JP6342659B2 - Splitting device - Google Patents

Description

  The present invention relates to a dividing device that divides a plate-like workpiece into a plurality of chips.

  A ceramic capacitor substrate formed by alternately laminating metal foils and insulators is divided into individual chip capacitors by a dividing device and widely used in electric devices such as mobile phones and personal computers.

  As a dividing device for dividing a ceramic capacitor substrate into individual chip capacitors, a cutting device having a cutting blade is generally used (see, for example, Patent Document 1).

  Moreover, as a dividing method for dividing the ceramic capacitor substrate into individual chip capacitors, a laser beam having a wavelength that absorbs the ceramic capacitor substrate is irradiated along the planned dividing line, and the ceramic capacitor substrate is divided along the planned dividing line. Attempts have also been made to cut.

JP 2003-142334 A

Thus, when the ceramic capacitor substrate is sintered at a predetermined temperature, it becomes hard. When the ceramic capacitor substrate is cut by the cutting blade, the cutting blade is severely consumed and may be damaged, resulting in poor productivity. There's a problem.
Further, when the ceramic capacitor substrate is irradiated with a laser beam and divided into individual chip capacitors, there is a problem that the melt (dross) adheres to the side surface of the chip capacitor and deteriorates the quality.
Furthermore, since the ceramic capacitor substrate is supported by a support member such as a holding substrate or tape in order to facilitate handling such as transportation even after the ceramic capacitor substrate is divided into individual chip capacitors, the support member is not attached. There is a problem that the steps of attaching and peeling are necessary and productivity is poor.

  The present invention has been made in view of the above-mentioned facts, and a main technical problem thereof is a dividing apparatus capable of efficiently dividing a plate-like workpiece including a ceramic capacitor substrate without deteriorating the quality of a chip. Is to provide.

In order to solve the main technical problem, according to the present invention, a dividing device for dividing a plate-like workpiece into a plurality of chips,
A cassette mounting region for placing a cassette accommodating a workpiece before processing,
Temporary placement means for temporarily placing the workpiece before processing;
A workpiece unloading means for unloading the unprocessed workpiece housed in the cassette placed in the cassette placement area to the temporary placing means;
A holding table for sucking and holding a workpiece before processing;
A moving means for moving the holding table to a loading / unloading area for loading and unloading a workpiece and a machining area;
A workpiece carry-in means for carrying the workpiece before being carried to the temporary placement means to the holding table positioned in the carry-in / out region;
A laser beam irradiating means for irradiating a workpiece before processing disposed in the processing region and sucked and held by the holding table to form a split groove serving as a break starting point to be divided into chips on the workpiece;
A splitting means for applying an external force to the workpiece on which the split groove serving as a fracture starting point is formed, and splitting the workpiece into a plurality of chips along the split groove;
Chip dropping means for dropping a plurality of chips, which are separated by the dividing means and not supported by the support member , into the housing means ,
The dividing means includes a workpiece placing member for placing a workpiece formed of a flexible member, and a pressing roller for pressing the workpiece placed on the workpiece placing member. A dividing device is provided.

The splitting device according to the present invention is configured as described above, and a laser beam is applied to a workpiece by a laser beam irradiation means to form a split groove that is a starting point of fracture to be split into chips. Unlike the dividing method, productivity is not reduced due to wear and breakage of the cutting blade.
Further, the laser processing by the laser beam irradiating means forms a dividing groove as a starting point of the fracture to be divided into chips in the workpiece, so that no melt (dross) is attached to the side wall of the chip.
Further, the workpiece formed with the dividing groove to be the starting point of the fracture to be divided into the chips is divided into individual chips by the dividing means and then separated into a state where it is not supported by the support member. Therefore, it is not necessary to support the workpiece on a supporting member such as a holding substrate or a tape, and the steps of attaching and peeling the supporting member become unnecessary, and the productivity is improved.

The perspective view of the dividing device comprised by this invention. The perspective view of the chip | tip drop member and chip | tip container which comprise the bulk accommodation means with which the division | segmentation apparatus shown in FIG. 1 is equipped. The block block diagram of the control means with which the division | segmentation apparatus shown in FIG. 1 is equipped. Explanatory drawing of the laser processing process implemented by the dividing apparatus shown in FIG. The perspective view of the ceramic capacitor board | substrate as a plate-shaped workpiece.

  Preferred embodiments of a dividing device configured according to the present invention will be described below in further detail with reference to the accompanying drawings.

  FIG. 5 shows a perspective view of a ceramic capacitor substrate as a plate-like workpiece. The ceramic capacitor substrate 10 shown in FIG. 5 has a thickness of about 500 μm and is formed in a rectangular shape, and has a plurality of first division planned lines 101 extending in a predetermined direction on the surface 10a, and the first division planned lines 101. A plurality of second division lines 102 extending in a direction perpendicular to the line are formed in a lattice shape. Chip capacitors 103 are formed in a plurality of regions partitioned by the first planned division line 101 and the second planned division line 102. The ceramic capacitor substrate 10 formed in this way is divided into individual chip capacitors 103 along the first planned division line 101 and the second planned division line 102.

FIG. 1 is a perspective view of a dividing apparatus configured according to the present invention for dividing the ceramic capacitor substrate 10 along a first scheduled dividing line 101 and a second scheduled dividing line 102.
The dividing device shown in FIG. 1 includes a device housing 2. A workpiece holding mechanism 3 for holding the workpiece and a laser beam irradiation means 4 for irradiating the workpiece held by the workpiece holding mechanism 3 with a laser beam are arranged at the center of the apparatus housing 2. Has been. The workpiece holding mechanism 3 includes a holding table 31 that sucks and holds the ceramic capacitor substrate 10 as the plate-like workpiece, and a holding table support means 32 that supports the holding table 31. As shown in FIG. 1, the holding table 31 is formed in a rectangular shape, and a suction chuck 311 made of porous ceramics for sucking and holding the ceramic capacitor substrate 10 is disposed at the center of the surface. The suction chuck 311 is connected to suction means (not shown). Accordingly, the ceramic capacitor substrate 10 is placed on the suction chuck 311 and the suction unit (not shown) is operated to suck and hold the ceramic capacitor substrate 10 on the suction chuck 311.

  The holding table support means 32 constituting the workpiece holding mechanism 3 includes a rotation driving means (not shown) that rotates the holding table 31 about an axis perpendicular to the holding surface that is the upper surface. The holding table support means 32 configured in this manner is configured to be movable between a loading / unloading area for loading and unloading the workpiece shown in FIG. 1 and a processing area by the laser beam irradiation means 4. It can be moved in the machining feed direction (X axis direction) indicated by an arrow X by an X axis direction moving means (not shown).

  The laser beam irradiation means 4 for irradiating the ceramic capacitor substrate 10 held on the holding table 31 constituting the workpiece holding mechanism 3 with a laser beam includes a laser beam oscillation means (not shown) for oscillating a pulse laser beam, and the laser beam oscillation. A condenser 41 for condensing the laser beam oscillated by the means is provided, and the condenser 41 is disposed in the processing region.

Above one side in the Y-axis direction of the workpiece holding mechanism 3 is a cassette mounting region 5a is placed is provided a cassette accommodating the ceramic capacitor substrate 10 as a plate-shaped workpiece before processing The cassette mounting area 5a is provided with a cassette table 50 that can be moved in the vertical direction (Z-axis direction) indicated by the arrow Z by lifting means (not shown). On this cassette table 50, a cassette 5 in which a plurality of ceramic capacitor substrates 10 as workpieces are accommodated is placed. On the front side of the cassette mounting area 5a, the ceramic capacitor substrate 10 accommodated in the cassette 5 is temporarily placed and temporarily positioned, and the ceramic capacitor substrate 10 accommodated in the cassette 5 is temporarily placed. A workpiece unloading means 7 for unloading is disposed.

  Between the temporary placement means 6 and the carry-in / carry-out area, the ceramic capacitor substrate 10 as a plate-shaped workpiece before being processed and aligned with the temporary placement means 6 is placed in the carry-in / carry-out area. A workpiece carry-in means 8 for conveying the workpiece onto a holding surface, which is the upper surface of the holding table 31 constituting the positioned workpiece holding mechanism 3, is provided. The workpiece carrying means 8 includes a suction holding pad 81 that sucks and holds the upper surface of the ceramic capacitor substrate 10 and an air cylinder that supports the suction holding pad 81 and moves the suction holding pad 81 in the vertical direction (Z-axis direction). It comprises a mechanism 82, an operating arm 83 that supports the air cylinder mechanism 82, and a moving means (not shown) that moves the operating arm 83 in the Y-axis direction. The suction holding pad 81 of the workpiece carrying means 8 configured in this way is connected to a suction means (not shown).

  The dividing apparatus in the illustrated embodiment is a ceramic capacitor as a plate-like workpiece that is held by a holding table 31 that is mounted on the air cylinder mechanism 82 of the workpiece loading means 8 and is positioned in the loading / unloading area. An imaging means 9 for detecting a region to be processed of the substrate 10 is provided. The image pickup means 9 is composed of optical means such as a microscope and a CCD camera, and sends the picked up image signal to a control means described later.

  On the other side of the workpiece holding mechanism 3 in the Y-axis direction, a dividing means 11 for dividing the ceramic capacitor substrate 10 as a plate-like workpiece laser-processed in the processing region into individual chip capacitors. Is arranged. The dividing means 11 includes a workpiece placing member 111 disposed on the other side in the Y-axis direction of the workpiece holding mechanism 3, and laser processing placed on the workpiece placing member 111. A pressing roller 112 for applying an external force to the ceramic capacitor substrate 10 as a plate-like workpiece thus formed, and a roller housing 113 for housing the pressing roller 112 so as to be able to enter and exit are provided. The workpiece placing member 111 is formed in a rectangular shape by a flexible member such as rubber. The pressing roller 112 is configured to roll in the X-axis direction while pressing the upper surface of the ceramic capacitor substrate 10 placed on the workpiece placing member 111.

  The dividing device in the illustrated embodiment is a ceramic capacitor as a plate-like workpiece processed by laser that is placed on a holding table 31 constituting a workpiece holding mechanism 3 positioned in a carry-in / out region. A workpiece conveying means 12 is provided for conveying the substrate 10 to the workpiece placing member 111 constituting the dividing means 11. The workpiece conveying means 12 includes a suction holding pad 121 for sucking and holding the upper surface of the ceramic capacitor substrate 10 as a laser processed plate-like workpiece placed on the holding table 31, and the suction holding pad. An air cylinder mechanism 122 that supports 121 and moves the suction holding pad 121 in the vertical direction (Z-axis direction), an operating arm 123 that supports the air cylinder mechanism 122, and an illustration that moves the operating arm 123 in the Y-axis direction. It consists of no moving means. The suction holding pad 121 of the workpiece transport means 12 configured in this way is connected to a suction means (not shown).

  The dividing apparatus in the illustrated embodiment includes a bulk accommodating means 13 for bulk accommodating a plurality of individually divided chip capacitors arranged adjacent to the workpiece placing member 111 constituting the dividing means 11. ing. The bulk accommodating means 13 includes a chip dropping member 131 having an opening 131 a that opens adjacent to the workpiece placement member 111. The tip dropping member 131 is formed in a funnel shape downward from the opening 131a as shown in FIG. A chip storage container 132 is disposed below the chip dropping member 131 configured as described above. As shown in FIG. 1, a drawer 133 for taking in and out the chip storage container 132 is provided on the front wall of the apparatus housing 2 in which the bulk storage means 13 composed of the chip drop member 131 and the chip storage container 132 is disposed. Is provided.

  Continuing the description with reference to FIG. 1, the dividing apparatus in the illustrated embodiment includes a plurality of chip capacitors in which the ceramic capacitor substrate 10 is divided on the workpiece mounting member 111 constituting the dividing means 11. The chip dropping means 14 for dropping into the opening 131a of the chip dropping member 131 constituting the bulk accommodating means 13 is provided. The tip dropping means 14 includes a tip dropping wiper 141, an operating arm 142 that supports the tip dropping wiper 141, and a moving means (not shown) that moves the operating arm 142 in the Y-axis direction.

  The dividing apparatus in the illustrated embodiment includes the control means 20 shown in FIG. The control means 20 is configured by a computer, and a central processing unit (CPU) 201 that performs arithmetic processing according to a control program, a read-only memory (ROM) 202 that stores control programs and the like, and a read / write that stores arithmetic results and the like. A random access memory (RAM) 203, an input interface 204, and an output interface 205 are provided. The detection signal from the imaging means 9 or the like is input to the input interface 204 of the control means 20 configured as described above. From the output interface 205 of the control means 20, the workpiece holding mechanism 3, the laser beam irradiation means 4, the workpiece carry-out means 7, the workpiece carry-in means 8, the dividing means 11, the workpiece conveyance means 12, etc. Output a control signal.

The dividing apparatus in the illustrated embodiment is configured as described above, and the operation thereof will be described below.
The unprocessed ceramic capacitor substrate 10 accommodated in the cassette 5 placed on the cassette table 50 disposed in the cassette placement area 5a is carried out by moving up and down in the Z-axis direction by a lifting means (not shown). Positioned in position. Next, the control means 20 moves the workpiece unloading means 7 forward and backward to unload the ceramic capacitor substrate 10 positioned at the unloading position onto the temporary placing means 6. The ceramic capacitor substrate 10 carried out to the temporary placing means 6 is aligned here. Next, the control means 20 operates the workpiece carry-in means 8 to suck and hold the upper surface of the ceramic capacitor substrate 10 aligned in the temporary placement means 6 by the suction holding pad 81 and is positioned in the carry-in / out area. The workpiece is held on a holding surface which is the upper surface of the suction chuck 311 of the holding table 31 constituting the workpiece holding mechanism 3. When the ceramic capacitor substrate 10 is placed on the suction chuck 311 of the holding table 31 in this way, the control means 20 operates a suction means (not shown), so that the upper surface of the suction chuck 311 of the holding table 31 is operated. The ceramic capacitor substrate 10 is sucked and held on a certain holding surface (workpiece holding step).

  As described above, when the ceramic capacitor substrate 10 is sucked and held on the holding surface which is the upper surface of the suction chuck 311 of the holding table 31, the control means 20 is mounted on the air cylinder mechanism 82 by operating the workpiece loading means 8. The imaging means 9 is positioned on the upper side of the ceramic capacitor substrate 10 held by the holding table 31. Next, the control unit 20 operates the imaging unit 9 to image the first scheduled division line 101 and the second scheduled division line 102 formed on the ceramic capacitor substrate 10 held on the holding table 31, and An alignment operation is performed to confirm whether or not one scheduled division line 101 and second scheduled division line 102 are parallel to the X-axis direction and the Y-axis direction. If the first scheduled dividing line 101 and the second scheduled divided line 102 are not parallel to the X-axis direction and the Y-axis direction, the control means 20 holds the holding table support means 32 constituting the workpiece holding mechanism 3. The first scheduled dividing line 101 and the second scheduled divided line 102 formed on the ceramic capacitor substrate 10 held on the holding table 31 by controlling a rotation driving means (not shown) that rotates the X axis direction and the Y axis It adjusts so that it may become parallel to a direction (alignment process).

  When the alignment process is performed as described above, the control unit 20 operates the X-axis direction moving unit (not shown) to move the holding table 31 to the machining region, and a predetermined first step is performed as shown in FIG. One end (left end in FIG. 4A) of one division planned line 101 is positioned immediately below the condenser 41 of the laser beam irradiation means 4. And the condensing point P of the pulse laser beam irradiated from the collector 41 is matched with the surface 10a (upper surface) vicinity of the ceramic capacitor board | substrate 10. FIG. Next, the control unit 20 operates the laser beam irradiation unit 4 to operate the X-axis direction moving unit (not shown) while irradiating a pulse laser beam having a wavelength that absorbs the ceramic capacitor substrate 10 from the condenser 41. The holding table 31 is moved at a predetermined processing feed speed in the direction indicated by the arrow X1 in FIG. When the other end of the first scheduled division line 101 (the right end in FIG. 4B) reaches a position directly below the condenser 41, the irradiation of the pulse laser beam is stopped and the movement of the holding table 31 is stopped. . As a result, as shown in FIG. 4B and FIG. 4C, the ceramic capacitor substrate 10 is formed with a dividing groove 104 that is a starting point of breakage along the first dividing line 101 ( Laser processing process). The dividing groove 104 is formed with a depth of about 50 μm under the following processing conditions.

In addition, the said laser processing process is performed on the following processing conditions, for example.
Wavelength: 355nm
Repetition frequency: 10 kHz
Average output: 5W
Focusing spot: φ10μm
Processing feed rate: 50 mm / sec

  If the laser processing step described above is carried out along all the first planned dividing lines 101 formed in the ceramic capacitor substrate 10 in a predetermined direction, the control means 20 operates a rotation driving means (not shown) to hold the holding table 31. Is rotated 90 degrees. Then, the laser processing step described above is performed along all the second scheduled division lines 102 formed on the holding table 31 in a direction orthogonal to the first scheduled division line 101. As a result, the ceramic capacitor substrate 10 held on the holding table 31 is formed with the dividing groove 104 that becomes the starting point of the break along all the first scheduled dividing lines 101 and the second scheduled dividing lines 102.

  The holding table 31 holding the ceramic capacitor substrate 10 subjected to the laser processing step as described above is moved from the processing area to the carry-in / out area. When the holding table 31 reaches the carry-in / out area shown in FIG. 1, the movement of the holding table 31 is stopped. Next, the suction holding of the ceramic capacitor substrate 10 held on the holding table 31 is released.

  Next, the control unit 20 operates a moving unit (not shown) of the workpiece transfer unit 12 to move the suction holding pad 121 to the ceramic capacitor substrate 10 placed on the holding table 31 positioned in the loading / unloading region. The air cylinder mechanism 122 is operated and the suction holding surface, which is the lower surface of the suction holding pad 121, is brought into contact with the upper surface of the ceramic capacitor substrate 10. The ceramic capacitor substrate 10 is sucked and held on the suction holding surface which is the lower surface of the suction holding pad 121 by operating a suction means (not shown).

  As described above, when the ceramic capacitor substrate 10 is sucked and held on the suction holding pad 121, the control means 20 operates the moving means (not shown) of the workpiece transfer means 12 to suck and hold the ceramic capacitor on the suction holding pad 121. The ceramic capacitor substrate in which the substrate 10 is positioned immediately above the workpiece mounting member 111 constituting the dividing means 11 and the air cylinder mechanism 122 is operated to lower the suction holding pad 121 and sucked and held by the suction holding pad 121. 10 is positioned on the upper surface of the workpiece placing member 111 constituting the dividing means 11. Then, the suction holding of the ceramic capacitor substrate 10 by the suction holding pad 121 is released. As a result, the ceramic capacitor substrate 10 is placed on the workpiece placement member 111 constituting the dividing means 11.

  Next, the control means 20 operates the pressing roller 112 constituting the dividing means 11 to roll in the X-axis direction while pressing the upper surface of the ceramic capacitor substrate 10 placed on the workpiece placing member 111. . As a result, the ceramic capacitor substrate 10 is formed with the dividing groove 104 that is the starting point of fracture along the first scheduled dividing line 101 and the second scheduled dividing line 102. Are broken along the first scheduled dividing line 101 and the second scheduled divided line 102 and are divided into individual chip capacitors 103 (dividing step).

  If the above-described dividing step is performed, the control means 20 operates the moving means (not shown) of the chip dropping means 14 to insert the chip dropping wiper 141 mounted on the operating arm 142 into the chip dropping member 131 constituting the bulk accommodating means 13. It is moved toward the opening 131a. As a result, the plurality of chip capacitors 103 individually divided on the workpiece placement member 111 are accommodated in the chip accommodation container 132 through the opening 121a.

As described above, the dividing apparatus in the illustrated embodiment is broken by irradiating the laser beam along the first scheduled division line 101 and the second scheduled division line 102 in the ceramic capacitor substrate 10 by the laser beam irradiation means 4. Since the dividing groove 104 as a starting point is formed, the productivity is not reduced due to wear and damage of the cutting blade as in the conventional dividing method in which cutting is performed by the cutting blade.
In addition, the laser processing by the laser beam irradiation means 4 forms the dividing groove 104 that is the starting point of the break along the first scheduled dividing line 101 and the second scheduled divided line 102 in the ceramic capacitor substrate 10. There is no adhesion of melt (dross) to the side walls.
Further, the ceramic capacitor substrate 10 in which the dividing groove 104 that is the starting point of the break is formed along the first scheduled dividing line 101 and the second scheduled dividing line 102 is divided into individual chip capacitors 103 by the dividing means 11. After that, since it is housed in the chip container 132, there is no need to support the ceramic capacitor substrate 10 on a supporting member such as a holding substrate or a tape, and the attaching and peeling steps of the supporting member are not required, thereby improving productivity. .

  In the embodiment described above, an example is shown in which the ceramic capacitor substrate 10 as a plate-like workpiece is divided into individual chip capacitors 103 along the first planned division line 101 and the second planned division line 102. However, the dividing apparatus according to the present invention has the same effect even when a glass substrate on which no division line is formed as a plate-like workpiece is divided into a plurality of chips.

2: Device housing 3: Workpiece holding mechanism 31: Holding table 4: Laser beam irradiation means 41: Condenser 5: Cassette 5a: Cassette placement area 6: Temporary placement means 7: Workpiece unloading means 8: Workpiece Object carrying means 9: Imaging means 10: Ceramic capacitor substrate 11: Dividing means 111: Workpiece placing member 112: Pressing roller 12: Workpiece conveying means 13: Bulk accommodating means 14: Chip dropping means 20: Control means

Claims (1)

A dividing device for dividing a plate-like workpiece into a plurality of chips,
A cassette mounting region for placing a cassette accommodating a workpiece before processing,
Temporary placement means for temporarily placing the workpiece before processing;
A workpiece unloading means for unloading the unprocessed workpiece housed in the cassette placed in the cassette placement area to the temporary placing means;
A holding table for sucking and holding a workpiece before processing;
A moving means for moving the holding table to a loading / unloading area for loading and unloading a workpiece and a machining area;
A workpiece carry-in means for carrying the workpiece before being carried to the temporary placement means to the holding table positioned in the carry-in / out region;
A laser beam irradiating means for irradiating a workpiece before processing disposed in the processing region and sucked and held by the holding table to form a split groove serving as a break starting point to be divided into chips on the workpiece;
A splitting means for applying an external force to the workpiece on which the split groove serving as a fracture starting point is formed, and splitting the workpiece into a plurality of chips along the split groove;
Accommodating means for accommodating a plurality of chips divided by the dividing means;
Chip dropping means for dropping a plurality of chips, which are separated by the dividing means and not supported by the support member , into the housing means ,
The dividing means includes a workpiece placing member for placing a workpiece formed of a flexible member, and a pressing roller for pressing the workpiece placed on the workpiece placing member. A dividing apparatus characterized by that.

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