JP6557131B2 - Splitting device - Google Patents

Description

  The present invention relates to a dividing apparatus that divides a workpiece having a plurality of regions formed on a surface in a lattice shape and having a plurality of regions partitioned by the plurality of scheduled division lines along the plurality of scheduled division lines. .

  In the semiconductor device manufacturing process, circuits such as ICs and LSIs are formed in a large number of regions arranged in a lattice pattern on the surface of a substantially disc-shaped semiconductor wafer, and each region where the circuits are formed is defined on a predetermined street. Individual semiconductor chips are manufactured by cutting along the division lines called. The semiconductor chip thus divided is packaged and widely used in electric devices such as mobile phones and personal computers.

  Electrical devices such as mobile phones and personal computers are required to be lighter and smaller, and a package technology capable of reducing the size of a semiconductor chip package called a chip size package (CSP) has been developed. As one of the CSP technologies, a package technology called Quad Flat Non-lead Package (QFN) has been put into practical use. This package technology called QFN is a method in which a plurality of connection terminals corresponding to the connection terminals of a semiconductor chip are formed and a plurality of electrode plates such as a copper plate are formed in a grid pattern with division lines divided for each semiconductor chip. A semiconductor substrate is arranged in a matrix, and a package substrate is formed by integrating the electrode plate and the semiconductor chip by a resin portion obtained by molding resin from the back side of the semiconductor chip. The package substrate is cut along a division line to divide the package substrate into individually packaged chip size packages (CSP).

  A dividing device that divides the package substrate along the planned division line to divide the package substrate into individually packaged chip size packages (CSPs) has a relief groove that allows the cutting blade of the cutting blade to escape in an area corresponding to the planned division line. Is formed in a lattice shape, and holding tables each provided with suction holes in a plurality of regions partitioned by escape grooves, and a cutting blade that cuts the package substrate sucked and held by the holding table along a planned division line There is known a dividing device including a cutting means provided with a receiving mechanism and a storage mechanism for storing a plurality of chip size packages (CSP) individually divided by the cutting means in a tray (see, for example, Patent Document 1). ).

  Further, a dividing device that divides a workpiece having a plurality of areas divided by a plurality of division lines formed in a lattice shape along the division lines, and corresponding to the plurality of division lines. Workpiece suction holding table having suction holes formed in a plurality of areas partitioned by the escape grooves, and the work held by suction holding by the holding table, while the cutting grooves of the cutting blade are formed in a lattice shape. Cutting means provided with a cutting blade for cutting a previous workpiece, drying means for drying a plurality of chips individually divided by the cutting means, storage means for storing the plurality of dried chips, and drying A chip dropping means for dropping a plurality of chips dried by the means into the accommodating means, and a plurality of chips divided individually by the cutting means It can be, and are also known division device which can be downsized (see, for example, Patent Document 2.).

JP 2001-023936 A JP 2013-0665603 A

  In the dividing apparatus as described above, when the workpiece before processing is divided into individual chips, fragments that could not be removed by dividing processing called so-called burrs remain on the outer periphery of each chip, which deteriorates the appearance of the product. Therefore, there is a problem that the quality is lowered, and conventionally, a method of manually removing the burr from each chip after being accommodated in the tray has been adopted. Further, even if a separate process for removing burrs from each chip after being accommodated in the tray is added to the dividing apparatus, a complicated apparatus configuration must be added to automate the deburring operation. However, there was a problem that the dividing device would be expensive.

  The present invention has been made in view of the above-mentioned facts, and its main technical problem is to add a complicated configuration to the burrs of the chips individually divided by the cutting means without deteriorating the production efficiency. It is an object of the present invention to provide a dividing device that removes the chip without any burrs and securely accommodates the chip from which the burrs have been removed in the accommodating means.

  In order to solve the above-mentioned main technical problem, according to the present invention, there is provided a dividing device for cutting a plate-like object and dividing it into chips, by a cutting means provided with a cutting blade so as to be rotatable, and a relief groove of the cutting blade. A holding means for holding a plate-like object on a holding surface having a plurality of suction areas corresponding to the size of the chip on the surface, and a plate-like object divided into individual chips held by the holding means A conveying means for conveying from the holding means to the unloading drying means, and a plurality of chips dried by the drying means are accommodated in a container, and the chips accommodated in the container are vibrated to remove burrs from the outer periphery of the chips. There is provided a dividing apparatus comprising at least removal means, accommodation means for accommodating the chips from which the burrs have been removed, and residual confirmation means for confirming whether or not chips remain in the burr removal means.

  Further, as the residual confirmation means in the dividing apparatus of the present invention, the residual of the chip is confirmed by a laser sensor, the residual of the chip is confirmed by an imaging camera, and the chip after removal of burrs to be accommodated in the weight of the accommodation means By comparing the predetermined weight plus the weight with the weight of the housing means actually measured by the weight measuring device that measures the weight of the housing means, the residue of the chip in the burr removing means is confirmed, etc. It is possible to appropriately select from these means.

  Further, the burr removing means in the dividing apparatus of the present invention promotes the movement of the chip to the accommodating means by ultrasonic vibration as the residual chip eliminating means, and promotes the movement of the chip to the accommodating means by air blow. Etc. can be provided. Furthermore, it is preferable that the residual confirmation means is configured to operate in units of lots of plate-like objects.

  The dividing apparatus according to the present invention is configured as described above, and transports a plate-like object divided into individual chips from the holding means to the drying means, and a plurality of chips dried by the drying means. A burr removing means for removing the burr from the outer periphery of the chip by vibrating the chip accommodated in the container and removing the burr from the outer periphery of the chip; a housing means for accommodating the chip from which the burr has been removed; Since it is composed at least of a residue confirmation means for confirming whether there is any residue, it is possible to remove burrs without relying on the operator's manual work or the like in a dividing device that cuts a plate-like member and divides it into chips. In addition, it is possible to monitor the chips remaining on the deburring means by moving the remaining chips to the receiving container and transfer them to the next process by improving the productivity. It can be.

The perspective view and sectional drawing of the package board | substrate as a to-be-processed object in the dividing device comprised by this invention. The perspective view of the dividing device comprised by this invention. The perspective view of the holding table with which the dividing device shown in FIG. 2 is equipped. The perspective view of the lower surface drying means with which the dividing apparatus shown in FIG. 2 is equipped. Sectional drawing of the lower surface drying means shown in FIG. The perspective view of the burr | flash removal means with which the dividing apparatus shown in FIG. 2 is equipped. The perspective view which looked at the suction holding pad which comprises the workpiece conveyance means with which the dividing apparatus shown in FIG. The block diagram of the control means with which the division | segmentation apparatus shown in FIG. 2 is equipped. FIG. 4 is a perspective view showing a state in which the package substrate is sucked and held on the holding table shown in FIG. 3. Explanatory drawing of the cutting process implemented by the dividing apparatus shown in FIG. FIG. 3 is an explanatory view showing a state in which individual divided chips sucked and held by a suction holding pad constituting the workpiece conveying means installed in the dividing apparatus shown in FIG. 2 are positioned on the drying table of the lower surface drying means. The figure which shows the state which accommodates the chip | tip divided | segmented separately with respect to the burr | flash removal means shown in FIG. 6 via a chip | tip dropping member. Explanatory drawing for demonstrating the operation | movement for operating the burr | flash removal means shown in FIG. 6, and deburring the accommodated chip | tip. Explanatory drawing explaining the state accommodated in a storage container, after the deburring operation | movement of the chip | tip by the deburring means shown in FIG. 13 is completed. Explanatory drawing which shows embodiment different from embodiment shown in FIG.

  Hereinafter, a preferred embodiment of a dividing apparatus constructed according to the present invention will be described in more detail with reference to the accompanying drawings.

  1A and 1B show a perspective view and a cross-sectional view of a package substrate as a workpiece. A package substrate 1 shown in FIGS. 1A and 1B includes an electrode plate 11, a plurality of first division lines 111 extending in a predetermined direction on a surface 11 a of the electrode plate 11, and the first Second division planned lines 112 extending in a direction orthogonal to the planned division lines 111 are formed in a lattice shape. A chip size package (CSP) 113 is arranged in each of a plurality of regions partitioned by the first planned division line 111 and the second planned division line 112, and this chip size package (CSP) 113 is arranged on the electrode plate 11. Molded by the synthetic resin portion 12 from the back side. The package substrate 1 formed in this way is divided into chip size packages (CSP) 113 which are cut along the first planned dividing line 111 and the second planned divided line 112 and individually packaged.

FIG. 2 is a perspective view of a dividing apparatus configured according to the present invention for cutting the package substrate 1 along the first planned dividing line 111 and the second planned dividing line 112.
The dividing apparatus shown in FIG. 2 includes an apparatus housing 2. A workpiece holding mechanism 3 for holding the workpiece and a cutting means 4 for cutting the workpiece held by the workpiece holding mechanism 3 are disposed at the center of the apparatus housing 2. ing. The workpiece holding mechanism 3 includes a holding table 31 that holds the package substrate 1 by suction and holding table support means 32 that supports the holding table 31. As shown in FIG. 3, the holding table 31 is formed in a rectangular shape, and a suction holding portion 310 that sucks and holds the package substrate 1 is provided at the center of the surface. On the upper surface (holding surface) of the suction holding unit 310, a relief groove for letting off a cutting blade of a cutting blade described later in a region corresponding to the first division planned line 111 and the second division planned line 112 formed on the package substrate 1. 311 and 312 are formed in a lattice shape. In addition, suction holes 313 are formed in the suction holding unit 310 in a plurality of regions partitioned by the first scheduled division line 111 and the second scheduled division line 112, and the suction holes 313 are not shown. Communicated with the means.

  Returning to FIG. 2, the description will be continued. The holding table support means 32 constituting the workpiece holding mechanism 3 rotates the holding table 31 around an axis perpendicular to the holding surface which is the upper surface (not shown). Means. The holding table support means 32 configured as described above is configured so that the holding table 31 can be moved between a loading / unloading area for loading and unloading the workpiece shown in FIG. The X-axis direction moving means does not move in the machining feed direction (X-axis direction) indicated by the arrow X.

  The cutting means 4 includes a spindle housing 41 disposed along an index feed direction (Y-axis direction) indicated by an arrow Y orthogonal to the X-axis direction, and a rotating spindle 42 rotatably supported by the spindle housing 41. A cutting blade 43 attached to the tip of the rotary spindle 42 and cutting water supply nozzles 44 disposed on both sides of the cutting blade 43 are provided. The spindle housing 41 is configured to be moved along the Y-axis direction by a Y-axis direction moving means (not shown). The rotary spindle 42 is driven to rotate by a drive source such as a servo motor (not shown). In the illustrated embodiment, the cutting blade 43 is an electroformed blade in which diamond abrasive grains are hardened by nickel plating on a blade base formed of aluminum in a disk shape. The cutting water supply nozzle 44 is connected to a cutting water supply means (not shown), and supplies the cutting water to the cutting portion by the cutting blade 43.

  Between the processing area by the cutting means 4 and the carry-in / out area, an upper surface cleaning means 5 for cleaning the upper surface of the workpiece that has been cut in the processing area and divided into individual chips is disposed. ing. The upper surface cleaning means 5 is disposed on the upper side of the movement path of the holding table 31 constituting the workpiece holding mechanism 3, and holds the workpiece that is held on the holding table 31 and cut by the cutting means 4. Spray cleaning water on top.

  On one side of the workpiece holding mechanism 3 in the Y-axis direction, there is provided a cassette placement area 6a for placing a cassette that accommodates a workpiece to be processed before the cassette placement area 6a. A cassette table 60 that is moved up and down by a lifting means (not shown) is provided. On the cassette table 60, a cassette 6 in which a plurality of the package substrates 1 as workpieces are accommodated is placed. On the front side of the cassette placement area 6a, the package substrate 1 accommodated in the cassette 6 is temporarily placed and temporarily placed, and the package substrate 1 accommodated in the cassette 6 is carried out to the temporary placement means 7. A workpiece unloading means 8 is disposed.

  Between the temporary placement means 7 and the loading / unloading area, the package substrate 1, which is a workpiece before being processed and aligned with the temporary placement means 7, is positioned in the loading / unloading area. A workpiece carry-in means 9 for conveying onto a holding surface which is the upper surface of a holding table 31 constituting the workpiece holding mechanism 3 is provided. The workpiece carrying means 9 includes a suction holding pad 91 for sucking and holding the upper surface of the package substrate 1, an air cylinder mechanism 92 for supporting the suction holding pad 91 and moving the suction holding pad 91 in the vertical direction, and the air The working arm 93 supports the cylinder mechanism 92 and moving means (not shown) for moving the working arm 93 in the Y-axis direction.

  The dividing apparatus in the illustrated embodiment processes the package substrate 1 which is a workpiece held on a holding table 31 mounted on the air cylinder mechanism 92 of the workpiece loading means 9 and positioned in the loading / unloading area. An imaging means 12 for detecting a region to be detected is provided. The image pickup means 12 is composed of optical means such as a microscope and a CCD camera, and sends the picked up image signal to a control means described later.

  On the other side of the workpiece holding mechanism 3 in the Y-axis direction, lower surface cleaning means 13 for cleaning the lower surface of the processed workpiece that has been cut in the processing region and divided into individual chips is arranged. It is installed. The lower surface cleaning unit 13 includes a cleaning roller 131 made of a sponge or the like configured to be rotatable, and a cleaning water supply unit (not shown) that supplies cleaning water to the cleaning roller 131.

  Further, the dividing apparatus in the illustrated embodiment includes a lower surface drying means 14 that is disposed adjacent to the lower surface cleaning means 13 and that dries the lower surface of the processed workpiece divided into individual chips. The bottom surface drying means 14 includes a drying table 141 as shown in FIGS. The drying table 141 includes a rectangular table main body 142 and a suction holding member 143 disposed on the upper surface of the table main body 142. The table body 142 is formed of a metal plate, and has a suction portion 142a formed of a rectangular shallow recess on the upper surface. The suction portion 142a includes a plurality of chip size packages (CSP) 113 of the package substrate 1 and A suction passage 142b is formed in each of a plurality of corresponding regions. The suction holding member 143 is formed in a size corresponding to the suction portion 142a formed of a shallow concave portion formed in the table main body 142 by heat-resistant fluorine-based rubber, and is fitted into the suction portion 142a. In the suction holding member 143 formed in this way, suction holes 143a are formed in a plurality of regions corresponding to the plurality of chip size packages (CSPs) 113 of the package substrate 1, and the suction holes 143a are formed in the table. The suction passage 142b formed in the main body 142 communicates. In addition, as the heat-resistant fluorine-based rubber forming the suction holding member 143, “Zarak” manufactured and sold by DuPont can be used.

  A suction chamber forming member 144 for forming a suction chamber communicating with the suction passage 142b is mounted on the lower surface of the table main body 142 constituting the drying table 141. The suction chamber forming member 144 is formed in a rectangular shape by a metal plate, and a recess 144a is provided on the upper surface. A suction chamber 144b in which the suction passage 142b communicates with the recess 144a and the lower surface of the table body 142 is formed. The suction chamber forming member 144 is formed with a communication path 144c that opens to the recess 144a. The communication path 144c communicates with a suction means (not shown). A heater 145 as a heating unit is disposed below the suction chamber forming member 144 configured as described above.

  Returning to FIG. 2 and continuing the description, the dividing apparatus in the illustrated embodiment accommodates a plurality of chips that are arranged adjacent to the lower surface drying means 14 and are divided individually, and a plurality of chips are vibrated to vibrate. A burr removing unit 15 for removing burrs remaining on the outer periphery of the chip, a chip dropping member 19, and a chip storage container 156 as a storage unit are provided. The chip dropping member 19 includes an opening 19a that is opened above the burr removing means 15 and adjacent to the lower surface drying means 14, and the chip dropping member 19 is formed in a funnel shape downward from the opening 19a. Has been. A deburring container 152 of the deburring unit 15 is disposed below the chip dropping member 19 configured as described above. Further, below the deburring container 152, a chip storage container 156 (accommodating means) for storing a plurality of chips after removal of the burr is disposed. As shown in FIG. The burr removing means 15 is provided so that it can be taken in and out from the front wall of the apparatus housing 2.

  The burr removing means 15 will be further described with reference to FIG. The deburring container 152 of the deburring means 15 is formed in a cylindrical shape opened in the vertical direction, and the vertical opening is formed by an upper closing member 154 and a lower closing member 155 supported by the opening / closing arms 154b and 155b. It can be opened and closed. The flat portions 154a and 155a of the upper closing member 154 and the lower closing member 155 are formed in a mesh shape so that outside air can be taken in from the outside. As will be described later, in the deburring container 152, an exhaust port 152a communicated with the exhaust duct 158 is provided (see FIG. 12), and is disposed on the exhaust duct 158 as described in FIG. By operating the exhaust fan 18, the air taken in from the upper and lower closing members 154 and 155 is discharged to the outside of the clean room through the exhaust port 152 a and the exhaust duct 158. The roughness of the mesh of the upper and lower closing members is set to be small so that the individually divided chips accommodated in the deburring container 152 do not spill out from the gap of the mesh. The deburring container 152 is supported by the deburring container swinging means 151 via the support case 153. As will be described later, the deburring container 152 and the support case 153 are disposed inside the deburring container swinging means 151. It is connected to the stored swing mechanism through a long hole 157, and is configured such that its angle periodically changes with respect to the vertical direction while reciprocating in the vertical direction along the long hole 157, The operation is continuously applied to the deburring container, and the plurality of chips housed in the deburring container 152 are vibrated to remove the burrs from the chips.

  Continuing the description with reference to FIG. 2, the dividing apparatus in the illustrated embodiment dries the upper surface of the processed workpiece divided into the individual chips placed on the lower surface drying means 14 and lowers the lower surface. An upper surface drying means / chip dropping means 16 for dropping a plurality of chips placed on the drying means 14 and whose upper and lower surfaces are dried into the opening 19a of the chip dropping member 19 is provided. The upper surface drying means / chip dropping means 16 supports the warm air blowing nozzle 161 for blowing warm air, the tip dropping brush 162 attached to the hot air blowing nozzle 161 and protruding downward, and the hot air blowing nozzle 161. It comprises an air cylinder mechanism 163 that moves the air blowing nozzle 161 in the vertical direction, an operating arm 164 that supports the air cylinder mechanism 163, and a moving means (not shown) that moves the operating arm 164 in the Y-axis direction.

  In the illustrated embodiment, the dividing apparatus is configured to process a processed workpiece divided into individual chips placed on a holding table 31 constituting the workpiece holding mechanism 3 positioned in the carry-in / out region. A workpiece conveying means 17 for conveying to the lower surface drying means 14 via the lower surface cleaning means 13 is provided. The workpiece conveying means 17 supports a suction holding pad 171 for sucking and holding the upper surface of the processed workpiece divided into individual chips placed on the holding table 31, and the suction holding pad 171. And an air cylinder mechanism 172 that moves the suction holding pad 171 in the vertical direction, an operating arm 173 that supports the air cylinder mechanism 172, and a moving means (not shown) that moves the operating arm 173 in the Y-axis direction. . As shown in FIG. 7, suction holes 171b are formed in a plurality of regions corresponding to the plurality of chip size packages (CSPs) 113 of the package substrate 1 on the suction holding surface 171a, which is the lower surface, in the suction holding pad 171. The suction hole 171b communicates with a suction means (not shown).

  The dividing apparatus in the illustrated embodiment includes the control means 20 shown in FIG. The control means 20 is configured by a computer, and a central processing unit (CPU) 201 that performs arithmetic processing according to a control program, a read-only memory (ROM) 202 that stores control programs and the like, and a read / write that stores arithmetic results and the like. A random access memory (RAM) 203, an input interface 204, and an output interface 205 are provided. To the input interface 204 of the control means 20 configured in this way, detection signals from the imaging means 12, a laser sensor 200, which will be described later, a weight measuring instrument 220 for the container, and the like are input. From the output interface 205 of the control means 20, the workpiece holding mechanism 3, the cutting means 4, the upper surface cleaning means 5, the workpiece unloading means 8, the workpiece loading means 9, the lower surface cleaning means 13, and the lower surface drying. Control signals are output to the means 14, the burr removing means 15, the upper surface drying means / chip dropping means 16, the workpiece conveying means 17, the exhaust fan 18, the air blow generator 210, the ultrasonic vibration generator 230, which will be described later, and the like.

The dividing apparatus in the illustrated embodiment is configured as described above, and the operation thereof will be described below.
The package substrate 1 accommodated in the cassette 6 is unloaded onto the temporary placement means 7, and the workpiece unloading means 8 and the workpiece unloading means 9 are actuated to be positioned in the loading / unloading area. The workpiece holding mechanism 3 is conveyed onto the holding surface of the suction holding unit 310 of the holding table 31 (workpiece loading step). The image signal input to the control means 20 is obtained by operating the image pickup means 12 to pick up the relief groove on the holding surface, which is the upper surface of the suction holding portion 310 of the holding table 31, before performing the workpiece carrying-in step. Based on the above, the positions of the escape grooves 311 and 312 formed on the holding surface which is the upper surface of the suction holding unit 310 are obtained (relief groove detecting step), and the xy coordinate values are stored in the random access memory (RAM) 203.

  If the workpiece carrying-in process described above is performed, the first division planned line 111 and the second division planned of the package substrate 1 placed on the holding surface of the holding table 31 using the imaging means 12. The line 112 is imaged, and the captured image signal is input to the control means 20 (division planned line detection step). Then, the control unit 20 positions the escape grooves 311 and 312 formed on the holding surface which is the upper surface of the holding unit 310 of the suction holding table 31 and the first formed on the package substrate 1 placed on the holding table 31. The amount of deviation between the division planned line 111 and the position of the second division planned line 112 is obtained (deviation amount detection step), and the control means 20 uses the amount of deviation obtained in the deviation amount detection step as a random access memory (RAM) 203. To store.

  If the above-described deviation amount detection step is performed, the upper surface of the package substrate 1 is sucked and held by the suction holding pad 91 and is retreated upward from the holding surface of the holding table 31. Next, the control unit 20 controls a rotation driving unit (not shown) that rotates the holding table support unit 32 and controls the movement of the holding table 31 in the X-axis direction and the Y-axis direction so that the position of the holding table 31 is shifted. Position at the position corrected by the amount. Next, the control means 20 remounts the package substrate 1 sucked and held by the suction holding pad 91 on the holding surface of the holding table 31 (workpiece replacement step). As a result, the escape grooves 311 and 312 formed on the holding surface coincide with the first scheduled division line 111 and the second scheduled division line 112 formed on the package substrate 1. When the workpiece repositioning step is performed in this way, the package substrate 1 is placed on the holding surface, which is the upper surface of the holding portion 310 of the holding table 31, by operating a suction means (not shown). Suction hold.

  As described above, the escape groove 2 formed on the holding surface of the holding table 31 and the holding table 31 by performing the escape groove detecting step, the division planned line detecting step, the shift amount detecting step, and the workpiece repositioning step. When the division planned lines formed on the upper package substrate 1 are made to coincide with each other and the package substrate 1 is sucked and held on the holding surface of the holding table 31, the imaging means 12 is placed on the package substrate 1 held on the holding table 31. Position. Next, the control unit 20 operates the imaging unit 12 to image the first and second division planned lines 111 and 112 formed on the package substrate 1, and the first division planned line 111 and the second division planned An alignment operation for confirming and adjusting whether or not the line 112 is parallel to the X-axis direction and the Y-axis direction is performed (alignment process).

  When the alignment process is performed as described above, the holding table 31 is moved to the machining area, and one end of the first scheduled dividing line 111 is slightly below the cutting blade 43 as shown in FIG. To the right. Next, the cutting blade 43 is cut and fed in a direction indicated by an arrow Z1 while supplying cutting water from a cutting water supply nozzle 44 (see FIG. 2) from a retracted position indicated by a two-dot chain line. Then, the X-axis direction moving means (not shown) is operated to move the holding table 31 in the direction indicated by the arrow X1 at a predetermined cutting feed speed, and the other end of the first scheduled dividing line 111 formed on the package substrate 1 is When it reaches the left side slightly below the cutting blade 43 (see FIG. 10B), the movement of the holding table 31 is stopped and the cutting blade 43 is moved to the retracted position indicated by the two-dot chain line in the direction indicated by the arrow Z2. Raise. Then, the above-described cutting is repeated for all the first division lines 111 to be cut, and the package substrate 1 is cut along the first division lines 111 (cutting process).

  If the above-described cutting process is performed along all the first division planned lines 111 formed in the package substrate 1 in a predetermined direction, the holding table 31 is rotated by 90 degrees, and the holding table 31 is moved to the predetermined direction. The above-described cutting process is performed along all the second division planned lines 112 formed in the orthogonal direction. As a result, the package substrate 1 is divided into individually packaged chip size packages (CSP) 113. When the cutting process is performed, the holding table 31 holding the package substrate 1 is moved from the processing area toward the carry-in / out area. At this time, the upper surface cleaning means 5 disposed on the upper side of the moving path of the holding table 31 is operated, and the package substrate 1 divided into individual chip size packages (CSP) 113 held on the holding table 31 is operated. The upper surface is cleaned (upper surface cleaning step).

  When the holding table 31 reaches the loading / unloading area shown in FIG. 2 while performing the upper surface cleaning step, the movement of the holding table 31 is stopped and the package divided into individual chip size packages (CSP) 113. The suction holding of the substrate 1 is released.

  Next, the suction holding pad 171 shown in FIG. 7 of the workpiece conveying means 17 is positioned immediately above the divided package substrate 1 and the air cylinder mechanism 172 is operated to divide the suction holding surface 171a. The chip size package (CSP) 113 that is divided and brought into contact with the upper surface is sucked and held by the action of the suction holes 171b (chip suction holding process).

  When the above-described chip suction and holding process is performed, the control unit 20 positions the individually divided chip size package (CSP) 113 directly above the lower surface cleaning unit 13 and operates the air cylinder mechanism 172 to perform the suction holding pad. 171 is lowered and brought into contact with the cleaning roller 131. At this time, the lower surface cleaning means 13 rotates the cleaning roller 131 and supplies cleaning water. As a result, the lower surface of the individually divided chip size package (CSP) 113 sucked and held by the suction holding pad 171 is cleaned (lower surface cleaning step).

  When the lower surface cleaning process is performed as described above, the control unit 20 operates the workpiece transfer unit 17 and the chip size package (CSP) 113 sucked and held by the suction holding pad 171 as shown in FIG. Is positioned on the upper surface of a suction holding member 143 made of fluorine-based rubber constituting the drying table 141 of the lower surface drying means 14, and the suction means (not shown) of the lower surface drying means 14 is operated and suction holding by the suction holding pad 171 is released. . As a result, from a suction means (not shown) through the communication passage 144c formed in the suction chamber forming member 144, the suction chamber 144b, the suction passage 142b formed in the table body 142, and the suction hole 143a formed in the suction holding member 143. Negative pressure acts on the lower surface of the individually divided chip size package (CSP) 113, and the individually divided chip size package (CSP) 113 is sucked and held on the upper surface of the suction holding member 143. Further, when the heater 145 of the lower surface drying means 14 is energized (ON), the lower surface of the divided chip size package (CSP) 113 is heated and dried.

  At the same time, the control unit 20 operates the upper surface drying unit / chip dropping unit 16 to eject hot air from the hot air ejection nozzle 161 and to reciprocate in the range of the chip size package (CSP) 113. Conduct multiple times. As a result, the lower surface and upper surface of the chip size package (CSP) 113 placed on the upper surface of the lower surface drying means 14 and individually divided are dried (chip drying process).

  If the above-described chip drying process is performed, the suction holding of the chip size package (CSP) 113 is released. Next, the control unit 20 operates a moving unit (not shown) of the upper surface drying unit / chip dropping unit 16 to move the chip dropping brush 162 mounted on the hot air jet nozzle 161 between the lower surface cleaning unit 13 and the lower surface drying unit 14. And the air cylinder mechanism 163 is operated to position the tip of the tip dropping brush 162 at a position in contact with the upper surface of the suction holding member 143 constituting the drying table 141. Then, the control unit 20 operates a moving unit (not shown) of the upper surface drying unit / chip dropping unit 16 to move the chip dropping brush 162 toward the opening 19 a of the chip dropping member 19. At this time, as shown in FIG. 12, the upper closing member 154 of the deburring container 15 is opened by the output signal of the control means 20, and as a result, the chip size placed on the upper surface of the lower surface drying means 14 The package (CSP) 113 is accommodated in the deburring container 152 through the opening 19a. At this time, the suction holding member 143 on which the individually divided chip size package (CSP) 113 is placed is made of heat-resistant fluorine-based rubber and has a low coefficient of friction. CSP) 113 can be moved smoothly. The burr removing means 15 is housed inside the apparatus housing 2 as described above, but the apparatus housing 2 is omitted in FIGS. 6 and 12 to 15 for convenience of explanation.

  As described above, when the individually divided chip size package (CSP) 113 is accommodated in the deburring container 152 through the chip dropping member 19, the control means 20 activates the opening / closing arm 154b, and the deburring container 15 upper openings are closed by an upper closing member 154. When the upper opening of the deburring container 15 is closed by the upper closing member 154, the control means 20 causes the deburring process to vibrate the chip size package (CSP) 113 accommodated in the deburring container 152. . Hereinafter, the deburring process of the present invention will be described in more detail.

  Prior to the deburring process performed by the control means 20, the exhaust fan 18 installed on the exhaust duct 158 shown in FIG. As shown in FIG. 12, the deburring container 152 is provided with an exhaust port 152a, and the outside air taken into the deburring container 152 from the flat portions 154a and 155a of the upper and lower closing members 154 and 155, It is discharged from the exhaust port 152 a of the deburring container 152, introduced into the exhaust duct 158 via the support case 153 supporting the deburring container 152 and the deburring container swinging means 151, and via the exhaust fan 18. It is discharged outside the clean room. A filter (not shown) may be disposed on the exhaust duct 158.

  After the exhaust fan 18 is actuated, the deburring container swinging means 151 is actuated by the control means 20. More specifically, as shown in FIGS. 13A and 13B, the support member 153 that supports the deburring container 152 is reciprocated up and down along the elongated hole 157 by a driving means (not shown). . Simultaneously with the reciprocating motion, the support case 153 rotates about 30 degrees clockwise around the central axis (P in the figure) in accordance with the lowering operation and about 30 degrees counterclockwise along with the ascent. Operated to do. Such reciprocation while rotating up and down is repeated about 100 times per minute, and stopped after one minute of operation. By such an operation, the plurality of chip size packages (CSP) 113 accommodated in the deburring container 152 are vibrated and rubbed with each other to remove burrs remaining in each chip size package (CSP) 113. .

  During the swinging operation, since the outside air is strongly sucked through the upper and lower closing members 154 and 155 of the deburring container 152 by the action of the exhaust fan 18, the fine air separated from the chip size package (CSP) 113 is removed. The burr is sucked out from the exhaust port 152a together with the outside air introduced from the upper and lower closing members 154 and 155, and passes through the inside of the support case 153 and the deburring container swinging means 151 to the exhaust duct 158 side. It is discharged and captured by a filter on an exhaust duct 158 (not shown).

  After the operation of the container swinging means 151 is stopped and burrs are removed from the individual chip size package (CSP) 113 by this operation, the operation of the exhaust fan 18 is stopped. Furthermore, after the exhaust fan 18 stops, as shown in FIG. 14, the lower closing member 155 of the deburring container 152 is opened by operating the opening / closing arm 155b. When the lower closing member 155 is opened, the lower side of the deburring container 152 is released, and the chip size package (CSP) is accommodated in the chip accommodating container 156 constituting the accommodating means positioned below the deburring container 152. The

  Here, in this embodiment, as shown in FIG. 14, a chip size package in which burrs are removed from the inside of the deburring container 152 from below the deburring container 152 constituting the deburring means 15 ( CSP) 113 as a residual confirmation means for confirming whether or not it remains, and high-pressure air is jetted into the deburring container 152 formed integrally with the laser sensor 200, and the deburring container By removing the chip size package (CSP) 113 that remains attached inside 152, an air blow unit 210 as a residual chip elimination unit that drops into a chip receiving container 156 located below is disposed so as to be able to advance and retreat. ing. The laser sensor 200 and the air blowing means 210 are normally retracted to a position adjacent to the deburring container 152 so as not to disturb the rotational movement of the chip storage container 156 for removing burrs. ing.

  After the burr is removed from each chip size package (CSP) 113 by the operation of the container swinging means 151, the lower closing member 155 of the deburring container 152 is opened by operating the opening / closing arm 155b. The retracted laser sensor 200 and air blow means 210 are positioned below the deburring container 152 as shown in FIG.

  Here, the laser sensor 200 disposed at the tip of the air blowing unit 210 functioning as a residual confirmation unit includes, for example, a He-Ne laser oscillator (633 nm) and a light receiving unit (not shown). The laser beam oscillated from the oscillator is configured to scan the entire inner surface from below the deburring container 152 by a galvanometer mirror (not shown) disposed at the irradiation port of the laser sensor 200. And the scattered light at the time of irradiating this laser beam with this light-receiving part is measured, and this measurement signal is sent to this control means 20. The measurement signal indicates a pre-stored characteristic when the chip after deburring does not remain in the deburring container 152 at all, or the chip remains on the inner wall of the deburring container 152 or the like. Whether or not the chip remains in the deburring container 152 can be confirmed depending on whether the characteristics including scattered light are exhibited.

  When it is determined by the control program stored in the control means 20 that the deburred chips remain in the deburring container 152, the control means 20 drives the air blowing means. A signal is output, and high-pressure air is supplied from a high-pressure air supply source (not shown) to inject high-pressure air into the deburring container 152 to eliminate the remaining chips. As a result, the chips remaining in the deburring container 152 or the like are detached and moved to the chip storage container 156 positioned below. The control may be terminated as it is after executing the residual chip eliminating means. However, after supplying the high-pressure air, the residual confirmation means is executed again, and it is determined that no chip remains. Until then, the residual chip elimination means may be repeatedly executed.

  In the present embodiment, the residual confirmation unit and the residual chip eliminating unit are executed for each lot of the plate-like object that is the workpiece, but are executed for each plate-like object that is the minimum unit of the workpiece. You may make it do.

  The residual confirmation means and residual chip elimination means in the present invention are not limited to the above-described embodiments. For example, an imaging camera can be installed in place of the laser sensor 200. In that case, after carrying out the work of storing the deburred chips in the chip storage container 156, the inside of the deburring container 152 is imaged by the imaging camera and displayed on the operation monitor M shown in FIG. It can be checked by the operator of the dividing device whether chips remain. At that time, if it is confirmed that chips remain in the deburring container 152, the remaining chip eliminating means is executed according to the instruction of the operator.

  Moreover, as another embodiment, it can also be set as a structure as shown in FIG. That is, a weight measuring device 220 that measures the weight of the chip container 156 is provided, and a predetermined weight obtained by adding the weight of all chips obtained by processing one lot of plate-like material to the weight of the chip container 156; By comparing the actually measured weight of the chip storage container 156, it is possible to confirm the remaining chip in the burr removing means. When the actually measured weight is lighter than the predetermined weight, it is assumed that the chip is attached to the deburring container, and therefore the residual chip eliminating means is executed. In the embodiment shown in FIG. 15, an ultrasonic vibration applying unit 230 that applies vibration to the deburring container 152 is provided as the residual chip eliminating unit, and deburring is performed by a drive signal from the control unit 20. Vibration is applied to the container 152, for example, the chip after deburring attached to the inner wall of the deburring container 152 can be shaken off and moved to the chip storage container.

  The chip container 156 can be pulled out from the front side of the apparatus housing 2 as shown in FIGS. 2 and 14, and the chip size package (CSP) 113 that has undergone the deburring process can be easily obtained. It can be taken out from the inside of the apparatus. Therefore, the chip size package (CSP) 113 that has finished the cutting and deburring process is accommodated in the chip accommodating container 156 and is carried to the next process.

  Note that the residual confirmation unit and the residual chip elimination unit based on the present invention are not limited to the above-described embodiment, and the combination can be changed as appropriate. For example, it is possible to provide the laser sensor 200 as the residual confirmation means and to combine the ultrasonic vibration applying means 230 as the residual chip elimination means, which can be appropriately modified within the technical scope specified by the present invention. .

1: Package substrate 2: Device housing 3: Workpiece holding mechanism 31: Holding table 4: Cutting means 43: Cutting blade 5: Upper surface cleaning means 6: Cassette 6a: Cassette placement area 7: Temporary placing means 8: Workpiece Object conveying means 9: Workpiece carrying means 12: Imaging means 13: Lower surface cleaning means 14: Lower surface drying means 15: Deburring means 151: Container swinging means 152: Deburring container 156: Chip container (accommodating means)
16: Upper surface drying means / chip dropping means 17: Workpiece conveying means 19: Chip dropping member 20: Control means 200: Laser sensor 210: Air blow means 220: Weight measuring device 230: Ultrasonic vibration applying means

Claims (7)

A dividing device for cutting a plate-like object and dividing it into chips,
A cutting means having a cutting blade rotatably;
A holding means for holding a plate-like object on a holding surface having a plurality of suction areas corresponding to the size of the chip, which is partitioned by a relief groove of the cutting blade, on the surface;
Conveying means for conveying the plate-like material divided into individual chips held by the holding means from the holding means to the drying means;
A plurality of chips dried by the drying means are housed in a container, and the chips housed in the container are vibrated to remove burrs from the outer periphery of the chips;
Storage means for storing the chip from which the burr has been removed;
A residue confirmation means for confirming whether or not the chip remains in the burr removing means;
A dividing device composed of at least.   The dividing device according to claim 1, wherein the residual confirmation unit confirms the residual of the chip by a laser sensor.   The dividing device according to claim 1, wherein the residual confirmation unit confirms the residual of the chip with an imaging camera.   The residual confirmation means includes at least a weight measuring device for measuring the weight of the accommodating means for accommodating the chip from which the burr has been removed, and the weight of the chip after removing the burr to be accommodated is added to the weight of the accommodating means. The dividing device according to claim 1, wherein a residue of chips in the burr removing unit is confirmed by comparing a predetermined weight with the actually measured weight of the containing unit.   5. The dividing device according to claim 1, wherein the burr removing unit includes a residual chip eliminating unit that promotes movement of the chip to the housing unit by ultrasonic vibration.   The dividing device according to any one of claims 1 to 4, wherein the burr removing unit includes a residual chip eliminating unit that promotes movement of the chip to the housing unit by air blowing.   7. The dividing apparatus according to claim 1, wherein the residual confirmation means operates in units of lots of plate-like objects.