JP6314195B2 - Printed wiring board and method for manufacturing the printed wiring board - Google Patents

Description

The present invention relates to a printed wiring board that can achieve a reduction in manufacturing process efficiency and cost reduction, and a method for manufacturing the printed wiring board.

Various printed wiring boards are built in electronic devices such as mobile phones and computer hard disk drives.
In recent years, with the progress of thinner, lighter, and more advanced electronic devices, in the field of printed wiring boards built into electronic devices, printed wiring boards have become thinner (especially thinner conductive layers) and lighter. High-density wiring has become an important development issue.
Conventionally, for example, as a printed wiring board capable of high-density wiring, at least one side of a substrate is 2
A printed wiring board (so-called multilayer printed wiring board) having a conductive layer of more than one layer is often used.
As a prior art showing such a printed wiring board, for example, there is Patent Document 1 below.

JP 2002-43714 A

Conventional printed wiring board (so-called multilayer printed wiring board) as shown in Patent Document 1 above
In general, a conductive layer is formed on an insulating layer through a base layer made of a conductive metal. In general, a base layer is formed using a sputtering method.
Such a conventional printed wiring board has an advantage that a thin conductive layer can be realized by forming a thin base layer.
However, since it is the structure which forms a base layer using sputtering method, a vacuum installation is required and installation cost, such as construction of an installation, a maintenance, and an operation, becomes high. Therefore, there has been a problem that the manufacturing cost cannot be reduced.
In addition, since all processes such as material supply and thin film formation must be performed in a vacuum, there is a problem that the efficiency of the manufacturing process cannot be realized.
In addition, since the underlayer formed by sputtering generally contains chromium (Cr), the underlayer becomes a difficult-to-etch layer. Therefore, the etching process for removing the unnecessary underlayer takes time, and in some cases, another process for removing the unnecessary underlayer is required in addition to the etching process. Therefore, there has been a problem that the efficiency of the manufacturing process and the cost saving of the manufacturing cost cannot be realized.

Therefore, the present invention solves the above-mentioned conventional problems, and can provide a printed wiring board that can be thinned and can be made thin, and can provide a manufacturing process that is more efficient and manufacturing costs can be reduced. Let it be an issue.

The printed wiring board of the present invention includes a first conductive layer, an insulating layer, and a second conductive layer on at least one side of the base material, and the second conductive layer includes the base layer made of a layer containing metal particles. The first feature is that the insulating layer is laminated.

According to the first aspect of the present invention, the printed wiring board includes a first conductive layer, an insulating layer, and a second conductive layer on at least one side of the substrate, and the second conductive layer includes metal particles. Since it is laminated | stacked on the said insulating layer through the base layer which consists of layers, in order to form a base layer, the expensive vacuum equipment required for physical vapor depositions, such as sputtering, is not required. Therefore, the efficiency of the manufacturing process and the cost saving of the manufacturing cost can be realized.
If nano-order metal particles are used, a sufficiently thin underlayer can be formed. Therefore, it can be set as the printed wiring board which can be reduced in thickness.

In the printed wiring board of the present invention, in addition to the first feature of the present invention, the insulating layer includes an opening, the first conductive layer exposed from the opening, and the second conductive layer. Is electrically connected through the underlayer.

According to the second feature of the present invention, in addition to the function and effect of the first feature of the present invention,
The insulating layer includes an opening, and the first conductive layer exposed from the opening and the second conductive layer are electrically connected via a base layer, so that high-density wiring and high functionality are achieved. It can be set as the printed wiring board which can be made.

In addition to the first or second feature of the present invention, the printed wiring board of the present invention has a third feature that the average particle diameter of the metal particles is 1 nm to 500 nm.

According to the third feature of the present invention, in addition to the function and effect of the first or second feature of the present invention, the average particle diameter of the metal particles is 1 nm to 500 nm. The number of the underlayers can be reduced.

The printed wiring board of the present invention has a fourth feature that, in addition to any one of the first to third features of the present invention, the metal particles are copper.

According to the fourth aspect of the present invention, in addition to the function and effect of any one of the first to third aspects of the present invention, the metal particles are copper, and therefore only an etching process is performed. Thus, an unnecessary underlayer can be easily removed. Therefore, the efficiency of the manufacturing process and the cost saving of the manufacturing cost can be further realized.

Moreover, the printed wiring board of this invention makes it 5th characteristic to provide a metal support layer in an outermost layer in addition to any one of the said 1st-4th characteristics of this invention.

According to the fifth aspect of the present invention, in addition to the operational effect of any one of the first to fourth aspects of the present invention, the outermost layer is provided with the metal support layer, so that the manufacturing process is more efficient. Thus, it is possible to realize a printed wiring board including a metal support layer capable of reducing the manufacturing cost and reducing the manufacturing cost.

The method for manufacturing a printed wiring board of the present invention includes a step of forming a first conductive layer on at least one side of a substrate, a step of forming an insulating layer above the first conductive layer, A sixth feature is that it includes at least a step of forming a base layer by applying a conductive ink containing metal particles on the surface and a step of forming a second conductive layer on the surface of the base layer.

According to the sixth aspect of the present invention, the printed wiring board manufacturing method includes the step of forming the first conductive layer on at least one side of the base material, and the formation of the insulating layer above the first conductive layer. Process,
The base layer is formed by including at least a step of forming a base layer by applying a conductive ink containing metal particles to the surface of the insulating layer and a step of forming a second conductive layer on the surface of the base layer. Therefore, expensive vacuum equipment required for physical vapor deposition such as sputtering is not required. Therefore, the efficiency of the manufacturing process and the cost saving of the manufacturing cost can be realized.
If nano-order metal particles are used, a sufficiently thin underlayer can be formed. Therefore, a thin printed wiring board can be manufactured effectively.

In addition to the sixth feature, the method for producing a printed wiring board of the present invention has a seventh feature that the step of forming the second conductive layer is an electrolytic plating method.

According to the seventh aspect of the present invention, in addition to the function and effect of the sixth aspect of the present invention,
Since the step of forming the second conductive layer is an electrolytic plating method, a printed wiring board having fine and high-density wiring can be efficiently formed.

In addition to the sixth or seventh feature, the method for manufacturing a printed wiring board according to the present invention has an eighth feature that the step of forming the insulating layer uses a photosensitive polyimide solution.

According to the eighth feature of the present invention, in addition to the function and effect of the sixth or seventh feature of the present invention, the step of forming the insulating layer uses a photosensitive polyimide solution. It is possible to form a thin insulating layer with good followability to wiring.

According to the printed wiring board of the present invention, the manufacturing process can be made more efficient and the manufacturing cost can be reduced, and the printed wiring board can be thinned. In addition, it is possible to realize a printed wiring board including a metal support layer that can be made thin while being able to improve the efficiency of the manufacturing process and save the manufacturing cost.
Moreover, according to the method for manufacturing a printed wiring board of the present invention, it is possible to realize the efficiency of the manufacturing process and the reduction in manufacturing cost, and it is possible to effectively manufacture a thin printed wiring board. Moreover, a printed wiring board provided with fine and high-density wiring can be efficiently formed. In addition, a thin insulating layer can be effectively formed with good followability to fine wiring.

It is sectional drawing of the principal part which shows the printed wiring board which concerns on embodiment of this invention. It is sectional drawing which simplifies and shows the manufacturing method of the printed wiring board which concerns on embodiment of this invention. It is sectional drawing which simplifies and shows the manufacturing method of the printed wiring board which concerns on embodiment of this invention. It is sectional drawing of the principal part which shows the modification of the printed wiring board which concerns on embodiment of this invention. It is sectional drawing of the principal part which shows the conventional printed wiring board.

With reference to the following drawings, a printed wiring board 1 and a printed wiring board 1 according to an embodiment of the present invention
The manufacturing method will be described for the understanding of the present invention. However, the following description is an embodiment of the present invention, and does not limit the contents described in the claims.

  First, a printed wiring board 1 according to an embodiment of the present invention will be described with reference to FIG.

The printed wiring board 1 according to the embodiment of the present invention includes a plurality of conductive layers 20 and a plurality of insulating layers 30 on one side of a base material 10 made of an insulating resin, and the conductive layers 20 and the insulating layers 30 are provided. This is a flexible printed wiring board (so-called multilayer printed wiring board) that is laminated alternately.
In addition, the flexible printed wiring board has at least one conductive layer 20 laminated on the insulating layer 30 with a base layer 40 interposed therebetween.
As shown in FIG. 1, the printed wiring board 1 includes a base material 10, a conductive layer 20, an insulating layer 30, and a base layer 40.

The base material 10 is a base of the printed wiring board 1, and in the present embodiment,
It is formed only with an insulating resin film.
As a resin film, what consists of a resin material excellent in the softness | flexibility is used. For example, any film may be used as long as it is normally used as a resin film for forming a substrate of a printed wiring board, such as a polyimide film or a polyester film.
In particular, it is desirable to have high heat resistance in addition to flexibility. For example, polyamide resin films, polyimide resin films such as polyimide and polyamideimide, and polyethylene naphthalate can be preferably used.
As the heat resistant resin, any resin may be used as long as it is usually used as a heat resistant resin for forming a printed wiring board, such as a polyimide resin or an epoxy resin.
In addition, the thickness of the base material 10 is desirably about 3 μm to 50 μm, more preferably 5 μm to 20 μm. This is because if it is less than 3 μm, the insulation cannot be maintained, and if it exceeds 50 μm, flexibility is lost.

The conductive layer 20 is a layer for forming wiring, electrodes, and the like of the printed wiring board 1 and is formed of a conductive metal.
In the present embodiment, the conductive layer 20 is formed by electrolytic plating.
In the present embodiment, copper (Cu) is used as the conductive metal.
Of course, the material is not limited to copper (Cu), and any metal that is normally used as a conductive metal for forming the wiring of the printed wiring board can be used.
Moreover, in this embodiment, as shown in FIG. 1, it is set as the structure provided with the two conductive layers 20 of the 1st conductive layer 21 and the 2nd conductive layer 22 which are laminated | stacked on both sides of the 1st insulating layer 31. As shown in FIG. . Further, the second conductive layer 22 is laminated on the first insulating layer 31 via the base layer 40.
The thickness of the conductive layer 20 is about 3 μm to 30 μm, more preferably 8 μm to 20 μm.
Is desirable. If the thickness is less than 3 μm, the current capacity cannot be secured, and if it exceeds 30 μm, the flexibility is lost.

The insulating layer 30 is a layer for ensuring insulation of the printed wiring board 1.
In this embodiment, the insulating layer 30 is formed using a photosensitive polyimide solution.
Moreover, in this embodiment, as shown in FIG. 1, the surface of the base material 10 and the surface of the 1st conductive layer 21, the 1st insulating layer 31 laminated | stacked, the surface of the 2nd conductive layer 22, and the 1st insulating layer The second insulating layer 32 and the second insulating layer 32 are stacked on the surface of 31.
The thickness of the insulating layer 30 is about 2 μm to 30 μm, more preferably 5 μm to 20 μm.
Is desirable. If the thickness is less than 2 μm, the conductor coating will be insufficient, and 30 μm
This is because the flexibility is lost when the value exceeds.

The base layer 40 mainly imparts conductivity to the surface of the insulating layer 30, so that the insulating layer 30
This is a layer serving as a base for forming the conductive layer 20 thereon. In addition, in this embodiment, FIG.
As shown in FIG. 2, the first conductive layer 21 and the second conductive layer 22 serve as an intermediate layer (conductive layer) for electrical connection.
More specifically, as shown in FIG. 1, the base layer 40 is formed on the surface of the first insulating layer 31 and the surface of the first conductive layer 21 exposed from the opening K provided in the first insulating layer 31. It is as.
As will be described later in detail, the underlayer 40 is configured as a layer containing metal particles.
The thickness of the underlayer 40 is about 50 nm to 1000 nm, more preferably 200 nm.
It is desirable to set it to ˜400 nm. This is because if the thickness is less than 50 nm, the coating of the metal particles is insufficient and the adhesion is lowered, and if it exceeds 1000 nm, voids are generated and the adhesion is reduced.

In the present embodiment, the conductive ink is configured to include a metal particle as a conductive substance that provides conductivity, a dispersant that disperses the metal particle, and a dispersion medium.

Moreover, in this embodiment, it is set as the structure which uses copper (Cu) as a metal particle.
Of course, it is not limited to copper (Cu), but also copper (Cu), nickel (Ni), titanium (T
i) Any one or more elements of vanadium (V) and oxides thereof may be used.

In addition, the size of the metal particles contained in the conductive ink has an average particle diameter of 1 nm to 500 nm.
It is desirable to use a thing of a grade. This average particle diameter is remarkably smaller than that for ordinary coating, and is suitable for obtaining a dense conductive film with little variation. When the average particle diameter is less than 1 nm, the dispersibility and stability in the ink are not necessarily good, and the particles are too small, and it takes time to apply the coating for lamination. Moreover, when exceeding 500 nm, it is easy to precipitate and it becomes easy to produce an unevenness | corrugation when apply | coating. Considering dispersibility, stability, unevenness prevention, etc.
It is desirable to use a material having a thickness of 30 nm to 100 nm.

The number of particles per unit area (per 1 mm ² ) of the metal particles is preferably 1 × 10 ⁹ to 1 × 10 ¹¹ when the average particle diameter of the metal particles is 10 nm. Further, when the average particle diameter of the metal particles is 50 nm, it is desirable that the number is 5 × 10 ⁷ to 4.6 × 10 ⁹ . When the average particle diameter of the metal particles is 100 nm, 1 × 10
It is desirable that the number is ⁸ to 1 × 10 ¹⁰ .
That is, when it is assumed that the metal particles are spherical, the coverage per unit area is 0.1 to 1.
0 is desirable, and more preferably, the coverage per unit area is 0.2 to 3.

Further, the metal particles contained in the conductive ink can be obtained by a titanium redox method.
Here, the “titanium redox method” means a method in which metal element ions are reduced by a redox action when trivalent Ti ions are oxidized to tetravalent, and metal particles are precipitated. . The metal particles obtained by the titanium redox method have a small particle size and are uniform, and can be formed into a spherical shape or a granular shape. Therefore, the underlayer 40 can be formed thin and a dense layer.

The viscosity of the conductive ink is 1.00 mPa · s to 2.0 mPa · s at 50 rpm.
The degree, more preferably 1.05 mPa · s to 1.15 mPa · s is desirable.
This is because when the thickness is less than 1.00 mPa · s, the variation in film thickness becomes large, and 2.00 mPa · s.
-It is because a void will become easy to enter when it exceeds s.

Next, a method for manufacturing the printed wiring board 1 according to the embodiment of the present invention will be described with reference to FIGS.

First, referring to FIG. 2A, the first conductive layer 21 is formed on the surface of the substrate 10. More specifically, the first conductive layer 21 is formed on the surface of the substrate 10 by electrolytic copper plating.
Thereafter, referring to FIG. 2B, the first insulating layer 31 including the opening K is formed on the surfaces of the base material 10 and the first conductive layer 21. More specifically, although not shown, the substrate 10 and the first
Liquid photosensitive polyimide is applied to the entire surface of the conductive layer 21. And the 1st insulating layer 31 provided with the opening part K on the surface of the base material 10 and the 1st conductive layer 21 is formed by performing a known exposure process, a development process, and an etching process on predetermined conditions.
Thereafter, referring to FIG. 2C, the first exposed from the surface of the first insulating layer 31 and the opening K.
A base layer 40 is formed on the surface of the conductive layer 21. More specifically, although not shown, a conductive ink containing metal particles is applied to the surface of the first insulating layer 31 and the surface of the first conductive layer 21 by using application means (bar coat printing). Then, the applied conductive ink is baked using heat treatment means, and the metal particles in the conductive ink are fixed to the surface of the first insulating layer 31 and the surface of the first conductive layer 21. Thereby, the foundation layer 40 comprised as a layer containing a metal particle is formed.
Thereafter, referring to FIG. 3A, the second conductive layer 22 is formed on the surface of the base layer 40. More specifically, the second conductive layer 22 is formed on the surface of the base layer 40 by electrolytic copper plating using a semi-additive method.
Thereafter, referring to FIG. 3B, unnecessary base layer 40 is removed. More specifically, a portion of the base layer 40 where the second conductive layer 22 is not stacked is removed by etching.
Thereafter, referring to FIG. 3C, on the surface of the second conductive layer 22 and the surface of the first insulating layer 31,
A second insulating layer 32 is formed. More specifically, although not shown, liquid photosensitive polyimide is applied to the entire surface of the second conductive layer 22 and the surface of the first insulating layer 31. Then, by performing known exposure processing, development processing, and etching processing under predetermined conditions, the second insulating layer 32 is formed on the surface of the second conductive layer 22 and the surface of the first insulating layer 31.
By passing through the above process, the printed wiring board 1 which concerns on embodiment of this invention shown in FIG.3 (c) is formed.

Below, the manufacturing method of the printed wiring board 1 and the printed wiring board 1 of embodiment of this invention is demonstrated in detail.

(Method for producing metal particles)
The manufacturing method of a metal particle includes the titanium redox method mentioned above, and the following manufacturing methods are possible.
The metal particles can be produced by a conventionally known method such as a high temperature treatment method called an impregnation method, a liquid phase reduction method, or a gas phase method.
In order to produce metal particles by the liquid phase reduction method, for example, in water, a water-soluble metal compound that is a source of metal ions forming the metal particles and a dispersant are dissolved, and a reducing agent is added. Preferably, the metal ion may be subjected to a reduction reaction for a certain time under stirring. Of course, when metal particles made of an alloy are produced by a liquid phase reduction method, two or more water-soluble metal compounds are used.
In the case of the liquid phase reduction method, the produced metal particles are spherical or granular in shape, have a sharp particle size distribution, and can be made into fine particles.
For example, in the case of Ni, nickel chloride (II) hexahydrate [NiCl ₂ .6H ₂ O], nickel nitrate (II) hexahydrate [Ni is used as the water-soluble metal compound that is the source of the metal ion.
(NO ₃ ) ₂ · 6H ₂ O]. In the case of Cu, copper nitrate (II) [
Cu (NO ₃ ) ₂ ] and copper (II) sulfate pentahydrate [CuSO ₄ .5H ₂ O] can be mentioned. For other metal particles, water-soluble compounds such as chlorides, nitric acid compounds and sulfuric acid compounds can be used.

(Reducing agent)
As a reducing agent when producing metal particles by the oxidation-reduction method, various reducing agents capable of reducing and precipitating metal ions in a liquid phase (aqueous solution) reaction system can be used. For example, sodium borohydride, sodium hypophosphite, hydrazine, transition metal ions such as trivalent titanium ions and divalent cobalt ions, reducing sugars such as ascorbic acid, glucose and fructose, ethylene glycol, glycerin, etc. Mention may be made of polyhydric alcohols. Among these, the titanium redox method described above is a method of reducing and precipitating metal ions by redox action when trivalent titanium ions are oxidized to tetravalent.

(Dispersant for conductive ink)
As the dispersant contained in the conductive ink, various dispersants having a molecular weight of 2000 to 100,000 and capable of favorably dispersing the metal particles precipitated in the dispersion medium can be used. By using a dispersant having a molecular weight of 2,000 to 100,000, the metal particles can be favorably dispersed in the dispersion medium, and the film quality of the resulting underlayer 40 can be made dense and defect-free. If the molecular weight of the dispersant is less than 2000, the effect of preventing the aggregation of metal particles and maintaining the dispersion may not be sufficiently obtained, and as a result, the underlying layer 40 may not be dense and have few defects. When the molecular weight exceeds 100,000, the bulk is too large, and in the heat treatment performed after the application of the conductive ink, the sintering of the metal particles is inhibited and voids are generated, or the film quality of the underlayer 40 is reduced. Or the decomposition residue of the dispersant may reduce the conductivity.
In addition, it is preferable that the dispersant does not contain sulfur, phosphorus, boron, halogen, or alkali from the viewpoint of prevention of component deterioration.
Preferred dispersants are those having a molecular weight in the range of 2,000 to 100,000, and amine-based polymer dispersants such as polyethyleneimine and polyvinylpyrrolidone, and also have a carboxylic acid group in the molecule such as polyacrylic acid and carboxymethylcellulose. Hydrocarbon polymer dispersant, poval (polyvinyl alcohol), styrene-maleic acid copolymer, olefin-maleic acid copolymer, or copolymer having a polyethyleneimine moiety and a polyethylene oxide moiety in one molecule And a polymer dispersant having a polar group of
The dispersant can be added to the reaction system in the form of a solution dissolved in water or a water-soluble organic solvent.
It is preferable that the content rate of a dispersing agent is 1-60 weight part per 100 weight part of metal particles. When the content ratio of the dispersant is less than the above range, there is a possibility that the effect of preventing the aggregation by dispersing the metal particles around the metal particles in the conductive ink containing water is insufficient. When the above range is exceeded, during the baking heat treatment after the coating of the conductive ink, the excessive dispersant inhibits the baking including the sintering of the metal particles, thereby causing voids or reducing the denseness of the film quality. In addition, the decomposition residue of the polymer dispersant may remain in the underlayer 40 as an impurity, and the conductivity of the underlayer 40 may be reduced.

(Metallic particle size adjustment)
To adjust the particle size of the metal particles, adjust the type and blending ratio of the metal compound, dispersant, and reducing agent, and adjust the stirring speed, temperature, time, pH, etc. when the metal compound is reduced. That's fine.
For example, the pH of the reaction system is preferably 7 to 13 in order to obtain particles having a fine particle size as in the present invention.
In order to adjust the pH of the reaction system to 7 to 13, a pH adjusting agent can be used. As this pH adjuster, common acids and alkalis such as hydrochloric acid, sulfuric acid, sodium hydroxide and sodium carbonate are used. In particular, in order to prevent deterioration of peripheral members, alkali metals and alkaline earth metals, Does not contain halogen elements such as chlorine and impurity elements such as sulfur, phosphorus and boron.
Nitric acid and ammonia are preferred.
In the embodiment of the present invention, the metal particles having an average particle size in the range of 30 nm to 100 nm are used, but an acceptable particle having an average particle size in the range of 1 nm to 500 nm can be used.
Here, the average particle diameter is represented by the center diameter D50 of the particle size distribution in the dispersion, and was measured using a Nikkiso Microtrac particle size distribution meter (UPA-150EX).

(Adjustment of conductive ink)
The metal particles deposited in the liquid phase reaction system can be adjusted to a conductive ink using a powder once passed through processes such as separation, washing, drying, and crushing. in this case,
Powdered metal particles, water as a dispersion medium, a dispersant, and, if necessary, a water-soluble organic solvent can be blended at a predetermined ratio to obtain a conductive ink containing metal particles. .
Preferably, the conductive ink is prepared using a liquid phase (aqueous solution) reaction system in which metal particles are deposited as a starting material.
That is, the liquid phase (aqueous solution) of the reaction system containing the precipitated metal particles is subjected to treatments such as ultrafiltration, centrifugation, washing with water, and electrodialysis to remove impurities, and if necessary, concentrated to remove water. Or, conversely, after adjusting the concentration of the metal particles by adding water, if necessary, a conductive ink containing the metal particles is prepared by blending a water-soluble organic solvent in a predetermined ratio. In this method, generation of coarse and irregular particles due to aggregation of metal particles during drying can be prevented, and a dense and uniform underlayer 40 can be obtained.

(Dispersion medium)
The ratio of water as a dispersion medium in the conductive ink is 20 to 1 per 100 parts by weight of the metal particles.
It is preferably 900 parts by weight. If the water content is less than the above range, the effect of dispersing the water-based dispersant sufficiently and dispersing the metal particles surrounded by the dispersant may be insufficient. When the water content exceeds the above range, the ratio of the metal particles in the conductive ink decreases, which is necessary for the surface of the first insulating layer 31 and the surface of the first conductive layer 21 exposed from the opening K. There is a possibility that a good coating layer having thickness and density cannot be formed.

The organic solvent (binder) blended in the conductive ink as necessary can be various organic solvents that are water-soluble. Specific examples thereof include methyl alcohol, ethyl alcohol, n
Alcohols such as propyl alcohol, isopropyl alcohol, n-butyl alcohol, isobutyl alcohol, sec-butyl alcohol, tert-butyl alcohol,
Examples thereof include ketones such as acetone and methyl ethyl ketone, polyhydric alcohols such as ethylene glycol and glycerin and other esters, and glycol ethers such as ethylene glycol monoethyl ether and diethylene glycol monobutyl ether.
The content ratio of the water-soluble organic solvent is preferably 30 to 900 parts by weight per 100 parts by weight of the metal particles. If the content ratio of the water-soluble organic solvent is less than the above range, the effect of adjusting the viscosity and vapor pressure of the dispersion due to the inclusion of the organic solvent may not be sufficiently obtained. When the above range is exceeded, there is a possibility that the effect of dispersing the metal particles in the conductive ink satisfactorily without causing aggregation by sufficiently swelling the dispersant with water.

(Heat treatment of conductive ink)
The conductive ink applied to the surface of the first insulating layer 31 and the surface of the first conductive layer 21 exposed from the opening K is heat-treated, whereby the first exposed from the surface of the first insulating layer 31 and the opening K. An underlayer 40 is obtained as a layer containing metal particles on the surface of the conductive layer 21.
By heat treatment, the dispersant and other organic substances contained in the applied conductive ink are volatilized and decomposed by heat to remove them from the coating layer, and the remaining metal particles are in a sintered state or a stage before sintering. In such a state that they are in close contact with each other and solidly bonded, they are firmly fixed to the surface of the first insulating layer 31 and the surface of the first conductive layer 21 exposed from the opening K.
The heat treatment may be performed in the air. Further, in order to prevent oxidation of the metal particles, it may be further fired in a reducing atmosphere after firing in the air. The firing temperature can be set to 700 ° C. or less from the viewpoint of suppressing the crystal grain size of the metal of the underlayer 40 formed by the firing from becoming too large or the generation of voids. The lower limit of the heat treatment temperature is preferably 150 ° C. or higher in consideration of the purpose of removing organic substances other than metal particles contained in the conductive ink from the coating layer.
As the heat treatment atmosphere, especially considering that the metal particles to be laminated are extremely fine,
In order to satisfactorily prevent the oxidation, the O ₂ concentration is set to 1000 ppm or less, for example, O ₂
A non-oxidizing atmosphere with a reduced concentration can be obtained. Furthermore, for example, a reducing atmosphere can be obtained by containing hydrogen at a concentration lower than the lower explosion limit (3%).

The printed wiring board 1 and the method for manufacturing the printed wiring board 1 according to the embodiment of the present invention having such a configuration have the following effects.

By configuring the underlayer 40 as a layer containing metal particles, expensive vacuum equipment necessary for physical vapor deposition such as sputtering is not required to form the underlayer 40. Therefore, printed wiring board 1 (multilayer printed wiring board) that can realize efficiency of manufacturing process and cost saving of manufacturing cost.
It can be.
Further, by using nano-order metal particles, a sufficiently thin underlayer 40 can be formed. Therefore, it can be set as the printed wiring board 1 (multilayer printed wiring board) which can be reduced in thickness.
Further, by electrically connecting the first conductive layer 21 and the second conductive layer 22 through the base layer 40, the printed wiring board 1 capable of high density wiring and high functionality can be obtained.
Further, by using copper as the metal particles contained in the conductive ink forming the base layer 40, the unnecessary base layer 40 can be easily removed simply by performing an etching process. Therefore, the efficiency of the manufacturing process and the cost saving of the manufacturing cost can be further realized.
Further, by forming the first conductive layer 21 and the second conductive layer 22 by electrolytic copper plating, the printed wiring board 1 including fine and high-density wiring can be efficiently formed. Therefore, the printed wiring board 1 can be made highly functional.
Further, by forming the insulating layer 30 with liquid photosensitive polyimide, it is possible to effectively form the thin insulating layer 30 with good followability to fine wiring. Therefore, it can be set as the printed wiring board 1 (multilayer printed wiring board) which can be reduced in thickness further.

On the other hand, the conventional printed wiring board 3 (so-called multilayer printed wiring board) shown in FIG. 5 generally forms the base layer 7 using a sputtering method.
Therefore, since vacuum equipment is required, there is a problem that equipment costs such as construction, maintenance, operation, etc. of equipment are high, and manufacturing costs cannot be reduced.
In addition, since all processes such as material supply and thin film formation must be performed in a vacuum, there is a problem that the efficiency of the manufacturing process cannot be realized.
Moreover, since the underlayer 7 formed by sputtering generally contains chromium (Cr), the underlayer 7 becomes a difficult-to-etch layer. Therefore, unnecessary underlayer 7
The etching process for removing the film takes time, and in some cases, another process for removing the unnecessary underlayer 7 is required in addition to the etching process. Therefore, there has been a problem that the efficiency of the manufacturing process and the reduction of the manufacturing cost cannot be realized.
In the conventional printed wiring board 3, the base member 4, the conductive layer 5, and the insulating layer 6 are the same members as the base member 10, the conductive layer 20, and the insulating layer 30 of the printed wiring board 1 in the embodiment of the present invention described above. Therefore, the following detailed description will be omitted.

Therefore, by using the configuration of the printed wiring board 1 according to the embodiment of the present invention, it is possible to realize the efficiency of the manufacturing process and the reduction of the manufacturing cost, and the printed wiring board 1 (
A so-called multilayer printed wiring board).
Moreover, a printed wiring board provided with fine and high-density wiring can be efficiently formed.

Next, with reference to FIG. 4, the modification of the printed wiring board 1 which concerns on embodiment of this invention is demonstrated.
The printed wiring board 2 according to this modification is a printed wiring board mainly used as a flexure (a so-called suspension board with a wiring circuit) built in a hard disk device of a computer (not shown), and according to the above-described embodiment of the present invention. The metal support layer 50 is provided on the printed wiring board 1.
Since the other configuration is the same as that of the printed wiring board 1 described above, the same member and the same function are given the same number and the same alphabet, and the following detailed description is omitted.

In this modification, as shown in FIG. 4, the metal support layer 50 is formed on the outermost layer of the printed wiring board 2.
Is provided. More specifically, the metal support layer 50 is provided on the lower surface of the substrate 10.
The metal support layer 50 can be formed by attaching a metal support substrate to the lower surface of the base material 10 via an adhesive (not shown).

Although not shown in detail, the metal support board constituting the metal support layer 50 is made of a flat metal foil or a metal thin plate, and ensures the rigidity of the printed wiring board 2 and forms an electrical ground. Is.
In this modification, stainless steel (SUS) is used as the metal for forming the metal support substrate.
Is used.
Of course, the metal forming the metal support substrate is not limited to stainless steel, and any metal may be used as long as it is normally used as a metal forming the metal support substrate constituting the printed wiring board, such as aluminum. .
The thickness of the metal support layer 50 is desirably about 10 μm to 40 μm, more preferably 15 μm to 25 μm when stainless steel is used as the metal forming the metal support substrate. This is because if the thickness is less than 10 μm, the rigidity is insufficient and plastic deformation is likely to occur during the assembly, and if it exceeds 40 μm, the rigidity is too strong and the gap between the disk and the disk cannot be kept constant.

By using the printed wiring board 2 having such a configuration, the manufacturing process can be made more efficient, the manufacturing cost can be reduced, and the thickness can be reduced, for example, as a flexure (so-called suspension board with a wiring circuit). The wiring board 2 can be used.
In addition, it is possible to efficiently form a high-performance printed wiring board 2 that can be used as, for example, a flexure, which includes fine and high-density wiring.

In the present embodiment, a plurality of conductive layers 20 and a plurality of insulating layers 3 are provided on one side of the substrate 10.
However, the present invention is not necessarily limited to such a configuration, and may be configured to include a plurality of conductive layers 20 and a plurality of insulating layers 30 on both sides of the base material 10.
Further, the number of conductive layers 20 and insulating layers 30 is not limited to that of the present embodiment, and can be changed as appropriate.
In the present embodiment, the first insulating layer 31 in which the second conductive layer 22 is laminated via the base layer 40 is provided on the surface of the first conductive layer 21 (immediately above). It is not limited to a simple configuration. For example, one or more other insulating layers and one or more other conductive layers are alternately stacked on the surface of the first conductive layer 21, and the second conductive layer 22 is formed thereon via the base layer 40. It is good also as a structure which provides the 1st insulating layer 31 which laminates | stacks. That is, the first conductive layer 2
1, the position of the first insulating layer 31 on the printed wiring board can be appropriately changed. Here, “above the first conductive layer 21” means the upper side of the first conductive layer. The upper side of the first conductive layer 21 (the upper side in contact with the surface of the first conductive layer 21), the second It is a concept that includes both an upper side that is not directly above one conductive layer 21 (an upper side that does not contact the surface of the first conductive layer 21).
In the present embodiment, the printed wiring board is provided with only one conductive layer laminated on the insulating layer via the base layer. However, the present invention is not limited to such a configuration. It is good also as a structure used as a printed wiring board provided with two or more conductive layers laminated | stacked via a base layer on a layer.
In this embodiment, the bar coat printing is used as the means for applying the conductive ink. However, the invention is not necessarily limited to such a structure, and other application means may be used. For example, screen printing can be used.
In the present embodiment, the insulating layer 30 is formed of liquid photosensitive polyimide. However, the insulating layer 30 is not necessarily limited to such a configuration, and the insulating layer 30 may be formed of other materials. . For example, the insulating layer 30 can be formed of a film-like photosensitive polyimide (so-called dry film resist). In this case, however, the thickness of the insulating layer 30 is desirably about 5 to 30 μm, more preferably 10 to 20 μm.
This is because if the thickness is less than 5 μm, the followability to the concavo-convex portion is deteriorated, and if it exceeds 30 μm, the resolution is lowered.
In the present embodiment, the printed wiring board 10 is configured as a flexible printed wiring board, but is not necessarily limited to such a configuration, and is configured as another printed wiring board such as a rigid flexible printed wiring board. It is good.
Moreover, in this embodiment, the base material 10 formed by only one layer of an insulating resin film.
However, the configuration of the base material 10 is not necessarily limited to such a configuration. For example, the base material 10 is formed of an insulating resin film and a so-called single-sided printed wiring board in which one or more conductive layers and one or more insulating layers are laminated on one side of the insulating resin film. It is good also as a structure to form. The base 10 is formed of a so-called double-sided printed wiring board in which an insulating resin film and one or more conductive layers and one or more insulating layers are laminated on both sides of the insulating resin film. It is good also as composition to do.

According to the present invention, the efficiency of the manufacturing process and the reduction of the manufacturing cost can be realized, and the printed wiring board that can be thinned can be obtained. The above usability is high.

DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Printed wiring board 3 Printed wiring board 4 Base material 5 Conductive layer 5a 1st conductive layer 5b 2nd conductive layer 6 Insulating layer 6a 1st insulating layer 6b 2nd insulating layer 7 Base layer 10 Base material 20 Conductive layer 21 1st conductive layer 22 2nd conductive layer 30 Insulating layer 31 1st insulating layer 32 2nd insulating layer 40 Underlayer 50 Metal support layer K Opening

Claims (5)

Comprising a substrate, a first conductive layer disposed on at least one surface side of the substrate, and an insulating layer and a second conductive layer,
The insulating layer has an opening;
An underlayer laminated above the first conductive layer and the insulating layer exposed from the opening;
The insulating layer is composed of a coating film,
The underlayer includes copper metal particles having an average particle diameter of 1 nm to 500 nm,
A printed wiring board in which the second conductive layer is electrically connected to the first conductive layer through the base layer.   The printed wiring board of Claim 1 provided with a metal support layer in an outermost layer. Forming a first conductive layer above the substrate;
A step of forming an insulating layer formed of a coating film and having an opening exposing the first conductive layer above the first conductive layer;
Applying a conductive ink containing copper metal particles having an average particle diameter of 1 nm or more and 500 nm or less above the first conductive layer and the insulating layer exposed from the opening to form a base layer; ,
A method of manufacturing a printed wiring board comprising at least a step of forming a second conductive layer electrically connected to the first conductive layer via the base layer above the base layer.   The method for producing a printed wiring board according to claim 3, wherein the step of forming the second conductive layer is an electrolytic plating method.   The method for producing a printed wiring board according to claim 3, wherein the step of forming the insulating layer uses a photosensitive polyimide solution.

Images