JP6302527B2 - Component mounting equipment - Google Patents

Description

  The present invention relates to a component mounting apparatus that takes out components from a component supply unit and mounts them on a substrate.

  2. Description of the Related Art Conventionally, there is known a component mounting apparatus that takes a bare chip (simply referred to as a component) from a diced wafer held on a wafer stage and mounts (bonds) it on a substrate. For example, Patent Document 1 discloses a component mounting apparatus that includes a pick-up tool (first head) for picking up a component and a bonding tool (second head) for mounting the component as one of such component mounting apparatuses. It is disclosed. In this component mounting apparatus, components are sucked by the pickup tool in a sucked state and taken out from the wafer. The parts picked up by the pick-up tool are turned upside down in accordance with the reversing operation of the pick-up tool, and then transferred to the bonding tool. Implemented. In addition, the suction state of the component delivered to the bonding tool is image-recognized using a component recognition camera. Then, the bonding tool is driven and controlled in accordance with the component adsorption deviation, so that the component is appropriately mounted at a predetermined position on the substrate.

JP 2006-19335 A

  In the conventional component mounting apparatus, as described above, component adsorption deviation due to the bonding tool is eliminated by driving and controlling the bonding tool in accordance with the adsorption deviation. However, this component mounting apparatus cannot solve the adsorption deviation itself when the component is delivered from the pickup tool to the bonding tool. Therefore, the following inconvenience due to the occurrence of the adsorption deviation can be considered. That is, if a part of the bonding tool (tip) protrudes from the part, the bonding tool may be erroneously recognized as a part of the part during image recognition of the part, which may cause a problem in the subsequent process of correcting the adsorption deviation. is there. Further, it is conceivable that an air leak occurs and the component falls from the bonding tool during the conveyance. Such a tendency becomes remarkable with the miniaturization of parts. Therefore, it is desired that the bonding tool can suck the component without causing a suction displacement when transferring the component from the pickup tool to the bonding tool. Such a problem also applies to a component mounting apparatus of a type in which, for example, a component taken out by a pickup tool is temporarily transferred onto a relay stage and the component on the relay stage is attracted by a bonding tool.

  The present invention has been made in view of the above circumstances, and components are indirectly transferred from a first head (such as a pickup tool) to a second head (such as a bonding tool) via a relay stage. With regard to a component mounting apparatus mounted on a substrate, a technology capable of suppressing a decrease in the component adsorption rate of the first head and a decrease in the component adsorption rate of the second head during component delivery even when the component is downsized. The purpose is to provide.

A component mounting apparatus according to the present invention is a component mounting apparatus that includes a component supply unit, extracts a component from the component supply unit, and mounts the component on a substrate, the first head extracting a component from the component supply unit, a second head part taken out by the first head is mounted to the transport and the intermediate stage to be placed by the first head, the placed intermediate stage component on the substrate, held by the first head An image pickup device that picks up an image of a component placed on the relay stage, or a component held by the second head, and a control device that controls the first head and the second head, The control device obtains a displacement amount of a component related to the component image with respect to a predetermined reference position based on the component image captured by the imaging device, and based on the displacement amount, the first head moves the component supply unit. La subsequent parts taken out in which the first head to execute a correction process for correcting the置位location mounting when placed on the intermediate stage.

In this component mounting apparatus, the amount of deviation (deviation amount with respect to a predetermined reference position) of the component held on the first head, the component placed on the relay stage, or the component held on the second head is image-recognized. based on the displacement amount,置位location mounting parts for the subsequent part of the intermediate stage is corrected. As a result, the positional deviation of the succeeding parts delivered from the first head to the second head via the relay stage is suppressed.

  In each of the component mounting apparatuses described above, the correction processing may be performed every time (for each cycle in which the component is taken out from the component supply unit and mounted on the board). A storage unit may be further provided, and the control device may execute the correction process based on the data stored in the storage unit when a predetermined correction condition is satisfied.

  According to this configuration, by performing the correction process at a constant timing, the accuracy of parts delivery from the first head to the second head is appropriately maintained.

  In this case, it is preferable that the control device executes the correction process based on an average value of data stored in the storage unit.

  According to this configuration, the accuracy of the correction processing can be increased, which is advantageous in increasing the accuracy of parts delivery from the first head to the second head.

  The control device sets the first condition for the number of data stored in the storage unit to reach a set number, the second condition for the average value of the data stored in the storage unit to exceed a threshold, and the number of substrates produced Any one of the third conditions exceeding the number is preferably set as the correction condition.

  According to this configuration, the correction process can be executed at an appropriate timing.

  As described above, according to the present invention, a component is reduced in size with respect to the component mounting apparatus in which the component is indirectly transferred from the first head to the second head via the relay stage and mounted on the substrate. Even in this case, it is possible to suppress a decrease in the component adsorption rate of the first head and a decrease in the component adsorption rate of the second head during component delivery.

It is a top view which shows the whole structure of a component mounting apparatus (1st form). It is a front view which shows the whole structure of a component mounting apparatus. It is a perspective view which shows the principal part of a component mounting apparatus. It is a block diagram which shows the control system of a component mounting apparatus. It is a flowchart for demonstrating mounting operation control of the components by a control apparatus. FIG. 6 is a flowchart (subroutine of step S5 in FIG. 5) for explaining component take-out operation control by the control device. FIG. 6 is a flowchart (subroutine of step S7 in FIG. 5) for explaining parts delivery operation control by the control device. It is a top view which shows the whole structure of a component mounting apparatus (2nd form). It is a front view which shows the head unit for extraction. 6 is a flowchart (subroutine of step S7 in FIG. 5) for explaining parts delivery operation control by the control device. It is a flowchart (subroutine of step S7 of FIG. 5) for demonstrating part delivery operation | movement control by the control apparatus concerning a 3rd form. It is a flowchart (subroutine of step S7 of FIG. 5) for demonstrating part delivery operation | movement control by the control apparatus concerning a 4th form. It is a top view which shows the whole structure of a component mounting apparatus (5th form). FIG. 10 is a flowchart (subroutine of step S5 in FIG. 5) for explaining component take-out operation control by the control devices according to the fifth and sixth embodiments. FIG.

  Hereinafter, an embodiment of a component mounting apparatus will be described in detail with reference to the accompanying drawings.

  Of the first to sixth modes described below, the third mode and its modifications mainly correspond to the present invention. The first form is a form that is the basis (base) of the second to sixth forms.

(First form)
1 and 2 show the overall configuration of the component mounting apparatus. In FIG. 1, FIG. 2, and the drawings described later, XYZ rectangular coordinate axes are shown to clarify the directional relationship. The X direction is a direction parallel to the horizontal plane, the Y direction is a direction orthogonal to the X direction on the horizontal plane, and the Z direction is a direction orthogonal to the X method and the Y direction.

  The component mounting apparatus M1 shown in the figure takes out a bare chip from a diced wafer W and mounts (mounts) it on a substrate P such as a printed wiring board (PWB), and components such as a tape feeder 4a described later. This is a so-called composite type component mounting apparatus capable of mounting components and the like supplied by the supply apparatus on the substrate P.

  The component mounting apparatus M1 includes a base 1, a conveyor 2 for loading and unloading the substrate P with respect to a predetermined mounting work position, first and second component supply units 4 and 5, and the substrate P. A component mounting mechanism 6 for mounting components (bare chip or chip component), a wafer storage unit 3 in which a diced wafer W is stored, and a wafer support device 7 for pulling out and supporting the wafer W from the wafer storage unit 3 A take-out device 8 that takes out the bare chip from the wafer W and delivers it to the component mounting mechanism 6; and a push-up device 9 that pushes up the bare chip from below when taking out the bare chip from the wafer W. The bare chip is an example of the “component” in the present invention.

  The conveyor 2 includes a conveyor body extending in the X direction for transporting the substrate P, and a positioning mechanism (not shown) that lifts and positions the substrate P on the conveyor body. The substrate P is conveyed in the X direction in a horizontal posture from the right side to the left side in FIG. 1 by the conveyor 2, and is positioned and fixed at a predetermined mounting work position. In this example, the positions (positions of the substrate P in the drawing) that are separated from each other by a predetermined interval in the X direction on the conveyance path by the conveyor 2 are the mounting work positions of the substrate P, respectively. In the following description, the upstream position of the substrate P in the transport direction is referred to as a first work position S1, and the downstream position is referred to as a second work position S2.

  The first and second component supply units 4 and 5 are provided on opposite sides of the conveyor 2. Specifically, the first component supply unit 4 is provided on the front side of the conveyor 2 (the front side of the component mounting apparatus M1: the lower side in the figure), and the second component supply unit 5 is provided on the rear side of the conveyor 2. Yes.

  The first component supply unit 4 is for supplying chip components such as transistors, resistors, and capacitors, and is provided at both ends of the component mounting apparatus M1 in the X direction. In the first component supply unit 4, for example, a plurality of component supply devices such as a tape feeder 4 a are arranged along the conveyor 2. Each tape feeder 4a is provided with a reel on which a tape holding a small piece of IC, transistor, capacitor or the like is wound and wound, and the tape is taken out by intermittently feeding the tape from the reel. A chip component is supplied to a predetermined component supply position near the conveyor 2 as a carrier.

  The second component supply unit 5 supplies bare chips. In the second component supply unit 5, the diced wafer W is arranged in a state of being supported by the wafer support device 7.

  The component mounting mechanism 6 is for mounting a component (a bare chip or a chip component / hereinafter, simply referred to as a component when there is no need to distinguish) supplied on the substrate P by the component supply units 4 and 5. Two mounting head units (first mounting head unit 10A and second mounting head unit 10B) that can move in the horizontal direction (XY direction) at positions above the conveyor 2, respectively, and drive these individually Drive mechanism.

  The first mounting head unit 10A is movable only within this region, with the upstream region of the base 1 including the first work position S1 as a movable region. On the other hand, the second mounting head unit 10 </ b> B is movable only within this region, with the downstream region of the base 1 mainly including the second work position S <b> 2 as a movable region. Each mounting head unit 10A, 10B includes two mounting heads 12a that are arranged in the X direction and can be moved up and down (moved up and down), and one movable camera 12b for substrate recognition. Each mounting head 12a receives a bare chip taken out from the wafer W by the wafer head 41a described later and mounts (mounts) it on the substrate P. In this example, these mounting heads 12a are the second heads of the present invention. It corresponds to.

  Each of the mounting head units 10A and 10B sucks the chip component supplied by the tape feeder 4a by the mounting head 12a and mounts it on the substrate P, and takes it out from the wafer W by the take-out device 8 (wafer head 41a). The bare chip to be mounted is sucked by the mounting head 12a and mounted on the substrate P. As a result, both chip components such as transistors and capacitors and bare chips are mounted on the substrate P. In addition, each mounting head unit 10A, 10B images a fiducial mark (not shown) attached to the substrate P by the moving camera 12b prior to mounting the component on the substrate P. Each moving camera 12b outputs the image signal to the control device 70 described later. Accordingly, the position of the substrate P at each of the work positions S1 and S2 is recognized.

  As shown in FIG. 2, the driving mechanism of the first mounting head unit 10A is supported by the ceiling Ma of the component mounting apparatus M1 so as to be movable in the Y direction, and can move the first mounting head unit 10A in the X direction. , A drive motor 16a (shown in FIG. 4) for moving the first mounting head unit 10A in the X direction relative to the support member 14, and the support member 14 in the Y direction. Drive motor 16b (shown in FIG. 4). Similarly, the driving mechanism of the second mounting head unit 10B is supported by the ceiling Ma of the component mounting apparatus M1 so as to be movable in the Y direction, and supports the second mounting head unit 10B so as to be movable in the X direction. 15, a drive motor 17a (shown in FIG. 4) for moving the second mounting head unit 10B in the X direction with respect to the support member 15, and a drive linear motor for moving the support member 15 in the Y direction. 17b (shown in FIG. 4). The drive motors 16a, 16b, 17a, and 17b are linear motors.

  The component mounting apparatus M1 further includes fixed cameras 18A and 18B (first fixed camera 18A and second fixed camera 18B) for component recognition arranged on the base 1. The first fixed camera 18A is disposed within the movable region of the first mounting head unit 10A, and the second fixed camera 18B is disposed within the movable region of the second mounting head unit 10B. These fixed cameras 18A and 18B are cameras provided with an image sensor such as a CCD or a CMOS, for example, and pick up images of components sucked and held by the mounting heads 12a of the mounting head units 10A and 10B from the lower side. The image signal is output to the control device 70 described later.

  The wafer support device 7 pulls out the wafer W stored in the wafer storage unit 3 to a predetermined component extraction work position of the second component supply unit 5 and supports the wafer W so that the bare chip can be extracted by the extraction device 8. It is. The wafer support device 7 includes a wafer holding table 20 that supports the wafer W, a pair of fixed rails 22 that support the wafer W so as to be movable in the Y direction, and the wafer holding table 20 along the fixed rails 22. And a drive mechanism for moving the The drive mechanism includes a ball screw shaft 24 extending in parallel with the fixed rail 22 and screwed into the wafer holding table 20, and a drive motor 26 for rotationally driving the ball screw shaft 24. With this configuration, the wafer holding table 20 passes through the lower position of the substrate P supported by the conveyor 2, and the part picking work position (position indicated by a solid line in FIG. 1) and the wafer receiving position in the vicinity of the wafer storage unit 3. (Position indicated by a two-dot chain line in FIG. 1).

  The wafer storage unit 3 is detachably fixed on the base 1 at the front center of the component mounting apparatus M1, specifically, at a position between the two first component supply units 4. As shown in FIG. 3, the wafer storage unit 3 includes a rack that stores a substantially annular holder Wh that holds the wafer W in a plurality of upper and lower stages, and a drive mechanism that drives the rack up and down. The wafer storage unit 3 is arranged at a predetermined loading / unloading height position where a desired wafer W can be loaded / unloaded with respect to the wafer holding table 20 by raising / lowering the rack. On the other hand, the wafer holding table 20 includes a wafer W loading / unloading mechanism (not shown). In the loading / unloading mechanism, the wafer W (holder Wh) in the rack disposed at the loading / unloading height position is transferred from the wafer storage unit 3 onto the wafer holding table 20 with the wafer holding table 20 disposed at the wafer receiving position. While being pulled out, the wafer W on the wafer holding table 20 can be accommodated (returned) in the rack. Each wafer W accommodated in the wafer accommodating portion 3 is affixed to the upper surface of the film-like wafer sheet so that the bare chip is in a face-up state (circuit formation surface (mounting surface with respect to the substrate P) is upward). And is held by a holder Wh via this wafer sheet.

  The wafer holding table 20 has an opening penetrating in the vertical direction (Z direction) at the center thereof, and holds the holder Wh so that the opening of the holder Wh and the opening of the wafer holding table 20 overlap. To do. Thereby, in a state where the wafer W (holder Wh) is held on the wafer holding table 20, it is possible to push up the bare chip from below the wafer holding table 20 by the push-up device 9 described later.

  The push-up device 9 is disposed in the second component supply unit 5. The push-up device 9 pushes up a bare chip to be taken out from the lower side of the wafer W on the wafer holding table 20 arranged at the component take-out work position, thereby peeling the bare chip from the wafer sheet. It is something to lift.

  As shown in FIGS. 2 and 3, the push-up device 9 includes a push-up head unit 30 provided with a pair of push-up heads 31a arranged in the X direction and each having a push-up pin (not shown). Includes a fixed rail 32 that supports the base unit 1 so as to be movable in the X direction, and a drive mechanism for moving the push-up head unit 30 along the fixed rail 32. This drive mechanism includes a ball screw shaft (not shown) that extends parallel to the fixed rail 32 and is screwed into the push-up head unit 30, and a drive motor 36 (shown in FIG. 4) for rotationally driving the shaft. Including. That is, with respect to the wafer W (wafer holding table 20) that can move only in the Y direction, the push-up head unit 30 is configured to be movable in the X direction, whereby any bare chip on the wafer W can be moved to the push-up head unit. 30 can be pushed up.

  Each push-up head 31a of the push-up head unit 30 is individually driven up and down by an actuator (air cylinder or the like) not shown. In other words, in a state where each thrusting head 31a is disposed inside the opening of the wafer holding table 20, any one of the thrusting heads 31a is driven up to a position where it substantially contacts the lower side of the wafer sheet. After the raising head 31a is arranged at a desired bare chip position, the bare chip is pushed up by driving the raising pin of the raising head 31a up by a drive motor (not shown).

  The take-out device 8 takes out the bare chip pushed up by the push-up device 9 from the wafer W and delivers it to the first head unit 10A and the second head unit 10B.

  The take-out device 8 includes a take-out head unit 40, a moving camera 50 for recognizing parts, and a drive mechanism for moving them in the horizontal direction (XY direction) at a position above the second part supply unit 5. . This drive mechanism has the following configuration.

  That is, the second component supply unit 5 has a pair of elevated fixed rails 52 arranged at a predetermined interval in the X direction and extending in parallel with each other in the Y direction, and both ends on the rails 52 extending in the X direction. A frame member 54 that is movably supported, a pair of ball screw shafts 56 that are disposed at positions close to the fixed rails 52 and extend in the Y direction, and are screwed into the frame members 54, respectively. A pair of drive motors 58 for rotating 56 is provided.

  The frame member 54 is provided with a first rail (not shown) that is fixed to the front surface side and extends in the X direction, and a second rail (not shown) that is fixed to the rear surface side and extends in the X direction. A take-out head unit 40 is movably supported on the first rail, and a moving camera 50 is movably supported on the second rail. Then, a ball screw shaft (not shown) that extends in the X direction and is screwed and inserted into the extraction head unit 40, a drive motor 60 that rotationally drives the ball screw shaft, and an X direction. A ball screw shaft (not shown) screwed into the moving camera 50 and a drive motor 62 that rotationally drives the ball screw shaft are provided.

  That is, the drive mechanism moves the frame member 54 along the fixed rail 52 by the operation of the drive motor 58, and moves the extraction head unit 40 and the moving camera 50 in the Y direction as the frame member 54 moves. Move. Further, the operation of the drive motor 60 moves the take-out head unit 40 in the X direction at the position on the front side of the frame member 54, and the operation of the drive motor 62 moves the moving camera 50 at the position on the rear side of the frame member 54. Move in the X direction. As a result, the take-out head unit 40 and the moving camera 50 can be moved independently in the horizontal direction (XY direction) above the component take-out work position.

  The movable area in the XY direction of the take-out head unit 40 and the movable area in the XY direction of each mounting head unit 10A, 10B partially overlap. As a result, as will be described later, it is possible to deliver a bare chip from the take-out head unit 40 to each of the mounting head units 10A and 10B. 2 and 3, the take-out head unit 40, the movable camera 50, and the drive mechanisms thereof are positioned below the mounting head units 10A and 10B and the drive mechanisms thereof. . Therefore, although the movable area of the extraction head unit 40 and the movable area of each mounting head unit 10A, 10B partially overlap as described above, the extraction head unit 40 and each mounting head unit 10A, 10B Do not interfere with each other.

  The take-out head unit 40 includes a pair of wafer heads 41a arranged in the X direction. These wafer heads 41a take out bare chips from the wafer W of the second component supply unit 5, and are configured to be able to hold them by sucking them.

  More specifically, these wafer heads 41a have a pair of bracket members 42 supported by the frame portion 40a of the take-out head unit 40 so as to be able to move up and down independently, and the pair of bracket members 42 in the X direction. And a drum-type head main body 43 that is supported rotatably around a parallel axis and has a pair of nozzles 44 for sucking parts on the outer peripheral surface.

  In each head main body 43, the pair of nozzles 44 are provided at positions that are exactly upside down, and when the nozzle 44 on one side faces directly below, the nozzle 44 on the other side faces directly above. Yes. In each wafer head 41a, the head body 43 is rotationally driven by a drive motor 45 provided on the bracket member 42, whereby the positions of the pair of nozzles 44 are alternately switched. Further, when the bracket member 42 is driven up and down by a drive motor (not shown), the entire wafer head 41 a including the nozzle 44 is raised and lowered relative to the frame portion of the take-out head unit 40.

  Note that the interval between the two wafer heads 41a, specifically, the interval between the nozzles 44 (interval in the X direction) is the interval between the two mounting heads 12a of the first mounting head unit 10A and the second mounting head unit 10B. The interval is set to be the same as the interval between the two mounting heads 12a. Thus, as will be described later, two mounting heads 12a of the first mounting head unit 10A or two mounting heads 13a of the second mounting head unit 10B are simultaneously applied to the two mounting heads 10a from the two wafer heads 41a. Bare chip delivery is possible.

  The moving camera 50 is a camera including an image sensor such as a CCD or a CMOS. Prior to taking out the bare chip from the wafer W, the moving camera 50 images the bare chip to be taken out, or after taking out the bare chip from the wafer W, images its take-out position, and outputs the image signal to the control device 70 described later. Is output.

  FIG. 4 is a block diagram showing a control system of the component mounting apparatus M1. As shown in the figure, the component mounting apparatus M1 includes a control device 70 including a CPU, various memories, an HDD, and the like. The controller 70 is electrically connected to the drive motors 16a, 16b, 17a, 17b, 26, 3, 45, 58, 60, 62, the moving cameras 12b, 50, the fixed cameras 18A, 18B, and the like. ing. As a result, the operations of the conveyor 2, the component mounting mechanism 6, the wafer support device 7, the take-out device 8, the push-up device 9, etc. are controlled by the control device 70. Further, an input device (not shown) is electrically connected to the control device 70, and various types of information by the operator are input based on the operation of the input device, and are incorporated in the drive motor 16a and the like. An output signal from position detection means such as an external encoder is also input.

  The control device 70 includes, as its functional elements, an axis control unit 73 that controls driving of the actuators such as the drive motors 16a, an image processing unit 74 that performs predetermined processing on image signals from the camera 12b, and the like. An I / O control unit 75 that controls input of signals from a sensor outside the figure and output of various control signals, a communication control unit 76 that controls communication with an external device, various programs such as mounting programs, and various data And a main arithmetic unit 71 that performs overall control and executes various arithmetic processes and the like.

  The control device 70 controls each drive motor 16a and the like based on a predetermined program, thereby controlling the conveyor 2, the component mounting mechanism 6, the wafer support device 7, the take-out device 8, the push-up device 9, and the like. Drive control. As a result, a series of operations (component mounting operations) such as loading / unloading of the wafer W into / from the wafer storage unit 3, removal of bare chips from the wafer W, and mounting of components by the component mounting mechanism 6 (mounting head units 10A and 10B) are executed. Let

  Next, component mounting operation control will be described with reference to FIG. FIG. 5 is a flowchart showing control of a series of component mounting operations by the control device 70.

  First, the control device 70 controls the conveyor 2 to carry the board P into the component mounting apparatus M1 and fix the board P in the state where the board P is disposed at the first work position S1 and the second work position S2, respectively (see FIG. Step S1).

  Next, the control device 70 pulls out the wafer W from the wafer storage unit 3 by controlling the wafer support device 7 (step S3). Specifically, by driving the drive motor 26, the wafer holding table 20 is moved to the wafer receiving position (the position of the two-dot chain line in FIG. 1). Then, the wafer W (holder Wh) is pulled out from the wafer storage unit 3 onto the wafer holding table 20 by a loading / unloading mechanism (not shown), and the wafer W is fixed to the wafer holding table 20. Thereafter, by driving the drive motor 26, the wafer holding table 20 is arranged at the component extraction work position (the position indicated by the solid line in FIG. 1) of the second component supply unit 5. At this time, the control device 70 makes the Y direction position of the bare chip to be taken out of the bare chips in the wafer W coincide with the Y direction position of the push-up head 31 a (push-up pin) of the push-up device 9. The wafer holding table 20 is moved.

  When the wafer W is placed at the component take-out operation position, the control device 70 controls the take-out device 8 and the push-up device 9 to take out bare chips from the wafer W (step S5).

  FIG. 6 is a flowchart showing details (subroutine) of bare chip take-out operation control (control to operate while feeding back detection data of a preceding part) in step S5. First, the control device 70 controls the take-out device 8, moves the moving camera 50 to a position above the wafer W, and recognizes an image of a bare chip to be taken out (a suction target) (step S501). Specifically, the drive motor 58 is driven to move the frame member 54 in the Y direction, and the drive motor 62 is driven to move the movable camera 50 in the X direction. As a result, the moving camera 50 is placed above the bare chip to be taken out. Then, the moving camera 50 images the bare chip. The control device 70 obtains the position of the bare chip based on this image data. In this case, the control device 70 causes the moving camera 50 to image a plurality of bare chips at once or continuously as necessary.

  Next, the control device 70 corrects a predetermined correction condition (memory) for correcting the target suction position of the bare chip by the take-out head unit 40 (wafer head 41a) based on the correction amount data obtained from the detection data in the preceding part. It is determined whether or not a set number of correction amount data and a moving average correction amount Δα described later are stored in the unit 72 (step S503). If not satisfied, the control device 70 further determines whether or not the target suction position (component pick-up position) of the bare chip by the wafer head 41a can be corrected from the initial position (a number equal to or less than the number set in the storage unit 72 will be described later). It is determined whether or not correction amount data to be stored and an average correction amount Δα ′ to be described later are stored (step S505). Here, if correction is not yet possible, the control device 70 sets the target suction position based on the initial position. Specifically, the center position (initial position) of the bare chip obtained based on the imaging result by the moving camera 50 is set as the target suction position, and the wafer holding table 20 is based on the target suction position and the recognition result in step S501. Then, the target positions of the push-up head unit 30 and the take-out head unit 40 are respectively calculated (step S507). That is, the wafer holding table 20, the push-up head unit 30 and the take-out head unit are arranged so that the push-up head 31a (push-up pin) and the wafer head 41a (nozzle 44) are respectively arranged at the center of the bare chip to be taken out. 40 target positions are calculated. On the other hand, when the average correction amount Δα ′ is stored in the storage unit 72 in step S505 and correction is possible (YES in step S505), the control device 70 initially uses the average correction amount Δα ′. The position is corrected (second correction method) to obtain the target suction position, and according to the corrected target suction position, based on the target suction position and the recognition result in step S501, the wafer holding table 20, the push-up head unit 30 and the target positions of the take-out head unit 40 are calculated (step S513).

  On the other hand, when the predetermined correction condition is satisfied in step S503 (YES in step S503), the control device 70 stores the data stored in the storage unit 72, specifically, the moving average correction amount Δα. , The initial position is corrected with the moving average correction amount Δα (first correction method) to obtain the target suction position, and the wafer is held based on the corrected target suction position and the recognition result in step S501. The target positions of the table 20, the push-up head unit 30 and the take-out head unit 40 are calculated (steps S515 and S517).

  Next, the controller 70 performs steps S507, S513, and S517 so that the push-up head 31a (push-up pin) and the wafer head 41a (nozzle 44) are arranged at the target suction position with respect to the bare chip to be taken out. The wafer support device 7, the take-out device 8, and the push-up device 9 are each controlled based on the target position obtained in any of the above (step S509). Specifically, the drive motor 36 is driven to move the push-up head unit 30 in the X direction, and the drive motor 26 is driven to move the wafer holding table 20 in the Y direction. As a result, one of the pair of thrusting heads 31a is moved to the target suction position of the wafer head 41a and below the bare chip. Further, the drive motor 58 is driven to move the frame member 54 in the Y direction, and the drive motor 60 is driven to move the takeout head unit 40 in the X direction. Thereby, one wafer head 41a of the pair of wafer heads 41a is moved to the target suction position and above the bare chip.

  When the push-up head 31a (push-up pin) and the wafer head 41a (nozzle 44) are arranged at the position corresponding to the bare chip to be taken out, the control device 70 takes out the bare chip from the wafer W (step S511). . Specifically, the control device 70 pushes up the bare chip from below by raising the push-up pin from the push-up head 31a. On the other hand, the control device 70 moves the wafer head 41 a up and down, thereby sucking the bare chip by the nozzle 44. Thereby, the bare chip is taken out from the wafer W. In the case where the bare chips are continuously taken out by the two wafer heads 41a, the control device 70 once again removes the bare chips by the one-side wafer head 41a, and then re-checks the other-side wafer head 41a. Any one of steps S507, S513, and S517 and steps S509 and S511 are executed.

  Returning to FIG. 5, the control device 70 then transfers the bare chip from the take-out device 8 (the take-out head unit 40) to the component mounting mechanism 6 (the first mount head unit 10A or the second mount head unit 10B). Delivery is performed (step S7).

  FIG. 7 is a flowchart showing details (subroutine) of bare chip transfer operation control in step S7. Since the delivery of the bare chip is performed in cooperation between the take-out head unit 40 and the mounting head units 10A, 10B, the operation control of the take-out head unit 40 is on the right side in FIG. The operation control is shown separately on the left side. In the following description, for the sake of convenience, a case where a bare chip is delivered from the takeout head unit 40 to the first mounting head unit 10A will be described.

  The control device 70 controls the component mounting mechanism 6 to move the first mounting head unit 10A to a predetermined component delivery position on the rear side of the conveyor 2 (step S701) and to control the take-out device 8. As a result, the take-out head unit 40 is moved to the same component delivery position (step S801). Thus, the first mounting head unit 10A and the take-out head unit 40 are arranged vertically at the component delivery position. Specifically, the first mounting head unit 10A and the take-out head unit 40 are arranged so that the two mounting heads 12a and the two wafer heads 41a (nozzles 44) face each other in the vertical direction. During the movement of the take-out head unit 40 to the component delivery position, the control device 70 rotates the wafer head 41a by controlling the drive motor 45, thereby reversing the bare chip adsorbed below the nozzle 44 ( The surface to be adsorbed is inverted).

  Next, the control device 70 waits for completion of bare chip delivery preparation on the take-out head unit 40 side (step S703), and when completed, lowers the mounting head 12a and inserts the bare chip by the mounting head 12a. Suction is performed (= adsorption negative pressure is applied to the mounting head 12a) (step S705). At this time, if both wafer heads 41a of the take-out head unit 40 are sucking bare chips, the control device 70 simultaneously lowers the two mounting heads 12a so that the mounting heads 12a simultaneously. Aspirate the bare chip.

  The control device 70 waits for the component suction by the mounting head 12a to be completed (= a predetermined negative suction pressure is applied to the mounting head 12a) (step S803). The bare chip suction state is released (step S805). Further, after waiting for the release of this suction state to be completed (= the negative pressure for suction acting on the wafer head 41a becomes 0 or positive pressure) (step S707), the mounting head 12a is raised. Then, a bare chip is picked up from the wafer head 41a (step S709). This completes the delivery of the bare chip from the wafer head 41a (takeout head unit 40) to the mounting head 12a (first mounting head unit 10A). Here, the delivery of the bare chip from the take-out head unit 40 to the first mounting head unit 10A has been described, but the same applies to the second mounting head unit 10B.

  Returning to FIG. 5, next, the control device 70 performs image recognition of the bare chip received by the mounting head units 10A and 10B (step S9). Specifically, the control device 70 moves the first mounting head unit 10A above the first fixed camera 18A (in the case of the second mounting head unit 10B, above the second fixed camera 18B) and mounts it. The first fixed camera 18A (or the second fixed camera 18B) causes the first fixed camera 18A (or the second fixed camera 18B) to take an image of the bare chip adsorbed on the mounting head 12a, and at the same time, the bare chip is adsorbed on the mounting head 12a based on the image data Deviation amounts, specifically, deviation amounts in the X direction, Y direction, and rotation direction (R direction) with respect to the center (reference position) of the mounting head 12a are obtained, and further, correction amounts of this adsorption deviation (ΔX, ΔY, ΔR) ) At this time, when the two mounting heads 12a respectively attract the bare chips, the control device 70 obtains a correction amount (referred to as an individual correction amount) individually for each mounting head 12a.

  The control device 70 further obtains an average value of the two individual correction amounts obtained in step S9 (corresponding to the correction amount data obtained from the detection data in the preceding part, referred to as a unified correction amount), and this unified correction amount is determined as the above-mentioned correction amount. In addition to storing (accumulating) in the storage unit 72, the unified correction amount obtained earliest among the set number of unified correction amounts already stored in the storage unit 72 is deleted. As a result of this update, an average value (referred to as moving average correction amount Δα) of the set number of unified correction amounts stored in the storage unit 72 is obtained and stored in the storage unit 72 in an update manner (step S11). When the number of unified correction amounts stored (accumulated) in the storage unit 72 is smaller than the set number (including 0), the moving average value of the unified correction amounts having the set number as a parameter can be obtained. Since it is not possible, simply calculate the average value (referred to as average correction amount Δα ′) from the stored (accumulated) unified correction amount of 0 or more and less than the setting and the newly obtained unified correction amount (the parameter is 1). In some cases, the average value is also stored in the storage unit 72 in an update manner.

  When the bare chip image recognition is completed, the control device 70 mounts the bare chip on the substrate P (step S13). Specifically, the control device 70 causes the camera 12b of the mounting head units 10A and 10B to image a fiducial mark (not shown) attached to the substrate P fixed to the conveyor 2, and The position of the substrate P is recognized based on the image data. The control device 70 obtains the target position of the mounting head units 10A and 10B based on the position of the substrate P and the mounting position of the bare chip on the substrate P, and further calculates the correction amount obtained in step S9. After correcting based on (individual correction amount), the mounting head units 10A and 10B are moved to the target positions. Then, the bare chip is mounted on the substrate P by lowering the mounting head 12a.

Thereafter, the control device 70 determines whether there are other components to be mounted (step S15). Here, if the bare chip to be mounted still remains, the process returns to step S5 and the mounting operation is continued. On the other hand, when the mounting of all bare chips is completed, the control device 70 releases the fixation of the substrate P, and then controls the conveyor 2 so that the substrate P is mounted on the component mounting device M.
Unload from 1 (step S17). Then, it is determined whether there is another board P to be produced (step S19). If the board P still remains, the control device 70 returns to step S1 and performs a mounting operation on the subsequent board P. Continue. On the other hand, when there is no other board P to be produced, a series of component mounting control is terminated.

  The control of the component mounting operation by the control device 70 has been described above with reference to the flowcharts (FIGS. 5 to 7). A series of operations of the component mounting device M1 based on this control is roughly summarized as follows. .

  In the component mounting apparatus M1, a bare chip is taken out from the wafer W by the wafer head 41a (takeout head unit 40), and the bare chip is delivered from the wafer head 41a to the mounting head 12a (mounting head units 10A, 10B). After that, it is transferred onto the substrate P by the mounting head 12a and mounted at a predetermined position (steps S1 to S13). At this time, the state of adsorption of the bare chip by the mounting head 12a is imaged by the fixed cameras 18A and 18B, so that the adsorption deviation of the bare chip with respect to the mounting head 12a is examined, and the correction amount is obtained. Specifically, the correction amount (individual correction amount) of each of the pair of mounting heads 12a is obtained, and the mounting head units 10A and 10B are controlled based on these individual correction amounts, thereby being attracted to each mounting head 12a. In addition, the bare chip is mounted on the substrate P after the adsorption deviation of each bare chip is corrected.

  Each time such a series of component mounting operations is performed, a unified correction amount that is an average value of the individual correction amounts is obtained and stored (accumulated) in the storage unit 72, and the average of the unified correction amounts is calculated. A value (average correction amount Δα) is obtained and stored in the storage unit 72 in an update manner (step S11).

  The moving average correction amount Δα or the average correction amount Δα ′ stored in the storage unit 72 is fed back to the bare chip extraction operation by the extraction device 8. Specifically, when a predetermined correction condition is satisfied (YES in step S503 in FIG. 6), the target suction position of the wafer head 41a (takeout head unit 40) when taking out the bare chip from the wafer W is the moving average. The correction amount Δα is corrected. In this example, as described above, the initial position of the target suction position is the center of the bare chip. For example, when the component mounting apparatus M1 is started, such as when the power is turned on, the target suction position is set to the initial position, and a predetermined correction condition is satisfied. Each time the target suction position is corrected by the moving average correction amount Δα stored in the storage unit 72 (steps S515 and S517). In the first embodiment, for example, the number of unified correction amounts stored in the storage unit 72 is a preset number (for example, 50), and the moving average correction amount Δα is stored in the storage unit 72. If it is determined, the control device 70 determines that the correction condition (step S503) is satisfied. Further, when the average correction amount Δα ′ is stored in the storage unit 72 and the unified correction amount having a number equal to or less than the set number 50 is stored in the storage unit 72, the control device 70 determines YES in step S505. to decide. However, as a condition for determining YES in step S505, the average correction amount Δα ′ is stored in the storage unit 72, and a unified correction amount of 20 or more and a set number (50 or less) is stored in the storage unit 72. It is good if you are. In this case, if the number of unified correction amounts already stored in the storage unit 72 has not reached 20, even though a new unified correction amount is obtained through step S9, the average correction amount Δα ′ is obtained. The new unified correction amount is additionally stored in the storage unit 72.

  In the component mounting apparatus M1 of the first embodiment, the moving average correction amount Δα corresponding to the bare chip suction deviation by the mounting head 12a of the preceding component is subsequently increased by the wafer head 41a (the extraction head unit 40). By feeding back to the operation of taking out the bare chip which is a component, the adsorption deviation at the time of delivery of the bare chip from the wafer head 41a to the mounting head 12a is suppressed. That is, the bare chip adsorption deviation by the mounting head 12a is regular due to a dimensional error or a drive error of a machine element except for a sudden one. Accordingly, the moving average correction amount Δα as described above is obtained, and the target suction position of the bare chip by the wafer head 41a is shifted in advance by this moving average correction amount Δα, that is, the bare chip suction displacement with respect to the mounting head 12a. (Correction) suppresses the occurrence of the above-described adsorption displacement when the bare chip is transferred from the wafer head 41a to the mounting head 12a, and the transfer of the bare chip from the wafer head 41a to the mounting head 12a is more accurate. Will be done.

  Therefore, the following inconvenience caused by the fact that the bare chip is attracted in a state of being shifted with respect to the mounting head 12a is effectively suppressed. For example, when image recognition of a bare chip by the fixed cameras 18A and 18B is performed, a part of the mounting head 12a (such as an edge portion) is erroneously recognized as a bare chip, which may cause a problem in the subsequent process for correcting the adsorption displacement. Thus, an air leak is generated in the mounting head 12a, thereby effectively preventing the bare chip from dropping from the mounting head 12a during the transfer onto the substrate P. Therefore, according to this component mounting apparatus M1, it is possible to more reliably and accurately mount the bare chip on the substrate P by the mounting head 12a because the inconvenience is suppressed.

  In particular, when the component mounting apparatus M1 is continuously operated for a long period of time, thermal deformation occurs in the drive systems of the component mounting mechanism 6, the wafer support apparatus 7, the take-out apparatus 8, and the like, and the adsorption deviation of the bare chip with respect to the mounting head 12a Although the amount may change with time, in this component mounting apparatus M1, as described above, the target suction position is corrected when the number of unified correction amounts stored in the storage unit 72 reaches a predetermined number. Is called. That is, the target suction position is corrected after a certain timing. Therefore, even when thermal deformation of the drive system occurs, it is possible to continuously suppress the adsorption deviation at the time of delivery of the bare chip from the wafer head 41a to the mounting head 12a for a long term.

  Moreover, in this component mounting apparatus M1, the bare chip target suction position by the wafer head 41a (the take-out head unit 40) is corrected using the result of bare chip image recognition by the fixed cameras 18A and 18B. Special equipment for correcting the target suction position is not required. Therefore, there is also an advantage that the above-described effects can be enjoyed without significant cost increase.

(Second form)
FIG. 8 shows the overall configuration of the component mounting apparatus M2 according to the second embodiment. The component mounting apparatus M2 according to the second embodiment has the same basic configuration as the component mounting apparatus M1 according to the first embodiment, except that the configuration differs from the component mounting apparatus M1 according to the first embodiment in the following points.

  The component mounting mechanism 6 according to the first embodiment includes the first mounting head unit 10A and the second mounting head unit 10B corresponding to the first work position S1 and the second work position S2, respectively. The component mounting mechanism 6 of the second embodiment includes one mounting head unit 10C that is movably supported by a single frame member 19 extending in the X direction. The mounting head unit 10C is used for the first operation. It corresponds to both the position S1 and the second work position S2. That is, components are mounted on the board P at both the work positions S1 and S2 by one mounting head unit 10C. The configuration of the mounting head unit 10C is the same as the mounting head units 10A and 10B of the first embodiment, and includes two mounting heads 12a and a moving camera 12b.

  Further, the take-out head unit 40 (the take-out device 8) of the second embodiment is the same as the first embodiment in that it includes a pair of wafer heads 80a arranged in the X direction, but as shown in FIG. The wafer head 80a is an axial head extending in the vertical direction, and has the same configuration as the mounting head 12a of the mounting head unit 10C. The interval between the two wafer heads 80a of the take-out head unit 40 (the interval in the X direction) is set to the same interval as the two mounting heads 12a of the mounting head unit 10C.

  Further, on the base 1, a stage for delivering a bare chip from the take-out head unit 40 (wafer head 80a) to the mounting head unit 10C (mounting head 12a), that is, a bare chip taken out by the wafer head 80a is mounted. A relay stage 82 is provided. Also in this component mounting apparatus M2, the movable region in the XY direction of the take-out head unit 40 and the movable region in the XY direction of the mounting head unit 10C partially overlap, and the relay stage 82 is shown in FIG. Thus, it arrange | positions in the vicinity of the 2nd fixed camera 18B among the said duplication area | regions.

  In the component mounting apparatus M2 of the second embodiment, the process (component delivery process) in step S7 in FIG. 5 is executed based on the operation control shown in FIG.

  Referring to FIG. 10, first, control device 70 controls take-out device 8 to move take-out head unit 40 (wafer head 80 a) that has taken out a component from wafer W to a component delivery position, that is, relay stage 82. Move upward (step S811). Then, the wafer head 80a is lowered to release the bare chip suction state, and then the wafer head 80a is raised to place the bare chip at a predetermined position on the relay stage 82 (step S813). At this time, if the two wafer heads 80a are sucking the bare chips, the control device 70 lowers the two wafer heads 80a at the same time and places both bare chips on the relay stage 82 at the same time.

  When the bare chip is transferred (placed) on the relay stage 82, the control device 70 controls the take-out device 8 and retracts the take-out head unit 40 outside the movable region of the mounting head unit 10C (step). S815).

  The control device 70 waits for the take-out head unit 40 to retract (step S711), moves the mounting head unit 10C above the relay stage 82, further lowers the mounting head 12a, and performs the mounting. The bare chip is adsorbed by the head 12a (steps S713 and S715). At this time, when two bare chips are placed on the relay stage 82, the control device 70 lowers the two mounting heads 12a at the same time, thereby simultaneously sucking the bare chips by the mounting heads 12a. . Thereby, the delivery of the bare chip from the take-out head unit 40 (wafer head 80a) to the mounting head unit 10C (mounting head 12a) is completed.

  That is, in the first mode, bare chips are directly transferred from the wafer head 41a (the extraction head unit 40) to the mounting head 12a (the mounting head units 10A and 10B). In the second mode, The bare chip is indirectly transferred from the wafer head 80a to the mounting head 12a via the relay stage 82.

  As described above, the component mounting apparatus M2 according to the second embodiment is different from the wafer head 80a to the mounting head 12a only in the configuration of delivery of the bare chip after the delivery to the mounting head 12a by the fixed cameras 18A and 18B. Based on the image recognition of the bare chip, the amount of adsorption deviation of the bare chip in the mounting head 12a is obtained, and the moving average correction amount Δα and the average correction amount Δα ′ are obtained from the amount of adsorption deviation, and then the moving average correction amount. Similar to the first embodiment, the target suction position of the bare chip, which is a subsequent component by the wafer head 80a (the extraction head unit 40), is corrected based on Δα and the average correction amount Δα ′. That is, the bare chip target suction position by the wafer head 80a is corrected by the moving average correction amount Δα and the average correction amount Δα ′ in this way, so that the bare chip is placed at a predetermined position on the relay stage 82 more accurately. It will be. Therefore, it is possible to effectively suppress the occurrence of adsorption deviation when the bare chip is transferred from the wafer head 80a to the mounting head 12a. Similarly to the first embodiment, the bare chip is transferred from the wafer head 80a to the mounting head 12a. Delivery will be performed with higher accuracy.

(Third form)
The third embodiment of the component mounting apparatus M3 (provided with reference numerals for the sake of explanation) is different from the second embodiment of the component mounting apparatus M2 in the following points except for the basic configuration. This is common with the component mounting apparatus M2.

  In this component mounting apparatus M3, the processing of steps S503, S505 and S513 to S517 in the flowchart of FIG. 6 is omitted in the processing of step S5 (component extraction processing) of FIG. Further, the component mounting apparatus M3 moves the wafer head 80a to the target suction position (center of the bare chip) corrected based on the bare chip image recognition result by the moving camera 50 (step S509), and performs the component suction (step S511). The target suction position is not corrected based on the detection data of the preceding part as in the first and second embodiments.

  FIG. 11 is a flowchart showing component delivery operation control in the component mounting apparatus M3. In this operation control, steps S807 to S820 are added before step S811 in the flowchart of FIG. That is, the control device 70 first determines whether or not a predetermined correction condition for correcting the target placement position of the bare chip on the relay stage 82 is satisfied (step S807). If not satisfied, the control device 70 further determines whether or not the target placement position of the bare chip on the relay stage 82 can be corrected (step S809). If correction is not yet possible, the control device 70 sets a predetermined initial position as the target placement position, and calculates the target position of the take-out head unit 40 based on this target placement position ( Step S810). That is, the target position of the take-out head unit 40 is calculated so that the center of the wafer head 80a is located at a predetermined position on the relay stage 82. On the other hand, when the target placement position can be corrected in step S809 (YES in step S809), the control device 70 uses the average correction amount Δα ′ stored in the storage unit 72 for removal. The target placement position of the head unit 40 is calculated (step S817).

  On the other hand, if the predetermined correction condition is satisfied in step S807 (YES in step S807), the control device 70 sets the target placement position based on the moving average correction amount Δα stored in the storage unit 72. After the correction, the target position of the takeout head unit 40 is calculated based on the corrected target placement position (step S820).

  Then, the control device 70 determines the target position obtained in any one of steps S810, S817, and S820 so that the wafer head 80a (the extraction head unit 40) is arranged at the target placement position. Control based on As a result, the take-out head unit 40 is moved to the parts delivery position, that is, above the relay stage 82 (step S811). Then, after the wafer head 80a is lowered to cancel the bare chip suction state, the wafer head 80a is raised to place the bare chip on the relay stage 82 (steps S813 and 815S). Since the operation control (steps S711 to S715) of the mounting head 12a (mounting head unit 10C) has already been described in the second embodiment, the description thereof is omitted here.

  That is, in the second embodiment, the target suction position of the bare chip when the wafer head 80a (takeout head unit 40) takes out the bare chip from the wafer W is corrected based on the moving average correction amount Δα. In the third embodiment, the target placement position when the wafer head 80a (the extraction head unit 40) places the bare chip on the relay stage 82 is corrected based on the moving average correction amount Δα.

  According to the component mounting apparatus M3 of the third embodiment, the bare chip target placement position by the wafer head 80a is corrected by the moving average correction amount Δα in this way, so that the bare chip can be more accurately specified on the relay stage 82. It will be placed at the position. Therefore, it is possible to effectively suppress the occurrence of adsorption displacement when the bare chip is transferred from the wafer head 80a to the mounting head 12a. Similarly to the second embodiment, the bare chip from the wafer head 80a to the mounting head 12a can be suppressed. Is transferred with higher accuracy.

  In the third embodiment, the wafer head 80a corresponds to the first head of the present invention, the mounting head 12a corresponds to the second head of the present invention, and the fixed cameras 18a and 18b correspond to the imaging device of the present invention. . Further, the control device includes a storage unit 72 (corresponding to the storage unit of the present invention).

  The component mounting apparatus M3 according to the third embodiment requires a unified correction amount based on the image recognition of the bare chip by the fixed cameras 18A and 18B after the delivery to the mounting head 12a. Since the stored moving average correction amount Δα and average correction amount Δα ′ are the same as those in the first and second embodiments and have already been described, they are omitted here.

(4th form)
The component mounting apparatus M4 of the fourth embodiment (provided with a reference for convenience of explanation) is different from the component mounting apparatus M1 of the first embodiment in the following points, and the basic configuration is the first configuration. It is common with the component mounting apparatus M1 of the form.

  In the component mounting apparatus M4 according to the fourth embodiment, the processing in step S11 (processing such as calculation of the unified correction amount and the moving average correction amount Δα and the average correction amount Δα ′) is not performed in the flowchart shown in FIG. On the other hand, the processing of step S7 in FIG. 5 (part delivery processing) is executed based on the operation control shown in FIG. 12, thereby calculating the following unified correction amount, moving average correction amount Δβ, and average correction amount Δβ ′. Is done.

  FIG. 12 is a flowchart showing the component delivery operation control of the component mounting apparatus M4. In this control, steps S601 to S605 are added before step S701 in the flowchart of FIG. 7, and step S703 is omitted. That is, in step S801, the control device 70 waits for the bare chip to be placed at the component delivery position in a face-down state (step S601), and when placed, performs image recognition of the bare chip (step S603). Specifically, the control device 70 moves the first mounting head unit 10A above the component delivery position, and images the bare chip adsorbed on the wafer head 41a (nozzle 44) with the substrate recognition moving camera 12b. In addition, based on the image data, the amount of positional deviation of the bare chip in the X direction and Y direction with respect to a predetermined component delivery position (predetermined reference position) is obtained, and further the amount of correction (ΔX, ΔY) of this positional deviation is obtained. Ask. At this time, when the two wafer heads 41a respectively attract the bare chips, the control device 70 obtains a correction amount (individual correction amount) individually for each wafer head 41a.

  The control device 70 further obtains an average value (unified correction amount) of the two individual correction amounts obtained in step S603, stores (accumulates) the newly obtained unified correction amount in the storage unit 72, and Based on the new unified correction amount and the unified correction amount already stored in the storage unit 72, a moving average value (referred to as moving average correction amount Δβ) and an average value (referred to as average correction amount Δβ ′) are obtained. The moving average correction value Δβ and the average correction amount Δβ ′ of the unified correction amount stored in the storage unit 72 are updated (step S605).

  When the bare chip image recognition is completed, the control device 70 moves the mounting head units 10A and 10B to the component delivery position (step S701), and sucks the bare chip by the mounting head 12a (= for sucking to the mounting head 12a). Negative pressure is applied) (step S705). Note that the processes in steps S707 and S709 and the processes in steps S801 to S805 related to the wafer head 41a (the extraction head unit 40) have already been described in the first embodiment, and thus are omitted here.

  That is, in the first embodiment, after the bare chip is delivered from the wafer head 41a (the take-out head unit 40) to the mounting head 12a (the mounting head units 10A and 10B), the bare chip is adsorbed to the mounting head 12a. The moving average correction amount Δα and the average correction amount Δα ′ are obtained, and the target suction position when the bare chip is taken out by the wafer head 41a is corrected based on the moving average correction amount Δα and the average correction amount Δα ′. In the fourth embodiment, before the bare chip is transferred from the wafer head 41a to the mounting head 12a, the moving average correction amount Δβ or the average for the positional deviation of the bare chip attracted to the wafer head 41a with respect to the predetermined transfer position is averaged. A correction amount Δβ ′ is obtained and based on the moving average correction amount Δβ and the average correction amount Δβ ′. , The target suction position of a subsequent part bare chip extraction when the wafer head 41a (the retrieval head unit 40) is corrected.

  According to the component mounting apparatus M4 of the fourth embodiment as described above, the position shift of the bare chip with respect to the predetermined delivery position is fed back to the bare chip take-out operation by the wafer head 41a (the take-out head unit 40). That is, when the bare chip target suction position by the wafer head 41a is shifted (corrected) in advance by an amount corresponding to the deviation of the bare chip with respect to the predetermined delivery position, the bare chip is delivered from the wafer head 41a to the mounting head 12a. Therefore, the bare chip is transferred from the wafer head 41a to the mounting head 12a with higher accuracy. Therefore, also in the case of this component mounting apparatus M4, it is possible to receive the same operational effects as those of the component mounting apparatus M1 of the first embodiment described above.

(5th form)
FIG. 13 shows the overall configuration of a component mounting apparatus M5 according to the fifth embodiment. The component mounting apparatus M5 of the fifth embodiment is basically the same as the component mounting apparatus M2 (FIGS. 8 and 9) of the second embodiment except for the following points. Common to the mounting apparatus M2.

  This component mounting apparatus M5 further includes a third fixed camera 18C for component recognition on the base 1. The third fixed camera 18C is a camera including an image sensor such as a CCD or a CMOS, and takes an image of the bare chip adsorbed on the wafer head 80a (the extraction head unit 40) from the lower side and controls the image signal. This is output to the device 70. The third fixed camera 18C is disposed in a movable region of the picking-up head unit 40 and in the vicinity of the component picking work position.

  In the component mounting apparatus M5, the processing in step S11 (processing such as calculation of the unified correction amount, the average correction amount Δα, and the average correction amount Δα ′) is not performed in the flowchart of FIG. On the other hand, the processing in step S5 in FIG. 5 (part extraction processing) is executed based on the operation control shown in FIG. 15, thereby calculating the following unified correction amount, moving average correction amount Δγ, and average correction amount Δγ ′. Is done.

  FIG. 14 is a flowchart showing the component removal operation control of the component mounting apparatus M5.

This control is obtained by adding steps S519 and S521 after step S511 in the flowchart of FIG. That is, when the bare chip is attracted by the wafer head 80a and taken out from the wafer W in step S511, the control device 70 performs image recognition of the bare chip (step S519). Specifically, the control device 70 moves the take-out head unit 40 above the third fixed camera 18C, causes the third fixed camera 18C to take an image of the bare chip adsorbed on the wafer head 80a, and the image data thereof. Based on the above, the adsorption deviation of the bare chip with respect to the wafer head 80a, specifically, the deviation amounts in the X direction, the Y direction, and the rotation direction with respect to the center of the nozzle 44 is obtained. Ask for. At this time, when the two wafer heads 80a respectively attract the bare chips, the control device 70 obtains a correction amount (individual correction amount) individually for each wafer head 80a.

  The control device 70 further obtains an average value (unified correction amount) of the two individual correction amounts obtained in step S519, stores (accumulates) the unified correction amount in the storage unit 72, and moves these unified correction amounts. An average value (referred to as moving average correction amount Δγ) and an average value (referred to as average correction amount Δγ ′) are obtained and stored in the storage unit 72 in an update manner (step S521). In addition, since the process of step S501-step S511 is the same as that of FIG. 6, description is abbreviate | omitted here.

  That is, in the fifth embodiment, after a bare chip is taken out from the wafer W by the wafer head 80a (takeout head unit 40), before the bare chip is transferred from the wafer head 80a onto the relay stage 82, the wafer head The bare chip adsorption deviation with respect to 80a is required. Then, a moving average correction amount Δγ and an average correction amount Δγ ′ for the suction deviation are obtained, and based on the moving average correction amount Δγ and the average correction amount Δγ ′, the target suction position when the bare chip is taken out by the wafer head 80a is determined. Correction is performed (step S517).

  According to the component mounting apparatus M5 of the fifth embodiment, the center of the actual bare chip on the wafer W is set as the target suction position, and the wafer head 80a is based on the bare chip suction state by the actual wafer head 80a. Since the target suction position of the bare chip due to is corrected, the precision of the bare chip suction position by the wafer head 80a is improved. Therefore, when the bare chip is transferred from the wafer head 80a to the mounting head 12a, the mounting head 12a can more reliably attract the position where the bare chip is defined (the center of the bare chip). For this reason, the occurrence of adsorption displacement during the transfer of the bare chip from the wafer head 80a to the mounting head 12a is suppressed, and the transfer of the bare chip from the wafer head 80a to the mounting head 12a is performed with higher accuracy. Therefore, also in the case of this component mounting apparatus M5, it is possible to receive the same operational effects as those of the component mounting apparatus M1 of the first embodiment described above.

  In the fifth embodiment, the third fixed camera 18C is provided as a camera for recognizing an image of the adsorption state of the bare chip by the wafer head 80a. However, such a dedicated third fixed camera 18C is not used. The first fixed camera 18A or the second fixed camera 18B may also be used.

  The configuration for correcting the target suction position of the bare chip by the wafer head 80a after the image recognition of the bare chip suction state by the wafer head 80a by the third fixed camera 18C in this way is the component mounting apparatus of the first embodiment. As in M1, a configuration in which a bare chip is directly transferred from the wafer head 41a to the mounting head 12a is also applicable.

(Sixth form)
The component mounting apparatus M6 of the sixth embodiment (provided with reference numerals for the sake of explanation) has the following basic configuration except that the configuration of the component mounting apparatus M6 of the fifth embodiment is different from that of the component mounting apparatus M5 of the fifth embodiment. It is common with the component mounting apparatus M5 of the form.

  This component mounting apparatus M6 does not include the third fixed camera 18C as in the fifth embodiment. In this component mounting apparatus M6, the component extraction process is basically executed based on the operation control shown in FIG. 14, but instead of the process in step S519 in FIG. 14, step S520 surrounded by a broken line in FIG. (Push-up mark recognition process) is executed. That is, when the bare chip is adsorbed by the wafer head 80a and taken out from the wafer W in step S511, the control device 70 performs image recognition of the raised trace of the wafer sheet (step S520). Specifically, the control device 70 moves the moving camera 50 above the wafer W, and causes the moving camera 50 to image the position of the bare chip taken out in step S511 on the wafer sheet. Based on the image data, the protrusion mark of the protrusion head 31a (the protrusion pin) is recognized, and the reference position (the center of the bare chip) in theory (design) or the reference position actually recognized in step S501 ( A positional deviation amount in the X direction and the Y direction between the center of the bare chip) and the position of the push-up mark is obtained, and further, a correction amount (ΔX, ΔY) of this positional deviation is obtained. Further, the control device 70 stores (accumulates) the correction amount in the storage unit 72, and also calculates a moving average value (referred to as a moving average correction amount Δε) and an average value (referred to as an average correction amount Δε ′) of these correction amounts. Is updated and stored in the storage unit 72 (step S521).

  That is, in the sixth embodiment, after the bare chip is taken out of the wafer W by the wafer head 80a (takeout head unit 40), the positional deviation of the pushup mark by the pushup head 31a (pushup pin) is required. Then, a moving average correction amount Δε and an average correction amount Δε ′ for the positional deviation are obtained. Based on the moving average correction amount Δε and the average correction amount Δε ′, the wafer head 80a is used when a bare chip is taken out from the wafer W. The target suction position is corrected, and the target push-up position of the bare chip by the push-up head 31a is corrected (step S517). As described above, when the bare chip is taken out from the wafer W, the push-up head unit 30 and the take-out head unit 40 are controlled so that the push-up head 31a (push-up pin) and the wafer head 80a are arranged at the same position. Therefore, the target suction position of the bare chip by the wafer head 80a is corrected based on the position of the protrusion mark in this way, and the target protrusion position of the bare chip by the protrusion head 31a is corrected, whereby the wafer head 80a The accuracy of the bare chip suction position is improved. Therefore, when the bare chip is transferred from the wafer head 80a to the mounting head 12a, the mounting head 12a can more reliably attract the position where the bare chip is defined (the center of the bare chip). For this reason, the occurrence of adsorption displacement during the transfer of the bare chip from the wafer head 80a to the mounting head 12a is suppressed, and the transfer of the bare chip from the wafer head 80a to the mounting head 12a is performed with higher accuracy. Therefore, also in the case of this component mounting apparatus M5, it is possible to receive the same operational effects as those of the component mounting apparatus M1 of the first embodiment described above.

  The configuration for correcting the target suction position of the bare chip by the wafer head 80a after recognizing the position of the protrusion mark in this way is the same as that of the component mounting apparatus M1 of the first embodiment from the wafer head 41a. The present invention can also be applied to a configuration in which a bare chip is directly delivered to the mounting head 12a.

  By the way, the component mounting apparatuses M1 to M6 according to the first to sixth embodiments described above are examples of the form of the component mounting apparatus, and the specific configuration of the component mounting apparatus departs from the gist of the present invention. It is possible to change appropriately within the range not to be.

  For example, in each of the above embodiments, when the number of correction amount (unified correction amount) data stored in the storage unit 72 reaches a set number (corresponding to the first condition of the present invention), the wafer head 41a (80a) Correction of the target adsorption position of the bare chip or the target placement position of the bare chip with respect to the relay stage 82 is performed (steps S503, S515, and S517 in FIGS. 6 and 15 and steps S807, S819, and S820 in FIG. 12). You may make it perform the said correction | amendment at timings other than. That is, the correction conditions in steps S503 and S807 are not limited to the above conditions. For example, it may be executed when the moving average correction amounts Δα, Δβ, Δγ, and Δε, and the average correction amounts Δα′Δβ′Δγ ′ and Δε ′ exceed a predetermined threshold (in accordance with the second condition of the present invention). It may be executed for each substrate P, or for each of a plurality of preset substrates P (corresponding to the third condition of the present invention), or may be executed with the passage of a set time.

  In each of the above embodiments, the moving average values (moving average correction amounts Δα, Δβ, Δγ and Δε) stored (accumulated) in the storage unit 72 and the average values (average correction amounts Δα ′, Δβ ′) are stored. , Δγ ′ and Δε ′), the target suction position and target mounting position are corrected. In this case, the standard deviation of the accumulated unified correction amount is obtained each time, and the unexpected data exceeding the predetermined range is deleted. Then, the moving average correction amounts Δα, Δβ, Δγ, and Δε and the average correction amounts Δα ′, Δβ ′, Δγ ′, and Δε ′ may be obtained. According to this configuration, it is possible to exclude suddenly generated adsorption deviations and the like from the calculation target. Therefore, the moving average correction amounts Δα, Δβ, Δγ, and Δε and the average correction amounts Δα ′, Δβ ′, Δγ ′, and The reliability of Δε ′ is improved, and the accuracy of attracting the bare chip by the wafer head 41a (80a) or the position accuracy when placing the bare chip on the relay stage 82 is enhanced.

  In each of the above embodiments, for example, a unified correction amount that is an average value of the amount of bare chip adsorption deviation by the two wafer heads 41a is obtained. For example, one of the two wafer heads 41a is used as a reference head. The moving average correction amount Δα and the like may be obtained by regarding the amount of bare chip adsorption deviation by the reference head as a unified correction amount. That is, since the two wafer heads 41a are mounted on the take-out head unit 40 and driven integrally, the moving average correction amount Δα and the like are obtained based on one of the two wafer heads 41a as described above. You may do it.

  In each of the above embodiments, the bare chip is taken out from the wafer W arranged in the second component supply unit 5 by the wafer head 41a (80a), and the bare chip is directly attached to the mounting head 12a from the wafer head 41a or the relay stage 82 is provided. The component mounting apparatus of the type that is indirectly transferred and mounted on the substrate P has been described. However, the present invention is a tray that accommodates package components such as QFP (Quad Flat Package) and BGA (Ball Grid Array). A type in which a part is taken out from the board by a take-out head (corresponding to the first head of the present invention), and this is directly or indirectly delivered to the mounting head via a relay stage for parts delivery and mounted on the substrate P The present invention can also be applied to other component mounting apparatuses.

  In each of the above embodiments, the target suction position of the bare chip by the wafer heads 41a and 80a and the target placement position when the bare chip sucked by the wafer head 80a is placed on the relay stage 82 are corrected. However, when the subsequent bare chip is directly transferred from the wafer head 41a to the mounting head 12a, the component transfer position (target transfer position) of the wafer head 41a is corrected based on the moving average correction amount or the average correction amount, or mounted. A predetermined component delivery position (target delivery position) of the head 12a may be corrected based on the moving average correction amount or the average correction amount. Further, when the bare chip is delivered from the wafer head 41a to the mounting head 12a via the relay stage 82, the component adsorption position (target delivery position) of the mounting head 12a that adsorbs the subsequent bare chip mounted on the relay stage 82. ) May be corrected based on the moving average correction amount or the average correction amount. Also with these configurations, the displacement of the bare chip when the subsequent bare chip is delivered from the wafer heads 41a, 80a to the mounting head 12a directly or indirectly via the relay stage 82 is suppressed.

  In each of the above embodiments, when the moving average correction amount and the average correction amount are obtained, the bare chip adsorbed on the mounting head 12a is imaged after the parts are delivered, or the bare chip adsorbed by the wafer head 80a is delivered. Although the unified correction amount that was imaged before and calculated based on the image data is used, the unified correction amount that is calculated based on the image data obtained by imaging the bare chip on the wafer may be used. The moving average correction amount and the average correction amount can also be obtained by these, and when the subsequent bare chip is transferred from the wafer head 41a, 80a to the mounting head 12a directly or indirectly via the relay stage 82, The positional deviation of the bare chip is suppressed.

  Further, the bare chip adsorbed on the wafer head 80a is imaged from below by the third fixed camera 18C on the base, or the bare chip adsorbed on the wafer head 41a (nozzle 44) is moved for substrate recognition in a face-down state. By taking an image with the camera 12b, a deviation amount of the center of the bare chip with respect to the centers of the wafer heads 41a and 80a is obtained, and when the bare chip is transferred from the wafer heads 41a and 80a to the mounting head 12a based on the deviation amount. The wafer heads 41a and 80a may be corrected with respect to a predetermined delivery position, or the mounting head 12a may be corrected with respect to a predetermined delivery position. Even with such a configuration, positional deviation of the bare chip when the bare chip is directly transferred from the wafer heads 41a and 80a to the mounting head 12a is suppressed.

  Further, when the bare chip is indirectly transferred from the wafer head 41a to the mounting head 12a via the relay stage 82, the amount of deviation of the center of the bare chip from the center of the wafer head 80a is obtained, and based on this amount of deviation, You may make it correct | amend the mounting position at the time of mounting a bare chip on the relay stage 82, or correct | amend the adsorption | suction position of the mounting head 12a at the time of adsorb | sucking the bare chip mounted on the relay stage 82. FIG. Also with this configuration, the positional deviation of the bare chip when being transferred from the wafer head 80a to the mounting head 12a via the relay stage 82 is suppressed.

  In the first embodiment, the initial position when the bare chip on the wafer W is attracted by the wafer heads 41a and 80a is set as the center (reference position) of the bare chip on the wafer imaged by the moving camera 50, but step S501. The part recognition may be omitted, and a predetermined position corresponding to the wafer W may be set as the initial position. Furthermore, when obtaining the unified correction amount, the moving average correction amount, and the average correction amount based on the preceding parts, the various cameras described above can be used. As a result, the displacement of the bare chip when the wafer heads 41a and 80a are transferred to the mounting head 12a directly or indirectly via the relay stage 82 is suppressed.

DESCRIPTION OF SYMBOLS 1 Base 2 Conveyor 4 1st component supply part 5 2nd component supply part 6 Component mounting mechanism 7 Wafer support apparatus 8 Take-out apparatus 9 Push-up apparatus 10A First mounting head unit 10B Second mounting head unit 12a Mounting head 40 Take-out head unit 41a Wafer head 70 Control device M1-M6 Component mounting device

Claims (4)

A component mounting apparatus that includes a component supply unit, takes out a component from the component supply unit, and mounts the component on a substrate,
A first head for taking out a component from the component supply unit;
A relay stage on which the component taken out by the first head is placed by the first head ;
A second head for transporting and mounting a component placed on the relay stage on a substrate;
An imaging device for imaging a component held by the first head, a component placed on the relay stage, or a component held by the second head;
A control device for controlling the first head and the second head,
The control device obtains a displacement amount of a component related to the component image with respect to a predetermined reference position based on the component image captured by the imaging device, and the first head is taken out from the component supply unit based on the displacement amount. component mounting apparatus characterized by performing a correction process for correcting the subsequent parts the first head 置位location mounting when placed on the intermediate stage was. The component mounting apparatus according to claim 1,
A storage unit for storing data relating to the amount of deviation;
The control device executes the correction process based on the data stored in the storage unit when a predetermined correction condition is satisfied. In the component mounting apparatus according to claim 2,
The control device performs the correction process based on an average value of data stored in the storage unit. In the component mounting apparatus according to claim 2 or 3,
The control device includes: a first condition in which the number of data stored in the storage unit reaches a set number; a second condition in which an average value of data stored in the storage unit exceeds a threshold value; The component mounting apparatus, wherein any one of the exceeding third conditions is the correction condition.

Images