JP6470088B2 - Bonding apparatus and bonding method - Google Patents

Description

  The present invention relates to a bonding apparatus and a bonding method, and more particularly, to a highly reliable bonding apparatus and bonding method.

Part of the process of assembling a package by mounting a die (semiconductor chip) on a substrate such as a wiring board or a lead frame is a die bonding process in which the die is adsorbed from the wafer and bonded to the substrate.
In the die bonding process, it is necessary to bond the die accurately to the bonding surface of the substrate. However, the substrate surface is heated to a high temperature of about 80 ° C. to 160 ° C. in the case of bonding with DAF (die attach film). There are also heat generation from the drive unit that performs the XYZ axis operation and changes in ambient temperature. Due to heating, drive unit heat generation, or change in ambient temperature, misalignment of the constituent members occurs and the die cannot be bonded to an accurate position.

  There is Patent Document 1 as a conventional technique for solving this type of problem. The invention of Patent Literature 1 is a semiconductor manufacturing apparatus that mounts a semiconductor element on a mounting target, and a shift detection that detects a shift amount between the semiconductor element mounted on the mounting target and a mounting target position on the mounting target. And a correction circuit that statistically processes a plurality of deviation values detected by the deviation detection unit and feeds back to the position correction calculation of the semiconductor element.

JP 2004-311569 A

  However, with the recent development of chip-on-chip technology due to smaller and thinner packages and thinner die, die bonding is required to have higher precision (ten to several μm) positioning. Therefore, in addition to the problem of Patent Document 1, a bonding position shift on the substrate side has become a problem due to thermal expansion of a conveyance path for conveying the substrate.

  Accordingly, an object of the present invention is to provide a highly reliable die bonder and bonding method capable of accurately bonding a die to a mounting position.

In order to achieve the above-mentioned object, the present invention itself is caused by heating, radiant heat, driving unit heat generation, or change in ambient temperature with respect to a conveyance path that is exposed to a high temperature of about 80 ° C. to 160 ° C. and causes a deviation of the posture of the substrate. In this case, the positional deviation of the bonding head and the mounting imaging camera due to the temporal change including the positional deviation is detected, the correlation position of these three is determined, and the positioning accuracy at the mounting position is improved. For example,
The present invention comprises a pickup imaging means having a first imaging field of view,
A mounting position imaging means having a second imaging visual field capable of imaging the mounting position of the die;
A die transfer tool capable of picking up a die in a first imaging field of view and placing the die at a placement position in a second imaging field of view, and picking up the die within the first imaging field of view. A die transfer tool having a reference mark at a position where it can be imaged within the second imaging field when the die is placed at the placement position, and
A first image obtained by picking up a die to be held by a die transfer tool and picked up by a pickup image pickup means;
A second image obtained by picking up the reference mark provided on the die transfer tool holding the die by the pickup image pickup means;
A third image obtained by picking up a target substrate to be placed by the die transfer tool by the placement position imaging means;
A fourth image obtained by imaging the reference mark provided on the die transfer tool holding the die by the mounting position imaging means;
And a correction unit that corrects the placement of the die held by the die transfer tool based on the first, second, third, and fourth images.

The present invention also includes a first step in which the pickup imaging means images the die that is to be held by the die transfer tool;
A second step in which the pickup imaging means images the reference mark provided on the die transfer tool holding the die; and
A third step in which the placement position imaging means images the substrate on which the die is to be placed;
A fourth step in which the placement position imaging means images the reference mark provided in the die transfer tool holding the die;
Correcting the placement of the die held by the die transfer tool based on the first, second, third and fourth steps;
This is a bonding method.

  Here, the die transfer tool includes, in addition to a bonding head for bonding the die, a pickup head for picking up from the wafer, a head that moves between the intermediate stage and some other place.

The pick-up image pickup means is an image pickup means for picking up a die from a wafer, an image pickup means for picking up a die placed on an intermediate stage, and an image pickup of picking up a die from a tool holding another die. In other words, it includes an image pickup means that can pick up an image when picking up a die. In addition, the mounting position imaging means is used when placing the die on a target portion to be transferred, such as a substrate, such as an imaging means when the die is placed on the intermediate stage, an imaging means when the die is placed on the substrate, or the like. Imaging means for imaging.
In addition to placing the die at the target location, placing the die includes any bonding action such as provisional pressure bonding or main pressure bonding.

  Further, the correction means is not limited to correction using only the die transfer tool, and any correction means capable of correcting the mounting position of the die held by the die transfer tool may be used. The die placement location may be corrected by correcting the position / angle of the die transfer tool, or the die placement location may be corrected by correcting the position / angle of the intermediate stage. In addition, any correction means that can correct the mounting position of the die can be used.

  These corrections are also described below. For example, the control means determines whether or not the reference mark is based on the relationship between the position or direction of the die in the first image and the position or direction of the reference mark in the second image. Estimate the position or direction of the die. Further, the control means estimates the position and direction of the substrate from the position and direction of the reference mark from the relationship between the position or direction of the substrate in the third image and the position or direction of the reference mark in the fourth image. The control unit corrects the position or direction of the die estimated from the reference mark and the position or direction of the substrate estimated from the reference mark.

  Further, in the present invention, the pickup imaging unit may be an imaging unit that captures the first image and the second image at the same position.

  In the present invention, the mounting position imaging unit may be an imaging unit that captures the third image and the fourth image at the same position.

  Further, according to the present invention, the correcting means determines whether the correction mark is detected from the position or direction of the reference mark in the third image based on the relationship between the position or direction of the die in the first image and the position or direction of the reference mark in the second image. It may be a means for correcting.

  In the present invention, the reference mark may be a reference mark that can be imaged by the pickup imaging means or the mounting position imaging means via an optical system having a prism provided on the transfer tool.

Furthermore, the present invention has pick-up means capable of reversing the die and rotatable in a plane parallel to the placement surface having the placement position,
The correcting means may be corrected by pick-up means.

  In the present invention, the pickup imaging means may image at the same position in the first step and the second step. Further, in the present invention, the mounting position imaging means may image at the same position in the third step and the fourth step.

In the present invention, the correcting step includes the position or direction of the die imaged in the first step, the position or direction of the reference mark imaged in the second step,
The correction may be based on the position or direction of the substrate imaged in the third step and the position or direction of the reference mark imaged in the fourth step.

  Further, in the present invention, the second or third step may be a step of imaging the reference mark via an optical system having a prism provided in the transfer tool.

  Further, in the present invention, the correcting step may be a step of correcting by a pick-up means capable of reversing the die and rotating in a plane parallel to the mounting surface having the mounting position.

  According to the present invention, it is possible to provide a highly reliable die bonder and bonding method capable of accurately bonding a die to a mounting position.

It is a schematic side view of the principal part of the 1st Example of this invention in 1st Embodiment of the die bonder suitable for this invention. It is a figure which shows the state of the mounting imaging camera and bonding head in a conveyance path. It is a figure which shows typically the structure of the bonding head in a 1st Example. It is a figure which shows operation | movement of the mounting imaging camera and bonding head for detecting the time-dependent attitude | position deviation of a mounting imaging camera and a bonding head. FIG. 5 shows the results obtained by the operation shown in FIG. 4, (a) is a diagram showing the detection results of the mounted imaging camera, and (b) is a diagram showing the detection results of the bonding head. It is a figure which shows the figure when the X drive axis | shaft of a mounting imaging camera is operated to the position of a conveyance reference mark, and the conveyance reference mark is made into the operation | movement origin by time-dependent attitude | position deviation. It is a figure which shows the detection processing flow of a time-dependent attitude | position deviation of an imaging camera. It is a figure which shows the detection result of the process attitude | position deviation with respect to the bonding head of the intermediate stage imaging camera obtained by the process. (a) shows the figure when the mounting position of the new die D is imaged by the mounting imaging camera on the substrate P or the already mounted die by the broken line conveyed to the attach stage, and (b) is placed on the intermediate stage. It is a figure when the image | photographed die D is imaged with the intermediate stage imaging camera. It is a figure which shows the mounting process flow at the time of performing temporal attitude shift and process attitude shift simultaneously. It is a schematic side view of the principal part of 2nd Embodiment of the die bonder suitable for this invention, and is the 4th Example of this invention.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In addition, the following description is for describing one embodiment of the present invention, and does not limit the scope of the present invention. Accordingly, those skilled in the art can employ embodiments in which these elements or all of the elements are replaced with equivalent ones, and these embodiments are also included in the scope of the present invention.
In this description, components having common functions are denoted by the same reference numerals in the description of each drawing, and overlapping description is avoided as much as possible.

  FIG. 1 is a schematic side view of a main part of a first example of the present invention in a first embodiment of a die bonder suitable for the present invention. The die bonder 100 once places the die D picked up by the pickup head 13 on the intermediate stage (holding position) 22, picks up the placed die D again by the bonding head 23, and transports the substrate P to the mounting position. It is a device that bonds and mounts on.

  The die bonder 100 includes a supply stage imaging camera 11 that recognizes the attitude of the die D on the wafer, an intermediate stage imaging camera 21 that recognizes the attitude of the die D placed on the intermediate stage 22, and a mounting position on the attachment stage 32. And a mounting imaging camera 31 for recognizing. In this embodiment, the intermediate stage imaging camera 21 is the pickup imaging camera in the present invention.

  The die bonder 100 includes a turning drive device 25 provided on the intermediate stage 22, an undervision camera 41 provided between the intermediate stage 22 and the attach stage 32, a heating device 34 provided on the attach stage 32, And a control device 50.

  The undervision camera 41 observes the state of the die D adsorbed while the bonding head 23 is moving from directly below, and the heating device 34 heats the stage 32 so that the die D can be easily picked up or mounted.

  A control device 50, a CPU (Central processor unit) (not shown), a ROM (Read only memory) for storing a control program, a RAM (Random access memory) for storing data, a control bus, etc., control each element constituting the die bonder 100. Then, implementation control described below is performed.

  The mounting units involved in the bonding process in the present embodiment are the transport path 60 including the attach stage 32 constituting the transport system, the mounting imaging camera 31, the bonding head 23, the intermediate stage imaging camera 21, and the intermediate stage 22. The mounting imaging camera 31, the bonding head 23, and the intermediate stage imaging camera 21 have XY drive axes that move in the X and Y directions in a plane parallel to the mounting surface 32m shown in FIG. It does not have a rotation axis that rotates with respect to an axis perpendicular to the axis. The intermediate stage 22 has a turning drive device 25 that rotates the intermediate stage 22 with the intermediate stage surface 22m (see FIG. 1) parallel to the mounting surface 32m.

  In this embodiment, the Y direction is a direction in which the bonding head 23 moves between the intermediate stage 22 and the attach stage 32, and the X direction is orthogonal to the Y direction in a plane parallel to the mounting surface 32m. Direction. Further, the linear scale position of the XY drive shaft is detected as shown in FIG. For example, 26 and 36 are Y drive axis linear scales of the bonding head 23 and the mounted imaging camera, respectively.

  FIG. 2 is a diagram illustrating a state of the mounting imaging camera 31 and the bonding head 23 in the conveyance path 60. Among the mounting units, the conveyance path 60 including the attach stage 32, the bonding head 23 existing above the conveyance path 60, and the mounting imaging camera 31 are 80 ° C. to 160 ° C. by the heating device 34 in order to facilitate bonding of the die D. Influenced before and after. That is, the conveyance path 60 is thermally expanded due to a high temperature, and the posture of the bonding head 23 and the mounted imaging camera 31 is shifted due to radiant heat or the like.

  Therefore, in the present invention, with respect to the transport path 60 that causes the posture deviation of the substrate P, the posture deviation due to the temporal change of the bonding head 23 and the mounting imaging camera 31 including the posture deviation due to heating or the like is detected. The correlation position of these three parties is determined, and the positioning accuracy at the mounting position is improved. As will be described later, the temporal posture deviation includes a rotation angle deviation and a position deviation. In the following description, the former is referred to as a temporal rotation angle deviation, and the latter is referred to as a temporal positional deviation.

In order to realize the above-described detection of the posture deviation with time, the present embodiment has the following two reference marks.
First, a transport reference mark HM provided to detect a time-dependent posture deviation from the operation origin of the transport path 60. In this embodiment, as shown in FIG. 2, HM1 and HM2 are provided on the convex portions on both sides of the conveyance path 60. The conveyance reference marks HM1 and HM2 are provided along a line in which the mounting imaging camera 31 and the bonding head 23 move in the Y direction and within the imaging range of the mounting imaging camera 31. The conveyance reference marks HM1 and HM2 only need to have a shape that can contrast with the conveyance path 60 and can be distinguished by the resolution of the imaging camera. The transport reference marks HM1 and HM2 may be provided on the attach stage 32 at positions separated by a predetermined distance.

  Second, a head reference mark BM provided on the bondin head 23. FIG. 3A is a diagram schematically showing the structure of the bonding head 23 in this embodiment. The reference mark BM has a center position 23cp of the collet 23C so that the center position 23cp of the collet 23C that holds the die D by suction coincides with the center position of the imaging field of the imaging camera when the bonding head 23 is imaged from directly above. It is provided at a position offset from. Further, the distance L from the imaging surface of the imaging camera to the head reference mark BM is a distance that becomes a position that becomes the focal length WD of the imaging camera shown in FIG. 3B, that is, L1 + L2 + L3. Furthermore, the head reference mark BM only needs to have a shape that can contrast with the mark portion 23m and can be distinguished by the resolution of the imaging camera. For example, in addition to the black dot mark, a notch mark may be provided in the mark portion 23m, or a linear mark parallel to the X direction or the Y direction may be provided in the mark portion 23m.

  Next, the structure of the bonding head 23 will be described. The bonding head 23 includes a collet 23C that sucks and holds the die D, a main body 23H that moves the collet 23C up and down and moves on a two-dimensional plane parallel to the mounting surface 32m, and an imaging camera posture deviation detection unit having a head reference mark BM. 23K. The bonding head 23 does not have a turning axis for turning the collet in a plane parallel to the mounting surface 32m.

  The imaging camera attitude deviation detection unit 23K extends from the main body 23H, passes the mark 23m provided with the head reference mark BM, and the image of the head reference mark BM through the center position 23cp of the collet 23C and is orthogonal to the mounting surface 32m. And an optical system 23o that guides on a central axis 23j. The center position 23cp shown in FIG. 3A is shown for convenience on the side parallel to the paper surface.

  In the present embodiment, the optical system 23o includes two prisms 23p1 and 23p2 provided on the upper portion of the main body 23H, and an optical system support 23s that supports them on the main body 23H. The prism 23p2 is provided such that its optical axis coincides with the central axis 23j. As another example of the optical system, a fiberscope provided with one end facing the head reference mark BM and the other end facing the imaging surface of the imaging camera at the position of the prism 23p2 may be used.

  First, with reference to FIGS. 4 and 5, a method for detecting a temporal posture deviation of the mounting imaging camera 31 and the bonding head 23 with respect to the conveyance path 60 and a method for detecting a temporal posture deviation of the mounting imaging camera 31 with respect to the bonding head 23 will be described. explain.

  FIG. 4 is a diagram illustrating an operation of the mounting imaging camera 31 and the bonding head 23 for detecting a temporal posture deviation between the mounting imaging camera 31 and the bonding head 23. FIG. 5 is a view showing the results obtained by the operation shown in FIG. 4 with respect to the mounting imaging camera 31 and the bonding head 23 with reference to a reference mark straight line HML indicated by a broken line connecting the conveyance reference marks HM1 and HM2. is there. FIG. 5A shows the result of the mounting imaging camera 31, and FIG. 5B shows the result of the bonding head 23. The position of the HMM in FIGS. 5A and 5B is the midpoint of the transport reference marks HM1 and HM2, and indicates a virtual transport reference mark HMM.

  As shown in FIG. 4A, the mounting imaging camera 31 is moved so that the center position of the imaging field of the mounting imaging camera 31 coincides with the center position of the transport reference mark HM1, and the mounting imaging shown in FIG. A position (Xcg1, Ycg1) from the conveyance reference mark HM1 of the camera 31 is obtained. Thereafter, as shown in FIG. 4B, the bonding head 23 is moved so that the center position of the head reference mark BM coincides with the center position of the imaging field of the mounting imaging camera 31, and the bonding shown in FIG. The position (Xbg1, Ybg1) of the head 23 from the conveyance reference mark HM1 is obtained.

  Next, the mounting imaging camera 31 and the bonding head 23 are sequentially moved onto the transport reference mark HM2, and the processing on the transport reference mark HM1 is also performed on the transport reference mark HM2, and FIGS. The position (Xcg2, Ycg2) of the mounting imaging camera 31 from the conveyance reference mark HM2 and the position (Xbg2, Ybg2) of the bonding head 23 from the conveyance reference mark HM1 are obtained, respectively. X is positive in the conveyance direction of the substrate P, and Y is positive in the direction in which the bonding head 23 is directed from the attach stage 32 to the intermediate stage 22.

  From the result shown in FIG. 5, the temporal rotation angle deviation of the bonding head 23 with respect to the reference mark straight line HML is θbg with the clockwise direction being positive. The rotational angle deviation is θcg with the clockwise direction being positive. Further, the temporal rotation angle deviation θbc of the mounting imaging camera 31 with respect to the bonding head 23 is θbg−θcg with the clockwise direction being positive. Each rotational angle deviation does not necessarily have to be positive in the clockwise direction. In short, it is necessary to be positive for the same rotation. In the following description, the rotational angle deviation is performed with the clockwise direction being positive.

  If the bonding head 23 has a rotation axis, the rotation axis is moved on the reference mark straight line HML as the operation origin Bg, and if it is rotated by the rotational angle deviation −θbg, the movement locus Br of the bonding head 23 is moved. Coincides with the reference mark straight line HML. In this embodiment, since the bonding head 23 does not have a rotation shaft, the rotation is performed by an intermediate stage 22 described later. Jcg is the operation origin of the Y drive axis of the mounting imaging camera 31, and Jcr is the movement locus of the mounting imaging camera 31.

  FIG. 6 shows an example in which the operation origin of the X drive shaft of the bonding head 23 is the transport reference mark HM1. In FIG. 6, if the distance between the transport reference marks HM1 and HM2 at the time of initial or previous time-dependent posture deviation detection is Ly, it means that ΔYb has been extended at the time of the current time-time posture deviation detection. However, since ΔYb is not so large that the mounting position deviates from the field of view when the mounting imaging camera 31 reaches the mounting position, ΔYb can be corrected from an image obtained by the mounting imaging camera 31 during actual bonding. Note that the operation origin of the X drive shaft is not limited to the conveyance reference mark HM1, but may be HM2 or an HMM that is a middle point.

  Since the mounting imaging camera 31 can be described in the same manner as the bonding head 23 shown in FIG. The movement locus of the mounting imaging camera 31 coincides with the movement locus Br of the bonding head 23 and the reference mark straight line HML. The operation origin of the mounting imaging camera 31 may not necessarily coincide with the transport reference mark HM1 of the operation origin of the bonding head 23.

  Next, detection of a time-dependent posture shift of the intermediate stage imaging camera 21 will be described with reference to FIGS. FIG. 7 is a diagram illustrating a detection processing flow of the temporal posture deviation of the intermediate stage imaging camera 21. FIG. 8 is a diagram illustrating a detection result of a temporal posture deviation with respect to the bonding head 23 of the intermediate stage imaging camera 21 obtained by the processing. Note that it is not necessary to carry out this as long as the influence of the heating of the transport path 60 and the heating of the intermediate stage 22 is small and the temporal posture deviation of the intermediate stage imaging camera itself can be ignored.

  Before the detection flow of FIG. 7 is performed, when the visual field center position 21c of the intermediate stage imaging camera 21 does not coincide with the rotation axis of the intermediate stage 22, the intermediate stage imaging camera 21 is moved and matched.

  First, as shown in FIG. 8, the bonding head 23 is translated in the Y direction on the alternate long and short dash line passing through the center position 21c of the imaging field of the intermediate stage imaging camera 21 to obtain the imaging BM1 of the head reference mark BM (S1). . Thereafter, the bonding head 23 is translated by a predetermined distance in the X direction, and an imaging BM2 of the head reference mark BM at that time is obtained (S2). The predetermined distance translation may be in the Y direction.

  As shown in FIG. 8, although the head reference mark BM is moved in parallel with the X direction, the head reference marks BM1 and BM2 are connected and the straight line is inclined. It shows that the head is inclined with respect to the head 23, that is, a temporal rotation angle deviation θab is obtained (S3). Since the head reference mark BM1 is on the center position 23cp of the collet 23C, the deviation between the BM1 and the center position 21c of the imaging field of the mounting imaging camera 31 is a positional deviation with respect to the bonding head 31 of the intermediate stage imaging camera 31, A positional shift (Xab, 0) with time is obtained (S4). In the case where the head reference mark BM is a linear mark that is linear in the X direction or the Y direction, the inclination of the alternate long and short dash line that passes through the center position 21c of the imaging field of the intermediate stage imaging camera 21 with respect to the linear mark is performed without performing S2. A time-dependent rotational angle deviation θab can be obtained.

  Thereafter, the intermediate stage 22 is rotated to correct the temporal rotation angle deviation of each mounting unit, but the origin position of the temporal attitude deviation is set so that the X position of each unit is on a straight line so that no positional deviation occurs due to the rotation. to correct. Specifically, the origin positions of the bonding head 23 and the mounting imaging camera 31 are moved by -Xab. As a result, since the position operation origin of the intermediate stage imaging camera 21 and the operation origin of the bonding head 23 and the mounting imaging camera 31 in the X direction are on a straight line, there is no positional deviation between them. The straight line is at a position shifted by Xab from the transport reference mark HM1. Since the positional deviation in the Y direction can be covered by the field of view of the imaging camera as described above, it can be ignored in appearance.

  The correction of the rotation angle deviation with time is not limited to the rotation angle deviation θab with the intermediate stage imaging camera 21 but also the rotation angle deviation θcg of the mounting imaging camera obtained by the transport reference mark HM of the transport path 60 and the mounting imaging of the bonding head 23. It is necessary to carry out with respect to the time-dependent rotational angle deviation that combines the time-dependent rotational angle deviation θbc with respect to the camera 31. Therefore, the total temporal rotation angle deviation θag with respect to the conveyance path 60 of the intermediate stage imaging camera 21 is expressed by Equation (1) or Equation (2). Therefore, the intermediate stage 22 is rotated by -θag to correct all rotational angle deviations over time.

θag = θcg + θbc + θab (1)
= Θcg + (θbg−θcg) + θab
= Θbg + θab (2)
It should be noted that the expression (2) indicates that if the bonding head 23 has a rotation axis, it is possible to correct the time-dependent rotational angle deviation with respect to the conveyance path 60 of all mounting units.

  When the time-dependent posture deviation changes every time, such as the conveyance path 60, the mounting imaging camera 31, and the bonding head 23, the time-dependent posture deviation detection based on the time-dependent change is performed each time. To do.

  As described above, according to the present embodiment, the mounting unit shifts with respect to the transport path 60 over time, that is, each mounting unit with respect to the substrate P placed in the correct posture on the transport path 60, particularly the bonding head 23, mounting imaging. The positional deviation of the camera 31 with time can be corrected, and the positioning accuracy with respect to the transport path, that is, the transported substrate P (mounting position) can be improved.

  Next, the mounting process will be described. In the mounting process, the rotational angle deviation θac relative to the bonding head between the intermediate stage camera (pickup imaging camera) that images the posture of the die when picking up the die and the mounting imaging camera that images the mounting position when bonding the die. However, this affects the positioning accuracy of the die at the mounting position.

θac = θab−θcb = θab + θbc (3)
The content of the expression (3) is included in the expression (1) and is corrected in the processing of the posture deviation with time.

Further, in the mounting process, when positioning is performed with higher accuracy, the mounting process is corrected in consideration of the processing posture deviation described below.
The processing posture deviation is a posture deviation of the substrate P transported to the attach stage 32 or the already mounted die D with respect to the mounting imaging camera 31, and an intermediate stage imaging camera of the die D placed on the intermediate stage 21. The posture deviation with respect to 21 is collectively referred to. Hereinafter, the processing posture deviation will be described with reference to FIG. The processing attitude deviation includes a processing rotation angle deviation and a processing position deviation similarly to the temporal attitude deviation.

  FIG. 9A is a diagram when the mounting position of the new die D is imaged by the mounting imaging camera 31 on the substrate P or the already mounted die D indicated by the broken line conveyed to the attach stage 32. From FIG. 9A, the processing position deviation of the mounting position with respect to the mounting imaging camera 31 is the processing rotation angle deviation θcd, and the processing position deviation is (Xcd, Ycd). Similarly, FIG. 9B shows an image of the die D placed on the intermediate stage 21, and the die processing attitude shift is the processing rotation angle shift θad and the processing position shift is (Xad, Yad). .

From FIG. 9, the processing rotation angle deviation of the die D on the intermediate stage 21 relative to the mounting position on the attach stage 32 is expressed by Equation (4).
Processing rotation angle deviation θd: θcd−θad (4)
Therefore, when the correction of the time-dependent posture deviation and the correction of the processing posture deviation are performed at the same time, as shown in the equation (5), the total rotation angle deviation obtained by adding the rotation angle deviations of both attitude deviations to the middle Correction is performed by rotating the stage 22.
Total rotation angle deviation θs: θag + θd (5)
On the other hand, for the positional deviation, after correcting the total rotational angle deviation of the equation (5), the processing positional deviation (Xad`, Yad`) of the die D on the intermediate stage obtained after the rotation is obtained, and the bonding head 23 is obtained. Correct the position of.

Next, a mounting process flow when the temporal posture deviation and the processing posture deviation are performed simultaneously will be described with reference to FIG.
First, the attach stage 32 obtains a rotation angle deviation θcg, θbc, or θcg with respect to the transport path 60 in advance (S101), and θcd and process position deviation (Xcd, Ycd) of the processing rotation angle deviation of the mounting position with respect to the mounting imaging camera 31. (102). Next, in the intermediate stage 22, the temporal rotation angle deviation θab of the intermediate stage imaging camera 21 with respect to the bonding head 23 is obtained (S103), and the processing rotation angle deviation θad of the die D with respect to the intermediate stage imaging camera 21 is obtained (S104). Thereafter, the total rotation angle deviation θs shown in Expression (5) is obtained from the respective rotation angle deviations obtained in S101 to S104, and the intermediate stage is rotated by −θs (S105).

  Next, the die D on the intermediate stage 22 is imaged to obtain a processing position shift (Xad`, Yad`) of the rotated die D (S106). The bonding head 23 is moved, the processing position deviation (Xad`, Yad`) is corrected, and the die D is picked up (107). The bonding head 23 moves to the attach stage 32, corrects the processing position shift (Xcd, Ycd) of the mounting position, and bonds the die D (108).

  If the posture deviation can be maintained for a certain time, it is determined whether or not the correction of the posture deviation with time is necessary (S100). If necessary, the above steps S101 to S108 are performed. If not, only the correction of the processing posture deviation is performed. That is, in the attach stage, a processing rotation angle deviation θcd and a processing position deviation (Xcd, Ycd) of the mounting position with respect to the mounting imaging camera 31 are obtained in advance (S111). Next, in the intermediate stage 22, a processing rotation angle deviation θad of the die D with respect to the intermediate stage imaging camera 21 is obtained (S112). Then, the processing rotation angle deviation θd shown in Expression (4) is obtained, and the intermediate stage 22 is rotated by −θd (S113). Thereafter, the processing of S106 to S108 is performed.

  In addition, in the case of the stacking process in which the dies are stacked as shown in FIG. 1, when the processing posture deviation of the die D to be stacked is obtained with a predetermined positioning accuracy from the posture of the mounted die D of the attach stage 32. S111 is omitted, and in S108, the processing position shift of the mounting position due to the stacking is corrected as a shift, and the die D is bonded.

  In the above description, the correction of the processing position deviation is performed on each stage. However, in the case where the collet 23C of the bonding head 23 is not the type that takes the die D into the inside, but the type that adsorbs the die D flush with each other, the positioning of the die D with respect to the pickup in the intermediate stage 22 does not necessarily have to be performed with high accuracy. Therefore, the processing position deviation correction may be performed on either stage or while moving to the attach stage 32.

  According to the present embodiment described above, it is possible to detect a change with time of the mounting unit by detecting a time-dependent posture deviation of the mounting unit with respect to the conveyance path, and to accurately bond the die to the mounting position.

  Further, according to the present embodiment described above, it is possible to detect and correct the temporal rotation angle deviation between the intermediate stage imaging camera and the mounting imaging camera by detecting the temporal attitude deviation of the mounting unit with respect to the conveyance path. The die can be accurately bonded to the mounting position.

  Next, a description will be given of a second embodiment of the method for detecting a time-dependent posture deviation with respect to the conveyance path 60. In the first embodiment, the temporal posture deviation detection with respect to the conveyance path 60 of the bonding head 23 and the temporal posture deviation detection with respect to the conveyance path 60 of the mounted imaging camera 31 are simultaneously performed on the two conveyance reference marks HM. In the embodiment, first, the temporal posture deviation of the mounting imaging camera 31 with respect to the conveyance path 60 is detected, and then the temporal posture deviation of the bonding head 23 with respect to the mounting imaging camera 21 is detected.

  The temporal posture deviation detection of the mounting imaging camera 31 in the present embodiment is the same as the first embodiment. In addition, the temporal posture deviation detection for the mounting imaging camera 21 of the bonding head 23 is performed in the same manner as the processing posture deviation detection processing for the bonding head 23 of the intermediate stage imaging camera. That is, the bonding head 23 is moved in the X direction or the Y direction with respect to the mounting imaging camera 31. However, in the first embodiment, the temporal posture deviation of the intermediate stage imaging camera 21 with respect to the bonding head 23 is detected. In this embodiment, the temporal posture deviation of the bonding head 23 with respect to the mounted imaging camera 31 is detected.

  In the second embodiment, the same effects as in the first embodiment can be obtained.

  Furthermore, a third embodiment of the temporal posture deviation detection method for the conveyance path 60 will be described. In the first and second embodiments, the position deviation with time with respect to the mounting imaging camera 31 and the bonding head 23 conveyance path 60 is detected using two conveyance reference marks separated by a certain distance. In the third embodiment, one transport reference mark HM provided on the transport path 60 including the attach stage 32, for example, the head reference mark HM1 is used.

  In the third embodiment, the mounting imaging camera 31 is moved in parallel to the X direction or the Y direction with respect to one conveyance reference mark HM, and the mounting imaging with respect to the conveyance path 60 is performed from the locus of one conveyance reference mark HM at that time. A time-dependent posture shift of the camera 31 is detected. That is, in FIG. 7 and FIG. 8, the head reference mark BM of the bonding head 23 with respect to the imaging camera is moved. In this embodiment, the mounting imaging camera 31 is moved with respect to the fixed transport reference mark HM. A time-dependent posture deviation of the mounting imaging camera 31 with respect to the conveyance path 60 is detected. Subsequent positional deviation detection of the bonding head 23 with respect to the mounted imaging camera 31 is performed in the same manner as in the second embodiment.

  In the third embodiment, the same effect as that of the first embodiment can be obtained.

  Next, a fourth embodiment of the present invention will be described. The fourth embodiment is a second embodiment of a die bonder suitable for the present invention, and will be described with reference to FIG. Unlike the first example, the die bonder 200 according to the second embodiment does not have the intermediate stage 22, and the bonding head 23 directly picks up the die D from the wafer (holding position) W, and the mounting position of the attach table 32. It is a device that directly bonds to the surface.

  In the second embodiment, the supply stage imaging camera 11 that confirms the posture of the die D on the wafer W on the supply stage 12 is a pickup imaging camera. That is, the mounting unit includes the mounting imaging camera 31, the bonding head 23, and the supply stage imaging camera 11 in addition to the conveyance path 60.

  In the second embodiment, Examples 1 to 3 are obtained by using the supply stage imaging camera 11 as the intermediate stage imaging camera 21 of the first embodiment and the supply stage 12 as the intermediate stage 22 of the first embodiment. Can be applied.

  In the fourth embodiment, the same effects as in the first embodiment can be obtained.

  Next, a fifth embodiment of the present invention will be described. The fifth example is a third embodiment of a die bonder suitable for the present invention. The third embodiment is a flip chip bonder. The flip chip bonder picks up the die D from the wafer W, reverses it for delivery, and has a pickup head 13 that can rotate in a plane parallel to the mounting surface 32m having the mounting position. The die D is sucked and held at a position (holding position) where the die D is reversed by the head 13 and bonded to the mounting position. The inverted position corresponds to the intermediate stage 22 of the first embodiment. Other configurations are the same as those of the first embodiment of the die bonder. Therefore, Examples 1 to 3 can be applied to the third embodiment of the die bonder.

  In the fifth embodiment, the same effects as in the first embodiment can be obtained.

11: Supply stage imaging camera 12: Supply stage 13: Pickup head 21: Intermediate stage imaging camera 21c: Center position of imaging field of intermediate stage imaging camera 22: Intermediate stage 23: Bonding head 23C: Collet 23cp: Collet center position 23j : Collet central axis 23m: Mark part 23o; Optical system 23p1, 23p2: Prism 23s: Optical system support part 23K: Imaging camera attitude deviation detection part 23H: Bonding head body 25: Rotation drive device 31: Mounting imaging camera 31c: Mounting Center position of imaging field of imaging camera 32: Attach stage 32m: Mounting surface 34: Heating device 41: Under vision camera 60: Transport path 100, 200: Die bonder D: Die (semiconductor chip) BM, BM1, BM2: Head reference mark HM HM1, HM2: Transport reference mark HML: Reference mark straight line P: Substrate W: Wafer θag: All-time rotational angle deviation with respect to the conveyance path of the intermediate stage imaging camera θab: Rotary angle deviation with respect to the bonding head of the intermediate stage imaging camera θbc: Bonding head Rotation angle deviation with respect to the mounting imaging camera of θbg: deviation of rotation angle with respect to the reference mark line of the bonding head
θcg: Deviation of rotation angle with time relative to the reference mark straight line of the mounted imaging camera θcd: Deviation of processing rotation angle of mounting position with respect to the mounted imaging camera θad: Deviation of processing rotation angle of the die on the intermediate stage with respect to the intermediate stage imaging camera

Claims (10)

A pickup imaging means having a first imaging field;
A mounting position imaging means having a second imaging visual field capable of imaging the mounting position of the die;
A die transfer tool capable of picking up a die in the first imaging field of view and placing the die at a placement position in the second imaging field of view, wherein when the die is picked up, the first The die transfer tool provided with a reference mark at a position where imaging can be performed within the second imaging field when the die is placed at the above-described mounting position and is a position where imaging can be performed within the imaging field;
A first image obtained by imaging the die to be held by the die transfer tool by the pickup imaging means;
A second image obtained by imaging the reference mark provided on the die transfer tool holding the die by the pickup imaging means;
A third image obtained by imaging the target substrate to be placed by the die transfer tool by the placement position imaging means;
A fourth image obtained by imaging the reference mark provided in the die transfer tool holding the die by the placement position imaging unit;
Correction means for correcting placement of a die held by the die transfer tool based on the first image, the second image, the third image, and the fourth image;
Have
The pickup imaging means, imaging means der Rubo bindings device for imaging the first image and the second image at the same position. A pickup imaging means having a first imaging field;
A mounting position imaging means having a second imaging visual field capable of imaging the mounting position of the die;
A die transfer tool capable of picking up a die in the first imaging field of view and placing the die at a placement position in the second imaging field of view, wherein when the die is picked up, the first The die transfer tool provided with a reference mark at a position where imaging can be performed within the second imaging field when the die is placed at the above-described mounting position and is a position where imaging can be performed within the imaging field;
A first image obtained by imaging the die to be held by the die transfer tool by the pickup imaging means;
A second image obtained by imaging the reference mark provided on the die transfer tool holding the die by the pickup imaging means;
A third image obtained by imaging the target substrate to be placed by the die transfer tool by the placement position imaging means;
A fourth image obtained by imaging the reference mark provided in the die transfer tool holding the die by the placement position imaging unit;
Correction means for correcting placement of a die held by the die transfer tool based on the first image, the second image, the third image, and the fourth image;
Have
The placement position imaging means, imaging means der Rubo bindings device for imaging the fourth image and the third image at the same position. The correction means determines the position or direction of the reference mark in the third image based on the relationship between the position or direction of the die in the first image and the position or direction of the reference mark in the second image. the bonding apparatus according to claim 1 or 2 which is a means for correcting. A pickup imaging means having a first imaging field;
A mounting position imaging means having a second imaging visual field capable of imaging the mounting position of the die;
A die transfer tool capable of picking up a die in the first imaging field of view and placing the die at a placement position in the second imaging field of view, wherein when the die is picked up, the first The die transfer tool provided with a reference mark at a position where imaging can be performed within the second imaging field when the die is placed at the above-described mounting position and is a position where imaging can be performed within the imaging field;
A first image obtained by imaging the die to be held by the die transfer tool by the pickup imaging means;
A second image obtained by imaging the reference mark provided on the die transfer tool holding the die by the pickup imaging means;
A third image obtained by imaging the target substrate to be placed by the die transfer tool by the placement position imaging means;
A fourth image obtained by imaging the reference mark provided in the die transfer tool holding the die by the placement position imaging unit;
Correction means for correcting placement of a die held by the die transfer tool based on the first image, the second image, the third image, and the fourth image;
Have
The reference mark, the reference mark der Rubo bindings device can image at the pick-up image pickup means or said placing position imaging means through an optical system having a prism provided in the die transfer tool. A pickup imaging means having a first imaging field;
A mounting position imaging means having a second imaging visual field capable of imaging the mounting position of the die;
A die transfer tool capable of picking up a die in the first imaging field of view and placing the die at a placement position in the second imaging field of view, wherein when the die is picked up, the first The die transfer tool provided with a reference mark at a position where imaging can be performed within the second imaging field when the die is placed at the above-described mounting position and is a position where imaging can be performed within the imaging field;
A first image obtained by imaging the die to be held by the die transfer tool by the pickup imaging means;
A second image obtained by imaging the reference mark provided on the die transfer tool holding the die by the pickup imaging means;
A third image obtained by imaging the target substrate to be placed by the die transfer tool by the placement position imaging means;
A fourth image obtained by imaging the reference mark provided in the die transfer tool holding the die by the placement position imaging unit;
Correction means for correcting placement of a die held by the die transfer tool based on the first image, the second image, the third image, and the fourth image;
Have
The die can be reversed, and has pick-up means that can rotate in a plane parallel to the mounting surface having the mounting position described above,
It said correcting means corrects to Rubo bindings device by the pickup means. A first step in which the pickup imaging means images the die that is to be held by the die transfer tool;
A second step in which the pickup imaging means images a reference mark provided on the die transfer tool holding the die;
A third step in which the placement position imaging means images the substrate on which the die is to be placed;
A fourth step in which the placement position imaging means images the reference mark provided in the die transfer tool holding the die;
A fifth step of correcting placement of the die held by the die transfer tool based on the first step, the second step, the third step, and the fourth step;
Have
The pickup imaging means, the imaging to Rubo bindings methods at the same position the first step and the second step. A first step in which the pickup imaging means images the die that is to be held by the die transfer tool;
A second step in which the pickup imaging means images a reference mark provided on the die transfer tool holding the die;
A third step in which the placement position imaging means images the substrate on which the die is to be placed;
A fourth step in which the placement position imaging means images the reference mark provided in the die transfer tool holding the die;
A fifth step of correcting placement of the die held by the die transfer tool based on the first step, the second step, the third step, and the fourth step;
Have
The placement position imaging means, said third step and said fourth image to Rubo bindings methods at the same position in step. In the fifth step, the position or direction of the die imaged in the first step, the position or direction of the reference mark imaged in the second step, the position or direction of the substrate imaged in the third step The bonding method according to claim 6, wherein the bonding method is a step of correcting based on the direction and the position or direction of the reference mark imaged in the fourth step. A first step in which the pickup imaging means images the die that is to be held by the die transfer tool;
A second step in which the pickup imaging means images a reference mark provided on the die transfer tool holding the die;
A third step in which the placement position imaging means images the substrate on which the die is to be placed;
A fourth step in which the placement position imaging means images the reference mark provided in the die transfer tool holding the die;
A fifth step of correcting placement of the die held by the die transfer tool based on the first step, the second step, the third step, and the fourth step;
Have
The second step or the third step, Step der Rubo bindings method of imaging the reference mark via an optical system having a prism provided in the die transfer tool. A first step in which the pickup imaging means images the die that is to be held by the die transfer tool;
A second step in which the pickup imaging means images a reference mark provided on the die transfer tool holding the die;
A third step in which the placement position imaging means images the substrate on which the die is to be placed;
A fourth step in which the placement position imaging means images the reference mark provided in the die transfer tool holding the die;
A fifth step of correcting placement of the die held by the die transfer tool based on the first step, the second step, the third step, and the fourth step;
Have
The fifth step, it is possible to invert the die, step der Rubo bindings method for correcting a rotatable pick-up means in a plane parallel to the mounting surface with a mounting position.

Images