JP6431714B2 - Laser cutting method and apparatus - Google Patents

Description

  The present invention relates to a laser cutting processing method and apparatus for a workpiece, and more specifically, detects a laser cutting failure place when laser cutting of a workpiece is first performed, and the laser cutting is performed at the next laser cutting processing. When performing laser cutting processing of a portion corresponding to a defect corresponding to a defective portion, a cooling fluid sprayed to the workpiece is flown into the cutting groove of the workpiece, and laser cutting is performed after cooling the surface of the workpiece and the inside of the workpiece. The present invention relates to a laser cutting processing method and apparatus.

  For example, when laser cutting of a relatively thick plate-like workpiece is performed, heat at the time of laser cutting is accumulated in the workpiece, and laser cutting defects such as burning and the width of the cutting groove gradually increase may occur. Therefore, water for cooling is sprayed in the vicinity of the laser cutting position of the workpiece (see Patent Document 1), the temperature of the workpiece surface in the vicinity of the laser cutting position of the workpiece is detected, and the detected surface temperature is When the set value is exceeded, cooling water is injected near the laser cutting position to cool the workpiece (see Patent Documents 2 and 3).

JP 2000-52081 A Japanese Patent Laid-Open No. 5-157474 JP 2007-75876 A

  In the configurations described in Patent Documents 1, 2, and 3, since cooling water is sprayed on the surface of the workpiece, the workpiece surface is cooled, but laser cutting failure such as burning due to heat accumulated in the workpiece is performed. May occur. Also, during laser cutting processing, cooling fluid such as assist gas or cooling water is sprayed into the cutting groove in laser cutting processing, but cooling is performed while irradiating the laser as the heat source. Cooling may not be performed and laser cutting defects such as burning may occur.

The present invention has been made in view of the above-described problems, and a laser processing head that is relatively movable in the X, Y, and Z axis directions orthogonal to each other is moved in an appropriate direction to move the workpiece. A laser cutting method for performing laser cutting processing, the step (a) of performing laser cutting processing of a workpiece by controlling the movement of the laser processing head according to a laser cutting processing program, and laser cutting in the laser cutting processing In the step (b) of detecting a defective portion, and when performing the next laser cutting process on the workpiece, when performing laser cutting processing of a portion corresponding to the defect corresponding to the detected laser cutting defective portion, the irradiation of moving and laser light, corresponding to the path length or laser cutting time of the laser cutting from a laser cutting start position, is set as a parameter stop Time only pause step (c) and, continuing the injection of the cooling fluid or cooling fluid and the assist gas to the workpiece in the temporary stopping position, already cooling fluid to the laser cutting machining performed cutting groove in the temporary stop position (D) step, and after cooling the surface of the workpiece and the inside of the workpiece at the temporary stop position by the cooling fluid, each step of (e) step of starting laser cutting processing of the defective portion is provided. It is characterized by being.

Further, there is provided a laser cutting method for performing laser cutting processing of a workpiece by moving a laser processing head that is relatively movable in X, Y, and Z axis directions orthogonal to the workpiece in an appropriate direction. (A) a step of performing laser cutting of a workpiece by controlling movement of the laser processing head in accordance with a cutting processing program, (b) a step of detecting a laser cutting failure location in the laser cutting processing, and the laser processing (C) a step of displaying the machining shape of the workpiece on the display screen of the display means in the control device for controlling the movement of the head or the automatic programming device for generating the laser cutting machining program, and the machining of the workpiece displayed on the display screen (D) a step of instructing on the display screen a defect-corresponding portion corresponding to the detected laser cutting defect portion in the shape; When performing laser cutting processing of the portion corresponding to the defect, the laser cutting processing program is set by setting a pause time during which the cooling fluid is continuously jetted and the movement of the laser processing head and the laser beam irradiation are temporarily stopped. (E) and a step (f) for performing laser cutting of the workpiece according to the laser cutting processing program assigned with the temporary stop time. The temporary stop time is the start of laser cutting processing. The parameter is stored in the parameter memory of the control device or the automatic programming device as a parameter of the processing path length of laser cutting processing from the position or the elapsed time from the laser cutting processing start time.

  In addition, a laser cutting machine having a laser processing head that is relatively movable in the X, Y, and Z axis directions orthogonal to the workpiece, and the movement of the laser processing head in accordance with a laser cutting processing program. A laser cutting processing apparatus comprising: a control device for controlling; and an automatic programming device that generates and provides the laser cutting processing program to the control device, wherein the laser cutting processing is performed by the laser cutting processing program. A display screen for displaying a machining shape of a workpiece is provided in at least one of the control device or the automatic programming device, and corresponds to a defect corresponding to a laser cutting defect location detected in laser cutting processing of the workpiece according to the laser cutting processing program. A defective point indicating means for instructing the point to the machining shape of the workpiece on the display screen In the control device or the automatic programming device, when performing the laser cutting processing of the instructed portion corresponding to the defect, the cooling fluid is continuously ejected and the movement of the laser processing head and the irradiation of the laser light are temporarily stopped. The control device or the automatic programming device includes a parameter memory in which time is stored as a parameter of a processing path length of laser cutting processing from a laser cutting processing start position or an elapsed time from the start of laser cutting processing. The control device or the automatic programming device has an allocating means for allocating a parameter of a pause time to the defect-corresponding portion in the laser cutting machining program based on an elapsed time, and the laser cutting to which the pause time is assigned The movement of the laser processing head is controlled according to a processing program. And it is characterized in that it comprises the control device.

  In addition, a laser cutting machine having a laser processing head that is relatively movable in the X, Y, and Z axis directions orthogonal to the workpiece, and the movement of the laser processing head in accordance with a laser cutting processing program. A control device for controlling the laser cutting processing device, the control device comprising a display screen for displaying a processing shape of a workpiece to be laser cut by the laser cutting processing program, the laser cutting processing device The control device is provided with a defective portion indicating means for instructing a processing shape of the workpiece on the display screen to indicate a defect-corresponding portion corresponding to a laser cutting defective portion detected in laser cutting processing of the workpiece according to a program, When laser cutting processing is performed on the part corresponding to the defect, the cooling fluid is continuously injected to move the laser processing head and The control device includes a parameter memory that stores a pause time for temporarily stopping the shot as a parameter of a processing path length of laser cutting processing from a laser cutting processing start position or an elapsed time from the start of laser cutting processing. The control device has an allocating means for allocating a parameter at the time of suspension to the failure corresponding portion in the laser cutting processing program based on the length or elapsed time, and according to the laser cutting processing program to which the suspension time is allocated. The apparatus includes the control device that controls movement of the laser processing head.

  According to the present invention, the workpiece surface and the inside of the workpiece where the laser cutting failure is likely to occur are cooled and laser cutting of the workpiece is performed, so that occurrence of laser cutting failure such as burning can be suppressed. .

It is explanatory drawing at the time of performing a laser cutting process to a workpiece | work and detecting a laser cutting defect location. It is explanatory drawing of the functional block diagram which shows the structure of the control apparatus which controls operation | movement of a laser cutting machine. It is explanatory drawing at the time of performing a laser cutting process to a workpiece | work and detecting a laser cutting defect location. It is explanatory drawing at the time of performing a laser cutting process to a workpiece | work and detecting a laser cutting defect location.

  Laser cutting of the workpiece W by a laser processing machine (not shown) provided with a laser processing head (not shown) that can be moved and positioned relatively in the X, Y, and Z axis directions orthogonal to the plate-like workpiece W. When processing, for example, as shown in FIG. 1A, a product WP having an appropriately shaped hole H inside may be cut. In this case, piercing is performed at the start position S1 in the hole H, and laser cutting of the hole H is performed as indicated by an arrow A. Next, piercing is performed at the start position S2 outside the product WP, and as shown by an arrow B, laser cutting of the product WP is performed.

  As described above, when the laser cutting of the product WP is performed, the heat during the laser cutting of the hole H is stored in the workpiece W. Then, as shown by arrow B, when laser cutting of the contour of the product WP is performed, the heat stored in advance and the heat at the time of the current laser processing overlap, and as shown in FIG. NG of defective laser cutting may occur. In addition, when the workpiece | work W is comparatively thick, the heat storage to an inside is large and it is easy to produce the burning resulting from this heat storage.

  Therefore, in the configuration described in Patent Document 2, when the surface temperature of the workpiece is detected and the detected temperature is equal to or higher than the set value, cooling water is supplied from the nozzle provided around the nozzle in the laser processing head in the vicinity of the processing point. It is jetted to cool. Further, in the configuration described in Patent Document 3, a temperature change at a position 5 mm away from the laser cutting processing position is detected, and in the case of a temperature at which burning may occur, the laser cutting processing is stopped, The workpiece is cooled by jetting compressed air from a cooling nozzle to the laser torch. In this case, cooling is performed for 10 minutes or more (see [0032] and [0033] of Patent Document 3).

  As described in Patent Documents 2 and 3, there is a problem in improving the efficiency when the work surface is not overcooled by merely injecting the cooling water onto the work surface, and when the stop time is prolonged. Therefore, in the present embodiment, a laser cutting defect portion such as burning is detected in advance, and the workpiece surface and the inside are cooled in advance when performing laser cutting processing of the portion corresponding to the defect corresponding to the laser cutting defect portion. It is something to try. Therefore, in this embodiment, the control device for the laser beam machine is configured as follows.

  Referring to FIG. 2, the operation of a laser cutting machine (not shown) provided with a laser machining head (not shown) that can be moved and positioned relatively in the X, Y, and Z axis directions orthogonal to the workpiece. The control device 1 for controlling the computer is composed of, for example, a computer, and includes a CPU 3, a RAM 5, a ROM 7, and an input / output means 9. The control device 1 is provided with a program memory 11 that stores a laser cutting processing program. The laser cutting processing program is generated in the automatic programming device 13 and is input to the program memory 11 in the control device 1 via the input / output means 9 and stored therein.

  Further, the control device 1 is provided with program reading means (program analysis means) 15 for reading a laser cutting processing program stored in the program memory 11, and the laser read by the program reading means 15. For example, an operation control means 19 is provided for controlling the operation of the servo motor 17 for moving and positioning the laser processing head in the X, Y, and Z axis directions in accordance with the cutting processing program.

  With the above configuration, after the laser cutting processing program generated in the automatic programming device 13 is stored in the program memory 11, the laser cutting machine is controlled under the control of the control device 1, and the product WP shown in FIG. When the laser cutting process is performed, as shown in FIG. 1B, a defective laser cutting point NG may be generated. Therefore, the laser cutting failure location detecting means 21 for detecting the laser cutting failure location NG is provided.

  More specifically, the laser cutting defect location detecting means 21 detects reflected light, scattered light, etc. from the laser processing position, as schematically shown in FIG. 2 of Japanese Patent Application Laid-Open No. 2013-86115, for example. The optical sensor (optical fiber) is provided in the laser processing head. When a laser cutting defect such as burning occurs during laser processing of the workpiece W, the amount of light incident on the optical sensor increases. Therefore, when the detected value of the amount of light incident on the optical sensor becomes larger than a preset value, it can be detected that burning has occurred.

  Therefore, by combining the program reading position of the program reading means 15 with the detection of the occurrence of burning by the optical sensor, it is possible to detect a laser cutting defect location during laser cutting of the workpiece W. The laser cutting failure location NG detected by the laser cutting failure location detection means 21 is stored in the laser cutting failure location memory 23 provided in the control device 1.

  Note that the method for detecting the defective laser cutting location NG is not limited to the above-described method, and may be performed as follows. That is, after the laser cutting of the workpiece W is completed, the workpiece (product WP) is imaged by, for example, a CCD camera. And with respect to the shape of the product WP (shape based on CAD data or CAM data) displayed on the display screen 27A of the display means 25 provided in the control device 25 or the display screen 27B provided in the automatic programming device 13. The shape of the imaged product WP is superimposed. Thereafter, the start point and end point of the laser cutting failure location NG in the imaged shape can be instructed by an appropriate failure location indication means 29, for example, by touching on the screen in the case of a touch panel. .

  Further, by visually observing the product WP that has been subjected to laser cutting processing, the start point position of the defective laser cutting point NG or the start point position and the end point position on the display screens 27A and 27B on which the shape of the product WP is displayed, for example, a mouse or the like It is also possible to instruct by the appropriate defective portion instruction means.

  As described above, when only the start positions of the laser cutting failure locations NG1 to NG4 shown in FIG. 1B are indicated on the display screens 27A and 27B, the start position of each of the laser cutting failure locations NG1 to NG4 is shown in FIG. As shown in A), the positions of P1 to P4 are displayed on the display screens 27A and 27B. Then, when the positions of the end points P1E to P4E of the laser cutting failure points NG1 to NG4 are indicated, as shown in FIG. 3B, the start point position and the end point position of each laser cutting failure point NG1 to NG4 are displayed. In addition, the long (length) of each of the laser cutting failure locations NG1 to NG4 is displayed. The position data of the start point positions P1 to P4 and the end point positions P1E to P4E and the data in the range of each laser cutting failure point NG1 to NG4 in each of the laser cutting failure points NG1 to NG4 are stored in the laser cutting failure point memory 23. Is.

  As already understood, when laser cutting of the workpiece W is performed in accordance with the laser cutting processing program and laser cutting processing is performed for the second and subsequent times, it is possible to detect a laser cutting defect location in the first time. . Therefore, when performing the second and subsequent laser cutting processes on the product WP having the same shape, a favorable laser cutting process can be performed by changing the laser cutting processing conditions of the defect-corresponding portion corresponding to the detected laser cutting failure portion NG. Can be done. That is, after removing (cooling) heat storage that causes burning as a laser cutting defect, laser cutting is performed on the portion corresponding to the defect.

  Therefore, the control device 1 is provided with the parameter memory 31 that stores the cooling time as the laser cutting processing condition of the defect-corresponding portion as a parameter, and restarts cutting when the laser cutting processing of the defect-corresponding portion is restarted. A cutting resumption condition memory 33 storing conditions in advance is provided. In the parameter memory 31, a cooling time parameter is stored in advance in correspondence with the processing path length L from the first laser cutting processing start position (start position S1) to the start position P1 to P4 of each of the laser cutting failure locations NG1 to NG4. Stored.

  That is, when the processing path length from the start position S1 to the start position of the laser cutting failure point NG is L1 mm or less, T1 seconds of cooling, (L1 + 1) mm to L2 mm, T2 seconds of cooling, (L2 + 1) mm In the case of ˜L3 mm, the cooling time is stored in advance in the parameter memory 31 as a parameter corresponding to the machining path length from the start position S1, as in the case of cooling for T3 seconds. The above parameters of the cooling time are predetermined by experiments or by empirical values.

  In the above case, the cooling time parameter is set corresponding to the processing path length, but the cooling time parameter can also be set corresponding to the time from the start of laser processing. In laser cutting processing, the heat storage amount of the workpiece increases as the processing path length increases, and the heat storage amount of the workpiece increases as the laser processing time increases.

  Therefore, it is desirable to set the workpiece cooling time as a parameter corresponding to the laser cutting processing path length or laser cutting time. Therefore, the control device 1 is provided with path length calculation means 35 from the start position S1 to the start point positions P1 to P4 of the laser cutting failure locations NG1 to NG4, and each laser cutting failure from the start position S1. Time measuring means 37 is provided for measuring the time to reach the locations NG1 to NG4. This time measuring means 37 measures the time when the laser cutting defective portion detecting means 21 detects a light quantity equal to or larger than a set value after the laser cutting processing is started at the first laser cutting processing of the workpiece W.

  In the cutting resumption condition memory 33, a predetermined range of the start point positions P1 to P4 and a laser in the range in the case where laser cutting processing is performed on the defective corresponding portions corresponding to the laser cutting defective portions NG1 to NG4. Each condition of the laser beam output and the moving speed of the laser processing head when performing the cutting process is experimentally obtained in advance and stored. In addition, the laser cutting process conditions for performing the laser cutting process for each defect-corresponding portion may be the same.

  In the configuration as described above, the workpiece W is subjected to laser cutting processing as shown in FIG. 1A in accordance with the laser cutting processing program generated in the automatic programming device 13 and stored in the programming memory 11. Then, as described above, the laser cutting defects NG1 to NG4 such as burning are detected at the time of laser cutting of the workpiece W or after the laser cutting processing. Then, the start point positions P1 to P4 of the laser cutting failure locations NG1 to NG4 are stored in the laser cutting failure location memory 23. At this time, when the time from the start position S1 to each of the start point positions P1 to P4 is timed by the time measuring means 37, the time measured is also stored in the laser cutting failure location memory 23.

  As described above, after performing laser cutting processing of the workpiece W and detecting the laser cutting failure locations NG1 to NG4, when performing the second laser cutting processing of the workpiece W, the laser cutting failure locations NG1 to NG1 are performed. When performing laser cutting processing of a portion corresponding to a defect corresponding to NG4, the movement of the laser processing head is stopped and the output of the laser beam is stopped at each of the start point positions P1 to P4. That is, at the start positions P1 to P4, the assist gas and the cooling fluid are continuously ejected to cool the workpiece W, and then the laser cutting process for each defective portion is resumed.

  That is, when performing the second laser cutting processing of the workpiece W, the workpiece W is laser-cut according to the laser cutting processing program stored in the program memory 11 and stored in the laser cutting failure location memory 23. When reaching each of the start point positions P1 to P4, the movement of the laser processing head and the output of the laser beam are stopped. Then, the parameter T of the stop time (cooling time) set corresponding to the machining path length of each of the starting point positions P1 to P4 is selected (searched) from the parameter memory 31 by the assigning means 39 provided in the control device 1. Assigned. Further, the cutting restart condition stored in the cutting restart memory 33 is assigned by the assigning means 39. That is, the ejection of the cooling fluid and the assist gas is continued for several seconds at the respective start point positions P1 to P4 for the time allocated as the parameter T.

  As already understood, at each of the start point positions P1 to P4, a stop time set as a parameter is assigned, and the cooling fluid (cooling water) and the assist gas are ejected in a state where the movement of the laser processing head is stopped. Is performed for several seconds, the workpiece surface in the vicinity of each of the start point positions P1 to P4 is cooled. Further, a part of the cooling water enters the cutting groove where the laser cutting has been performed. At this time, the cooling water is pushed deeply into the cutting groove of the workpiece W by the ejection of the assist gas, or the assist gas flows into the cutting groove deeply into the cutting groove. Therefore, not only the surface of the workpiece W but also the inside of the workpiece W is cooled, and the cooling in the vicinity of the start point positions P1 to P4 can be performed more effectively.

  As described above, the surface and the inside of the workpiece W are cooled at each of the starting point positions P1 to P4, and when the time set as the parameter T has elapsed, each defect corresponds to the condition stored in the cutting resumption condition memory 33. The laser cutting process of the location will be performed. Therefore, laser cutting processing can be performed satisfactorily for each defect-corresponding portion.

  In the above description, when the control device 1 includes the parameter memory 31, the cutting resumption condition memory 33, and the assigning means 39, the laser cutting processing is performed on the defect-corresponding portions corresponding to the laser cutting failure portions NG1 to NG4. As described above, the stop time parameter and the cutting resumption condition are assigned to each of the starting point positions P1 to P4 of each defect-corresponding portion. However, the automatic programming device 13 includes the parameter memory 33, the cutting resumption condition memory 33, and the assigning means 39. Then, the data stored in the laser cutting failure location memory 23 is input to the automatic programming device 13 via the input / output means 9 by the communication means, the storage medium, etc., and the program is stopped by the laser cutting processing program as described above. It is also possible to assign time and disconnection restart conditions.

  In the above description, the parameter of the cooling time (laser machining head stop time) is set according to the path length from the start position S1 to each of the laser cutting failure locations NG1 to NG4. In this case, the cooling time at the start point position P4 is set despite the fact that the range from the start point position P4 to the end point position P4E of the laser cut defect point NG4 is smaller than the range from the start point position P3 to the end point position P3E of the laser cut defect point NG3. Becomes longer. Therefore, it is possible to set the cooling time parameter corresponding to the range of each of the laser cutting failure locations NG1 to NG4.

  In the above case, since the range of the laser cutting failure location NG4 is smaller than the range of the laser cutting failure locations NG2 and NG3, the start point position P4 is longer than the cooling time at the start point positions P2 and P3 of the laser cutting failure locations NG2 and NG3. The cooling time is shortened. It should be noted that the range of the laser cutting failure location NG2 is increased because the heat is accumulated by heat conduction during the piercing process at the start position S2, and the heat during the laser cutting process is overlapped so that the burning is performed. It will occur. The range of the defective laser cutting portion NG3 is increased by performing laser cutting processing so as to draw an arc with a small radius in a state where heat is stored by heat conduction during the piercing processing at the start position S2. Burning occurs.

  As described above, even when cooling is performed by setting a cooling time parameter corresponding to the size of the defective range in the laser cutting failure locations NG1 to NG4, the laser cutting failure occurs during the second laser cutting process. It is possible to suppress the occurrence of places.

  By the way, when nesting a plurality of products WP on a single workpiece W and performing laser cutting processing, as shown in FIG. 4, laser cutting processing is performed on all products WP, as shown in FIG. Thus, the laser cutting defect location of all the products WP is detected. Then, set the cooling time of the laser cutting failure location of all products WP, and before the laser cutting of the location corresponding to the failure corresponding to the detected laser cutting failure location at the second and subsequent laser cutting processing, as described above, By cooling the surface and the inside of the workpiece, the occurrence of defective laser cutting can be suppressed.

  As will be understood from the above description, the laser cutting process of the workpiece is performed to detect the laser cutting failure spot, and the laser corresponding to the defect corresponding to the laser cutting fault spot at the second laser cutting process. Before performing the cutting process, the surface and the inside of the workpiece are cooled. Therefore, it can suppress that the heat at the time of a laser cutting process is stored, and burning generate | occur | produces.

  The present invention is not limited to the above-described embodiments, and can be implemented in other forms by making appropriate changes. That is, when the movement of the laser processing head is stopped and the cooling water and the assist gas are jetted to cool the surface and the inside of the workpiece, the jetted cooling water can be cooled to a predetermined temperature or less in advance. . It is also possible to change the ejection pressure and amount of cooling water and assist gas.

  Further, it is possible to slightly return the laser processing head when cooling the surface and the inside of the workpiece. In this case, not only the stop position of the laser processing head but also the cooling along the cutting groove, and the surface and the inside of the workpiece can be cooled more effectively.

  Further, when performing laser cutting processing of the defect-corresponding portions corresponding to the laser cutting failure portions NG1 to NG4, the cooling water is continuously ejected in a state where the movement of the laser processing head and the output of the laser beam are stopped. The assist gas can be ejected in pulses. In this case, the cooling water can easily flow into the lower position of the nozzle provided in the laser processing head when the assist gas ejection stops. Therefore, the cooling water can easily enter the cutting groove at the laser cutting position, and the surface and the inside of the workpiece at the laser cutting position can be effectively cooled.

  Further, when performing laser cutting processing of the portion corresponding to the defect, the laser processing head is repeatedly moved forward and backward, and during the backward movement, the laser beam output is stopped and the cooling water and the assist gas are continuously ejected. Is also possible. In this case, although the laser cutting processing of the portion corresponding to the defect is performed step by step, the surface and the inside of the workpiece near the laser cutting processing position can be effectively cooled.

DESCRIPTION OF SYMBOLS 1 Control apparatus 11 Program memory 13 Automatic programming apparatus 21 Laser cutting failure location detection means 23 Laser cutting failure location memory 25 Display means 27A, 27B Display screen 29 Defective location instruction means 31 Parameter memory 33 Cutting resumption condition memory 35 Path length calculation means 37 Timekeeping means 39 Allocation means

Claims (4)

A laser cutting method for performing laser cutting processing of a workpiece by moving a laser processing head that is relatively movable in X, Y, and Z axis directions orthogonal to the workpiece in an appropriate direction,
(A) a step of performing laser cutting processing of a workpiece by controlling movement of the laser processing head according to a laser cutting processing program;
(B) a step of detecting a laser cutting defect location in the laser cutting processing;
(C) When performing the next laser cutting processing on the workpiece, when performing the laser cutting processing of the portion corresponding to the defect corresponding to the detected laser cutting failure portion, the movement of the laser processing head and the irradiation of the laser beam are performed . A step of temporarily stopping only a stop time set as a parameter in accordance with a laser cutting processing path length from a laser cutting processing start position or a laser cutting time ;
(D) continuing the injection of the cooling fluid or the cooling fluid and the assist gas to the workpiece at the temporary stop position, and supplying the cooling fluid into the cutting groove that has already been laser-cut at the temporary stop position;
(E) a step of starting laser cutting processing of the portion corresponding to the defect after cooling the surface of the workpiece at the temporary stop position and the inside of the workpiece with a cooling fluid;
A laser cutting method comprising the steps of: A laser cutting method for performing laser cutting processing of a workpiece by moving a laser processing head that is relatively movable in X, Y, and Z axis directions orthogonal to the workpiece in an appropriate direction,
(A) a step of performing laser cutting processing of a workpiece by controlling movement of the laser processing head according to a laser cutting processing program;
(B) a step of detecting a laser cutting defect location in the laser cutting processing;
(C) displaying the machining shape of the workpiece on the display screen of the display means in the control device for controlling the movement of the laser machining head or the automatic programming device for generating the laser cutting machining program;
(D) a step of instructing on the display screen a defect-corresponding portion corresponding to the detected laser cutting defect portion in the machining shape of the workpiece displayed on the display screen;
(E) When performing laser cutting processing of the instructed portion corresponding to the defect, the cooling fluid is continuously ejected to set a pause time for temporarily stopping the movement of the laser processing head and the irradiation of the laser beam, The process assigned to the laser cutting program
(F) a step of performing laser cutting of the workpiece in accordance with the laser cutting processing program assigned with the pause time;
With each process ,
The pause time is stored in a parameter memory of the control device or the automatic programming device as a parameter of a processing path length of laser cutting processing from the laser cutting processing start position or an elapsed time from the laser cutting processing start time. A laser cutting method characterized by the above. A laser cutting machine having a laser processing head that is relatively movable in the X, Y, and Z axis directions orthogonal to the workpiece, and a control for controlling the movement of the laser processing head according to a laser cutting processing program A laser cutting processing apparatus comprising: an apparatus; and an automatic programming device that generates the laser cutting processing program and provides the program to the control device,
  Provided on at least one of the control device or the automatic programming device with a display screen for displaying a machining shape of a workpiece to be laser cut by the laser cutting processing program,
  Defect location indicating means for instructing the machining shape of the workpiece on the display screen to indicate a defect equivalent location corresponding to a laser cutting failure location detected in laser cutting machining of the workpiece according to the laser cutting machining program. In preparation for automatic programming equipment,
  When performing the laser cutting processing of the instructed portion corresponding to the defect, a pause time for stopping the movement of the laser processing head and the irradiation of the laser beam by continuing the jetting of the cooling fluid is determined from the laser cutting processing start position. A parameter memory stored as a parameter of a processing path length of laser cutting processing or an elapsed time from the start of laser cutting processing is provided in the control device or the automatic programming device,
  The control device or the automatic programming device is provided with an allocating means for allocating a parameter of a temporary stop time to the defect-corresponding portion in the laser cutting processing program based on a processing path length or an elapsed time,
  A laser cutting processing apparatus comprising: the control device that controls movement of the laser processing head in accordance with a laser cutting processing program assigned with the pause time. A laser cutting machine having a laser processing head that is relatively movable in the X, Y, and Z axis directions orthogonal to the workpiece, and a control for controlling the movement of the laser processing head according to a laser cutting processing program A laser cutting processing apparatus comprising:
  The control device is provided with a display screen that displays a machining shape of a workpiece to be laser cut by the laser cutting program,
  The control device is provided with a defective portion indicating means for instructing a processing shape of the workpiece on the display screen to indicate a defect-corresponding portion corresponding to a laser cutting failure portion detected in the laser cutting processing of the workpiece according to the laser cutting processing program. ,
  When performing the laser cutting processing of the instructed portion corresponding to the defect, a pause time for stopping the movement of the laser processing head and the irradiation of the laser beam by continuing the jetting of the cooling fluid is determined from the laser cutting processing start position. A parameter memory stored as a parameter of a processing path length of laser cutting processing or an elapsed time from the start of laser cutting processing is provided in the control device,
  The control device comprises an allocating means for allocating a parameter at the time of temporary stop to the defect-corresponding portion in the laser cutting processing program based on a processing path length or elapsed time,
  A laser cutting processing apparatus comprising: the control device that controls movement of the laser processing head in accordance with a laser cutting processing program assigned with the pause time.

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