JP6318367B2 - Component mounting method and component mounting apparatus - Google Patents

Description

  The present invention relates to a component mounting method and a component mounting apparatus in which components supplied by a tape feeder are sucked by a suction nozzle and mounted on a substrate.

  In a component mounting apparatus that mounts electronic components on a substrate, an electronic component is taken out by a mounting head from a component supply unit in which a large number of component supply devices such as a tape feeder are arranged in parallel, and is mounted on the substrate. As the mounting head, a multiple-type head having a plurality of suction nozzles is used, and the mounting head takes out a plurality of electronic components in one mounting turn that reciprocates between the component supply unit and the substrate, thereby improving work efficiency. I try to improve. At this time, if a plurality of components can be sucked simultaneously to each of the plurality of suction nozzles, the operation efficiency of picking up the components can be improved, and the productivity is further improved.

  In order to enable simultaneous suction of a plurality of components, it is required that the component suction position and the component stop position by the tape feeder mechanism of the tape feeder are accurately matched in each suction nozzle. For this reason, various measures have been introduced for the purpose of suppressing the displacement between the component suction position and the component stop position (see, for example, Patent Document 1). In the prior art disclosed in this patent document, when the component suction position and the component stop position are deviated, the component suction position is corrected so that the component suction position and the component stop position coincide with each other. The range to become is expanded.

JP 2005-005288 A

  However, in the related art including the above-described patent document example and expanding the range of simultaneous suction of a plurality of components by correcting the component stop position, there are the following problems. That is, there is a limit to the correction of the component stop position, and simultaneous suction may not be possible if the amount of deviation in the tape feed direction between the component suction position and the component stop position is large. If the correction amount of the component stop position is large, even the next sucked component may be sent to the component extraction opening for removing the component. In this case, the cover tape is peeled off and the upper surface side is This is because the exposed part may jump out.

  Therefore, the present invention provides a component mounting method and a component mounting apparatus capable of expanding the target range in which a plurality of components can be simultaneously attracted even when the amount of deviation between the component attracting position and the component stop position is large. For the purpose.

  The component mounting method of the present invention includes a plurality of suction nozzles mounted from a tape feeder provided with a tape feeding mechanism that is arranged in parallel in a component supply unit and feeds components held on a tape to a component suction position by a suction nozzle. A component mounting method for simultaneously sucking and mounting a plurality of components on a substrate by a head, the step of detecting a shift amount between a component stop position and the component suction position in tape feeding by the tape feeding mechanism, and the deviation amount Is within the limit value, a first simultaneous suction step for simultaneously picking up a plurality of components by correcting the component stop position of each tape feeder so that the component stop position matches a preset component suction position; If the positional deviation amount is not within the limit value, the tape feeder component stop position other than the tape feeder component stop position is not within the limit value. It matches the labels to correct the parts stop position comprises a second co-adsorption step of adsorbing a plurality of components simultaneously, the.

  The component mounting apparatus according to the present invention is mounted with a plurality of suction nozzles from a tape feeder provided with a tape feeding mechanism that is arranged in parallel in a component supply unit and feeds the components held on the tape to the component suction position by the suction nozzle. A component mounting apparatus that simultaneously picks up a plurality of components by a head and mounts them on a substrate, and a displacement detection unit that detects a displacement amount between a component stop position and the component suction position in tape feeding by the tape feeding mechanism, A component suction control unit that controls the mounting head and the tape feeding mechanism based on the detected shift amount to cause the component stop position and the component suction position to coincide with each other to simultaneously suck a plurality of components; The component suction control unit is configured such that when the deviation amount is within the limit value, the component stop position matches the preset component suction position. When the parts stop position of each tape feeder is corrected to adsorb a plurality of parts at the same time, and the deviation amount is not within the limit value, the other tape feeders are placed at the parts stop position of the tape feeder where the deviation amount is not within the limit value. The parts stop position is corrected so that the parts stop positions coincide with each other, and a plurality of parts are sucked simultaneously.

  According to the present invention, even if the amount of deviation between the component suction position and the component stop position is large, the target range in which a plurality of components can be simultaneously sucked can be expanded.

The top view of the component mounting apparatus of one embodiment of this invention The fragmentary sectional view of the component mounting apparatus of one embodiment of the present invention The fragmentary sectional view of the component mounting apparatus of one embodiment of the present invention Structure explanatory drawing of the tape feeder with which the component mounting apparatus of one embodiment of this invention is mounted | worn Explanatory drawing of the component adsorption | suction position and component stop position in the component mounting apparatus of one embodiment of this invention Explanatory drawing which shows the limit value of correction | amendment of a component stop position in the component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the control system in the component mounting apparatus of one embodiment of this invention Explanatory drawing of the position shift detection of the component adsorption | suction position and component stop position in the component mounting apparatus of one embodiment of this invention The flowchart of the simultaneous adsorption | suction process of the components in the component mounting method of one embodiment of this invention of one embodiment of this invention Explanatory drawing of the correction | amendment aspect of the component stop position in the component mounting method of one embodiment of this invention of one embodiment of this invention Explanatory drawing of the correction | amendment aspect of the component stop position in the component mounting method of one embodiment of this invention of one embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, with reference to FIG. 1 and FIG. 2, the structure of the component mounting apparatus 1 which mounts an electronic component on a board | substrate is demonstrated. The component mounting apparatus 1 has a function of mounting an electronic component (hereinafter simply abbreviated as “component”) on a substrate, and FIG. 2 partially shows a cross section taken along line AA in FIG.

  In FIG. 1, a substrate transport mechanism 2 is disposed in the center of the base 1a in the X direction (substrate transport direction). The board transport mechanism 2 transports the board 3 carried in from the upstream side, and positions and holds the board 3 on a mounting stage set for executing a component mounting operation. Component supply units 4 are disposed on both sides of the substrate transport mechanism 2, and a plurality of tape feeders 5 are mounted in parallel on each component supply unit 4.

  The tape feeder 5 pitches the carrier tape containing the components in the tape feeding direction, that is, the direction from the outside of the component supply unit 4 toward the substrate transport mechanism 2, so that the component by the mounting head of the component mounting mechanism described below Supply the parts to the removal position. A Y-axis beam 7 having a linear drive mechanism is disposed in the Y direction (a direction orthogonal to the X direction) at one end in the X direction on the upper surface of the base 1a. Similarly, two X-axis beams 8 each having a linear drive mechanism are coupled to be movable in the Y direction. A mounting head 9 is mounted on each of the two X-axis beams 8 so as to be movable in the X direction.

  The mounting head 9 is a multiple head having a plurality of holding heads 9a (see FIG. 3), and the lower end portion of each holding head 9a sucks and holds the components as shown in FIG. A suction nozzle 12 that can be moved up and down is mounted. By driving the Y-axis beam 7 and the X-axis beam 8, the mounting head 9 moves in the X direction and the Y direction. As a result, the two mounting heads 9 take out the component 16 by the suction nozzle 12 from the component take-out position of the tape feeder 5 of the corresponding component supply unit 4.

  The component suction position [P1] (see FIG. 5) at which the suction nozzle 12 sucks and holds the component 16 at the component pick-up position is variable and is set to coincide with the component stop position [P2] in the tape feeder 5. . Then, the extracted component 16 is transferred and mounted on the mounting point of the substrate 3 positioned by the substrate transport mechanism 2. The Y-axis beam 7, the X-axis beam 8, and the mounting head 9 constitute a component mounting mechanism 10 that moves and mounts the component on the substrate 3 by moving the mounting head 9 that holds the component.

  A component recognition camera 6 is disposed between the component supply unit 4 and the board transport mechanism 2. When the mounting head 9 that has taken out a component from the component supply unit 4 moves above the component recognition camera 6, the component recognition camera 6 captures and recognizes the component held by the mounting head 9. Mounted on the mounting head 9 are substrate recognition cameras 11 that are located on the lower surface side of the X-axis beam 8 and move together with the mounting head 9. As the mounting head 9 moves, the substrate recognition camera 11 moves above the substrate 3 positioned by the substrate transport mechanism 2 and images and recognizes the substrate 3. In the component mounting operation on the substrate 3 by the mounting head 9, the mounting position correction is performed in consideration of the component recognition result by the component recognition camera 6 and the substrate recognition result by the substrate recognition camera 11.

  As shown in FIG. 2, a carriage 13 in which a plurality of tape feeders 5 are mounted in advance on a feeder base 13 a is set in the component supply unit 4. By clamping the feeder base 13a to the fixed base 1b provided on the base 1a, the position of the carriage 13 is fixed in the component supply unit 4. The carriage 13 holds a supply reel 14 for storing a carrier tape 15 holding components in a wound state. The carrier tape 15 drawn out from the supply reel 14 is pitch-fed by the tape feeder 5 to the component pick-up position 5b by the suction nozzle 12.

  Next, the mounting head 9 will be described with reference to FIG. As shown in FIG. 3, the mounting head 9 is a multiple head, and includes four holding heads 9 a. Here, the arrangement pitch p in the X direction of the holding heads 9a coincides with the arrangement pitch p of the tape feeders 5 in the component supply unit 4, and the positions in the Y direction of the holding heads 9a are all on the same line. As a result, in one component take-out operation in which the mounting head 9 is moved to the component supply unit 4 and the component 16 is taken out from the tape feeder 5, a plurality of tapes are picked up by the suction nozzles 12 attached to the plurality of holding heads 9a. Simultaneous suction can be performed by simultaneously picking up and picking up the component 16 from the component pickup position 5b of the feeder 5. That is, the component mounting apparatus 1 simultaneously picks out a plurality of components 16 from the tape feeder 5 provided in parallel with the component supply unit 4 by the mounting head 9 having a plurality of suction nozzles 12 and mounts them on the substrate 3. To do.

  Next, the configuration and function of the tape feeder 5 will be described with reference to FIG. As shown in FIG. 4, the tape feeder 5 includes a main body 5a and a mounting portion 5e protruding downward from the lower surface of the main body 5a. In a state where the tape feeder 5 is mounted with the lower surface of the main body 5a aligned with the feeder base 13a, the connector portion 5c provided in the mounting portion 5e is fitted into the feeder base 13a. Accordingly, the tape feeder 5 is fixedly mounted on the component supply unit 4 and the tape feeder 5 is electrically connected to the control unit 30 (see FIG. 7) of the component mounting apparatus 1.

  Inside the main body 5a, a tape running path 5d for guiding the carrier tape 15 drawn from the supply reel 14 and taken into the main body 5a is provided continuously from the rear end to the front end of the main body 5a. ing. In the carrier tape 15, a base pocket 15a constituting the tape body is provided with a component pocket 15b, which is a concave portion for storing the electronic component 16, and a feed hole 15d for pitch feeding the carrier tape 15 at a predetermined pitch. It becomes the composition. The upper surface of the base tape 15a is sealed with a cover tape 15c so as to cover the component pocket 15b in order to prevent the component 16 from falling off the component pocket 15b.

  The main body 5a is provided with a tape feed mechanism 20 for pitch-feeding the carrier tape 15. The tape feed mechanism 20 includes a feed motor 18 that rotationally drives a sprocket 19 provided at the tip of the tape running path 5d, and a feeder controller 17 that controls the feed motor 18. When the tape feeder 5 is mounted on the feeder base 13a, the feeder controller 17 is connected to the controller 30 (see FIG. 7). In the tape feeding by the tape feeding mechanism 20, the component stop position data [P2] (see FIG. 5) where the component 16 to be taken out stops is the component stop position data stored in the storage unit 31 by the feeder control unit 17. Adjustment is possible by controlling based on 33b.

  The front side of the sprocket 19 is a component take-out position 5b that picks up and picks up the component 16 in the component pocket 15b by the suction nozzle 12 mounted on the mounting head 9. On the upper surface side of the main body 5a in the vicinity of the sprocket 19, a pressing member 21 is disposed. The pressing member 21 guides the carrier tape 15 by pressing it from the upper surface side within a predetermined range including the component take-out position 5b of the tape running path 5d. The holding member 21 is provided with a taking-out opening 22 corresponding to the take-out position of the component 16 by the suction nozzle 12.

  The edge of the trailing edge of the take-out opening 22 is a tape peeling portion 21a in which the end of the holding member 21 is cut into a shape having an upper taper surface, and the cover tape 15c peeled from the base tape 15a is a tape peeling portion. It goes around 21a and is led backward. As a result, the cover pocket 15c is peeled off from the component pocket 15b in the take-out opening 22, and the component 16 in the component pocket 15b can be picked up by the suction nozzle 12 and taken out.

  Next, the component suction position [P1] by the suction nozzle 12 and the component stop position [P2] in the tape feeding of the carrier tape 15 will be described with reference to FIGS. In picking up the components by the mounting head 9, it is required to match the component suction position [P1] with the component stop position [P2]. As described above, both the component suction position [P1] by the mounting head 9 and the component stop position [P2] in the tape feeding mechanism 20 are variable, and in this embodiment, a plurality of components can be simultaneously sucked. For the purpose of expanding the range as much as possible, the parts suction position [P1] and the parts stop position [P2] are rationally set to improve the efficiency of the part suction work.

  In FIG. 5A, the component suction position [P1] is a default position when the tape feeder 5 from which components are to be taken out is targeted. The part stop position [P2] is a default position in an operating state in which the tape feeder 5 is actually arranged on the feeder base 13a. Originally, the component suction position [P1] and the component stop position [P2] should coincide with each other, but in reality, due to the difference in the inherent machine of the tape feeder 5 and the error in setting to the feeder base 13a, etc. The suction position [P1] and the component stop position [P2] do not coincide with each other, and are displaced by a deviation amount d corresponding to the individual state.

  In order to correct such a positional deviation, as shown in FIG. 5B, the original position of the tape feeding mechanism 20 in the tape feeder 5 is corrected by a deviation amount d in a direction (arrow a) to eliminate the positional deviation. Offset processing is performed for each individual tape feeder 5. As a result, the component suction position [P1] and the component stop position [P2] of the plurality of tape feeders 5 arranged in the component supply unit 4 coincide with each other, and the component pockets of the carrier tape 15 taped by each tape feeder 5 are used. The component 16 can be correctly sucked and held by the suction nozzle 12 from 15b.

  Next, a limit value that defines a range in which correction is allowed in the offset processing for correcting the shift amount d will be described with reference to FIG. FIG. 6A shows the limit value L1 in the offset process for moving the component stop position [P2] in the tape feeding direction. That is, in this case, the component stop position [P2] moves from the default position shown in FIG. 5A in the tape feed direction in the take-out opening 22, and depending on the offset amount, the next take-out object in the tape feed is determined. There may be a situation in which the component pocket 15b in which the component 16 * is stored is sent into the take-out opening 22. In this case, there is a possibility that the component 16 jumps out of the component pocket 15b exposed from the upper part by peeling off the cover tape 15c, thereby hindering normal component removal. Therefore, in the offset process of moving the component stop position [P2] in the tape feeding direction, the offset amount needs to be suppressed to a range smaller than the limit value L1 shown in FIG.

  On the other hand, FIG. 6B shows the limit value L2 in the offset process for moving the component stop position [P2] in the direction opposite to the tape feed. That is, in this case, the component stop position [P2] moves in the opposite direction from the default position shown in FIG. 5A in the take-out opening 22, so that the component 16 to be taken out is accommodated depending on the offset amount. There may be a situation in which the component pocket 15b is not completely fed into the take-out opening 22 and is partially covered by the tape peeling portion 21a. In this case, the upper part of the component pocket 15b is not completely exposed, and there is a risk that normal component removal of the component 16 by the suction nozzle 12 may be hindered. Therefore, in the offset process in which the component stop position [P2] is moved in the direction opposite to the tape feeding direction, the offset amount needs to be suppressed to a range smaller than the limit value L2 shown in FIG.

  As the limit values L1 and L2, the experience values set in advance according to the types of the tape feeder 5 and the component 16 may be used, or based on the component pitch in the carrier tape 15 and the size of the component pocket 15b. It may be calculated using a prescribed arithmetic expression. This calculation process is performed using the calculation processing function of the component suction control unit 30a (FIG. 7).

  Next, the configuration of the control system of the component mounting apparatus 1 will be described with reference to FIG. In FIG. 7, the control unit 30 is a processing operation unit having a CPU function, and controls each unit described below based on various data stored in the storage unit 31. As a result, various operations and processes necessary for the board transfer operation and the component mounting operation in the component mounting apparatus 1 are executed. The control unit 30 includes a component suction control unit 30a. The component suction control unit 30a simultaneously receives the components 16 from the plurality of tape feeders 5 arranged in the component supply unit 4 by the suction nozzle 12 mounted on the mounting head 9. Control processing necessary for adsorption is performed.

  In the control by the control unit 30, the production data 32 and the component suction control data 33 stored in the storage unit 31 are referred to. The production data 32 includes component data indicating the type and size of the component 16 extracted from the component supply unit 4 by the mounting head 9, mounting coordinate data indicating a mounting position when the extracted component 16 is mounted on the substrate 3, and mounting. Data referred to for production work, such as mounting sequence data that defines the order.

  The component suction control data 33 is referred to when the component suction control unit 30a controls the component mounting mechanism 10 and the tape feeder 5 to execute a component suction process for picking up and holding the component 16 from the component supply unit 4. It is data. The component suction control data 33 includes component suction position data 33a, component stop position data 33b, and a component stop correction limit value 33c.

  The component suction position data 33 a is data related to the component suction position [P 1] that defines the position of the suction nozzle 12 when the component 16 is sucked by the mounting head 9, and the component stop position data 33 b is a carrier in each tape feeder 5. This is data relating to the component stop position [P2] where the component 16 to be removed stops when the tape 15 is fed. The component stop correction limit value 33c is data defining limit values L1 and L2 (see FIG. 6) in offset processing for correcting the component stop position [P2].

  The mechanism driving unit 34 is controlled by the control unit 30 to drive the substrate transport mechanism 2, the X-axis beam 8, the Y-axis beam 7, the mounting head 9, and the tape feeding mechanism 20 of the tape feeder 5. Thereby, the carried-in board | substrate 3 is conveyed and positioned, and the component mounting operation | work which makes the positioned board | substrate 3 object is performed. Further, when the component suction control unit 30a controls the mechanism driving unit 34, the component supply unit 4 performs a component take-out operation for sucking and taking out the component 16 from the tape feeder 5 by the suction nozzle 12 of the mounting head 9.

  The recognition processing unit 35 performs recognition processing on the imaging results obtained by the board recognition camera 11 and the component recognition camera 6. As a result, the position of the substrate 3 in a state of being positioned by the substrate transport mechanism 2 is recognized, and the position of the component 16 in the state of being held by the mounting head 9 is recognized. Further, the recognition processing unit 35 performs a recognition process on a screen in which the component recognition position 5b of the tape feeder 5 is imaged by the substrate recognition camera 11, whereby a component stop position [P2] and a component suction position [P1] described below are processed. A deviation amount is detected.

  That is, by moving the mounting head 9 to the component supply unit 4, the substrate recognition camera 11 is sequentially positioned above the take-out opening 22 of each tape feeder 5 as shown in FIG. 15 is imaged. At this time, the mounting head 9 is aligned so that the visual field center (optical coordinate center) of the substrate recognition camera 11 coincides with the component suction position [P1] set in advance for the tape feeder 5.

  Thereby, as shown in FIG. 8B, the recognition image 11a including the component pocket 15b in which the component 16 to be taken out is stored is acquired. The recognition image 11a is subjected to recognition processing by the recognition processing unit 35 so that the distance between the center of the visual field and the center of the pocket 15b (pocket center 15b (C)), that is, the component suction position [P1] and the pocket center 15b (C). A shift amount d indicating a gap with respect to is detected. By executing this deviation amount detection for a plurality of tape feeders 5, deviation amount data shown in FIG. 8C is acquired.

  That is, in this deviation amount data, the common component suction position [P1] and each tape feeder 5 for each of a plurality of target tape feeders 5 (here, tape feeder 5 (1) to tape feeder 5 (4)). Deviations d1 to d4 from the component pocket 15b after feeding the tape (component stop position [P2] in the tape feeder 5) are detected. Therefore, the board recognition camera 11 and the recognition processing unit 35 are a positional deviation detection unit that detects a deviation amount between the component stop position [P2] and the component suction position [P1] in tape feeding by the tape feeding mechanism 20.

  As shown in FIG. 8 (c), in the tape feeder 5 arranged in the component supply unit 4, the component suction position [P1] and the component stop position [P2] do not coincide with each other, and the shift according to the individual state. The position is displaced by an amount (deviation amounts d1 to d4). For this reason, it is impossible to simultaneously suck a plurality of components 16 from these tape feeders 5 by the mounting head 9 in which the suction nozzles 12 are all arranged in the same Y direction.

  In the present embodiment, the component stop position [P2] by the tape feeding mechanism 20 of each tape feeder 5 is set according to the shift amount d of the tape feeder 5 so that a plurality of components can be sucked simultaneously even in such a case. By correcting, the component suction position [P1] and the component stop position [P2] are made to coincide with each other, and in this state, the component suction control for simultaneously sucking the component 16 from the tape feeder 5 by the mounting head 9 is performed. This control process is executed by the component suction control unit 30a, and the component suction control unit 30a controls the component mounting mechanism 10 and the tape feeding mechanism 20 of each tape feeder 5 based on the detected shift amount d, thereby The stop position P2 and the component suction position P1 are made to coincide with each other, and the simultaneous suction of the plurality of components 16 is executed.

  Next, the component simultaneous suction processing in the component mounting method by the component mounting apparatus 1 having the above-described configuration will be described with reference to the drawings in accordance with the flow of FIG. Here, a plurality of suction nozzles 12 are provided from a tape feeder 5 provided with a tape feeding mechanism 20 that is arranged in parallel in the component supply unit 4 and feeds the parts 16 held on the tape to the component suction position [P1] by the suction nozzles 12. A plurality of components 16 are sucked at the same time by the mounting head 9 having the above.

  First, in FIG. 9, at the start of production (ST1), the parts 16 are tape-fed by the tape feeding mechanism 20 in each tape feeder 5 (ST2). Next, as shown in FIG. 8, the component stop position [P2] in tape feeding is sequentially imaged by the board recognition camera 11 with each tape feeder 5, and the deviation d from the component suction position [P1] is detected (deviation). Quantity detection step) (ST2). That is, by performing recognition processing on the acquired recognition image 11a by the recognition processing unit 35, the shift amounts d1 to d4 shown in FIG. 8C are detected. Next, the following simultaneous suction control is executed by the component suction control unit 30a based on the detected shift amount d.

  First, it is determined whether or not the detected deviation amounts d1 to d4 are all within the limit values (ST3). That is, the deviation amounts d1 to d4 are compared with the component stop correction limit value 33c stored in the storage unit 31, and whether the tape feed direction is within the limit value L1 (FIG. 6A) or the opposite direction. Determines whether it is within the limit value L2 (FIG. 6B).

  Here, when all the deviation amounts d are within the limit value, that is, as shown in FIG. 10A, the deviation amounts d1 to d4 detected for each of the tape feeder 5 (1) to the tape feeder 5 (4). If both are within the limit values L1 and L2, the component stop position [P2] for each tape feeder 5 is set in advance for the tape feeder 5 and stored in the storage unit 31 as the component suction position data 33a. The component stop position [P2] of each tape feeder 5 is corrected so as to coincide with the component suction position [P1] that is present (ST4). The corrected component stop position [P2] is stored in the storage unit 31 as the component stop position data 33b.

  As a result, after the tape feeder 5 (1) to 5 (4) performs tape feeding for component supply, as shown in FIG. 10 (b), all tape feeders 5 are components to be taken out. The component pocket 15b that accommodates 16 stops at the component suction position [P1] by the suction nozzle 12 of the mounting head 9. In this state, the plurality of suction nozzles 12 are lowered with respect to each tape feeder 5 to simultaneously suck the plurality of components 16 (first simultaneous suction step) (ST6).

  On the other hand, when there is a tape feeder 5 whose deviation d is not within the limit value, that is, as shown in FIG. 11A, the deviation detected for each of the tape feeders 5 (1) to 5 (4). If any of d1 to d4 is not within the limit values L1 and L2, resetting is performed for both the component suction position [P1] and the component stop position [P2] as described below. Here, an example in which the shift amount d2 of the tape feeder 5 (2) exceeds the limit value L1 is shown.

  That is, each tape feeder 5 is set such that the component stop position [P2] of the other tape feeder 5 matches the component stop position [P2] of the tape feeder 5 (2) where the deviation amount d exceeds the limit value L1. The component stop position [P2] is corrected for (ST7). With the correction of the component stop position [P2], the component suction position [P1] is corrected so as to coincide with the new component stop position [P2]. The component suction position [P1] and the component stop position [P2] corrected in this way are stored in the storage unit 31 as component suction position data 33a and component stop position data 33b, respectively.

  Thus, after the tape feeding for supplying the components is executed in the tape feeders 5 (1) to 5 (4), as shown in FIG. The component pocket 15b that accommodates 16 stops at the component suction position [P1] by the suction nozzle 12 of the mounting head 9. In this state, by lowering the plurality of suction nozzles 12 with respect to each tape feeder 5, a plurality of components 16 are suctioned simultaneously (second simultaneous suction step) (ST6).

  As described above, in the simultaneous suction of a plurality of components in the present embodiment, the deviation amount d between the component stop position [P2] and the component suction position [P1] in the tape feeding by the tape feeding mechanism 20 is detected and detected. If the amount of deviation d is within the limit value, the component stop position [P2] of each tape feeder 5 is corrected so that the component stop position [P2] matches the preset component suction position [P1]. When a plurality of parts 16 are attracted at the same time and the deviation d is not within the limit value, the parts stop position [P2] of the tape feeder 5 where the deviation d is not within the limit value is set to the parts stop position [P2] of the other tape feeder 5 [ The parts stop position [P2] is corrected so that P2] matches, and a plurality of parts 16 are sucked simultaneously. Thereby, even if the deviation | shift amount d of component adsorption | suction position [P1] and component stop position [P2] is large, the target range which can adsorb | suck several components simultaneously can be expanded.

  The component mounting method and the component mounting apparatus of the present invention have the effect that the target range in which a plurality of components can be picked up simultaneously can be expanded even when the amount of deviation between the component picking position and the component stop position is large. In addition, it is useful in the field of component mounting in which components supplied by a tape feeder are sucked by a suction nozzle and mounted on a substrate.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 3 Board | substrate 4 Component supply part 5 Tape feeder 9 Mounting head 12 Adsorption nozzle 15 Carrier tape 16 Component 20 Tape feed mechanism [P1] Component adsorption position [P2] Component stop position

Claims (4)

Multiple parts are arranged in parallel in the parts supply unit, and multiple parts are picked up simultaneously by a mounting head equipped with multiple suction nozzles from a tape feeder equipped with a tape feed mechanism that feeds the parts held on the tape to the part suction position by the suction nozzle. Component mounting method for mounting on a board,
Detecting a deviation amount between a component stopping position and the component suction position in tape feeding by the tape feeding mechanism;
When the deviation amount is within the limit value, a first simultaneous operation in which the component stop position of each tape feeder is corrected so that the component stop position coincides with a preset component suction position and a plurality of components are simultaneously sucked. An adsorption process;
If the positional deviation amount is not within the limit value, a plurality of component stop positions are corrected so that the component stop position of the other tape feeder matches the component stop position of the tape feeder where the deviation amount is not within the limit value. A second simultaneous adsorption process for simultaneously adsorbing components;
A component mounting method comprising:   The component mounting method according to claim 1, wherein the limit value is a limit value in a tape feeding direction. Multiple parts are arranged in parallel in the parts supply unit, and multiple parts are picked up simultaneously by a mounting head equipped with multiple suction nozzles from a tape feeder equipped with a tape feed mechanism that feeds the parts held on the tape to the part suction position by the suction nozzle. A component mounting apparatus for mounting on a board,
A misalignment detection unit for detecting a misalignment between the component stop position and the component suction position in tape feeding by the tape feeding mechanism;
A component suction control unit that controls the mounting head and the tape feeding mechanism based on the detected shift amount to cause the component stop position and the component suction position to coincide with each other to simultaneously suck a plurality of components; With
The component adsorption control unit
If the amount of deviation is within the limit value, the component stop position of each tape feeder is corrected so that the component stop position matches the preset component suction position, and a plurality of components are sucked simultaneously,
When the deviation amount is not within the limit value, a plurality of components are corrected by correcting the component stop position so that the component stop position of the other tape feeder matches the component stop position of the tape feeder where the deviation amount is not within the limit value. A component mounting apparatus characterized by adsorbing at the same time.   The component mounting apparatus according to claim 3, wherein the limit value is a limit value in a tape feeding direction.

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