JP6315882B2 - Method for dividing laminated ceramic substrate - Google Patents

Description

  The present invention relates to a method for dividing a laminated ceramic substrate in which ceramic substrates of different materials are laminated.

  Conventionally, when a laminated ceramic substrate in which a metal layer is laminated on a ceramic substrate is divided, the substrate is often divided using a dicing saw or the like. Patent Document 1 proposes a method of manufacturing a ceramic bonded substrate in which a metal layer is bonded after scribing the ceramic substrate, and then the metal layer on the scribe line is removed by etching and then a break is performed.

JP 2009-252971 A

  In the above-mentioned Patent Document 1, it is necessary to scribe before laminating a metal layer on a ceramic substrate, and there is a problem that the laminated ceramic substrate already laminated is not divided.

  Development of a laminated ceramic substrate in which different types of ceramic substrates are laminated has been progressing, but the method for dividing the substrate has not been established. As a method for dividing the multilayer ceramic substrate, it is conceivable to break the multilayer ceramic substrate by scribing the multilayer ceramic substrate using a scribing wheel, in addition to division by a dicing saw, which is a normal method for dividing a brittle material substrate. In order to divide the laminated ceramic substrates of different materials, a case will be described in which a laminated substrate 100 in which another ceramic substrate 102 is laminated on a ceramic substrate 101 is scribed and broken as shown in FIG. First, as shown in FIG. 1B, the surface of the ceramic substrate 101 is scribed with a scribing wheel 103, and the laminated substrate 100 is held on the supporting members 105 and 106 as shown in FIG. Is pressed by the break bar 104 and breaks. In this case, since the ceramic substrate 101 cannot be separated even if the ceramic substrate 101 can be separated, there is a problem that the ceramic substrate 102 cannot be completely divided even if a break is applied as shown in FIG. .

  As another method, as shown in FIGS. 2A and 2B, scribing is performed on the surface of the other ceramic substrate 102 of the laminated ceramic substrate 100 using a scribing wheel 103. Next, as shown in FIG. 2C, the multilayer ceramic substrate 100 is divided using a break bar 104. In this case, since the ceramic substrate 101 cannot be separated even if the ceramic substrate 102 can be separated, there is a problem that the ceramic substrate 101 cannot be completely divided even if a break is applied as shown in FIG. .

  The present invention has been made in view of such problems, and an object of the present invention is to completely divide and individualize a laminated ceramic substrate in which different types of ceramic substrates are laminated.

In order to solve this problem, the method for dividing a laminated ceramic substrate according to the present invention is a method for dividing a laminated ceramic substrate in which a scribe line is directly formed by directly laminating first and second ceramic substrates of different materials. A first scribe line is formed along a planned dividing line on an opposite surface (outer surface) of the first ceramic substrate to the second ceramic substrate, and the second ceramic substrate. A second scribe line is formed along a line corresponding to the first scribe line on the opposite surface (outer surface) of the laminated surface with the first ceramic substrate, and the first and second scribe lines are formed. Breaking the ceramic substrate along the scribe line by breaking the at least one ceramic substrate along Than is.

  According to the present invention having such a feature, a laminated ceramic substrate on which ceramic substrates of different materials are laminated is scribed from both sides and broken from at least one surface. For this reason, it can divide | segment into a desired shape completely, can be individualized, and the effect that an end surface precision can be improved is acquired.

FIG. 1 is a diagram showing a dividing process when scribing and breaking from one ceramic substrate side of a laminated ceramic substrate. FIG. 2 is a diagram showing a state in which the laminated ceramic substrate is scribed and broken from the other ceramic substrate side. FIG. 3 is a diagram showing a dividing process of the multilayer ceramic substrate according to the embodiment of the present invention. FIG. 4 is a diagram showing a dividing process of the multilayer ceramic substrate according to the embodiment of the present invention.

  FIG. 3A is a diagram showing a laminated ceramic substrate (hereinafter simply referred to as a laminated substrate) 10 to be divided according to an embodiment of the present invention in which different types of first and second ceramic substrates 11 and 12 are laminated. It is. Here, the ceramic substrates 11 and 12 may be LTCC substrates, ceramic substrates such as alumina (HTCC), aluminum nitride, barium titanate, ferrite, silicon nitride, so-called fine ceramics substrates. The plate | board thickness of the ceramic substrates 11 and 12 shall be 0.2-0.4 mm, for example. The material of the first ceramic substrate 11 may be different from that of the ceramic substrate 12. The thickness of the ceramic substrate 11 may be the same as or different from the thickness of the ceramic substrate 12. Here, the first ceramic substrate 11 is a ferrite, and the second ceramic substrate 12 is an LTCC substrate.

  When the laminated substrate 10 is divided in a predetermined pattern, the scribing wheel 13 is first moved by a scribing device (not shown) along a line scheduled to be divided from the first ceramic substrate 11 as shown in FIG. Press and roll to form a scribe. The scribe line thus formed is defined as a first scribe line S1. The scribing wheel used for this scribing may be a scribing wheel capable of highly penetrating scribing, or may be a normal scribing wheel. Here, a scribing wheel capable of high penetration and having a blade edge angle of 155 ° is used. For example, Japanese Patent No. 3074143 proposes a scribing wheel in which a large number of grooves are formed at a predetermined interval on the circumferential surface, and a high penetration can be obtained by using protrusions therebetween. Since ferrite is brittle, it is preferable to scribe shallowly using a blade with a blade edge angle of 155 °.

  Further, the laminated substrate 10 is inverted, and a scribe is formed by a scribe device (not shown) from the surface of the second ceramic substrate 12 directly above the scribe line S1 as shown in FIG. The scribe line thus formed is referred to as a second scribe line S2. In this case, a material that can be scribed with high penetration may be used, or a normal scribing wheel may be used. Here, a scribing wheel 14 capable of highly penetrating scribe is used. The cutting edge angle at this time is set to 110 °, and scribing is performed deeper than the ceramic substrate 11. The type of scribing wheel and the load during scribing are appropriately selected depending on the material, thickness, hardness, etc. of the ceramic substrates 11 and 12.

  Next, as shown in FIG. 3 (d), the tape 17 is disposed on the upper surfaces of the pair of support members 15 and 16 using a break device so that the scribe lines S1 and S2 are positioned between the support members 15 and 16. The laminated substrate 10 is disposed. Then, a break is performed by pushing down the break bar 18 along the second scribe line S2 from above.

  Further, as shown in FIG. 4E, the laminated substrate 10 is inverted, the tape 19 is disposed on the upper surfaces of the support members 15 and 16, and the scribe lines S1 and S2 are positioned between the support members 15 and 16. The substrate 10 is disposed. Then, the break bar 18 is pushed down along the first scribe line S1 from above to break. In this way, as shown in FIG. 4 (f), the laminated substrate 10 can be completely divided and individualized along the scribe lines S1 and S2, and the end face accuracy can be improved. Individual laminated substrate chips can be formed by dividing the laminated ceramic substrate into a lattice shape.

  In the above-described embodiment, the ceramic substrate 11 is scribed and then the ceramic substrate 12 is scribed as shown in FIGS. 3B and 3C. Also good.

  In the above-described example, as shown in FIGS. 3D and 4E, the break is made from the ceramic substrates on both sides by the break device, but one break is performed depending on the type and thickness of the ceramic substrate. This makes it possible to divide. For example, when the scribe penetrates the ceramic substrate 12 sufficiently deep along the scribe line S2 or when the ceramic substrate 11 is sufficiently thin, it can be divided and individualized by breaking from one of the surfaces.

  Although different scribing wheels are used here when scribing the ceramic substrates of the first and second ceramic substrates, they may be the same. As the type of the scribing wheel, an optimum scribing wheel is appropriately selected according to the material, thickness, hardness and the like of the ceramic substrates 11 and 12. The angle of the cutting edge of the scribing wheel, the cribing load, and the like are also appropriately selected according to the ceramic substrate. In general, a shallow scribe may be used for ferrite, and the properties of LTCC vary greatly depending on the sintering temperature, additives, and the like. Therefore, the blade angle and the type of scribing wheel and scribe load suitable for the substrate are used.

  In this embodiment, scribing is performed by rolling the scribing wheel using the scribing device in the steps of FIGS. 3B and 3C, but the scribing may be performed by the laser scribing device. Good. This laser scriber may be a laser scriber that is heated by a laser and then cooled immediately after that to infiltrate the scriber, or may be one that melts and scribes the substrate by increasing the output of the laser itself. Good. Further, a laser scribing apparatus that performs scribing by intermittently irradiating a laser and changing the irradiation position may be used. Moreover, although it has broken using the break device in the step of FIG. 4 (e), if the shape of the small piece to be cut instead is relatively large, the operator may cut it directly by hand. . In this case, the tape 19 is unnecessary.

  INDUSTRIAL APPLICABILITY The present invention can be easily divided into a multilayer ceramic substrate made of different materials by using a scribe device and a break device, and is effective in manufacturing a micro multilayer substrate.

DESCRIPTION OF SYMBOLS 10 Multilayer ceramic substrate 11,12 Ceramic substrate 13,14 Scribing wheel 15,16 Support member 17,19 Tape 18 Break bar

Claims (1)

A method for dividing a laminated ceramic substrate having no scribe line formed by directly laminating first and second ceramic substrates having different material types,
Forming a first scribe line along a line to be cut on a surface opposite to the laminated surface of the first ceramic substrate with the second ceramic substrate;
Forming a second scribe line along a line corresponding to the first scribe line on a surface opposite to the laminated surface of the second ceramic substrate with the first ceramic substrate;
A method for dividing a multilayer ceramic substrate, wherein the ceramic substrate is divided along the scribe line by breaking the at least one ceramic substrate along the first and second scribe lines.

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