device according to claim 1, wherein the convex portion of the first upper mold has a depression on a top surface.   5. The method for manufacturing a light emitting device according to claim 1, wherein the slide portion is provided at a center in a left-right direction of the first long side surface of the first recess.   The light emitting device manufacturing method according to claim 1, wherein the slide portion is provided at a center in a vertical direction of the first concave first long side surface. The method for manufacturing a light emitting device according to claim 1, wherein the second upper mold is in contact with the electrode via a sheet.

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